Sample Picture: Sony ©2017© 2017 SCOPE of the REPORT

From Technologies to Market

MicroLED Displays: Hype and reality, hopes and challenges

Large video displays

Smartwatches and TV wearables Sony

The report LG provides an Apple The report does not Smartphones extensive review Virtual reality cover non-display of µLED display applications of technologies and µLED: AC-LEDs, LiFi, potential Optogenetics, applications as Samsung well as the Oculus Lithography, competitive Laptops and lighting… convertibles landscape and key Augmented/Mixed MicroLED TV prototype (Sony, CES 2012) players. Reality

HP Microsoft Tablets Automotive HUD

BMW Acer

• Understand the Current Status of the µLED Display Technologies: • What are they? What are the key benefits? How do they differ from other display technologies? What are the cost drivers? • What are the remaining roadblocks? How challenging are they? • Detailed analysis of key technological nodes: epitaxy, die structure and manufacturing, front plane structure and display designs, Deep color conversion, backplanes, massively parallele pick and place and continuous assembly processes, hybridization, defect understanding management, light extraction and beam shaping. of the • Which applications could µLED display address and when? technology, current status • Detailed analysis of major display applications: TV, smartphones, wearables, augmented and virtual reality (AR/VR/MR), laptops and prospects, and tablets, monitors, large LED video displays... roadblocks • How disruptive for incumbent technologies: LCD, OLED, LCOS… and key • MicroLED display application roadmap, forecast and SWOT analysis players. • Competitive Landscape and Supply chain • Identify key players in technology development and manufacturing.Who owns the IP? • Potential impact on the LED supply chain: epimakers, MOCVD reactor and substrate suppliers. • Potential impact on the display chain: LCD and OLED panel makers. • Scenario for a µLED display supply chain.

Market forecast methodology

Market segmentation methodology

Technology analysis methodology Information collection

• Scope Of the Report p8 • What’s Happening In the Short Term? • Objective Of the Report p9 • Introduction p52 • LED Efficiency • Who should Be Interested In this Report? p10 • Display Resolutions • Companies cited in the report p11 • OLED and LCD Display structure Overview • Display Trends • Acronyms p12 • LEDs In displays • Executive Summary p13 • MicroLED Definition and History • What is a MicroLED displays? • MicroLED Displays Technology Evolution • Status • What is a MicroLED displays? • Remaining Roadblocks • MicroLED Display Assembly • MicroLED Attributes vs Application Requirement • MicroLED Chip Manufacturing • SWOT Analysis • Benefits • Major Technology Bricks • Comparisons With LCD and OLED • Assembly Technologies • MicroLED Display Manufacturing Challenges • Display Structure and Backplane • MicroLED Displays Frontplane & Pixel Structures p68 • MicroLED efficiency • Backplane and Pixel Bank Structure • MicroLED Dimensions • MicroLED Display Structure: Monochrome • Epitaxy • MicroLED Display Structure: Color • Chip Manufacturing • Pixel Fill Factor and Added Display Functionalities • Color Conversion • Pixel density and Pixel Pitch • Cost Drivers • Subassembly Microsystems • Defect Management • Tiled Arrays • Major Players • LED Efficiency • Supply chain • Brightness • Possible Winner and Losers. • Pixel Size vs. Efficiency • MicroLED Application Roadmap • MicroLED Driving Regime • 2017-2025 MicroLED Adoption Forecast

