The Ultimated Edition Tout Du M Ondeo

Total Page:16

File Type:pdf, Size:1020Kb

The Ultimated Edition Tout Du M Ondeo THEULTIMATED EDITIONUS 20170352767A1 TOUTDU M ONDEO (19 ) United States (12 ) Patent Application Publication ( 10) Pub . No. : US 2017/ 0352767 A1 Hayne (43 ) Pub . Date : Dec. 7 , 2017 ( 54 ) ELECTRONIC MEMORY DEVICES HOIL 29 /66 (2006 .01 ) GIIC 16 / 14 ( 2006 . 01 ) (71 ) Applicant: Lancaster University Business HOIL 29 / 423 ( 2006 .01 ) Enterprises Limited , Lancashire (GB ) 2 ) U . S . CI. CPC .. .. HOIL 29 /803 ( 2014 .09 ) ; HOIL 29 /66924 (72 ) Inventor : Manus Hayne, Lancashire (GB ) ( 2013 .01 ) ; HOIL 29 /66916 (2013 .01 ) ; HOIL 29 / 432 ( 2013 .01 ) ; GIIC 16 / 14 ( 2013 . 01 ) ; (21 ) Appl. No. : 15 /521 , 208 HOIL 21/ 28273 ( 2013 .01 ) ; GIIC 16 / 28 (22 ) PCT Filed : Oct. 23 , 2015 ( 2013 .01 ) ; HOIL 29/ 42324 ( 2013 .01 ) ( 57 ) ABSTRACT ( 86 ) PCT No. : PCT/ GB2015 / 053191 A memory cell for storing one or more bits of information $ 371 ( c ) ( 1 ) , has a control gate , a source terminal and a drain terminal. A ( 2 ) Date : Apr. 21, 2017 semiconductor substrate is located between the source and drain terminals , and a floating gate is disposed between the ( 30 ) Foreign Application Priority Data control gate and the semiconductor substrate . The floating gate is electrically isolated from the control gate by a charge Oct. 23, 2014 (GB ) .. .. .. 1418888 . 2 trapping barrier, and is electrically isolated from the semi conductor substrate by a charge blocking barrier . At least Publication Classification one of the charge trapping barrier and the charge blocking (51 ) Int . CI. barrier contains a III- V semiconductor material . The charge HOIL 29 /80 ( 2006 .01 ) trapping barrier is adapted to enable the selective passage of HOIL 29 /43 ( 2006 . 01 ) charge carriers between the control gate and the floating HOIL 21/ 28 ( 2006 .01 ) gate , in use , to modify the one or more bits of information GIIC 16 / 28 ( 2006 . 01 ) stored by the memory cell. 24 6000 op de Hos * 1 porlo Patent Application Publication Dec . 7 , 2017 Sheet 1 of 6 US 2017 / 0352767 A1 Figure 1 wwwwwww wwwwwwwwwwww 24 26 1 0600 NORMAN X 150 5008 Wood ith w woon 20 Patent Application Publication Dec . 7 , 2017 Sheet 2 of 6 US 2017 / 0352767 A1 FigureFigurx 2 W * 24 20 440 XXX * * * CHORONARINChorong X soos nogo google 2006 Patent Application Publication Dec . 7 , 2017 Sheet 3 of 6 US 2017 / 0352767 A1 Figure 3 30 k * * * , * , * , * , * , * , * , * , * ,* , * , * * * * * , * , * , * , * , * a # * # # # * ooooooooooo00oooooooooo # ???????? # * # 00000000000000000000000000000000000000000000000 * # * ooooooooooooooooooooooooooooo # # # * # # * # # # # * # wwwwwwwwwwwww 00000000000000000000000000000000oooooooo0000000000000000000000000000000000000000000000000000000 * oooooooooooooooooooooooooooooooooo # * # # KOSOANOVI # www oooooooooooooooooooooooooo # . * . * . * . * . * . * . * . * . * . * . * . * . * . * . * www ooooo # # wwwwwwwwwwwwwwwwwwwwwwwwwwwwwwwwwwwwwwwwwwwwwwwwwww000000000000000000000000000000000000000 Opocs Patent Application Publication Dec . 7 , 2017 Sheet 4 of 6 US 2017 / 0352767 A1 Figurewi 4 wwwwww wwwwwwww ! w ww w - + inna + V wwwwwwwwwwwwwwwwwwwwwwwwwww w errrrrrrrrrrr KOJOB wwwwwwww wwwwwwwwww wwwwwwwwwwwwwwwwwwww wwwwwwwwwwwwww ?momen ww + WWW pamannannawaanzaaaannnnnnnnnaaagawannnnnnnnnnnnnnnnnnnnnnnnn 20 Displacsment (nm ) Figure 5 00000 0 0000000000000000 febrer wwwwwwwwwwwwwwwwwwwwwwww wowy e 7777777777777777777777777 Energy(@V) 5c 5 $ wernerennnnnnn momentwemo , i quererquyuyuyundurdu wwwins? isimine ni 8 hmmmmmmmmm wiwiwimminen Werderderderderd Jauwgelosia) uu ( Patent Application Publication Dec . 