Lecture 16 – Introduction to Optical Lithography
EECS 598-002 Winter 2006 Nanophotonics and Nano-scale Fabrication P.C.Ku Optical Lithography
An optical system that transfers the image from the mask to the resist layer + the process of forming an etching mask (i.e. the resist development and etc.)
EECS 598-002 Nanophotonics and Nanoscale Fabrication by P.C.Ku 2 Resolution limits for imaging
Small features correspond to large (kx, ky) components.
In traditional optical microscopes, the detector sees the light in the far fieldk region.
2 2 222 k==++ωµε0 kkkxyz
22 ⇒+<⇒kkxyω nck/2/&,max =πλ n
17.5 15 Resolving power 12.5
k-space real-space 10 = λλ/2( n)≡ eff /2 7.5 5 = diffraction limit 2.5
−2/π n λ 2/π n λ k& -2 -1 1 2 λ / n
EECS 598-002 Nanophotonics and Nanoscale Fabrication by P.C.Ku 3 Finite-size lens
In a real system, the cutoff spatial frequency is often limited by the size of the lens which is quantitatively described by a numerical aperture (NA).
NA≡ n sinθ θ
k&,max 2π ⇒=⇒=sink&,max NA k λ
θ Resolving power Æ
λλ/2NA( )≡ eff /2
where λeff = λ /NA
EECS 598-002 Nanophotonics and Nanoscale Fabrication by P.C.Ku 4 Patterning process
Dissolution rate
resist x
I aerial image
x Dissolution + rate I
EECS 598-002 Nanophotonics and Nanoscale Fabrication by P.C.Ku 5 Some clarifications
The minimum feature size:
The fundamental limit of optical lithography is not determined by the optical system alone but rather is an overall contributions from the optics, resist, develop and etching processes.
Process window:
Capability of printing small features does not always guarantee a good quality and a repeatable and controllable patterning.
Alignment:
Alignment to the underlying layer is equally as important as the optics.
EECS 598-002 Nanophotonics and Nanoscale Fabrication by P.C.Ku 6 How was our prediction in the past?
1.0 µm 0.7 µm 0.5 µm 0.35 µm 0.25 µm 0.18 µm 0.13 µm 0.10 µm ?
EECS 598-002 Nanophotonics and Nanoscale Fabrication by P.C.Ku 7 ITRS prediction in 1998
ITRS 1998:
193 DUV litho cannot produce 65 nm process.
EECS 598-002 Nanophotonics and Nanoscale Fabrication by P.C.Ku 8 ITRS 1999
157 nm appears on the map.
EECS 598-002 Nanophotonics and Nanoscale Fabrication by P.C.Ku 9 ITRS 2005 report
Note: 157 nm off the chart now.
EECS 598-002 Nanophotonics and Nanoscale Fabrication by P.C.Ku 10 Major challenges (at this moment…)
Data from ENIAC. EECS 598-002 Nanophotonics and Nanoscale Fabrication by P.C.Ku 11 Evolution of optical lithography
Contact and proximity printing Defects, gap control
1:1 projection printing Overlay, focus, mask cost
Step-and-repeat projection Reduction possible printing
Easier focus; Step-and-scan projection better usage of lens printing area
EECS 598-002 Nanophotonics and Nanoscale Fabrication by P.C.Ku 12 A step-and-scan system (stepper or scanner)
Mask
Wafer
EECS 598-002 Nanophotonics and Nanoscale Fabrication by P.C.Ku 13 Step-and-repeat vs step-and-scan
Step-and-repeat Step-and-scan
scan
EECS 598-002 Nanophotonics and Nanoscale Fabrication by P.C.Ku 14 Evolution of optics
From Introduction to Microlithography
EECS 598-002 Nanophotonics and Nanoscale Fabrication by P.C.Ku 15 An example of the optics (NA=0.6, 4X reduction)
US Patent 5969803
EECS 598-002 Nanophotonics and Nanoscale Fabrication by P.C.Ku 16 Challenges in lens design
Larger lens (required by better resolution) Æ aberration
Suitably rotating the lens in the step-and-scan system can minimize the aberration
Finite linewidth of laser source Æ dispersion
Aspheric lens Æ more expensive
Tighter spec on surface quality of lens
Shortening the wavelength Æ more expensive raw materials
EECS 598-002 Nanophotonics and Nanoscale Fabrication by P.C.Ku 17 Resolution vs minimum linewidth
Resolution often refers to the smallest pitch of a dense line/space pattern. It is limited by the diffraction limit.
Important for DRAM/flash.
Minimum linewidth is the minimum line or space that we can resolve. It has no fundamental limit.
Important for logic chips (e.g. the gate length of a transistor)
EECS 598-002 Nanophotonics and Nanoscale Fabrication by P.C.Ku 18 There’s no fundamental limit to optical lithography!
EECS 598-002 Nanophotonics and Nanoscale Fabrication by P.C.Ku 19 Fundamentals of lithographic optics
Diffraction
Partial coherence
Depth of focus
Reflection and interference
Polarization dependence
EECS 598-002 Nanophotonics and Nanoscale Fabrication by P.C.Ku 20 Fraunhofer diffraction (scalar; far-field)
η y ξ x z
Mask plane Image plane
k ixy()22+ eeikz 2λz Uxy(, )= FU[] (,)ξη fx =xz/λ iz f y =xz/λ
EM field
EECS 598-002 Nanophotonics and Nanoscale Fabrication by P.C.Ku 21 Diffraction from an aperture
⎛⎞ax FU[]()ξ = a sinc⎜⎟ fxzx = /λ ⎝⎠λz
22⎛⎞ax a Intensity ∝ a sin c ⎜⎟ ⎝⎠λz 1
0.9
0.8 0.7 Before the lens 0.6
0.5
0.4
0.3
0.2
0.1
0 -4 -3 -2 -1 0 1 2 3 4 λz/a
EECS 598-002 Nanophotonics and Nanoscale Fabrication by P.C.Ku 22 Diffraction of a line/space (N spaces) pattern
22 ⎛⎞⎛⎞Npxππ sx ⎜⎟⎜⎟sin sin Ix()∝ λλ s p ⎜⎟⎜⎟px sx ⎜⎟⎜⎟sin ππ ⎝⎠⎝⎠λλ
1 1 1
0.9 0.9 0.9
0.8 0.8 0.8
0.7 0.7 0.7
0.6 0.6 0.6
0.5 0.5 0.5
0.4 0.4 0.4 0.3 0.3 0.3 0.2 0.2 0.2 0.1 0.1 0.1 0 0 0 -5 0 5 -5 0 5 -5 0 5 N=5 N=10 N=100
EECS 598-002 Nanophotonics and Nanoscale Fabrication by P.C.Ku 23 Basic lithographic optics configuration
illumination mask projection lens photoresist (image plane)
EECS 598-002 Nanophotonics and Nanoscale Fabrication by P.C.Ku 24 Image formation
st Need to have at least the 0-th and the 1 diffraction orders being collected to recover the pitch information.
+1 0
0
-1 -1
Oblique incidence can improve the minimum pitch but result in a less image contrast.
EECS 598-002 Nanophotonics and Nanoscale Fabrication by P.C.Ku 25