TM Burn-in & Test Socket Workshop

March 6-9, 2005 Hilton Phoenix East / Mesa Hotel Mesa, Arizona ARCHIVE Burn-in & Test Socket Workshop TM COPYRIGHT NOTICE

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Keynote Address Tuesday 3/08/05 8:00PM “Processor Packaging Trends and the Impact on Test” Eric Tosaya Director Packaging Engineering ProcessorProcessor PackagingPackaging TrendsTrends andand thethe ImpactImpact onon TestTest

J. Kwon, S. Singh & E. Tosaya*

* presenter

Mar 2005 BiTS Keynote 1 ProcessorProcessor RoadmapsRoadmaps

ƒ The roadmaps were created using information collected from various sources: ƒ Tom’s Hardware: www4.tomshardware.com ƒ X-bit Labs: www.xbitlabs.com ƒ PC Watch: //pc.watch.impress.co.jp ƒ : www.Intel.com ƒ SUN Microsystems: www.sun.com ƒ Transmeta: www.transmeta.com ƒ nVIDIA: www.nvidia.com ƒ ATI: www.ati.com ƒ Intel, Sun Microsystems, Transmeta, nVidia & ATI and their corresponding product names are all trademarked and/or copy righted by the respective companies.

Mar 2005 BITS 2005 Keynote 2 AMD Desktop: K7 T-Bred/Barton XP ~76 W

Palomino Athlon ~72 W

Thunderbird ~72 W 50mm / OPGA Socket 462 / 2.54 Pitch

50mm / OPGA Socket 462 / 2.54 Pitch 50mm / CPGA Socket 462 / 2.54 Pitch 2000 2001 2002 Mar 2005 BITS 2005 Keynote 3 AMD Desktop: K8 New Castle ~89 W

ClawHammer ~89 W

SledgeHammer 40mm / uOPGA ~89 W / 1.27 Pitch

40mm / uOPGA / 1.27 Pitch

40mm / uCPGA / 1.27 Pitch 2003 2004 Mar 2005 BITS 2005 Keynote 4 AMD Mobile K8 Hammer ~ 35 W

K7 T-Bred/Barton ~ 25 W

T-Bred/Barton ~ 35 W 40mm / uOPGA Socket 754 / 1.27 Pitch Palomino ~ 35 W 33mm / uOPGA Socket 563 / 1.27 Pitch 50mm / OPGA Socket 462 / 2.54 Pitch 50mm / CPGA Socket 462 / 2.54 Pitch 20012002 2003 2004 Mar 2005 BITS 2005 Keynote 5 AMD Server K8 ~ 89 W

K7 ~ 66 W

~ 66 W 40mm / uCPGA Socket 940 / 1.27 Pitch

50mm / OPGA Socket 462 / 2.54 Pitch

50mm / CPGA Socket 462 / 2.54 Pitch

2000 2001 2003 Mar 2005 BITS 2005 Keynote 6 Intel Desktop Prescott ~ 115W P4 Northwood /Prescott ~ 103W P3 Willamette ~ 71W 37.5mm / LGA Socket 775 Tualatin 1.09 X 1.17 Pitch ~ 33W 35mm / uPGA / 1.27 Pitch

50mm / PGA / 2.54 Pitch

50mm / PGA / 2.54 Pitch

2001 2002 2004 Mar 2005 BITS 2005 Keynote 7 Intel Mobile P4 ~ 35 W Centrino ~ 25W 37.5mm / LGA Socket 775 , 1.09X1.17 Pitch P3 35mm / uOPGA Socket 478 ~ 7 W 1.27 Pitch

35mm uOPGA / BGA 478 1.27 Pitch 31mmx27mm BGA 495 / Micro PGA 495 1.27 Pitch 2001 2003 2004 2005 Mar 2005 BITS 2005 Keynote 8 Intel

Gallatin ~ 80 WNocona ~ 103 W

53.34mm Interposer 42.5mmX42.5mm 35mm x 35mm OBGA uOPGA / 1.27 Pitch / 1.27 Pitch