7 , 2017 Sheet 5 of 6 US 2017 / 0352767 A1 Figure 6 de ; ; 33 LUUvomoun Horoosoles* Harcamage oi probaasbydessäy y sumption mona ? ?????????• ? : ; :? ?????????? an www diea Percentageofprobabilitydensityfunction suapAungegold momentin ??????????????????????????????????????????????????????????????????????????????? Sateen Om ww www wwwwwwwwwwwwwwwww > wwwwwwwwwwwwww ?????? ????? . ; ? Dis??? } } Figure 7 ??) - . - Y - . (O)Xh3B mempercent er V . olen ????????? mmmmmmm ?????? * * ER wwwwwwwwwwwwwwwwamen busmoment 7a 0 1 komandante d wujuawajeldso Patent Application Publication Dec . 7 , 2017 Sheet 6 of 6 US 2017 / 0352767 A1 Figure22 . 8 wwwwwwwwwwwwwwwwwwwwwwwwwwwwwwww ** * * roosoudy censity function morcentage of prodaoutty onsity function hoe mmmmm VC Sinceur Probabilitydensityfunction(nm) wantummannahamwinamakanminnanland in wwwwwwww wimmoinnin uonounsalsuapAilqeqoidjoabeju2018d s womitmentwmiminimitat wwwwwwww wmowhomontown.common KWKWKWKWKWWwwwwwwwwwwww w han hometo this - - m . dr m way more o n . - - - - - - - - - - - - - - - - wwwwww- wwwwwwwwwwwwwwwwwwwww-wwwwwwwwww- wwwwww wwwwwwwwwwwwwwwwww wwwwwwwwww 0 -30 20 . 01 Displacement (nm ) US 2017 /0352767 A1 Dec. 7 , 2017 ELECTRONIC MEMORY DEVICES be held within the floating gate for extremely long periods of time without the risk of charge being removed from the CROSS REFERENCE TO RELATED floating gate . Thus, flash memory is a non - volatile form of APPLICATION memory , which allows for robust storage of data . [0001 ] The present application claims priority to Great [0008 ] Flash memory typically makes use of one of two Britain Patent Application No . 1418888 . 2 , filed Oct. 23 , mechanisms for the transfer of charge between the channel 2014 , incorporated herein its entirety . and the floating gate , namely Fowler -Nordheim tunnelling and hot - carrier injection (HCI ) . TECHNICAL FIELD [0009 ] Fowler- Nordheim tunnelling is a quantum mechanical effect relying on the tunnelling of electrons [0002 ] The present invention relates to electronic memory through a potential barrier . The probability of an electron devices , and in particular to electronic memory devices that passing through a barrier is greater for barriers of a smaller utilise floating gates to store charge . width , and thus , in order to facilitate the transfer of electrons between the channel and the floating gate , it is desirable to BACKGROUND have as thin a layer of oxide as possible . 10003 ] In the modern era , society is becoming ever more [00101 This , however, contradicts the requirement for non dependent on access to , and the manipulation and storage of, volatility , which requires that the oxide layer is thick enough increasingly vast amounts of data , at ever increasing speeds . to prevent charge from leaking from the floating gate to the Indeed , the ability to access large amounts of robustly stored channel, and vice versa . The increased thickness that is data at a high speed is vital in many industries, as well as necessary for non - volatility thus results in a lower probabil highly desirable for individuals when , for example , access ity of electrons being transferred between the channel and ing the internet and the like . Access to information can the floating gate , thereby increasing write and erase times . promote freedom of choice , improve efficiency , drive inno [ 0011 ] Hot - carrier injection relies on the application of a vation and economic development , and may overall lead to voltage between the source and drain , which increases the an improved quality of life . kinetic energy of electrons in the channel such that they are [0004 ] Memory devices are typically semiconductor able to pass through the oxide layer and into the floating based , integrated circuits for use by computers or other channel . However , this requires a high voltage to be applied , electronic devices . There are many different types of which may in turn create a high electric field through the memory, including random - access memory (RAM ) , read structure . Furthermore , increased voltages may result in only memory (ROM ) , non - volatile floating gate NOR / electrons having increased kinetic energy to such a degree NAND flash memory , and dynamic random -access memory that, when electrons collide with the oxide layer , degradation (DRAM ) . of the oxide layer may occur , thereby limiting the number of [0005 ] Flash memory is a semiconductor device that uti times that electrons may be transferred ( ie data may be lises an electrically isolated floating gate within which written and erased ) from the channel to the floating gate . charge is selectively stored . A conventional flash memory [0012 ] Various alternative methods to conventional flash cell comprises a semiconductor substrate (usually silicon ) , memory have been proposed , for example the production of which is doped to form separated source and drain terminals . nitride trapping layers in SONOS or TANOS devices, yet A control gate terminal is also provided , with an electrically none of these methods have been able to combine long term isolated floating gate disposed between the control gate and charge retention , ie non -volatility , with the fast write and /or the substrate . A voltage applied to the control gate that is erase times that are desirable . greater in magnitude than a threshold voltage enables cur [ 0013] There has now been devised a memory cell, rent flow along a conductive channel, also known as an method of manufacturing a memory cell , and a method of inversion layer, in the semiconductor substrate between the operating a memory cell , which overcome or substantially source and the drain terminals . [ 0006 ] If charge is located within the floating gate , then mitigate the aforementioned and / or other disadvantages the floating gate partially screens the control gate from the associated with the prior art. channel, thereby increasing the magnitude of the threshold voltage, ie the voltage at the control gate
Recommended publications
  • Physical Properties and Data of Optical Materials
    Physical Properties and Data of Optical Materials Moriaki Wakaki Keiei Kudo Takehisa Shibuya Laß) CRC Press ^^ J Taylor &. Francis Group '*-*"' Boca Raton London New York CRC Press is an imprint of the Taylor & Francis Group, an informa business • Table of Contents A AI (Aluminum) 1 AlSb (Aluminium Antimonide) 10 ADP (Ammonium Dihydrogen Phosphate) 16 Sb (Antimony) 21 Arsenic Selenium Glass 26 As (33%) + S (30%) + Br (37%) (Arsenic-Sulfur-Bromine Glass) 28 As2Se3 (Arsenic Tri-Selenide) 30 As2S3 (Arsenic Tri-Sulfide Glass) 33 6 Ba (Barium) 39 BaF2 (Barium Fluoride) 42 BaTi03 (Barium Titanate) 47 Be (Beryllium) 50 BeO (Beryllium Oxide) 54 Bi(Bismuth) 56 B(Boron) 61 C Cd(Cadmium) 65 CdSe (Cadmium Selenide) 70 CdS (Cadmium Sulfide) 75 CdTe (Cadmium Telluride) 82 CaC03 (Calcite) 89 CaF2 (Calcium Fluoride) 96 CaW04 (Calcium Tungstate) 105 CsBr (Cesium Bromide) 108 Csl (Cesium Iodide) 113 Cr(Chromium) 118 Cu(Copper) 122 CuCl (Cuprous Chloride) 128 D Diamond 135 G Ga (Gallium) 139 GaSb (Gallium Antimonide) 142 GaAs (Gallium Arsenide) 149 GaP (Gallium Phosphide) 158 Ge (Germanium) 165 Ge + Se + Te (Germanium-Selenium-Tellurium Glass) 180 Glass 182 Au (Gold) 191 * I In (Indium) 199 InSb (Indium Antimonide) 202 InAs (Indium Arsenide) 212 InP (Indium Phosphide) 218 Ir (Iridium) 224 Fe(Iron) 228 L LaF3 (Lanthanum Fluoride) 233 PbF2 (Lead Fluoride) 236 PbSe (Lead Selenide) 237 PbS (Lead Sulfide) 243 PbTe (Lead Telluride) 251 LiF (Lithium Fluoride) 257 Lucite 266 M Mg (Magnesium) 269 MgF2 (Magnesium Fluoride) 275 Mg2Ge (Magnesium Germanide) 282 MgO (Magnesium
