New Approaches in Optical Lithography Technology for Subwavelength Resolution
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Modification Cleaning Bonding
EXCIMER LAMP LIGHT SOURCE Bonding Cleaning Modification EXCIMER LAMP LIGHT SOURCE RESULTS * Data verified by in-house testing. ■Surface modification of various materials TLS B0019EA Modification 100 Irradiation distance: 2 mm 90 Irradiation time: 10 s Irradiation atmosphere: air Surface modification technology is 80 utilized in a wide range of industrial Before processing fields. Compared to ordinary techniques, 70 After processing material modification using excimer 60 lamps is considered precision modifica- 50 tion because it occurs via a chemical reaction on the atomic or molecular level. 40 Moreover, this is clean modification that 30 does not harm the material and generates 20 no dust particles, and so is effective in 10 fields requiring more advanced levels of CONTACT ANGLE TO PURE WATER (°) material modification. 0 PET TAC PPS PVA COP Acrylic Polyimide Glass epoxy Polyethylene Polypropylene Polycarbonate ■Surface modification of resin ■Bonding pre-processing (improve adhesiveness) Example: Polyphenylene sulfide (PPS) + polyolefin (PO) 80° 3 15° Improved 2 about 3 times 1 Before excimer light irradiation After excimer light irradiation BONDING STRENGTH 0 Before processing After processing by excimer light by excimer light TLS B0013EA PRINCIPLE 1 Excimer lamp 2 Vacuum UV light In air O3 O(1D) O3 O(1D) O3 (Wavelength: 172 nm) 1 O2 O3 + O( D) Reaction O3 O(1D) O3 O(1D) O3 H HHH HHHH OH O OH COOH CCCC Resin material CCCC CCCC HHHH HHHH HHHH Vacuum UV light at a wavelength Bonds in material surface are Imparts hydrophilicity to the material of 172 nm generates ozone and simultaneously broken up by surface since chemical reaction active oxygen in large quantities. -
China's Progress in Semiconductor Manufacturing Equipment
MARCH 2021 China’s Progress in Semiconductor Manufacturing Equipment Accelerants and Policy Implications CSET Policy Brief AUTHORS Will Hunt Saif M. Khan Dahlia Peterson Executive Summary China has a chip problem. It depends entirely on the United States and U.S. allies for access to advanced commercial semiconductors, which underpin all modern technologies, from smartphones to fighter jets to artificial intelligence. China’s current chip dependence allows the United States and its allies to control the export of advanced chips to Chinese state and private actors whose activities threaten human rights and international security. Chip dependence is also expensive: China currently depends on imports for most of the chips it consumes. China has therefore prioritized indigenizing advanced semiconductor manufacturing equipment (SME), which chip factories require to make leading-edge chips. But indigenizing advanced SME will be hard since Chinese firms have serious weaknesses in almost all SME sub-sectors, especially photolithography, metrology, and inspection. Meanwhile, the top global SME firms—based in the United States, Japan, and the Netherlands—enjoy wide moats of intellectual property and world- class teams of engineers, making it exceptionally difficult for newcomers to the SME industry to catch up to the leading edge. But for a country with China’s resources and political will, catching up in SME is not impossible. Whether China manages to close this gap will depend on its access to five technological accelerants: 1. Equipment components. Building advanced SME often requires access to a range of complex components, which SME firms often buy from third party suppliers and then assemble into finished SME. -
Annual Report 2004
Annual Report 2004 Annual Report 2004 Contents 4 About ASML 5 ASML Corporate Achievements 2004 7 Message to Our Shareholders 10 Report of the Supervisory Board 17 Corporate Governance 34 Information and Investor Relations 35 ASML Worldwide Contact Information 37 Form 20-F In this report the expression “ASML” is sometimes used for convenience in contexts where reference is made to ASML Holding N.V. and/or any of its subsidiaries in general. The expression is also used where no useful purpose is served by identifying the particular company or companies. “Safe Harbor” Statement under the U.S. Private Securities Litigation Reform Act of 1995: the