2002 2004 Mar 2005 BITS 2005 Keynote 9 Intel

Itanium 1 Itanium 2

PCB with OBGA PCB with OBGA Socket : PAC 418 Socket PAC 611

~ 130 W ~ 130 W

2001 2002 Mar 2005 BITS 2005 Keynote 10 Ultra SPARC : SUN

II IIe IIi

35mm X 35mm 50mm X 50mm 37.5mm X 37.5mm Ceramic 787 LGA Ceramic 370 PGA Ceramic 587 LGA 1.0mm Pitch 2.54mm Pitch 1.27mm Pitch

Mar 2005 BITS 2005 Keynote 11 Ultra SPARC : SUN

IIIi III IV

45mmX 45mm 45mm X 45mm 45mm X 45mm Ceramic 959 uPGA Ceramic 1368 LGA Ceramic 1368 LGA 1.27 Pitch 1.12mm Pitch 1.12mm Pitch ~ 52W ~ 50W ~ 108W

Mar 2005 BITS 2005 Keynote 12 Transmeta Crusoe

5.7 ~ 7.3 W 5.1 ~ 9 W 5 ~ 9.5 W

474-pin 474-pin 399-contact Ceramic BGA Ceramic BGA FC-OBGA 32.5mm x 25mm 32.5mm x 25mm 21mm x 21mm

Mar 2005 BITS 2005 Keynote 13 Transmeta Efficeon

783-pin 592-pin 783-pin FC-OBGA FC-OBGA FC-OBGA 29mm x 29mm 21mm X 21mm 29mm x 29mm 1.0mm Pitch 0.8mm Pitch 1.0mm Pitch

Mar 2005 BITS 2005 Keynote 14 GPU : nVidia

FC OBGA with Stiffener

Mar 2005 BITS 2005 Keynote 15 GPU : ATI

w/Stiffener 42.5mm X 42.5mm 1265 Pin FC OBGA

Mar 2005 BITS 2005 Keynote 16 WhatWhat doesdoes thethe crystalcrystal ballball say?say? ƒƒ PlatformPlatform infrastructureinfrastructure setssets thethe electrical,electrical, thermalthermal && mechanicalmechanical requirementrequirement ofof processorprocessor design:design: ƒ data rates (Gbps) ƒ power (100W - 130W) ƒ 2nd level interconnect (sli)

ƒƒ TomorrowTomorrow’’ss platformplatform definitiondefinition isis drivingdriving multicoremulticore processorsprocessors (MCP),(MCP), newnew signalingsignaling technologytechnology forfor 5Gbps5Gbps andand beyond,beyond, corecore levellevel hothot spotspot coolingcooling technology,technology, improvedimproved socketsocket && PCBPCB technologytechnology toto supportsupport betterbetter slisli..

Mar 2005 BITS 2005 Keynote 17 WhatWhat doesdoes thethe crystalcrystal ballball say?say? ƒƒ InIn 2004,2004, >> 100M100M X86X86 singlesingle corecore processorsprocessors (SCP)(SCP) werewere shipped,shipped, thethe vastvast majoritymajority withwith organicorganic substratesubstrate technology.technology. ƒ uOPGA: can we drive the pitch down w/ acceptable cost? ƒ OLGA: will LGA sockets reach the cost curve of PGA ZIF w/ the same manufacturability & reliability? ƒ BGA is the mainstream for handheld mobile

Mar 2005 BITS 2005 Keynote 18 WhatWhat doesdoes thethe crystalcrystal ballball say?say? ƒƒ TypicalTypical 1st1st levellevel interconnectinterconnect ((flifli)) forfor highhigh volumevolume manufacturedmanufactured ((hvmhvm)) 130nm130nm –– 65nm65nm productproduct isis soldersolder alloyalloy basedbased w/w/ aa pitchpitch ofof 150um150um –– 200um.200um. ƒ Low-K dielectric w/ short stack-ups are pervasive

ƒƒ FutureFuture 45nm45nm productproduct willwill useuse aa PbPb--freefree flifli.. ƒ Low-K dielectric w/ taller stack-ups are the goal. ƒ Organic: New underfills and/or creative substrate constructions ƒ Ceramic (LTCC): $$$ = some niche applications? ƒ fli pitch will be driven by SCP mobile (low pwr) architecture

Mar 2005 BITS 2005 Keynote 19 WhatWhat doesdoes thethe crystalcrystal ballball say?say?

