NEWS CEVA MAKES IT MOBILE

CEVA Newsletter | February 2009 | Issue 9.1

IN THIS EDITION...

< CEVA-XC – The Industry’s Highest Performance Processor For 4G Wireless Communications < Overcoming Challenges in HD Audio IC Design Visit CEVA at Mobile World Congress 2009 CEVA-powered Technology in over 35 Stand 2F07, Hall 2 Feb 16-19, Barcelona, Spain < Companies’ Products at CES 2009 CEVA NEWS > FEBRUARY 2009

Letter from our CEO

Table of Contents Dear Readers,

Welcome to another edition of CEVA News, packed with news and views of our recent products Letter from our CEO and solutions for today’s multimedia-driven, always-connected world. With 2008 now drawn 2-3 to a close, I want to take this opportunity to reflect on what was the most successful year thus far in CEVA’s history. From both a strategic and a financial perspective we have reached a number of key milestones during the year. CEVA-XC – THE INDUSTRY’S From a strategic standpoint, we continued to build on our strong presence in the handset HIGHEST PERFORMANCE PROCESSOR FOR market with 13% of all handsets shipped in 2008 using our DSPs for wireless baseband. Four 4G WIRELESS of the top five handset manufacturers; Nokia, Samsung, LG and Sony Ericsson, are now in mass COMMUNICATIONS production with CEVA-powered chipsets, in addition to many others. Despite the indications that 2009 will be a down year for handset sales, we are well positioned to increase our overall 3-5 market share with key handset manufacturers through our diverse base of DSP customers.

OVERCOMING CHALLENGES The emergence of broadband connectivity embedded in netbooks, Mobile Internet Devices IN HD AUDIO IC DESIGN (MID) and other mobile computing devices, has opened up a significant new growth driver for CEVA. In today’s new range of connected devices, our DSPs power the world’s leading 6-8 manufacturers; Dell, Lenovo, LG, Toshiba and others. To address the next-generation of 4G connected devices, CEVA recently introduced the CEVA-XC DSP - the industry’s highest performance processor for multi-standard 4G wireless communications. This is CEVA’s first CEVA EVERYWHERE! special purpose communications processor and you can read more about it in this newsletter. 9 Outside of the wireless baseband market, our strategy to grow the business into new areas including portable multimedia and home entertainment showed significant progress. By PRESS ANNOUNCEMENTS the close of 2008, three leading Asian customers were shipping CEVA-powered multimedia 10-11 chips in portable multimedia devices and others are targeting production during 2009. Most significantly, a world-leading portable multimedia device OEM deployed our multimedia technology in a new generation product, underlining the technical excellence of our multimedia CEVA NEWS solutions. We continue to develop industry-leading technologies for the multimedia and Newsletter home entertainment markets, and just recently introduced a new technology offering for the Published Quarterly ©2009 CEVA, Inc. HD Audio market - CEVA-HD-Audio. This solution is soon to be deployed by a leading Blu-ray All rights reserved chipset manufacturer and features as our second lead-article in this newsletter.

Overall in 2008, more than 300 million CEVA-powered devices were sold throughout the world, ranging from wireless handsets, Smartphones, netbooks and portable multimedia players, through to games consoles, HDTVs, Set-top boxes, digital picture frames and many more. To date, more than 1 billion CEVA-powered devices have shipped; a significant milestone for our young and innovative company.

On the financial front, we reported strong 2008 results. Our revenues grew 22% on a year over year basis to $40.4 million and non-GAAP net income and EPS showed a remarkable 118% and 113% growth, respectively, compared to 2007. These figures represent the highest growth rates in our history and underscore our strengthened position, despite the recessionary environment. Most significantly, our royalty revenue recorded impressive growth, up 58% over

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CEVA-XC – MEET THE INDUSTRY’S < HIGHEST PERFORMANCE PROCESSOR FOR 4G WIRELESS COMMUNICATIONS

A single DSP core with specialized Vector Communication Units capable of delivering fully-programmable, scalable solutions for 3.5G/4G wireless applications

