DOCSLIB.ORG

SPIE Photomask Technology Advance Program

Total Page：16

File Type：pdf, Size：1020Kb

Download full-text PDF Read full-text

Load more

Register Today This program is current as of 17 June 2010. Please visit spie.org/pmadvance for event updates, travel, and registration information. he premier optical sciences and technology memeetingete ing Connecting minds for global solutions Connecting minds for global solutions The premier meeting for the photomask industry • Mask Infrastructure • Mask Integration • Emerging Mask Technology • Patterned Media Advance Technical Program The international technical group of SPIE dedicated to the advancement of photomask technology Conferences + Courses: 13-16 September 2010 Exhibition: 14-15 September 2010 Monterey Conference Center and Monterey Marriott Hotel Monterey, California, USA Showcase your results When you present your research at SPIE Photomask Technology it is exposed to a forum of leaders in photomask from around the world. This showcases your results and gives you immediate feedback from an audience of your peers. Collaborate with your Participate in colleagues SPIE Photomask Technology provides the largest and the perfect environment to enhance your professional value. Experience a rich most important marketplace of ideas, an audience of technical experts, and a dynamic atmosphere that worldwide supports professional networking. technical event Publish your research Within days or weeks of presentation your work will be published in the SPIE Digital Library in the photomask and be distributed through leading scientifi c databases and indexes. Your work will become industry. part of the scientifi c literature of the world. U.S. Patent literature cites over 40,000 SPIE publications, with 161 universities and 2,785 non-academic organizations from 43 different countries citing SPIE papers. Advance Technical Program Conferences + Courses: 13-16 September 2010 Exhibition: 14-15 September 2010 Monterey Conference Center and Monterey Marriott Hotel Monterey, California, USA Contents Exhibition . 2 Invitation . 3 Special Events . .4-5 Special Session on E-Beam/Direct-Write . 5 Photomask Reception . 5 Daily Schedule . 6 Sponsors . 6 Conference . 7-12 Proceedings . .12 Courses . .13–15 Registration Information . .16–17 Keynote Presentation The Future is Bright for Those with Open Eyes Tuesday 14 September, 8:10 to 8:50 am Franklin Kalk, Executive Vice-President, Technology Toppan Photomasks Don’t miss this exciting opening Keynote on Tuesday morning. Visit the SPIE Photomask Technology website to make your time in Monterey a success! Everything you need to know about the conference and location is available online. Up-to-date paper listings and session times Use the My Schedule tool to build a custom, printable schedule Updated lists of exhibiting companies and activity on the show fl oor Hotel, travel, and registration information And more! Register today and save spie.org/pmadvance spie.org/pmadvance 1 TEL:TEL: +1 SPIE360 676 Photomask 3290 · Technology+1 888 504 2010 8171 · · spie.org/[email protected]@spie.org 1 MAKE TIME FOR THE FREE EXHIBITION Monterey Conference Center · Serra Ballrooms Exhibition Dates: 14 – 15 September 2010 Tuesday-Wednesday · 10:00 am to 4:00 pm Tuesday Poster Reception · 6:15 to 7:45 pm Photomask 2010 Exhibitor List New and returning companies confi rmed for 2010 are highlighted in boldface. (Current as of 5/25/2010) Advantest Corporation n&k Technology, Inc. Applied Materials, Inc. Nippon Control System Corp. See the latest in: Beam Services, Inc. Park Systems Inc. Carl Zeiss SMS GmbH Plasma-Therm LLC · Electron-beam lithography Corning Inc. Pozzetta Products, Inc. Cyantek Corp. RAVE LLC · EUV Gudeng Precision Industrial Co., Ltd. Semiconductor International · Metrology Hamatech USA, Inc. Magazine Heidelberg Instruments Inc. Shin-Etsu MicroSi, Inc. · Lasers Hitachi High Technologies America, Inc. Sigmameltec Ltd. · Nanotechnology Infi nite Graphics Incorporated SII NanoTechnology Inc. · Optical/laser microlithography Inko Industrial Corp. SoftJin Technologies Pvt. Ltd. KLA-Tencor Corp. Synopsys, Inc. · Resist technology and KM ACT Corp. TOOL Corp. processing Mentor Graphics Corp. XEI Scientifi c, Inc. · Software Micro Lithography, Inc. XYALIS Micronic Laser Systems AB · Electronic imaging components Mitsui Chemicals America, Inc. SPIE Sales [email protected] Tel +1 360 676 3290 2 SPIESPIE Photomask Technology 2010 · spie.org/pmadvancespie.org/pmadvance BACUS Steering Committee Plan now to Attend Frank E. Abboud, On behalf of SPIE, BACUS, and the Organizing Committee, we invite you to at- Intel Corp. tend the 29th Annual SPIE/BACUS Photomask Symposium. Photomask Technol- Paul W. Ackmann, ogy continues to be the premier worldwide technical meeting for the photomask GLOBALFOUNDRIES Inc. industry. This year’s symposium will give the