matters discussed in this document may include forward-looking statements that are subject to risks and uncertainties including, but not limited to, economic conditions, product demand and semiconductor equipment industry capacity, worldwide demand and manufacturing capacity utilization for semiconductors (the principal product of our customer base), competitive products and pricing, manufacturing efficiencies, new product development, ability to enforce patents, the outcome of intellectual property litigation, availability of raw materials and critical manufacturing equipment, trade environment, and other risks indicated in ASML’s Annual Report on Form 20-F and other filings with the U.S. Securities and Exchange Commission. © 2005, ASML Holding N.V. All Rights Reserved About ASML ASML is the world’s leading provider of lithography advanced scanners, enabling the delivery of complete systems for the semiconductor industry, manufacturing and integrated mask design to wafer imaging solutions. complex machines critical to the production of integrated circuits or chips. ASML Optics provides precision optical modules for the PAS 5500 and TWINSCAN lithography systems. -
Patent Dispute Settlement; Financial Results Forecast Revision
September 29, 2004 Patent Dispute Settlement; Financial Results Forecast Revision On September 28, 2004 (Japan time), Nikon Corporation (Nikon), ASML Holding N.V. (ASML) and Carl Zeiss SMT AG (SMT) signed a Memorandum of Understanding which provides for a comprehensive settlement of legal proceedings and cross- license of patents between Nikon, ASML and SMT. Accordingly, we have revised the forecast of Financial Results for the Year ending March2005 (April 1, 2004 – March 31, 2005) that was issued on May 10, 2004 (refer to item 4 in this document for a detailed breakdown). 1. Details regarding disputes (prior to settlement) The major events in the disputes between Nikon (and subsidiaries) and ASML (and subsidiaries/affiliates) are as outlined below. On December 21, 2001, Nikon filed a complaint against ASML with the U.S. International Trade Commission (ITC) requesting an exclusion order to prevent any further importation by ASML of infringing stepper and scanner equipment (used in manufacture of semiconductor devices) in the U.S. Since the ITC denied Nikon’s request, Nikon appealed to the Court of Appeals for the Federal Circuit (CAFC) on May 12, 2003. Nikon also pursued patent infringement cases against ASML with the Federal District Court for the Northern District of California (NDCA), with the Tokyo District Court and in Korea as well. As a result of several settlement discussions, Nikon basically agreed to settle the case since it concluded that its goal has been accomplished in principle. The NDCA allowed SMT to join in the case, and therefore, they are party to the Memorandum of Understanding. -
ENTERED ATOM Instrument Corporation, Ct Al., § August 16, 2018 § David J
Case 4:12-cv-01811 Document 142 Filed in TXSD on 08/16/18 Page 1 of 6 UNffiD STATES DISTRICT COURT SOUTHERN DISTRICT UnitedOF TEXAS States District Court Southern District of Texas ENTERED ATOM Instrument Corporation, ct al., § August 16, 2018 § David J. Bradley, Clerk Plaintiffs, § § 1Jcrsus § Civil Action H-I2-r8II § § Petroleum Analyzer Company, L.P., § § Defendant. § Findings and Conclusions 1. Background. Franek Olstowski worked for Petroleum Analyzer Company, L.P., before becoming president and part-owner of ATOM Instrument Corporation. ATOM and Petroleum develop, manufacture, and repair instruments for chemical analysis of hydrocarbons. In 2002, while working as a consultant for Petroleum, Olstowski developed an excimer light source to detect sulfur using ultraviolet fluorescence. He did this separately from his work at Petroleum. In 2003 and 2005, under a non-disclosure agreement, Petroleum and he talked about licensing his technology but did not reach an agreement. Olstowski was awarded a patent in 2007. Excimer is short for excited dimer. It is a combination of a noble gas and a reactive gas that produces ultraviolet light when excited by electricity. Possible combinations include krypton and chloride, xenon and chloride, and xenon and bromine. An excimer detects, in this case, sulfur by making it glow. like an excimer, :z;inc or cadmium can be used as a source of ultraviolet light. In 2006, Petroleum sued ATOM and Olstowski in Texas state court, claiming ownership of the excimer technology. In their contract, Olstowski and Petroleum had agreed to arbitrate, so the court sent them to do that. The arbitration panel awarded Olstowski ownership of all the technology. -