ƒ fli will drive new wafer sort technology ƒ What kind of fli will it be…bumped, bumpless, post, optical or some combination? ƒ How long will physical contact last? ƒ Probe pitch and density limits ƒ Data rate limits

ƒ Platform economics drives the use of sockets today. At 10Gbps and beyond will this model breakdown due to performance limitations? ƒ What happens to ATE? ƒ What happens to Burn-in ƒ What happens to SLT?

Mar 2005 BITS 2005 Keynote 20 WhatWhat doesdoes thethe crystalcrystal ballball say?say?

ATE B-I ATE SLT

ƒƒ ATE/Handlers:ATE/Handlers: 2.5Gbps2.5Gbps toto >> 5Gbps5Gbps Mark ƒ Still Cu traces at 5Gps but what about > 5Gbps? 5Gbps? QA ƒ MCP test times go up….parallel test for < $/unit. ƒ offline multi bin sorting

ƒ Moving from die level to hot spot/core cooling Boxstock ƒ Integration of marking and 2D readers into handlers or offline binners

Mar 2005 BITS 2005 Keynote 21 WhatWhat doesdoes thethe crystalcrystal ballball say?say?

ATE B-I ATE SLT

ƒƒ Burn-In : SCP die level cooling to MCP Burn-In : SCP die level cooling to MCP Mark perper corecore hothot spotspot cooling?cooling? ƒ 100% BI to sampling mode BI ƒ Add more capability at BI, i.e. accelerated BI to QA reduce time and $/unit. ƒ Higher Voltage ƒ Higher Frequency Boxstock

Mar 2005 BITS 2005 Keynote 22 WhatWhat doesdoes thethe crystalcrystal ballball say?say?

ATE B-I ATE SLT

ƒƒ SLT: Need better thermal capability / SLT: Need better thermal capability / Mark capacitycapacity atat SLTSLT forfor functionalfunctional testingtesting ƒ 100% SLT to sampling SLT ƒ Applicable to SCP and MCP QA ƒ From die level to hot spot/core cooling

Boxstock

Mar 2005 BITS 2005 Keynote 23 WhatWhat doesdoes thethe crystalcrystal ballball say?say?

ATE B-I ATE SLT

ƒƒ Sockets Sockets Mark ƒ Driven by sli (package, socket & PCB) ƒ Signal integrity… > 5Gbps ƒ Loading force on substrate/lid or bare die QA ƒ Driven by pin/pad count and area ƒ Need to control warpage factors (pkg, sckt & PCB) ƒ Minimize surface marring/scratching Boxstock ƒ Tighter sli pitch impacts pin integrity and bending

Mar 2005 BITS 2005 Keynote 24 SUMMARYSUMMARY ƒƒ PlatformPlatform infrastructureinfrastructure limitslimits raterate ofof changechange andand definesdefines processorprocessor boundariesboundaries ƒƒ MainstreamMainstream substratessubstrates technologytechnology willwill continuecontinue toto bebe organicorganic uPGAuPGA,, LGALGA && BGABGA ƒƒ HowHow farfar beyondbeyond 5Gbps5Gbps willwill CuCu interconnectinterconnect go?go? ƒ Sockets may not be far behind as a bottleneck ƒƒ MCPsMCPs willwill drivedrive developmentdevelopment ofof activeactive hothot spotspot coolingcooling forfor BIBI && SLTSLT ƒƒ ATEATE movingmoving toto parallelparallel processorprocessor testingtesting ƒ Offline binning more cost effective

Mar 2005 BITS 2005 Keynote 25