• Ultra High Brightness MicroDisplays • Chip Manufacturing and Singulation p115 • MicroLED Large video displays (front End Level 1) • Current confinement Trenches • Chip singulation: • MicroLED efficiency • Bonding and Etching: Apple-Luxvue • MicroLED Dimensions • Anchor and Breakable Tethers: X-Celeprint • Chip Manufacturing • MicroLED Displays Backplanes p91 • Impact on Supply chain • Passive Matrix Driving • Active Matrix Driving • Transfer And Assembly Technologies p125 • LCD vs Emissive display Driving Requirement • Pick and Place vs Monolithic Arrays • Emissive Display Driving • Massively Parallel Pick and Place and Printing Processes p127 • Thin Film Transistor Backplanes • Overview • TFT Substrates Example: Gen 10 • Transfer Sequences • TFT Channel Material • Transfer Array Vs. Display Pixel Pitch • Trends • Throughput and cost Drivers • Channel Materials For MicroLED Displays • Edge Effects • Pixel Density and Backplane • Pick and Place Processes • Impact on MicroLED Driving Technology • Die Stabilization and Release. • Impact on MicroLED Assembly Technology • Die Selection • Discrete Micro-Controllers • Pick Up Methods • MicroLED Epitaxy p106 • Luxvue: Electrostatic MEMS (Front End Level 0) • Luxvue Compliant Pick Up Heads • Overview • Luxvue Transfer Process Sequence • Epitaxy Defects and Dead Pixels • Luxvue Alternative Process • Wavelength homogeneity and Consistency • X-Celeprint Elastomere Transfer Printing • Brightness and Voltage Variations • Other Process Flows: Die Encapsulation • Impact on Supply chain • Other Process Flows: Stretchable Film • Semi-continuous Process

• Wet Printing, Electrophotographic • Broadband phosphors • Fluidic Assembly • Narrowband Phosphors • Key IP Holders and Conclusion • Examples • Phosphors Particle size • Large Monolithic MicroLED Arrays p160 • Quantum Dots • The challenge for High Pixel Density • Benefits and challenges • Full Array Level Microdisplay Manufacturing. • Performance • Hybridization • Implementations in Traditional Displays • MicroLED Array Hybridization on CMOS: LETI • Challenges for MicroLED Displays • Monolithic Integration of LTPS TFT: Lumiode • QD vs Phosphors: Summary • Monolithic Integration of Metal Oxide TFT: eMagin • Quantum Wells converters. • Monolithic Integration of GaN TFT: OSRAM and Nth Degree • Micro-wire MicroLED Arrays: Aledia • Defect Management p201 • 3D Integration: Ostendo • Introduction • Conclusion • Bad Pixels • Emitter Redundancy • Light Extraction and Viewing Angles p175 • Example of Repair Strategies • Introduction • Defect Management Strategies • Die-Level Beam Shaping and Extraction • Conclusion • Illustration: InfiniLED • Array-Level Beam Shaping • Applications and Markets for MicroLED Displays p212 • External Micro Optics • Overview Of Key Hypothesis • Viewing Angle and Power consumption • Overview of Epiwafer Cost per Application • Overview of Epiwafer And Transfer Cost per Application • Color Conversion p183 • Discussion • Color Gamut • MicroLED Attributes vs Application Requirement • Comparison of major standards • MicroLED Application Roadmap • Major Color Gamut in the CIE 1931 and 1976 spaces • MicroLED SWOT Per Application • Color Conversion • 2017-2025 MicroLED Adoption Forecast • Wavelength Converter Deposition

• Virtual Reality p224 • MicroLED for Smartwatches • Introduction: VR and AR/MR • 2017-2025 Forecast • The Reality-to-Virtual-Reality Continuum. • MOCVD Requirement • VR Displays: FOV, Resolution and Pixel Density • Transfer Tools Requirements • VR Displays: Refresh Rate • TVs p262 • VR Displays: Brightness • Introduction • Computing Power and Bandwidth • The UHD alliance • Foveated rendering • MicroLED vs OLED and QD-LCD • Trade Offs for the Design of a VR Headset • MicroLED TV Panel costs • Current status • Additional Challenges For MicroLED TVs • Microdisplays • MicroLED Volume forecast and MOCVD Requirements • MicroLED displays for VR: Transfer-Based (Large displays) • Transfer Tools Requirements • Screen Door Effect • Alternative Transfer and Assembly Approaches • MicroLED Microdisplays • MicroLED displays for VR: conclusion • Smart Phones p273 • Smartphone display Requirement • Augmented and Mixed Reality p244 • Is 4K required? • Display Requirements • MicroLED for Cell Phones: Epiwafer Cost • Display Types: • MicroLED for Cell Phones: Transfer Cost • MicroLED Displays for AR and MR • No Pixel Redundancy • Comparison of AR Displays Technologies • Pixel Redundancy • 2017 – 2027 AR/MR Market Forecast • Status and roadblocks • 2020-2027 MicroLED Scenario for AR/MR. • 2017-2025 Volume forecast and MOCVD Requirements • Head Up displays • Transfer Tools Requirements • 2020-2025 MicroLED Head Up displays Forecast • Tablets p284 • Smartwatches p253 • MicroLED Tablet Panel costs • Introduction • 2017-2025 Volume forecast and MOCVD Requirements • Forecasting the Smartwatch market • Transfer Tools Requirements

