História Mikroprocesora
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Intel® Core™ I7 Processor Family for the LGA-2011 Socket
Intel® Core™ i7 Processor Family for the LGA-2011 Socket Datasheet, Volume 1 Supporting Desktop Intel® Core™ i7-3960X and i7-3970X Extreme Edition Processor for the LGA-2011 Socket Supporting Desktop Intel® Core™ i7-39xxK and i7-38xx Processor Series for the LGA-2011 Socket This is volume 1 of 2. February 2014 Reference Number: 326196-003 INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL'S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. Intel products are not intended for use in medical, life saving, life sustaining, critical control or safety systems, or in nuclear facility applications. Intel may make changes to specifications and product descriptions at any time, without notice. Designers must not rely on the absence or characteristics of any features or instructions marked “reserved” or “undefined.” Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them. The information here is subject to change without notice. Do not finalize a design with this information. The products described in this document may contain design defects or errors known as errata which may cause the product to deviate from published specifications. -
Multiprocessing Contents
Multiprocessing Contents 1 Multiprocessing 1 1.1 Pre-history .............................................. 1 1.2 Key topics ............................................... 1 1.2.1 Processor symmetry ...................................... 1 1.2.2 Instruction and data streams ................................. 1 1.2.3 Processor coupling ...................................... 2 1.2.4 Multiprocessor Communication Architecture ......................... 2 1.3 Flynn’s taxonomy ........................................... 2 1.3.1 SISD multiprocessing ..................................... 2 1.3.2 SIMD multiprocessing .................................... 2 1.3.3 MISD multiprocessing .................................... 3 1.3.4 MIMD multiprocessing .................................... 3 1.4 See also ................................................ 3 1.5 References ............................................... 3 2 Computer multitasking 5 2.1 Multiprogramming .......................................... 5 2.2 Cooperative multitasking ....................................... 6 2.3 Preemptive multitasking ....................................... 6 2.4 Real time ............................................... 7 2.5 Multithreading ............................................ 7 2.6 Memory protection .......................................... 7 2.7 Memory swapping .......................................... 7 2.8 Programming ............................................. 7 2.9 See also ................................................ 8 2.10 References ............................................. -
ESC4000 G3/G3S Series 2U Rackmount Server User Guide E9711 First Edition October 2014
ESC4000 G3/G3S Series 2U Rackmount Server User Guide E9711 First Edition October 2014 Copyright © 2014 ASUSTeK COMPUTER INC. All Rights Reserved. No part of this manual, including the products and software described in it, may be reproduced, transmitted, transcribed, stored in a retrieval system, or translated into any language in any form or by any means, except documentation kept by the purchaser for backup purposes, without the express written permission of ASUSTeK COMPUTER INC. (“ASUS”). ASUS provides this manual “as is” without warranty of any kind, either express or implied, including but not limited to the implied warranties or conditions of merchantability or fitness for a particular purpose. In no event shall ASUS, its directors, officers, employees, or agents be liable for any indirect, special, incidental, or consequential damages (including damages for loss of profits, loss of business, loss of use or data, interruption of business and the like), even if ASUS has been advised of the possibility of such damages arising from any defect or error in this manual or product. Specifications and information contained in this manual ae furnished for informational use only, and are subject to change at any time without notice, and should not be construed as a commitment by ASUS. ASUS assumes no responsibility or liability for any errors or inaccuracies that may appear in this manual, including the products and software described in it. Product warranty or service will not be extended if: (1) the product is repaired, modified or altered, unless such repair, modification of alteration is authorized in writing by ASUS; or (2) the serial number of the product is defaced or missing. -
Risk Factors
Risk Factors •Today’s presentations contain forward-looking statements. All statements made that are not historical facts are subject to a number of risks and uncertainties, and actual results may differ materially. Please refer to our most recent Earnings Release and our most recent Form 10-Q or 10-K filing for more information on the risk factors that could cause actual results to differ. •If we use any non-GAAP financial measures during the presentations, you will find on our website, intc.com, the required reconciliation to the most directly comparable GAAP financial measure. Rev. 4/19/11 Today’s News The world’s first 3-D Tri-Gate transistors on a production technology New 22nm transistors have an unprecedented combination of power savings and performance gains. These benefits will enable new innovations across a broad range of devices from the smallest handheld devices to powerful cloud-based servers. The transition to 3-D transistors continues the pace of technology advancement, fueling Moore’s Law for years to come. The world’s first demonstration of a 22nm microprocessor -- code-named Ivy Bridge -- that will be the first high-volume chip to use 3-D Tri-Gate transistors. Energy-Efficient Performance Built on Moore’s Law 1 65nm 45nm 32nm 22nm 1x 0.1x > 50% 0.01x reduction Lower Active Power Active Lower Lower Transistor Leakage Transistor Lower Active Power per Transistor (normalized) Transistor per Power Active 0.001x Constant Performance 0.1 65nm 45nm 32nm 22nm Higher Transistor Performance (Switching Speed) Planar Planar Planar Tri-Gate Source: Intel 22 nm Tri-Gate transistors increase the benefit from a new technology generation Source: Intel Transistor Innovations Enable Technology Cadence 2003 2005 2007 2009 2011 90 nm 65 nm 45 nm 32 nm 22 nm Invented 2nd Gen. -
Lista Sockets.Xlsx
Data de Processadores Socket Número de pinos lançamento compatíveis Socket 0 168 1989 486 DX 486 DX 486 DX2 Socket 1 169 ND 486 SX 486 SX2 486 DX 486 DX2 486 SX Socket 2 238 ND 486 SX2 Pentium Overdrive 486 DX 486 DX2 486 DX4 486 SX Socket 3 237 ND 486 SX2 Pentium Overdrive 5x86 Socket 4 273 março de 1993 Pentium-60 e Pentium-66 Pentium-75 até o Pentium- Socket 5 320 março de 1994 120 486 DX 486 DX2 486 DX4 Socket 6 235 nunca lançado 486 SX 486 SX2 Pentium Overdrive 5x86 Socket 463 463 1994 Nx586 Pentium-75 até o Pentium- 200 Pentium MMX K5 Socket 7 321 junho de 1995 K6 6x86 6x86MX MII Slot 1 Pentium II SC242 Pentium III (Cartucho) 242 maio de 1997 Celeron SEPP (Cartucho) K6-2 Socket Super 7 321 maio de 1998 K6-III Celeron (Socket 370) Pentium III FC-PGA Socket 370 370 agosto de 1998 Cyrix III C3 Slot A 242 junho de 1999 Athlon (Cartucho) Socket 462 Athlon (Socket 462) Socket A Athlon XP 453 junho de 2000 Athlon MP Duron Sempron (Socket 462) Socket 423 423 novembro de 2000 Pentium 4 (Socket 423) PGA423 Socket 478 Pentium 4 (Socket 478) mPGA478B Celeron (Socket 478) 478 agosto de 2001 Celeron D (Socket 478) Pentium 4 Extreme Edition (Socket 478) Athlon 64 (Socket 754) Socket 754 754 setembro de 2003 Sempron (Socket 754) Socket 940 940 setembro de 2003 Athlon 64 FX (Socket 940) Athlon 64 (Socket 939) Athlon 64 FX (Socket 939) Socket 939 939 junho de 2004 Athlon 64 X2 (Socket 939) Sempron (Socket 939) LGA775 Pentium 4 (LGA775) Pentium 4 Extreme Edition Socket T (LGA775) Pentium D Pentium Extreme Edition Celeron D (LGA 775) 775 agosto de -
