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Advanced Stepper Lithography Technology to Enable Flexible AMOLED Displays

Keith Best Roger McCleary Elvino M da Silveira 5/19/17 Agenda

• About Rudolph • JetStep® G System overview and performance • Display Market Trends - Migration to Flex • Flexible Display Lithography Challenges • Results • Conclusion

2 Process Solutions Across the Industry

INSPECT MEASURE Macro Defects Silicon to Die On Product and In-die Dicing and Chipping Detection Multi-layer Film Stacks Interconnect Metrology UBM, RDL, PR, PI, Dielectrics 3D/2D Inspection Structure CD Residue Detection CORE COMPETENCIES

IMAGE ANALYZE Lithography resolution ≤1.5µm Process Analysis Active Matrix Display Backplanes Process Control Fan-out and Cu Pillar Tool-centric and Fabwide and Panel

FRONT-END BACK-END

SILICON RUDOLPH SOLUTIONS APPLY ACROSS THE SEMICONDUCTOR VALUE CHAIN TEST

3 Lithography Experience Spanning >25 Years

PanelPrinter Gen 6 High 9200 (G4.5) Resolution FPD

PanelPrinter 5200HR PanelPrinter (G2.5) PanelPrinter JetStep W AP 5200 (G2) 6700 (G3.5) Wafer System JetStep S AP Panel System

1988 1992 1996 2000 2004 2008 2012 2016 2019

8010 GHI 8009 Lens G Lens 6218 GHI 8410 GHI Variable NA Lens 16001 Iline Lens Lens

8015GT Lens Godzilla Lens

4 Rudolph Lithography Family

Advanced Packaging Display Lithography Systems Lithography Systems JetStep G Series

JetStep W2300 JetStep S3500 JetStep G35 JetStep G45 (wafers) (panels) Resolution in µm 2.5 1.5 Field Size Ø in mm 80 200 Substrate size Gen 2 to 3.5 Gen 4.5

Specifically designed for mobile display and pilot production

5 Display Market Trends Changes Driven by Electronics Everywhere

AMOLED displays are key differentiation and wearable enabler

Panel makers are aggressively investing in flexible AMOLED to meet demand

Bendable Foldable Rollable

6 Trends Driving Changes in Lithography

AUTOMATION Lithography systems need to process G5 & 6 highly compliant substrate with warp

PIXEL CREATION AMLCD Color Filter OLED Front Plane

SUBSTRATE Glass PI on Glass up to Gen 5 & 6

DISPLAY PRODUCTS Rigid Curved Bendable Foldable Rollable

NOW 2018 2019 2020 2021

Mobile/ Tablets END MARKET VR AR

Automotive Wearables

PPI 440 >500 800 1000 2000

TRANSISTOR TECH TFT LTPS LTPS with OLED

LITHO 0.5µm Overlay-1.5µm 0.35µm Overlay - 1.35µm 0.25µm Overlay – 1.0µm Resolution PERFORMANCE Resolution Resolution Compiled by Simax Asia Pacific Limited May 2017

7 8 Scaling to R2R Web 8” to accommodate an Stage topography topography Variations Addressinghandlingand Instability Addressingdimensional support an 8” web Overcoming Flex Manufacturing Challenges Flex Manufacturing Overcoming R2R to JetStep G35 A Path to Flex Substrate Lithography SubstrateFlex to Path A Addressing Topography Challenges On-the-fly auto focus

• Allows lens to follow wafer contours • Addresses the challenges of imaging on warped substrates • Capability to measure and monitor wafer topography

9 Imaging on Thin Substrates Photoresist: DOW SPR955CM, 1.4µm FT on Si. Dose: 300 mJ

Focus = 0 um Focus = +2 um Focus = +4 um

Focus = -2 um Focus = +6 um 1.25 µm thru Focus, ≥ 8.0 µm DOF

10 Flexible Substrates Distortion Characteristics Compaction and Expansion

• Environment Induced • Temperature Effects: ~2um over 100mm field per degree C • Relative Humidity Effects: ~ 1um over 100mm field per % change in RH

• Mechanical Induced Strain • Substrate Tension Variations in the Web line • Process Induced Distortion Substrate No Substrate Distortion Distortion Good Overlay Poor Overlay

Layer 1 Layer 2 Layer 1 Layer 2

11 Grid Measurement Front and backside alignment • Integrated with JetStep alignment system • Dual Head Off-axis alignment Optional IR • Real time auto-focus Visible Microscope • Entire wafer area accessible for alignment Visible scope IR scope

Objective 10X 5X 500-700nm 500-1050nm* Field of View 1.35 x 1.35 2.7 x 2.7 mm Resolved Feature Size 0.9 µm 5.3 µm

DOF 4.4 µm 200 µm Align Precision (3σ) 0.15 µm 0.24 µm *Longer Wavelength Option Available

Embedded IR Alignment Target Visible Top-side Alignment Target

12 Compensation Method

• 6 DOF Reticle chuck compensation • Up to 400PPM Compensation • Minimize field distortion • Mag, Trap, and Local position displacements

X 1, X 2,Y 1 X ,Y,

Z 1, Z 2, Z 3 Z,x,y

13 Overlay on Thin Substrates

Product B, Layer C, Overlay X (1x Stepper to 2x Stepper) Product B, Layer C, Overlay Y (1x Stepper to 2x Stepper) 1.5 1.5

1 1

0.5 0.5

0 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 -0.5 -0.5

-1 -1

-1.5 -1.5

X Overlay Y Overlay 250 250 200 200 150 150 100 100 Frequency 50 Frequency 50 0 0 -1 -0.8 -0.6 -0.4 -0.2 0 0.2 0.4 0.6 0.8 1 -1 -0.8 -0.6 -0.4 -0.2 0 0.2 0.4 0.6 0.8 1 Microns Microns Production Overlay Results – 28 Consecutive Substrates

14 Rudolph Flexible Lithography Systems . Gen 2.5 Lithography System . Flexible Lithography Sheets . Custom Flexible Display Manufacturing and Research

Photo source: ASU monthly magazine

Delivering Enabling Capabilities

15 Rudolph R2R Lithography Systems

. 6600 Gen 3 R2R Lithography System . New highly improved R2R . Process development research

Solution Through Collaboration

16 Functioning Flexible Displays

Flex Map

Conformal Display Concept Conformal Display

Working with World Leading Researches to Turn Concepts in Reality

Sources: Arizona State University (ASU) US Army Flexible Display Center & ASU Magazine, September 2013 volume 17 number 1

17 Beyond AMOLED Development results in technology to open new possibilities

IP DEVELOPED ADVANCED OLED MOBILE Flexible DISPLAYS PACKAGING TWO CAMERA

CU-PILLAR, C4, PCB

LARGE FIELD LENS G6 FPD NEXT GEN FPD HR, HIGH THROUGHPUT & LOW COO

HR, AP, PANEL

STITCHING

18 for flexible displays

High Fidelity Imaging for Critical Layers 1.5um L/S resolution

Overlay Through Active Compensation Real-time compensation while maintaining best focus

Addressing the Real World Challenges of Display Manufacturing on Flexible Substrates

19 Thank You!

[email protected] www.rudolphtech.com