• Laptops and Convertibles p289 • Supply Chain p317 • Tablet, Laptops and convertible: Overview • Overview • MicroLED in Laptops • Summary of Key Hypothesis • MicroLED Laptop Panel costs • Substrate and MOCVD Requirements • 2017 -2025 Volume forecast and MOCVD Requirements • Discussion: Wafer Supply • Transfer Tools Requirements • Epitaxy and Wafer Processing • Transfer Tools • Desktop Monitors p296 • Impact on Supply chain • Desktop Computer Monitors • Supply Chain Scenario • 2017-2025 Volume forecast and MOCVD Requirements • Discussion • Transfer Tools Requirements • Large video displays p301 • Company presentation p333 • Overview • 2017-2025 MicroLED Large Video Displays • Others p304 • LCD Backlights • Competitive Landscape p308 • Research Activity • Leading Patent Holders • Key Players and Technology Focus • Significant Industry Events • The Apple Ecosystem • Taiwan Ecosystem • Discussion

• AR:Augmented Reality • MEMS: Micro Electro-Mechanical Systems • CapEx: Capital Expenditure • MOCVD: Metal-Oxide ChemicalVapor Deposition • CMOS: Complementary Metal Oxide Semiconductor • MR: Mixed Reality • EQE: External Quantum Efficiency • ODM: Original Design Manufacturer • FET: Field Effect Transistor • OEE: Optical Extraction Efficiency • FHD: Full High Definition (1920 x 1080) • OEM: Original Equipment Manufacturer • FOV: Field OfView • OLED: Organic Light emitting Diode • FWHM: Full Width at Half Maximum • PDMS: Polydimethylsiloxane (polymer material) • HD: High Definition • PECVD: Plasma-Enhanced ChemicalVapor Deposition • HMD: Head Mounted Display • P&P: Pick and Place • HUD: Head Up Display • PPD: Pixel Per Degree • IC: Integrated Circuit • PPI: Pixel Per Inch • IQE: Internal Quantum Efficiency • PPM: Parts Per Million • LCD: Liquid Crystal Display • QD: Quantum Dots • LCOS: Liquid Crystal On Silicon • QHD: Quad High Definition (2560 x 1400 to 3440 x 1440) • LED: Light Emitting Diode • TFT:Thin Film Transi • LTPS: Low Temperature Polysilicon

• LED supply chain: sapphire makers, MOCVD • Display Makers and supply chain suppliers, epi-houses. • Hype versus reality: what is the status of µLED displays? What can we expect in the near • Understand the µLED display opportunity future? • What does it entail for the LED supply? • Are they a threat to my LCD and OLED • What are the technical challenges? investments? • How can my company participate in this emerging • Which display applications and markets can opportunity? µLED displays address? A detailed roadmap. • Who should we partner with? • Find the right partner: detailed mapping of the µLED ecosystem and supply chain • R&D Organizations and Universities • OSAT and foundries • Understand the market potential of your • Are µLED a new opportunity for my technologies for this emerging market company? • Identify the best candidates for collaboration and • Venture capital, financial and strategic technology transfer. investors. • OEMs / ODMs • Hype versus reality. Understand the • What are the potential benefits of µLED displays? technology and the real potential. • Are they a threat or an opportunity for my • How is the supply chain shaping up? products? • Identify the key players and potential investment targets. • When will they be ready • Could µLED hurt my existing investments? • Should I get involved in the supply chain.