authors an opportunity to present their exciting research fi ndings that relate to the emerging technical challenges facing Michael D. Archuletta, the photomask industry, to an international audience of their peers. RAVE LLC Artur P. Balasinski, Cypress This year we will open on Tuesday with the Keynote Presentation by Dr. Franklin D. Semiconductor Corp. Kalk, Toppan Photomasks, titled, The Future is Bright for Those with Open Eyes. Dr. Kalk will certainly have insight into the photomask industry, so you won’t want Uwe F. W. Behringer, UBC to miss his presentation! Microelectronics (Germany) Peter D. Buck, We have received 144 presentations this year, so it should be a very informative Toppan Photomasks, Inc. week. The all-day Wednesday Special Session is on EBDW/ML2: 13.5 Nanometer Brian Cha, or 17.3 Picometer?: not enough R&D $s to go around? From ‘Plenty, but Never SEMATECH North Enough’ to ‘Badly Needed’: are we funding the right technology/wavelength? Our Co-Chairs Brian Grenon and Wolf Staud have solicited the contributions of Thomas B. Fauer, industry luminaries on the various subjects and challenges that ML2 is facing: start- IBM Corp. ing with Burn Lin, TSMC [Keynote Speaker], Hans Pfeiffer [historical background], Brian J. Grenon, Neil Berglund [CoO], Aki Fujimura, [Invited: Design challenges], David Lam, Grenon Consulting, Inc. [Complimentary Lithography], Tor Sandstrom [platform], Laurent Pain [datapath] and many more tool and sub-system suppliers to give you a great program on this Naoya Hayashi, more than viable alternative. Dai Nippon Printing Co., Ltd. (Japan) We hope that you will be joining us in beautiful Monterey. Not only will you have a Mark T. Jee, great experience attending the sessions, you can also plan on staying on for a few HOYA Corp. USA days in the City by the Bay! Wilhelm Maurer, Conference Chair Infi neon Technologies AG (Germany) M. Warren Montgomery M. Warren Montgomery, College of NanoScale Science and Engineering CNSE/SEMATECH (CNSE) and SEMATECH Inc. Emmanuel Rausa, Plasma-Therm LLC Douglas J. Resnick, Molecular Imprints, Inc. Conference Co-Chair Steffen F. Schulze, Mentor Graphics Corp. Wilhelm Maurer Infi neon Technologies AG (Germany) Wolf Staud, Applied Materials, Inc. J. Tracy Weed, Synopsys, Inc. John M. Whittey, KLA-Tencor Corp. Banqiu Wu, Applied Materials, Inc. Larry S. Zurbrick, Agilent Technologies, Inc. SPIE would like to express its deepest appreciation to the symposium chairs, conference chairs, program committees, session chairs, and authors who have so generously given their time and advice to make this symposium possible. The symposium, like our other conferences and activities, would not be possible without the dedicated contribution of our participants and members. This program is based on commitments received up to the time of publication and is subject to change without notice. TEL: +1 360 676 3290 · +1 888 504 8171 · [email protected] 3 Special Events Keynote Presentation The Future is Bright for Those with Open Eyes Tuesday 14 September 8:10 to 8:50 am Dr. Franklin Kalk is Toppan Photomasks’ executive vice president of Technology, with responsibility for the company’s global R&D programs. His recent interest is the effect of next generation lithography on semiconductor industry business models. He is widely published and Franklin Kalk, holds 18 U.S. patents. He received a Ph.D. in Optics from the University Executive Vice-President, of Rochester. Technology Toppan Photomasks Don’t miss this exciting opening Keynote. Poster Viewing Exhibition/Poster Reception Tuesday 14 September . 10:00 am to 4:00 pm, and 6:15 to 7:45 pm Monterey Conference Center, Serra Grand Ballroom Wednesday 15 September . 10:00 am to 3:00 pm Tuesday 14 September . 6:15 to 8:15 pm Poster Reception Beer Poster authors may set up their poster papers between 10:00 am and 4:00 pm on Tuesday and will leave them up until Wednesday afternoon. Sponsored by Authors will be present during the Poster Reception 6:15 to 7:45 pm Tuesday to answer questions and provide in-depth discussion regard- ing their papers. Any papers not removed by Wednesday at 3:00 pm Symposium attendees and guests are invited to attend an Exhibition/ will be considered unwanted and will be discarded. SPIE assumes no Poster Reception on Tuesday evening in the Serra Grand Ballroom. The responsibility for papers left up after Wednesday at 3:00 pm. reception provides an opportunity for attendees to meet colleagues, network, view poster papers, and visit the exhibition booths. Refresh- ments will be served. Attendees are requested to wear their conference registration badges. SPIE Green Initiative As host to events that bring together scientists and engineers from around the globe, SPIE is committed to making our symposia as environmentally
Recommended publications
  • High-End EUV Photomask Repairs for Advanced Nodes