    [Show full text]
  • Chemical Names and CAS Numbers Final
    Chemical Abstract Chemical Formula Chemical Name Service (CAS) Number C3H8O 1‐propanol C4H7BrO2 2‐bromobutyric acid 80‐58‐0 GeH3COOH 2‐germaacetic acid C4H10 2‐methylpropane 75‐28‐5 C3H8O 2‐propanol 67‐63‐0 C6H10O3 4‐acetylbutyric acid 448671 C4H7BrO2 4‐bromobutyric acid 2623‐87‐2 CH3CHO acetaldehyde CH3CONH2 acetamide C8H9NO2 acetaminophen 103‐90‐2 − C2H3O2 acetate ion − CH3COO acetate ion C2H4O2 acetic acid 64‐19‐7 CH3COOH acetic acid (CH3)2CO acetone CH3COCl acetyl chloride C2H2 acetylene 74‐86‐2 HCCH acetylene C9H8O4 acetylsalicylic acid 50‐78‐2 H2C(CH)CN acrylonitrile C3H7NO2 Ala C3H7NO2 alanine 56‐41‐7 NaAlSi3O3 albite AlSb aluminium antimonide 25152‐52‐7 AlAs aluminium arsenide 22831‐42‐1 AlBO2 aluminium borate 61279‐70‐7 AlBO aluminium boron oxide 12041‐48‐4 AlBr3 aluminium bromide 7727‐15‐3 AlBr3•6H2O aluminium bromide hexahydrate 2149397 AlCl4Cs aluminium caesium tetrachloride 17992‐03‐9 AlCl3 aluminium chloride (anhydrous) 7446‐70‐0 AlCl3•6H2O aluminium chloride hexahydrate 7784‐13‐6 AlClO aluminium chloride oxide 13596‐11‐7 AlB2 aluminium diboride 12041‐50‐8 AlF2 aluminium difluoride 13569‐23‐8 AlF2O aluminium difluoride oxide 38344‐66‐0 AlB12 aluminium dodecaboride 12041‐54‐2 Al2F6 aluminium fluoride 17949‐86‐9 AlF3 aluminium fluoride 7784‐18‐1 Al(CHO2)3 aluminium formate 7360‐53‐4 1 of 75 Chemical Abstract Chemical Formula Chemical Name Service (CAS) Number Al(OH)3 aluminium hydroxide 21645‐51‐2 Al2I6 aluminium iodide 18898‐35‐6 AlI3 aluminium iodide 7784‐23‐8 AlBr aluminium monobromide 22359‐97‐3 AlCl aluminium monochloride
    [Show full text]
  • Flexible Thermal Interface Based on Self-Assembled Boron Arsenide for High-Performance Thermal Management
    UCLA UCLA Previously Published Works Title Flexible thermal interface based on self-assembled boron arsenide for high-performance thermal management. Permalink https://escholarship.org/uc/item/4b77z423 Journal Nature communications, 12(1) ISSN 2041-1723 Authors Cui, Ying Qin, Zihao Wu, Huan et al. Publication Date 2021-02-24 DOI 10.1038/s41467-021-21531-7 Peer reviewed eScholarship.org Powered by the California Digital Library University of California ARTICLE https://doi.org/10.1038/s41467-021-21531-7 OPEN Flexible thermal interface based on self-assembled boron arsenide for high-performance thermal management ✉ Ying Cui1, Zihao Qin1, Huan Wu1, Man Li1 & Yongjie Hu 1 Thermal management is the most critical technology challenge for modern electronics. Recent key materials innovation focuses on developing advanced thermal interface of elec- 1234567890():,; tronic packaging for achieving efficient heat dissipation. Here, for the first time we report a record-high performance thermal interface beyond the current state of the art, based on self- assembled manufacturing of cubic boron arsenide (s-BAs). The s-BAs exhibits highly desirable characteristics of high thermal conductivity up to 21 W/m·K and excellent elastic compliance similar to that of soft biological tissues down to 100 kPa through the rational design of BAs microcrystals in polymer composite. In addition, the s-BAs demonstrates high flexibility and preserves the high conductivity over at least 500 bending cycles, opening up new application opportunities for flexible thermal cooling. Moreover, we demonstrated device integration with power LEDs and measured a superior cooling performance of s-BAs beyond the current state of the art, by up to 45 °C reduction in the hot spot temperature.