Aledia (FR), Allos Semiconductor (DE), Apple (US), AUO (TW), BOE (CN), CEA-LETI (FR), CIOMP (CN), Columbia University (US), Cooledge (CA), Cree (US), CSOT (CN), eMagin (US), Epistar (TW), Epson (JP), Facebook (US), Foxconn (TW), Fraunhofer Institute (DE), Glo (SE), GlobalFoundries (US), Goertek (CN), Hiphoton (TW), HKUST (HK), HTC (TW), Ignis (CA), InfiniLED (UK), Intel (US), ITRI (TW), Kansas State University (US), Kopin (US), Lumiode (US), Luxvue (US), Metavision (US), Microsoft (US), Mikro-Mesa (TW), mLED (UK), Nichia (JP), Nth Degree (US), Oculus (US), Osterhout Design Group (US), Osram (DE), Ostendo (US), Playnitride (TW), PSI Co (KR), Rohinni (US), Saitama University (JP), Samsung (KR), Sanan (CN), Semprius (US), Sharp (JP), Sony (JP), Strathclyde University (UK), SunYat-Sen University (TW),Texas Tech (US),TSMC (TW), Tyndall National Institute (IE), University of Illinois (US),VerLASE (US),VueReal (CA),Vuzix (US), X-Celeprint (IE).

Eric Virey is a Senior Market and Technology Analyst at Yole Développement. Eric is a daily contributor to the development of LED, OLED, and Displays activities at Yole, with a large collection of market and technology reports as well as multiple custom consulting projects: business strategy, identification of investments or acquisition targets, due diligences (buy/sell side), market and technology analysis, cost modelling, technology scouting, etc. Thanks to its deep knowledge of the LED/OLED and displays related industries, Eric has spoken in more than 30 industry conferences worldwide over the last 5 years. He has been interviewed and quoted by leading media over the world. Previously Eric has held various R&D, engineering, manufacturing and business development positions with Fortune 500 Company Saint-Gobain in France and the United States. Dr Eric Virey holds a Ph-D in Optoelectronics from the National Polytechnic Institute of GrenobleEric is also Contact: [email protected] author / co-author of multiple reports (examples below) and contributed to various custom projects.

• LED Packaging • Status of the LED Industry • LED Front End Manufacturing • Sapphire Market & Applications • III-V Epitaxy • Phosphors and Quantum Dots • Bulk GaN • OrganicTFTs • GaN on Silicon • …

• Traditional SMD or CSP packaged LEDs are commonly used as the illumination source for the backlighting of LCD panels. • LEDs are also commonly used in large direct emissive video billboards used in stadium, advertising and video facades. In those devices, discrete packaged LED containing red, green and blue chips form the individual pixels with pitches typically ranging from 1 to 40 mm depending on display size and resolution. • As of Q1-2017, there is no other format of commercial displays using LEDs as a direct emissive element to constitute individual pixels or sub-pixels. The reasons for this limitation are multiple and include cost and Packaged LEDs manufacturability. are commonly • Nevertheless, the idea of µLED displays with high resolution and sub millimetric pixel pitch is almost as old as the used in large video displays and invention and commercialization of LEDs themselves. Over the last 3-4 years it has generated a lot of excitement and LCD backlight. development as well as investment and M&A activity. MicroLEDs could be at the center of a new display revolution

Packaged LED

LED Video display Illustration: www.absen.com

Now Soon) Mid term Longer term (>5 years) (2017) (2-3 years) (3-5 year) or out of reach?

Small pitch (<2 mm) large video displays. • Brings significant performance improvement (contrast) and potential Detailed roadmap in the cost reduction (eliminates LED package) report • Large die OK (30 µm) but low transfer efficiency. • Available from Sony in 2017:

• 140+ players have filed patents related to microLED.The 500+ microLED inventions are held by a lot of different patent applicants. • Some players have filed their own patents (XXX, XXX, XXX, XXX, XXX, XXX, XXX, XXX, XXX, XXX, XXX…), while other ones have acquired IPs through patent licensing agreements (XXX, XXX, XXX) or M&A (Apple/LuxVue, Oculus/InfiniLED). • Many R&D Labs are present in the microLED patent landscape (University of Illinois, ITRI, CEA-LETI, CIOMP, Fraunhofer, Sejong University …).