    High-End EUV Photomask Repairs for Advanced Nodes

    High-end EUV Photomask Repairs for advanced nodes Dr. Michael Waldow Product Manager vZTech - Virtual SMS Tech Conference, 18.05.2021 Agenda 1 Introduction 2 High-end EUV photomask repairs 3 Summary Carl ZEISS SMT GmbH, Dr. Michael Waldow, Semiconductor Mask Solutions 18.05.2021 2 Agenda 1 Introduction 2 High-end EUV photomask repairs 3 Summary Carl ZEISS SMT GmbH, Dr. Michael Waldow, Semiconductor Mask Solutions 18.05.2021 3 Introduction EUV High-Volume manufacturing ramping up SAMSUNG newsroom C. C. Wei – TSMC - CEO & Vice Chairman* MAY 21, 2021 JULY 16, 2020 “…new production line in Pyeongtaek, Korea…will produce 14- ‚Next, let me talk about our N5 ramp up and N4 introduction. N5 is the foundry nanometer DRAM and 5-nanometer logic, …based on EUV...” industry's most advanced solution with best PPA. N5 is already in volume Anandtech.com - APRIL 02, 2021 production with good yield, while we continue to improve the “… South Korea authorities this week gave SK Hynix a green light to build We are seeing robust productivity and performance of the EUV tools. a new, 120 trillion won ($106.35 billion) fab complex…. using demand for N5 and expect a strong ramp of N5 in the second half of this year, driven by both 5G smartphones and HPC applications.‘ process technologies that rely on extreme ultraviolet lithography (EUV)…’ ▪ EUV is becoming more and more important and Intel: The Empire Strikes Back** MAY 21, 2021 amount of EUV lithographic layers is rising ‚while the outlook on EUV was still quite uncertain. Hence, Intel's initial 7nm ▪ First consumer products based on EUV seems to have used EUV quite conservatively, in relatively few layers.
  • Gray-Scale Photolithography Using Microfluidic Photomasks

