MEMS Technology Symposium Sensors: a Foundation for Accelerated MEMS Market Growth to $1 Trillion

MEPTECPRESENTS MicroElectronics Packaging and Test Engineering Council

Tenth Annual MEMS Technology Symposium Sensors: A Foundation for Accelerated MEMS Market Growth to $1 Trillion

Participating Companies: n Amkor Technology n MANCEF n BridgeWave Communications n Movea, Inc. n Coventor, Inc. n Sensor Platforms, Inc. n Fairchild Semiconductor n Syride n Hewlett-Packard Labs n University of California n Hillcrest Laboratories, Inc. at Berkeley n n IHS iSuppli VectorNav Technologies n n Intel Corporation Wireless Communications Alliance n InvenSense, Inc. n Xsens n Kionix, Inc. n Yole Développement

Platinum Sponsor Gold Sponsors Association Sponsor

MAY 23, 2012 • SAN JOSE, CALIFORNIA

MEDIA SPONSORS MEPTECPRESENTS MicroElectronics Packaging and Test Engineering Council

TENTH ANNUAL MEMS TECHNOLOGY SYMPOSIUM

CONTENTS Agenda

Sponsor, Exhibitor, and MEMS for All of Us Participant Directories

Participant Biographies

MORNING KEYNOTE - Sensory Swarms Professor Kristofer Pister, University of California, Berkeley

- Accelerating MEMS Market to $Trillion/Trillion Units Janusz Bryzek, Ph.D., Fairchild Semiconductor - Implementing the Trillion Dollar MEMS Roadmap Robert Haak, Insight interAsia/MANCEF - CeNSE: Awareness Through A Trillion MEMS Sensors Rich Friedrich, Hewlett-Packard Labs - On the Road to $1T? Gregory J. Galvin, Ph.D., Kionix, Inc. - The MEMS Revolution: from Billions to Trillions? Jérémie Bouchaud, IHS iSuppli

AFTERNOON KEYNOTE - Motion Interface the Next Large Market Opportunity Steve Nasiri, InvenSense, Inc.

- Status of the MEMS Industry – New Drivers: The Path to New Opportunities J.C. Eloy, Yole Développement - Realizing the Full Potential of MEMS Design Automation Stephen Breit, Ph.D., Coventor, Inc. - High Volume Assembly & Test Solutions to Meet the Rapidly Growing MEMS Market Russell Shumway, Amkor Technology

SPECIAL SESSION: MEMS for All of Us - Fusing Sensors into Mobile Operating Systems and Innovative Use Cases Tristan Joo, Wireless Communications Alliance Participating Companies: – Hillcrest Labs, Inc. – Movea, Inc. – Sensor Platforms, Inc. – Syride – VectorNav Technologies – Xsens

Wednesday, May 23, 2012 • Holiday Inn San Jose • San Jose, California MEPTECPRESENTS MicroElectronics Packaging and Test Engineering Council

A ONE-DAY TECHNICAL SYMPOSIUM & EXHIBITS

Tenth Annual MEMS TECHNOLOGY SYMPOSIUM Sensors: A Foundation for Accelerated MEMS Market Growth to $1 Trillion

MORNING AGENDA

7:00 am Registration Opens

8:15 am Welcome and Introduction

8:30 am – 9:00 am MORNING KEYNOTE Sensory Swarms Professor Kristofer Pister, Electrical Engineering and Computer Science University of California, Berkeley

9:00 am – 9:30 am Accelerating MEMS Market to $Trillion/Trillion Units Janusz Bryzek, Ph.D., VP MEMS Development Fairchild Semiconductor

9:30 am – 10:00 am Implementing the Trillion Dollar MEMS Roadmap Robert Haak, CEO, Insight interAsia Pte Ltd. Vice President - Asia/Pacific, Executive Board of Directors, MANCEF

10:00 am – 10:30 am Morning Break and Exhibits

10:30 am – 11:00 am CeNSE: Awareness through A Trillion MEMS Sensors Rich Friedrich, Director of the CeNSE Program Hewlett-Packard Labs

11:00 am – 11:30 am On the Road to $1T? Gregory J. Galvin, Ph.D., President/CEO Kionix, Inc.

11:30 am – 12:00 pm The MEMS Revolution: from Billions to Trillions? Jérémie Bouchaud, Director and Senior Principal Analyst MEMS and Sensors IHS iSuppli

12:00 pm - 1:00 pm Lunch and Exhibits

Wednesday, May 23, 2012 • Holiday Inn San Jose • San Jose, California MEPTECPRESENTS MicroElectronics Packaging and Test Engineering Council

A ONE-DAY TECHNICAL SYMPOSIUM & EXHIBITS

Tenth Annual MEMS TECHNOLOGY SYMPOSIUM Sensors: A Foundation for Accelerated MEMS Market Growth to $1 Trillion

AFTERNOON AGENDA

1:00 pm – 1:30 pm AFTERNOON KEYNOTE Motion Interface the Next Large Market Opportunity Steve Nasiri, Founder, President, CEO and Chairman InvenSense, Inc.

1:30 pm – 2:00 pm Status of the MEMS Industry – New Drivers: The Path to New Opportunities J.C. Eloy, President and CEO Yole Développement

2:00 pm – 2:30 pm Realizing the Full Potential of MEMS Design Automation Stephen Breit, Ph.D., Vice President Engineering Coventor, Inc.

2:30 pm – 3:00 pm High Volume Assembly & Test Solutions to Meet the Rapidly Growing MEMS Market Russell Shumway, Sr. Manager, MEMS & Sensor Packaging Amkor Technology

3:00 pm – 3:30 pm Afternoon Break and Exhibits

SPECIAL SESSION: MEMS for All of Us This special session will showcase products driven by sensors, sensor software, and the technology behind these products. During the reception following this session attendees will have an opportunity to see hands on demonstrations of the products.

3:30 pm – 3:50 pm Fusing Sensors into Mobile Operating Systems & Innovative Use Cases Tristan Joo, Board Director & Co-Chair of Mobile SIG Wireless Communications Alliance Participating Companies: Hillcrest Labs, Inc. Movea, Inc. Sensor Platforms, Inc. Syride VectorNav Technologies Xsens

5:00 pm – 7:00 pm Exhibitor and Sponsor Reception and Demonstrations

Wednesday, May 23, 2012 • Holiday Inn San Jose • San Jose, California MEPTECPRESENTS MicroElectronics Packaging and Test Engineering Council

TENTH ANNUAL MEMS TECHNOLOGY SYMPOSIUM

A SPECIAL THANKS TO OUR SPONSORS

PLATINUM SPONSOR

GOLD SPONSORS

ASSOCIATION SPONSOR

Please see our sponsors’ ads on the following pages.

Wednesday, May 23, 2012 • Holiday Inn San Jose • San Jose, California MEPTECPRESENTS MicroElectronics Packaging and Test Engineering Council

TENTH ANNUAL MEMS TECHNOLOGY SYMPOSIUM

THANKS TO OUR MEDIA SPONSORS

Wednesday, May 23, 2012 • Holiday Inn San Jose • San Jose, California Value Beyond Silicon. At Kionix, we don’t simply offer accelerometers; we provide a range of solutions for Android, Windows, and embedded systems. • Our solutions include high-performance consumer grade accelerometers, gyroscopes, and combo sensors. • We enable motion-based gaming, context awareness, user interface, personal navigation, remote control, notebook hard disk drive drop protection, and much more. • And now we’re adding comprehensive software libraries for various inertial sensor combinations on the leading operating systems and hardware platforms. Contact us today to learn more about our solutions and how we can put them to work for you.

