Direct and Photon-Assisted Tunneling in Resonant-Cavity Quantum-Well Light-Emitting Transistors

Total Page:16

File Type:pdf, Size:1020Kb

Direct and Photon-Assisted Tunneling in Resonant-Cavity Quantum-Well Light-Emitting Transistors Direct and photon-assisted tunneling in resonant-cavity quantum-well light-emitting transistors Cite as: J. Appl. Phys. 124, 234501 (2018); https://doi.org/10.1063/1.5042418 Submitted: 31 May 2018 . Accepted: 20 October 2018 . Published Online: 18 December 2018 Junyi Qiu , Curtis Y. Wang, Milton Feng, and N. Holonyak ARTICLES YOU MAY BE INTERESTED IN Tutorial: An introduction to terahertz time domain spectroscopy (THz-TDS) Journal of Applied Physics 124, 231101 (2018); https://doi.org/10.1063/1.5047659 Hole transport in selenium semiconductors using density functional theory and bulk Monte Carlo Journal of Applied Physics 124, 235102 (2018); https://doi.org/10.1063/1.5055373 Aperiodic multilayer graphene based tunable and switchable thermal emitter at mid-infrared frequencies Journal of Applied Physics 124, 233101 (2018); https://doi.org/10.1063/1.5048332 J. Appl. Phys. 124, 234501 (2018); https://doi.org/10.1063/1.5042418 124, 234501 © 2018 Author(s). JOURNAL OF APPLIED PHYSICS 124, 234501 (2018) Direct and photon-assisted tunneling in resonant-cavity quantum-well light-emitting transistors Junyi Qiu, Curtis Y. Wang, Milton Feng, and N. Holonyak, Jr. Department of Electrical and Computer Engineering, Micro and Nanotechnology Laboratory, University of Illinois at Urbana-Champaign, Champaign, Illinois 61801, USA (Received 31 May 2018; accepted 20 October 2018; published online 18 December 2018) Tunneling in a transistor is a critical quantum process toward the next-generation, energy-efficient, high-speed data transfer for both electrical and optical communications. In this work, resonant- cavity quantum-well light-emitting transistors with tunneling collector junctions are designed and fabricated. Three distinctive tunneling mechanisms are clearly identified by the transistor optical output family curves, namely, electron direct tunneling (DT) from collector to base, electron DT from base to collector, and intra-cavity photon-assisted electron tunneling from base to collector. The device operations under both direct and photon-assisted tunneling are explained in detail by the intra-cavity quantum transition of electron-hole pair to photon dynamics. The tunnel junction and the corresponding carrier tunneling injection suggest the possibility of utilizing tunneling to achieve high-speed optoelectronics operations. Published by AIP Publishing. https://doi.org/10.1063/1.5042418 I. INTRODUCTION insertion of a double quantum-well in the base and a 15 nm The invention of the transistor by Bardeen and Brattain1 In0.05Ga0.95As layer between the base and the collector as the marks the beginning of transistor integrated circuits and tunneling region. In addition to the transistor base QWs pro- viding the electron-hole (e-h) recombination and photon serves as the basis for an information revolution. The transis- tor establishes the spontaneous electron-hole recombination, generation, the collector junction incoherent-tunneling intro- supporting signal amplification and switching by voltage duces additional carrier injection mechanisms and is shown to have a significant effect on the device operation; electrons control of the emitter and the collector junctions with minor- ity carrier injection, recombination, and collection. Utilizing tunneling from base to collector can be shown to increase the a direct bandgap compound semiconductor material, hetero- base QW photon generation because of the associated hole creation; at higher bias, ICPAT dominates and a transition interfaces, and quantum-wells (QWs), the light-emitting tran- sistor2,3 and the transistor laser4,5 introduce stimulated from direct tunneling to inelastic tunneling is observed. electron-hole recombination to coherent photon generation in Detailed DT and ICPAT tunneling mechanisms are revealed in the optical (L–V) family curves in contrast to the transistor the base and result in a broad spectrum of new functionali- I–V ties. Contrary to light-emitting diodes (LEDs) and diode collector current ( ) outputs. lasers (DLs), where the active region is nearly intrinsic, the This work demonstrates the use of a collector tunnel junction in transistors to control emitter carrier injection, fast quantum-well transistor’s base is thin and heavily doped to 1019 cmÀ3, resulting in a short recombination lifetime and base transport, and QW recombination in optoelectronic thus inherently higher optical modulation bandwidth. devices, which may provide a much faster modulation method in comparison with the conventional current modula- Experimentally, a light-emitting transistor with a modulation tion of LEDs, and DLs which rely on slow diffusion for bandwidth f–3dB = 7 GHz corresponding to a radiative recom- bination lifetime of 23 ps has been reported.6,7 Also, a tran- carrier