How Intel® Itanium®-Based Servers Are Changing the Economics of Mission-Critical Computing
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Introduction to the Poulson (Intel 9500 Series) Processor Openvms Advanced Technical Boot Camp 2015 Keith Parris / September 29, 2015
Introduction to the Poulson (Intel 9500 Series) Processor OpenVMS Advanced Technical Boot Camp 2015 Keith Parris / September 29, 2015 © Copyright 2015 Hewlett-Packard Development Company, L.P. The information contained herein is subject to change without notice. Information on Poulson from Intel’s ISSCC Paper © Copyright 2015 Hewlett-Packard Development Company, L.P. The information contained herein is subject to change without notice. Poulson information from Intel’s ISSCC Paper http://www.intel.com/content/dam/www/public/us/en/documents/white-papers/itanium-poulson-isscc-paper.pdf 3 © Copyright 2015 Hewlett-Packard Development Company, L.P. The information contained herein is subject to change without notice. Poulson information from Intel’s ISSCC Paper http://www.intel.com/content/dam/www/public/us/en/documents/white-papers/itanium-poulson-isscc-paper.pdf 4 © Copyright 2015 Hewlett-Packard Development Company, L.P. The information contained herein is subject to change without notice. Poulson information from Intel’s ISSCC Paper http://www.intel.com/content/dam/www/public/us/en/documents/white-papers/itanium-poulson-isscc-paper.pdf 5 © Copyright 2015 Hewlett-Packard Development Company, L.P. The information contained herein is subject to change without notice. Poulson information from Intel’s ISSCC Paper • Intel presented a paper on Poulson at the International Solid-State Chips Conference (ISSCC) in July 2011. From this, we learned: • Poulson would be in a 32 nm process (2 process generations ahead from Tukwila, which was at 65 nm, skipping the 45 nm process) • The socket would be compatible with Tukwila • Poulson would have 8 cores, of a brand new core design • The front end (instruction fetch) would be decoupled from the back end (instruction execution) • Poulson could execute and retire as many as 12 instructions per cycle, double Tukwila’s 6 instructions http://www.intel.com/content/dam/www/public/us/en/documents/white-papers/itanium-poulson-isscc-paper.pdf 6 © Copyright 2015 Hewlett-Packard Development Company, L.P. -
Inside Intel® Core™ Microarchitecture Setting New Standards for Energy-Efficient Performance
White Paper Inside Intel® Core™ Microarchitecture Setting New Standards for Energy-Efficient Performance Ofri Wechsler Intel Fellow, Mobility Group Director, Mobility Microprocessor Architecture Intel Corporation White Paper Inside Intel®Core™ Microarchitecture Introduction Introduction 2 The Intel® Core™ microarchitecture is a new foundation for Intel®Core™ Microarchitecture Design Goals 3 Intel® architecture-based desktop, mobile, and mainstream server multi-core processors. This state-of-the-art multi-core optimized Delivering Energy-Efficient Performance 4 and power-efficient microarchitecture is designed to deliver Intel®Core™ Microarchitecture Innovations 5 increased performance and performance-per-watt—thus increasing Intel® Wide Dynamic Execution 6 overall energy efficiency. This new microarchitecture extends the energy efficient philosophy first delivered in Intel's mobile Intel® Intelligent Power Capability 8 microarchitecture found in the Intel® Pentium® M processor, and Intel® Advanced Smart Cache 8 greatly enhances it with many new and leading edge microar- Intel® Smart Memory Access 9 chitectural innovations as well as existing Intel NetBurst® microarchitecture features. What’s more, it incorporates many Intel® Advanced Digital Media Boost 10 new and significant innovations designed to optimize the Intel®Core™ Microarchitecture and Software 11 power, performance, and scalability of multi-core processors. Summary 12 The Intel Core microarchitecture shows Intel’s continued Learn More 12 innovation by delivering both greater energy efficiency Author Biographies 12 and compute capability required for the new workloads and usage models now making their way across computing. With its higher performance and low power, the new Intel Core microarchitecture will be the basis for many new solutions and form factors. In the home, these include higher performing, ultra-quiet, sleek and low-power computer designs, and new advances in more sophisticated, user-friendly entertainment systems. -