Kionix, Inc. Worldwide Headquarters | 36 Thornwood Drive, Ithaca, NY 14850 USA Phone: 607.257.1080 | www.kionix.com

MEPTECPRESENTS MicroElectronics Packaging and Test Engineering Council

TENTH ANNUAL MEMS TECHNOLOGY SYMPOSIUM

EVENT SPONSORS

PLATINUM SPONSOR GOLD SPONSORS ASSOCIATION SPONSOR

Amkor Technology MEMS Industry Group Kionix, Inc. 1900 S. Price Road, Chandler, AZ 85286 1620 Murray Avenue, 3rd Fl, Pittsburgh, PA 15217 36 Thornwood Drive, Ithaca, NY 14850 Phone: 480-821-5000 Phone: 412-390-1644 Phone: 607-257-1080 www.amkor.com www.memsindustrygroup.com www.kionix.com Amkor Technology, Inc. is one of the world’s larg- MEMS Industry Group (MIG) is the unifying voice Kionix, Inc. is a global MEMS inertial sensor manu- est providers of advanced semiconductor assembly of the commercial MEMS community, representing facturer, offering one of the industry’s broadest and test services. Founded in 1968, Amkor has those companies with the goal of making money in families of tri-axis accelerometers and gyroscopes. become a strategic manufacturing partner for many the MEMS market. By providing forums for informa- Consumer-electronics leaders worldwide utilize of the world’s leading semiconductor companies tion exchange and collaboration they create the Kionix’s products, development tools and appli- and electronics OEMs, providing a broad array horizontal band across the broad range of compa- cations to enable motion-based gaming; context of advanced package design, assembly and test nies supporting and utilizing MEMS technology. MIG awareness, personal navigation, remote control solutions. Amkor’s operational base encompasses is the virtual and physical place for people and and hard drive drop protection in mobile products. more than 5 million square feet of manufacturing facilities, product development centers, and sales organizations to come together to address industry & support offices in Asia, Europe and the United issues and further the commercialization of MEMS. States. Amkor offers a suite of services, including electroplated wafer bumping, probe, assembly and final test. Amkor is a leader in advanced copper pil- lar bump and packaging technologies which enables next generation flip chip interconnect.

ASE Group 1255 E. Arques Avenue, Sunnyvale, CA 94085 Phone: 408-636-9500 www.aseglobal.com The ASE Group is the world’s largest provider of independent semiconductor manufacturing services in assembly and test. As a global leader geared towards meeting the industry’s ever growing needs for faster, smaller and higher performance chips, the Group develops and offers a wide portfolio of technology and solutions including IC test program design, front-end engineering test, wafer probe, wafer bump, substrate design and supply, wafer level package, flip chip, system-in-package, final test and electronic manufacturing services.

Wednesday, May 23, 2012 • Holiday Inn San Jose • San Jose, California MEPTECPRESENTS MicroElectronics Packaging and Test Engineering Council

TENTH ANNUAL MEMS TECHNOLOGY SYMPOSIUM

EXHIBITOR DIRECTORY

Advanced Packaging Center electroplated wafer bumping, probe, assembly and where bond pads, heat sinks, window or exposed final test. Amkor is a leader in advanced copper pil- die surfaces must be kept free of mold compound or Stenograaf 3 lar bump and packaging technologies which enables resin bleed are ideally suited for their cost effective 6921EX, Duiven, The Netherlands next generation flip chip interconnect. technology. As the holder of many FAM related pat- Phone: 480-488-9898 ents, Boschman brings unique and proven solutions. www.apcenter.nl AmTECH Microelectronics In addition Boschman provides automatic molding Advanced Package Center (APC), offers a one-stop solutions for conventional semiconductor devices 6541 Via Del Oro and reel to reel smartcards. shop for delivery of research, development, quali- San Jose, CA 95119 fication, prototyping and small volume manufactur- Phone: 408-227-8885 ing services. APC focuses upon MEMS, Sensors, and Coventor, Inc. advanced IC and wafer level packaging realized www.amtechmicro.com through Boschman Technologies’ unique Film Assist AmTECH is a community of talented and experi- 4000 CentreGreen Way, Suite 190 Molding (FAM) technology. By working closely with enced employees with a reputation for excellent Cary, NC 27513 customer R&D departments to explore new packag- service, on-time delivery and a strong commitment Phone: 919-854-7500 ing concepts, APC provides value from Innovation to to quality. AmTECH was founded on 1993 to pro- www.coventor.com Industrialization. vide Advanced Packaging and PCB Assembly. They Coventor, Inc. is the market leader in automat- provide manufacturing services for IC Packaging, ed design solutions for micro-electromechanical AGC Electronics America Chip-On-Board, Chip-On-Flex, MEMS and Multichip systems (MEMS) and virtual fabrication of MEMS Modules with Fine Pitch Gold or Aluminum Wire and semiconductor devices. Coventor serves a 18694 Caminito Pasadero Bonding. Their PCB Assembly capabilities include worldwide customer base of integrated device San Diego, CA 92128 Lead-Free SMT Assembly with 0201, µBGA; WLCSP manufacturers, fabless design houses, independent Phone: 714-745-3193 and 0.4mm pitch QFNs and connectors. foundries, and R&D organizations that develop www.agcem.com MEMS-based products for automotive, aerospace, AGC, a Fortune Global 1000 company, is a lead- ASE Group industrial, defense, and consumer electronics applications, including smart phones, tablets, and gam- er in glass materials and related technologies. 1255 E. Arques Avenue ing systems. Coventor’s software tools and exper- Their world class electronic packaging products Sunnyvale, CA 94085 tise enable its customers to simulate and optimize include: AQ Fused silica; ideal for remarkable High Phone: 408-636-9500 Frequency Performance >20 GHz; EN-A1 Alkali MEMS device designs and fabrication processes Free Boro-Aluminosilicate; for IPD and interposer www.aseglobal.com before committing to time-consuming and costly substrates and Specialty glass frits/paste provide The ASE Group is the world’s largest provider of build-and-test cycles. The company is headquar- solutions for MEMS bonding, high frequency, and PV independent semiconductor manufacturing services tered in Cary, North Carolina and has offices in and LED applications. in assembly and test. As a global leader geared Silicon Valley, Calif., Cambridge, Mass., and Paris. towards meeting the industry’s ever growing needs Amkor Technology for faster, smaller and higher performance chips, E-tec Interconnect Ltd. the Group develops and offers a wide portfolio of 1900 S. Price Road technology and solutions including IC test program P.O. Box 4078 Chandler, AZ 85286 design, front-end engineering test, wafer probe, Mountain View, CA 94040 Phone: 480-821-5000 wafer bump, substrate design and supply, wafer Phone: 408-746-2800 www.amkor.com level package, flip chip, system-in-package, final www.e-tec.com Amkor Technology, Inc. is one of the world’s larg- test and electronic manufacturing services. E-tec Interconnect is an established supplier of est providers of advanced semiconductor assembly precision sockets and contactors for MEMS develop- and test services. Founded in 1968, Amkor has Boschman Technologies ment and test applications. Custom requirements become a strategic manufacturing partner for many Stenograaf 3 are welcome: they can accommodate virtually any of the world’s leading semiconductor companies 6921EX, Duiven, The Netherlands footprint including “mixed pitch” and “non-Jedec” and electronics OEMs, providing a broad array Phone: 480-488-9898 modules. Top and bottom openings can be modi- of advanced package design, assembly and test fied to satisfy a variety test set-ups including open solutions. Amkor’s operational base encompasses www.boschman.nl cavity probe and thermal emission microscopy. more than 5 million square feet of manufacturing Boschman Technologies is the worlds leading suppli- Standard features include: pin pitch from 0.3mm facilities, product development centers, and sales er of automatic molding systems using Film Assisted through 1.5 mm, pin counts up to 2000 and test & support offices in Asia, Europe and the United Molding (FAM) technology. QFN, SENSOR, MEMS, speeds to 40 GHz. SMT, thru-hole and solderless States. Amkor offers a suite of services, including Solar and other unique applications like Bio-Sensors mount options are available as well as various clo-