* A patent family is a set of patents filed in multiple countries by a Industrials common inventor(s) to protect a single invention. R&D Labs

Testing and Display µLED Transfer and Color Light Extraction Epitaxy Hybridization repair / Defect architecture & structure interconnect Conversion & shaping Management drivers

Details in the report

• The art of making µLED displays consists in processing a bulk LED substrate into an array of micro-LEDs which are poised for pick up and transfer to a receiving substrate for integration into heterogeneously integrated system: the display (which integrates, LEDs, transistors, optics etc…). • The micro-LEDs can be picked up and transferred individually, in groups, or as the entire array of 100,000’s of µLEDs:

Massively Parallel Transfer (“Pick and Place”) Arrays Monolithic Integration

Individual µLED dies or small chips comprising small amounts of Large chips comprising large quantities of µLED emitters MicroLED chips µLED emitters (<10) are singulated and individually picked up, (>10,000’s to millions) are hybridized onto a backplane can be transferred, positioned and assembled to a backplane containing (typically Si CMOS). Individual pixels are not physically singulated and the pixel driving circuitry (typically TFT on glass or flexible singulated. The pitch of the donor array matches the pitch of transferred substrate). The pitch on the display is typically lower than that the display. individually or of the donor wafer. µLED array as large monolithic arrays. µLED chips

Backplane Hybridization Transfer Tool Epiwafer or carrier with pre-singulated die Backplane

Display Backplane Epiwafer

• The front plane structure Light Pixel bank including the interconnects Transparent electrode and the pixel banks can be Passivation built directly upon the Bank layer Bottom electrode backplane. Frontplane Electrode to pixel • The bank layer thickness Planarization Layer Passivation (Also known as Interlayer Dielectric: ILD) The TFT and angle can be used to Drain Channel (semiconductor) Source backplane can adjust the display viewing Gate GateInsulator Insulator (Dielectric) Other circuitry (not detailed): switch Gate transistors, compensation transistors, be essentially angle. µLED dies are Backplane (metal) capacitors, identical to that positioned into the pixel Backplane substrate (Glass, metal, plastic) of an OLED bank by the transfer tool display all the and connected by solder Cross section of a microLED display subpixel way through the reflow or other processes. planarization layer. • More than 1 µLED of the same color can be placed in each bank if redundancy is Sub Subpixel required to mitigate risks of pixel bank dead/malfunctioning pixels (see “Defect Management” section of this report) Simplified top view of the pixel bank

Display substrate Display substrate Transfer array Transfer array

2) 4)

Display substrate Display substrate Donor wafer Donor wafer

Die Stabilization and Die Selection: Die Pick Up: Die Placing release: Provide enough force to How to provide enough force The pitch of the µLEDs on the Provide enough force to to hold the die onto the donor wafer is usually smaller overcome the bonding overcome the bonding donor wafer but allow its than that on the display. Some force of the die to the force of the die to the release to the pick up heads die need to be picked up donor wafer to allow pick transfer array and drop it while others remain on the up. donor wafer off on the receiving Dozens of substrate transfer technologies have Release been proposed. The major Stabilization technology Donor wafer Donor wafer Donor wafer Display backplane options identified by screening more than 450 are shown here

• More than 20 companies have patented massively parallel transfer Main patent applicants involved in massively processes for µLEDs. Many more processes could be inferred by parallel pick and place technology combining the different technology bricks described in this section. (according to the number of their patent families*) • Most are probably just concepts that haven’t yet reached the stage of prototypes. None has yet been fully validated in volume production to the exception of the PDMS stamp process developed by the team of Prof. Rogers at the University of Illinois and used by startup Semprius for photovoltaic Mass transfer is a applications. X-Celeprint is developing and commercializing the cornerstone of technology for µLEDs and other micro-devices. µLED display Source: technologies. • Beside X-Celeprint, the most advanced company in the field of Luxvue and X- massively parallel transfer of µLEDs is likely to be Apple via its Celeprint have acquisition of Luxvue in 2014. We believe their the technology to solid IP portfolio be more complex (MEMS vs polymer stamp) but deliver higher on the topic. throughputs and be capable of handling smaller size of µLEDs. Both companies however remains secretive about actual performance of their technology. • Another issue not developed in this report is that of the transfer equipment which must ensure very high positioning accuracy at both the pick up and drop off steps. Multiple patents describing transfer tools have been filed by XXX, XXX, XXX etc. * A patent family is a set of patents filed in multiple countries by a common inventor(s) to protect a single invention. ©2017 | www.yole.fr | MicroLED Displays 24 DEFECT MANAGEMENT STRATEGIES