Microcode Revision Guidance August 31, 2019 MCU Recommendations
microcode revision guidance August 31, 2019 MCU Recommendations Section 1 – Planned microcode updates • Provides details on Intel microcode updates currently planned or available and corresponding to Intel-SA-00233 published June 18, 2019. • Changes from prior revision(s) will be highlighted in yellow. Section 2 – No planned microcode updates • Products for which Intel does not plan to release microcode updates. This includes products previously identified as such. LEGEND: Production Status: • Planned – Intel is planning on releasing a MCU at a future date. • Beta – Intel has released this production signed MCU under NDA for all customers to validate. • Production – Intel has completed all validation and is authorizing customers to use this MCU in a production environment. -
Data Sampling on MDS-Resistant 10Th Generation Intel Core (Ice Lake) 1
Data Sampling on MDS-resistant 10th Generation Intel Core (Ice Lake) Daniel Moghimi Worcester Polytechnic Institute, Worcester, MA, USA Abstract the store buffer. MSBDS has been shown in attacks on the kernel space as well as on SGX [1]. In addition to the leakage Microarchitectural Data Sampling (MDS) is a set of hardware component, MSBDS can also be turned around easily to tran- vulnerabilities in Intel CPUs that allows an attacker to leak siently inject values into a victim, an attack technique known bytes of data from memory loads and stores across various as Load Value Injection (LVI) [14]. security boundaries. On affected CPUs, some of these vulner- abilities were patched via microcode updates. Additionally, To mitigate these vulnerabilities, Intel released software Intel announced that the newest microarchitectures, namely workarounds and microcode updates for affected CPUs [4]. Cascade Lake and Ice Lake, were not affected by MDS. While One of the most recent microarchitectures, Ice Lake, is re- Cascade Lake turned out to be vulnerable to the ZombieLoad ported to be unaffected by MDS attacks [6,8]. Intel has also v2 MDS attack (also known as TAA), Ice Lake was not af- explicitly listed Ice Lake processors as not being vulnera- fected by this attack. ble to LVI-SB [14], which exploits MSBDS for Load Value Injection [7]. In this technical report, we show a variant of MSBDS (CVE- 2018-12126), an MDS attack, also known as Fallout, that To better analyze the MDS vulnerabilities, and potentially works on Ice Lake CPUs. This variant was automatically find new variants, Moghimi et al. -
Asrock G41C-VS Motherboard, a Reliable Motherboard Produced Under Asrock’S Consistently Stringent Quality Control
G41C-VS User Manual Version 1.0 Published October 2009 Copyright©2009 ASRock INC. All rights reserved. 1 Copyright Notice: No part of this manual may be reproduced, transcribed, transmitted, or translated in any language, in any form or by any means, except duplication of documentation by the purchaser for backup purpose, without written consent of ASRock Inc. Products and corporate names appearing in this manual may or may not be regis- tered trademarks or copyrights of their respective companies, and are used only for identification or explanation and to the owners’ benefit, without intent to infringe. Disclaimer: Specifications and information contained in this manual are furnished for informa- tional use only and subject to change without notice, and should not be constructed as a commitment by ASRock. ASRock assumes no responsibility for any errors or omissions that may appear in this manual. With respect to the contents of this manual, ASRock does not provide warranty of any kind, either expressed or implied, including but not limited to the implied warran- ties or conditions of merchantability or fitness for a particular purpose. In no event shall ASRock, its directors, officers, employees, or agents be liable for any indirect, special, incidental, or consequential damages (including damages for loss of profits, loss of business, loss of data, interruption of business and the like), even if ASRock has been advised of the possibility of such damages arising from any defect or error in the manual or product. This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. -