Wednesday, May 23, 2012 • Holiday Inn San Jose • San Jose, California MEPTECPRESENTS MicroElectronics Packaging and Test Engineering Council

TENTH ANNUAL MEMS TECHNOLOGY SYMPOSIUM

EXHIBITOR DIRECTORY sure styles. Their socket products are engineered ented Nasiri-Fabrication platform and patent-pend- MEMS Industry Group and manufactured by Swiss craftsmen, they are ing MotionFusion™ technology address the emerging competitively priced and expedited delivery is needs of many mass-market consumer applications 1620 Murray Avenue, 3rd Floor available. such as improved performance, accuracy, and Pittsburgh, PA 15217 intuitive motion and gesture based interfaces. Phone: 412-390-1644 FRT of America InvenSense technology can be found in consumer www.memsindustrygroup.com electronic markets including smartphones, tablets, MEMS Industry Group (MIG) is the unifying voice 1101 S. Winchester Blvd., L-240 gaming devices, optical image stabilization, and of the commercial MEMS community, representing San Jose, CA 95128 remote controls for Smart TVs. InvenSense is head- those companies with the goal of making money in Phone: 408-261-2632 quartered in Sunnyvale, California and has offices the MEMS market. By providing forums for informa- www.frtofamerica.com in China, Taiwan, Korea, Japan, and Dubai. tion exchange and collaboration they create the FRT is recognized as a valued partner for non- horizontal band across the broad range of compa- contact, optical metrology systems. FRT of America Kionix, Inc. nies supporting and utilizing MEMS technology. MIG is the virtual and physical place for people and serves you by providing high quality automated 36 Thornwood Drive organizations to come together to address industry measuring tools which fulfill your research, inspec- Ithaca, NY 14850 issues and further the commercialization of MEMS. tion and process verification needs. Delivering Phone: 607-257-1080 increased manufacturing yield, enhanced produc- tivity, improved quality and product performance, www.kionix.com memsstar because that’s what it’s about at the end of the Kionix, Inc. is a global MEMS inertial sensor manu- day. The MicroProf measures step height, shape, facturer, offering one of the industry’s broadest Starlaw Park, Starlaw Road thickness, roughness and more; their MicroProf families of tri-axis accelerometers and gyroscopes. Livingston EH54-8SF, United Kingdom TTV measures wafer thickness, TTV, bow and warp Consumer-electronics leaders worldwide utilize Phone: +44 1506 409160 for full thickness, thinned and bonded wafers and Kionix’s products, development tools and appli- www.memsstar.com their MicroSpy Topo DT is a high resolution 3D pro- cations to enable motion-based gaming; context memsstar is a leading provider of etch and deposi- filer with confocal and interferometric measuring awareness, personal navigation, remote control tion equipment and process expertise to the micro- modes. and hard drive drop protection in mobile products. electrical mechanical systems (MEMS) and semiconductor industries. The company’s vapor release Gel-Pak Lam Research Corporation and anti-stiction processes offer high performance processing solutions for tomorrow’s MEMS devices. 31398 Huntwood Avenue 4300 Cushing Parkway All wafer processing is performed on a single wafer Hayward, California 94544 Fremont, CA 94538 basis, and tool configurations range from a manual, Phone: 888-621-4147 / 510-576-2220 Phone: 510-572-0200 one-chamber R&D system to a fully automated www.gelpak.com www.lamrc.com cluster tool for high volume production. As well as Gel-Pak manufactures Gel-Coated boxes, trays, Lam Research Corporation is a leading supplier of its XeF2 and HF isotropic etch processes, memsstar slides and films that are designed to protect sensi- wafer fabrication equipment and services to the also offers a coatings chamber for the deposition of tive devices during transport and processing. The worldwide semiconductor industry, where they self assembled monolayers (SAM). company’s proprietary elastomer technology holds have been advancing semiconductor manufactur- devices in place without the use of custom molded ing for over 30 years. Their market-leading etch Micrel, Inc. pockets. The systems are distributed worldwide. products address a broad range of applications, from conductor and dielectric etch to emerging 2180 Fortune Drive InvenSense, Inc. MEMS, deep silicon, and 3D IC applications. Lam’s San Jose, CA 95131 clean portfolio incorporates both wet and plasma- Phone: 408-944-0800 1197 Borregas Avenue based technologies, allowing implementation of www.micrel.com Sunnyvale, CA 94089 customized yield-enhancing solutions. With their Micrel, Inc. is a leading manufacturer of IC solu- Phone: 408-988-7339 expertise and world-class global customer support, tions. Micrel’s Custom Foundry Services allow www.invensense.com Lam Research is addressing many of today’s most customers to develop proprietary process flows, InvenSense Inc. (NYSE: INVN) is the leading pro- advanced semiconductor processing challenges. from R&D to high-volume production. Products vider of MotionTracking™ solutions for consumer include mixed-signal, analog, and power semi- electronic devices in the world. The company’s pat- conductors, communication, clock management,

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Wednesday, May 23, 2012 • Holiday Inn San Jose • San Jose, California MEPTECPRESENTS MicroElectronics Packaging and Test Engineering Council

