Visio-Amd Cpu

Total Page:16

File Type:pdf, Size:1020Kb

Visio-Amd Cpu AMD CPUコアの移行予想図 2003 2004 2005 2006 2007 2008 2009 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 1H 2H 1H 2H 1H 2H MP SledgeHammer Athens Egypt Santa Rosa Deerhound Zamora Opteron Socket F 4 cores 4 cores Server&Workstation 1MB L2 Server 1MB L2 1MBx2 L2 2-Channel 1MBx2 L2 Shared Cache Shared L3 Socket 940 Registered DDR2, Socket F Pacifica, Memory RAS 2-Channel New Socket ? Registered DDR2, FB-DIMM Socket 940 Pacifica, HyperTransport3 Memory RAS DP Deerhound Zamora SledgeHammer Opteron Troy Italy Santa Rosa Server& 1MB L2 SSE3 1MB L2 1MBx2 L2 1MBx2 L2 4 cores 4 cores Workstation Socket 940 Socket AM2 Shared Cache Shared L3 Socket 940 2-Channel DDR2, Pacifica, Memory RAS Socket F (12 07 LGA) Opteron UP Opteron SledgeHammer Server& Venus Denmark Santa Ana Socket AM2 Cadiz 1MB L2 1MB L2 Single/Dual 1MBx2 L2 4 cores Workstation Socket 940 Socket 939 Socket 939 DDR2/3 HyperTransport3 Socket 940 Athlon 64 FX Socket AM2 Premium Socket 940 San Diego Toledo Desktop ClawHammer 1MB L2 1MBx2 L2 1MB L2 Socket 939 Windsor Greyhound Brisbane 4 cores Athlon 64 1MBx2 L2 Socket 754 Socket 939 Toledo Athlon 64 X2 Socket M3? Desktop PC Desktop 1MBx2 L2 Socket AM2 ClawHammer SSE3 DDR2/3 1MB L2 Socket 939 HyperTransport3 Performance Newcastle San Diego Socket AM2 512KB L2 1MB L2 2-Channel DDR2, /Mainstream Pacifica Desktop Socket A Athlon 64 Socket 754 Socket 939 Athlon XP Orleans Socket 939 Winchester Venice 512KB L2 512KB L2 Socket AM2 Thoroughbred 2-Channel DDR2, /Barton Sempron Paris SSE3 Value Victoria Socket 754/939 Socket AM2 256KB L2 Palermo Manila Sparta Desktop Socket A 256KB L2 Socket A Socket 754 Thoroughbred Athlon 64 Mobile Athlon 64 SSE3 Socket AM2 Full-Size Socket 754 Notebook Socket 754 Socket A ClawHammer Socket 754 Socket AM2, (62W) Newark 2-Channel DDR2, Trinidad Pacifica Mobile Sempron Socket 754 Full-Size Thoroughbred Socket AM2, /Barton 2-Channel DDR2 Value Socket A Notebook Georgetown Albany Richmond (62W) Athlon XP-M Socket AM2 Notebook PC Socket S1, 2-Channel DDR2, Mobile Athlon 64 Pacifica Turion 64 Socket S1, Turion 64 X2 Socket S1 Thin&Light 2-Channel DDR2, New Socket? Socket 754 Pacifica DDR2/3 Mobile Socket A HyperTransport3 (-35W) Odessa Oakville Lancaster SSE3 Taylor Tyler Mobile Sempron Socket S1, Thin&Light Thoroughbred 2-Channel DDR2 Socket S1 Value /Barton Socket S1, Socket A 2-Channel DDR2 Mobile Dublin Socket 754 Roma Keene Sherman (-25W) Athlon XP-M Low Power Mobile (-11W?) ? Single-core Dual-core Quad-core 130nm 130nm 90nm 90nm 65nm 65nm K7 K8 K8 K8(Rev. F) K8 (Rev.G/H?) K8 "New Core" Socket A Socket 940 Socket 754 Socket 939 Socket AM2 Socket F Socket S1 Copyright (c) 2006 Hiroshige Goto All rights reserved..