supply. sistor laser with a resonance-free 20 GHz bandwidth and a carrier recombination lifetime as low as 29 ps has been con- firmed.8 Furthermore, we have realized intra-cavity photon- II. DEVICE FABRICATION AND MEASUREMENT SETUP assisted tunneling (ICPAT) providing the coherent photon absorption to electron-hole tunneling generation at the tran- The RCLET’s structure and band diagram are drawn – sistor collector junction.9 14 This coherent-ICPAT process schematically in Fig. 1. The basic structure is an n-InGaP/ suggests that the collector region can be used as a built-in p+-GaAs/n+-GaAs heterojunction bipolar transistor (HBT): electro-absorption modulator (EAM) allowing direct voltage- the emitter is a 53 nm In0.49Ga0.51P layer with a doping modulation on the semiconductor laser. of 1017 cmÀ3; the base region is GaAs with a doping of 19 20 –3 Different than the previous work on coherent-ICPAT 10 –10 cm and an undoped In0.2Ga0.8As double QWs; – in transistor lasers,9 16 this work focuses on the physical the collector is GaAs with a doping of ∼1019 cmÀ3;an mechanisms of direct tunneling (DT) and incoherent-ICPAT In0.05Ga0.95As layer of 15 nm thickness is inserted between and their interactions observed in the unique optical family the base and the collector to serve as the tunneling region. characteristics of resonant-cavity light-emitting transistors The resonant cavity is realized with a 4-pair distributed (RCLETs). The new design of RCLETs includes the Bragg reflector (DBR) (12%–90% AlGaAs) on the top and a 0021-8979/2018/124(23)/234501/6/$30.00 124, 234501-1 Published by AIP Publishing. 234501-2 Qiu et al. J. Appl. Phys. 124, 234501 (2018) FIG. 1. Resonant-cavity quantum-well light-emitting transistor (RCLET) struc- ture (left) and band diagram (right) showing the reduced gap tunnel junc- tion placed at the base-collector junction and the additional hole supply due to base-to-collector electron direct tunnel- ing under collector reverse bias. 36-pair DBR on the bottom. The device fabrication proce- the existence of tunneling behavior. As shown in Fig. 3(a), dure can be found in previous publications.2,3 a negative differential resistance region appears in the diode Figure 2 shows (a) the fabricated device under SEM and I–V curve, which is the signature of a tunnel diode.14 The (b) the optical emission viewed with an IR camera under an device band diagram is simulated with Sentaurus TCAD and optical microscope. The device has a planar contact layout plotted in Fig. 3(b) for reference. When the collector junction for potential high-speed applications and can be probed with is reverse biased (VBC , 0 V), electrons tunnel from the base two sets of ground-signal-ground (GSG) probes following valence band to the collector conduction band; at a small BC the conventional transistor common-emitter setup. A lensed junction forward bias (VBC . 0 V), electrons tunnel from the multimode fiber (core diameter 50 μm) is used to couple the collector conduction band to the base valence band; under spontaneous light output from the RCLET emission area, and higher forward bias (VBC . 0 V), electrons diffuse from the the spectrum is plotted in a linear scale in Fig. 2(c) with a collector to the base. The C-to-B tunnel current increases peak wavelength at 969.8 nm and a full-width half-maximum with the junction bias until the collector Fermi-level aligns (FWHM) of 10.6 nm. Due to the small light emission area, with the base valence band, at which point a peak current the lack of light output directionality, and the limited accep- (IP) of 2.35 mA is recorded at a peak voltage (VP) of 0.14 V; tance angle of fiber, we could only collect a few microwatts further increasing the junction bias will reduce the amount of of power, which is a major limiting factor at this stage. available equal-energy states in the base valence band and reduce the tunnel current, giving rise to the negative differen- tial resistance. The simulated band diagram shows that the I –V III. BASE-COLLECTOR TUNNEL DIODE BC BC separation between the base valence band and the collector CHARACTERISTICS Fermi-level is 0.074 eV, which is smaller than the measured The diode IBC–VBC characteristics of the base-collector peak voltage; this is likely due to the non-negligible series (BC) junction are measured at room temperature to confirm resistance introduced by contact resistance and the device FIG. 2. (a) SEM image of the finished RCLET device; the contacts are placed on the top with emitter metal (EM), base metal (BM), and collector metal (CM). (b) Microscopic top view of the device under testing; light emission (∼980 nm) can be observed with an IR camera; a lensed multimode fiber is used to couple the light output; only a fraction of the total power can be col- lected due to the small emission area and the lack of light output direction- ality. (c) RCLET emission spectrum measured at a bias of VBE ¼ 1:5Vand VCB ¼ 0:5 V; the peak emission is at 969.8 nm with a full-width half- maximum of 10.6 nm.