TENTH ANNUAL MEMS TECHNOLOGY SYMPOSIUM

EXHIBITOR DIRECTORY

Ethernet switch, and physical layer transceivers. Milestone Technology to meet their needs for optoelectronic packaging, Headquarters and state-of-the-art wafer fabrica- complex hybrid assembly and micron-level com- tion facilities are in San Jose, CA, with offices and 1292 Kifer Road, Suite 810 ponent attachment. Assembly Services, located design centers globally. Sunnyvale, CA 94086 in Carlsbad, CA, is the contract assembly, process Phone: 408-530-8378 development, test and prototyping division of MicroGen Systems, Inc. www.milestonefalab.com Palomar Technologies. Assembly Services provides Milestone Technology is a Failure Analysis Lab process expertise with high-precision die attach, 95 Brown Road, Suite 120 providing services for the MEMS, Semiconductor, wire bond and component placement services, Ithaca, NY 14850 LED, Medical Device, Solar, Electronics, Disk Drive, offering its customers an alternative route to meet Phone: 585-683-1430 Optical, Coating, Ceramics and Materials indus- complex packaging needs for without investing in www.microgensystems.com tries. They specialize in Ultra High Resolution capital equipment. MicroGen Systems, Inc. delivers the first MEMS SEM, EDX, Quantitative Analysis, Mapping, Precision based vibrational energy harvesters based on pat- Cross-Sectioning, Surface Contamination, FTIR, PCB Polytec, Inc. ented technology and intended to power autono- Inspection, Dye Pry, and Metallography. 16400 Bake Parkway mous and networked wireless sensors. Markets Irvine, CA 92618 include industrial (process and manufacturing Pac Tech USA Packaging Phone: 949-943-3033 monitoring) and commercial (appliances), auto- www.polytec.com motive, infrastructure and consumer. MicroGen Technologies Inc. has begun volume production for its first family 328 Martin Avenue Polytec is a world leader in optical measure- of products MEMS. Initial markets are industrial Santa Clara, CA 95050 ment systems, featuring the state-of-the-art Micro and commercial. MicroGen Systems, powering the Phone: 408-588-1925 System Analyzer (MSA-500) system for MEMS char- wireless world. www.pactech-usa.com acterization. The MSA system incorporates three key technologies: scanning laser Doppler vibrom- Pac-Tech USA Packaging Technologies Inc. facility Microplex, Inc. etry for out-of-plane deflection shape, strobe video in Santa Clara, California offers contract wafer microscopy for in-plane motion and white light 1070 Ortega Way bumping services using low cost electroless Ni/Au interferometry for static shape measurements. Placentia, CA 92870 under-bump metallization, solder stencil printing Their instruments are used throughout the MEMS Phone: 714-630-8220 and solder ball placement for quick-turn and mass- research community. www.microplexinc.com production. PacTech USA also provides product demonstrations, training and sales support. Pac PROMEX Industries, Inc. Microplex hole fill for silicon wafers (TSV) has a Tech designs and builds state-of-the-art wafer higher aspect ratio than plated copper hole plugs. bumping and assembly equipment for flip-chip and 3075 Oakmead Village Drive The copper fill is sintered at 850˚C and has a chip-scale packaging. Pac Tech is the worldwide Santa Clara, CA 95051 TCE that is better matched to silicon than that of leader in laser reflow and heating technology as Phone: 408-496-0222 plated copper. Their copper fill does not generate implemented in systems for solder jetting (SB2) and www.promex-ind.com the stresses of plated copper hole plugs resulting flip-chip attach (LAPLACE) for advanced packaging PROMEX, Silicon Valley’s Packaging Foundry, inte- in a more reliable product. Microplex also has the applications like HGA assembly, MEMS and opto- grates IC Assembly, materials-centric Advanced capability to make circuits with 25 micron lines, 25 electronic packaging, LCD driver assembly, etc. micron spaces, and 25 micron interconnects (hole Packaging with broad process and technical knowl- fill) on 250 micron thick ceramic. The pattern is edge, enabling customers to take new products to etched and the resolution is comparable to that Palomar Technologies market faster than by any other route. Chip-on- Board and High Reliability SMT are also available. of thin film circuits. The gold conductors can be 2728 Loker Avenue West JEDEC standard, custom and open cavity plastic etched thick film or Printed Thin Film (PTF). Their Carlsbad, CA 92010 molded QFN’s. Promex is a recognized leader in 2D, printed thin film can be plated with nickel and gold Phone: 760-931-3600 to allow soldering and wire bonding. 2.5D, 3D and RoHS compliant Advanced Packaging www.palomartechnologies.com including SiPs, MEMS, Medical Devices, Image Palomar Technologies, a former subsidiary of Sensors & RF modules. ISO 9001, ISO 13485 Medical Hughes Aircraft, is the global leader of auto- registered, ITAR certified. Worldwide customers mated high-accuracy, large work area die attach are provided quick turns, process development, and wire bond equipment and precision contract prototypes through NPI, coupled to scalable volume assembly services. Customers utilize the products, production in our partnership centered culture. services and solutions from Palomar Technologies

Wednesday, May 23, 2012 • Holiday Inn San Jose • San Jose, California MEPTECPRESENTS MicroElectronics Packaging and Test Engineering Council

TENTH ANNUAL MEMS TECHNOLOGY SYMPOSIUM

EXHIBITOR DIRECTORY

Quartet Mechanics Silex Microsystems film and thin-film diamond products for advanced thermal management and cutting tool applications, 1040 Di Giulio Avenue, Suite 200 580 California Street, Suite 1200 CVD diamond coating and material services, hot Santa Clara, CA 95050 San Francisco, CA 94104 filament CVD reactor systems and diamond deposi- Phone: 408-200-8345 Phone: 415-283-3399 tion consulting services. www.quartetmechanics.com www.silexmicrosystems.com Based in the Silicon Valley, California, Quartet Silex Microsystems is a world-leading MEMS foundry STPKC Mechanics has core technology that lies in the that brings advanced process technologies and Academic City areas of micron-level precision material handling, manufacturing capacity to a wide range of high- Dubai / UAE 300109 machine vision systems, advanced clean-room tech companies. Currently Silex operates two Phone: +971 56 729 1679 robotics and custom automation. Their product state-of-the-art MEMS fabs with 6” and 8” wafer suite features standard or custom tool devel- size respectively. They serve customers in a wide www.stpkc.com opment, robotics and peripherals, high preci- range of application areas, such as automotive, Semiconductor Technology Package Consulting sion component tooling/fabrication, and tool medical, consumer electronics and more. Among (STPKC) is a fabless design centre for packages and connectivity/e-diagnostics. All their components the sensors manufactured are pressure sensors, modules. Due to increased challenges in packaging, are designed with module and versatile concept, accelerometers, gyros and also components for STPKC helps customers to co-design packages for so a single tool can bridge various substrate flow control, ink jet printing and drug delivery. MEMS and IC applications. They work hand in hand materials, sizes, shapes, process steps with no Silex is also well recognized for its world leading with their customers from concept to Design for or limited change-over. High through-put 4-axis through wafer via processes (Sil-Via® and Met-VIA® ) Manufacturing (DFM). SCARA robots with machine vision are used for that enables wafer level packaging of MEMS and alignment & placement for your micro manufac- CMOS using the extended process modules Sil-CAP™ SVTC Technologies, LLC turing. Regardless of wafer thickness, from 50 µm and Met-CAP™. thin wafers to 6mm bonded wafers, or perforated, 3833 North First warped, bumped, and over-sized carrier wafers, SoftMEMS San Jose, CA 95134 their wafer transfer automation solution provides Phone: 408-240-7000 the precision and repeatability tolerance required 2391 Nobili Avenue www.svtc.com by the MEMS industry. Santa Clara, CA 95051 Phone: 408-426-4301 SVTC Technologies provides development and com- www.softmems.com mercialization services for innovative semiconduc- Quik-Pak tor process-based technologies and products, cost- 10987 Via Frontera SoftMEMS is the creator of the popular, power- effectively and in an IP-secure manner. Through San Diego, CA 92127 ful, easy-to-use CAD tool suites MEMS Pro, MEMS facilities in San Jose, California, and Austin, Texas, Phone: 858-674-4676 Master and MEMS Xplorer. Software functionalities SVTC serves customers in rapidly growing markets encompass mixed MEMS/IC schematic capture, www.icproto.com such as novel memory, novel transistors, logic, simulation, optimization, statistical analysis, full MEMS, biotechnology, image sensors and photovol- Quik-Pak, a division of Delphon Industries, provides custom mask layout, manufacturing rule verifica- taics. SVTC offers a suite of leading-edge equip- IC packaging and assembly services. The company’s tion, 3D model generation and visualization from ment and services, including full-scale 8-inch and newest offering is its OmPP package. These pre- manufacturing process descriptions, behavioral 12-inch process capabilities, advanced CMOS and molded QFN packages provide a fast, inexpensive model creation and links to 3D analysis packages. non-CMOS equipment, analytical services, develop- solution for your prototype or sample requirement support tools and commercialization services. ments. Quik-Pak also specializes in a variety of ser- sp3 Diamond Technologies, Inc. SVTC is ISO 9001 and ITAR certified. SVTC’s inves- vices that together provide a full turn-key solution tors include Oak Hill Capital Partners, Tallwood including wafer preparation, die/wire bonding, 1605 Wyatt Drive Venture Capital and the company’s management remolding and marking/branding. Custom assembly Santa Clara, CA 95054 and employees. services are also offered for Flip Chip, Ceramic Phone: 408-492-0630 Packages, Chip-on-Board, Stacked Die, MEMS, etc. www.sp3diamondtech.com Founded in 1993 and headquartered in Santa Clara, California, USA, sp3 Diamond Technologies makes chemical vapor deposition (CVD) diamond for a broad range of applications where current materials have reached their limit. sp3 provides thick- (continued)

