The Datasheetarchive

Total Page:16

File Type:pdf, Size:1020Kb

The Datasheetarchive STP2011PGA-50 July 1997 MSI DATA SHEET MBus-to-SBus Interface DESCRIPTION The STP2011 MBus-to-SBus Interface (MSI) provides an interface between the MBus and the SBus and controls access to the I/O subsystem. The MSI consists of two main functional blocks: the Memory Subsystem and the I/O Subsystem. The STP2011 sits between MBus and SBus and serves the following purposes: 1. MBus Arbitration The MBus arbiter supports up to five masters including the MSI itself. A parallel arbitration scheme is used by the arbiter to reduce arbitration overhead. The arbiter assumes no real-time requirement from the master devices. 2. MBus Monitoring The STP2011 monitors MBus operation. If the bus operation takes more than 200 microseconds to complete, it assumes the bus master is trying to access a non-existent device. It forces a termination and signals an error condition to the bus master. * 3. SBus Arbitration The SCSI Interface and SBus slots are SBus Master devices. A round-robin scheme is used to arbitrate for ownership of the SBus and no real-time requirement is assumed. 4. SBus Monitoring The STP2011 monitors the SBus during an access to SBus devices. If the access does not get response within 256 SBus clock cycles, the access is forced to terminate and an error is returned. Devices that have long access latency should issue an SBus retry acknowledge to allow later reconnection. 1 MSI STP2011PGA-50 MBus-to-SBus Interface BLOCK, LOGIC, AND TYPICAL APPLICATION DIAGRAMS MBus Interface SBus Interface • MBus Control Protocol • SBus Control Protocol MBus Interface SBus Interface • MBus Arbiter • SBus Arbiter • SBus Monitor Data Buffer JTAG Interface IOMMU • Internal Scan • 16 Full Assoc. Entries Test Signals Misc. Signals • Boundary Scan • LRU Replacement • TLB Flush Figure 1. STP2011 Block Diagram 64 MAD[63:0] DBRI_BR MAS DBRI_BG MBB ESC_BR e c a MERR ESC_BG f r e MRDY t 32 n I * MRTY SB_D[31:0] s u MBR[3:0] 28 B M MBG[3:0] SB_A[27:0] MCLK SB_SIZ[2:0] e MSI_INT SB_RD c a f SB_AS r STP2011 e t n SB_ACK[2:0 I ] s u B 2 SB_LERR S - k SB_BR[5:0] c JTAGDI o l JTAGTMS SB_BG[5:0] C & SB_SEL[3:0 JTAGCLK G TESTEN ] A T SB_CLK J Logical Connections SEL_ESC SEL_SEC Figure 2. STP2011 Logical Connections 2 July 1997 MSI MBus-to-SBus Interface STP2011PGA-50 SBus Device STP2011 MBus/SBus s u Interface B S MBus SBus Module Device s u B I/O Subsystem M Memory Subsystem MBus Module Figure 3. STP2011* Typical Application July 1997 3 MSI STP2011PGA-50 MBus-to-SBus Interface SIGNAL DESCRIPTIONS MBus Interface Signal Type Description MAD[63:0] I/O MBus Address, Data and Control Bus. During the address phase, MAD[35:0] contains the physical address PA[35:0]. The remaining signals MAD[63:36] on