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INTEL Central Processing Units (CPU) This Page of Product Is Rohs Compliant
INTEL Central Processing Units (CPU) This page of product is RoHS compliant. CENTRAL PROCESSING UNITS (CPU) Intel Processor families include the most powerful and flexible Central Processing Units (CPUs) available today. Utilizing industry leading 22nm device fabrication techniques, Intel continues to pack greater processing power into smaller spaces than ever before, providing desktop, mobile, and embedded products with maximum performance per watt across a wide range of applications. Atom Celeron Core Pentium Xeon For quantities greater than listed, call for quote. MCU \ MPU / DSP MPU / MCU \ MOUSER Intel Core Cache Data TDP Price Each Package Processor Family Code Freq. Size No. of Bus Width (Max) STOCK NO. Part No. Series Name (GHz) (MB) Cores (bit) (W) 1 25 50 100 Desktop 607-DF8064101211300Y DF8064101211300S R0VY FCBGA-559 D2550 Atom™ Cedarview 1.86 1 2 64 10 607-CM8063701444901S CM8063701444901S R10K FCLGA-1155 G1610 Celeron® Ivy Bridge 2.6 2 2 64 55 Intel 607-CM8062301046804S CM8062301046804S R05J FCLGA-1155 G540 Celeron® Sandy Bridge 2.5 2 2 64 65 607-AT80571RG0641MLS AT80571RG0641MLS LGTZ LGA-775 E3400 Celeron® Wolfdale 2.6 1 2 64 65 607-HH80557PG0332MS HH80557PG0332MS LA99 LGA-775 E4300 Core™ 2 Conroe 1.8 2 2 64 65 607-AT80570PJ0806MS AT80570PJ0806MS LB9J LGA-775 E8400 Core™ 2 Wolfdale 3.0 6 2 64 65 607-AT80571PH0723MLS AT80571PH0723MLS LGW3 LGA-775 E7400 Core™ 2 Wolfdale 2.8 3 2 64 65 607-AT80580PJ0676MS AT80580PJ0676MS LB6B LGA-775 Q9400 Core™ 2 Yorkfield 2.66 6 4 64 95 607-CM80616003060AES CM80616003060AES LBTD FCLGA-1156 -
SAMPLE CHAPTER 1 Chapter Personal Computer 1 System Components the FOLLOWING COMPTIA A+ ESSENTIALS EXAM OBJECTIVES ARE COVERED in THIS CHAPTER
SAMPLE CHAPTER 1 Chapter Personal Computer 1 System Components THE FOLLOWING COMPTIA A+ ESSENTIALS EXAM OBJECTIVES ARE COVERED IN THIS CHAPTER: Ûß1.2 Explain motherboard components, types and features Nß Form Factor Nß ATX / BTX, Nß micro ATX Nß NLX Nß I/O interfaces Material Nß Sound Nß Video Nß USB 1.1 and 2.0 Nß Serial Nß IEEE 1394 / FireWire Nß Parallel Nß NIC Nß Modem Nß PS/2 Nß Memory slots Nß RIMM Nß DIMM Nß SODIMM CopyrightedNß SIMM Nß Processor sockets Nß Bus architecture 86498book.indb 1 7/22/09 5:37:17 AM Nß Bus slots Nß PCI Nß AGP Nß PCIe Nß AMR Nß CNR Nß PCMCIA Chipsets Nß BIOS / CMOS / Firmware Nß POST Nß CMOS battery Nß Riser card / daughterboard Nß [Additional subobjectives covered in chapter 2] Ûß1.4 Explain the purpose and characteristics of CPUs and their features Nß Identify CPU types Nß AMD Nß Intel Nß Hyper threading Nß Multi core Nß Dual core Nß Triple core Nß Quad core Nß Onchip cache Nß L1 Nß L2 Nß Speed (real vs. actual) Nß 32 bit vs. 64 bit Ûß1.5 Explain cooling methods and devices Nß Heat sinks Nß CPU and case fans 86498book.indb 2 7/22/09 5:37:18 AM Nß Liquid cooling systems Nß Thermal compound Ûß1.6 Compare and contrast memory types, characteristics and their purpose Nß Types Nß DRAM Nß SRAM Nß SDRAM Nß DDR / DDR2 / DDR3 Nß RAMBUS Nß Parity vs. Non-parity Nß ECC vs. non-ECC Nß Single sided vs. double sided Nß Single channel vs. -
Multiprocessing Contents
Multiprocessing Contents 1 Multiprocessing 1 1.1 Pre-history .............................................. 1 1.2 Key topics ............................................... 1 1.2.1 Processor symmetry ...................................... 1 1.2.2 Instruction and data streams ................................. 1 1.2.3 Processor coupling ...................................... 2 1.2.4 Multiprocessor Communication Architecture ......................... 2 1.3 Flynn’s taxonomy ........................................... 2 1.3.1 SISD multiprocessing ..................................... 2 1.3.2 SIMD multiprocessing .................................... 2 1.3.3 MISD multiprocessing .................................... 