Wednesday, May 23, 2012 • Holiday Inn San Jose • San Jose, California MEPTECPRESENTS MicroElectronics Packaging and Test Engineering Council

TENTH ANNUAL MEMS TECHNOLOGY SYMPOSIUM

EXHIBITOR DIRECTORY

Tousimis XACTIX, Inc. 2211 Lewis Avenue 2403 Sidney Street, Suite 300 Rockville, CA 20851 Pittsburgh, PA 15203 Phone: 301-881-2450 Phone: 412-381-3195 www.tousimis.com www.xactix.com Tousimis manufactures highly reliable Supercritical XACTIX is the manufacturer of the Xetch® xenon CO2 Dryers which enable delicate micro 3-D struc- difluoride (XeF2) etching systems with many differ- tural preservation. Their Critical Point Dryer (CPD) ent models to support small labs through high vol- process technology eliminates surface tension forc- ume production. These dry isotropic etching tools es. Current CPD applications include MEMS, Bio- are used to etch silicon, molybdenum and germani- MEMS, AeroGel, Nano Particle, Carbon Nanotube, um and are popular in the MEMS community due to Graphene and others. Tousimis is a USA based com- high selectivity versus many standard films includ- pany located in the Washington D.C. area. Tousimis ing photoresist, silicon dioxide, silicon nitride, and supports all products with their global sales and aluminum. The Xetch® systems are particularly well service support network. suited for release, but are certainly not limited to MEMS applications and are useful for many appli- Unisem Group cations where highly selective isotropic silicon, molybdenum and germanium etching is required. 1284 Forgewood Avenue XACTIX also provides XeF2 etching services. Sunnyvale, CA 94089 Phone: 408-734-3222 Yole Développement www.unisemgroup.com Le Quartz, 75 cours Emile Zola Unisem Group is a global provider of semiconduc- 69100 Lyon-Villeurbanne, France tor assembly and test services for many of the Phone: +33-472-83-01-80 world’s most successful electronics companies. Unisem offers an integrated suite of packaging www.yole.fr and test services such as wafer bumping, wafer Beginning in 1998 with Yole Développement, they probing, wafer grinding, a wide range of of lead- have grown to become a group of companies frame and substrate IC packaging including leaded, providing market research, technology analysis, QFN, BGA and FlipChip packages, and high-end strategy consulting, media in addition to finance RF and mix-signal test services. The company’s services. With a solid focus on emerging appli- turnkey services include design, assembly, test, cations using silicon and/or micro manufactur- failure analysis, and electrical and thermal char- ing, Yole Développement group has expanded acterization. With approximately 10,000 employ- to include more than 50 associates worldwide ees worldwide, Unisem has factory locations in covering MEMS, MedTech, advanced packaging, Ipoh, Malaysia; Wales, United Kingdom; Chengdu, compound Semiconductors, power Electronics, lED, People’s Republic of China; Batam, Indonesia and and photovoltaics. The group supports companies, Sunnyvale, California, USA. The company is head- investors and r&D organizations worldwide to help quartered in Kuala Lumpur, Malaysia. them understand markets and follow technology trends to develop their business.

Wednesday, May 23, 2012 • Holiday Inn San Jose • San Jose, California MEPTECPRESENTS MicroElectronics Packaging and Test Engineering Council

TENTH ANNUAL MEMS TECHNOLOGY SYMPOSIUM

MEMS FOR ALL OF US PARTICIPANTS

Hillcrest Laboratories, Inc. 15245 Shady Grove Rd, S-400, Rockville, MD 20850 Phone: 240-386-0600 VectorNav Technologies www.hillcrestlabs.com Sensor Platforms, Inc. 903 N. Bowser Rd., S-200, Richardson, TX 75081 Hillcrest Labs is a leading global supplier of motion 2860 Zanker Road, Suite 210, San Jose, CA 95134 Phone: 512-772-3615 processing solutions. These solutions capture human www.vectornav.com and mechanical movement and translate it into Phone: 408-850-9350 motion patters which can be used to control and www.sensorplatforms.com VectorNav Technologies specializes in manufacturing high performance inertial measurement units interact with devices. With more than a decade Sensor Platforms is a venture-financed company and orientation sensors using the latest miniature of MEMS experience, a unique perspective on the located in Silicon Valley that licenses algorithmic solid-state MEMS inertial sensor technology. Since its natural user experience, a global patent portfolio software and platforms, enabling mobile consumer founding by five graduates of Texas A&M University and numerous successful mass market deployments, applications to better serve the users. The compa- in 2008, VectorNav has been providing customers they enable partners to quickly and effectively ny’s FreeMotion™ Library provides the sophisticated worldwide access to high quality, fully calibrated enhance and differentiate products through motion. intelligence needed to process data from various orientation sensors with state-of-the-art digital Hillcrest offers both software and hardware solu- sensors in smartphones and tablets, to interpret filtering technology. With a strong background in tions for creating motion enabled products, and users’ movements, situations and, inferentially, Aerospace Engineering and experience in the devel- has customers and licensees throughout Smart TV, intents. The library allows device OEMs to purchase opment and testing of spacecraft, launch vehicles, Mobile Device, Gaming and Industrial sectors. sensors from multiple suppliers, and optimizes and micro-aerial vehicles, VectorNav brings high power consumption to enable longer battery life. performance Aerospace filtering and calibration To achieve these benefits Sensor Platforms has techniques into the world of low-cost industrial assembled a team with expertise in control systems, grade MEMS sensors, expanding the possibilities of machine learning, mixed signal design, motion kine- today’s MEMS sensor technology. matics, semiconductor device physics, and signal processing.

Movea, Inc. 6160 Stoneridge Mall Rd, Pleasanton, CA, 94588 Phone: 925-271-7470 www.movea.com Xsens Movea is the leading provider of motion-processing Syride Pantheon 6a, 7521 PR, Enschede, The Netherlands technologies including software, embeddable solu- 37 Anita Avenue, La Selva, CA 95076 Phone: +31 (0)88 97367 00 tions, and semiconductor IP for motion-enabled Phone: 831-345-5969 www.xsens.com application development. Movea’s unique motion- www.syride.com processing capabilities enable their customers to Xsens is the leading innovator in 3D motion tracking quickly add motion intelligence to their prod- Syride created a lightweight (110g) and profiled technology and products. Its sensor fusion tech- ucts. Through their easy-to-integrate technologies, (12.5 x 12.5 x 2cm) device which is the culmination nologies enable a seamless interface between the Movea clients can reduce their risk, cost, and of five years of research dedicated to the growing digital and physical world in consumer electronics time-to-market to deliver compelling motion-based needs of extreme sports athletes (surfers, paraglid- devices and professional applications such as 3D features that set their products apart from the com- ers, etc.) wishing to conduct detailed monitoring of character animation, motion analysis, and industrial petition and create more end-user value. their practice to progress better and faster, and the control & stabilization. Clients and partners include ability to share and relive their experience. Electronic Arts, NBC Universal, Daimler, Autodesk, Sagem (Safran Group), Siemens and other leading institutes and companies throughout the world. Founded in 2000, Xsens is a privately held company with headquarters in Enschede, the Netherlands and a US subsidiary in Los Angeles, California.