the bus contain the transaction-specific information which will be described in the MBus specification. MAS I/O MBus Address Strobe. This signal is asserted by the bus master during the very first cycle of the bus transaction. MBB I/O MBus Busy. This signal is asserted as an output during the entire transaction. MERR I/O MBus Error transaction status bit. This bit is one of the three bits used to encode the transaction status. MRDY I/O MBus Data Ready. This bit is one of the three bits used to encode the transaction status. MRTY I/O MBus Retry. This bit is one fo the three bits used to encode the transaction status. MBR[3:0] Input MBus Bus Request signal. This signal is asserted by an MBus master to acquire bus ownership. MBG[3:0] Output MBus Bus Grant signal. The MSBI determines the next owner of the MBus by the assertion of this signal. MCLK Input MBus Clock. MSI_INT Output Interrupt caused by page fault or write error. * JTAG Interface Signal Type Description JTAGDI Input JTAG Data Input. JTAGTMS Input JTAG Enable. JTAGCLK Input JTAG Clock Input. JTAGDO Output JTAG Data Output. TESTEN Input For testing pads and JTAG three-state access, low during normal operation. 4 July 1997 MSI MBus-to-SBus Interface STP2011PGA-50 SBus Interface Signal Type Description SB_D[31:0] I/O SBus Data, also some transfer information on SB_D[31:23] SB_PA[27:0] I/O SBus Physical Address, also SB_D[59:32] SB_SIZ[2:0] I/O SBus Transfer Size, also SB_D[62:60] SB_RD I/O SBus Transfer Directon, also SB_D[63] SB_AS Output SBus Address Strobe SB_ACK[2:0] I/O SBus Transfer Acknowledgment SB_LERR Input SBus Late Data Error SB_BR[5:0] Input SBus Request SB_BG[5:0] Output SBus Grant SB_SEL[3:0] Output SBus Slave Select, Expansion SBus ports SB_CLK Input SBus Clock SEL_SEC Output SBus Slave Select for STP2014 (SEC) SEL_ESC Output SBus Slave Select for SCSI/Ethernet (SEC) DBRI_BR Input DBRI Bus Request DBRI_BG Output DBRI Bus Grant ESC_BR Input SCSI/Ethernet (ESC) DVMA Request ESC_BG Output SCSI/Ethernet (ESC) DVMA Grant* SYS_RESET Input System Reset July 1997 5 MSI STP2011PGA-50 MBus-to-SBus Interface ELECTRICAL SPECIFICATIONS Absolute Maximum Ratings [1] Symbol Parameter Rating2 Units VCC DC supply voltage +7 V VIN Input voltage range GND £ VIN £ VCC V IIN DC input current ±10 mA TS Storage temperature –40 to +125 °°C 1. Operation of the device at values in excess of those listed above will result in degradation or destruction of the device. All voltages are defined with respect to ground. Functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. 