Recommended publications
  • The Transistor Laser: a Radical, Revolutionary Device
    technology novel devices The transistor laser: a radical, revolutionary device There are tremendous differences between the laser and the transistor, but it is possible to draw their attributes together by building a transistor laser. This novel device that produces its electrical and optical outputs simultaneously promises to revolutionize data transfer, enabling new architectures capable of operating at incredibly high bit rates, says Milton Feng from the University of Illinois, Urbana-Champaign. 48 www.compoundsemiconductor.net November / December 2010 novel devices technology he semiconductor industry rakes in billions and Tdollars from the manufacture of devices invented way back in the middle of the twentieth century. With the benefit of hindsight it is clear that the most important of them all is the transistor, a device invented by John Bardeen and Walter Brattain in 1947, which has been the key building block in the development of microelectronics, integrated circuits, consumer electronics, and the computer industry. Not far behind the transistor is the visible LED, made for the first time by Nick Holonyak in 1962, and the laser diode, independently invented in that same year by Holonyak and Robert Hall. These two optoelectronic devices have provided a great foundation for revolutionizing display, lighting, and information technology. Although the performance of all these devices has come on in leaps and bounds over the intervening decades, none can simultaneously deliver an electrical signal and a laser output. The invention of such device had to wait until Fig. 1 Three-port operation of the transistor laser provides an electrical input 2004, when I, Milton Feng, in partnership with co-worker (port 1), an electrical output (port 2) and an optical laser output (port 3).
    [Show full text]
  • ECE Illinois WINTER2005.Indd
    Electrical and Computer Engineering Alumni News ECE Alumni Association newsletter University of Illinois at Urbana-Champaign Winter 2005-2006 Jack Kilby, 1923–2005 Volume XL Cancer claims Nobel laureate, ECE alumnus By Laura Schmitt and Jamie Hutchinson Inside this issue Microchip inventor and Nobel physics laureate DEPARTMENT HEAD’S Jack Kilby (BSEE ’47) died from cancer on MESSAGE June 22, 2005. He was 81. Kilby received the 2000 Nobel Prize in 2 Physics on December 10, 2001, in an award ceremony in Stockholm, Sweden. Kilby was ROOM-TEMPERATURE LASER recognized for his part in the invention and 4 development of the integrated circuit, which he first demonstrated on September 12, 1958, while at Texas Instruments. At the Nobel awards ceremony, Royal Swedish Academy member Tord Claesen called that date “one of the most important birth dates in the history of technology.” A measure of Kilby’s importance can be seen in the praise that was lavished on him in death. Lengthy obituaries appeared in engi- Jack Kilby neering and science trade publications as well FEATURED ALUMNI CAREERS as in major newspapers worldwide, including where his interest in electricity and electron- the New York Times, Financial Times, and The ics blossomed at an early age. His father ran a 29 Economist. On June 24, ABC News honored power company that served a wide area in rural Kilby by naming him its Person of the Week. Kansas, and he used amateur radio to keep in Reporter Elizabeth Vargas introduced the contact with customers during emergencies. segment by noting that Kilby’s invention During an ice storm, the teenage Kilby saw “had a direct effect on billions of people in the firsthand how electronic technology could world,” despite his relative anonymity among positively impact people’s lives.