Wednesday, May 23, 2012 • Holiday Inn San Jose • San Jose, California MEPTECPRESENTS MicroElectronics Packaging and Test Engineering Council

TENTH ANNUAL MEMS TECHNOLOGY SYMPOSIUM

MORNING KEYNOTE

SENSORY SWARMS Professor Kristofer Pister Electrical Engineering and Computer Science University of California, Berkeley

Reliable, low-power wireless sensor networking will bring an explosion in the demand for MEMS sensors. By reducing the cost of installation by an order of magnitude, wireless networking allows sensors to be used in new applications where they were previously impractical. For five years wireless networked sensors have been improving efficiency in industrial process automation, with multi-vendor interoperable systems deployed in over 100 countries, and revolutionizing the industry. With the introduction of efficient coding for Internet Protocol packets, each sensor can now have its own IPv6 address and communicate to cloud-based business logic and applications, setting the stage for similar revolutions in building automation, urban infrastructure, smart grid and energy efficiency, and countless other applications.

Wednesday, May 23, 2012 • Holiday Inn San Jose • San Jose, California MEPTECPRESENTS MicroElectronics Packaging and Test Engineering Council

TENTH ANNUAL MEMS TECHNOLOGY SYMPOSIUM

ACCELERATING MEMS MARKET TO $TRILLION/TRILLION UNITS Janusz Bryzek, Ph.D. VP MEMS Development Fairchild Semiconductor

This presentation introduces a bold vision: potential for MEMS market to reach $1 trillion dollars in the next ten years. Several discussed pointers confirm a potential for such growth. Clearly, the MEMS market is entering an explosive growth phase. Various analysts have estimated a growth of 12-15% per year from $1.5B base in 2012, translating to a MEMS market of ~$1 trillion in 35 years (2046). To reach that market in only 10 years, growth would have to be accelerated to 56% a year.

Acceleration of growth will require significantly faster MEMS R$D and commercialization cycles. Acceleration of R&D cycles will need new software tools enabling dramatically better process modeling. Acceleration of commercialization cycles will require standard MEMS processes.

This presentation will discuss different pointers to accelerated MEMS market growth and the impact of such growth.

Wednesday, May 23, 2012 • Holiday Inn San Jose • San Jose, California MEPTECPRESENTS MicroElectronics Packaging and Test Engineering Council

TENTH ANNUAL MEMS TECHNOLOGY SYMPOSIUM

IMPLEMENTING THE TRILLION DOLLAR MEMS ROADMAP Robert Haak CEO, Insight interAsia Pte Ltd. Vice President - Asia/Pacific, Executive Board of Directors, MANCEF

The rationale for this roadmap is a bold initiative to break from current MEMS sales growth patterns and leap to a new factor of improvement in MEMS sales. This would move the industry from a current hyper competition environment to one more of co-opetition.

This presentation will propose a three-part technology roadmap that requires the interface of at least three elements of the systems: (1) the sensor technology itself, (2) the technology of data transfer from the sensor, and (3) the technology behind the equipment used to process the data.

This roadmap is a market goal generated roadmap effort. Cooper (1994) was one of the first roadmapping professionals to focus on the market-generated roadmaps initiated in the late 1990’s. New market goal roadmap efforts look toward market drivers that could generate the need for their products as the top strata of their roadmaps. The base proposition of this roadmap is the need for ubiquitous sensing. Social media will be used to develop drivers but two candidate examples of markets with needs are (1) highway infrastructure and (2) preventative medicine sensing.

With highway infrastructure, for example, much of today’s US highway infrastructure was built during the Eisenhower administration to meet 50-year lifetime conditions. Today, the average bridge in that infrastructure is 48 years old and the average bridge costs approximately $17,000 to inspect annually. Micro- and nano-sensors are key elements in this the sensing network and California is a lead user.

Roadmaps must have a timeline in order to be useful to anyone. The usual roadmap timeline starts at present day and progresses to a review in 5 years, then finalizes at 15 years. We do not see a reason to change this.

We must sequence the three roadmaps to meet the requirements of a system that would enable the growth sensor sales that we aim for. The approved candidate sensors will be used as the product platforms in the roadmap for sensors.

Wednesday, May 23, 2012 • Holiday Inn San Jose • San Jose, California MEPTECPRESENTS MicroElectronics Packaging and Test Engineering Council

TENTH ANNUAL MEMS TECHNOLOGY SYMPOSIUM

CENSE: AWARENESS THROUGH A TRILLION MEMS SENSORS Rich Friedrich Director of the CeNSE Program Hewlett-Packard Labs

Central Nervous System for the Earth (CeNSE) is a project involving multiple Hewlett-Packard groups focused on enabling a sensory system consisting of a trillion micro and nanoscale sensors embedded in the environment. CeNSE will provide real-time monitoring of surroundings for mission-critical business, environmental, health, and safety applications such as large structure integrity, medical monitoring, food safety, and energy use. By harvesting vast amounts of data and analyzing it to find correlations in space and time, we will enable customers to optimize their operations, anticipate their needs, and understand their impact. At the extremities of this system, HP is developing sensors with sensitivities that approach the limits of what is physically detectable. CeNSE will accelerate the growth rates of MEMS markets as the platform matures and the demand for deployed sensors reaches new applications. The enhanced awareness provided by CeNSE will revolutionize how we interact with the planet, technology, and each other.

Wednesday, May 23, 2012 • Holiday Inn San Jose • San Jose, California MEPTECPRESENTS MicroElectronics Packaging and Test Engineering Council

TENTH ANNUAL MEMS TECHNOLOGY SYMPOSIUM

ON THE ROAD TO $1T? Gregory J. Galvin, Ph.D. President/CEO Kionix, Inc.

MEMS is certainly among the fastest growing markets in the world. However, the confluence of mobility, inter- connectivity and self-awareness suggests that the future of MEMS could be significantly brighter than even the most optimistic current forecasts. Recent years have seen a very rapid proliferation of MEMS devices, both sensors and actuators, entering large volume commercial applications. In less than a decade, MEMS microphones will have grown from zero units to annual production in the multiple billions. MEMS oscillators today are less than one percent of that multiple billion dollar market, yet could potentially show the same accelerated and disruptive growth as happened with MEMS microphones.

Several societal trends suggest the possibility of even more remarkable growth for the MEMS industry. First is mobility. Our electronic products have become ever more mobile, personal and indispensible. Second is inter- connectivity. Our electronic products are all interconnected, with each other and with the rest of the world. Information can be gathered anywhere and shared everywhere. Finally, our electronic products are becoming self-aware. They know where they are, what they are doing, what is happening around them and they can take appropriate actions on their own – all to the benefit of their users. MEMS devices, and an ever growing number of them, are integral to enabling these three trends.