Recommended publications
  • 2004 Gamers' Hardware Upgrade Guide
    Ace’s Hardware 2004 Gamers’ Hardware Upgrade Guide 2004 Gamers’ Hardware Upgrade Guide By Johan De Gelas – January 2004 Introduction Last week, we showed you a preview of the Athlon 64 3400+. Today, we'll investigate this new CPU as an upgrade to an existing system. How much performance do you gain when upgrading? What about the other features aside from performance, such as Cool'n'Quiet and more thermal and mechanical safety? As always, we start with a base system to be upgraded. This time around, our base system is equipped with an Athlon XP 2100+, as previous polls among our readers show that the faster versions of the Athlon XP "Palomino" were very popular in the early days of 2003. Now in 2004, Palomino is getting a little long in the tooth, so it's interesting to know whether or not an upgrade may be worthwhile. Our old system also contains a GeForce Ti 4200 and 512 MB of DDR266 (PC2100) memory. We will upgrade the CPU (to the Athlon 4 3400+) and memory (to DDR400 CAS 2) and compare that upgrade with one that simply upgrades the video card. As mentioned previously, we've done this before in many of our Gamer's Upgrade Guides. However, the gaming industry is not sitting still, and we are moving from hybrid DirectX 7/8 games to DirectX 8/9 games, which - as you will see - behave quite differently. The games you'll see tested in detail today are Halo 1.03, Return to Castle Wolfenstein: Enemy Territory, and X²- The Threat.
    [Show full text]
  • Titan X Amd 1.2 V4 Ig 20210319
    English TITAN X_AMD 1.2 Installation Guide V4 Parts List A CPU Water Block A A-1 BPTA-CPUMS-V2-SKA ..........1 pc A-1 A-2 A-2 Backplane assembly ..............1 set B Fittings B-1 BPTA-DOTFH1622 ...............4 pcs B-2 TA-F61 ...................................2 pcs B-3 BPTA-F95 ..............................2 pcs B-4 BP-RIGOS5 ...........................2 pcs B-5 TA-F60 ..................................2 pcs B-6 TA-F40 ..................................2 pcs C Accessory C-1 Hard tube ..............................2 pcs C-2 Fitting + soft tube ....................1 pc C-3 CPU set SCM3FL20 SPRING B SCM3F6 1mm Spacer Back Pad Paste Pad Metal Backplane M3x32mm Screw B-1 B-2 B-3 B-4 B-5 B-6 C C-1 Hard Tube ※ The allowable variance in tube length is ± 2mm C-2 Fitting + soft tube Bitspower reserves the right to change the product design and interpretations. These are subject to change without notice. Product colors and accessories are based on the actual product. — 1 — I. AMD Motherboard system 54 AMD SOCKET 939 / 754 / 940 IN 48 AMD SOCKET AM4 AMD SOCKET AM3 / AM3+ AMD SOCKET AM2 / AM2+ AMD SOCKET FM1 / FM2+ Bitspower Fan and DRGB RF Remote Controller Hub (Not included) are now available at microcenter.com DRGB PIN on Motherboard or other equipment. 96 90 BPTA-RFCHUB The CPU water block has a DRGB cable, which AMD SOCKET AM4 AMD SOCKET AM3 AM3+ / AMD SOCKET AM2 AM2+ / AMD SOCKET FM1 / FM2+ can be connected to the DRGB extension cable of the radiator fans. Fan and DRGB RF Remote Motherboard Controller Hub (Not included) OUT DRGB LED Do not over-tighten the thumb screws Installation (SCM3FL20).
    [Show full text]
  • SOCKETS (Zocalos)
    Instituto ITES Armado, Reparación y Mantención PC. Prof: Vladimir Zúñiga C. SOCKETS (zocalos) LGA 775 Especificaciones Tipo LGA Factores de forma Flip-chip land grid array del chip Contactos 775 Protocolo del FSB Quad-Pumped Frecuencia del 533 MT/s, 800 MT/s, 1066 FSB MT/s, 1333 MT/s, 1600 MT/s Dimesiones del 1.47 × 1.47 inches[1] procesador Procesadores Intel Pentium 4 (2.66 - 3.80 GHz) Intel Celeron D (2.53 - 3.60 GHz ) Intel Pentium 4 Extreme Edition (3.20 - 3.73 GHz) Intel Pentium D (2.66 - 3.60 GHz) Pentium Dual-Core (1.40 - 2.80 GHz) Intel Core 2 Duo (1.60 - 3.33 GHz) Intel Core 2 Extreme (2.66 - 3.20 GHz) Intel Core 2 Quad (2.33 - 3.00 GHz) Intel Xeon (1.86-3.40 GHz) Intel 'Core' Celeron (1.60 - 2.40 GHz) El zócalo LGA 775, también conocido como Socket T o Socket 775, es uno de los zócalos utilizados por Intel para dar soporte a los microprocesadores Pentium 4. Entre otros aspectos, se diferencia de los anteriores 370 (para Pentium III) y del Socket 423 y 478 (para los primeros Pentium 4) en que carece de pines. Las velocidades de bus disponibles para esta arquitectura van desde 533Mhz hasta 1600MHz. Este tipo de zócalo es el "estándar" para casi todos los procesadores de consumo de Intel para equipos sobremesa y algunos portátiles. Desde los "Celeron D" hasta los "Core 2 Duo", pasando por los "Pentium D", su principal atractivo es que los procesadores para LGA 775 carecen de pines; es decir que la placa base es la que contiene los contactos para comunicarse con el procesador.