3 1.3.4 MIMD multiprocessing .................................... 3 1.4 See also ................................................ 3 1.5 References ............................................... 3 2 Computer multitasking 5 2.1 Multiprogramming .......................................... 5 2.2 Cooperative multitasking ....................................... 6 2.3 Preemptive multitasking ....................................... 6 2.4 Real time ............................................... 7 2.5 Multithreading ............................................ 7 2.6 Memory protection .......................................... 7 2.7 Memory swapping .......................................... 7 2.8 Programming ............................................. 7 2.9 See also ................................................ 8 2.10 References ............................................. -
5 Microprocessors
Color profile: Disabled Composite Default screen BaseTech / Mike Meyers’ CompTIA A+ Guide to Managing and Troubleshooting PCs / Mike Meyers / 380-8 / Chapter 5 5 Microprocessors “MEGAHERTZ: This is a really, really big hertz.” —DAVE BARRY In this chapter, you will learn or all practical purposes, the terms microprocessor and central processing how to Funit (CPU) mean the same thing: it’s that big chip inside your computer ■ Identify the core components of a that many people often describe as the brain of the system. You know that CPU CPU makers name their microprocessors in a fashion similar to the automobile ■ Describe the relationship of CPUs and memory industry: CPU names get a make and a model, such as Intel Core i7 or AMD ■ Explain the varieties of modern Phenom II X4. But what’s happening inside the CPU to make it able to do the CPUs amazing things asked of it every time you step up to the keyboard? ■ Install and upgrade CPUs 124 P:\010Comp\BaseTech\380-8\ch05.vp Friday, December 18, 2009 4:59:24 PM Color profile: Disabled Composite Default screen BaseTech / Mike Meyers’ CompTIA A+ Guide to Managing and Troubleshooting PCs / Mike Meyers / 380-8 / Chapter 5 Historical/Conceptual ■ CPU Core Components Although the computer might seem to act quite intelligently, comparing the CPU to a human brain hugely overstates its capabilities. A CPU functions more like a very powerful calculator than like a brain—but, oh, what a cal- culator! Today’s CPUs add, subtract, multiply, divide, and move billions of numbers per second. -
Lista Sockets.Xlsx
Data de Processadores Socket Número de pinos lançamento compatíveis Socket 0 168 1989 486 DX 486 DX 486 DX2 Socket 1 169 ND 486 SX 486 SX2 486 DX 486 DX2 486 SX Socket 2 238 ND 486 SX2 Pentium Overdrive 486 DX 486 DX2 486 DX4 486 SX Socket 3 237 ND 486 SX2 Pentium Overdrive 5x86 Socket 4 273 março de 1993 Pentium-60 e Pentium-66 Pentium-75 até o Pentium- Socket 5 320 março de 1994 120 486 DX 486 DX2 486 DX4 Socket 6 235 nunca lançado 486 SX 486 SX2 Pentium Overdrive 5x86 Socket 463 463 1994 Nx586 Pentium-75 até o Pentium- 200 Pentium MMX K5 Socket 7 321 junho de 1995 K6 6x86 6x86MX MII Slot 1 Pentium II SC242 Pentium III (Cartucho) 242 maio de 1997 Celeron SEPP (Cartucho) K6-2 Socket Super 7 321 maio de 1998 K6-III Celeron (Socket 370) Pentium III FC-PGA Socket 370 370 agosto de 1998 Cyrix III C3 Slot A 242 junho de 1999 Athlon (Cartucho) Socket 462 Athlon (Socket 462) Socket A Athlon XP 453 junho de 2000 Athlon MP Duron Sempron (Socket 462) Socket 423 423 novembro de 2000 Pentium 4 (Socket 423) PGA423 Socket 478 Pentium 4 (Socket 478) mPGA478B Celeron (Socket 478) 478 agosto de 2001 Celeron D (Socket 478) Pentium 4 Extreme Edition (Socket 478) Athlon 64 (Socket 754) Socket 754 754 setembro de 2003 Sempron (Socket 754) Socket 940 940 setembro de 2003 Athlon 64 FX (Socket 940) Athlon 64 (Socket 939) Athlon 64 FX (Socket 939) Socket 939 939 junho de 2004 Athlon 64 X2 (Socket 939) Sempron (Socket 939) LGA775 Pentium 4 (LGA775) Pentium 4 Extreme Edition Socket T (LGA775) Pentium D Pentium Extreme Edition Celeron D (LGA 775) 775 agosto de -