    [Show full text]
  • Advanced Crystal Growth Techniques with Iii-V Boron Compound
    ADVANCED CRYSTAL GROWTH TECHNIQUES WITH III-V BORON COMPOUND SEMICONDUCTORS by CLINTON E. WHITELEY B.S., Benedictine Collage, 2005 M.S., Kansas State University, 2008 AN ABSTRACT OF A DISSERTATION submitted in partial fulfillment of the requirements for the degree DOCTOR OF PHILOSOPHY Department of Chemical Engineering College of Engineering KANSAS STATE UNIVERSITY Manhattan, Kansas 2011 ABSTRACT Semiconducting icosahedral boron arsenide, B12As2, is an excellent candidate for neutron detectors and radioisotope batteries, for which high quality single crystals are required. Thus, the present study was undertaken to grow B12As2 crystals by precipitation from metal solutions (nickel) saturated with elemental boron and arsenic in a sealed quartz ampoule. B12As2 crystals of 8-10 mm were produced when a homogeneous mixture of the three elements was held at 1150 °C for 48-72 hours and slowly cooled (3°C/hr). The crystals varied in color and transparency from black and opaque to clear and transparent. X-ray topography (XRT), Raman spectroscopy, and defect selective etching confirmed that the crystals had the expected rhombohedral structure and a low density of defects (5x107 cm-2). The concentrations of residual impurities (nickel, carbon, etc) were found to be relatively high (1019 cm-3 for carbon) as measured by secondary ion mass spectrometry (SIMS) and elemental analysis by energy dispersive x-ray spectroscopy (EDS). The boron arsenide crystals were found to have favorable electrical properties (µ = 24.5 cm2 / Vs), but no interaction between a prototype detector and an alpha particle bombardment was observed. Thus, the flux growth method is viable for growing large B12As2 crystals, but the impurity concentrations remain a problem.
    [Show full text]
  • Boron Isotope Effect on the Thermal Conductivity of Boron Arsenide Single Crystals
    Boron isotope effect on the thermal conductivity of boron arsenide single crystals Haoran Sun1, Ke Chen2, Geethal Amila Gamage1, Hamidreza Ziyaee3, Fei Wang1, Yu Wang1,4, Viktor G. Hadjiev3, Fei Tian1†, Gang Chen2, and Zhifeng Ren1† 1 Department of Physics and Texas Center for Superconductivity (TcSUH), University of Houston, Houston, Texas 77204, USA 2 Department of Mechanical Engineering, Massachusetts Institute of Technology, Cambridge, MA 02139, USA 3 Department of Mechanical Engineering and Texas Center for Superconductivity (TcSUH), University of Houston, Houston, Texas 77204, USA 4 Institute of Advanced Materials, Hubei Normal University, Huangshi, Hubei 435002, China †To whom correspondence should be addressed, email: [email protected], [email protected] Abstract Boron arsenide (BAs) with a zinc blende structure has recently been discovered to exhibit unusual and ultrahigh thermal conductivity (k), providing a new outlook for research on BAs and other high thermal conductivity materials. Technology for BAs crystal growth has been continuously improving, however, the influence of boron isotopes, pure or mixed, on the thermal conductivity in BAs is still not completely clear. Here we report detailed studies on the growth of single crystals of BAs with different isotopic ratios and demonstrate that the k of isotopically pure BAs is at least 10% higher than that of BAs grown from natural B. Raman spectroscopy characterization shows differences in scattering among various BAs samples. The presented results will be helpful in guiding further studies on the 1 influence of isotopes on optimizing k in BAs. 2 Introduction The heat produced in high power density electronic devices imposes a major limitation on the performance of these devices.