Intel® Core™ I7 Processor Families for the LGA2011-0 Socket
® Intel Core™ i7 Processor Families for the LGA2011-0 Socket Thermal Mechanical Specification and Design Guide — Supporting Desktop Intel® Core™ i7-3970X and i7-3960X Extreme Edition Processor Series for the LGA2011-0 Socket — Supporting Intel® Core™ i7-3000K Processor Series and Intel® Core™ i7-3000 Processor Series for the LGA2011-0 Socket — Supporting Desktop Intel® Core™ i7-4960X Extreme Edition Processor Series for the LGA2011 Socket — Supporting Desktop Intel® Core™ i7-49xx and i7-48xx Processor Series for the LGA2011 Socket November 2013 326199-004 INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL'S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. Intel products are not intended for use in medical, life saving, or life sustaining applications. Intel may make changes to specifications and product descriptions at any time, without notice. Designers must not rely on the absence or characteristics of any features or instructions marked “reserved” or “undefined.” Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them. The processors and LGA2011-0 socket may contain design defects or errors known as errata which may cause the product to deviate from published specifications. -
IMB-170-V Mini-ITX Motherboard Spotlight Features
Industrial Motherboards IMB-170-V Mini-ITX Motherboard Spotlight Features ‧Socket G2 (rPGA988B) for Intel Core i7/i5/i3/Celeron (Ivy Bridge and Sandy Bridge) ‧Intel® QM77 Chipset ‧Integrated Intel® HD Graphics Built-in Visuals ‧Supports DDR3 1600MHz, 2 x SO-DIMM, up to 16GB system memory ‧2 x COM (RS-232/422/485), 4 x COM (RS-232) ‧D-Sub, 1 x HDMI, 1 x DisplayPort, 1 x Dual Channel 24-bit LVDS ‧4 x USB 3.0, 8 x USB 2.0, 2 x SATA3, 2 x SATA2 ‧1 x PCIe 2.0 x16, 1 x mini-PCIe ‧Gigabit LAN : 1 x Intel 82579LM, 1 x Intel 82583V Specifications Processor System Rear I/O Dimension Mini-ITX (6.7-in x 6.7-in) VGA 1 Socket G2 (rPGA988B) for Intel Core i7/i5/i3/Celeron CPU HDMI 1 (Sandy Bridge and Ivy Bridge) DVI-I/D 0 Core Number (By CPU, Max 4) Display Port 1 Max Speed (By CPU) Ethernet 2 L3 Cache (By CPU) USB 6 (4 x USB 2.0 compliant, 2 x USB 3.0 compliant) Chipset QM77 Audio 3 (Mic-in, Line-out, Line-in) BIOS UEFI Serial 2 (RS-232/422/485) Expansion Slot PS/2 1 (Combo) PCI 0 Internal Connector Mini-PCIe 1 (Full size) USB 6 (4 x USB 2.0 compliant, 2 x USB 3.0 compliant) mSATA 0 LVDS/Inverter 1/1 PCIe 1 (IVY Bridge: Gen3; Sandy Bridge: Gen2) VGA 0 CFast Card Socket 0 Serial 4 (RS-232) Memory SATA 2 x SATA2 (3.0Gb/s) + 2 x SATA3 (6.0Gb/s), Support Technology Dual Channel DDR3 1066/1333/1600 MHz SDRAM RAID 0/1/5/10 m-SATA Max. -
Embedded Board Product Selection Guide
Embedded Board Product Selection Guide ECX SBCs Pico-ITX SBCs Mini-ITX Motherboards ATX Motherboards COM Express Modules Qseven Modules Embedded Boards | Contents Table of Contents About Quanmax .............................................................. 02 Overview Product Overview (Embedded Boards) .......................... 04 Qseven™ Module Product Matrix .................................... 06 KEEX-200T .................................................................................. 07 COM Express® Mini Module Product Matrix .................... 08 Computer-on-Modules COMM-E380 Series ................................................................. 09 COM Express® Compact Module Product Matrix ............ 