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Powering AI and Automotive Applications with the MIPI Camera Interface Agenda
Hyoung-Bae Choi Synopsys Powering AI and Automotive Applications with the MIPI Camera Interface Agenda Adoption of MIPI CSI-2℠ Image sensors beyond mobile AI and automotive examples CSI-2 interface overview Meeting reliability requirements of automotive applications Supporting artificial intelligence (AI) applications Summary © 2018 MIPI Alliance, Inc. 2 MIPI Specifications in New Applications Automotive, IoT / Wearables, Virtual / Augmented Reality © 2018 MIPI Alliance, Inc. 3 Industrial & Surveillance Applications Using MIPI CSI-2 Image Sensors © 2018 MIPI Alliance, Inc. 4 Example of MIPI in an Automotive Application MIPI CSI-2 Image Sensors & DSI Display MIPI CSI-2 Image Sensors Front Camera Module Vbat Power Supply Front Camera Left Camera MIPI DSI Right Display Module Camera Display Proprietary, LVDS or Right Camera MPU Left Ethernet Switch Module Camera CAN Interface Rear Camera Module Flash LVDS or Rear Camera DRAM Memory Ethernet Link Other Camera Module Other Camera Module © 2018 MIPI Alliance, Inc. 5 Safety-Critical ADAS Applications Require ISO 26262 Functional Safety Compliance and ASIL Certification Electronics failure can have hazardous impact Emergency braking Pedestrian detection Collision avoidance ≠ © 2018 MIPI Alliance, Inc. 6 MIPI Specs for Automotive Applications Infotainment Vehicle Networks & V2X • Real time video & data network • Gateways • Navigation • Telematics • Audio/Video • V2V • Entertainment • V2I • Security Driver Information Driver Assistance • Parking assist • Instrument clusters • Lane departure warning -
OCP DC-SCM Specification
Datacenter Secure Control Module Specification Authors: Priya Raghu, Senior Hardware Engineer, Microsoft Mark A. Shaw, Principal Hardware Engineering Manager, Microsoft Prakash Chauhan, Server Architect, Google Siamak Tavallaei, Chief Systems Architect, Google Mike Branch, Server Architect, Google Mason Possing, Hardware Engineer, Microsoft Open Compute Project • DC-SCM Specification Revision History Version Date Notes 0.8 Nov 9th 2020 Initial public review. 0.95 Dec 2nd 2020 Feedback Implemented Removed ESPI_CS1_N and replaced with RSVD3, Table 22:SPARE[0:1] desc, 1.0 March 11th Fig 22: Updated to initiator/Responder, Table 27: I3C pull-up updated to 2021 STBY/MAIN, Sec 6: Platform interop wording edit, Sec 2.2.3- Typo( FFF> HFF), Fig 3,4,5,6 updated, Table 3 updated http://opencompute.org ii Open Compute Project • DC-SCM Specification Contributions to this Specification are made under the terms and conditions set forth in Open Web Foundation Contributor License Agreement (“OWF CLA 1.0”) (“Contribution License”) by: Microsoft Corporation, Google LLC Usage of this Specification is governed by the terms and conditions set forth in the Open Web Foundation Final Specification Agreement (“OWFa 1.0”). Note: The following clarifications, which distinguish technology licensed in the Contribution License and/or Specification License from those technologies merely referenced (but not licensed), were accepted by the Incubation Committee of the OCP: INTELLIGENT PLATFORM MANAGEMENT INTERFACE (IPMI) I2C TRADEMARK OF PHILLIPS SEMICONDUCTOR I3C TRADEMARK OF MIPI ALLIANCE, INC USB TRADEMARK OF USB IMPLEMENTORS FORUM, INC PCIE TRADEMARK OF PCI-SIG ESPI TRADEMARK OF INTEL CORP NOTWITHSTANDING THE FOREGOING LICENSES, THIS SPECIFICATION IS PROVIDED BY OCP "AS IS" AND OCP EXPRESSLY DISCLAIMS ANY WARRANTIES (EXPRESS, IMPLIED, OR OTHERWISE), INCLUDING IMPLIED WARRANTIES OF MERCHANTABILITY, NON-INFRINGEMENT, FITNESS FOR A PARTICULAR PURPOSE, OR TITLE, RELATED TO THE SPECIFICATION. -
Ross Technology RT6224K User Manual 1 (Pdf)