8Th Generation Intel® Core™ Processors Product Brief
PRODUCT BRIEF 8TH GENERATION INTEL® CORE™ PROCESSORS Mobile U-Series: Peak Performance on the Go The new 8th generation Intel® Core™ Processor U-series—for sleek notebooks and 2 in 1s elevates your computing experience with an astounding 40 percent leap in productivity performance over 7th Gen PCs,1 brilliant 4K Ultra HD entertainment, and easier, more convenient ways to interact with your PC. With 10 hour battery life2 and robust I/O support, Intel’s first quad-core U-series processors enable portable, powerhouse thin and light PCs, so you can accomplish more on the go. Extraordinary Performance and Responsiveness With Intel’s latest power-efficient microarchitecture, advanced process technology, and silicon optimizations, the 8th generation Intel Core processor (U-series) is Intel’s fastest 15W processor3 with up to 40 percent greater productivity than 7th Gen processors and 2X more productivity vs. comparable 5-year-old processors.4 • Get fast and responsive web browsing with Intel® Speed Shift Technology. • Intel® Turbo Boost Technology 2.0 lets you work more productively by dynamically controlling power and speed—across cores and graphics— boosting performance precisely when it is needed, while saving energy when it counts. • With up to four cores, 8th generation Intel Core Processor U-series with Intel® Hyper-Threading Technology (Intel® HT Technology) supports up to eight threads, making every day content creation a compelling experience on 2 in 1s and ultra-thin clamshells. • For those on the go, PCs enabled with Microsoft Windows* Modern Standby wake instantly at the push of a button, so you don’t have to wait for your system to start up. -
6Th Gen Intel® Core™ Desktop Processor Product Brief
Product Brief 6th Gen Intel® Core™ Processors for Desktops: S-series LOOKING FOR AN AMAZING PROCESSOR for your next desktop PC? Look no further than 6th Gen Intel® Core™ processors. With amazing performance and stunning visuals, PCs powered by 6th Gen Intel Core processors will help take things to the next level and transform how you use a PC. The performance of 6th Gen Intel Core processors enable great user experiences today and in the future, including no passwords and more natural user interfaces. When paired with Intel® RealSense™ technology and Windows* 10, 6th Gen Intel Core processors can help remove the hassle of remembering and typing in passwords. Product Brief 6th Gen Intel® Core™ Processors for Desktops: S-series THAT RESPONSIVE PERFORMANCE EXTRA New architecture and design in 6th Gen Intel Core processors for desktops bring: BURST OF Support for DDR4 RAM memory technology in mainstream platforms, allowing systems to have up to 64GB of memory and higher transfer PERFORMANCE speeds at lower power when compared to DDR3 (DDR4 speed 2133 MT/s at 1.2V vs DDR3 speed 1600 MT/s at 1.5). 6th Gen Intel Core i7 and Core i5 processors come with Intel® Turbo boost 2.0 Technology which gives you that extra burst of performance for those jobs that require a bit more frequency.1 Intel ® Hyper-Threading Technology1 allows each processor core to work on two tasks at the same time, improving multitasking, speeding up the workfl ow, and accomplishing more in less time. With the Intel Core i7 processor you can have up to 8 threads running at the same time. -
Introducing the New 11Th Gen Intel® Core™ Desktop Processors