2. Referenced to GND. Recommended Operating Conditions Symbol Parameter Min Typ Max Units VCC DC supply voltage 4.75 5.0 5.25 V TA Ambient temperature 0 – 70 °°°C * 6 July 1997 MSI MBus-to-SBus Interface STP2011PGA-50 DC Characteristics Symbol Parameter Conditions1 Min Typ Max Units VIH Input high voltage 4.75 < VCC < 5.25 2.0 – – V VIL Input low voltage 4.75 < VCC < 5.25 – – 0.8 V VOH Output high voltage IOH = –4.0, –8.0 mA 2.4 4.5 – V VOL Output low voltage IOL = 4.0, 8.0 mA – 0.2 0.4 V IIL Input leakage current VCC = Max, VIN = VCC or –10 ±1 10 µA GND IIPU Input pull-up current VCC = Max, VIN = GND or –175 – –2 µA 3.5 V 3-state output VCC = Max, VOUT = GND or IOZ –10 ±1 10 µA leakage current VCC 3-state output current I V = GND or 3.5 V –175 – –2 µA OZU with pull-up OUT P-channel output IOSP4 short circuit current VCC = Max, VOUT = GND –140 –70 –25 mA (4 mA output buffers)2 P-channel output IOSP8 short circuit current VCC = Max, VOUT = GND –280 –140 –50 mA (8 mA output buffers)2 N-channel output * IOSN4 short circuit current VCC = Max, VOUT = VCC 30 75 140 mA (4 mA output buffers)2 N-channel output IOSN8 short circuit current VCC = Max, VOUT = VCC 60 150 280 mA (8 mA output buffers)2 Quiescent supply I V = V or GND – – 2 mA DD current IN CC Dynamic supply I V = Max, f = 40 MHz – – 500 mA CC current CC 1. Specified at VCC equals 5 V ± 5% at ambient temperature over the specified range. 2. Not more than one output may be shorted at a time for a maximum duration of one second. July 1997 7 MSI STP2011PGA-50 MBus-to-SBus Interface AC Characteristics: MBus Output Signal Timing 40 MHz 50 MHz With System Load 100 pF Load Symbol Signal Name Reference Min Max Min Max Units Tdo MBG[3:0] MCLK+ 4.0 12.6 – 12.6 ns Tdo MAD[63:00] MCLK+ 3.4 18.4 – 14.0 ns Tdo MRDY MCLK+ 3.3 16.9 – 15.0 ns Tdo MERR MCLK+ 3.3 16.9 – 15.0 ns Tdo MRTY MCLK+ 3.3 16.9 – 15.0 ns Tdo MAS MCLK+ 3.3 17.3 – 15.0 ns Tdo MBB MCLK+ 3.3 17.3 – 15.0 ns AC Characteristics: SBus Output Signal Timing 40 MHz 50 MHz Symbol Parameter Min Max Min Max Units Tsi Setup time to clock 15 15 ns * Tdo Output delay from clock 30 22.5 ns Toh Output hold from clock 2.5 2.5 ns Thi Input hold time from clock 1.5 1.5 ns 8 July 1997 MSI MBus-to-SBus Interface STP2011PGA-50 AC Characteristics: MBus Input Signal Timing 40 MHz 50 MHz With System Load With System Load Parameter Signal Name Reference Min Max Min Max Units Tsi MAD[63:00] MCLK+ 3.2 – 3.2 – ns Thi MAD[63:00] MCLK+ -0.3 – 0 – ns Tsi MAS MCLK+ 3.6 – 6.1 – ns Thi MAS MCLK+ -0.3 – 0.4 – ns Tsi MRDY MCLK+ 6.1 – 6.1 – ns Thi MRDY MCLK+ -0.1 – 0.4 – ns Tsi MRTY MCLK+ 5.6 – 6.1 – ns Thi MRTY MCLK+ -0.2 – 0.4 – ns Tsi MERR MCLK+ 5.6 – 6.1 – ns Thi MERR MCLK+ -0.1 – 0.4 – ns Tsi MBB MCLK+ 5.1 – 6.1 – ns Thi MBB MCLK+ 0.4 – 0.4 – ns Tsi MBR[3:0] MCLK+ 7.0 – 5.0 – ns Thi MBR[3:0] MCLK+ 0.2 – 0.2 – ns Tsi SYS_RESET MCLK+ NA * – NA – ns Thi SYS_RESET MCLK+ NA – NA – ns July 1997 9 MSI STP2011PGA-50 MBus-to-SBus Interface TIMING DIAGRAMS SCLK MCLK MAS MAD[63:00] M.A.