PCA-6009 Full-Sized PCA/ISA-Bus LGA775 Pentium® 4/Celeron® D
PCA-6009 Full-sized PC PCA-6009 Full-sized PCA/ISA-bus LGA775 with VGA/Gigabit Card Pentium® 4/Celeron® D Processor Card with VGA/Gigabit LAN/HISA (800 MHz FSB) Packing List Specifications Before you begin installing your card, please make Standard SBC Functions sure that the following materials have been shipped: • CPU: Intel LGA 775 Celeron D up to 3.06 GHz, Pentium 4 up to 3.4 GHz, FSB 533/800 MHz. • 1 PCA-6009 Pentium® 4/Celeron® D processor- • BIOS: Award 4 Mb Flash memory BIOS based single board computer • Chipset: Intel 915GV with ICH6 • 1 PCA-6009 Startup Manual • System Memory: Up to 2 GB; two 240-pin DIMM sock- ets. Supports dual channel DDRII 400/533 SDRAM. • 1 CD with driver utility and manual (in PDF format) • SATA/IDE Interface: Two on-board serial ATA connec- • 1 FDD cable p/n: 1700340640 tors with data transmission rate up to 150 MB/Sec and supporting Advanced Host controller interface (AHCI) • 1 Ultra ATA 66/100 HDD cables p/n: 1701400452 technology. One IDE hard disk drives or two enhanced LAN/HISA (800 MHz FSB) I/ISA-bus LGA775 Pentium • 2 Serial ATA HDD data cables p/n: 1700071000 IDE devices. Supports PIO mode 4 (16.67MB/s data transfer rate) and ATA 33/66/100 (33/66/100MB/s data • 2 Serial ATA HDD power cables p/n: 1703150102 transfer rate.) BIOS enabled/disabled. • 1 ATX 12V power converter p/n: 170304015K • FDD interface: Supports one FDD cable • Serial ports: Two serial RS-232 ports • 1 Printer (parallel) port & COM p/n: 1701260305 • Parallel port: One parallel port, supports SPP/EPP/ port cable kit ECP mode • -
AIMB-760 Socket LGA 775 Intel® Pentium® 4 / Celeron® D 800 Mhz
Industrial ATX Motherboard with Motherboard Industrial ATX AIMB-760 Socket LGA 775 Intel® Pentium® 4 / AIMB-760 Socket LGA 775 Intel Celeron® D 800 MHz FSB Industrial ATX Motherboard with PCI-E, DDR2 and Dual GbE Packing List Specifications Before you begin installing your card, please make Standard SBC Functions sure that the following materials have been shipped: • CPU: Intel LGA 775 Pentium 4® up to 3.8 GHz, Cele- ron® D up to 3.06 GHz, FSB 533/800 MHz • AIMB-760 Pentium® 4 / Celeron® D processor • BIOS: Award 4 Mb flash memory BIOS based industrial motherboard • Chipset: Intel 915GV with ICH6 • 1 AIMB-760 startup manual • System Memory: Up to 4 GB; four 240-pin DIMM sock- ets. Supports dual channel DDRII 400/533 SDRAM. • 1 CD with driver utility and manual Note: Due to the inherent limitations of PC architec- ture, the system may not fully detect 4 GB • 1 FDD cable p/n:1700340640 RAM when 4 GB RAM is installed. • 2 Ultra ATA 66/100 HDD cables p/n: 1701400452 • SATA/IDE Interface: Four on-board serial ATA connec- • 2 Serial ATA HDD data cable p/n: 1700071000 tors with a data transmission rate of up to 150 MB/s supporting Advanced Host Controller Interface (AHCI) • 2 Serial ATA HDD power cable p/n: 1703150102 technology. One IDE hard disk drive or two enhanced IDE devices. Supports PIO mode 4 (16.67 MB/s data • 1 ATX 12 V power converter p/n:170304015K transfer rate) and ATA 33/66/100 (33/66/100 MB/s data cable transfer rate) BIOS enabled/disabled. -
Intel® Core™2 Duo Processors E8400, E7400,E6400 and E4300
Product Brief Intel® Core™2 Duo Processors Embedded Computing Intel® Core™2 Duo Processors E8400, E7400, E6400 and E4300 for Embedded Computing Product Overview Arch State Arch State Thermal Co Thermal Intel® Core™2 Duo processors – members of Intel’s growing Co Thermal Execution Execution product line of multi-core processors based on Intel® Core™ Resources Resources microarchitecture – now feature 45nm process technology to nt nt ro ro L1 Caches L1 Caches l deliver more performance without using more energy. This new l process technology makes it possible to integrate two complete APIC APIC execution cores in one physical package, providing