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Application Note DTC Theory of Operation

Application Note DTC Theory of Operation

Application Note AN29 9380 Carroll Park Drive San Diego, CA 92121, USA Tel: 858-731-9400 Fax: 858-731-9499 www.psemi.com

DTC Theory of Operation

Introduction Summary The Digitally Tunable (DTC) is a variable • DTC is a variable capacitor controlled by a digital capacitor controlled by a digital interface. A digital serial serial interface interface is used to control CMOS FETs that connect and • DTC equivalent circuit model includes 3 main disconnect fixed High-Q MIM to obtain components: Tuning Core, parasitic package in- different capacitance values. The use of FET stacking to ductance, and shunt parasitic network create a virtual high- FET enables the high power • Total capacitance in shunt configuration will be handling of the DTC. The digital control interface is fully higher than series configuration due to parasitic integrated on die; no external components for bias voltage generation or interfacing are required. This App Note capacitance describes the operation of the DTC and its use in a • Quality factor is only defined in shunt configuration tunable matching network. Peak voltage across the RF terminals or from any RF terminal to should not exceed the maximum peak voltage DTC Equivalent Circuit Model The capacitance of the DTC is determined by the parallel combination of all “on state” MIM capacitor-FET paths and all “off state” paths. By weighting each MIM The DTC can be modeled using a circuit shown in Figure capacitor in the device, a linear and monotonic tuning 2. It includes all of the parasitic elements and is accurate response is achieved. At the lowest capacitance setting of in both Series and Shunt configurations. The model the device, each switch is off. Figure 1 shows a simplified reflects physical circuit behavior accurately and provides view of the RF core of the DTC. Figure 2 is the block very close correlation to measured data. The model will diagram for the DTC component highlighting the digital match all important parameters (C, tuning range, SRF and interface and RF sections. Q, mismatch and dissipative loss) properly. Figure 2 shows the equivalent circuit for the DTC. It includes 3 main components: the Tuning Core composed of R s and C s, parasitic package inductance L s, and the shunt parasitic network (C p, R p1 , R p2 ).

RF+ RF- ESD ESD LS RS CS LS RF+ RF-

CP CP

RP2 RP2

RP1 RP1 Serial CMOS Control Driver Interface and ESD

Figure 1: Block Diagram of DTC Figure 2: DTC Model

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Capacitance vs. State 5

4 LS RS CS LS RF+ RF- 3 CP CP

R RP2 P2 2 RP1 RP1 Capacitance[pF]

1

0 0 4 8 12 16 20 24 28 32 Tuning State Figure 3: Capacitance of the Tuning Core in Series Configuration As seen in Figure 3, the Tuning Core capacitance is linearly proportional to the tuning state in a discrete fashion. The Tuning State corresponds to a specific capacitance value that the Tuning Core is programmed to through the serial interface. The resolution of the DTC is determined by the number of capacitance steps that exist between the minimum (C smin ) and maximum (C smax ) capacitance values. The capacitance tuning ratio of the Tuning Core is determined as Csmax /C smin, which is also referred to as the Series Tuning Ratio.

To adequately represent the behavior of a practical implementation of the DTC, the parasitic capacitance (due to circuit and package parasitics) from RF ports to GND (C p) must be taken into account. Thus the DTC appears as a 3-terminal network and has capacitance between each RF port, and between each RF port to GND. The effective capacitance the DTC presents to a circuit will depend on its configuration (Series vs. Shunt).

In Series configuration, the DTC Tuning Core capacitance C s is seen between RF+ and RF- ports. In this case, Cs is referred to as the Series Capacitance. Since the shunt parasitic C p is connected to GND, it doesn’t impact the capacitance between RF+ and RF-, but nonetheless must be taken into account when designing the end application circuit. Capacitance vs. State 6

5 L L S RS CS S 4

RF+ RF-

C P C P 3 RP2 RP2

RP1 RP1 2 Capacitance [pF] Capacitance

1 Capacitance in Series Configuration Capacitance in Shunt Configuration

0 0 4 8 12 16 20 24 28 32 Tuning State Figure 4: Capacitance in Shunt and Series In Shunt configuration, typically RF- is grounded and RF+ is connected to the signal. The Package Inductance Ls at RF- port effectively shorts out the parasitic shunt network on the RF- side of the circuit; C p and Cs become parallel. Thus in shunt, the total capacitance C = (C s+C p) is higher than capacitance seen between RF+ and RF- ports, as illustrated in Figure 4.