10 COMC-E380 Series .................................................................. 11 Pico-ITX SBC Product Matrix .................................... 12 PITX-MX60 Series ..................................................................... 13 ECX SBC Intel® CPU Support Matrix ............................... 14 ECX SBC Product Matrix .................................................. 16 KEEX-5100 Series ..................................................................... 18 KEEX-8100 Series ..................................................................... 19 Single Board Computers KEEX-7101 Series ..................................................................... 20 KEEX-6100 Series ..................................................................... 21 KEEX-6150 Series .................................................................... -
Intel® Xeon® Processor E5 V3 Family Thermal Guide
Intel ® Xeon® Processor E5-1600 / 2600 / 4600 v3 Product Families Thermal Mechanical Specification and Design Guide October 2015 Order No.: 330786-003US You may not use or facilitate the use of this document in connection with any infringement or other legal analysis concerning Intel products described herein. You agree to grant Intel a non-exclusive, royalty-free license to any patent claim thereafter drafted which includes subject matter disclosed herein. No license (express or implied, by estoppel or otherwise) to any intellectual property rights is granted by this document. All information provided here is subject to change without notice. Contact your Intel representative to obtain the latest Intel product specifications and roadmaps. The products described may contain design defects or errors known as errata which may cause the product to deviate from published specifications. Current characterized errata are available on request. Copies of documents which have an order number and are referenced in this document may be obtained by calling 1-800-548-4725 or visit http:// www.intel.com/design/literature.htm. Basis, BlueMoon, BunnyPeople, Celeron, Centrino, Cilk, Flexpipe, Intel, the Intel logo, the Intel Anti-Theft technology logo, Intel AppUp, the Intel AppUp logo, Intel Atom, Intel CoFluent, Intel Core, Intel Inside, the Intel Inside logo, Intel Insider, Intel NetMerge, Intel NetStructure, Intel RealSense, Intel SingleDriver, Intel SpeedStep, Intel vPro, Intel Xeon Phi, Intel XScale, InTru, the InTru logo, the InTru Inside logo, InTru soundmark, Iris, Itanium, Kno, Look Inside., the Look Inside. logo, MCS, MMX, Pentium, picoArray, Picochip, picoXcell, Puma, Quark, SMARTi, smartSignaling, Sound Mark, Stay With It, the Engineering Stay With It logo, The Creators Project, The Journey Inside, Thunderbolt, the Thunderbolt logo, Transcede, Transrf, Ultrabook, VTune, Xeon, X-GOLD and XMM are trademarks of Intel Corporation in the U.S. -
NF9G-QM77 Intel Mobile Core I3/I5/I7 Mini-ITX Features2gigabit LAN / Daughter Board Gen2
NF9G-QM77 Intel Mobile Core i3/i5/i7 Mini-ITX Features2Gigabit LAN / Daughter Board Gen2 1. Intel QM77 Express Chipset 2. Supports 3rd Generation Intel Core i3, i5, i7 Mobile Processors, Socket G2, Ivy Bridge and Sandy Bridge 3. Integrated Intel HD Graphics in CPU 4. Supports up to 3 independent Displays 5. DisplayPort, HDMI, VGA, 24bit LVDS Video Outputs 6. 2 * DDR3-1333 SO-DIMM up to 16GB 7. 2 * SATA3 6Gb/s, 4 * SATA2 3Gb/s RAID 0, 1, 5, 10 8. Dual Intel Gigabit LAN, iAMT 8.0, HD Audio, 4 * Serial Ports 9. PCI Express 3.0 x16, Watchdog Timer, GPIO, USB 3.0 10. 1 * PCI Express Mini Card Slot (mSATA/mini-PCIE selectable) 11. 1 * PCI Express Mini Card Slot (half-size) 12. Supports Jetway Daughter Boards Gen2 13. Mini-ITX Form Factor (170mm x 170mm) DAUGHTER BOARD JADE4RTLANGEN2G 4-port Realtek Gigabit LAN JADE4INLANG 4-port Intel Gigabit LAN JADE4COMCB 2 * Internal RS232 2 * external RS232/422/485 TPM 1.2 Header Sold Separately rd CPU Supports 3 -Generation Intel Core i3, i5, i7 Mobile Processors, Socket G2 (Ivy Bridge & Sandy Bridge) Chipset Intel QM77 Express Chipset Video Integrated Intel HD Graphics in CPU (See CPU specs for details) Memory 2 * 204-pin DDR3-1333 Dual Channel SO-DIMM up to 16GB rd Expansion Slots 1 * PCI Express 3.0 x16 Slot (requires 3 -Gen CPU to run at 3.0) 1 * PCI Express Mini Card Slot (mSATA/mini-PCIE function selectable) 1 * PCI Express Mini Card Slot (half-size) Storage 4 * SATA2 3Gb/s ports supporting RAID 0, 1, 5. -