Mobile Broadband Poses Substantial Challenges

The next generation of wireless systems – whether handheld terminals or base station infrastructure – brings new opportunities for mobile broadband SoC designs, but also new challenges in making it a reality. Fourth Generation systems, 4G, enable end users, using any category of mobile or stationary device, to wirelessly connect to broadband networks. However, 4G modems will require almost a twenty-fold increase in processing horsepower, compared to current 3.5G modems, even though handset OEMs are still allocating the same for the leading position; namely LTE and WiMAX. WiMAX power budget for 4G designs. Designing an extremely has emerged as the technology of choice for computing powerful communication IC that meets these stringent devices such as notebooks, netbooks and mobile internet power constraints poses a fundamental challenge to devices (MIDs), and is heavily promoted by Intel. LTE SoC designers. appears to be the preferred choice for mobile handsets and Smartphones. It is unclear which standard will Analyzing the routes to 4G wireless baseband, there are prevail, and it is highly possible that both standards two evolving technologies that are currently competing will coexist and serve different use cases in different

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< 2007 and reaching $14.3 million for the full year. Royalty growth is testament to the strength and the maturity of our technologies and our strong customer base. Finally, we generated overall positive cash flow of $8.3 million during 2008, in addition to initiating and executing a $6.8 million share repurchase program.

Looking towards the rest of 2009, despite the economic conditions, we see many exciting new market opportunities for CEVA and will continue to build and develop our franchise and technologies.

We would be delighted to welcome you to visit our booth at this year’s Mobile World Congress in Barcelona, to enjoy our popular MediaSphere multimedia experience and see our latest products and solutions.

Wishing you a successful 2009,

Gideon Wertheizer

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AXI I/O AXI

PCU Data Addressing Unit

Sequencer Scalar LS0 LS1 Dispatcher

Interrupts Register File Program Memory Controller Data Memory Controller

Power Scaling Unit

Configurable L1 Configurable L1 Program Memory Data Memory Computation Units

General Vector Computation Unit Communication Unit

MS0 MS1 VMAC VPACK VBM

Register File Vector File

CEVA-XC – Block Diagram

geographies. This requires a flexible DSP-based solution associated with developing a high performance, next that would allow for specific implementations under both generation wireless communications IC. Utilizing an technology roadmaps. innovative scalable architecture, CEVA-XC addresses the precise requirements of any 4G design, from handset 4G handsets need to support multiple wireless air terminals and mobile broadband modules through to interfaces, including HSPA, Wi-Fi, WCDMA and others. wireless infrastructure equipment. With standards constantly evolving, hardwired solutions cannot economically keep pace with the developments of Using a software programmable architecture to deliver these standards. A software-based approach will need to a single engine for all wireless processing, CEVA-XC be taken that offers multimode systems support and can eliminates the need for multiple baseband coprocessors replace multiple dedicated baseband systems. within the handset as is currently required. Thus, it reduces power consumption and die size related to A Fully-Programmable Approach additional memories, data buffers and overall data traffic common to such distributed architectures. To address these complex commercial, technical and implementation issues, CEVA is launching the CEVA- CEVA-XC’s native inherent DSP capabilities enable efficient XC™ - the industry’s highest performance processor control and data flows for a wide range of DSP tasks and architecture designed and optimized for advanced data types, both vectorizable and scalar. This enables wireless communications. CEVA-XC builds on CEVA’s strong strong and integrated C-level compiler support, which heritage in developing DSP cores for cellular baseband, dramatically simplifies software development efforts and with more than 400 million CEVA-powered wireless reduces associated integration costs. handsets shipped to date. The fully programmable DSP architecture supports full transceiver paths for multiple A Scalable and Configurable Approach air interfaces in software, including the most demanding 4G mobile standards; LTE and WiMAX, in addition to Wi-Fi, CEVA-XC is CEVA’s first dedicated DSP core for HSPA, WCDMA, EVDO, GSM/GPRS, DVB-H and GPS. communications processing. This fully programmable architecture is optimized for the most demanding wireless CEVA-XC is specifically designed to address the stringent applications, capable of handling LTE class 5 and WiMAX II power consumption, time-to-market and cost constraints complete transceiver paths on a single core. To reach these

