Reverse Costing® CATALOGUE
REVERSE COSTING® A complete set of information to understand the technology and cost of the electronic devices on the market. System Plus Consulting Reverse Costing® reports are based on in-house developed methodology and costing tools which ensure their single format. The full collection is regularly updated on our website. These reports can be ordered individually or under our Annual Subscription. IMAGING Date Manufacturer Ref. Type of Product Overview Pages Product
VISIBLE 2020/2 Sony Tof Sensing Solution Deep analysis of the rear 3D sensing module with Sony’s CIS and Lumentum’s SP20518 117 flood illuminator.
2020/4 Omnivision CameraCubeChip Costs and estimates prices for the OVM6948 CameraCubeChip. SP20515 114 OVM6948 2020/1 Samsung 3D TOF Depth Sensing Deep analysis of the rear 3D sensing module with Sony’s 2nd Generation CIS SP20484 127 Camera Module
2020/4 Various Smartphone Camera Overview of the latest flagship smartphone cameras released in 2019 with SP20470 145 Module Comparison detailed technical and cost analyses of the Huawei P30 Pro, Samsung Galaxy S10 2020 5G/S10+ and Apple iPhone 11 Pro 2018/5 ams Color Sensor Full analysis from sensor die to packaging along with a cost analysis and a price estimate SP18385 102 AS726X Series for the device. 2018/7 Hamamatsu C12880MA Micro- Detailed physical analysis with process description and manufacturing cost analysis SP18355 115 C12880MA spectrometer
INFRARED 2020/5 Nirone Spectral Engines Nirone Insights into technological data, manufacturing cost, and selling price of housing, electronic SP20558 123 Sensor X board, FPI MEMS and InGaAs photodiode
2020/6 Apple iPad Pro LiDAR Module Complete technical analysis of the 3D depth sensing system, this SP20557 174 report analyses the cost and estimates the price for the system
2020/6 Various Smartphone 3D Sensing Technological and economical comparison of five VCSEL diesand six NIR CIS integrated by SP20531 228 Modules Comparison the major manufacturers. 2020 2019/2 Valeo Valeo SCALA Laser Based on a complete teardown analysis of the LiDAR, the report provides the bill- SP19488 140 SCALA Scanner ofmaterial (BOM) and the manufacturing cost of the LiDAR sensor 2019/9 pmd/Infineon pmd/Infineon’s 3D Analysis of the complete 3D indirect ToF camera, provided along with cost analysis and SP19468 147 Indirect Time-of-Flight in price estimation for the module. LG G8 2019/4 ams Direct ToF Proximity Complete analysis of the proximity sensor includes detailed analyses of the SPAD detector SP19456 144 Sensor and the VCSEL, along with a cost analysis and price estimation for the module.
2019/5 Panasonic 3D ToF camera with Physical and economic analysis of the 3D depth sensing camera found in the Vivo Nex Dual SP19451 143 3D ToF flood illuminator Display smartphone. 2019/3 Various Comparison 2019 Analysis of the CIS dies integrated in rear and front-facing CMOS Camera Modules SP19431 300Mobile CMOS Image Sensor including main cameras, wide angle, telephoto and near global shutter infrared. 2019/2 Huawei 3D Depth-Sensing System Full analysis of the NIR camera module and the dot projector, along with a cost SP19424 180 Mate 20 Pro analysis and price estimate for the system 2019/3 Sony 3D Time-of-Flight Complete 3D depth sensing system physical analysis and cost and estimatation of the price. SP19403 147 IMX316
