Reverse Costing® CATALOGUE REVERSE COSTING® A complete set of information to understand the technology and cost of the electronic devices on the market. System Plus Consulting Reverse Costing® reports are based on in-house developed methodology and costing tools which ensure their single format. The full collection is regularly updated on our website. These reports can be ordered individually or under our Annual Subscription. IMAGING Date Manufacturer Ref. Type of Product Overview Pages Product VISIBLE 2020/2 Sony Tof Sensing Solution Deep analysis of the rear 3D sensing module with Sony’s CIS and Lumentum’s SP20518 117 flood illuminator. 2020/4 Omnivision CameraCubeChip Costs and estimates prices for the OVM6948 CameraCubeChip. SP20515 114 OVM6948 2020/1 Samsung 3D TOF Depth Sensing Deep analysis of the rear 3D sensing module with Sony’s 2nd Generation CIS SP20484 127 Camera Module 2020/4 Various Smartphone Camera Overview of the latest flagship smartphone cameras released in 2019 with SP20470 145 Module Comparison detailed technical and cost analyses of the Huawei P30 Pro, Samsung Galaxy S10 2020 5G/S10+ and Apple iPhone 11 Pro 2018/5 ams Color Sensor Full analysis from sensor die to packaging along with a cost analysis and a price estimate SP18385 102 AS726X Series for the device. 2018/7 Hamamatsu C12880MA Micro- Detailed physical analysis with process description and manufacturing cost analysis SP18355 115 C12880MA spectrometer INFRARED 2020/5 Nirone Spectral Engines Nirone Insights into technological data, manufacturing cost, and selling price of housing, electronic SP20558 123 Sensor X board, FPI MEMS and InGaAs photodiode 2020/6 Apple iPad Pro LiDAR Module Complete technical analysis of the 3D depth sensing system, this SP20557 174 report analyses the cost and estimates the price for the system 2020/6 Various Smartphone 3D Sensing Technological and economical comparison of five VCSEL diesand six NIR CIS integrated by SP20531 228 Modules Comparison the major manufacturers. 2020 2019/2 Valeo Valeo SCALA Laser Based on a complete teardown analysis of the LiDAR, the report provides the bill- SP19488 140 SCALA Scanner ofmaterial (BOM) and the manufacturing cost of the LiDAR sensor 2019/9 pmd/Infineon pmd/Infineon’s 3D Analysis of the complete 3D indirect ToF camera, provided along with cost analysis and SP19468 147 Indirect Time-of-Flight in price estimation for the module. LG G8 2019/4 ams Direct ToF Proximity Complete analysis of the proximity sensor includes detailed analyses of the SPAD detector SP19456 144 Sensor and the VCSEL, along with a cost analysis and price estimation for the module. 2019/5 Panasonic 3D ToF camera with Physical and economic analysis of the 3D depth sensing camera found in the Vivo Nex Dual SP19451 143 3D ToF flood illuminator Display smartphone. 2019/3 Various Comparison 2019 Analysis of the CIS dies integrated in rear and front-facing CMOS Camera Modules SP19431 300Mobile CMOS Image Sensor including main cameras, wide angle, telephoto and near global shutter infrared. 2019/2 Huawei 3D Depth-Sensing System Full analysis of the NIR camera module and the dot projector, along with a cost SP19424 180 Mate 20 Pro analysis and price estimate for the system 2019/3 Sony 3D Time-of-Flight Complete 3D depth sensing system physical analysis and cost and estimatation of the price. SP19403 147 IMX316 SYSTEM PLUS CONSULTING - Reverse Costing Catalogue - 2020-07 Page 1 / 8 IMAGING Date Manufacturer Ref. Type of Product Overview Pages Product 2018/12 Mantis 3D Depth Sensing System Analysis of the complete 3D depth sensing system, including a SP18438 160 Xiaomi Mi8 Explorer complete analysis of the NIR camera module, and the dot projector. cost analysis and price estimation for the system 2018/11 Orbec 3D Depth Sensing System Complete analysis of the 3D depth sensing system, including a SP18434 170 Oppo Find X complete analysis of the NIR camera module, the dot projector and the SoC. 2018/8 Samsung & Apple ALS & Proximity Sensor Analysis of the packaging and the sensor die along with a cost analysis calculation for three SP18405 200 Various smartphone generations: Galaxy S7, S8 and S9 and iPhone 7, 8 and X. 2018/5 Intel 3D Active IR Stereo Complete teardown analysis of the RealSense D435, with high definition pictures of the SP18404 90 RealSense D435 Depth Camera vision processor, VCSEL IR projector and image sensor dies and the BOM. 2018/4 Heimann Sensor 32 x 32-array thermopile Detailed teardown and cost analysis of the thermopile die,the silicon lens, the EEPROM SP18396 121 HTPA32x32d LWIR die,and the packaging. 