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performance levels, the CEVA-XC architecture incorporates To achieve this, CEVA-XC features an innovative Power 1, 2 or 4 Vector Communications Units within the CEVA-X Scaling Unit, supporting multiple clock and voltage architecture. Each vector unit is a 256-bit SIMD engine, domains and operating modes. Within the design, using 3-way VLIW and a large array of 16 MAC, arithmetic, different execution units can be clocked separately and logic and shift units. An optimized instruction set handles voltage can be scaled down or turned off completely for the requirements of wireless modems, including matrix unused modules at any particular time. This contributes processing, MIMO detectors, complex filtering, data significantly to more efficient power consumption, both permutations and bit stream processing. dynamic and static.

The CEVA-XC architecture also offers a number of optional Conclusion instruction sets which further enable designers to reach the optimal balance of performance and cost within their The fourth generation of wireless communications respective designs. enable high-speed connectivity anytime and anywhere. However, the processing demands for these 4G devices will be tremendous. Integrating a “future-proof” approach into a “present-day” design is critical in order to meet the demands of 4G/LTE, WiMAX and other advanced wireless networks.

The CEVA-XC addresses all of these challenges in a high performance, single-core DSP processor architecture, optimized for advanced wireless communication. This will enable designers of ICs for mobile devices and infrastructure equipment to extract maximum processing horsepower in a cost-effective, power-efficient manner, backed by an industry heritage of over 400 million chips shipped to date in wireless devices. For wireless infrastructure equipment, such as femtocells, picocells and base-stations, where full programmability is an absolute must, CEVA-XC provides the highest- performance single-core architecture, estimated to be 8 to 10 times higher than the next most powerful DSP architecture available today. Integrating multiple CEVA- XC cores on a single die can easily replace multiple DSP ICs currently used in such applications, providing higher levels of integration and reducing cost.

Power Management

Power management has been a key part of the development of the CEVA-XC from the outset. Customers have been demanding the right level of performance for 4G modems but with the same power consumption as today>s existing 2G and 3G devices. This new level of complexity for mobile devices requires a new approach to achieve an optimal balance of performance and power, despite the tremendous power budget constraints.

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OVERCOMING CHALLENGES < IN HD AUDIO IC DESIGN By Eyal Ben-Avraham, VP Strategic Accounts & Partners, CEVA