    [Show full text]
  • Cubic Boron Phosphide Epitaxy on Zirconium Diboride Balabalaji Padavala, H
    Cubic boron phosphide epitaxy on zirconium diboride Balabalaji Padavala, H. Al Atabi, Lina Tengdelius, Jun Lu, Hans Högberg and J. H. Edgar The self-archived postprint version of this journal article is available at Linköping University Institutional Repository (DiVA): http://urn.kb.se/resolve?urn=urn:nbn:se:liu:diva-144241 N.B.: When citing this work, cite the original publication. Padavala, B., Al Atabi, H., Tengdelius, L., Lu, J., Högberg, H., Edgar, J. H., (2018), Cubic boron phosphide epitaxy on zirconium diboride, Journal of Crystal Growth, 483, 115-120. https://doi.org/10.1016/j.jcrysgro.2017.11.014 Original publication available at: https://doi.org/10.1016/j.jcrysgro.2017.11.014 Copyright: Elsevier http://www.elsevier.com/ Cubic Boron Phosphide Epitaxy on Zirconium Diboride Balabalaji Padavala1, H. Al Atabi1, Lina Tengdelius2, Jun Lu2, Hans Högberg2 and J.H. Edgar1 Kansas State University, Department of Chemical Engineering, Durland Hall, Manhattan, KS 66506, USA Thin Film Physics Division, Department of Physics, Chemistry, and Biology (IFM), Linköping University, SE-581 83 Linköping, Sweden Abstract Cubic boron phosphide (BP) is one of the least studied III-V compound semiconductors, in part because it is difficult to prepare in high quality form. In this study, zirconium diboride (ZrB2) was studied as a potential substrate for BP epitaxial layers, because of its advantages of a low lattice constant mismatch and high thermal stability. Two types of substrates were considered: ZrB2(0001) epitaxial films on 4H- SiC(0001) and bulk ZrB2(0001) single crystals. The optimal temperature for epitaxy on these substrates was 1100 °C; higher and lower temperatures resulted in polycrystalline films.
    [Show full text]
  • 1.2 Boron Arsenide: Structure, Properties and Applications
    THE PENNSYLVANIA STATE UNIVERSITY SCHREYER HONORS COLLEGE DEPARTMENT OF MATERIALS SCIENCE AND ENGINEERING INVESTIGATION OF METAL THIN-FILMS ON BORON ARSENIDE AND HEXAGONAL BORON NITRIDE RAJEH SALAH R. ALSAADI SPRING 2020 A thesis submitted in partial fulfillment of the requirements for a baccalaureate degree in Materials Science and Engineering with honors in Materials Science and Engineering Reviewed and approved* by the following: Suzanne E. Mohney Professor of Materials Science and Engineering and Electrical Engineering Thesis Supervisor Robert A. Kimel Associate Teaching Professor of Materials Science and Engineering Honors Adviser * Electronic approvals are on file. i ABSTRACT Boron arsenide (BAs) and hexagonal boron nitride (h-BN) are of great interest for the development of next-generation electronic and optoelectronic devices due to their potential for superior performance for heat management and as insulating two-dimensional layered materials, respectively. Studies of metal electrical contacts to BAs, or heterojunctions involving metals and h-BN, are scarce in the literature. A device with BAs as an active semiconducting layer would require electrical contacts, so reactivity at metal/BAs interfaces were assessed based on condensed phase equilibria for metal-B-As systems. A MATLAB program was utilized to calculate the ternary phase diagrams for BAs with Pt, Mo, Cr, Ti, Au and Ag at room temperature. Platinum, Mo, Cr and Ti demonstrate are predicted to have exhibit a thermodynamic drive to react with BAs, while Au and Ag are in thermodynamic equilibrium with BAs. Assessment of stability of thin metal films on h-BN involved collection of condensed phase equilibria for metal-B-N systems from the literature, which showed that the early transition metals Cr, V, Ti, Zr, and Al have a thermodynamic driving force to react, while later transition metals Fe, Co, Ni, Mn, Au, Ag, Cu and Cd are expected to be stable on h-BN.