Full-service, independent repair center -~ ARTISAN® with experienced engineers and technicians on staff. TECHNOLOGY GROUP ~I We buy your excess, underutilized, and idle equipment along with credit for buybacks and trade-ins. Custom engineering Your definitive source so your equipment works exactly as you specify. for quality pre-owned • Critical and expedited services • Leasing / Rentals/ Demos equipment. • In stock/ Ready-to-ship • !TAR-certified secure asset solutions Expert team I Trust guarantee I 100% satisfaction Artisan Technology Group (217) 352-9330 | [email protected] | artisantg.com All trademarks, brand names, and brands appearing herein are the property o f their respective owners. Find the Ross Technology RT6224K-200/512S at our website: Click HERE 830-0016-03 Rev A 11/15/96 PRELIMINARY Colorado 4 RT6224K hyperSPARC CPU Module Features D Based on ROSS’ fifth-generation D SPARC compliant — Zero-wait-state, 512-Kbyte or hyperSPARC processor — SPARC Instruction Set Architec- 1-Mbyte 2nd-level cache — RT620D Central Processing Unit ture (ISA) Version 8 compliant — Demand-paged virtual memory (CPU) — Conforms to SPARC Reference management — RT626 Cache Controller, Memory MMU Architecture D Module design Management, and Tag Unit — Conforms to SPARC Level 2 MBus — MBus-standard form factor: 3.30” (CMTU) Module Specification (Revision 1.2) (8.34 cm) x 5.78” (14.67 cm) — Four (512-Kbyte) or eight D Dual-clock architecture — Provides CPU upgrade path at (1-Mbyte) RT628 Cache Data Units module level (CDUs) Ċ CPU scaleable up to -
Microcontroller Serial Interfaces
Microcontroller Serial Interfaces Dr. Francesco Conti [email protected] Microcontroller System Architecture Each MCU (micro-controller unit) is characterized by: • Microprocessor • 8,16,32 bit architecture • Usually “simple” in-order microarchitecture, no FPU Example: STM32F101 MCU Microcontroller System Architecture Each MCU (micro-controller unit) is characterized by: • Microprocessor • 8,16,32 bit architecture • Usually “simple” in-order microarchitecture, no FPU • Memory • RAM (from 512B to 256kB) • FLASH (from 512B to 1MB) Example: STM32F101 MCU Microcontroller System Architecture Each MCU (micro-controller unit) is characterized by: • Microprocessor • 8,16,32 bit architecture • Usually “simple” in-order microarchitecture, no FPU • Memory • RAM (from 512B to 256kB) • FLASH (from 512B to 1MB) • Peripherals • DMA • Timer • Interfaces • Digital Interfaces • Analog Timer DMAs Example: STM32F101 MCU Microcontroller System Architecture Each MCU (micro-controller unit) is characterized by: • Microprocessor • 8,16,32 bit architecture • Usually “simple” in-order microarchitecture, no FPU • Memory • RAM (from 512B to 256kB) • FLASH (from 512B to 1MB) • Peripherals • DMA • Timer • Interfaces • Digital • Analog • Interconnect Example: STM32F101 MCU • AHB system bus (ARM-based MCUs) • APB peripheral bus (ARM-based MCUs) Microcontroller System Architecture Each MCU (micro-controller unit) is characterized by: • Microprocessor • 8,16,32 bit architecture • Usually “simple” in-order microarchitecture, no FPU • Memory • RAM (from 512B to 256kB) • FLASH -
Server Base Manageability Requirements 1.0 Platform Design Document Non-Confidential
Arm® Server Base Manageability Requirements 1.0 Platform Design Document Non-confidential Copyright © 2020 Arm Limited or its affiliates. All rights reserved. Document number: DEN0069B Server Base Manageability Requirements Server Base Manageability Requirements Copyright © 2020 Arm Limited or its affiliates. All rights reserved. Release inormation The Change History table lists the changes made to this document. Table 1-1 Change history Date Issue Confidentiality Change 30 January 2020 A Non-Confidential Initial release, SBMR 1.0 15 June 2020 B Non-Confidential License LES-PRE-21585 Page 2 of 45 Copyright © 2020 Arm Limited or its affiliates. All rights reserved. DEN0069B 1.0 Server Base Manageability Requirements Arm Non-Confidential Document Licence (“Licence”) This Licence is a legal agreement between you and Arm Limited (“Arm”) for the use of the document accompanying this Licence (“Document”). Arm is only willing to license the Document to you on condition that you agree to the terms of this Licence. By using or copying the Document you indicate that you agree to be bound by the terms of this Licence. If you do not agree to the terms of this Licence, Arm is unwilling to license this Document to you and you may not use or copy the Document. “Subsidiary” means any company the majority of whose voting shares is now or hereafter owner or controlled, directly or indirectly, by you. A company shall be a Subsidiary only for the period during which such control exists. This Document is NON-CONFIDENTIAL and any use by you and your Subsidiaries (“Licensee”) is subject to the terms of this Licence between you and Arm. -