    [Show full text]
  • HDAMA Rev.G User's Guide
    HDAMA rev.G HDAMA User’s Guide Release Date:Jul.2005 3.02 Version: Appendix BIOS Hardware Overview Setup Install Arima ServerBoard Manual COPYRIGHTS AND DISCLAIMERS ..........................................C-I ATTENTION: READ FIRST! ...................................... C-II Overview GENERAL SAFETY PRECAUTIONS .......................................C-2 ESD PRECAUTIONS ........................................................C-2 OPERATING PRECAUTIONS ................................................C-2 ABOUT THIS USER'S MANUAL ...........................................C-3 GETTING HELP ...............................................................C-3 SERVERBOARD SPECIFICATIONS ........................................C-5 SERVERBOARD LAYOUT ...................................................C-6 SERVERBOARD MAP .......................................................C-7 I/O PORT ARRAY ............................................................C-7 Hardware Installation MAP OF JUMPERS ...........................................................C-9 JUMPER SETTINGS ........................................................C-10 INSTALLING MEMORY .....................................................C-11 RECOMMENDED MEMORY CONFIGURATIONS .......................C-13 INSTALLING THE PROCESSOR AND HEATSINK ......................C-14 MAP OF SERVERBOARD CABLE CONNECTORS ...................C-16 ATX POWER CONNECTORS ............................................C-17 FLOPPY DISK DRIVE CONNECTOR ...................................C-18 PRIMARY IDE CONNECTORS ............................................C-18
    [Show full text]
  • User's Manual User's Manual
    User’s Manual (English Edition) Intel Pentium 4 Socket 478 CPU AMD Athlon/ Duron/Athlon XP Socket 462 CPU AMD Athlon 64 Socket 754 CPU ZM-WB2 Gold * Please read before installation http://www.zalman.co.kr http://www.zalmanusa.com 1. Features 1) Gold plated pure copper base maximizes cooling performance and prevents CPU blocks from galvanic corrosion 2) Intel Pentium 4 (Socket 478), AMD Athlon/Duron/Athlon XP (Socket 462),Athlon 64 (Socket 754) compatible design for broad compatibility. 3) Three types of compression fitting are offered for use with water tubes (8X10mm,8X11mm,10X13mm) * Zalman Tech. Co., Ltd. is not responsible for any damage resulting from CPU OVERCLOCKING. 2. Specifications Part No Part name Q’ ty Weight (g) Use 1 CPU block 1 447.0 CPU mountimg 2 Hand screw 2 8.0 Clip mountimg 3 Thermal grease 1 1.8 Apply to cpu core 4 Clip 1 9.6 CPU block mountimg 5 User’s manual 1 6 Clip supports 2 8.2 Socket 478 7 Clip supports A 2 5.0 Socket 462 8 Clip supports B 2 5.0 Socket 462 9 Bolts 4 0.8 Clip supports, A, B-type 10 Paper washer 1 set 7, 8 mountimg 11 Nipple 2 6.2 Socket 754 mountimg 12 Back plate 60.0 Socket 754 mountimg Fitting to 13 Fitting 3 set 8 x 10mm, 8 x 11mm, 10 x 13mm tubes NOTE 1) The maximum weight for the cooler is specified as 450g/450g/300g for socket 478/754/462 respectively. Special care should be taken when moving a computer equipped with a cooler which exceeds the relevant weight limit.