    [Show full text]
  • Guideline Ver6.2 Se Ria L No. CAS RN® Substance Group 1 Substance
    Guideline Ver6.2 Rank CAS RN® Substance Group 1 Substance Group 2 Substance Name 1=Prohibited No. Serial 2=Reduction 1 124-73-2 ozone depleting substances(Halons) Ethane, 1,2-dibromo-1,1,2,2-tetrafluoro- 1 2 25497-30-7 ozone depleting substances(Halons) Dibromotetrafluoroethane 1 3 27336-23-8 ozone depleting substances(Halons) Dibromotetrafluoroethane,compressed 1 4 353-59-3 ozone depleting substances(Halons) Methane, bromochlorodifluoro- 1 5 354-56-3 ozone depleting substances(Halons) Ethane, pentachlorofluoro- 1 6 75-61-6 ozone depleting substances(Halons) Methane, dibromodifluoro- 1 7 75-63-8 ozone depleting substances(Halons) Methane, bromotrifluoro- 1 8 110003-27-5 ozone depleting substances(HBFCs) 1,3-dibromo-1,1,2-trifluoropropane 1 9 111483-20-6 ozone depleting substances(HBFCs) 1-bromo-2,3-difluoropropane 1 10 124-72-1 ozone depleting substances(HBFCs) 2-bromo-1,1,1,2-tetrafluoroethane 1 11 148875-95-0 ozone depleting substances(HBFCs) C3H3FBr4 1 12 148875-98-3 ozone depleting substances(HBFCs) C3H2F2Br4 1 13 1511-62-2 ozone depleting substances(HBFCs) Methane, bromodifluoro- 1 14 172912-75-3 ozone depleting substances(HBFCs) HBFC-131 B3 Tribromofluoroethane 1 15 1800-81-3 ozone depleting substances(HBFCs) 1-bromo-1,2-difluoroethane 1 16 1868-53-7 ozone depleting substances(HBFCs) Dibromofluoromethane 1 17 1871-72-3 ozone depleting substances(HBFCs) FLUOROBROMOPROPANE 1 18 2252-78-0 ozone depleting substances(HBFCs) 1-Bromo-1,1,2,3,3,3-hexafluoropropane 1 19 2252-79-1 ozone depleting substances(HBFCs) 2-bromo-1,1,1,3,3,3-hexafluoropropane
    [Show full text]
  • Download (16Mb)
    A Thesis Submitted for the Degree of PhD at the University of Warwick Permanent WRAP URL: http://wrap.warwick.ac.uk/127768 Copyright and reuse: This thesis is made available online and is protected by original copyright. Please scroll down to view the document itself. Please refer to the repository record for this item for information to help you to cite it. Our policy information is available from the repository home page. For more information, please contact the WRAP Team at: [email protected] warwick.ac.uk/lib-publications Dielectrics for Narrow Bandgap III-V Devices Oliver Vavasour School of Engineering University of Warwick Dissertation submitted for the degree of Doctor of Philosophy October 2018 Contents List of Figures vii List of Tables xiv List of Equations xvi Acknowledgements xvii Declaration xviii Abstract xx Nomenclature xxii 1 Introduction 1 1.1 Semiconductor Technology Applications . 1 1.1.1 Niches for Alternative Materials . 2 1.1.2 Use of Narrow Bandgap Materials . 2 1.2 III-V Semiconductor Materials . 2 1.2.1 Elemental and Compound Semiconductors . 2 1.2.2 Semiconductor Alloys . 3 1.3 Review of Narrow Bandgap Material Applications . 4 1.4 Thesis Outline . 5 2 Literature Review 7 2.1 Introduction . 7 2.1.1 Deposition Techniques . 8 2.1.2 Origin of Interface Trap States . 10 2.2 Dielectric Materials . 10 2.2.1 Silicon Dioxide . 11 2.2.2 Gadolinium/Gallium Oxide . 11 2.2.3 Aluminium Oxide . 11 2.2.4 Hafnium Oxide . 12 i Chapter 0 Section 0.0 2.2.5 Lanthanum Oxide .
    [Show full text]
  • Abstract Development of Boron-Arsenide-Based
    ABSTRACT DEVELOPMENT OF BORON-ARSENIDE-BASED COMPOSITES AS THERMAL INTERFACE MATERIALS FOR HIGH POWER GENERATING ELECTRONICS MODULES Vignesh Varadaraju, MS Department of Mechanical Engineering Northern Illinois University, 2017 Dr. Pradip Majumdar, Director Thermal management is one of the most critical issues in electronics due to increasing power densities. This problem is getting even worse for small and sophisticated devices due to air gaps present between the heat source and heat sink; air gaps are thermal barriers to the heat dissipation path. Thermal interface materials (TIM) are used to reduce the air gaps; TIM placed in between heat source and heat sink significantly increases the heat transfer capability of the system. The ability to work at large temperature cycling results in reduction of thermos- mechanical reliability for the traditional TIMs. A high-thermal-performance, cost-effective and reliable TIM would be needed to dissipate the generated heat, which could enable significant reductions in weight, volume and cost of the thermal management system. The objective of this research is to design advanced TIM by finding the composition of boron arsenide as filler in polymer-nanostructured material which can outperform traditional TIMs when it is used in high-heat fluxes applications including space and aero-space applications. A three-dimensional computational analysis model is developed to evaluate boron- arsenide-based TIM in terms of spreading heat and reduction junction temperature using an insulated gate bipolar transistor (IGBT) power module in a forced-air convective environment. NORTHERN ILLINOIS UNIVERSITY DEKALB, ILLINOIS AUGUST 2017 DEVELOPMENT OF BORON-ARSENIDE-BASED COMPOSITES AS THERMAL INTERFACE MATERIALS FOR HIGH POWER GENERATING ELECTRONICS MODULES BY VIGNESH VARADARAJU ©2017 Vignesh Varadaraju A THESIS SUBMITTED TO THE GRADUATE SCHOOL IN PARTIAL FULFILLMENT OF THE REQUIREMENTS FOR THE DEGREE MASTER OF SCIENCE DEPARTMENT OF MECHANICAL ENGINEERING Thesis Director: Dr.