Recommended publications
  • Ross Technology RT6224K User Manual 1 (Pdf)
    Full-service, independent repair center -~ ARTISAN® with experienced engineers and technicians on staff. TECHNOLOGY GROUP ~I We buy your excess, underutilized, and idle equipment along with credit for buybacks and trade-ins. Custom engineering Your definitive source so your equipment works exactly as you specify. for quality pre-owned • Critical and expedited services • Leasing / Rentals/ Demos equipment. • In stock/ Ready-to-ship • !TAR-certified secure asset solutions Expert team I Trust guarantee I 100% satisfaction Artisan Technology Group (217) 352-9330 | [email protected] | artisantg.com All trademarks, brand names, and brands appearing herein are the property o f their respective owners. Find the Ross Technology RT6224K-200/512S at our website: Click HERE 830-0016-03 Rev A 11/15/96 PRELIMINARY Colorado 4 RT6224K hyperSPARC CPU Module Features D Based on ROSS’ fifth-generation D SPARC compliant — Zero-wait-state, 512-Kbyte or hyperSPARC processor — SPARC Instruction Set Architec- 1-Mbyte 2nd-level cache — RT620D Central Processing Unit ture (ISA) Version 8 compliant — Demand-paged virtual memory (CPU) — Conforms to SPARC Reference management — RT626 Cache Controller, Memory MMU Architecture D Module design Management, and Tag Unit — Conforms to SPARC Level 2 MBus — MBus-standard form factor: 3.30” (CMTU) Module Specification (Revision 1.2) (8.34 cm) x 5.78” (14.67 cm) — Four (512-Kbyte) or eight D Dual-clock architecture — Provides CPU upgrade path at (1-Mbyte) RT628 Cache Data Units module level (CDUs) Ċ CPU scaleable up to
    [Show full text]
  • Fieldserver – EZ Gateway M-Bus to Modbus & Bacnet Start-Up Guide FS-EZX-MBUS-MOD-BAC
    FieldServer – EZ Gateway M-Bus to Modbus & BACnet Start-up Guide FS-EZX-MBUS-MOD-BAC APPLICABILITY & EFFECTIVITY Effective for all systems manufactured after March 2019. Document Revision: 2.D T18604 EZ Gateway M-Bus to Modbus & BACnet Start-up Guide Technical Support Please call us for any technical support needs related to the FieldServer product. Sierra Monitor Corporation 1991 Tarob Court Milpitas, CA 95035 Website: www.sierramonitor.com U.S. Support Information: +1 408 964-4443 +1 800 727-4377 Email: [email protected] EMEA Support Information: +31 33 808 0590 Email: [email protected] Technical Support EZ Gateway M-Bus to Modbus & BACnet Start-up Guide TABLE OF CONTENTS 1 About the EZ Gateway......................................................................................................................................... 5 2 Certification .......................................................................................................................................................... 5 2.1 BTL Mark – BACnet Testing Laboratory ........................................................................................................ 5 3 Supplied equipment ............................................................................................................................................ 5 4 Installing the EZ Gateway ................................................................................................................................... 6 4.1 Mounting ........................................................................................................................................................
    [Show full text]
  • An Overview of Soc Buses
    Vojin Oklobdzija/Digital Systems and Applications 6195_C007 Page Proof page 1 11.7.2007 2:16am Compositor Name: JGanesan 7 An Overview of SoC Buses 7.1 Introduction....................................................................... 7-1 7.2 On-Chip Communication Architectures ........................ 7-2 Background . Topologies . On-Chip Communication Protocols . Other Interconnect Issues . Advantages and M. Mitic´ Disadvantages of On-Chip Buses M. Stojcˇev 7.3 System-On-Chip Buses ..................................................... 7-4 AMBA Bus . Avalon . CoreConnect . STBus . Wishbone . University of Nisˇ CoreFrame . Manchester Asynchronous Bus for Low Energy . Z. Stamenkovic´ PI Bus . Open Core Protocol . Virtual Component Interface . m IHP GmbH—Innovations for High SiliconBackplane Network Performance Microelectronics 7.4 Summary.......................................................................... 7-15 7.1 Introduction The electronics industry has entered the era of multimillion-gate chips, and there is no turning back. This technology promises new levels of integration on a single chip, called the system-on-a-chip (SoC) design, but also presents significant challenges to the chip designers. Processing cores on a single chip may number well into the high tens within the next decade, given the current rate of advancements [1]. Interconnection networks in such an environment are, therefore, becoming more and more important [2]. Currently, on-chip interconnection networks are mostly implemented using buses. For SoC applications, design reuse becomes easier if standard internal connection buses are used for interconnecting components of the design. Design teams developing modules intended for future reuse can design interfaces for the standard bus around their particular modules. This allows future designers to slot the reuse module into their new design simply, which is also based around the same standard bus [3].
