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Microled Displays 2018 From Technologies to Market MicroLED Displays 2018 Sample Courtesy of Sony © 2018 © 2017 OBJECTIVE OF THE REPORT Everything You Always Wanted to Know About µLED Displays! • Understand the Current Status of the µLED Display Technologies: • What are microLED? What are the key benefits? How do they differ from other display technologies? What are the cost drivers? • What are the remaining roadblocks? How challenging are they? • Detailed analysis of key technological nodes: epitaxy, die structure and manufacturing, front plane structure and display designs, Deep color conversion, backplanes, massively parallel pick and place and continuous assembly processes, hybridization, defect understanding management, light extraction and beam shaping. of the technology, • Which applications could µLED display address and when? current status • Detailed analysis of major display applications: TV, smartphones, wearables, augmented and virtual reality (AR/VR/MR), laptops and prospects, and tablets, monitors, large LED video displays... roadblocks • What are the cost targets for major applications? How do they impact technology, design and process choices? and key players. • How disruptive for incumbent technologies: LCD, OLED, LCOS… • MicroLED display application roadmap, forecast and SWOT analysis • Competitive Landscape and Supply chain • Identify key players in technology development and manufacturing.Who owns the IP? • Potential impact on the LED supply chain: epimakers, MOCVD reactor and substrate suppliers. • Potential impact on the display chain: LCD and OLED panel makers. • Scenario for a µLED display supply chain. MicroLED Displays | Sample | 2 Biography & contact EricVirey - Principal Analyst,Technology & Market, Sapphire & Display Dr. Eric Virey serves as a Senior Market and Technology Analyst at Yole Développement (Yole), within the Photonic & Sensing & Display division. Eric is a daily contributor to the development of LED, OLED, and Displays activities, with a large collection of market and technology reports as well as multiple custom consulting projects. Thanks to its deep technical knowledge and industrial expertise, Eric has spoken in more than 30 industry conferences worldwide over the last 5 years. He has been interviewed and quoted by leading media over the world. Previously Eric has held various R&D, engineering, manufacturing and business development positions with Fortune 500 Company Saint-Gobain in France and the United States. Dr. Eric Virey holds a Ph-D in Optoelectronics from the National Polytechnic Institute of Grenoble. MicroLED Displays | Sample | 3 COMPANIES CITED IN THE REPORT Aixtron (DE), Aledia (FR), Allos Semiconductor (DE), AMEC (CN), Apple (US), AUO (TW), BOE (CN), CEA-LETI (FR), CIOMP (CN), Columbia University (US), Cooledge (CA), Cree (US), CSOT (CN), eLux (US), eMagin (US), Epistar (TW), Epson (JP), Facebook (US), Foxconn (TW), Fraunhofer Institute (DE), glō (SE), GlobalFoundries (US), Goertek (CN), Google (US), Hiphoton (TW), HKUST (HK), HTC (TW), Ignis (CA), InfiniLED (UK), Intel (US), ITRI (TW), Jay Bird Display (HK), Kansas State University (US), KIMM (KR), Kookmin U. (KR), Kopin (US), LG (KR), LightWave Photonics Inc (US), Lumens (KR), Lumiode (US), LuxVue (US), Metavision (US), Microsoft (US), Mikro Mesa (TW), mLED (UK), MIT (US), NAMI (HK), Nanosys (US), NCTU (TW), Nichia (JP), Nth Degree (US), NuFlare (JP), Oculus (US), Optovate (UK), Osterhout Design Group (US), Osram (DE), Ostendo (US), PlayNitride (TW), PSI Co (KR), QMAT (US), Rohinni (US), Saitama University (JP), Samsung (KR), Sanan (CN), SelfArray (US), Semprius (US), Smart Equipment Technology (FR), Seoul Semiconductor (KR), Sharp (JP), Sony (JP), Strathclyde University (UK), SUSTech (CN), Sun Yat-sen University (TW), Sxaymiq Technologies (US), Tesoro (US), Texas Tech (US), Tianma (CN), TSMC (TW), Tyndall National Institute (IE), Uniqarta (US), U. Of Hong Kong (HK), U. of Illinois (US), Veeco (US), VerLASE (US), V-Technology (JP), VueReal (CA), Vuzix (US), X- Celeprint (IE)…and more. MicroLED Displays | Sample | 4 TABLE OF CONTENTS • Executive summary p10 • Cycle time and thickness • Blue shift • Introduction to microLED displays p51 • Wafer flatness • Definition and history • GaN-based red chips • What is a microLED display? • Conclusions and impact on supply chain • Comparisons with LCD and OLED • Assembly • Chip manufacturing and singulation (FE Level 1) p96 • Display structure • MicroLED singulation p97 • SWOT analysis • Impact on cost related to the epiwafer • MicroLED display manufacturing yields p63 • Illustrations • Overview • MicroLED efficiency p104 • Individual die testing. • LED and microLED efficiency • KGD mapping and individual transfer • Development thrust areas • Transfer fields and interposers • Current confinement structures • Defect management strategies • Status • Yield roadmap • MicroLED chip manufacturing p112 • Redundancy • Example of process flow – Apple 6 masks • Conclusions • Lithography • MicroLED epitaxy (FE Level 0) p79 • Fab types comparison: infrastructure & equipment • Wafer size • MicroLED in CMOS fabs • Wavelength homogeneity • Transfer and assembly technologies p124 • Epitaxy defects MicroLED Displays | Sample | 5 TABLE OF CONTENTS • Overview p125 • Example: Sharp/ELUX • Major types and key attributes of transfer processes • Summary p154 • Challenges • Intellectual property landscape • Pick and place processes p129 • Selectivity • Sequence and challenges • Major transfer processes: most mature • Transfer sequences • Transfer processes: others • Transfer array Vs. display pixel pitch • Conclusion • Throughput and cost drivers • Transfer and assembly equipment p165 • Direct transfer vs. interposer • Introduction • Interposer and yields • Traditional single chip tools • Other use of interposers. • Assembly environment • Example (X-CeLeprint) • Specific challenge for mass transfer • Continuous/ semi-continuous assembly p141 • Bulk microLED arrays p171 • Overview • Full array level microdisplay manufacturing. • Laser-based sequential transfer • Hybridization & bonding process • QMAT-TESORO • Wafer level bonding • Uniqarta • Monolithic integration of LTPS TFT: lumiode • GLO • 3D integration: Ostendo • Optovate • Yields and costs • Self assembly p150 • Color generation in bulk arrays • Fluidic self assembly MicroLED Displays | Sample | 6 TABLE OF CONTENTS • Pixel repair p183 • Analog driving: microLED driving regime • Emitter redundancy • MicroLED-specific challenges • Example of repair strategies • Illustration: 75” 4K TV, QHD smartphone • Defect management strategies • Digital driving: introduction • Digital driving: benefits & challenges • Light extraction and beam shaping p189 • Hybrid driving • Optical crosstalk • Analog Vs digital: summary • Emission pattern, viewing angle and power consumption • TFT versus discrete micro IC. • Emission pattern and color mixing • Cost zspects • Die-level light management • Cost reduction path • Array-level beam shaping • Conclusions • Color conversion p204 • Economics of microLED – cost down paths p240 • Overview • Baseline hypothesis and sensitivity • Phosphors • Quantum dots • Television p247 • Flux requirements • Cost target and price elasticity • Patterning and deposition • 75” TV panel assembly strategies • Yield impact • Backplanes and pixel driving p214 • Very large panels • Introduction • Benefit of sequential transfer • Channel materials for microLED displays • Interposers • Mobility vs display specifications • Die size • Stability and signal distortion • Cost-down path • Pixel density MicroLED Displays | Sample | 7 TABLE OF CONTENTS • Smartphones p265 • Smartphones p294 • Cost target • Who can afford a smartphone? • Illustration: 6” QHD phone panel • Smartphone panel volume forecast • Key outputs • Mobile phones: display for differentiation • Die size optimization • Foldable smartphones • Interposers • MicroLED adoption and volume forecast • Applications and markets for microLED displays p277 • TVs p301 • MicroLED attributes vs application requirement • The “Better Pixel” • Application roadmap • Resolution • SWOT per application • TV panel forecast • Key hypothesis for equipment forecast • 8K adoption • 2017-2027 microLED adoption forecast • MicroLED adoption and panel volume forecast • AR, MR andVR p284 • Others: tablets, laptops, monitors p310 • The reality-to-virtual-reality continuum. • Overview • Market volume headset forecasts for VR and aR • Tablets • MicroLED adoption and volume forecast • Laptop and convertibles • Head up displays • Desktop monitors • Smartwatches p290 • Wafer and equipment forecast p315 • Smartwatch volume forecast • Epiwafer • MicroLED Adoption and volume forecast • MOCVD • Transfer equipment MicroLED Displays | Sample | 8 TABLE OF CONTENTS • Competitive landscape p322 • Time evolution of patent publications • Leading patent applicants • What happened In the last 18 months • Time evolution of patent applications per company • Breakdown by company headquarters • Positioning of established panel makers • Breakdown by company type • Supply chain p332 • Overview • Capex aspects • Supply chain requirement • Front END (LED Manufacturing) • Back end: backplane, assembly and module. • Supply chain scenarios • Intellectual property • Conclusion MicroLED Displays | Sample | 9 SCOPE OF THE REPORT TV Contrary to the 2017 edition, this report does not Smartwatches and cover applications in large wearables LG LED videowalls: those will be Smartphones discussed extensively in our This report upcoming report on provides an Apple miniLED applications
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