    [Show full text]
  • Front Matter Template
    Copyright by Jae Hyun Kim 2015 The Dissertation Committee for Jae Hyun Kim Certifies that this is the approved version of the following dissertation: Four-Probe Thermal and Thermoelectric Transport Measurements of Bismuth Antimony Telluride, Silicon, and Boron Arsenide Nanostructures Committee: Li Shi, Supervisor Jayathi Murthy Yaguo Wang Zhen Yao Emanuel Tutuc Four-Probe Thermal and Thermoelectric Transport Measurements of Bismuth Antimony Telluride, Silicon, and Boron Arsenide Nanostructures by Jae Hyun Kim, B. S.; M. S. Dissertation Presented to the Faculty of the Graduate School of The University of Texas at Austin in Partial Fulfillment of the Requirements for the Degree of Doctor of Philosophy The University of Texas at Austin August 2015 Dedication Jeewon and Yonu Acknowledgements I am sincerely grateful to my advisor professor Li Shi for his continuous support, insightful advice, and encouragement. I would not have been able to make this progress without his guidance. I would like to thank my dissertation committee members, professors Jayathi Murthy, Yaguo Wang, Zhen Yao, and Emanuel Tutuc. I also would like to thank previous and current lab members; Yong , Arden, Jae Hun, Michael, Insun, Dan, Pat, Mir, Annie, Eric, Gabbi, Brandon, and others, who helped me a lot in many aspects. v Four-Probe Thermal and Thermoelectric Transport Measurements of Bismuth Antimony Telluride, Silicon, and Boron Arsenide Nanostructures Jae Hyun Kim, Ph. D. The University of Texas at Austin, 2015 Supervisor: Li Shi Thermal management in electronic devices has become a significant challenge because of the high power density in nanoelectronic devices. This challenge calls for a better understanding of thermal transport processes in nanostructures and devices, as well as new thermal management approaches such as high thermal conductivity materials and efficient on-chip thermoelectric coolers.
    [Show full text]
  • Jb Enterprises
    +91-8048372629,937 Jb Enterprises https://www.indiamart.com/jbenterprises-hyderabad/ We are trader and supplier of a wide array of Flexible Printing , Silver Pouches, Heat Silver Pouches, Papr Lamination,Silicon oil ,Silicon Grease,Printing ink & many more. About Us Incorporated in the year 2015 at Hyderabad, Telangana, India, we JB Enterprises are a Sole Proprietorship based company, conceived its business operations as a distinguished as a trustworthy trader and supplier of a wide array of Aluminium Antimonide, Aluminum Arsenide, Aluminium Boride, Aluminium Bromide, Aluminium Carbide, Aluminum Fluoride, Aluminum Iodide, Aluminium Molybdate, Aluminium Nitride, Aluminium Oxide, Aluminum Sulfide, Aluminium Telluride, Aluminium Tungstate, Aluminium Zirconate, Ammonium Chloride & many more. Offered chemicals are widely demanded in the market, owing to their indispensable features like balanced composition, high purity level, long shelf life and eco-friendly nature. These chemicals are procured from the certified vendors of the market. Provided chemicals serve a wide number of industries. Under the strict guidance of Jagdish Chandra Bandaragal (Proprietor), our company has been able to carve a distinct place in the industry. He frequently coordinates with the team and makes them updated with the current market trends. For more information, please visit https://www.indiamart.com/jbenterprises-hyderabad/about-us.html O u r P r o d u c t s R E T S Y L O P G N I T N I R P Rotogravure Printing Rotogravure Film Printing Paper With Film Lamination
    [Show full text]