    [Show full text]
  • Computer Architectures an Overview
    Computer Architectures An Overview PDF generated using the open source mwlib toolkit. See http://code.pediapress.com/ for more information. PDF generated at: Sat, 25 Feb 2012 22:35:32 UTC Contents Articles Microarchitecture 1 x86 7 PowerPC 23 IBM POWER 33 MIPS architecture 39 SPARC 57 ARM architecture 65 DEC Alpha 80 AlphaStation 92 AlphaServer 95 Very long instruction word 103 Instruction-level parallelism 107 Explicitly parallel instruction computing 108 References Article Sources and Contributors 111 Image Sources, Licenses and Contributors 113 Article Licenses License 114 Microarchitecture 1 Microarchitecture In computer engineering, microarchitecture (sometimes abbreviated to µarch or uarch), also called computer organization, is the way a given instruction set architecture (ISA) is implemented on a processor. A given ISA may be implemented with different microarchitectures.[1] Implementations might vary due to different goals of a given design or due to shifts in technology.[2] Computer architecture is the combination of microarchitecture and instruction set design. Relation to instruction set architecture The ISA is roughly the same as the programming model of a processor as seen by an assembly language programmer or compiler writer. The ISA includes the execution model, processor registers, address and data formats among other things. The Intel Core microarchitecture microarchitecture includes the constituent parts of the processor and how these interconnect and interoperate to implement the ISA. The microarchitecture of a machine is usually represented as (more or less detailed) diagrams that describe the interconnections of the various microarchitectural elements of the machine, which may be everything from single gates and registers, to complete arithmetic logic units (ALU)s and even larger elements.
    [Show full text]
  • Applications of the Scalable Coherent Interface to Data Acquisition At
    CERN LIBRARIES, GENEVA e8a ¥foi`<¥ lllll flliIllllllllllllllllllllllllllll SCOOOO0123 SP:. Ib RDC- EUROPEAN ORGANIZATION FOR NUCLEAR RESEARCH ... 3 Q` 6 CERN DRDC 92-6 QJan.DRDCPBS 2 , 1992 Add.1 Applications of the Scalable Coherent Interface to Data Acqu1s1t1on at LHC A. Bogaertsl, J. Buytaertz, R. Divia, H. Miillerl, C. Parkman, P. Ponting, D. Samyn CERN, Geneva, Switzerland B. Skaali, G. Midttun, D. Wormald, J. Wikne University of Oslo, Physics Department, Norway S. Falciano, F. Cesaroni INFN Sezione di Roma and University of Rome, La Sapienza, Italy V.I. Vinogradov Institute of Nuclear Research, Academy of Sciences, Moscow, Russia K. Lochsen, B. Solbergs Dolphin SCI Technology A.S., Oslo, Norway A. Guglielmi, A. Pastore Digital Equipment Corporation {DEC}, Joint Project at CERN F·H. Worm, J. Bovier Creative Electronic Systems {CES}, Geneva, Switzerland C. Davis Radstone Technology plc, Towcester, UK joint spokesmen Fellow at CERN Scientific associate at CERN, funded by Norwegian Research Council for Science and Humanities OCR Output $U?£(.<> Addendum to P33 The proposed work on SCI during 1992 has been revised due to delays in availibil ity of SCI chips. The revised plans are summarized in the new appendices A-D below. Some parts of the project for which the necessary items will not be available in 1992 (such as cache controller chip, the SCI-fiber version, the SCI-SCI bridge and the Futurebus+ bridge) have been postponed till 1993. This concerns primarily the cache coherent readout proposed for the 3"" level trigger. The content and spirit of proposal P33 is however unchanged. We will concentrate on building an SCI demonstration system which should test the data moving properties first, and at the same time prepare the first stage of an SCI ringlet system.