    [Show full text]
  • CNST Annual Nanotechnology Workshop 2011 Npeap Workshop
    CNST Annual Nanotechnology Workshop 2011 nPEAP Workshop May 12–13, 2011 Beckman Institute for Advanced Science and Technology and Micro and Nanotechnology Laboratory University of Illinois at Urbana-Champaign Sponsor Showcasing University of Illinois research in • University of Illinois bionanotechnology/nanomedicine, nanoelectronics/ Center for Nanoscale Science and Technology nanophotonics, and nanomaterials/nanomanufacturing, leading to cross-campus and industry collaborations. Co-sponsors • Micro and Nanotechnology Laboratory nPEAP • National Center for Supercomputing Applications The nano-Photonics and Electronics Industry Affiliates • Beckman Institute for Advanced Program focuses on cutting-edge nano-photonics and Science and Technology electronics research. • Coordinated Science Laboratory • Frederick Seitz Materials Research Laboratory • Institute for Genomic Biology • NSF I/UCRC Center for Agricultural, Biomedical, and Pharmaceutical Nanotechnology (CABPN) • NSF IGERT- CMMB • NIH/NCI M-CNTC • NSF Center on Emergent Behaviors For Technical Collaboration Contact: of Integrated Cellular Systems Center for Nanoscale Science and Technology (EBICS, co-location) University of Illinois • NanoHub at Illinois 217-333-2015 • Nanotechnology Community of Scholars at ACES [email protected] • US Army TATRC: Micro and Nano- www.cnst.illinois.edu mediated 3D Stereo Lithography 11:10 In-Situ TEM Investigations of Nanoscale Energy Systems in Relevant CNST Annual Environmental Conditions Shen Dillon, Materials Science and Nanotechnology
    [Show full text]
  • Compound Semiconductor Materials and Processing Technologies for Photonic Devices and Photonics Integration
    Carl kth royal institute r of technology euterskiöld Hedlund euterskiöld Compound semiconductor materials and processing technologies for photonic devices and photonics integration photonics and devices photonic for technologies processing and materials semiconductor Compound Doctoral Thesis in Information and Communication Technology Compound semiconductor materials and processing technologies for photonic devices and photonics integration CARL REUTERSKIÖLD HEDLUND ISBN 978-91-7873-665-2 TRITA-EECS-AVL-2020:51 KTH2020 www.kth.se Stockholm, Sweden 2020 Compound semiconductor materials and processing technologies for photonic devices and photonics integration CARL REUTERSKIÖLD HEDLUND Academic Dissertation which, with due permission of the KTH Royal Institute of Technology, is submitted for public defence for the Degree of Doctor of Philosophy on Friday the 30h October 2020, at 10:00 a.m. in sal C, Electrum, KTH Doctoral Thesis in Information and Communication Technology KTH Royal Institute of Technology Stockholm, Sweden 2020 © Carl Reuterskiöld Hedlund ISBN 978-91-7873-665-2 TRITA-EECS-AVL-2020:51 Printed by: Universitetsservice US-AB, Sweden 2020 Contents Abstract …………………………………………………………6 Sammanfattning ……………………………………………….8 Acknowledgements ………………………………………….10 List of Publications ………………………………………….11 1 Introduction ……………………………………………….17 1.1 Part A: GaAs and InP- device growth and processing…...17 1.1.1 Transistor vertical surface emitting lasers …………………..17 1.1.2 Trench confined transistors for spatial light modulator driver electronics…………………………………....………….20
    [Show full text]
  • Creating a Better Sensor for DNA Analysis
    NEWS FOR ECE ILLINOIS ALUMNI AND FRIENDS WINTER 2009–2010 Creating a better sensor for DNA analysis Also in this issue: Goddard receives Presidential Early Career Award Scientists break light modulation speed record—twice ECE grad students develop portable AIDS diagnostic platform ECE alumnus Cho inducted into National Inventors Hall of Fame Department of Electrical and Computer Engineering Support excellence To alumni and friends of ECE ILLINOIS, Speaking at a special session on scientific philanthropy, held at the World Conference of Science Journalists in London last July, Mike Lazaridis, cofounder of Research in Motion, Ltd., the company behind the BlackBerry® and major sponsor of the Institute for Quantum Computing at the University of Waterloo, Canada, said, “Philanthropy can be seen as a kind of venture capital for really long-term investment.” This comment reminds us of the true value of academic philanthropy as a critical enabler of the free pursuit of the arts, scientific discovery, and engineering innovation. Philanthropy, which can be defined literally as “a love for mankind,” occurs through the generosity of those with a commitment to the future, people for whom satisfaction derives from the benefits to society at large. I can think of no other institution more deserving of sponsorship today than the land grant university, perhaps the foremost guardian of the free pursuit of knowledge expansion. In today’s challenging economic times, the uncertainty of state support forces land grant universities to become increasingly dependent on philanthropy to further pursuit of their mission. The characterization of the philanthropist as a catalyst for the betterment of humanity aligns with the wellspring of the land grant university’s success—a fundamental meritocracy, regard- ing not only the selection of the student body, but also regarding academic and artistic freedom.