    [Show full text]
  • AMD Socket AM2 with AMD M690T Chipset Reference Schematic D D
    5 4 3 2 1 AMD Socket AM2 with AMD M690T Chipset Reference Schematic D D NOTES: Page Index Page Index ------- -------------------------------------------- ------- -------------------------------------------- 1) This schematic supports the AMD Socket AM2 CPU devices. 1 Cover Page 17 SB600 PCIe, PCI, LPC, Straps, & CPU Control 2) These are "Reference Schematics" and as such they have 2 Revision History 18 SB600 ACPI, GPIO, USB, and Audio Interfaces not been verified by an actual board build. 3 Block Diagram 19 SB SATA, IDE, SPI, and HW Management Interfaces 3) This reference schematic supports AMD M960T revision 4 Clock Structure 20 SB600 Power A12 or later. If A12 or later revision is not used, please 5 Power Configuration (1) 21 CRT Connector see your customer support representative for the 6 Power Configuration (2) 22 Broadcom Ethernet Controller necessary application notes for workarounds. 7 Reset & Voltage Sequence 23 Realtek Audio Codec C 4) This reference schematic supports SB600 revision 8 Socket AM2 HT Interface 24 LPC BIOS C A21 or later. If A21 or later revision is not used, please 9 Socket AM2 DDRII Memory Interface 25 USB Power and Connectors see your customer support representative for the 10 Socket AM2 Control & Debug 26 Power Main System, SB600 PCIe, & Other necessary application notes for workarounds. 11 Socket AM2 Power & Ground 27 Standby Power & Powergood 5) Unless otherwise specified, resistors have 5% tolerance. 12 SODIMM DDR2 28 Power for CPU Core 13 M690T HT, PCI, PCIe(R), PCIe Graphics Port 29 Power for DDR2 Memory and Interface 6) Unless otherwise specified, capacitors have 20% tolerance. 14 M690T PLL and Video Interface 30 Power M690T Core, PCIe Interface 15 M690T Power and Side Port Memory Interface 31 Unused Interfaces 16 Clock Generator IMPORTANT NOTICE: B 1.
    [Show full text]
  • Thermal and Electrical Specification of AMD Semprontm Processors
    Thermal and Electrical Specification of AMD SempronTM Processors Thermal and Electrical Specification of AMD SempronTM Processors 27 September 2004 Page 1/5 Thermal and Electrical Specification of AMD SempronTM Processors ©2004 Advanced Micro Devices Inc. All rights reserved. The contents of this document are provided in connection with Advanced Micro Devices, Inc. (“AMD”) products and are for information purposes only. AMD makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. No license, whether express, implied, arising by estoppels or otherwise, to any intellectual property rights are granted by this publication. Except as set forth in AMD’s Standard Terms and Conditions of Sale, AMD assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right. AMD MAKES NO REPRESENTATIONS OR WARRANTIES WITH RESPECT TO THE CONTENTS HEREOF AND ASSUMES NO RESPONSIBILITY FOR ANY INACCURACIES, ERRORS OR OMISSIONS THAT MAY APPEAR IN THIS INFORMATION. AMD SPECIFICALLY DISCLAIMS ANY IMPLIED WARRANTIES OF MERCHANTABILITY OR FITNESS FOR ANY PARTICULAR PURPOSE. IN NO EVENT WILL AMD BE LIABLE TO ANY PERSON FOR ANY DIRECT, INDIRECT, SPECIAL OR OTHER CONSEQUENTIAL DAMAGES ARISING FROM THE USE OF ANY INFORMATION CONTAINED HEREIN OR FOR THE PERFORMANCE OR OPERATION OF ANY PERSON’S SYSTEM, INCLUDING, WITHOUT LIMITATION, ANY LOST PROFITS, BUSINESS INTERRUPTION, DAMAGE TO OR DESTRUCTION OF PROPERTY, OR LOSS OF PROGRAMS OR OTHER DATA, EVEN IF AMD IS EXPRESSLY ADVISED OF THE POSSIBILITY OF SUCH DAMAGES.