    Gray-Scale Photolithography Using Microfluidic Photomasks

    Gray-scale photolithography using microfluidic photomasks Chihchen Chen, Danny Hirdes, and Albert Folch* Department of Bioengineering, University of Washington, Seattle, WA 98195 Edited by George M. Whitesides, Harvard University, Cambridge, MA, and approved December 23, 2002 (received for review September 23, 2002) The ability to produce three-dimensional (3D) microstructures is of Here we demonstrate a type of gray-scale photomasks that increasing importance in the miniaturization of mechanical or allow for patterning large areas (Ͼ3 inches in diameter) using fluidic devices, optical elements, self-assembling components, and standard photolithographic equipment (i.e., a contact mask tissue-engineering scaffolds, among others. Traditional photoli- aligner with a collimated UV source). Our photomasks contain thography, the most widely used process for microdevice fabrica- light-absorbing features that are liquid (i.e., dyes) and can be tion, is ill-suited for 3D fabrication, because it is based on the addressed (i.e., altered) by means of microfluidic channels. We illumination of a photosensitive layer through a ‘‘photomask’’ term them ‘‘microfluidic photomasks’’ (␮FPMs). The ␮FPMs (a transparent plate that contains opaque, unalterable solid-state are advantageous in that (i) they contain a virtually unlimited features), which inevitably results in features of uniform height. number of gray scales as given by variations in dye concentration, We have devised photomasks in which the light-absorbing fea- (ii) they can be manufactured rapidly and inexpensively, and tures are made of fluids. Unlike in conventional photomasks, the (iii) the fluidic patterns can be changed in the time scale of a opacity of the photomask features can be tailored to an arbitrary few seconds, thus allowing for rapid reconfiguration of the number of gray-scale levels, and their spatial pattern can be photomask.
  • Integrated Circuit (Ic) and Photomask Images Processing Technology

    Integrated Circuit (Ic) and Photomask Images Processing Technology

    INTEGRATED CIRCUIT (IC) AND PHOTOMASK IMAGES PROCESSING TECHNOLOGY A. Doudkin, D. Vershok Laboratory of System Identification of United Institute of Informatics Problems of NASB, 6, Surganova str., BY-220012, Minsk, Belarus e-mails: doudkin{vershok}@newman.bas-net.by Abstract. The integrated circuit and photomask images processing technology is proposed. This technology allows to perform the restoration of the integrated-circuit metallization layout and the mask artwork from the images of IC metallization layers or photomask set correspondingly. It can be applied for the tasks of integrated circuits redesign and automated visual inspection of integrated circuits and photomask production. 1. Introduction The modern semiconductor manufacturing needs to control all of the critical process modules that drive IC manufacturing success. Several factors inherent in the semiconductor industry drive the critical need for comprehensive yield management and process control solutions. Among the most significant of these are: increasing device complexity; shrinking geometries; reduced product life cycles. The visual or optical inspec- tion is the important part of such control solutions. It implies the presence of some operative analysis system [1] providing image registration, visual information processing and analysis. In this paper the main attention is paid to image processing technology which was developed for this sort of the systems. 2. Problem formulation The proposed technology has the following objectives: 1 restoration of the integrated-circuit metalli- zation layout from the images of IC metallization layers; 2 restoration of the mask artwork from the images of photomask set. Thus, the objects of processing are raster patterns of IC metallization layers and IC pho- tomasks, represented as the collection of partially overlapping images (frames) without any reference marks (Fig 1.).
  • Fundimentals of Photolithography