SYSTEM PLUS CONSULTING - Reverse Costing Catalogue - 2020-07 Page 1 / 8 IMAGING Date Manufacturer Ref. Type of Product Overview Pages Product 2018/12 Mantis 3D Depth Sensing System Analysis of the complete 3D depth sensing system, including a SP18438 160 Xiaomi Mi8 Explorer complete analysis of the NIR camera module, and the dot projector. cost analysis and price estimation for the system 2018/11 Orbec 3D Depth Sensing System Complete analysis of the 3D depth sensing system, including a SP18434 170 Oppo Find X complete analysis of the NIR camera module, the dot projector and the SoC. 2018/8 Samsung & Apple ALS & Proximity Sensor Analysis of the packaging and the sensor die along with a cost analysis calculation for three SP18405 200 Various smartphone generations: Galaxy S7, S8 and S9 and iPhone 7, 8 and X. 2018/5 Intel 3D Active IR Stereo Complete teardown analysis of the RealSense D435, with high definition pictures of the SP18404 90 RealSense D435 Depth Camera vision processor, VCSEL IR projector and image sensor dies and the BOM. 2018/4 Heimann Sensor 32 x 32-array thermopile Detailed teardown and cost analysis of the thermopile die,the silicon lens, the EEPROM SP18396 121 HTPA32x32d LWIR die,and the packaging. 2017/9 FlIR Camera and 12µm Detailed teardown and cost analysis of the microbolometer, lens and WLP. bIll-of-material SP17349 170 Boson microbolometer (BOM) of the camera core, and manufacturing cost of the infraredcamera. INTEGRATED CIRCUITS Date Manufacturer Ref. Type of Product Overview Pages Product
OTHER 2020/4 Mediatek 77/79 GHz eWLB/AiP Review of the MT2706, including a complete package and die analysis, cost SP20556 92 MT2706 Radar Chipset analysis, and price estimate for the component 2020/1 Various BCD Technology and In-depth comparative study of 31 Bipolar-CMOS-DMOS technologies with a SP20485 367 Cost Comparison 2020 focus on Silicon-on-Insulator high voltage devices from the 15 leading manufacturers
2019/4 Mobileye Vision Processor Family Exhaustive comparison between the EyeQ4®-High and -Mid versions and the previous SP19462 90 EyeQ4 EyeQ3®, highlighting the improvements, similarities and differences. 2019/7 Melexis Infrared Thermal Sensor Detailed teardown & cost analysis of the thermopile die where the memory is directly SP19429 100 MLX90640 integrated,along with the silicon lens and the packaging.
MEDICAL 2019/6 Apple Apple Watch 4’s PPG Analysis of the complete health sensor system, including a full analysis of the infrared LED SP19436 163 Apple Watch 4 and ECG Health Sensors from Epistar, green LEDs from OSRAM and the photodiodes from OSRAM for the PPG. MEMORY Date Manufacturer Ref. Type of Product Overview Pages Product
OTHER 2020/4 Intel Intel Optane 128GB Exhaustive analysis of the main components of the Intel Optane DIMM System, including a SP20551 130 DIMM full analysis of the 3D XPoint die, Intel Optane Processor and the Micron DRAM DDR4 die
2020/6 Everspin STTMRAM Memory Analysis of the package and the dies, the MRAM cell, focusing on the layered material that SP20543 80 EMD3D256M makes up the MRAM cell. 2019/11 Various LPDDR4 Memory Full teardowns of the packages and LPDDR4 dies to unveil the technology and process SP19466 170 Comparison 2019 employed by each manufacturer.
3D NAND 2019/9 Samsung 3D V-NAND 92-Layer Detailed technology study WITH details of die cross sections and material identification, SP19489 100 Memory Dteailed process and manufacturing price estimation also included.
2019/12 Various 3D NAND Memory Detailed study of the latest 96-layer technology from Toshiba and SanDisk, 92-layer SP19483 240 Comparison 2019 technology from Samsung, 72-layer technology from SK Hynix and 96-layer technology from Micron 2018/12 Various Leading-edge 3D NAND Detailed study of the latest NAND dies and die cross-section and processes. Detailed SP18422 245 3D NAND Memory Memory Comparison physical analysis, highlighting the cell design and memory storage type.
SYSTEM PLUS CONSULTING - Reverse Costing Catalogue - 2020-07 Page 2 / 8 MEMS & SENSOR Date Manufacturer Ref. Type of Product Overview Pages Product
PRINTHEADS 2018/9 Xaar Xaar 1201 GS2p5 PZT Insight into technological data, manu-facturing cost, and selling price of the MEMS inkjet SP18421 150 1201 GS2p5 PZT Printhead manufactured by Ricoh and the 1201 printhead supplied by Xaar 2018/9 Epson Printhead with MicroTFP Insight into technological data,manufacturing cost, and selling price of SP18420 158 PrecisionCore Inkjet Dies the microTFP inkjet MEMS and the PrecisionCore printhead by Epson.