    [Show full text]
  • Cray XT and Cray XE Y Y System Overview
    Crayyy XT and Cray XE System Overview Customer Documentation and Training Overview Topics • System Overview – Cabinets, Chassis, and Blades – Compute and Service Nodes – Components of a Node Opteron Processor SeaStar ASIC • Portals API Design Gemini ASIC • System Networks • Interconnection Topologies 10/18/2010 Cray Private 2 Cray XT System 10/18/2010 Cray Private 3 System Overview Y Z GigE X 10 GigE GigE SMW Fibre Channels RAID Subsystem Compute node Login node Network node Boot /Syslog/Database nodes 10/18/2010 Cray Private I/O and Metadata nodes 4 Cabinet – The cabinet contains three chassis, a blower for cooling, a power distribution unit (PDU), a control system (CRMS), and the compute and service blades (modules) – All components of the system are air cooled A blower in the bottom of the cabinet cools the blades within the cabinet • Other rack-mounted devices within the cabinet have their own internal fans for cooling – The PDU is located behind the blower in the back of the cabinet 10/18/2010 Cray Private 5 Liquid Cooled Cabinets Heat exchanger Heat exchanger (XT5-HE LC only) (LC cabinets only) 48Vdc flexible Cage 2 buses Cage 2 Cage 1 Cage 1 Cage VRMs Cage 0 Cage 0 backplane assembly Cage ID controller Interconnect 01234567 Heat exchanger network cable Cage inlet (LC cabinets only) connection air temp sensor Airflow Heat exchanger (slot 3 rail) conditioner 48Vdc shelf 3 (XT5-HE LC only) 48Vdc shelf 2 L1 controller 48Vdc shelf 1 Blower speed controller (VFD) Blooewer PDU line filter XDP temperature XDP interface & humidity sensor
    [Show full text]
  • AMD Multi-Core Processors Providing Multiple Benefits for the Future
    hard hat area | white paper AMD Multi-Core Processors Providing Multiple Benefits For The Future y now you probably have heard of variations this year. In 2007 the chipmakers (page 50). This month, we’ll focus on what dual- and multi-core processors. expect to introduce several multi-core AMD has planned for 2006 and beyond. B Both AMD and Intel released chips, beginning with quad-core offerings. dual-core chips in 2005, and both have We discussed Intel’s multi-core proces- Dual-Core Chips plans to release dozens more dual-core chip sors in the January 2006 issue of CPU In April 2005, AMD released its first dual-core chip aimed at the server and workstation market, the Opteron proces- Direct Connect Architecture vs. sor. There are several Opteron dual-core Legacy Systems 90nm processors ranging in clock speeds from 1.6GHz to 2.4GHz. Direct Connect Architecture lives up to its name by providing a for the past few years in its single-core chips. direct connection between the processor, the memory But now AMD has extended the use of Direct Connect Architecture to controller, and the I/O area to improve overall system connect the cores on a dual- or multi-core chip die and to connect each performance. AMD has used Direct Connect Architecture core to its memory controller. ▲ With multi-core architecture, each core on the chip has its own memory con- When using a dual-processor x86 legacy architecture, troller, which significantly improves memory performance. Using Direct Connect however, two processors then have to share the same Architecture to make a connection with the memory controller eliminates most memory control hub, which creates bottlenecks in data bottlenecks and makes multitasking easier.
    [Show full text]
  • User's Manual
    User’s Manual (English version) CNPS9500 Intel Pentium 4 Socket 478 CPU Intel Dual Core Pentium/Pentium 4 Socket 775 CPU AMD Sempron/AMD64 (Athlon 64 X2/Opteron/Athlon 64) Socket 754/939/940 CPU * Applies to all versions of CNPS9500. * Please read before installation. http://www.zalman.co.kr http://www.zalmanusa.com 1. Features 1) 100% copper heatsink with aerodynamically optimized “tunnel” design for maximum cooling efficiency. 2) Innovative and patented, curved heatpipe design for a heat transfer capacity of up to 6 heatpipes with just 3. 3) Optimized heatsink layout for maximum cooling efficiency with minimal materials. 4) 0.2mm ultra-slim fins for minimized weight and reduced airflow resistance. 5) Ultra quiet CNPS 92mm opaque fan with blue LEDs. 6) Aerodynamically optimized heatsink for smoother airflow and minimal noise. 7) Compatible CPUs (Refer to “7. Compatible CPUs” on page 3. for more information.) - Intel : All Dual Core Pentium CPUs (Socket 775) All Pentium 4 CPUs (Socket 775/478) - AMD : All Dual Core AMD Athlon 64 X2 CPUs (Socket 939) All AMD Sempron/AMD64 CPUs (Socket 754/939/940) 8) Adjustable fan speed controller (FAN MATE 2) enables control of noise and fan speed. 2. Specifications 1) Flower Heatsink (FHS) Spec. Model CNPS9500 Materials Pure Copper Weight(g) 530(1) Thermal Resistance Silent Mode 0.16 (°C/W ) Normal Mode 0.12 Dimensions (mm) 85(L) X 112(W) X 125(H) Dissipation Area (㎠) 3,698 2) Fan - Bearing Type : 2-Ball - Rotation Speed : 1,350RPM ± 10 % (Silent Mode) 2,600RPM ± 10 % (Low-noise Mode) - Noise (dB) : 18.0dB ± 10% (Silent Mode) - measured at 1m from noise source 27.5dB ± 10% (Low-noise mode) - measured at 1m from noise source 3) FAN MATE 2 - Output Voltage : 5V ~ 11V ± 2 % - Allowable Power : 6W or lower (Note 1) The maximum weight for a cooler is specified as 450g for Intel Socket 775 and AMD Socket 754/939/940.