advancements Shared L2 Cache Power Mgmt Core in simultaneous computing for multi-threaded applications and Coordination Logic Coordination Logic multi-tasking environments. Bus Interface These processors meet the needs of a wide range of performance- intensive, low-power embedded applications in smaller form factors Intel® Core™2 Duo processor, based on Intel® Core™ microarchitecture, such as interactive clients (i.e., point-of-sale terminals and ATMs), includes two complete execution cores, shared L2 cache, and intel- gaming platforms, industrial control and automation, digital security ligent power management features. surveillance and medical imaging. While incorporating advanced processor technology, these processors remain software- Intel® Core™ Microarchitecture compatible with previous IA-32 processors. Intel Core microarchitecture provides enhanced energy-efficient 45nm Intel Core 2 Duo processors E8400∆ and E7400∆ provide a performance to help equipment manufacturers optimally balance giant leap forward on the road to multi-core and parallel computing. processing capabilities within power and space constraints. They utilize hafnium-infused Hi-k transistors, increasing processor performance by doubling the transistor density while improving • Intel® Wide Dynamic Execution executes four instructions per efficiency and speed relative to the previous generation. -
Intel's Core 2 Family
Intel’s Core 2 family - TOCK lines II Nehalem to Haswell Dezső Sima Vers. 3.11 August 2018 Contents • 1. Introduction • 2. The Core 2 line • 3. The Nehalem line • 4. The Sandy Bridge line • 5. The Haswell line • 6. The Skylake line • 7. The Kaby Lake line • 8. The Kaby Lake Refresh line • 9. The Coffee Lake line • 10. The Cannon Lake line 3. The Nehalem line 3.1 Introduction to the 1. generation Nehalem line • (Bloomfield) • 3.2 Major innovations of the 1. gen. Nehalem line 3.3 Major innovations of the 2. gen. Nehalem line • (Lynnfield) 3.1 Introduction to the 1. generation Nehalem line (Bloomfield) 3.1 Introduction to the 1. generation Nehalem line (Bloomfield) (1) 3.1 Introduction to the 1. generation Nehalem line (Bloomfield) Developed at Hillsboro, Oregon, at the site where the Pentium 4 was designed. Experiences with HT Nehalem became a multithreaded design. The design effort took about five years and required thousands of engineers (Ronak Singhal, lead architect of Nehalem) [37]. The 1. gen. Nehalem line targets DP servers, yet its first implementation appeared in the desktop segment (Core i7-9xx (Bloomfield)) 4C in 11/2008 1. gen. 2. gen. 3. gen. 4. gen. 5. gen. West- Core 2 Penryn Nehalem Sandy Ivy Haswell Broad- mere Bridge Bridge well New New New New New New New New Microarch. Process Microarchi. Microarch. Process Microarch. Process Process 45 nm 65 nm 45 nm 32 nm 32 nm 22 nm 22 nm 14 nm TOCK TICK TOCK TICK TOCK TICK TOCK TICK (2006) (2007) (2008) (2010) (2011) (2012) (2013) (2014) Figure : Intel’s Tick-Tock development model (Based on [1]) * 3.1 Introduction to the 1. -
User's Manual Socket LGA775 Pentium® 4 Intel® I915g Chipset
User’s Manual 2801560 Socket LGA775 Pentium® 4 Intel® i915G Chipset Industrial Motherboard Acknowledgments Award is a registered trademark of Award Software International, Inc. PS/2 is a trademark of International Business Machines Corporation. Intel and Pentium 4 are registered trademarks of Intel Corporation. Microsoft Windows is a registered trademark of Microsoft Corporation. Winbond is a registered trademark of Winbond Electronics Corporation. All other product names or trademarks are properties of their respective owners. ii 2801560 User’s Manual Table of Contents Introduction ...................................................... 1 Checklist .......................................................................... 1 Product Description .......................................................... 2 Specifications ................................................................... 