    [Show full text]
  • Intesisbox® Bacnet Server M-Bus Meters
    ® IntesisBox BACnet Server M-Bus Meters User Manual r1.3 eng Issue date: 08/2019 ® IntesisBox BACnet Server – M-Bus User Manual r1.3 eng © Intesis Software S.L.U. 2019 All Rights Reserved. Information in this document is subject to change without notice. The software described in this document is furnished under a license agreement or nondisclosure agreement. The software may be used only in accordance with the terms of those agreements. No part of this publication may be reproduced, stored in a retrieval system or transmitted in any form or any means electronic or mechanical, including photocopying and recording for any purpose other than the purchaser’s personal use without the written permission of Intesis Software S.L.U. Intesis Software S.L.U. Milà i Fontanals, 1 bis 08700 Igualada Spain TRADEMARKS All trademarks and trade names used in this document are acknowledged to be the copyright of their respective holders. 2/41 © Intesis Software S.L.U. - All rights reserved URL http://www.intesisbox.com email [email protected] IntesisBox is a registered trademark of Intesis Software SLU tel +34 938047134 ® IntesisBox BACnet Server – M-Bus User Manual r1.3 eng Gateway for the integration of M-Bus devices into BACnet MSTP or BACnet IP enabled monitoring and control systems. Order code: IBBACMEB0100000, 10 M-Bus devices IBBACMEB0200000, 20 M-Bus devices IBBACMEB0600000, 60 M-Bus devices IBBACMEB1200000, 120 M-Bus devices 3/41 © Intesis Software S.L.U. - All rights reserved URL http://www.intesisbox.com email [email protected] IntesisBox is a registered trademark of Intesis Software SLU tel +34 938047134 ® IntesisBox BACnet Server – M-Bus User Manual r1.3 eng INDEX 1 Description ..............................................................................................................................................
    [Show full text]
  • PC Hardware Contents
    PC Hardware Contents 1 Computer hardware 1 1.1 Von Neumann architecture ...................................... 1 1.2 Sales .................................................. 1 1.3 Different systems ........................................... 2 1.3.1 Personal computer ...................................... 2 1.3.2 Mainframe computer ..................................... 3 1.3.3 Departmental computing ................................... 4 1.3.4 Supercomputer ........................................ 4 1.4 See also ................................................ 4 1.5 References ............................................... 4 1.6 External links ............................................. 4 2 Central processing unit 5 2.1 History ................................................. 5 2.1.1 Transistor and integrated circuit CPUs ............................ 6 2.1.2 Microprocessors ....................................... 7 2.2 Operation ............................................... 8 2.2.1 Fetch ............................................. 8 2.2.2 Decode ............................................ 8 2.2.3 Execute ............................................ 9 2.3 Design and implementation ...................................... 9 2.3.1 Control unit .......................................... 9 2.3.2 Arithmetic logic unit ..................................... 9 2.3.3 Integer range ......................................... 10 2.3.4 Clock rate ........................................... 10 2.3.5 Parallelism .........................................
    [Show full text]
  • Verifying Distributed Directory-Based Cache Coherence Protocols: S3.Mp, a Case Study
    Verifying Distributed Directory-based Cache Coherence Protocols: S3.mp, a Case Study Fong Pong, Andreas Nowatzyk*, Gunes Aybay* and Michel Dubois Department of EE-Systems *Sun Microsystems Computer Corporation University of Southern California Technology Development Group Los Angeles, CA 90089-2562 Mountain View, CA 94043 Abstract. This paper presents the results for the verification of the S3.mp cache coherence protocol. The S3.mp protocol uses a distributed directory with limited number of pointers and hardware sup- ported overflow handling that keeps processing nodes sharing a data block in a singly linked list. The complexity of the protocol is high and its validation is challenging because of the distributed algorithm used to maintain the linked lists and the non-FIFO network. We found several design errors, including an error which only appears in verification models of more than three processing nodes, which is very unlikely to be detected by intensive simulations. We believe that methods described in this paper are applicable to the verification of other linked list based protocols such as the IEEE Scalable Coherent Interface. 1 Introduction S3.mp (Sun’s Scalable Shared memory MultiProcessor) is a research project which imple- ments a distributed cache-coherent shared-memory system [12]. In S3.mp, cache coherence is supported by a distributed directory-based protocol with a small, fixed number of pointers and a hardware supported overflow mechanism which keeps processing nodes sharing a data block in singly linked lists. Cache coherence protocols that use linked lists have been proposed by Thapar [18] and are also used in the Scalable Coherent Interface (SCI) protocol [7].