    Fundimentals of Photolithography

    FUNDIMENTALS OF PHOTOLITHOGRAPHY One of the most widely used methods for creating nanoscale circuit components is Photolithography. The word lithography is derived from the Greek words lithos (stone) and graphein (to write) and finds its roots in a process invented by Aloys Senefelder in 1796. By treating a piece of limestone with certain chemicals, Senefelder was then able to transfer an image carved into the stone onto a piece of paper. This was done by coating certain parts of the porous limestone with a water repellant substance. When ink was applied to the stone it would only adhere to the untreated hydrophilic areas, and hence the image carved into the rock could be transferred repeatedly onto paper. Senefelder's technique is still used in some artistry applications today. As time progressed and technology improved, lithography methods evolved. In the 1820's a French scientist by the name of Nicephore Niepce developed the first photoresist, a component fundamental to photolithography. A photoresist is a substance that undergoes a chemical reaction when it is eXposed to light. Niepce's photoresist was a material known as Bitumen of Judea, a kind of naturally occurring asphalt. A sheet of stone, metal, or glass was coated with a thin layer of this bitumen, which became less soluble where it was eXposed to light. Areas that were uneXposed could then be removed using a solvent, and the resultant exposed areas of the sheet were etched using a chemical bath. After the remaining photoresist was removed, the sheet could then be used as a printing plate. Photolithography today is in many ways similar to the original process invented by Niepce.
  • Anti-Slavery Performance in 2016 | First Edition

    Anti-Slavery Performance in 2016 | First Edition

    Corporate Compliance with the California Transparency in Supply Chains Act: 1 Anti-Slavery Performance in 2016 Copyright © Development International 2017 When citing this publication please use the following information: Authors: Chris N. Bayer and Jesse H. Hudson Title: Corporate Compliance with the California Transparency in Supply Chains Act: Anti-Slavery Performance in 2016 Version: First Edition Date published: March 7, 2017 The views expressed in this report are solely those of the authors. Furthermore, the information contained in this document should not be construed as legal advice. In case of questions please contact: Chris N. Bayer, PhD at <[email protected]>. Funded by: iPoint-systems gmbh www.ipoint-systems.com Corporate Compliance with the California Transparency in Supply Chains Act: 2 Anti-Slavery Performance in 2016 Foreword “With every dollar that we spend, we vote for the world we want.” – Diane Osgood, Economist and expert on social impact economics As UN Goodwill Ambassador against trafficking and slavery in 2005, my first trip was to visit Lake Volta in Ghana – the second largest man-made lake in the world. When children’s dead bodies began washing up on the lake’s shores, locals raised alarm and took action. I met with them, and with children who’d been bought, sold, beaten, famished, raped, abused and forced to dive in fear of their lives, to catch fish larger than their arm-span, and disentangle nets caught on the branches of trees that no one bothered to clear from the lake. And as I walked away, I uneasily asked if the fish was ever sold in Europe.
  • Contact Photolithography

    Contact Photolithography

    Contact Photolithography Overview Contact photolithography is performed using a Mask Aligner. A mask aligner has two main tooling structures: the Mask Holder and the Wafer Chuck. The mask holder is machined to have an extremely flat surface, and the photomask is held in place on this surface by vacuum. The wafer chuck, which is also machined to be very flat, holds the wafer in place also by using vacuum. This tooling is carefully mounted so that during operation the surfaces of the two parts are kept parallel to each other. The wafer chuck can be moved up to the mask holder in order to bring the wafer into contact with the photomask using variable force. The wafer chuck surface position can also be adjusted to be as planar as possible with the mask in order to yield the best results; this is called Wedge Error Compensation. Once the wafer and mask are positioned an exposure can be performed by opening a shutter on the Lamp Housing. Inside the lamp housing there is a Mercury (Hg) arc lamp and associated optics which will allow a selected controlled band of UV light to expose the mask and wafer. There is an optical system incorporated into the tooling which can be used to view alignment marks on the wafer through complimentary marks on the photomask. Micrometers on the wafer chuck tooling allow the operator to move the wafer into alignment with the mask before exposure. Mask aligners are typically manually operated but some versions are nearly fully automated. Design Contact photolithography has the advantage of exposing the entire wafer surface in one process cycle.
  • 2019 Corporate Responsibility Report