Introduction synthesis (MIDI) or audio playback may be required. This complex use case requires a highly capable DSP Multimedia technology is constantly evolving. High processor. Definition audio or “HD Audio” has also been introduced • Digital TV (“DTV”) – a significant challenge for to accompany HD video and add a richer audio experience DTV is the high level of data processing and data traffic to the ever-expanding world of multimedia entertainment. required for HD audio applications. Cost is another By 2011, according to a recent report, predicted sales of factor, as mandatory DTV transition requires consumers “HD” devices will reach 187 million for DTVs, 160 million to purchase new digital decoders. for set-top boxes and 116 million for Blu-ray DVDs. In • Set-top Boxes (“STB”) – for markets such as the USA, addition, there are other market segments such as A/ where analog broadcasting will cease during 2009, V receivers, HD camcorders, IPTV and mobile phones. audio quality is of immediate interest to set-top Mobile devices such a Smartphones and Portable Media box manufacturers, who need to ensure that their Players are becoming more sophisticated in terms of audio signals will be of comparable quality to the audio format playback and usage scenarios as they are video output. required to play any PC or internet originated content, • Blu-ray Discs – Blu-ray Disc is an optical disc for high despite the additional constraints due to their function as definition video and data storage, named for the blue- a mobile connected device. colored laser (actually, violet-colored) which is used to read from and write to this disc format. Blu-ray discs can The processing demands, audio channels, bit rates and store up to 50 gigabytes of data, almost six times more precision requirements of HD audio are significantly higher than a two-layer DVD, and over ten times that of a single- than standard audio systems. HD audio systems impact layer DVD. on every aspect of IC design and create major challenges to delivering the promised audio quality improvements. There are now around 1,000 movies available on Blu- ray Discs in various languages, which is set to increase Opportunities for HD Audio significantly, following the end of the format war between the Toshiba-led HD-DVD format and the Blu-ray groups There are four major application opportunities for in February 2008. This will further increase the need HD Audio. for highly capable audio processors, both for home- entertainment and mobile applications. • High End Mobile Devices – These are Smartphones, Portable Media Players and Portable Game Consoles Design Challenges for HD Audio ICs that can handle any audio content from any source. Mobile audio playback applications have become more The overriding nature of HD audio is the volume of data complex. Usage scenarios where a mobile device is traffic compared to conventional audio applications. Just decoding audio from a flash memory card, along with 3D for I/O, this traffic for certain codecs can reach 24.5Mbps surround audio enhancement, sample rate conversion, for input and 96KHz x 8 x 24bit, giving 27.6Mbps for and equalizer are becoming ubiquitous. If the audio is output, requiring a new approach to IC design to maintain being sent to a Bluetooth headset, then Bluetooth audio audio quality. encoding is also required. And, if a phone call is received during this playback, then some additional ringtone • Performance Requirements – data rates for HD audio

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applications are often too high for many existing single- tackling even the most demanding HD audio use cases. core DSP solutions to handle, even before considering Based on the high-performance 32-bit CEVA-TeakLite- any mandatory post-processing functions. III™ DSP core running at speeds of 550MHz, the highly- • Die Size/Power Consumption Considerations – multi- optimized CEVA-HD-Audio platform is the most compact core solutions can provide the processing capabilities and power-efficient solution available for HD audio for HD audio but die size, electrical power and price integration into home entertainment and mobile ICs. increase trade-offs that can often be prohibitive, The CEVA-TeakLite-III DSP core has been adopted by especially in HD devices such as portable gaming several consumer IC vendors for Home and Mobile audio consoles. Power consumption also affects device heat applications to date, and is currently being designed into dissipation, often requiring certain cooling elements a next generation Blu-ray DVD chip by one of the world’s that may affect overall product design. leading DVD IC vendors. In addition, three other tier-1 • Memory Swaps for Task Switching – parallel tasks in HD baseband semiconductor vendors have adopted CEVA- audio systems require very frequent memory swaps, TeakLite-III for mobile audio applications. which can overload memory bandwidth, rapidly degrading sound quality as the system fails to cope with CEVA-HD-Audio addresses markets ranging from entry- the increased bus traffic. 32-bit instead of 16-bit format level, memory-constrained devices such as high- instruction sets can further aggravate data overload end mobile devices, digital TVs and set-top-boxes, to issues and certain HD audio codecs require over 100KW performance-hungry applications such as Blu-ray DVD of data RAM plus rather large tables which mandate players that require sophisticated post-processing memory swapping for efficient RAM memory utilization. functions. The single-core platform, based on CEVA- • Slow External Memory Access – many audio algorithms TeakLite-III, includes; a configurable memory subsystem; a operating on DSPs traditionally access large buffers in large set of audio codecs optimized for the DSP in a typical a non-sequential fashion, and so are placed in external, audio system; and a complete software development slow memories such as DDR SDRAM. Furthermore, the kit (SDK) for quick and easy system development and audio and video decoders often compete on the data bus SoC integration. throughput, so memory access efficiency is also critical. The optional audio codecs for Blu-ray include lossy and CEVA-HD-Audio also incorporates memory overlay lossless codecs: support that takes advantage of a generic DMA controller. By adapting the audio algorithms and codec Resolving the Challenges flow accordingly, CEVA ensures the solution meets the stringent requirements of advanced audio systems, Addressing the multiple issues dominating the HD without compromising die size or power consumption. audio DSP field, CEVA has developed CEVA-HD-Audio; Applying these optimizations also allows developers of a comprehensive, single-core DSP-based solution for low-cost audio solutions to reduce their bill of materials by supporting slow DDR memories.