    [Show full text]
  • Rc1701xx-MBUS Datasheet (Rev
    RC1701-MBUS4 Radiocrafts RC1701HP-MBUS4 Embedded Wireless Solutions RC1701VHP-MBUS4 Wireless M-Bus High power N Mode RF Transceiver Module EN 13757-4:2013) Product Description The RC1701HP-MBUS is part of a compact surface-mounted Wireless M-Bus module family that measures only 12.7 x 25.4 x 3.7 mm. The module contains a communication controller with embedded wireless M-Bus protocol software supporting the new EN13757-4:2018 Mode N and is pre-certified for operation under the European radio regulations. Applications • Wireless M-Bus • Automatic Meter Reading (AMR) • Advanced Metering Infrastructure (AMI) • Gas and Water meters • Electricity meters • Heat meters, Heat cost allocators • Readers and concentrators • Asset Tracking and Tracing Note: The number of LGA pads differ from photo, see page 8 for details Features • Embedded Wireless M-Bus protocol supporting EN 13757-4:2018 mode N • High power, long range (20 km Line-Of-Sight) • Industry leading Wireless M-Bus protocol stack • Completely shielded • Pin compatible with the RC11XX (including –MBUS, –KNX, -TM and RC232 versions) and 2.4 GHz versions RC2500/2500HP from Radiocrafts • 12.7 x 25.4 x 3.7 mm compact module for SMD mounting • No external components except antenna • Antenna tuning feature • 2.8 – 3.6 V supply voltage, ultra low power modes • Conforms with EU RED directive (EN 300 220, EN 301 489, EN 60950) • EN300-220 Cat 1 receiver option for optimum selectivity • Configurable LBT as defined in CIG UNI/TS 11291-11-4 • Output power table in 3 dB steps from -27 dBm to +27/30 dBm as defined in CIG UNI/TS 11291-11-4 Quick Reference Data Parameter RC1701HP-MBUS Unit Frequency bands 169.4 – 169.8125 MHz Number of channels 41 Data rate 2.4, 4.8, 6.4, 19.2 kbps Max output power + 27/30 dBm dBm Sensitivity, (2.4 / 4.8 / 19.2) -119/-115/-107 dBm Supply voltage 2.8 – 3.6 Volt Current consumption, RX /IDLE 31.7 mA Current consumption, TX (+27/30 dBm) 403 / 703 mA Current consumption, SLEEP Max 2.0 uA Temperature range -30 to +85 C ©2018 Radiocrafts AS RC1701xx-MBUS Datasheet (rev.
    [Show full text]
  • General Spare Node
    !VIK401 - Dino General SPARe Node Specification December 16, 1992 MK401- Dino General SPARe Node OVERVIEW The MK401 (Dino) is the first board in the new machine architecture. As such it incorporates several new devices and concepts. A complete mechanical redesign has resulted in a card size of 14 inches by 15 inches. The ElanlElite communications network is supported, and a new supervisory structure based around the CAN (Control Area Network) serial bus protocol is implemented. All input/output connectors are brought to the front panel of the cards, removing the need for 10 'dongles'. Built-in SCSI drives are also supported with backplane SCSI wiring. The board is MBus based with a single MBus (single node). On this MBus are placed two full size MBus processor card sites. This allows two SPARC CPUs to be supported, either as one dual processor card or two single processor cards. Also on the MBus is the Elan communication processor which has two Elan links to the backplane. An MBus to SBus converter chip drives an SBus which has three single sized SBus master card sites in addition to two SBus DMA controllers supporting an Ethernet port and two SCSI ports. The SBus cards and one of the MBus cards have front panel access space. A memory controller supports up to 128MBytes of error checked DRAM using 4Mbit DRAM technology. Support for 16Mbit DRAMs is included and allows a total of 512MBytes of DRAM on the node. An additional controller supports an 8bit peripheral bus, the lOBus, with a variety of devices attached. These include a Boot ROM, real time clock, two serial ports, keyboard and mouse ports, an interface to the CAN bus and miscellaneous node control functions.