PRESSURE SENSOR 2018/5 Various MEMS Pressure Sensor Multiple comparisons based on physical analyses of 34 MEMS pressure sensor components SP18385 160MEMS Pressure Sensor Comparison 2018
PHOTONIC 2020/3 Intel Silicon Photonic 100G A deep analysis of the world’s first 100G CWDM silicon photonic transceiver, SP20544 259 QFSP28 CWDM4 covering new technologies and the main differences from the Intel 100G PSM4. 2019/3 Intel Silicon photonic die Exhaustive analysis of the main components of the Intel 100G PSM4 connector along with SP19407 200 PSM4 QFSP28 a cost analysis and price estimate.
OTHER 2019/10 USound MEMS Speaker Technology and cost analysis of the UT-P 2016 MEMS Speaker.Envelope Tracker Module SP19491 88 Achelous UT-P 2016 2019/8 HP HP746 HDNA Inkjet Die Complete physical & cost analysis of the HDNA ihermal inkjet die from HP. A comparison 94 746 between HP inkjet die with and without HDNA is included.
MICROPHONE 2020/3 Infineon (SDM) MEMS Apple’s AirPods Pro use the newest MEMS microphone technology from SP20549 112 XENSIVTM in Goertek Microphone Infineon: Sealed Dual-Membrane XENSIVTM, found in Goertek’s microphone. 2020/2 TDK Ultrasonic Time of Flight The first Piezoelectric Micromachined Ultra-sonic Transducer (PMUT) millimeteraccurate SP20520 113 CH101 Sensor ultra-low power Time of Flight sensor. 2020/2 Various Consumer MEMS Compare the technology and cost of 19 microphones from Knowles, Goertek, SP20458 199 Microphones AAC Technologies, STMicroelectronics, TDK-InvenSense, TDK-Epcos, Cirrus Logic and Vesper. 2019/10 Usound MEMS Speaker Technology and cost analysis of the UT-P 2016 MEMS Speaker SP19491 88 UT-P 2016
MEDICAL 2017/7 Thermo Fisher Sequencing chip Complete analysis of the Ion 520 chip from Thermo Fisher, featuring chip disassembly and SP17346 130 Ion 520 die analyses, processes and cross-sections.
IMU/COMBO 2019/1 Honeywell MEMS Inertial Sensor Detailed physical analysis with a process description and manufacturing cost analysis, as SP19443 102 HG1120CA50 9-Axis well as a full comparison with the Sensonor STIM210 and the ADIS16460. 2019/1 Honeywell MEMS Inertial Sensor Detailed physical analysis with a process description and manufacturing cost analysis, as SP19442 161 HG4930CA51 6-Axis well as a full comparison with the Sensonor STIM210 and the HG1120CA50. 2017/10 InvenSense Pressure Sensor Combo Detailed technology and cost analysis of the ICM-20789 7-axis motion tracking device. SP17361 175 ICM-20789 Comparison with the previous generation of combo sensors from InvenSense
GYROSCOPE 2018/1 Tronics Microsystems Angular Rate Sensor Analysis of the complete component, including the package, MEMS, and ASIC dies SP18381 141 GYPRO3300 description of the ASIC and MEMS functionalities.
FINGERPRINT 2020/4 Goodix Goodix’s Ultra-Thin Deep analysis of the latest generation of under-display optical fingerprint SP20552 107 Optical In-Display Fingerprint 2019/10 Goodix Under-Display Optical Insight into technological data, manufacturing cost, and selling price of the fingerprint SP19506 160 Fingerprint sensor supplied by Goodix.
SYSTEM PLUS CONSULTING - Reverse Costing Catalogue - 2020-07 Page 3 / 8 MEMS & SENSOR Date Manufacturer Ref. Type of Product Overview Pages Product 2019/9 Various Piezoelectric modules Physical analysis and a cost estimation of the integration of piezoelectric material in a SP19472 271 system or wafer.
2019/7 Qualcomm 3D Sonic Sensor Analyses of the sensor die and the ASICs along with a cost analysis and price estimation for SP19465 127 Fingerprint the module.