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S11

LS RS CS LS S21 0.0 RF+ RF- -0.5

-1.0 C P C P -1.5

R [dB] S21 RP2 P2 -2.0

-2.5 RP1 RP1 -3.0 0.0 0.5 1.0 1.5 2.0 2.5 3.0

Frequency [GHz] Ideal Reactance freq (30.00MHz to 3.000GHz) Reactance with Parasitic effect included

Figure 5: Effect of Parasitic Capacitance on Series Behavior

Since C p represents shunt admittance, the DTC no longer appears as a simple reactance in series between the RF ports, but rather as an impedance . Thus the S 11 and S 21 for the actual circuit in the series configuration deviate from an ideal series reactance, as illustrated in Figure 5. Capacitance vs. State 10

L L 3GHz S RS CS S 8 RF+ RF- 6 CP CP

R RP2 4 P2 1GHz RP1 RP1 Capacitance[pF] 2

0 0 4 8 12 16 20 24 28 32 Tuning State Figure 6: Apparent Capacitance in Shunt Configuration

In addition to the parasitic capacitances, a parasitic inductance L s (due to package and circuit parasitics) is present in the DTC. This inductance causes the apparent capacitance of the DTC to increase towards higher frequencies. This causes the apparent tuning ratio to also increase at higher frequencies as shown in Figure 6.

LS RS CS LS RF+ RF- State 31 CP CP

R RP2 P2 State 0 RP1 RP1

Figure 7: Effects on SRF From Parasitic Inductance At the Self Resonant Frequency (SRF) the parasitic inductance cancels out the capacitive reactance and capacitance falls to zero. Above SRF the DTC appears inductive (or has negative capacitance). The SRF is dependent on which tuning state (which capacitance value) the DTC is programmed. SRF is approximately inversely proportional to the square root of capacitance.

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LS RS CS LS RF+ RF- Rs

CP CP

RP2 RP2

RP1 RP1 Cs

Figure 8: C s and R s Dependency on Tuning State In order to accurately represent the dissipative losses in the DTC, each capacitive element (parasitic or tuning core) must have a resistive component associated with it. The dissipative losses for the Tuning Core (C s) are modeled by Equivalent Series Resistance (R s). The value of R s and C s depend on tuning state as illustrated in Figure 8.

LS RS CS LS RF+ RF-

CP CP

RP2 RP2

RP1 RP1

Figure 9: Quality Factor of the Shunt Parasitic Components

The shunt parasitic network is a combination of circuit and package parasitics, which also contain resistive loss components. One source of these resistive losses is the internal biasing circuitry within the tuning core. The component values of the parasitic network are independent of frequency and tuning state. The Quality Factor of the parasitic network (which helps describe its loss) is illustrated in Figure 9.

LS RS CS LS RF+ RF- State 0 CP CP

RP2 RP2

RP1 RP1 State 31

Figure 10: Q as a Composite of Core and Parasitic Components The complete DTC model provides an accurate representation of the device in both Series and Shunt configurations.

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The overall dissipative losses for the DTC depend on the Tunable Matching Network Example configuration of the part. Quality Factor cannot be defined The implementation of an actual Tunable Matching in general for the DTC connected in Series, because the Network using the DTC model is illustrated in Figure 11. dissipative losses depend on the source and load Both Series and Shunt DTCs are used to obtain the impedances. In Shunt configuration however, the RF- is widest impedance coverage. Shunt are used grounded and signal is connected to RF+ port. The total with the DTCs as part of the impedance transformation Quality Factor Q in Shunt configuration as seen at RF+ is network, and to provide the required DC path to ground a composite of the DTC Tuning Core Q and the parasitic s for proper biasing and additional ESD protection. Their network components (Q ), as illustrated in Figure 10. p values can be modified to change the frequency response and impedance transformation characteristics of the Tunable Matching Network. The output impedance constellation of the Tunable Matching Network is shown in Figure 12. Each point on the Smith Chart corresponds to an output load impedance (connected to Port 2) that can be matched to 50 at Port 1 swept over each DTC capacitance state. The Smith Chart constellation is shown for the tuning C1 response present at 1 GHz. RF+ C2 The Insertion Loss and Return Loss plots correspond to Port 1 Port 2 RF+ selecting tuning states for both DTCs to provide an RF- optimum Return Loss for each frequency point, between L1 L2 50 ports. Figure 12 shows that the Tunable Matching 5.6nH 4nH Network has a bandwidth of 0.75-1.2 GHz, RF - corresponding to a frequency range that can be matched perfectly to 50 . The simulated Insertion Loss of this network is approximately 0.5 dB and accurately Figure 11: Example Tunable Matching Network represents how the circuit performs in measurement.