This presentation will discuss the high-volume MEMS programs at Kionix, one of the leading suppliers of MEMS inertial sensors, and look at the potential for MEMS markets to reach the trillion dollar threshold over the next decade.

Wednesday, May 23, 2012 • Holiday Inn San Jose • San Jose, California MEPTECPRESENTS MicroElectronics Packaging and Test Engineering Council

TENTH ANNUAL MEMS TECHNOLOGY SYMPOSIUM

THE MEMS REVOLUTION: FROM BILLIONS TO TRILLIONS? Jérémie Bouchaud Director and Senior Principal Analyst MEMS and Sensors IHS iSuppli

This presentation will provide feedback on the trillion-dollar market opportunity as envisioned in the Micro and Nanotechnology Commercialization Education Foundation (MANCEF) roadmap.

MEMS is definitely in the era of billions today. The market will be bolstered at a rate of $1 billion per year in value over the next 5 years. Some companies shipped close to one billion units MEMS last year e.g. Knowles and ST. However, IHS iSuppli struggles with the vision of a $Trillion MEMS market, even in 20 years’ time. The presentation will explain why, referring to certain “pointers to accelerated MEMS market growth” of the roadmap to a $Trillion MEMS market.

One must keep in mind that the market is highly price elastic. Even if, with a lot of imagination, the market expands to trillions of sensors in a few decades, this would only happen if these devices cost not $10, not even $1, but just a few cents. 12-bit accelerometers are already shipping for less than $0.35 today and even at this price, they are still in the low billion range. The same applies to microphones, which sell for less for $0.25 today. It means that a trillion units MEMS market would only generate a value in the $10s of billion range. IHS iSuppli believes that to be realized, this vision of the trillion sensors market must be extended far beyond MEMS, to non-MEMS sensors that are more relevant for the “Internet of things”, e.g. environmental sensors like temperature, light, humidity, UV, etc, and to non-MEMS sensor fabrication technologies that are more likely to reach the sub $0.05 points needed for opening up trillions of units market, like large area plastic electronics.

Wednesday, May 23, 2012 • Holiday Inn San Jose • San Jose, California MEPTECPRESENTS MicroElectronics Packaging and Test Engineering Council

TENTH ANNUAL MEMS TECHNOLOGY SYMPOSIUM

AFTERNOON KEYNOTE

MOTION INTERFACE THE NEXT LARGE MARKET OPPORTUNITY Steve Nasiri Founder, President, CEO and Chairman InvenSense

Every now and then, some new technology surfaces as the next Must-Have function that transforms the consumer products landscape; Bluetooth, Camera Modules, WiFi, and Touch Screens, to name just a few. Motion Interface rapidly has become that next Must-Have function in all mobile consumer products. At the outset within the Nintendo Wii and now found in all high-end Smart Phones and Tablets, and expected to be penetrat- ing many other consumer products, such as, Smart TV’s remote controllers, Wearable Devices, Ski Goggles, Power Screwdrivers, Golf Putters, Sporting Shoes, Quad-helicopters, and many more. This presentation will discuss the key fundamental technologies, challenges, benefits, and overview of various use cases.

Wednesday, May 23, 2012 • Holiday Inn San Jose • San Jose, California MEPTECPRESENTS MicroElectronics Packaging and Test Engineering Council

TENTH ANNUAL MEMS TECHNOLOGY SYMPOSIUM

STATUS OF THE MEMS INDUSTRY NEW DRIVERS: THE PATH TO NEW OPPORTUNITIES J.C. Eloy President and CEO Yole Développement

Now the infrastructure is ready to create more sophisticated applications integrating gyroscopes and magnetometers, generating robust demand for 18.6% average annual growth in sensor units from 2011 to 2016. But there’ll be big changes as well, as prices will continue to drop, and a host of players along the complex new value chain all scramble to figure out how best to compete and cooperate for the much bigger business of integrating the silicon sensors into useful functions. Continued price declines will hold revenue growth to a still respectable 11.4% CAGR, to become a $2.74 billion market opportunity by 2015, but split among a growing crowd of suppliers.

Despite the complexities of designing and fabricating MEMS devices, most of the value in these functions is not actually in the fabrication of the MEMS die. Yole Développement figures the actual cost of front end manufacturing of the MEMS die will account for only about 17% of the total $2.6 billion total consumer and automotive inertial sensor revenue this year, while the ASIC, the packaging, the test & calibration and the software production costs make up some 41%, leaving roughly 42% total gross margin to be divided up among all the players in the value chain. Moreover, the MEMS die is likely to become an even smaller part of the total cost going forward as the sensors scale to smaller size and ASPs fall. Meanwhile, the demands on the package, the test and the software are growing more complex, and their value is likely to increase.

Outside of the consumer electronics, the applications of MEMS are also increasing both in term of numbers and value. The game is just how to shrink the time to market of such applications and simplify the adoption of MEMS solutions from a module of system maker point of view.

How to reach a $1Tr MEMS markets? The presentation will highlight YOLE opinion on the collaborative actions to implement to let the MEMS business fly where it has to be: an enabling function helping systems and modules to understand and act on their external environment.

Wednesday, May 23, 2012 • Holiday Inn San Jose • San Jose, California MEPTECPRESENTS MicroElectronics Packaging and Test Engineering Council

TENTH ANNUAL MEMS TECHNOLOGY SYMPOSIUM

REALIZING THE FULL POTENTIAL OF MEMS DESIGN AUTOMATION Stephen Breit, Ph.D. Vice President Engineering Coventor, Inc.

Software tools for MEMS and IC designers have the potential to dramatically increase the efficiency of MEMS product development and integration. We propose a deceptively simple criterion for determining whether this potential has been achieved: Software tools must be able to simulate all specs on a product data sheet as well as manufacturing yield with sufficient accuracy and speed to justify the elimination of build-and-test cycles. We first discuss the broad implications of this criterion in light of two industry realities: continuing innovation in MEMS processes, and increasing integration of MEMS and electronics at the package, wafer and process levels. We then review the capabilities of state-of-the-art software tools and methodology versus the criterion and its implied requirements, identifying what is currently possible, and what gaps remain. Our review leads us to identify key requirement for fully realizing the potential of MEMS design automation: improved understanding of MEMS processes through characterization and/or standardization; tools and methodology that enable Design for Manufacturing; and a MEMS verification flow that complements the existing analog/mixed-signal verification flow.

Wednesday, May 23, 2012 • Holiday Inn San Jose • San Jose, California MEPTECPRESENTS MicroElectronics Packaging and Test Engineering Council

TENTH ANNUAL MEMS TECHNOLOGY SYMPOSIUM

HIGH VOLUME ASSEMBLY & TEST SOLUTIONS TO MEET THE RAPIDLY GROWING MEMS MARKET Russell Shumway Sr. Manager, MEMS & Sensor Packaging Amkor Technology

We are facing explosive growth of product opportunities as the creative application of known fab techniques are used to create silicon-based MEMS transducers and sensors. With a lack of packaging standards in past years, the form factor of these product solutions have been nearly as diverse as the applications they serve. However, the rapid growth of MEMS can be accelerated when manufacturing approaches become more standard and available. The unique requirements of various sensors will be discussed along with approaches toward streamlining MEMS for high volume manufacturing which can enjoy cost and scale efficiencies of mature manufacturing platforms.