    [Show full text]
  • Archana Subramanian Nikhat Farha
    Archana Subramanian Nikhat Farha Application with multiple threads running within a process. Ability of a program or operating system to manage its use by more than one user at a time. Manage multiple requests without having multiple copies of the same program. Processes are insulated from each other by the operating system. Error in one process cannot bring down another process. Operating system keeps track of the tasks and goes from one task to the next without loss of information. PROCESS THREAD Executable object in an container, Stream of instruction within a an application process. Processes do not share memory Threads share the same memory Message passing. Inter thread communication. Security Speed Hybrid design of Multi threading and Multi processing leads to efficient parallel capability of Hardware Statement “The number of transistors on a chip will roughly double each year.” “Computer performance will double every 18 months.” 1st generation: • 1971: Intel 4004 (2300 transistors) • 1974: Intel 8080 (4500 transistors) Instruction processing was strictly sequential. Instructions were fetched, decoded and executed strictly one at a time 2nd generation: • 1979: Motorola MC68000 (68000 transistors) Primitive pipelining with three stages: fetch, decode, execute; only one instruction is in execution at a certain time 3rd generation: • 1984: Motorola MC68020 (240000 transistors) Five stage pipeline; increased parallelism 4th generation: • 1990: MotorolaMC88110, Intel 80960 - these are RISCs (over 1 Million transistors) • PowerPC604, Pentium Superscalar architectures; parallel execution based on multiple pipelines and functional units 5th generation: • 1996: P6, PowerPC 620 (over 5 Million transistors) • MIPS R10000, AMD K5/K6, UltraSparc (not exactly out of order) Superscalars with out of order execution and sophisticated scheduling and renaming strategies VLIW VLIW (very large instruction word) - a compiler schedules the instructions statically (instead of dynamic scheduling as with superscalars).
    [Show full text]
  • Supermicro H8DME-2
    Supermicro H8DME-2 Key Features 1. Dual AMD® Opteron™ 2000 Series (Socket F) Support, 1000 MHz HyperTransport Link 2. nVidia MCP55 Pro / NEC uPD720400 Chipset 3. Up to 32GB DDR2 667 SDRAM Up to 32GB DDR2 533 SDRAM Up to 64GB DDR2 400 SDRAM 4. Dual-port Gigabit LAN/Ethernet Controller 5. 6 SATA2 3.0Gb/s HDD Support 6. 2 x8 PCI-e, 2 64-bit 133/100MHz PCI-X, 2 64-bit 100MHz PCI-X 7. ATI ES1000 Graphics 8. SIMLC IPMI 2.0 Support 9. 8 Fan Support with Speed Control Product SKUs Chassis ( Optimized for H8DME-2 ) MBD-H8DME-2- • H8DME-2 (Standard Retail Pack) O • CSE-825TQ-560LPV * • CSE-825TQ-R700LPV * MBD-H8DME-2- • H8DME-2 (Bulk Pack) B 2U Chassis * Please use air-shroud MCP-310-00025- 01 Physical Stats (Air-shrouds sold separately) • CSE-745TQ-800 • Extended ATX Form Factor • CSE-745TQ-R800 • CSE-745TQ-700 • 12" x 13.05" (30.5cm x 33.2cm) • Dimensions CSE-745TQ-R700 Rackmount • CSE-743TQ-R760 Tower / 4U • CSE-743T-R760 Processor/Chipset • CSE-743i-R760 • CSE-743T-650 • Dual 1207-pin Socket F • CSE-743i-650 • Supports up to two AMD Opteron™ 2000 Series (Socket F) processor(s) CPU • • Dual-core Support To ensure system stability, a 420W (minimum) ATX power supply Important [ 4-pin (+12V), 8-pin (+12V) and 24- • 1000MHz HyperTransport Chassis Notes pin are required] System Bus • nVidia MCP55 Pro Chipset • NEC uPD720400 Expansion Slots • 2 x8 PCI-e slots • System Memory 1 SEPC (Supermicro extended Power Connector) slot for 2U active PCI-Express • riser cards with a power extension Sixteen 240-pin DIMM sockets (i.e.
    [Show full text]