Illustrations: reducing die size to a level where redundancy becomes cost effective, i.e. when decrease in repair cost offsets epiwafer cost increase. The graph shows our simulation for various applications of the epiwafer cost thresholds and corresponding die size at which redundancy becomes cost effective

For displays with high pixel counts cost epi Added $XX and pixel density, $XX pixel repair Die size dominates the Die size transfer cost. Pixel redundancy becomes efficient if die size can be

reduced. Added epi cost epi Added $XX $XX

Die size Die size

QHD 4K Smartphone 9” Tablet 13” Laptop FHD 4K 4K 8K Smartwatch Smartphone (Xperia Z5 (iPAD Pro) (MacBook Pro) Monitor Monitor 55" TV 85" TV (Galaxy S7 ) Premium)

Resolution 312 x 390 1440 x 2560 2160 x 3840 1536 x 2048 2560 x 1600 1920 x 1080 3840 x 2160 3840 x 2160 7680 x 4320

PPI 325 577 801 264 277 102 185 80 104

# of transfer XX XX XX XX XX XX XX XX XX cycles [2] # of repairs at 100 ppm 37 1,106 2,489 944 1,229 623 2,489 2,489 9,954 defects Total Transfer XX XX XX XX XX XX XX XX XX cost

Total Epiwafer XX XX XX XX XX XX XX XX XX cost

Total XX XX XX XX XX XX XX XX XX

Total with XX XX XX XX XX XX XX XX XX redundancy [3]

[1] cost for transfer and epiwafer only. Doesn’t include: backplane, color conversion, optics, testing … [2]: assumes XxX cm2 transfer array [3]: assumes Xx subpixel redundancy: doubles epiwafer cost and the number of transfer cycles but put repair cycles at zero.

Sony

• Assuming displays realized with XX x XX µm size µLEDs, about XXx multiwafer (Veeco’s Epik 700 type) or XXX single-wafer reactors would be needed to supply Apple needs. If the µLED size can be reduced to XX x XX µm, the numbers drop to XX and XX respectively. • Note however that those numbers assume a production run rate averaged throughout the year. Higher numbers (+20~30%) would be needed to absorb the higher run-rates typically experienced in the few the months preceding a product launch.

XX x XX µm MicroLED Scenario with 2x redundancy 2019 2020 2021 2022 2023 2024 2025 Smartwatch # of 6" epiwafers market would # of MOCVD put only (12 x 6") moderate strain # of 8" Epiwafers on the LED # of MOCVD supply chain (1 x 8") XX x XX µm MicroLED Scenario with 2x redundancy 2019 2020 2021 2022 2023 2024 2025 # of 6" epiwafers # of MOCVD (12 x 6") # of 8" Epiwafers # of MOCVD (1 x 8")

Note: indicates total cumulated # of MOCVD tools

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MARKET AND TECHNOLOGY REPORTS by Yole Développement

o MEMS & SENSORS o MEDTECH − Fingerprint Sensor Applications and Technologies - Consumer Market Focus 2017 − Status of the Microfluidics Industry 2017 − MEMS Microphones, Speakers and Audio Solutions 2017 − Solid State Medical Imaging 2017 − Status of the MEMS Industry 2017 − Sensors for HomeCare 2017 − MEMS & Sensors for Automotive 2017 − Sensors for Medical Robotics 2017 − High End Inertial Sensors for Defense and Industrial Applications 2017 − Organs-on-a Chip 2017 − Sensor Modules for Smart Building 2017 − Sensing and Display for AR/VR/MR 2017 (Vol 1) o ADVANCED PACKAGING − MEMS Packaging 2017 − Advanced Substrates Overview 2017 − Magnetic Sensors Market and Technologies 2017** − Status of the Advanced Packaging Industry 2017 − Microspectrometers Markets and Applications 2017** − Fan Out Packaging: Market & Technology Trends 2017 − 3D Business Update: Market & Technology Trends 2017 o RF DEVICES AND TECHNOLOGIES − Advanced QFN: Market & Technology Trends 2017** − RF Components and Modules for Cellphones 2017 − Inspection and Metrology for Advanced Packaging Platform 2017** − Advanced RF SiP for Cellphones 2017 − Advanced Packaging for Memories 2017 − 5G and Beyond (Vol 1): Impact on RF Industry, from Infrastructure to Terminals 2017 − Embedded Die Packaging: Technologies and Markets Trends 2017 − 5G and Beyond (Vol 2): RF Materials Platform, from Infrastructure to Terminals 2017 − RF Technologies for Automotive Applications 2017 o MANUFACTURING − GaN and Si LDMOS Market and Technology Trends for RF Power 2017 − Glass Substrate Manufacturing 2017 − Equipment & Materials for Fan Out Technology 2017 o IMAGING & OPTOELECTRONICS − Equipment & Materials for 3D T(X)V Technology 2017 − 3D Imaging & Sensing 2017 − Emerging Non Volatile Memories 2017 − Status of the CMOS Image Sensor Industry 2017 − Camera Module for Consumer and Automotive Applications 2017 − Uncooled Infrared Imaging Technology & Market Trends 2017 ** To be confirmed − Active Imaging and Lidars 2017 (vol 1)