2017/9 FlIR Camera and 12µm Detailed teardown and cost analysis of the microbolometer, lens and WLP. bIll-of-material SP17349 170 Boson microbolometer (BOM) of the camera core, and manufacturing cost of the infraredcamera. INTEGRATED CIRCUITS Date Manufacturer Ref. Type of Product Overview Pages Product OTHER 2020/4 Mediatek 77/79 GHz eWLB/AiP Review of the MT2706, including a complete package and die analysis, cost SP20556 92 MT2706 Radar Chipset analysis, and price estimate for the component 2020/1 Various BCD Technology and In-depth comparative study of 31 Bipolar-CMOS-DMOS technologies with a SP20485 367 Cost Comparison 2020 focus on Silicon-on-Insulator high voltage devices from the 15 leading manufacturers 2019/4 Mobileye Vision Processor Family Exhaustive comparison between the EyeQ4®-High and -Mid versions and the previous SP19462 90 EyeQ4 EyeQ3®, highlighting the improvements, similarities and differences. 2019/7 Melexis Infrared Thermal Sensor Detailed teardown & cost analysis of the thermopile die where the memory is directly SP19429 100 MLX90640 integrated,along with the silicon lens and the packaging. MEDICAL 2019/6 Apple Apple Watch 4’s PPG Analysis of the complete health sensor system, including a full analysis of the infrared LED SP19436 163 Apple Watch 4 and ECG Health Sensors from Epistar, green LEDs from OSRAM and the photodiodes from OSRAM for the PPG. MEMORY Date Manufacturer Ref. Type of Product Overview Pages Product OTHER 2020/4 Intel Intel Optane 128GB Exhaustive analysis of the main components of the Intel Optane DIMM System, including a SP20551 130 DIMM full analysis of the 3D XPoint die, Intel Optane Processor and the Micron DRAM DDR4 die 2020/6 Everspin STTMRAM Memory Analysis of the package and the dies, the MRAM cell, focusing on the layered material that SP20543 80 EMD3D256M makes up the MRAM cell. 2019/11 Various LPDDR4 Memory Full teardowns of the packages and LPDDR4 dies to unveil the technology and process SP19466 170 Comparison 2019 employed by each manufacturer. 3D NAND 2019/9 Samsung 3D V-NAND 92-Layer Detailed technology study WITH details of die cross sections and material identification, SP19489 100 Memory Dteailed process and manufacturing price estimation also included. 2019/12 Various 3D NAND Memory Detailed study of the latest 96-layer technology from Toshiba and SanDisk, 92-layer SP19483 240 Comparison 2019 technology from Samsung, 72-layer technology from SK Hynix and 96-layer technology from Micron 2018/12 Various Leading-edge 3D NAND Detailed study of the latest NAND dies and die cross-section and processes. Detailed SP18422 245 3D NAND Memory Memory Comparison physical analysis, highlighting the cell design and memory storage type. SYSTEM PLUS CONSULTING - Reverse Costing Catalogue - 2020-07 Page 2 / 8 MEMS & SENSOR Date Manufacturer Ref. Type of Product Overview Pages Product PRINTHEADS 2018/9 Xaar Xaar 1201 GS2p5 PZT Insight into technological data, manu-facturing cost, and selling price of the MEMS inkjet SP18421 150 1201 GS2p5 PZT Printhead manufactured by Ricoh and the 1201 printhead supplied by Xaar 2018/9 Epson Printhead with MicroTFP Insight into technological data,manufacturing cost, and selling price of SP18420 158 PrecisionCore Inkjet Dies the microTFP inkjet MEMS and the PrecisionCore printhead by Epson. PRESSURE SENSOR 2018/5 Various MEMS Pressure Sensor Multiple comparisons based on physical analyses of 34 MEMS pressure sensor components SP18385 160MEMS Pressure Sensor Comparison 2018 PHOTONIC 2020/3 Intel Silicon Photonic 100G A deep analysis of the world’s first 100G CWDM silicon photonic transceiver, SP20544 259 QFSP28 CWDM4 covering new technologies and the main differences from the Intel 100G PSM4. 2019/3 Intel Silicon photonic die Exhaustive analysis of the main components of the Intel 100G PSM4 connector along with SP19407 200 PSM4 QFSP28 a cost analysis and price estimate. OTHER 2019/10 USound MEMS Speaker Technology and cost analysis of the UT-P 2016 MEMS Speaker.Envelope Tracker Module SP19491 88 Achelous UT-P 2016 2019/8 HP HP746 HDNA Inkjet Die Complete physical & cost analysis of the HDNA ihermal inkjet die from HP. A comparison 94 746 between HP inkjet die with and without HDNA is included. MICROPHONE 2020/3 Infineon (SDM) MEMS Apple’s AirPods Pro use the newest MEMS microphone technology from SP20549 112 XENSIVTM in Goertek Microphone Infineon: Sealed Dual-Membrane XENSIVTM, found in Goertek’s microphone. 2020/2 TDK Ultrasonic Time of Flight The first Piezoelectric Micromachined Ultra-sonic Transducer (PMUT) millimeteraccurate SP20520 113 CH101 Sensor ultra-low power Time of Flight sensor. 2020/2 Various Consumer MEMS Compare the technology and cost of 19 microphones from Knowles, Goertek, SP20458 199 Microphones AAC Technologies, STMicroelectronics, TDK-InvenSense, TDK-Epcos, Cirrus Logic and Vesper. 2019/10 Usound MEMS Speaker Technology and cost analysis of the UT-P 2016 MEMS Speaker SP19491 88 UT-P 2016 MEDICAL 2017/7 Thermo Fisher Sequencing chip Complete analysis of the Ion 520 chip from Thermo Fisher, featuring chip disassembly and SP17346 130 Ion 520 die analyses, processes and cross-sections. IMU/COMBO 2019/1 Honeywell MEMS Inertial Sensor Detailed physical analysis with a process description and manufacturing cost analysis, as SP19443 102 HG1120CA50 9-Axis well as a full comparison with the Sensonor STIM210 and the ADIS16460.