Product Brief 11th Gen Intel® Core™ Desktop Processors Introducing the New 11th Gen Intel® Core™ Desktop Processors The 11th Gen Intel® Core™ desktop processor family puts you in control of your compute experience. It features an innovative new architecture for reimag- ined performance, immersive display and graphics for incredible visuals, and a range of options and technologies for enhanced tuning. When these advances come together, you have everything you need for fast-paced professional work, elite gaming, inspired creativity, and extreme tuning. The 11th Gen Intel® Core™ desktop processor family gives you the power to perform, compete, excel, and power your greatest contributions. Product Brief 11th Gen Intel® Core™ Desktop Processors PERFORMANCE Reimagined Performance 11th Gen Intel® Core™ desktop processors are intelligently engineered to push the boundaries of performance. The new processor core architecture transforms hardware and software efficiency and takes advantage of Intel® Deep Learning Boost to accelerate AI performance. Key platform improvements include memory support up to DDR4-3200, up to 20 CPU PCIe 4.0 lanes,1 integrated USB 3.2 Gen 2x2 (20G), and Intel® Optane™ memory H20 with SSD support.2 Together, these technologies bring the power and the intelligence you need to supercharge productivity, stay in the creative flow, and game at the highest level. Product Brief 11th Gen Intel® Core™ Desktop Processors Experience rich, stunning, seamless visuals with the high-performance graphics on 11th Gen Intel® Core™ desktop -
Benchmarking the Intel FPGA SDK for Opencl Memory Interface
The Memory Controller Wall: Benchmarking the Intel FPGA SDK for OpenCL Memory Interface Hamid Reza Zohouri*†1, Satoshi Matsuoka*‡ *Tokyo Institute of Technology, †Edgecortix Inc. Japan, ‡RIKEN Center for Computational Science (R-CCS) {zohour.h.aa@m, matsu@is}.titech.ac.jp Abstract—Supported by their high power efficiency and efficiency on Intel FPGAs with different configurations recent advancements in High Level Synthesis (HLS), FPGAs are for input/output arrays, vector size, interleaving, kernel quickly finding their way into HPC and cloud systems. Large programming model, on-chip channels, operating amounts of work have been done so far on loop and area frequency, padding, and multiple types of blocking. optimizations for different applications on FPGAs using HLS. However, a comprehensive analysis of the behavior and • We outline one performance bug in Intel’s compiler, and efficiency of the memory controller of FPGAs is missing in multiple deficiencies in the memory controller, leading literature, which becomes even more crucial when the limited to significant loss of memory performance for typical memory bandwidth of modern FPGAs compared to their GPU applications. In some of these cases, we provide work- counterparts is taken into account. In this work, we will analyze arounds to improve the memory performance. the memory interface generated by Intel FPGA SDK for OpenCL with different configurations for input/output arrays, II. METHODOLOGY vector size, interleaving, kernel programming model, on-chip channels, operating frequency, padding, and multiple types of A. Memory Benchmark Suite overlapped blocking. Our results point to multiple shortcomings For our evaluation, we develop an open-source benchmark in the memory controller of Intel FPGAs, especially with respect suite called FPGAMemBench, available at https://github.com/ to memory access alignment, that can hinder the programmer’s zohourih/FPGAMemBench. -
Toshiba Hardware Portfolio – Microsoft Support by Family
Date created: 6/17/2020 Toshiba Hardware Portfolio – Microsoft Support by Family Windows 10 Windows 10 Windows 10 Toshiba Windows 10 Toshiba IoT IoT Enterprise Intel Platform Machine Intel Processor Model IoT Enterprise Family Enterprise LTSC 2019 Type LTSB 2015 LTSB 2016 Core i3 9100TE 777 TCx™ 700 4900 Core i5 9500T 787 9th Gen Core Core i7 9700T 797 (Coffee Lake Not Supported Refresh) Core i3 9100TE 371 TCx™ 300 4810 Core i5 9500T 381 Core i7 9700T 391 8th Gen Core TCx™ 300 4810 361 Celeron 4900T (Coffee Lake) TCx™ 700 4900 767 107 Available now and Core i7 7600U 117 supported until 137 Not Supported Jan 9, 2029 105 Core i5 7300U 115 7th Gen Core 135 TCx™ 800 6200 Available (Kaby Lake) 103 now and Core i3 7100U 113 supported until 133 Oct 13, 2026 10C Celeron 3965U 11C 13C N/A 4750 AMD GX-218GL D10 SoC Family Basics Celeron J1900 4818 T10 (Bay Trail) Quad Not Supported 6th Gen Core 145 TCxWave™ 6140 