    2019 Corporate Responsibility Report

    TABLE OF CONTENTS 01 COMPANY PROFILE 07 COMMUNITY ENGAGEMENT 02 CEO STATEMENT 08 SUSTAINABLE MANUFACTURING 03 GOVERNANCE 09 PRODUCT STEWARDSHIP 04 STAKEHOLDER ENGAGEMENT 10 SITE PROFILES 05 SUPPLIER RESPONSIBILITY 11 ABOUT THIS REPORT 06 OUR PEOPLE AND WORKPLACE 12 GRI CONTENT INDEX GLOBALFOUNDRIES | CORPORATE RESPONSIBILITY REPORT 2019 BACK | MENU | NEXT 2 01 COMPANY PROFILE We are GLOBALFOUNDRIES, a leading full- While execution excellence remains our Today, GF operates manufacturing facili- service foundry delivering truly differentiated first priority, we are more than a manufac- ties in Dresden, Germany; Malta and East semiconductor solutions, created ten years turer. We are the catalyst for growth in the Fishkill, New York; Burlington, Vermont; and ago with an integral commitment to social and industries we serve. With one of the largest Singapore. GF’s corporate offices are in Santa environmental responsibility and dedicated to populations of leading-edge scientists Clara, California (Silicon Valley) with a global ethical and responsible business practices. and technologists in the semiconductor network of R&D, design enablement, and manufacturing industry, we make possible customer support operations (please refer to GF provides a unique combination of design, the technologies and systems that trans- the map “Company Locations”). GF is owned development, and fabrication services for a form industries. We are dedicated to being by Mubadala Investment Company, which is range of high-growth markets. With a manu- the best possible partner for our clients, owned by the Government of Abu Dhabi. facturing footprint spanning three continents, delivering the expertise and insights to GF has the flexibility and agility to meet the help position them as the leaders in their 2019 marks the tenth anniversary of the dynamic needs of clients across the globe.
  • An Empirical Study of Photomask Manufacturing Productivity

    An Empirical Study of Photomask Manufacturing Productivity

    Benchmarking the Productivity of Photomask Manufacturers C. Neil Berglund and Charles M. Weber Charles Weber (primary corresponding author) Department of Engineering and Technology Management Portland State University P.O. Box 751 Portland, Oregon 97207-0751 Phone: 503 725 8133 Facs: 503 725 4667 Email: [email protected] Neil Berglund Department of Engineering and Technology Management Portland State University P.O. Box 751 Portland, Oregon 97207-0751 Phone: 503 725 4660 Facs: 503 725 4667 Email: [email protected] Page 1 of 27 Benchmarking the Productivity of Photomask Manufacturers C. Neil Berglund1 and Charles M. Weber1, 1Portland State University-ETM, Portland, Oregon, 97207-0751, USA ABSTRACT A survey-based, empirical study that benchmarks the productivity of photomask manufacturers has led to some significant conclusions. Firstly, the wide variation in the productivity indicators from company to company suggests that all participants may have significant cost-reduction opportunities within their operations -- even among the best performers capital is underutilized. Secondly, the high downtime of pattern generation tools is limiting productivity. Thirdly, producing smaller feature sizes is correlated to an investment in engineering and experimentation capacity. It could not be confirmed that photomask manufacturers are successfully taking advantage of economies of scale, suggesting that the outlook for profitability of many photomask manufacturers is precarious. Keywords: Benchmarking, Photomask, Manufacturing, Productivity 1. INTRODUCTION For the past four decades, Moore’s Law [1], which states that the number of transistors that can be built into a given amount of chip space will double every 12 to 18 months, has been driving the dimensions of merit for semiconductor manufacturing and its enabling technologies.
  • SPIE Photomask Conference 2014, 16 – 18 September, 2014 We Are Pleased to Present in Cooperation with Our Partners the Followi

    SPIE Photomask Conference 2014, 16 – 18 September, 2014 We Are Pleased to Present in Cooperation with Our Partners the Followi