Excimer Lamps/Excimer Irradiation Unit | USHIO INC
11/18/2020 Excimer lamps/Excimer irradiation unit | USHIO INC. HOME Products Information Products Excimer lamps/Excimer irradiation unit Excimer lamps/Excimer irradiation unit Modification Cleaning MEMS, Electronic Semiconductors Components Liquid Crystal Display Printed Circuit Board and Functional Materials Biology and Chemistry PKG Energy Printing Excimer VUV light is the very high-energy light generated by lamps containing noble gases or noble-gas hydride compounds. Externally applying high-energy electrons to a sealed lamp containing a noble gas or noble gas hydride compound generates intense plasma discharge (dielectric barrier discharge). This plasma features high-energy electron content, and can be extinguished instantly. The plasma discharge instantly excites the atoms of the discharge gas (noble gas) to their excimer (Xe) state (high- energy orbital atoms form excimer excited molecules). The excimer-specific spectrum is emitted when atoms return from this excimer state to their original condition (ground state). This emission is called VUV light. Download * * * * Favorites Print catalog For inquiries regarding "222 nm ultraviolet (UV-C) light antibacterial and viral inactivation device," please contact : Sales Department 5, Sales Division, Light Source Business Division TEL: +81-3-5657-1016 / E-Mail: [email protected] Features Main applications Case study Product Lineup Options FAQ High photon energy VUV (vacuum ultraviolet) light at a wavelength of 180 nm or less, which is not available using conventional UV lamps, emits light efficiently to evoke or accelerate chemical reactions otherwise unachievable with conventional UV light. Single wavelength Excimer emission features a single peak emission wavelength with light emitted only in a very narrow range around the peak. -
New Applications with the EX-Mini Compact Excimer Lamp Light Source
2015 01 INTERVIEW PAGE 6 New Applications with the EX-mini Compact Excimer Lamp Light Source OPTO-SEMICONDUCTOR PRODUCTS PAGE 15 ELECTRON TUBE PRODUCTS PAGE 19 SYSTEMS PRODUCTS PAGE 26 Low-noise MPPC for precision Deep UV light source – higher Easy-to-use – NanoZoomer-SQ measurement power than LED Digital Slide Scanner June 22-25, 2015 Munich, Germany Hall A2, Booth 303 PHOTONNOVATION Content Medical Life ScienceDrug DiscoveryMeasurementAnalytical Semicond. Prod.Optical CommsSecurity Industry ND InspectionAcademic Research OPTO-SEMICONDUCTOR PRODUCTS 15 MPPC®/MPPC Module S13360 Series, C13365/C13366 Series 16 CMOS Linear Image Sensor S13131 17 Mini-spectrometer C13053MA 18 InAsSb Photovoltaic Detector (Non-cooled Type) P13243 Series ELECTRON TUBE PRODUCTS 19 Deep UV Light Source (UVCL) L12848-305 20 Excimer Lamp Light Source L11751-01, E12499, C11997 21 Opto-Spectrum Generator L12194-00-34054 22 NIR-PMT Unit H12397-75 23 Fast Decay Time Phosphor J12782-09D SYSTEMS PRODUCTS 24 ORCA-Flash4.0 LT with W-VIEW Mode™ 26 NanoZoomer-SQ Digital Slide Scanner C13140-21 27 ImagEM X2-1K EM-CCD Camera C9100-24B LASER PRODUCTS 28 LD Irradiation Light Source (SPOLD) L11785-61 29 Super Luminescent Diode (SLD) L12856-04 CompaNY NEWS APPLICATION REPORT 4 Hamamatsu holds the IEEE Milestone dedication ceremony 10 Tumor detection in fluorescent tissue microarrays enables high-through- in recognition of 20-inch photomultiplier tubes put analysis of multiple cancer biomarkers 5 Hamamatsu establishes a new subsidiary to enhance sales 12 Investigations of emission -
STERILRAY Vs . LARSON ELECTRONICS