I3C Master IP Core - Lattice Radiant Software
I3C Master IP Core - Lattice Radiant Software User Guide FPGA-IPUG-02082-1.0 December 2019 I3C Master IP Core - Lattice Radiant Software User Guide Disclaimers Lattice makes no warranty, representation, or guarantee regarding the accuracy of information contained in this document or the suitability of its products for any particular purpose. All information herein is provided AS IS and with all faults, and all risk associated with such information is entirely with Buyer. Buyer shall not rely on any data and performance specifications or parameters provided herein. Products sold by Lattice have been subject to limited testing and it is the Buyer's responsibility to independently determine the suitability of any products and to test and verify the same. No Lattice products should be used in conjunction with mission- or safety-critical or any other application in which the failure of Lattice’s product could create a situation where personal injury, death, severe property or environmental damage may occur. The information provided in this document is proprietary to Lattice Semiconductor, and Lattice reserves the right to make any changes to the information in this document or to any products at any time without notice. © 2019 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice. 2 FPGA-IPUG-02082-1.0 I3C Master IP Core - Lattice Radiant Software User Guide Contents Acronyms in This Document ................................................................................................................................................ -
Fieldserver – EZ Gateway M-Bus to Modbus & Bacnet Start-Up Guide FS-EZX-MBUS-MOD-BAC
FieldServer – EZ Gateway M-Bus to Modbus & BACnet Start-up Guide FS-EZX-MBUS-MOD-BAC APPLICABILITY & EFFECTIVITY Effective for all systems manufactured after March 2019. Document Revision: 2.D T18604 EZ Gateway M-Bus to Modbus & BACnet Start-up Guide Technical Support Please call us for any technical support needs related to the FieldServer product. Sierra Monitor Corporation 1991 Tarob Court Milpitas, CA 95035 Website: www.sierramonitor.com U.S. Support Information: +1 408 964-4443 +1 800 727-4377 Email: [email protected] EMEA Support Information: +31 33 808 0590 Email: [email protected] Technical Support EZ Gateway M-Bus to Modbus & BACnet Start-up Guide TABLE OF CONTENTS 1 About the EZ Gateway......................................................................................................................................... 5 2 Certification .......................................................................................................................................................... 5 2.1 BTL Mark – BACnet Testing Laboratory ........................................................................................................ 5 3 Supplied equipment ............................................................................................................................................ 5 4 Installing the EZ Gateway ................................................................................................................................... 6 4.1 Mounting ........................................................................................................................................................ -
An Overview of Soc Buses
Vojin Oklobdzija/Digital Systems and Applications 6195_C007 Page Proof page 1 11.7.2007 2:16am Compositor Name: JGanesan 7 An Overview of SoC Buses 7.1 Introduction....................................................................... 7-1 7.2 On-Chip Communication Architectures ........................ 7-2 Background . Topologies . On-Chip Communication Protocols . Other Interconnect Issues . Advantages and M. Mitic´ Disadvantages of On-Chip Buses M. Stojcˇev 7.3 System-On-Chip Buses ..................................................... 