o POWER ELECTRONICS o LED − Status of Power Electronics Industry 2017 − UV LEDs 2017 - Technology, Manufacturing and Application Trends − Power Mosfets Market and Technology Trends 2017 − Agricultural Lighting 2017 - Technology, Industry and Market Trends − IGBT Market and Technology Trends 2017 − Automotive Lighting 2017 - Technology, Industry and Market Trends − Power Packaging Market and Technology Trends 2017 − Active Imaging and Lidar 2017 (Vol 2) - IR Lighting** − Power SiC 2017: Materials, Devices, and Applications − LED Lighting Module 2017 - Technology, Industry and Market Trends − Power GaN 2017: Materials, Devices, and Applications − IR LEDs 2017 - Technology, Manufacturing and Application Trends − Materials Market Opportunities for Cellphone Thermal Management (Battery − Phosphors & Quantum Dots 2017 - LED Downconverters for Lighting & Displays Cooling, Fast Charging, Data Processing, Battery Cooling, etc.) 2017 − CSP LED Module 2017 − Gate Driver Market and Technology Trends in Power Electronics 2017 − LED Packaging 2017 − Power Management ICs Market Quarterly Update 2017 − Power Electronics for Electrical Aircraft, Rail and Buses 2017 − Thermal Management for LED and Power 2017 PATENT ANALYSIS by Knowmade − 3D Monolithic Memory: Patent Landscape Analysis o BATTERY AND ENERGY MANAGEMENT − Microfluidic Diagnostic: Patent Landscape Analysis − Status of Battery Industry for Stationary, Automotive and Consumer Applications 2017 − GaN Technology: Top-100 IP profiles** − Uncooled Infrared Imaging: Patent Landscape Analysis** o COMPOUND SEMICONDUCTORS − MEMS Microphone: Patent Landscape Analysis** − Power SiC 2017: Materials, Devices, and Applications − MEMS Microphone: Knowles' Patent Portfolio Analysis** − Power GaN 2017: Materials, Devices, and Applications − MicroLEDs: Patent Landscape Analysis** − GaN and Si LDMOS Market and Technology Trends for RF Power 2017 − Microbolometer: Patents used in products** − Bulk GaN Technology Status and Market Expectations (Power, LED, Lasers) 2017 − Micropumps: Patent Landscape Analysis** − Flexible batteries: Patent Landscape Analysis** o DISPLAYS − Microdisplays and MicroLEDs 2017 − Display for Augmented Reality, Virtual Reality and Mixed Reality 2017 TEARDOWN & REVERSE COSTING by System Plus Consulting − QD for Display Applications 2017 More than 60 teardowns and reverse costing analysis and cost simulation tools to be published in − Phosphors & Quantum Dots 2017 - LED Downconverters for Lighting & Displays 2017. − Emerging Display Technologies 2017** ** To be confirmed