Wednesday, May 23, 2012 • Holiday Inn San Jose • San Jose, California MEPTECPRESENTS MicroElectronics Packaging and Test Engineering Council

TENTH ANNUAL MEMS TECHNOLOGY SYMPOSIUM

SPECIAL SESSION

MEMS FOR ALL OF US

The explosion of the MEMS sensor market has brought MEMS devices to consumer products. The use of multi-axis multi-function sensors data to support complex functions, such as navigation, body movement modeling, image stabilization, etc., triggered the emergence of a new industry: sensor data processing software companies.

This session will introduce six companies, and the technology behind their products which are driven by sensors and sensor software. At the post-conference reception attendees will have an opportunity to have hands on demos with the products.

Wednesday, May 23, 2012 • Holiday Inn San Jose • San Jose, California MEPTECPRESENTS MicroElectronics Packaging and Test Engineering Council

TENTH ANNUAL MEMS TECHNOLOGY SYMPOSIUM

FUSING SENSORS INTO MOBILE OPERATING SYSTEMS AND INNOVATIVE USE CASES Tristan Joo Board Director & Co-Chair of Mobile SIG Wireless Communications Alliance

Indoor navigation LBS and gesture enabled 3D games using motion sensors, gesture & touchless user interfaces, Augmented Reality, context-aware services – these are the next-generation use cases enabled by the latest advances in MEMS and other sensor technologies. With the next wave of smartphones and tablets proliferating, User Experience (UX) differentiation is becoming ever-more important to stay market-competitive. Yet, mobile apps that utilize such sensors are still underwhelming and fragmentation remains a major issue. However, as the native integration of variety of sensors accelerate across mobile operating systems and as “sensor fusion and standardization” advances innovative use cases, mobile apps, and device designs further, the overall UX enhancements will dramatically transform the mobile industry out to a new frontier.

Wednesday, May 23, 2012 • Holiday Inn San Jose • San Jose, California MEPTECPRESENTS MicroElectronics Packaging and Test Engineering Council

TENTH ANNUAL MEMS TECHNOLOGY SYMPOSIUM

HILLCREST LABORATORIES, INC. Justin Zink Sales, Marketing and Business Development

The technology behind the Freespace® products that Hillcrest Labs will be demonstrating are MEMS sensors – specifically Accelerometers, Magnetometers and Gyroscopes. These sensors, when combined with Hillcrest’s advanced MotionEngine™ sensor calibration and sensor fusion software, enable users to control products and their interfaces through motion. Hillcrest’s motion control products are unique due to their industry leading accuracy, precision and intuitiveness. The quality of motion control opens a wide range of applications for the products, including consumer electronics, health and fitness and industrial products.

Wednesday, May 23, 2012 • Holiday Inn San Jose • San Jose, California MEPTECPRESENTS MicroElectronics Packaging and Test Engineering Council

TENTH ANNUAL MEMS TECHNOLOGY SYMPOSIUM

MOVEA, INC. Dave Rothenberg WW Marketing and Communications

Movea will be demonstrating MotionCore, a family of dedicated motion-processing IP cores optimized for mobile applications. This solution enables customers and partners to quickly add motion intelligence to their products, meaning reduced risk, cost, and Time-to-Market for delivering compelling new motion-based features that create more end-user value such as gesture based interfaces, pedestrian navigation or activity monitoring on mobile platforms. MotionCore components benefits include increased performance and reduced power consumption associated to motion processing for mobile platforms.

Wednesday, May 23, 2012 • Holiday Inn San Jose • San Jose, California MEPTECPRESENTS MicroElectronics Packaging and Test Engineering Council

TENTH ANNUAL MEMS TECHNOLOGY SYMPOSIUM

SENSOR PLATFORMS, INC. Kevin A. Shaw, Ph.D. Chief Technology Officer

Sensor Platforms FreeMotion™ Library: Sensors are the force behind revolutionary changes in the way we use mobile devices. In the first phase, we were taught to move the device to change the screen or to play a game. This ‘motion’ based approach was mostly about us learning the right gesture for the right function. However, the next phase of sensors will be far more powerful. Now, mobile devices will start adapting to users and start learning to understand our needs. These ‘Context Aware’ devices are less about motion and more about understanding us. These devices can turn on when we look at them; mute the ringer when we are in a meeting and bounce to voicemail all phone calls when I drive except those from my spouse. Sensor Platforms has already established a powerful presence in the sensor community with its best-in-class Sensor Fusion algorithms, and now we are building the Context Awareness algorithms to usher in the next generation of mobile devices.

Wednesday, May 23, 2012 • Holiday Inn San Jose • San Jose, California MEPTECPRESENTS MicroElectronics Packaging and Test Engineering Council

TENTH ANNUAL MEMS TECHNOLOGY SYMPOSIUM

SYRIDE Romain Lazerand Consultant

Syride created a device that is composed of a 9-axis Accelerometer – Magnetometer – Gyrometer which allows for sports practitioners to relive and share their experience. They are currently focusing on surfing and para- gliding. Surfers and paragliders will be able to see their “session” in data form like never before: from speed to G-force through 3D movement tracking and many other insights like calories burned, wave height/flight tracking, safety tools, etc. Overall, it will make people progress faster and better making the overall sport evolve even faster!

Wednesday, May 23, 2012 • Holiday Inn San Jose • San Jose, California MEPTECPRESENTS MicroElectronics Packaging and Test Engineering Council

TENTH ANNUAL MEMS TECHNOLOGY SYMPOSIUM

VECTORNAV TECHNOLOGIES Jeremy Davis, Ph.D. Director of Engineering

VectorNav will be demonstrating the newly released VN-200 Inertial Navigation Sensor. The VN-200 utilizes 3-axis MEMS accelerometers, magnetometers, gyros, a MEMS pressure sensor, and a GPS module to produce a high accuracy orientation, position, and velocity solution. VectorNav’s state of the art sensor fusion software, the Vector Processing Engine (VPE), performs advanced dynamic tuning and disturbance rejection and has been upgraded to handle GPS and pressure sensor measurements on the VN-200. The small form factor combined with its advanced sensor fusion algorithms enables inertial navigation for a wide variety of new and existing applications.

Wednesday, May 23, 2012 • Holiday Inn San Jose • San Jose, California MEPTECPRESENTS MicroElectronics Packaging and Test Engineering Council

TENTH ANNUAL MEMS TECHNOLOGY SYMPOSIUM

XSENS Casper Peeters CEO

Xsens will be demonstrating its motion capture system with on-body motion sensor modules, each containing gyroscopes, accelerometers and magnetometers. The system is widely used by creators of animations for computer games and movies, scientists in sports and biomechanics and many other professionals. At today’s rapid decrease in size and costs of MEMS sensors, mass adoption of the body motion tracking technology for consumer applications in gaming, sports or healthcare will soon come within reach.

Wednesday, May 23, 2012 • Holiday Inn San Jose • San Jose, California About MEPTEC

MEPTEC (Microelectronics Packaging and Test Engineering Council) is a trade association of semiconductor suppliers, manufacturers, and vendors concerned exclusively with packaging, assembly, and testing, and is committed to enhancing the competitiveness of the back-end portion of the semiconductor industry. Since its inception over 30 years ago, MEPTEC has provided a forum for semiconductor packaging and test professionals to learn and exchange ideas that relate to packaging, assembly, test and handling. Through our monthly luncheons, and one-day symposiums, and an Advisory Board consisting of individuals from all segments of the semiconductor industry, MEPTEC continuously strives to improve and elevate the roles of assembly and test professionals in the industry. For more information about MEPTEC events and member- ship visit our website at www.meptec.org.

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