Photomask Japan 2015 Oral Presentations (as of April 10)

Session Session Program Date Session Title Presentation Title Name Affiliation time No. No. 1-1 Photomasks for FPD Mr. Yasuhiro Kanaya Japan Display Inc. (Invited) Enabling the future registration requirements needed for 1-2 effective production of the most advanced displays by using a Mr. Mikael Lars Wahlsten Mycronic 13:00- April 20 FPD Photomasks combination of the Prexision-80 and the Prexision-MMS 14:40 １ 1-3 Latest technology trends of FPD Photomask Mr. TORU KUZUWA SK-Electronics CO., LTD.

1-4 Impact of the back side flatness of a mask on the panel overlay Mr. Daisuke Kemmochi HOYA CORPORATION Photomask Japan 2015 Oral Presentations (as of April 10)

Session Session Program Date Session Title Presentation Title Name Affiliation time No. No. 9:10- 2-1 Keynote Lecture Mask challenges in complementary EUV/193i patterning Mr. Mark Phillips Intel Corporation 9:40 ２ (Invited) Contact Hole Multiplication using Grapho-Epitaxy Directed Self- 3-1 Assembly: process choices, template optimization, and Dr. Joost Bekaert imec 9:40- (Invited) DSA placement accuracy 10:30 3 N7 logic Via patterning using templated DSA: Implementation 3-2 Dr. Joost Bekaert imec aspects 4-1 Mask data processing in the era of multibeam writers Mr. Frank E. Abboud Intel Corporation (Invited) 4-2 Progress of Electron Multi-Beam Mask Writer Dr. Platzgummer Elmar IMS 10:50- (Invited) 4 Writing Technologies 12:30 4-3 Correction of Resist Heating Effect on VSB Mask Writer Ms. Mizuna Suganuma NuFlare Technology

Investigation of local registration performance of IMS 4-4 Dr. Daniel Chalom IMS Nanofabrication Nanofabrication's Multi-Beam Mask Writer The method of quartz damage recovery in the photomask repair 5-1 Mr. Hoon Namkung SK Hynix April 21 process Demonstration of Parallel Scanning Probe Microscope for High 5-2 Dr. Hamed Sadeghian TNO 12:55- Photomask Fabrication Throughput Photomask Metrology 5 15:15 Processes 5-3 Multi-beam SEM technology for ultra-high throughput Dr. Thomas Kemen Carl Zeiss Microscopy GmbH

Development of high-transmittance phase-shift mask 5-4 Mr. Won-Suk Ahn SAMSUNG ELECTRONICS fabrication for immersion ArF lithography 6-1 Model-Based Data Preparation and Verification for Mask Mr. Patrick Schiavone Aselta (Invited) Manufacturing Model-based dose MPC for advanced VSB and multi-beam 6-2 Mr. Peter Buck Mentor Graphics Corporation mask lithography 15:35- 6 MDP&OPC 6-3 Pitch-based pattern splitting for 1D layout Mr. Ryo Nakayama Canon Inc. 17:25 High performance ILT for hotspots repair with hierarchical 6-4 Mr. Kyohei Sakajiri Mentor Graphics Corporation pattern matching Challenges and requirements of mask data processing for Samsung Electronics Co., 6-5 Dr. Jin Choi multi-beam mask writer Ltd Photomask Japan 2015 Oral Presentations (as of April 10)

Session Session Program Date Session Title Presentation Title Name Affiliation time No. No. 8-1 Mask Complexity : The Panel Discussion Mr. Naoya Hayashi Dai Nippon Printing Co., Ltd. (Invited) 8-2 30 years of R&D of EUVL and its mask inspection technologies Prof. Hiroo Kinoshita University of Hyogo (Invited) 9:00- 8 EUVL Masks(1) Phase Imaging Results of Phase Defect Using Micro Coherent 10:40 8-3 Dr. Tetsuo Harada University of Hyogo EUV Scatterometry Microscope

Mask blank defect printability comparison using optical 8-4 Dr. Pawitter Mangat GLOBALFOUNDRIES mask/wafer inspection and bright field actinic mask inspection

EUV scanner printability evaluation of natural blank defects 9-1 Mr. Noriaki Takagi EIDEC detected by actinic blank inspection

9-2 ENDEAVOUR to Understand EUV Buried Defect Printability Mr. Kazunori Seki Toppan Photomasks, INC. 11:00- 9 EUVL Masks(2) 12:20 Defectivity evaluation of EUV reticles with etched multilayer 9-3 Mr. Rik Jonckheere imec image border by wafer printing analysis Alternative EUV mask technology to compensate for mask 3D imec, Kapeldreef 75, B-3001 9-4 Dr. Lieve Van Look April 22 effects Leuven, Belgium The impact of mask topography induced phase effects and their 10-1 mitigation by absorber optimization for ArFi and EUV Dr. Jo Finders ASML (Invited) lithography 10-2 EUV pellicle development update Dr. Carmen Zoldesi ASML Netherlands 13:20- 10 EUVL Masks(3) 14:50 Grid-supported EUV pellicles: a theoretical investigation for 10-3 Dr. Florian DHALLUIN ASML added value Impact of the deformed extreme ultraviolet pellicle in terms of 10-4 Ms. In-Seon Kim Hanyang University critical dimension uniformity Patterned mask inspection technology with Projection Electron EUVL Infrastructure 11-1 Microscope (PEM) technique for 11 nm half-pitch (hp) Mr. Ryoichi Hirano Development Center, Inc. generation EUV masks

11-2 Pattern inspection of etched multilayer EUV mask Dr. Susumu Iida EIDEC 15:10- 11 EUVL Masks(4) 16:30 Analysis of a low-aspect phase defect for actinic EUVL mask 11-3 Dr. Takeshi Yamane EIDEC blank inspection

11-4 Detection capability of Actinic Blank Inspection tool Mr. Tomohiro Suzuki Lasertec corporation