2018/7 Synaptics and Goodix Synaptics’ Under-Display Comparison with the latest Huawei FPC1268 fingerprint touch sensor and a physical SP18419 125 VIVO X21 Fingerprint Scanner comparison with the Goodix Version of Vivo’s fingerprint scanner Inside the VIVO X21 UD ENVIRONMENT 2019/1 Sensirion NDIR CO2 & Humidity Technology and cost analysis that includes study of all the main parts of the sensor : the SP20513 3990 SCD30 Sensor humidity sensor, the other module parts and the assembly 2020/1 Sensirion NDIR CO2 and Humidity Technology and cost analysis,all the main parts of the sensor are studied, including SP20513 126 SCD30 Sensor the humidity sensor, the other module parts and the assembly. 2018/10 Various Miniaturized Gas Sensor Comparison 2018 : Analysis of the packaging and the sensor die along with SP18398 150 a cost analysis for all devices.
2018/2 Sensirion SGP30 Gas Sensor Analysis of the entire component, including the package, MEMS, and ASIC die. Full SP18372 125 SGP30 description of the ASIC and MEMS functionalities as well as manufacturing processes. PACKAGING Date Manufacturer Ref. Type of Product Overview Pages Product
OTHER 2018/11 Various Wafer to Wafer Analysis of each component’s wafer bonding process, including component dimensions, SP18430 160 Wafer Permanent Bonding cost and manufacturing approach.
EMBEDDED 2019/11 Qualcomm Envelope Tracker Module In-depth physical analysis of the envelope tracking module,and a complete description of SP19425 124 QET5100M the manufacturing process flow
3D PACKAGING 2020/3 Apple SiP in AirPods Pro Analysis of Apple’s first SiP found in the latest AirPods, featuring a fully SP20471 220 integrated SiP for audio codec and Bluetooth connectivity.
2019/1 Apple Apple Watch Complete analysis of the SiP, featuring die analyses, packaging processes and cross- SP19439 200 Series 4 sections. 2018/11 Samsung Samsung Exynos 9110 Complete analysis of the SiP FO-PLP, featuring die analyses, processes and package cross- SP18444 127 Exynos 9110 with Eplp sections. 2018/10 Intel EMIB Complete physical analysis of the packaging process,with details of all technical choices SP18417 160 regarding processes,equipment and materials.
2018/6 Samsung, Qualcomm Samsung’s Galaxy S9 + Review of the Exynos 9810 and the Snapdragon 845, including a complete package SP18406 130 Processor Packages analysis, cost analysis, and price estimate for the chips.
2018/7 Qualcomm Qualcomm WiGig Full investigation of the system, featuring a detailed study of the SiPs and the antenna SP18393 157 WiGig Chips Chipset Smartphone board including die analyses, processes and board cross-sections 2018/2 TSMC inFO Packaging in iPhone Analysis of the packaging from the DRAM memory to the LSC developed by TSMC. SP18373 140 Apple A11 inFO PoP X Comprehensive cost analysis and price estimation of the device. 2017/11 AMD SPIL CoW last – Samsung Complete physical analysis of the packaging process.Comparison with NVIDIA’s Tesla P100 SP17360 130 Radeon Vega HBM2 and AMD’s Fury X. 2017/10 Various Mems Packaging Multiple comparisons based on physical analyses of over 100 MEMS components. SP17352 300 MEMS Packaging
SYSTEM PLUS CONSULTING - Reverse Costing Catalogue - 2020-07 Page 4 / 8 PASSIVE Date Manufacturer Ref. Type of Product Overview Pages Product
OTHER 2017/9 Various Silicon Capacitor Details on the manufacturing process and materials used, component design, and die size. SP17344 140 Silicon Capacitor Comparison of the components’ sizes, materials and characteristics. POWER Date Manufacturer Ref. Type of Product Overview Pages Product
SiC 2019/10 Wolfspeed SiC Module Estimated manufacturing cost of all the module’s components and selling price analysis SP19494 154 CAB450M12XM3 2019/8 UnitedSiC UnitedSiC Cascode JFET Detailed manufacturing cost analysis of the JFET,the MOSFET and the package as well as SP19467 200 650V Family the estimated selling price of each one of 5 five cascode components
2019/5 Various Comparison 2019 Estimated manufacturing cost of the MOSFET devices & analysis of their selling prices. SP19449 289 SiC MOSFET Technological & manufacturing cost comparisons between the analyzed MOSFETs. 2018/8 Rohm Rohm SiC MOSFET Gen3 Analysis of the Gen3 trench MOSFETs at 650V and 1200V, with optical and scanning SP18428 95 Gen3 Trench Trench Design Family electron microscope (SEM) images of the complex SiC trench structure. 2018/6 STMicroelectronics Tesla Model 3 Inverter Estimation of the production cost of the SiC MOSFET and package.Technical and cost SP18413 100 Tesla Model 3 with SiC Power Module comparison with the Mitsubishi J-Series TP-M power module.