7-4 AMBA Bus . Avalon . CoreConnect . STBus . Wishbone . University of Nisˇ CoreFrame . Manchester Asynchronous Bus for Low Energy . Z. Stamenkovic´ PI Bus . Open Core Protocol . Virtual Component Interface . m IHP GmbH—Innovations for High SiliconBackplane Network Performance Microelectronics 7.4 Summary.......................................................................... 7-15 7.1 Introduction The electronics industry has entered the era of multimillion-gate chips, and there is no turning back. This technology promises new levels of integration on a single chip, called the system-on-a-chip (SoC) design, but also presents significant challenges to the chip designers. Processing cores on a single chip may number well into the high tens within the next decade, given the current rate of advancements [1]. Interconnection networks in such an environment are, therefore, becoming more and more important [2]. Currently, on-chip interconnection networks are mostly implemented using buses. For SoC applications, design reuse becomes easier if standard internal connection buses are used for interconnecting components of the design. Design teams developing modules intended for future reuse can design interfaces for the standard bus around their particular modules. This allows future designers to slot the reuse module into their new design simply, which is also based around the same standard bus [3]. -
Computer Architectures an Overview
Computer Architectures An Overview PDF generated using the open source mwlib toolkit. See http://code.pediapress.com/ for more information. PDF generated at: Sat, 25 Feb 2012 22:35:32 UTC Contents Articles Microarchitecture 1 x86 7 PowerPC 23 IBM POWER 33 MIPS architecture 39 SPARC 57 ARM architecture 65 DEC Alpha 80 AlphaStation 92 AlphaServer 95 Very long instruction word 103 Instruction-level parallelism 107 Explicitly parallel instruction computing 108 References Article Sources and Contributors 111 Image Sources, Licenses and Contributors 113 Article Licenses License 114 Microarchitecture 1 Microarchitecture In computer engineering, microarchitecture (sometimes abbreviated to µarch or uarch), also called computer organization, is the way a given instruction set architecture (ISA) is implemented on a processor. A given ISA may be implemented with different microarchitectures.[1] Implementations might vary due to different goals of a given design or due to shifts in technology.[2] Computer architecture is the combination of microarchitecture and instruction set design. Relation to instruction set architecture The ISA is roughly the same as the programming model of a processor as seen by an assembly language programmer or compiler writer. The ISA includes the execution model, processor registers, address and data formats among other things. The Intel Core microarchitecture microarchitecture includes the constituent parts of the processor and how these interconnect and interoperate to implement the ISA. The microarchitecture of a machine is usually represented as (more or less detailed) diagrams that describe the interconnections of the various microarchitectural elements of the machine, which may be everything from single gates and registers, to complete arithmetic logic units (ALU)s and even larger elements. -
A Collaborative Approach to Advancing In-Vehicle Connectivity
A Collaborative Approach to Advancing In-Vehicle Connectivity Rick Wietfeldt, Ph.D. Director, MIPI Alliance Board of Directors Sr. Director Technology, Qualcomm 19 November 2020 1 | © 2019 MIPI Alliance, Inc. Presentation Outline • About MIPI Alliance • Automotive Industry Need • MIPI Automotive SerDes Solutions (MASSSM) and MIPI A-PHYSM • Summary 2 | © 2020 MIPI Alliance, Inc. About MIPI Alliance TODAY'S MIPI MEMBER ECOSYSTEM 3 | © 2020 MIPI Alliance, Inc. MIPI Specifications Leveraged Beyond Mobile 4 | © 2020 MIPI Alliance, Inc. Board and Contributor Members Contributor Members Board Members 5 | © 2020 MIPI Alliance, Inc. MIPI Liaisons: Extending The Mobile Ecosystem Security Automotive SIM, Secure Element Memory, Storage Displays Telecommunications Storage Connectivity Automotive 6 | © 2020 MIPI Alliance, Inc. Cross-Industry Convergence, Protocol Persistence • Semiconductor & ecosystem companies reuse assets (IP) to lower NRE/costs, including reuse of interface protocols – Making any interface change is difficult and costly. MIPI CSI, DSI, Backward compatibility is key. I3C, RFFE ... • Leading examples of evolution… reuse/extend: – USB: 1996+: USB 1, … USB 4 (adds DP, PCIe) … – SD: 1999+: SD, … SD v7 (adds PCIe) … – PCIe 2003+: PCIe Gen 1, … Gen 5, Gen 6 WIP – CSI-2 2005+: CSI-2 v1, … CSI-2 v3, … CSI-2 v4 WIP • Leverage includes cross-SDO cooperation: – USB4 adds DP & PCIe support; SD7 adds PCIe support • Evolution focuses on improving USB PCIe, DP UART Ethernet performance & reliability I2C I2CMIPI I3C – Encoding, equalization, error -
