Introduction from the Ieee 69Th Ectc Program Chair Nancy Stoffel
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Weekender July-2021 Web.Pdf
JUL-AUG 2021 FULL SPEED AHEAD SUMMER SIPPERS TIME IS RUNNING OUT Takuya Haneda hopes to paddle his New and true Japanese liqueurs that Japan’s slapdash love affair with SDGs canoe to gold at Tokyo 2020 will hold the Tokyo heat at bay is anything but sustainable — 2 — Weekender_August_Master_002.indd 2 2018/07/24 11:41 CONTENTS RADAR IN-DEPTH TRAVEL THIS MONTH’S HEAD TURNERS COFFEE-BREAK READS WHERE TO GO 8 AREA GUIDE: TOKYO’S LUMBERYARD 20 BALLET IN THE TIME OF CORONA 46 SHONAI SHRINE Once Tokyo’s center for all things wood, How National Ballet of Japan’s new artistic Embark on small adventures on the grounds Shin-Kiba now brightens up at night as a director Miyako Yoshida stays on her toes. of a former Yamagata castle. popular entertainment hub. 23 KYOTO IN SYMPHONY 50 SPORTS PARADISE 10 STYLE: ODE TO THE BIRDS Composer Marios Joannou Elia orchestrates a Traditional and modern sports have deep Photographer and filmmaker Boa Campbell masterpiece of sound dedicated to Kyoto. roots in Kyushu’s Miyazaki Prefecture. takes us on a flight through Tokyo’s world of modern fashion. 26 A DAY IN THE LIFE OF A SHAMISEN 52 KYUSHU BY TRAIN MAKER Escape to these iconic locales with 16 SHOP JAPAN: BEST OF THE BEACH The designer of Tokyo 2020’s official shamisen assistance from the JR Kyushu Rail Pass. These Japan-made summer accessories spreads the word about the native instrument. help anyone stay cool and look stylish on their next seaside excursion. 30 ON IMPULSE GUIDE Special effects makeup artist extraordinnaire CULTURE ROUNDUP 18 TRENDS: 5 JAPANESE LIQUEURS Amazing Jiro takes TW inside his twisted world. -
Japanese Female and 'Trans' Athletes
Japanese Female and ‘Trans’ Athletes: Negotiating Subjectivity and Media Constructions of Gender, Sexuality, and Nation by Satoko Itani A thesis submitted in conformity with the requirements for the degree of Doctor of Philosophy Department of Curriculum, Teaching & Learning Ontario Institute for Studies in Education University of Toronto © Copyright by Satoko Itani (2015) Japanese Female and ‘Trans’ Athletes: Negotiating Subjectivity and Media Constructions of Gender, Sexuality, and Nation Satoko Itani Doctor of Philosophy Department of Curriculum, Teaching & Learning Ontario Institute for Studies in Education University of Toronto 2015 Abstract The focus of this thesis is twofold: 1) the construction of Japanese female athletes in ‘masculine’ sports by Japanese media in terms of gender, sexuality, ethnicity, and nation; and 2) Japanese female and ‘trans’ athletes’ negotiation with Japanese gender and sexuality norms in the formation of their gendered subjectivities. A theoretical framework informed by feminist, queer, and postcolonial theories is used to analyze the discursive constructions and constitution of subjectivities of Japanese female and ‘trans’ athletes in the ‘masculine’ sports of soccer and wrestling. Critical discourse analysis (CDA) was employed to analyze Japanese mainstream newspaper and magazines published between 2001 and 2012 and in-depth interviews with twelve Japanese female and ‘trans’ athletes in wrestling and soccer. The result of the media analysis illustrates that Japanese mainstream media used multiple normative and normalizing ii discursive tactics to construct Japanese female athletes within patriarchal, sexist, and heterosexist gender and sexual norms. These discourses were also mobilized in the reporting of international competitions in which the success of Japanese female athletes was appropriated to construct Japanese national identity in order to recuperate Japanese masculinity. -
Development of 3-D Printed Hybrid Packaging for Gaas-MEMS