    [Show full text]
  • SPARC/MEM-20 Installation Guide P/N 204227Edition6.0 P/N October 2001
    SPARC/MEM-20 Installation Guide P/N 204227 Edition 6.0 October 2001 Copyright The information in this publication is subject to change without notice. Force Computers, GmbH reserves the right to make changes without notice to this, or any of its products, to improve reliability, performance, or design. Force Computers, GmbH shall not be liable for technical or editorial errors or omissions contained herein, nor for indirect, special, incidental, or consequential damages resulting from the furnishing, performance, or use of this material. This information is pro- vided “as is” and Force Computers, GmbH expressly disclaims any and all warranties, express, implied, statutory, or otherwise, including without limitation, any express, statutory, or implied warranty of merchantability, fitness for a particular purpose, or non-infringement. This publication contains information protected by copyright. This publication shall not be reproduced, transmitted, or stored in a retrieval system, nor its contents used for any purpose, without the prior written consent of Force Computers, GmbH. Force Computers, GmbH assumes no responsibility for the use of any circuitry other than circuitry that is part of a product of Force Computers, GmbH. Force Computers, GmbH does not convey to the purchaser of the product described herein any license under the patent rights of Force Computers, GmbH nor the rights of others. Copyright 2001 by Force Computers, GmbH. All rights reserved. The Force logo is a trademark of Force Computers, GmbH. IEEE is a registered trademark of the Institute for Electrical and Electronics Engineers, Inc. PICMG, CompactPCI, and the CompactPCI logo are registered trademarks and the PICMG logo is a trademark of the PCI Indus- trial Computer Manufacturer’s Group.
    [Show full text]
  • Rpm: a Rapid Prototyping Engine for Multiprocessor Systems1
    Appeared in IEEE Computer, February 1995 RPM: A RAPID PROTOTYPING ENGINE FOR MULTIPROCESSOR SYSTEMS1 Luiz Andre Barroso, Sasan Iman, Jaeheon Jeong, Koray Öner, Krishnan Ramamurthy and Michel Dubois Department of Electrical Engineering - Systems University of Southern California Los Angeles, CA 90089-2562 (213)740-4475 [email protected] Abstract In multiprocessor systems, processing nodes contain a processor, some cache and a share of the system memory, and are connected through a scalable interconnect. The sys- tem memory partitions may be shared (shared-memory systems) or disjoint (message- passing systems). Within each class of systems many architectural variations are possible. Fair comparisons among systems are difficult because of the lack of a common hardware platform to implement the different architectures. RPM (Rapid Prototyping engine for Multiprocessors) is a hardware emulator for the rapid prototyping of various multiprocessor architectures. In RPM, the hardware of the target machine is emulated by reprogrammable controllers implemented with Field-Pro- grammable Gate Arrays (FPGAs). The processors, memories and interconnect are off-the- shelf and their relative speeds can be modified to emulate various component technolo- gies. Every emulation is an actual incarnation of the target machine and therefore software written for the target machine can be easily ported on it with little modification and with- out instrumentation of the code. In this paper, we describe the architecture of RPM, its performance and the proto- typing methodology. We also compare our approach with simulation and breadboard pro- totyping. Keywords: Field-Programmable Gate Arrays (FPGAs), message-passing multicomputers, shared-memory multiprocessors, design verification, performance evaluation, simulation. 1.
    [Show full text]