    SPIE Photomask Conference 2014, 16 – 18 September, 2014 We are pleased to present in cooperation with our partners the following topics during SPIE Photomask Conference. Don´t miss it! Tuesday, Sept. 16th, 9:15 – 10:15am | EUV mask infrastructure: Don’t miss the train! - Invited Paper, Dr. Oliver Kienzle, Carl Zeiss SMS GmbH Tuesday, Sept. 16th, 1:45 – 3:35pm | Automated hotspot analysis with aerial image CD metrology for advanced logic devices, Ute Buttgereit, Thomas Trautzsch, Carl Zeiss SMS GmbH (Germany); Min-Ho Kim, Jung-Uk Seo, Young-Keun Yoon, Hakseung Han, Dong-Hoon Chung, Chan-Uk Jeon, SAMSUNG Electronics Co., Ltd. (Korea, Republic of); Gary Meyers, Synopsys, Inc. (USA) Tuesday, Sept. 16th 6:00 – 7:30pm (Poster Session) | Further beyond – Registration & Overlay Control Enhancements for Optical masks, Kujan Gorhad, Carl Zeiss SMS Ltd. (Israel); Dirk Beyer, Carl Zeiss SMS GmbH (Germany); Avi Cohen, Dan Avizemer, Erez Graitzer, Carl Zeiss SMS Ltd. (Israel); Ch. Ehrlich W. Degel, Markus Kirsch, Carl Zeiss SMS GmbH Tuesday, Sept. 16th 6:00 – 7:30pm (Poster Session) | On the benefit of high resolution and low aberrations for in-die mask registration metrology, Thomas Scherübl, Dirk Beyer, Dirk Seidel, Steffen Steinert, Sven Heisig, Susanne Töpfer, Carl Zeiss SMS GmbH Tuesday, Sept. 16th 6:00 – 7:30pm (Poster Session) | Short feedback loop for OPC model based wafer level CD, GuoXiang Ning, GLOBALFOUNDRIES Inc. (USA); Thomas Thaler, Kristian Schulz, Ute Buttgereit, Carl Zeiss SMS GmbH; Peter Philipp, Advanced Mask Technology Ctr. GmbH Co. KG (Germany); Paul W. Ackmann, Lloyd C. Litt, Chin-Teong Lim, GLOBALFOUNDRIES Inc. (USA) Wednesday, Sept.
  • Photomask Patterning for Slope-Form Deep Etching Using Deep-Reactive-Ion Etching and Gradation Exposure

    Photomask Patterning for Slope-Form Deep Etching Using Deep-Reactive-Ion Etching and Gradation Exposure

    Sensors and Materials, Vol. 26, No. 1 (2014) 31–37 MYU Tokyo S & M 0967 Photomask Patterning for Slope-Form Deep Etching Using Deep-Reactive-Ion Etching and Gradation Exposure Masaki Yamaguchi* and Yuki Nakayama Graduate School of Engineering, Iwate University, 4-3-5 Ueda, Morioka 020-8551, Japan (Received August 8, 2013; accepted November 8, 2013) Key words: deep-reactive-ion etching (DRIE), gradation exposure, silicon mold, micro-electro- mechanical systems (MEMS), microneedle The purpose of this research is to demonstrate a methodology for etching silicon to particular required depths that can be used when designing structures to manufacture microneedles. A photolithography technique was demonstrated using gradation exposure and deep-reactive-ion etching (DRIE). The entire photolithography process was carried out in two steps: (i) a photoresist pattern was transferred onto silicon dioxide using a layout mask, and (ii) a silicon mold was formed using exposure through the use of a gradation mask and DRIE. A digital gradation mask design that included 16 scales was proposed. The exposure time and thickness of the photoresist were optimized experimentally under 102 different conditions. The aspect ratio of the resist reached 19:1 and the maximum etched depth was 285 µm under conditions of 6 s exposure time and 3 µm thickness of the photoresist. It was demonstrated that the slopes formed by deep etching ranged between 0–285 µm, which is needed for microneedles to be realised by DRIE and grey-scale technology. 1. Introduction Microneedles,
  • Company Overview Valuation Data Source