University of South Florida Scholar Commons Graduate Theses and Dissertations Graduate School June 2018 Development of 3-D Printed Hybrid Packaging for GaAs-MEMS Oscillators based on Piezoelectrically-Transduced ZnO-on-SOI Micromechanical Resonators Di Lan University of South Florida, [email protected] Follow this and additional works at: https://scholarcommons.usf.edu/etd Part of the Electrical and Computer Engineering Commons Scholar Commons Citation Lan, Di, "Development of 3-D Printed Hybrid Packaging for GaAs-MEMS Oscillators based on Piezoelectrically-Transduced ZnO- on-SOI Micromechanical Resonators" (2018). Graduate Theses and Dissertations. https://scholarcommons.usf.edu/etd/7690 This Dissertation is brought to you for free and open access by the Graduate School at Scholar Commons. It has been accepted for inclusion in Graduate Theses and Dissertations by an authorized administrator of Scholar Commons. For more information, please contact [email protected]. Development of 3-D Printed Hybrid Packaging for GaAs-MEMS Oscillators based on Piezoelectrically-Transduced ZnO-on-SOI Micromechanical Resonators by Di Lan A dissertation submitted in partial fulfillment of the requirements for the degree of Doctor of Philosophy Department of Electrical Engineering College of Engineering University of South Florida Major Professor: Jing Wang, Ph.D. Thomas M. Weller, Ph.D. Arash Takshi, Ph.D. Rasim Guldiken, Ph.D. Shengqian Ma, Ph.D. Date of Approval: June 14, 2018 Keywords: Microelectromechanical Systems, Additive Manufacturing, MMIC, Microfabrication Copyright © 2018, Di Lan DEDICATION To my wife, my parents, my advisors, my friends ACKNOWLEDGMENTS First, I would like to state my greatest appreciation to my major advisor and Professor Dr. -
Advanced Ic Packaging Technologies, Materials, and Markets 2015 Edition
ADVANCED IC PACKAGING TECHNOLOGIES, MATERIALS, AND MARKETS 2015 EDITION A Strategic Report Covering the Latest Technologies in IC Packaging, Enabling Portable and Other Electronics Report Coverage Report Highlights Stacked Packages Industry Outlook System-in-Packages Market Analysis and Forecasts, Interconnection Technologies 2013–2019 Through-Silicon-Vias (TSV) Multichip Packaging 2.5D and 3D Integration Technology Trends Multi-row QFNs Key Application Forecasts Fan-out WLPs Company Profiles New Venture Research A Technology Market Research Company 337 Clay St., Suite 101 [email protected]/ Nevada City, CA 95959 www.newventureresearch.com/ Tel: (530) 265-2004 Fax: (530) 265-1998 Advanced IC Packaging Technologies, Materials, and Markets, 2015 Edition Synopsis The demand for consumer electronics and mobile QFNs and WLPs), as well as advanced communications devices that keep us connected is multicomponent packages (PoPs, PiPs, and MCMs). driving electronics manufacturers to deliver ever-more Forecasts include multichip IC packaging units, compact and portable electronic systems. Today's revenue, prices, die usage and applications. users ask for products with more functionality, added performance, higher speed, and smaller form factors. Chapter 6: System in Package (SiP) Solutions & Advances in IC packaging technologies are providing Substrate Materials, presents a more in-depth look at solutions to meet these demands through a variety of the evolving multicomponent packages, and presents techniques that result in ICs that are more powerful and key market trends alongside forecasts of units and provide greater functionality, while fitting into ever revenue. This chapter also examines the substrate smaller and more highly integrated form factors. materials and embedded components used in SiP Multichip packages are on the leading edge of silicon assembly. -
Integrating MEMS and Ics
OPEN Microsystems & Nanoengineering (2015) 1, 15005; doi:10.1038/micronano.2015.5 © 2015 IECAS All rights reserved 2055-7434/15 www.nature.com/micronano Review Article Integrating MEMS and ICs Andreas C. Fischer, Fredrik Forsberg, Martin Lapisa, Simon J. Bleiker, Göran Stemme, Niclas Roxhed and Frank Niklaus The majority of microelectromechanical system (MEMS) devices must be combined with integrated circuits (ICs) for operation in larger electronic systems. While MEMS transducers sense or control physical, optical or chemical quantities, ICs typically provide functionalities related to the signals of these transducers, such as analog-to-digital conversion, amplification, filtering and information processing as well as communication between the MEMS transducer and the outside world. Thus, the vast majority of commercial MEMS products, such as accelerometers, gyroscopes and micro-mirror arrays, are integrated and packaged together with ICs. There are a variety of possible methods of integrating and packaging MEMS and IC components, and the