Core i5 6300U (Skylake/Q170) 155 Date created: 6/17/2020 14C Celeron 3955U 15C SoC Family Celeron J1900 A3R (Bay Trail) Quad Core i5 4950S 786 Available Core i3 4330 C86 now and TCx™ 700 4900 Celeron G1820 supported until 746 Oct 14, 2025 4th Gen Core Celeron G1820TE (Haswell/Q87) C46 Core i5 4570TE 380 TCx™ 300 4810 Core i3 4330TE 370 Celeron G1820TE 360 3rd Gen Core + TCxWave ™ 6140 Core i3 3217UE 120 2nd Gen PCH SurePOS (IvyBridge CPU + 4852 Core i5 3550S 580 CougarPoint PCH) 500 Toshiba Toshiba Limited TCxWave ™ 6140 Celeron 847E 100 Limited Support SurePOS Celeron G540 785 Support 2nd Gen Core 4900 700 Core i3 2120 C85 (SandyBridge/Q67) -
Class-Action Lawsuit
Case 3:20-cv-00863-SI Document 1 Filed 05/29/20 Page 1 of 279 Steve D. Larson, OSB No. 863540 Email: [email protected] Jennifer S. Wagner, OSB No. 024470 Email: [email protected] STOLL STOLL BERNE LOKTING & SHLACHTER P.C. 209 SW Oak Street, Suite 500 Portland, Oregon 97204 Telephone: (503) 227-1600 Attorneys for Plaintiffs [Additional Counsel Listed on Signature Page.] UNITED STATES DISTRICT COURT DISTRICT OF OREGON PORTLAND DIVISION BLUE PEAK HOSTING, LLC, PAMELA Case No. GREEN, TITI RICAFORT, MARGARITE SIMPSON, and MICHAEL NELSON, on behalf of CLASS ACTION ALLEGATION themselves and all others similarly situated, COMPLAINT Plaintiffs, DEMAND FOR JURY TRIAL v. INTEL CORPORATION, a Delaware corporation, Defendant. CLASS ACTION ALLEGATION COMPLAINT Case 3:20-cv-00863-SI Document 1 Filed 05/29/20 Page 2 of 279 Plaintiffs Blue Peak Hosting, LLC, Pamela Green, Titi Ricafort, Margarite Sampson, and Michael Nelson, individually and on behalf of the members of the Class defined below, allege the following against Defendant Intel Corporation (“Intel” or “the Company”), based upon personal knowledge with respect to themselves and on information and belief derived from, among other things, the investigation of counsel and review of public documents as to all other matters. INTRODUCTION 1. Despite Intel’s intentional concealment of specific design choices that it long knew rendered its central processing units (“CPUs” or “processors”) unsecure, it was only in January 2018 that it was first revealed to the public that Intel’s CPUs have significant security vulnerabilities that gave unauthorized program instructions access to protected data. 2. A CPU is the “brain” in every computer and mobile device and processes all of the essential applications, including the handling of confidential information such as passwords and encryption keys. -
INTEL Central Processing Units (CPU) This Page of Product Is Rohs Compliant
INTEL Central Processing Units (CPU) This page of product is RoHS compliant. CENTRAL PROCESSING UNITS (CPU) Intel Processor families include the most powerful and flexible Central Processing Units (CPUs) available today. Utilizing industry leading 22nm device fabrication techniques, Intel continues to pack greater processing power into smaller spaces than ever before, providing desktop, mobile, and embedded products with maximum performance per watt across a wide range of applications. Atom Celeron Core Pentium Xeon For quantities greater than listed, call for quote. MCU \ MPU / DSP MPU / MCU \ MOUSER Intel Core Cache Data TDP Price Each Package Processor Family Code Freq. Size No. of Bus Width (Max) STOCK NO. Part No. Series Name (GHz) (MB) Cores (bit) (W) 1 25 50 100 Desktop 607-DF8064101211300Y DF8064101211300S R0VY FCBGA-559 D2550 Atom™ Cedarview 1.86 1 2 64 10 607-CM8063701444901S CM8063701444901S R10K FCLGA-1155 G1610 Celeron® Ivy Bridge 2.6 2 2 64 55 Intel 607-CM8062301046804S CM8062301046804S R05J FCLGA-1155 G540 Celeron® Sandy Bridge 2.5 2 2 64 65 607-AT80571RG0641MLS AT80571RG0641MLS LGTZ LGA-775 E3400 Celeron® Wolfdale 2.6 1 2 64 65 607-HH80557PG0332MS HH80557PG0332MS LA99 LGA-775 E4300 Core™ 2 Conroe 1.8 2 2 64 65 607-AT80570PJ0806MS AT80570PJ0806MS LB9J LGA-775 E8400 Core™ 2 Wolfdale 3.0 6 2 64 65 607-AT80571PH0723MLS AT80571PH0723MLS LGW3 LGA-775 E7400 Core™ 2 Wolfdale 2.8 3 2 64 65 607-AT80580PJ0676MS AT80580PJ0676MS LB6B LGA-775 Q9400 Core™ 2 Yorkfield 2.66 6 4 64 95 607-CM80616003060AES CM80616003060AES LBTD FCLGA-1156