    [Show full text]
  • Surfactants and Digital Alloys for Strain Relief in III-Nitride Distributed Bragg Reflectors and Related Heterostructures Via Metal Organic Vapor Phase Epitaxy
    Graduate Theses, Dissertations, and Problem Reports 2011 Surfactants and digital alloys for strain relief in III-nitride distributed Bragg reflectors and related heterostructures via metal organic vapor phase epitaxy Lee Ellen Rodak West Virginia University Follow this and additional works at: https://researchrepository.wvu.edu/etd Recommended Citation Rodak, Lee Ellen, "Surfactants and digital alloys for strain relief in III-nitride distributed Bragg reflectors and related heterostructures via metal organic vapor phase epitaxy" (2011). Graduate Theses, Dissertations, and Problem Reports. 4775. https://researchrepository.wvu.edu/etd/4775 This Dissertation is protected by copyright and/or related rights. It has been brought to you by the The Research Repository @ WVU with permission from the rights-holder(s). You are free to use this Dissertation in any way that is permitted by the copyright and related rights legislation that applies to your use. For other uses you must obtain permission from the rights-holder(s) directly, unless additional rights are indicated by a Creative Commons license in the record and/ or on the work itself. This Dissertation has been accepted for inclusion in WVU Graduate Theses, Dissertations, and Problem Reports collection by an authorized administrator of The Research Repository @ WVU. For more information, please contact [email protected]. SURFACTANTS AND DIGITAL ALLOYS FOR STRAIN RELIEF IN III- NITRIDE DISTRIBUTED BRAGG REFLECTORS AND RELATED HETEROSTRUCTURES VIA METAL ORGANIC VAPOR PHASE EPITAXY
    [Show full text]
  • Development of High Speed Vertical Cavity Surface-Emitting Semiconductor Diode Laser and Transistor Laser by Michael E. Liu Diss
    DEVELOPMENT OF HIGH SPEED VERTICAL CAVITY SURFACE-EMITTING SEMICONDUCTOR DIODE LASER AND TRANSISTOR LASER BY MICHAEL E. LIU DISSERTATION Submitted in partial fulfillment of the requirements for the degree of Doctor of Philosophy in Electrical and Computer Engineering in the Graduate College of the University of Illinois at Urbana-Champaign, 2016 Urbana, Illinois Doctoral Committee: Professor Milton Feng, Chair Professor Jianming Jin Associate Professor John M. Dallesasse Assistant Professor Can Bayram ABSTRACT High speed semiconductor lasers are used in optical transceivers for short-reach data links. With fast-growing data capacity and traffic in the data centers around the globe, faster optical transceivers are demanded. A microcavity vertical cavity surface-emitting laser (VCSEL) is able to show a high modulation bandwidth as well as single-mode operation; however, because of the small oxide aperture (< 3 µm), a microcavity VCSEL shows high resistance and low optical power. An 850 nm oxide-confined VCSEL with an aperture ~4 µm is able to show error- free transmission at 40 Gb/s. With an advanced DBR design for parasitic reduction as well as better thermal conduction and a short 0.5-λ cavity with five quantum wells, an 850 nm VCSEL is able to demonstrate 57 Gb/s error-free transmission at 25 °C and 50 Gb/s error- free transmission at 85 °C. The dynamic carrier profile in the base of a transistor laser makes it possible to have a shorter carrier lifetime than in a diode laser. The first oxide-confined vertical cavity transistor laser (VCTL) is realized with a trench oxidation process and a lateral-feeding base metal design.