OTHER 2020/5 Various Industrial Power Module Insight into severalpackaging technologiesto analyze their structures, processes and SP20474 165 Packaging costs Comparison 2020 2018/7 Various Automotive Power Comparison 2018 of the structures and costs of the different technological choices made SP18399 110 Module Packaging by key manufacturers of the automotive industry
2018/5 Various Power Discrete Packaging Comparison 2018 : Summary of the state of the art of packaging power semiconductors at SP18359 115 a discrete level. Comparison of 20 types of packages.
IGBT 2020/3 StarPower Tri-Pack IGBT Module Tri-Pack power module from StarPower with direct liquid cooling pin-fin SP20541 100 GD820HTX75P6H structure. 2020/1 Hitachi Double-Side Cooling Discover Hitachi’s power module and its innovative assembling technology of SP20516 127 Audi e-tron’s Inverter Power Module integrated double-side cooling structure. 2019/10 Infineon 1200V Power Module Full teardown of the module’s components and housing, as well as stimated SP19492 163 PrimePACK™2 with IGBT5 and EC5 manufacturing cost of all the module’s components and a selling price analysis Diode 2019/3 ABB Power Module Insights into the structure, technical choices, design, processes, and supply chain SP19455 140 5SNG 1000X170300 positions.Manufacturing cost of the module’s components and analyses its selling price. 2018/10 Mitsubishi Mitsubishi J1- Series Technology and cost analysis of two J1-series power modules with 650V and SP18408 185 J1- Series 650V 650V 600A/1000A: the CT600CJ1A060 and the CT1000CJ1B060
GaN 2020/3 Nexperia GaNbased Power Device Deep analysis of the GAN063-650WSA, Nexperia’s first GaN product SP20550 101 GAN063-650WSA 2020/2 OPPO GaN-based in-box fast Competitive analysis of Power Integrations’ GaN and silicon technology used in SP20547 127 charger OPPO’s high power chargers.
2019/10 Macom RF Power Amplifier with Estimation of the production costs of the HEMT, the passive die, and the package as well as SP19493 108 NPA1008 GaN-on-Si HEMT the estimated selling price of the component. 2019/7 Anker GaN-on-Sapphire HEMT Teardown analysis of the SC1933C .Estimation of the production costs of the ICs, the HEMT SP19480 156 SC1933C Power IC & the package as well as the estimated selling price of the component. 2019/5 Navitas GaNFast Power IC Family Insights into the HEMT tructure, the epitaxy, technical choices, design, processes, and SP19464 112 NV6115 & NV6252 supply chain positions.
SYSTEM PLUS CONSULTING - Reverse Costing Catalogue - 2020-07 Page 5 / 8 POWER Date Manufacturer Ref. Type of Product Overview Pages Product 2019/7 Various GaN-Based Wall Charger Detailed BOM and manufacturing analysis for all the chargers’ devices and packages. SP19453 169 Comparison 2019 Different supply chains and the technical choices made by the manufacturers.