technology of choice strongly depends on the device, the field of application and the commercial requirements. In this review paper, traditional as well as innovative and emerging approaches to MEMS and IC integration are reviewed. These include approaches based on the hybrid integration of multiple chips (multi-chip solutions) as well as system-on-chip solutions based on wafer-level monolithic integration and heterogeneous integration techniques. These are important technological building blocks for the ‘More-Than- Moore’ paradigm described in the International Technology Roadmap for Semiconductors. In this paper, the various approaches are categorized in a coherent manner, their merits are discussed, and suitable application areas and implementations are critically investigated. -
2006 Technical Program
International Microelectronics Assembly and Packaging Society New England Chapter 43rd Annual Symposium Technical Sessions - May 3, 2016 Symposium’s Technical Chairs Welcome Letter We’d like to welcome everyone to the 43nd Annual New England iMAPS Symposium! Thanks to all the Session Chairs we’ve compiled an engaging program of technical talks on many of today’s hot topics that will peak the interest of every Attendee. We hope you take full advantage of the opportunity to interact with the speakers and each other in a learning environment that’s only available at this unique one day symposium. Below is a brief summary to help you on your way and don’t forget to spend time in the exhibit hall, because after all without the support of the exhibitors this day wouldn’t be possible. Enjoy!!! Dmitry Marchenko Dr. Parshant Kumar RF and Microwave - Innovations and Emerging Technologies: This session is all about the innovations and emerging technologies that are driving RF and microwave packaging industry. Returning by popular demand and includes talks from industry leaders such as CST, Ametek and Draper. The topics cover issues like EM coupling between buck converters and antennas, Low Loss Additive Materials and design challenges of millimeter-wave semiconductor packaging. 3D and Beyond: This session covers the latest advancements in 2.5/3D technology. A Novel way to produce 3D chip assemblies called Quilt will be presented by IIC. Presentation by Tufts will describe liquid metal interconnects use in studies of animals and soft robots. You will learn about the latest Draper work on Printed transceivers. -
Assembly and Packaging
INTERNATIONAL TECHNOLOGY ROADMAP FOR SEMICONDUCTORS 2009 EDITION ASSEMBLY AND PACKAGING THE INTERNATIONAL TECHNOLOGY ROADMAP FOR SEMICONDUCTORS: 2009 TABLE OF CONTENTS Scope....................................................................................................................................1 Difficult Challenges................................................................................................................2 Single Chip Packaging ..........................................................................................................2 Overall Requirements......................................................................................................................2 Electrical Requirements ...............................................................................................................................3 Cross Talk ....................................................................................................................................................3 Power Integrity .............................................................................................................................................3 Thermal Requirements.................................................................................................................................3 Hot spots ......................................................................................................................................................4 Mechanical Requirements............................................................................................................................4 -
Quilt Packaging: a Novel High Speed Chip-To-Chip