    [Show full text]
  • (12) United States Patent (10) Patent No.: US 8,179,937 B2 Walter Et Al
    US008179937B2 (12) United States Patent (10) Patent No.: US 8,179,937 B2 Walter et al. (45) Date of Patent: May 15, 2012 (54) HIGH SPEED LIGHT EMITTING (56) References Cited SEMCONDUCTOR METHODS AND DEVICES U.S. PATENT DOCUMENTS (75) Inventors: Gabriel Walter, Champaign, IL (US); 4,176,367 A 1 1/1979 Uematsu . 357/19 Milton Feng, Champaign, IL (US); Nick (Continued) Holonyak, Jr., Urbana, IL (US); Han Wui Then, Hillsboro, OR (US); FOREIGN PATENT DOCUMENTS Chao-Hsin Wu, Champaign, IL (US) JP 61270885 12, 1986 (73) Assignees: Quantum Electro Opto Systems Sdn. OTHER PUBLICATIONS Bhd., Melaka (MY); The Board of Electrical-Optical Signal Mixing and Multiplication (2-> 22 GHz) Trustees of The University of Illinois, With a Tunnel Junction Transistor Laser, H.W. Then, C.H. Wu, G. Urbana, IL (US) Walter, M. Feng and N. Holonyak, Jr., Appl. Phys. Lett. 94, 10114 (*) Notice: Subject to any disclaimer, the term of this (2009). patent is extended or adjusted under 35 (Continued) U.S.C. 154(b) by 0 days. Primary Examiner — Tod T Van Roy (21) Appl. No.: 12/799,083 (74) Attorney, Agent, or Firm — Martin Novack (22) Filed: Apr. 16, 2010 (57) ABSTRACT (65) Prior Publication Data A method for producing a high frequency optical signal com ponent representative of a high frequency electrical input US 2010/027214.0 A1 Oct. 28, 2010 signal component, includes the following steps: providing a semiconductor transistor structure that includes a base region Related U.S. Application Data of a first semiconductor type between semiconductor emitter (63) Continuation-in-part of application No.
    [Show full text]
  • Device Technologies for RF Front-End Circuits in Next-Generation Wireless Communications
    Device Technologies for RF Front-End Circuits in Next-Generation Wireless Communications MILTON FENG, FELLOW, IEEE, SHYH-CHIANG SHEN, MEMBER, IEEE, DAVID C. CARUTH, MEMBER, IEEE, AND JIAN-JANG HUANG, MEMBER, IEEE Invited Paper Next-generation high data rate wireless communication systems I. INTRODUCTION offer completely new ways to access information and services. To provide higher data speed and data bandwidth, RF transceivers The evolution of wireless networks involves enormous in next-generation communications are expected to offer higher complexity and rapid changes between different generations RF performance in both transmitting and receiving circuitry to as well as different applications. Take mobile commu- meet quality of service. Chosen semiconductor device technologies nications as an example. It is one of the fastest growing will depend greatly on the tradeoffs between manufacturing cost areas over the past decade. The first-generation mobile and circuit performance requirements as well as the variations in system architecture. Hardly did we find a single semiconductor communication systems are analog systems designed to device technology that offers a total solution to RF transceiver carry the voice traffic. The rapid growth in the number of building blocks in terms of system-on-a-chip integration. The subscribers and the proliferation of incompatible first-gener- choices of device technologies for each constituent component ation systems drove the evolution toward second-generation are then important and complicated issues. In this paper, we will (2G) cellular systems. Multiple access techniques such review the general performance requirement of key components for RF transceivers for next-generation wireless communications. as time division multiple access (TDMA), code division The state-of-the-art high-speed transistor technologies will be multiple access (CDMA), and global system for mobile presented to assess the capabilities and limitations of each tech- communications (GSM) are used in the 2G systems.