Intel's Core 2 Family
Intel’s Core 2 family - TOCK lines References Dezső Sima Vers. 1.0 Januar 2019 Contents (1) • 1. Introduction • 2. The Core 2 line • 3. The Nehalem line • 4. The Sandy Bridge line • 5. The Haswell line • 6. The Skylake line • 7. The Kaby Lake line • 8. The Kaby Lake Refresh line • 9. The Coffee Lake line • 10. The Coffee Lake line Refresh Contents (2) • 11. The Cannon Lake line (outlook) • 12. Sunny Cove • 13. References 13. References 12. References (1) [1]: Singhal R., “Next Generation Intel Microarchitecture (Nehalem) Family: Architecture Insight and Power Management, IDF Taipeh, Oct. 2008, http://intel.wingateweb.com/taiwan08/ published/sessions/TPTS001/FA08%20IDFTaipei_TPTS001_100.pdf [2]: Bryant D., “Intel Hitting on All Cylinders,” UBS Conf., Nov. 2007, http://files.shareholder.com/downloads/INTC/0x0x191011/e2b3bcc5-0a37-4d06- aa5a-0c46e8a1a76d/UBSConfNov2007Bryant.pdf [3]: Fisher S., “Technical Overview of the 45 nm Next Generation Intel Core Microarchitecture (Penryn),” IDF 2007, ITPS001, http://isdlibrary.intel-dispatch.com/isd/89/45nm.pdf [4]:Pabst T., The New Athlon Processor: AMD Is Finally Overtaking Intel, Tom's Hardware, August 9, 1999, http://www.tomshardware.com/reviews/athlon-processor,121-2.html [5]: Carmean D., “Inside the Pentium 4 Processor Micro-architecture,” Aug. 2000, http://people.virginia.edu/~zl4j/CS854/pda_s01_cd.pdf [6]: Shimpi A. L. & Clark J., “AMD Opteron 248 vs. Intel Xeon 2.8: 2-way Web Servers go Head to Head,” AnandTech, Dec. 17 2003, http://www.anandtech.com/showdoc.aspx?i=1935&p=1 [7]: Völkel F., “Duel of the Titans: Opteron vs. Xeon : Hammer Time: AMD On The Attack,” Tom’s Hardware, Apr. -
Computer Organization and Assembly Language CSC-210 Laboratory
Department of Computer Science CSC-210 Computer Organization and Assembly Language Laboratory Manual, 3rd Edition/2017 Computer Organization and Assembly Language CSC-210 Laboratory Manual 3rd Edition 2017/2018 Name: Number: ٍ :Section Department: 1 Department of Computer Science CSC-210 Computer Organization and Assembly Language Laboratory Manual, 3rd Edition/2017 Table of Contents Lab (1): Computer Anatomy ....................................................................................................... 4 Objectives ............................................................................................................................... 4 What is a Computer? ............................................................................................................... 4 System ..................................................................................................................................... 4 1. Motherboard ............................................................................................................. 5 2. Central Processing Unit (CPU) ...................................................................................... 6 3. Memory .................................................................................................................... 6 4. Video Adapter ............................................................................................................ 7 5. Operating System ......................................................................................................