2019/9 EPC HEMT with Monolithic Complete teardown analysis and detailed manufacturing cost analysis of the die and SP19415 86 EPC2112 Optimized Gate Driver the package as well as the estimated selling price of the device, 2018/10 Qorvo Qorvo QPF4006 39GHz Detailed analysis of the packaging and the GaN on SiC SP18411 110 QPF4006 39GHz GaN MMIC transistor with optical SEM Pictures as well as a cost analysis. 2018/6 GaN Systems 100V GaN HEMT Estimated production cost for the epitaxy and the package. Comparison of the standard SP18391 97 GS61004B 100V Si MOSFETs and low-voltage GaN on Si HEMT. 2019/11 Various GaN-on-Si HEMT vs Detailed pictures of device structures, details on manufacturing processes and materials, 260 Superjunction MOSFET comparison of electrical performance, and cost breakdown analysis of the process. Comparison 2019 2019/6 Infineon CoolGaN Transistor Complete teardown analysis including optical and SEM pictures of metal layers, 97 600V delayering of the GaN, cross-section of the HEMT part and the diode part of the die. RF Date Manufacturer Ref. Type of Product Overview Pages Product
RF MODULE 2020/4 Various RF Front-End Module Insights into technology and cost data for FEMs and several other components found in ten SP20522 304 Comparison 2020 V2 smartphones.
2020/1 various RF Front-End Module Technical and cost overview of the latest Radio Frequency Front-End module SP20504 266 Comparison 2020 – V1 technologies, with deep analysis of the Apple iPhone 11 Pro, Samsung Galaxy Note 10+ and OnePlus 7 Pro 5G. 2019/10 Qorvo RFFEM Complete analysis of the FEM SiP, including the LNA, the filtering dies, the internal SP19478 162 QM76018 and external EMI shielding and the Power Amplifier. 2019/2 Broadcom Apple iPhone Xs/Xr Series Complete analysis of the FEM SiP, including an analysis of the matching IC, the filtering SP19445 167 AFEM-8092 dies, the internal and external EMI shielding and the Power Amplifier. 2019/5 Acconeer Pulsed Coherent Radar Review of the A111, including a complete die analysis, cost analysis, and price estimate for SP19433 81 A111 60 GHz the chips. Physical and technical comparison with Texas Instruments’ IWR6843AoP 2019/1 Ainstein & Calterah Ainstein K-77 & Calterah BOM and the manufacturing cost of the radar sensor and review of the CAL77A2T4R SP19400 159 CAL77A2T4R transceiver, with a complete die analysis, cost analysis, and price estimate of the chips.
2019/4 Analog Devices RF MEMS Switch Detailed physical description of the Analog Devices ADGM1304 along with a cost analysis. SP19392 121 ADI ADGM 304/1004 physical and cost comparison with the ADGM1001. 2018/2 Broadcom Mid&High Band LTE FEM Analysis of the full FEM SiP, including the RF IC and its IPDs, the filtering dies and the SP18379 160 AFEM-8072 internal and external EMI shielding. 2018/10 Various Automotive Radar Comparison 2018 : Description of each component and statistical analyses for most radar SP18368 397 Automotive Radar systems focusing on the RF board. 2017/11 Various RF SiPs Description of each component and important data, including type of substrate, proportion SP17364 140 of silicon in the module and line spacing.
RF IC 2020/3 Broadcom SiP in the Apple iPhone Cost effective third generation of mid/high band Front-End Module with SP20521 205 AFEM-8100 11 Series advanced and innovative packaging. 2020/4 Infineon & Knowles Google Pixel Deep dive into the first Human Machine Interaction (HMI) system with Infineon’s SP20519 173BGT60TR13C & DSP IA85084XL Gesture 60 GHz Radar On-Chip AoP BGT60TR13C and Knowles’ DSP IA8508. Recognition Chipset 2020/5 Qualcomm 2nd Generation 5G Full investigation of the system, featuring a detailed study of the SiPs, including die SP20517 216 mmWave Chipset, from analyses, processes and board cross-sections Modem to Antenna 2019/9 Qualcomm Qualcomm’s First 5G Full investigation of the system, with detailed study of the SiPs, including die analyses, SP19482 194 SDX50M & QTM052 mmWave Chipset processes and board cross-sections. Complete cost analysis &selling price estimation. System 2019/8 Texas intruments 77/79 GHz Radar Chipset Complete package and die analysis, cost analysis, and price estimate SP19481 100 AWR1843AoP for the component.
SYSTEM PLUS CONSULTING - Reverse Costing Catalogue - 2020-07 Page 6 / 8 RF Date Manufacturer Ref. Type of Product Overview Pages Product 2018/8 Peraso Peraso X710 Chipset Full investigation of the system, with a detailed study of the baseband processor, the RFIC SP18418 150 X710 60GHz and the antenna board including die analyses, processes and board cross-sections.