QUILT PACKAGING: A NOVEL HIGH SPEED CHIP-TO-CHIP COMMUNICATION PARADIGM FOR SYSTEM-IN-PACKAGE A Dissertation Submitted to the Graduate School of the University of Notre Dame in Partial Fulfillment of the Requirements for the Degree of Doctor of Philosophy by Qing Liu, B.E., M.E., M.S.E.E. Gary H. Bernstein, Director Graduate Program in Electrical Engineering Notre Dame, Indiana December 2007 © Copyright by QING LIU 2007 All Rights Reserved QUILT PACKAGING: A NOVEL HIGH SPEED CHIP-TO-CHIP COMMUNICATION PARADIGM FOR SYSTEM-IN-PACKAGE Abstract by Qing Liu As state-of-the-art transistor features continue to shrink and the incorporation of high-k, low-k isolation dielectric materials and strained and SiGe layers on silicon becomes common, chip density and performance are improved. However, system performance has not kept up with the pace especially at multi-GHz clock rates. The bottleneck is packaging. Conventional packaging techniques require high driving current and large in-die area for bonding pads, and provide limited bandwidth. As a result, several technologies, such as system-on-chip, system-in-packaging and system-on-packaging, have been actively pursed to meet the demands of low power, high I/O counts and fast chip-to-chip communication. Here, we present a novel packaging technique, Quilt Packaging (QP), for system-in-package. QP uses microelectromechanical systems (MEMS) inspired fabrication techniques to form Qing Liu contacts along the vertical edge facets of the integrated circuits (ICs) during the back-end-of-line process, enabling the ICs to be interconnected by butting them against each other. -
Nanoelectronics, Nanophotonics, and Nanomagnetics Report of the National Nanotechnology Initiative Workshop February 11–13, 2004, Arlington, VA
National Science and Technology Council Committee on Technology Nanoelectronics, Subcommittee on Nanoscale Science, Nanophotonics, and Nanomagnetics Engineering, and Technology National Nanotechnology Report of the National Nanotechnology Initiative Workshop Coordination Office February 11–13, 2004 4201 Wilson Blvd. Stafford II, Rm. 405 Arlington, VA 22230 703-292-8626 phone 703-292-9312 fax www.nano.gov About the Nanoscale Science, Engineering, and Technology Subcommittee The Nanoscale Science, Engineering, and Technology (NSET) Subcommittee is the interagency body responsible for coordinating, planning, implementing, and reviewing the National Nanotechnology Initiative (NNI). The NSET is a subcommittee of the Committee on Technology of the National Science and Technology Council (NSTC), which is one of the principal means by which the President coordinates science and technology policies across the Federal Government. The National Nanotechnology Coordination Office (NNCO) provides technical and administrative support to the NSET Subcommittee and supports the subcommittee in the preparation of multi- agency planning, budget, and assessment documents, including this report. For more information on NSET, see http://www.nano.gov/html/about/nsetmembers.html . For more information on NSTC, see http://www.ostp.gov/cs/nstc . For more information on NNI, NSET and NNCO, see http://www.nano.gov . About this document This document is the report of a workshop held under the auspices of the NSET Subcommittee on February 11–13, 2004, in Arlington, Virginia. The primary purpose of the workshop was to examine trends and opportunities in nanoscale science and engineering as applied to electronic, photonic, and magnetic technologies. About the cover Cover design by Affordable Creative Services, Inc., Kathy Tresnak of Koncept, Inc., and NNCO staff. -
Pacific Citizen) Counties
IN THIS ISSUE " SPECIAL REPORT S honlt'o property aold , t rust fUnd set up . ... _.....•••••. 3 '" GENERAL NEWS \.1 .S ~ U P1"t'll\e Cout't 1.k". Prop 1'4 t. lr houd n, Utl(' .• . .•• 1 T "k~ Mlk l ftPpolnttd J a pane.-; t (orelRn m tnlltter; Pan· n\ ttlm on Jap,," u ned " .nUqu . t ~ ed" .............. , 3 ITIZEN .. DISTRICT -JACL ceDC p rop05~5 per c.pU. alloca tion of J ACL nation A' budKe\. J"O\H Kubata el eC' ted new DC .0\'(,1'n o1'; P WDC board ap VOL. 63 NO. 24 FRIDAY, DECEMBER 9,1966 Edit/Bus. Office: MA 6·6936 p ro \ ·t'~ 3· ton <l pl. " tor district: TEN CENTS Juntors add to me $u s(on .t Seab rook •• , ....•••••• ,. ,. , •. 1 '" CHAPTER-JACL S (lu t h \\1 ('~t J ACLer contributes $90,000 stamp collection to Jew Is.h National Fund . _•..•..... 1 JACLcr wl" $ {COry of Orange C o u n ' ~'\ Qnd lO!\e$ (MH sun' l s of S"lt LJlike City) In recent Justice of fair housing law cited A :I~e:~~on~S!(i' 'pi one e'~s' honorJ b y chapler ....••.•••••.•.. 4 .. DEPARTMENTS 1000 Club Noles ~· n Deaths (5) .. COLUMNISTS by JACL at Calif. state hearing Enomoto-Dialogue Needed. Masaoka-25 Years Arter. SAN FRANCISCO - National proposition unconstitutional, the Staletoday, what chance H osokawa-lnaugural UNUSUAL PHILANTHROPY-Southwest L.A. JACLer sold to them, they would be the attention of JACL Include SAtow-Histor lc Decision . J ACL Director Masao Satow the commission was told. -