3 Board Dimensions............................................................. 4 Installations ...................................................... 5 Installing the CPU ............................................................ 6 ATX Power Installation .................................................... 7 Installing the Memory ....................................................... 7 Setting the Jumpers........................................................... 8 Connectors on 2801560 .................................................... 13 Watchdog Timer Configuration....................................... 25 BIOS Setup ..................................................... -
Intel® Server Board SE7505VB2
Intel® Server Board SE7505VB2 Technical Product Specification Intel part number C32194-002 Revision 1.2 April 2004 Enterprise Platforms and Services Marketing Revision History Intel® Server Board SE7505VB2 Revision History Date Revision Number Modifications January 2003 1.0 Initial Release Added memory cooling duct information, added section on BIOS event March 2003 1.1 log, incorporated Technology Leadership terminology, and corrected miscellaneous minor technical details. April 2004 1.2 New graphics for Mechanical Changes. ii Revision 1.2 Intel part number C32194-002 Intel® Server Board SE7505VB2 Disclaimers Disclaimers Information in this document is provided in connection with Intel® products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel's Terms and Conditions of Sale for such products, Intel assumes no liability whatsoever, and Intel disclaims any express or implied warranty, relating to sale and/or use of Intel products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright or other intellectual property right. Intel products are not intended for use in medical, life saving, or life sustaining applications. Intel may make changes to specifications and product descriptions at any time, without notice. Designers must not rely on the absence or characteristics of any features or instructions marked "reserved" or "undefined." Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them. The SE7505VB2 server system may contain design defects or errors known as errata that may cause the product to deviate from published specifications. -
Socket E Slot Per
Socket e Slot per CPU Socket e Slot per CPU Socket 1 Socket 2 Socket 3 Socket 4 Socket 5 Socket 6 Socket 7 e Super Socket 7 Socket 8 Slot 1 (SC242) Slot 2 (SC330) Socket 370 (PGA-370) Slot A Socket A (Socket 462) Socket 423 Socket 478 Socket 479 Socket 775 (LGA775) Socket 603 Socket 604 PAC418 PAC611 Socket 754 Socket 939 Socket 940 Socket AM2 (Socket M2) Socket 771 (LGA771) Socket F (Socket 1207) Socket S1 A partire dai processori 486, Intel progettò e introdusse i socket per CPU che, oltre a poter ospitare diversi modelli di processori, ne consentiva anche una rapida e facile sostituzione/aggiornamento. Il nuovo socket viene definito ZIF (Zero Insertion Force ) in quanto l'inserimento della CPU non richiede alcuna forza contrariamente ai socket LIF ( Low Insertion Force ) i quali, oltre a richiedere una piccola pressione per l'inserimento del chip, richiedono anche appositi tool per la sua rimozione. Il modello di socket ZIF installato sulla motherboard è, in genere, indicato sul socket stesso. Tipi diversi di socket accettano famiglie diverse di processori. Se si conosce il tipo di zoccolo montato sulla scheda madre è possibile sapere, grosso modo, che tipo di processori può ospitare. Il condizionale è d'obbligo in quanto per sapere con precisione che tipi di processore può montare una scheda madre non basta sapere solo il socket ma bisogna tenere conto anche di altri fattori come le tensioni, il FSB, le CPU supportate dal BIOS ecc. Nel caso ci si stia apprestando ad aggiornare la CPU è meglio, dunque, attenersi alle informazioni sulla compatibilità fornite dal produttore della scheda madre.