Case 3:21-cv-01166-X Document 1 Filed 05/21/21 Page 1 of 38 PageID 1 IN THE UNITED STATES DISTRICT COURT FOR THE NORTHERN DISTRICT OF TEXAS HIGH ENERGY OZONE LLC d/b/a FAR- ) UV STERILRAY and S. EDWARD ) NEISTER, ) ) Civil Action No. 3:21-cv-1166 Plaintiffs, ) ) JURY TRIAL DEMANDED v. ) ) LARSON ELECTRONICS LLC, ) ) Defendant. ) COMPLAINT Plaintiffs High Energy Ozone LLC d/b/a Far-UV Sterilray (“HEO3”) and Mr. S. Edward Neister (“Mr. Neister”) (collectively, “Plaintiffs”), allege as follows: INTRODUCTION 1. More than fifteen years ago, physicist S. Edward Neister developed and patented methods for deactivating or destroying harmful microorganisms using a new spectrum of ultraviolet (UV) light. Mr. Neister’s methods included the development and use of Krypton-Chloride excimer lamps that emit a peak wavelength at 222 nm in conjunction with other wavelengths. Unlike the 254 nm UV light—which had been used for decades for sanitization but was dangerous to humans—applying 222 nm UV light does not penetrate human skin or eyes, making it far better and more useful than traditional lamps and methods of use. 2. Mr. Neister’s patented technology became the foundation for the family business. Mr. Neister and his brother John Neister originally founded the company Case 3:21-cv-01166-X Document 1 Filed 05/21/21 Page 2 of 38 PageID 2 that would become HEO3 in 2005 in a small town in New Hampshire. HEO3 is producing and selling lamps designed to perform Mr. Neister’s patented methods of killing harmful microorganisms. 3. -
Targeted Phototherapy
Review TTargetedargeted pphototherapyhototherapy Article VVenkataramenkataram MysoreMysore ABSTRACT Centre for Advanced Phototherapy is one of the most important therapeutic modalities in dermatology. This fi eld has Dermatology, Bangalore, India seen several major advances in the recent years, the most recent being targeted phototherapy. Targeted phototherapy, which includes laser and nonlaser technologies, delivers light/laser AAddressddress forfor ccorrespondence:orrespondence: in the ultraviolet spectrum, of specifi c wavelength, specifi cally targeted at the affected skin Dr. Venkataram Mysore, Venkat Charmalaya - Centre and thereby avoids many of the side effects of conventional phototherapy. The treatment for Advanced Dermatology, has been claimed to be effective, quick, and needing fewer treatment sessions. The article 3437 1st G cross 7 main reviews this new mode of phototherapy. Subbanna Garden, Vijay Nagar, Bangalore – 560 040, Key words: Excimer laser, excimer light, phototherapy, psoriasis, targeted phototherapy, India. E-mail: [email protected] vitiligo DDOI:OI: 10.4103/0378-6323.48655 PMID: 19293497 IINTRODUCTIONNTRODUCTION etc. These machines have the following disadvantages: 1. Exposure of uninvolved areas Phototherapy is used for a wide variety of skin diseases. 2. Slow delivery system and lengthy treatment There has been considerable progress in cellular sessions and cutaneous photobiology leading to improved 3. Multiple and frequent visits to clinic understanding of different photodermatoses and their 4. Difficulty in treating certain areas (such as treatment. However, the developments in phototherapy genitalia, oral mucosa, ear, etc) have been comparatively slow, as reflected in a recent 5. Difficulty in treating children who may feel publication that “developments in phototherapy have intimidated by the large machines not kept pace with scientific progress, as has been the 6. -
Lithography Reading: Jaeger, Chap
EE143 – Fall 2016 Microfabrication Technologies Lecture 3: Lithography Reading: Jaeger, Chap. 2 Prof. Ming C. Wu [email protected] 511 Sutardja Dai Hall (SDH) 1-1 The lithographic process 1-2 1 Photolithographic Process (a) Substrate covered with silicon dioxide barrier layer (b) Positive photoresist applied to wafer surface (c) Mask in close proximity to surface (d) Substrate following resist exposure and development (e) Substrate after etching of oxide layer (f) Oxide barrier on surface after resist removal (g) View of substrate with silicon dioxide pattern on the surface 1-3 Photomasks - CAD Layout • Composite drawing of the masks for a simple integrated circuit using a four-mask process • Drawn with computer layout system • Complex state-of-the- art CMOS processes may use 25 masks or more 1-4 2 Photo Masks • Example of 10X reticle for the metal mask - this particular mask is ten times final size (10 µm minimum feature size - huge!) • Used in step-and-repeat operation • One mask for each lithography level in process 1-5 Lithographic Process 1-6 3 Printing Techniques Contact Proximity Projection • Contact printing printing printing printing damages the mask and the wafer and limits the number of times the mask can be used • Proximity printing eliminates damage • Projection printing can operate in reduction mode with direct step- on-wafer 1-7 Contact Printing hv Photo photoresist Mask Plate wafer Resolution R < 0.5µm mask plate is easily damaged or accumulates defects 1-8 4 Proximity Printing Light g ~ 20µm Photoresist Wafer Exposed Resolution � ∝ & �� �: wavelength of the light source �: g ~ 1µm for visible photons, much smaller for X-ray lithography 1-9 Projection Printing hv De-Magnification: nX 10X stepper 4X stepper lens 1X stepper focal plane P.R . -