Applications of the Scalable Coherent Interface to Data Acquisition At
CERN LIBRARIES, GENEVA e8a ¥foi`<¥ lllll flliIllllllllllllllllllllllllllll SCOOOO0123 SP:. Ib RDC- EUROPEAN ORGANIZATION FOR NUCLEAR RESEARCH ... 3 Q` 6 CERN DRDC 92-6 QJan.DRDCPBS 2 , 1992 Add.1 Applications of the Scalable Coherent Interface to Data Acqu1s1t1on at LHC A. Bogaertsl, J. Buytaertz, R. Divia, H. Miillerl, C. Parkman, P. Ponting, D. Samyn CERN, Geneva, Switzerland B. Skaali, G. Midttun, D. Wormald, J. Wikne University of Oslo, Physics Department, Norway S. Falciano, F. Cesaroni INFN Sezione di Roma and University of Rome, La Sapienza, Italy V.I. Vinogradov Institute of Nuclear Research, Academy of Sciences, Moscow, Russia K. Lochsen, B. Solbergs Dolphin SCI Technology A.S., Oslo, Norway A. Guglielmi, A. Pastore Digital Equipment Corporation {DEC}, Joint Project at CERN F·H. Worm, J. Bovier Creative Electronic Systems {CES}, Geneva, Switzerland C. Davis Radstone Technology plc, Towcester, UK joint spokesmen Fellow at CERN Scientific associate at CERN, funded by Norwegian Research Council for Science and Humanities OCR Output $U?£(.<> Addendum to P33 The proposed work on SCI during 1992 has been revised due to delays in availibil ity of SCI chips. The revised plans are summarized in the new appendices A-D below. Some parts of the project for which the necessary items will not be available in 1992 (such as cache controller chip, the SCI-fiber version, the SCI-SCI bridge and the Futurebus+ bridge) have been postponed till 1993. This concerns primarily the cache coherent readout proposed for the 3"" level trigger. The content and spirit of proposal P33 is however unchanged. We will concentrate on building an SCI demonstration system which should test the data moving properties first, and at the same time prepare the first stage of an SCI ringlet system. -
Intesisbox® Bacnet Server M-Bus Meters
® IntesisBox BACnet Server M-Bus Meters User Manual r1.3 eng Issue date: 08/2019 ® IntesisBox BACnet Server – M-Bus User Manual r1.3 eng © Intesis Software S.L.U. 2019 All Rights Reserved. Information in this document is subject to change without notice. The software described in this document is furnished under a license agreement or nondisclosure agreement. The software may be used only in accordance with the terms of those agreements. No part of this publication may be reproduced, stored in a retrieval system or transmitted in any form or any means electronic or mechanical, including photocopying and recording for any purpose other than the purchaser’s personal use without the written permission of Intesis Software S.L.U. Intesis Software S.L.U. Milà i Fontanals, 1 bis 08700 Igualada Spain TRADEMARKS All trademarks and trade names used in this document are acknowledged to be the copyright of their respective holders. 2/41 © Intesis Software S.L.U. - All rights reserved URL http://www.intesisbox.com email [email protected] IntesisBox is a registered trademark of Intesis Software SLU tel +34 938047134 ® IntesisBox BACnet Server – M-Bus User Manual r1.3 eng Gateway for the integration of M-Bus devices into BACnet MSTP or BACnet IP enabled monitoring and control systems. Order code: IBBACMEB0100000, 10 M-Bus devices IBBACMEB0200000, 20 M-Bus devices IBBACMEB0600000, 60 M-Bus devices IBBACMEB1200000, 120 M-Bus devices 3/41 © Intesis Software S.L.U. - All rights reserved URL http://www.intesisbox.com email [email protected] IntesisBox is a registered trademark of Intesis Software SLU tel +34 938047134 ® IntesisBox BACnet Server – M-Bus User Manual r1.3 eng INDEX 1 Description ..............................................................................................................................................