MARKET AND TECHNOLOGY REPORTS by Yole Développement o COMPOUND SEMICONDUCTORS − Power GaN 2016: Epitaxy and Devices, Applications and Technology Trends o MEMS & SENSORS − GaN RF Devices Market: Applications, Players, Technology and substrates 2016 − Gas Sensors Technology and Market 2016 − Sapphire Applications & Market 2016: from LED to Consumer Electronics − Status of the MEMs Industry 2016 − Power SiC 2016: Materials, Devices, Modules, and Applications − Sensors for Cellphones and Tablets 2016 − Market and Technology Trends of Inkjet Printheads 2016 o LED − Sensors for Biometry and Recognition 2016 − UV LED Technology, Manufacturing and Applications Trends 2016 − Silicon Photonics 2016 − OLED for Lighting 2016 – Technology, Industry and Market Trends − Automotive Lighting: Technology, Industry and Market Trends 2016 o IMAGING & OPTOELECTRONICS − Thermal Management Technology and Market Perspectives in Power Electronics and − Status of the CMOS Image Sensor Industry 2016 LEDs 2017 − Uncooled Infrared Imaging Technology & Market Trends 2016 − Organic Thin Film Transistor 2016: Flexible Displays and Other Applications − Imaging Technologies for Automotive 2016 − Sapphire Applications & Market 2016: from LED to Consumer Electronics − Sensors for Drones & Robots: Market Opportunities and Technology Evolution 2016 − LED Packaging 2017: Market, Technology and Industry Landscape

o MEDTECH o POWER ELECTRONICS − BioMEMS 2016 − Power Electronics for EV/HEV 2016: Market, Innovations and Trends − Point of Care Testing 2016: Application of Microfluidic Technologies − Status of Power Electronics Industry 2016 − Passive Components Technologies and Market Trends for Power Electronics 2016 o ADVANCED PACKAGING − Power SiC 2016: Materials, Devices, Modules, and Applications − Embedded Die Packaging: Technology and Market Trends 2017 − Power GaN 2016: Epitaxy and Devices, Applications, and Technology Trends − 2.5D & 3D IC TSV Interconnect for Advanced Packaging: Business Update 2016 − Inverter Technologies Trends & Market Expectations 2016 − Fan-Out: Technologies and Market Trends 2016 − Opportunities for Power Electronics in Renewable Electricity Generation 2016 − Fan-In Packaging: Business update 2016 − Thermal Management Technology and Market Perspectives in Power Electronics and LEDs 2017 − Status and Prospects for the Advanced Packaging Industry in China 2016 − GaN RF Devices Market: Applications, Players, Technology and substrates 2016 o MANUFACTURING o BATTERY AND ENERGY MANAGEMENT − Thin Wafer Processing and Dicing Equipment Market 2016 − Beyond Li-ion Batteries: Present and Future Li-ion Technology Challengers 2016 − Emerging Non Volatile Memories 2016 − Stationary Storage and Automotive Li-ion Battery Packs 2016 − Opportunities for Power Electronics in Renewable Electricity Generation 2016 ©2017 | www.yole.fr | MicroLED Displays 37 CONTACT INFORMATION

o CONSULTING AND SPECIFIC ANALYSIS • North America: Steve LaFerriere, Director of Northern America Business Development Email: [email protected] – +1 31 06 008 267 • Japan & Rest of Asia: Takashi Onozawa, General Manager, Asia Business Development Email: [email protected] - +81 3 4405 9204 • Greater China: Mavis Wang, Director of Greater China Business Development Email: [email protected] - +886 979 336 809 • RoW: Jean-Christophe Eloy, CEO & President, Yole Développement Email [email protected] - +33 4 72 83 01 80 o REPORT BUSINESS • North America: Steve LaFerriere, Director of Northern America Business Development Email: [email protected] – +1 31 06 008 267 • Europe: Lizzie Levenez, EMEA Business Development Manager Email: [email protected] - +49 15 123 544 182 • Rest of Asia: Takashi Onozawa, General Manager, Asia Business Development Follow us on Email: [email protected] - +81 3 4405 9204 • Japan & Asia: Miho Othake, Account Manager Email: [email protected] - +81 3 4405 9204 • Greater China: Mavis Wang, Director of Greater China Business Development Email: [email protected] - +886 979 336 809 o FINANCIAL SERVICES • Jean-Christophe Eloy, CEO & President Email: [email protected] - +33 4 72 83 01 80 o GENERAL • Email: [email protected] - +33 4 72 83 01 80