Fall 2008 Ho’Omau Ka Huaka’I the Voyage Continues
member’s newsletter | fall 2008 Ho’omau ka HUAKA’i The Voyage Continues MAJOR EXHIBITION Safeco Insurance Foundation Special Exhibition Gallery at the new Wing Luke Asian Museum EXHIBIT OPENING RECEPTION Thursday, November 20, 2008 at 5:30pm ON DISPLAY November 21, 2008 – August 16, 2009 Photo courtesy of Jean Cabunoc. The Wing Luke Asian Museum proudly presents Ho’omau ka Huaka’i, The Voyage Continues: Native Hawai’ians in the Pacific Northwest, on display November 21, 2008 through April 16, 2009 in the new Museum’s Safeco Insurance Foundation Special Exhibition Gallery. A groundbreaking exhibit for both the Wing Luke Asian Museum and the Asian Pacific Islander American community, Ho’omau ka Huaka’i, The Voyage Continues explores the experiences of Native Hawai’ians in the Pacific Northwest from past to present day. Themes include the Native Hawai’ians’ pioneer history as the first Asian Pacific Islander group in the Pacific Northwest, the rich contributions of Native Hawai’ians in Washington State for the past 200 years, the community formed to preserve their rich cultural traditions and the legacies they leave for future generations. Artifacts, photographs, multimedia and first-hand stories from Native Hawai’ian civic and cultural leaders will be featured. Also included are digitized photos, documents and oral histories which were collected specifically for the exhibit and will be available to the public through database accessible onsite and through the Museum’s website. In addition, a series of family-friendly community programs will be presented in collaboration with the exhibition. We hope visitors will gain a greater understanding of the rich history of Native Hawai’ians in the Pacific Northwest and as the original descendants of the indigenous people of the Hawai’ian Islands. -
Curriculum Vitæ of Gary H. Bernstein
CURRICULUM VITÆ OF GARY H. BERNSTEIN Department of Electrical Engineering 275 Fitzpatrick Hall University of Notre Dame Notre Dame, IN 46556 (574) 631-6269 (office) (574) 277-0752 (home) [email protected] fax: (574) 631-4393 Education Ph.D. Arizona State University, Tempe, AZ. July 1987 (Advisor – David K. Ferry). M.S.E.E. Purdue University, West Lafayette, IN. May 1981. B.S.E.E. University of Connecticut, Storrs, CT. May 1979 (Honors Scholar). Experience Associate Director of the Center for Nano Science and Technology, University of Notre Dame (5/13). Frank M. Freimann Professor of Electrical Engineering (7/10). Co-Founder, Indiana Integrated Circuits, LLC (7/09). (www.indianaic.com). Professor, Department of Electrical Engineering, University of Notre Dame (5/98). Associate Chair, Department of Electrical Engineering, University of Notre Dame (1/99 to 8/06). Associate Professor, Department of Electrical Engineering, University of Notre Dame (5/93). Founding Director of the Notre Dame Nanofabrication Facility, Department of Electrical Engineering, University of Notre Dame (8/88 to 8/98). Assistant Professor, Department of Electrical Engineering, University of Notre Dame (8/88). Postdoctoral Fellow, Center for Solid State Electronics Research, Arizona State University (8/87 to 5/88). Research Associate, Arizona State University (11/83 to 8/87). Research Assistant, Motorola Semiconductor Research and Development Laboratories, Phoenix, AZ (5/83 to 8/83). Research Assistant, Los Alamos National Laboratory, Los Alamos, NM. Employment included DOE security clearance (Summers 79-80). Areas of Interest Nanofabrication using electron beam lithography, molecular electronics, microelectromechanical systems for integrated circuit packaging, and nanomagnetics. Honors and Awards 21.