    [Show full text]
  • Light Emitting Transistor and Laser Revised.Indd
    Office of Technology Management UNIVERSITY OF ILLINOIS AT URBANA - CHAMPAIGN Light Emitting Transistor and Laser This invention is the world’s fi rst light emitting transistor. The HBLET extends the capabilities of light-emitting diodes and could make this transistor the fundamental element in electronics and optoelectronics. Photonics, optics & lasers Speed These transistors produce infrared light in phase with their base current, allowing it applications ts to attain a switching speed superior to light fi emitting diodes (LEDs). Electronics Controlled light emission Optoelectronics Light intensity can be controlled by varying the base current. Displays bene Simultaneous control of optical and electrical outputs The addition of a third port allows greater control. Tech No. TF04036 Utilizes base current U.S. Patent applications pending Once considered wasteful, the base current is used to create light. Investigators Milton Feng & Nick Holonyak www.ece.uiuc.edu Tech Manager Steven Wille Phone: 217.244.5956 Email: [email protected] For more information about the Offi ce of Technology Management please call us at 217.333.7862 or visit our website at: www.otm.uiuc.edu Copyright © 2005 - 2006 The Board of Trustees at the University of Illinois about the world’s fi rst light emitting transistor... In a bipolar device there are two kinds of injected These transistors are made with indium gallium carriers, negatively charged electrons and phosphide and gallium arsenide, unlike traditional positively charged holes. Some of these carriers, transistors which have been built from silicon and for example, a transistor, recombine rapidly, germanium. The recombination process in indium supported by a base current essential for normal gallium phosphide and gallium arsenide materials transistor function.
    [Show full text]
  • Tunneling Holds Key to High-Speed Modulation of Transistor and Laser Development 5 December 2016, by Rick Kubetz
    Tunneling holds key to high-speed modulation of transistor and laser development 5 December 2016, by Rick Kubetz and computer engineering at Illinois. "The three- terminal transistor replaced the fragile vacuum tube for fast reliable electrical signal switching and amplification, and has made possible a revolution in modern electronics, communications, and computer technologies." "We are especially grateful to John Bardeen for bringing transistor research to Urbana in 1951, and changing all of our lives world-wide with the new quantum-physics and solid state devices," stated Nick Holonyak Jr, Bardeen's first graduate student and current Bardeen Chair professor emeritus of electrical and computer engineering and Physics . In 2004, Feng and Holonyak realized the radiative recombination energy (light) at the base of an III-V Milton Feng and Nick Holonyak, Jr. invented the heterojunction bipolar transistor could be transistor laser in 2004 and continue develop the technology for energy-efficient high speed data transfer modulated to be a signal and a three-port device in optical and 5G wireless communications. Credit: that can harness the intricate physics between University of Illinois electrons and light. "The fastest way for current to switch in a semiconductor material is for the electrons to jump In 2004, electrical engineering pioneers Nick between bands in the material in a process called Holonyak, Jr. and Milton Feng at the University of tunneling," Feng stated. "Light photons help shuttle Illinois invented the transistor laser—a three-port the electrons across, a process called intra-cavity device that incorporated quantum-wells in the base photon-assisted tunneling, making the device much and an optical cavity—increasing its capacity to faster." transmit data one hundred-fold.
    [Show full text]
  • Inalgaas/Inp Light Emitting Transistors and Transistor Lasers Operating Near 1.55 Μm Copyright © Yong Huang 2010
    InAlGaAs/InP Light Emitting Transistors and Transistor Lasers Operating Near 1.55 µm A Dissertation Presented to The Academic Faculty by Yong Huang In Partial Fulfillment of the Requirements for the Degree Doctor of Philosophy in the School of Electrical and Computer Engineering Georgia Institute of Technology December 2010 Copyright © Yong Huang 2010 InAlGaAs/InP Light Emitting Transistors and Transistor Lasers Operating Near 1.55 µm Approved by: Dr. Russell D. Dupuis, Advisor Dr. Jeffrey A. Davis School of Electrical and Computer School of Electrical and Computer Engineering Engineering Georgia Institute of Technology Georgia Institute of Technology Dr. Shyh-Chiang Shen Dr. Zhong Lin Wang School of Electrical and Computer School of Materials Science and Engineering Engineering Georgia Institute of Technology Georgia Institute of Technology Dr. Oliver Brand School of Electrical and Computer Engineering Georgia Institute of Technology Date Approved: October 29, 2010 To my parents, Changfang Zhou and Tonghua Huang; and my supportive and beloved wife, Naiyu Wang ACKNOWLEDGEMENTS I would like to express my sincere gratitude to those who have helped make this work and dissertation possible. First, I would like to thank my advisor, Professor Russell D. Dupuis, for his guidance and for giving me the opportunity to participate in various optoelectronics research areas that are very stimulating and challenging. His devotion for work and deep and broad knowledge on semiconductors and MOCVD inspired me very much. I would also like to thank Professors Shyh-Chiang Shen, Oliver Brand, Jeffrey A. Davis, and Zhong Lin Wang for serving on my committee. It is an honor to have such esteemed professors on my committee.
    [Show full text]