Excimer Lamp Pumped by a Triggered Discharge
ENTE PER LE NUOVE TECNOLOGIE, L'ENERGIA E L'AMBIENTE Dipartimento Innovazione ET f\T- - 9k 13 EXCIMER LAMP PUMPED BY A TRIGGERED DISCHARGE G. BALDACCHINI, S. BOLLANTI, P. Dl LAZZARO, F. FLORA, G. GIORDANO, T. LETARDI, A. RENIERI, G. SCHINA Centro Ricerche Frascati, Roma G. CLEMENTI, F. MUZZI, C.E. ZHENG EL.EN., (Electronic Engineering), Firenze MASTER DISTRIBUTION OF THIS DOCUMENT IS UNLIMITED FOREIGN SALES PROHIBITED RT/INN/96/13 DISCLAIMER Portions of this document may be illegible in electronic image products. Images are produced from the best available original document ABSTRACT Radiation characteristics and discharge performances of an excimer lamp are described. The discharge of the HCl/Xe gas mixture at an atmospheric pres sure, occurring near the quartz tube wall, is initiated by a trigger wire. A maximum total UV energy of about 0.4 J in a (0.8-0.9) ps pulse, radiated from a 10 cm discharge length, is obtained with a total discharge input energy of 8 J. Excimer lamps are the preferred choice for medical and material processing ir radiations, when the monochromaticity orcoherence of U V light is not required, due to their low cost, reliability and easy mantainance. (DISCHARGE UV LAMP). RIASSUNTO In questo iavoro vengono illustrate le caratteristiche di eccitazione e di emissione radiativa di ima lampada ad eccimeri. La scarica di eccitazione e innescata da un filo ad alia lensione e si sviluppa vicino alia parete del tubo di quarzo in una miscela di gas HCl/Xe a pressione atmosferica. Con un’energsa d; 8 J depositata dalla scarica in una lampada lunga 10 cm, si ottiene un’cnergia massima irraggiata nell’ultravioletto di 0.4 J in un impulse di 0.8-0.9 ps di durata. -
Excimer Lamp Excimer Lamp
RFRF DISCHARGEDISCHARGE TYPETYPE EXCIMEREXCIMER LAMPLAMP L12431L12431 Reforming Cleaning Making it "PERFECT" with "LIGHT" ! Making changes with "LIGHT" ! The possibilities of light for "Reforming" and "CLEANING" ! Principle Application examples Features of the Hamamatsu excimer lamps Reforming ISurface reforming of PET plastic Excimer lamp 80° Uniformity irradiates a large area Hamamatsu 1 long flat lamps Surface reforming technology is utilized in a 15° by use of a long flat lamp In air (wavelength 172 nm) wide range of industrial fields. Material re- Uniformity characteristics (along short axis) forming using excimer lamps is considered O2 O3 + O(1D) Long flat lamps vs. cylindrical lamps precision reforming compared to ordinary 3 1 3 1 3 O O( D) O O( D) O H2OH2O techniques because it occurs via a chemical H2O H2O Before irradiation After irradiation reaction on the atomic or molecular level. HHHH 100 Plastic I Moreover, this is a clean reforming that does CCCC CCCC Bonding pre-processing (improve adhesiveness) 90 material not harm the substrate or generate dust parti- Example: PPS (polyphenylene sulfide) + PO (polyolefin) 80 HHHH HHHH Good uniformity since entire surface is cles and so is an effective technology in 3 in close proximity Vacuum ultraviolet light at a wave- Bonds in material surface are bro- 70 fields requiring more advanced levels of mate- length of 172 nm generates ozone ken simultaneously with ozone and rial reforming. Improved 60 and active oxygen in large quanti- active oxygen generation, and the 2 Cylindrical lamps from ties. resulting moisture evaporates. about other companies Surface reforming using excimer lamps can 3 times 50 be used to increase adhesiveness and improve 40 1 functionality of materials such as by giving Bonding strength 30 UV power meter: Hamamatsu H9535-172 hydrophilicity to them, making it useful in a Lamp to UV power meter distance: 5 mm 2 20 Pinhole is interposed between lamp and UV power meter wide range of fields and materials.