Impedance Constellation

IL and RL vs. Frequency 0 0.0

-10 -0.5 Insertion Loss (dB) Loss Insertion -20 -1.0

-30 -1.5 conj(S22)

-40 -2.0 Return Loss (dB)

-50 -2.5

-60 -3.0 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2 1.3 1.4 1.5 S1 (0.000 to 31.000) Frequency (MHz) Figure 12: Network Response

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Design Guidelines (Peak RF Voltage limit) The effective peak voltage across the DTC can be solved Reconfigurable circuits such as filters and matching mathematically, typically by use of simulation software networks often expose components to high peak such as ADS or MATLAB. In the example shown in Figure because of the transformation ratios seen in the 13, the source impedance (Port 1) is set to 50 while the resonating elements in the circuit. The RF voltage across load impedance (Port 2) is swept over VSWR and phase the DTC is dependent on the impedance and RF power to cover various impedance conditions. At each VSWR level. In some circuits such as filters or impedance and phase, the capacitance values for DTCs A and B are matching networks, certain source and load impedances chosen to achieve the lowest mismatch loss between can cause the effective RF voltage across the DTC to Ports 1 and 2. With this, the peak voltage each DTC will be exposed to can be solved. exceed maximum specified V pk even at low RF input power. Figure 14 shows the solved peak RF voltages across the Since the DTC contains ESD protection circuitry, a path to various terminals of DTCs A and B over various load ground exists at each RF terminal even if it is used in a impedances. As can be seen, over all load impedances of series configuration. In addition to the RF voltage present up to 9:1 VSWR, 30 V peak RF is never reached for DTC across the RF terminals of the device, care must be taken A between the RF+ terminals to ground, or between the RF+ and RF- terminals. not to exceed maximum specified V pk between any RF terminal and ground (RF+ to Ground or RF- to Ground). Unfortunately, with this design, some load impedances Spurious emissions will increase if the Vpk limit is presented at Port 2 cause 30 V to be exceeded across the exceeded between the RF+ and RF- terminals and RF+ and RF- (ground) terminals of DTC B. Because of between the RF+ terminals and ground. this, this design shouldn’t be used at some load To demonstrate this, the example tuner presented earlier impedances at 9:1 with 34 dBm input power, or the input is evaluated with a 34 dBm 1 GHz input (50 ) at Port 1 power must be reduced. and a load impedance (Z L) swept over all phase angles for VSWR values of 1:1, 3:1, and 9:1 at Port 2. In this case, a DTC with 30 V pk voltage handling is assumed.

DTCC1 A Port 1 RF+ DTCC2 B Port 2 50 Z +34dBm 1GHz RF- RF+ L L1 L2 5.6nH 4nH RF -

Figure 13: RF Voltage Example

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Variable CapacitorDTC A, PeakA, Peak Voltage Voltage (RF+ (RF+ to toGND) GND) vs. Phas e Variable CapacitorDTC A, PeakA, Peak Voltage Voltage (RF+ (RF+ to toRF-) RF-) vs. Phas e 25 22 24 20

23 9:1 VSWR 18 22 16 9:1 VSWR 21 14

20 12

19 10 18 3:1 VSWR 8 Peak Voltage [V] Voltage Peak [V] Voltage Peak 17 6

16 4 3:1 VSWR 15 1:1 VSWR 2 1:1 VSWR 14 0 0 30 60 90 120 150 180 210 240 270 300 330 360 0 30 60 90 120 150 180 210 240 270 300 330 360 Phase Angle (degrees) Phase Angle (degrees)

Variable CapacitorDTC B, PeakB, Peak Voltage Voltage (RF+ (RF+ to to RF-) RF-) vs. Phas e 40 9:1 VSWR 35

30

25 3:1 VSWR

20

15 1:1 VSWR Peak Voltage [V] Voltage Peak 10

5

0 0 30 60 90 120 150 180 210 240 270 300 330 360 Phase Angle (degrees) Figure 14: RF Voltages for Example Tuner with 34 dBm Input

Conclusion The DTC theory of operation has been described. The DTC is variable capacitor controlled by a serial interface that is integrated on die with the Tuning Core. Applicable to both series and shunt configurations, the DTC can be modeled with three main sections - a Tuning Core, a parasitic inductance, and a shunt parasitic network. The parasitic elements affect the total capacitance in shunt and the apparent capacitance at higher frequencies. The overall dissipative losses of the DTC, described as the Quality Factor, are defined only in shunt configuration. If the DTC is used in filters or impedance matching networks, care must be taken not to exceed the maximum specified peak voltage between RF terminals or from any terminal to ground.

The information in this document is believed to be reliable. However, Peregrine assumes no liability for the use of this information. Use shall be entirely at the user’s own risk. No patent rights or licenses to any circuits described in this document are implied or granted to any third party. Peregrine’s products are not designed or intended for use in devices or systems intended for surgical implant, or in other applications intended to support or sustain life, or in any application in which the failure of the Peregrine product could create a situation in which personal injury or death might occur. Peregrine assumes no liability for damages, including consequential or incidental damages, arising out of the use of its products in such applications. The Peregrine name, logo, and UTSi are registered trademarks and UltraCMOS, HaRP, MultiSwitch and DuNE are trademarks of Peregrine Semiconductor Corp. All other trademarks mentioned herein are the property of their respective companies.

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