RF FILTER 2020/6 Various SAW Filter Comparison Description of each process flow for the thirteen SAW technologies on the market. It also SP20490 201 2020 contains a complete cost analysis of each process and tries to explain OEM choices.
2019/10 Murata SAW Filter Complete analysis of the IHP SAW component including analyses of the filter die and the SP19454 100 IHP CSP, along with cost analysis and price estimation for the component.
OTHER 2017/12 Various RF Integrated Passive Description of each component, its major characteristics (substrate type (GaAs, silicon, SP17328 300 RF IPD Devices glass), passivation layers, passive integration, etc.) and a comparison of all devices. SOLID STATE LIGHTING Date Manufacturer Ref. Type of Product Overview Pages Product
VCSEL 2019/4 Various Comparison 2019 Complete cost analysis and a cost estimate of the VCSEL SP19426 190 VCSEL
OTHER 2020/4 Butterfly Network CMUT Sensor Focus on the analysis of the CMUT semiconductor. It includes an ultrasonic MEMS SP20545 105 transducer and the ASIC die developed by Butterfly Network. SYSTEM Date Manufacturer Ref. Type of Product Overview Pages Product
OTHER 2019/8 Devialet Free Devialet Player Complete teardown analysis including printed circuit board (PCB) cross-sections, PCB SP19460 142 antenna X-rays and main integrated circuit (IC) die photos.
2019/8 Freebox Freebox Delta Server Detailed BOM, the manufacturing cost of the server, optical module and security module SP19460 142 and estimation of final manufacturer price
2019/9 Various Particle Sensor Technical & cost analysis of 7 particle sensors, it includes block diagrams. SP19446 85
AUTOMOTIVE 2020/2 Audi-Bosch Instrument Latest Audi Q3 instrument cluster with immobilizer: Structural and cost SP20512 115 FPK Cluster analysis 2020/1 Tesla Triple Forward Camera Complete analysis of the main sensing part of the Tesla‘s autopilot system SP20509 80 Model 3 from Tesla Model 3 2020/1 Denso Monocular Forward Denso has developed a new monocular forward camera for improved night SP20507 87 Toyota Alphard ADAS Camera vision, using Sony’s high-sensitivity 1.27M-pixel image sensor and Toshiba’s new advanced image recognition processor. 2020/1 Aptiv Aptiv’s Lane Assist Front Complete teardown analysis of the Audi A8 Front Camera with BOM and manufacturing SP20501 67 4N0907217A Camera for Audi A8 cost of the camera. 2019/12 Nvidia Visual Computing Complete analysis of the module, featuring deep IC and SP19514 110 Tegra K1 Module Memories die analyses, packaging processes and cross-sections 2019/12 Aptiv 76GHz Short Range Radar Complete teardown analysis with BOM and the manufacturing cost of the radar sensor SP19510 89 R3TR 2019/12 Mando 77GHz Mid-Range Radar Complete teardown analysis with BOM and the manufacturing cost of the radar sensor SP19508 72 MRR20
SYSTEM PLUS CONSULTING - Reverse Costing Catalogue - 2020-07 Page 7 / 8 SYSTEM Date Manufacturer Ref. Type of Product Overview Pages Product 2019/12 Aptiv Audi A8 zFAS ADAS Complete teardown analysis with BOM and the manufacturing cost of the control unit SP19502 87 Zfas Platform 2019/12 Denso Short Range Radar Complete teardown analysis with BOM and the manufacturing cost of the radar sensor SP19500 76 DNSRR004 2019/12 Denso Cruise Control BOM and manufacturing cost of the radar sensor.It also so includes a physical SP19499 94 DNMWR009 Radar Distance Sensor analysis of the MCU, a complete cost analysis and selling price estimation 2019/11 Bose Automotive Audio Complete teardown analysis of Bose Audio Amplifier from the Renault Talisman. Complete SP19498 77 Amplifier physical analysis and manufacturing cost estimate for every part. Frames 2019/9 Ford Silverbox Complete teardown analysis along with BOM and cost analysis. SP19476 69 SYNC 3
SYSTEM PLUS CONSULTING - Reverse Costing Catalogue - 2020-07 Page 8 / 8