    Company Overview Valuation Data Source

    Valuation Data Source company overview No. Company No. Company No. Company "Bank "Saint-Petersburg" Public 60 AbClon Inc. 117 Activision Blizzard, Inc. 1 Joint-Stock Company Abdullah Al-Othaim Markets 118 Actron Technology Corporation 61 2 1&1 Drillisch AG Company 119 Actuant Corporation 3 1-800-FLOWERS.COM, Inc. Abdulmohsen Al-Hokair Group for 120 Acuity Brands, Inc. 62 4 11 bit studios S.A. Tourism and Development Company 121 Acushnet Holdings Corp. 5 1st Constitution Bancorp 63 Abengoa, S.A. 122 Ad-Sol Nissin Corporation 6 1st Source Corporation 64 Abeona Therapeutics Inc. 123 Adairs Limited 7 21Vianet Group, Inc. 65 Abercrombie & Fitch Co. 124 ADAMA Ltd. 8 22nd Century Group, Inc. 66 Ability Enterprise Co., Ltd. 125 Adamas Pharmaceuticals, Inc. Ability Opto-Electronics Technology 126 Adamis Pharmaceuticals Corporation 9 2U, Inc. 67 Co.,Ltd. 127 Adani Enterprises Limited 10 3-D Matrix, Ltd. 68 Abiomed, Inc. 128 Adani Gas Limited 11 361 Degrees International Limited 69 ABIST Co.,Ltd. 129 Adani Green Energy Limited 12 3D Systems Corporation 70 ABL Bio Inc. Adani Ports and Special Economic 13 3i Group plc 130 71 Able C&C Co., Ltd. Zone Limited 14 3M Company 131 Adani Power Limited 72 ABM Industries Incorporated 15 3M India Limited 132 Adani Transmissions Limited 73 ABN AMRO Bank N.V. 16 3S KOREA Co., Ltd. 133 Adaptimmune Therapeutics plc 74 Aboitiz Equity Ventures, Inc. 17 3SBio Inc. 134 Adastria Co., Ltd. 75 Aboitiz Power Corporation 18 500.com Limited 135 ADATA Technology Co., Ltd. 76 Abraxas Petroleum Corporation 19 51 Credit Card Inc.
  • Photolithography Basics Photolithography Is the Process of Transferring Geometric Shapes on a Mask to the Surface of a Silicon Wafer

    Photolithography Basics Photolithography Is the Process of Transferring Geometric Shapes on a Mask to the Surface of a Silicon Wafer

    Photolithography Basics Photolithography is the process of transferring geometric shapes on a mask to the surface of a silicon wafer. The steps involved in the photolithographic process are wafer cleaning; barrier layer formation; photoresist application; soft baking; mask alignment; exposure and development; and hard-baking. Wafer Cleaning, Barrier Formation and Photoresist Application In the first step, the wafers are chemically cleaned to remove particulate matter on the surface as well as any traces of organic, ionic, and metallic impurities. After cleaning, silicon dioxide, which serves as a barrier layer, is deposited on the surface of the wafer. After the formation of the SiO2 layer, photoresist is applied to the surface of the wafer. High-speed centrifugal whirling of silicon wafers is the standard method for applying photoresist coatings in IC manufacturing. This technique, known as "Spin Coating," produces a thin uniform layer of photoresist on the wafer surface. Positive and Negative Photoresist There are two types of photoresist: positive and negative. For positive resists, the resist is exposed with UV light wherever the underlying material is to be removed. In these resists, exposure to the UV light changes the chemical structure of the resist so that it becomes more soluble in the developer. The exposed resist is then washed away by the developer solution, leaving windows of the bare underlying material. In other words, "whatever shows, goes." The mask, therefore, contains an exact copy of the pattern which is to remain on the wafer. Negative resists behave in just the opposite manner. Exposure to the UV light causes the negative resist to become polymerized, and more difficult to dissolve.