The CEVA-HD-Audio solution>s optimized HD audio codecs support from 2 channels up to 7.1 channels with various bit-rates. Audio codecs supported include: MP3, AAC-LC, HE-AAC, WMA, AC-3, RealAudio, Dolby Digital Plus, Dolby TrueHD, DTS, DTS-HD MA, DTS-HD HR and others.

The CEVA-TeakLite-III DSP core, at the center of the CEVA- HD-Audio solution, features native 32-bit processing, including a 32-bit multiplier with 72-bit accumulation for full data precision. In addition, strong bit-manipulation Example of 7.1 Channel HD Audio

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AHB-Lite Master AHB-Lite Slave AHB-Lite Master

Program Memory Subsystem Data Memory Subsystem

Cache Controller Write Buffer Arbiters AHB I/Fs

Arbiters PCU Data Addressing Unit AHB I/F Sequencer Scalar AGU0 AGU1 Interrupts Configurable L1 Configurable L1 Program Memory Emulation & System Data Memory Decoders Register File On-Chip Emulation (OCEM) Computation & Bit-Manipulation Unit Real-Time Trace Register File

Generic System FFT MAC 32 ALU DMA

Viterbi MAC 16 MAC 16 BMU APB3

APB3 Port

CEVA TeakLite-III – Block Diagram

capabilities for stream processing and 32-bit FFT support CEVA-HD-Audio also excels for mobile applications where enable a highly efficient implementation of audio codecs. only 100MHz is needed to support the most complex A well-balanced 10-stage pipeline allows the DSP to audio Smartphone use cases including audio decoding, support high speed implementations, making it ideal as a surround, sample rate conversion, equalizer, Bluetooth single-core for the most demanding HD audio use-cases. encoding and ring tone handling. This enables low power consumption and thus long battery life. HD Audio in Practice… With more than 550MHz available on a single-core implementation, this leaves ample headroom for additional processing, reduces power consumption and enables licensees to integrate CEVA solutions into their devices quickly, with more confidence in the quality of the audio output.

Summary

HD audio is the multimedia market’s most challenging audio compression scheme in terms of sheer processing requirements to date. Complex use-cases offer exciting possibilities in terms of users’ audio experience, but require tremendous processing power that cannot usually be delivered comfortably with a single-core DSP solution. CEVA-HD-Audio has been developed to handle the most This has a significant impact on price. demanding audio use cases. Currently, the Blu-ray DVD format provides the richest audio experience, but requires With a heritage of one billion audio ICs shipped and a processing power to match. legacy of audio-focused development, CEVA offers the CEVA-HD-Audio solution, based on its powerful CEVA- In worst-case scenarios, CEVA-HD-Audio requires 250 MHz TeakLite-III DSP core, one of the most high-performance, to support Dolby-based Blu-ray audio processing and just cost-efficient DSPs that is capable of delivering a high 300 MHz to support the most complex DTS-based Blu-ray quality user experience for the HD audio era. audio processing, including system functions.

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< CEVA EVERYWHERE! CEVA-powered technology in over 35 companies’ products at CES 2009

At last month’s Consumer Electronics Show in Las Vegas, Intersil, Lenovo, LG Electronics, Marvell, Mindspeed, MSI, over 100,000 people saw the latest gadgets, gizmos and NXP, Samsung, Sharp, Sony Electronics, Sony Ericsson, gaming devices from over 2,700 exhibitors. ST-NXP, Sunplus, XStreamHD and Zoran.

As CEVA’s products and solutions have evolved over CEVA DSP cores and technologies have been licensed to the years, an increasing number of companies are more than 170 licensees and deployed in over 1 billion incorporating CEVA-powered technology into their devices worldwide. End markets for these products devices, recognizing the smart, compact processing include wireless handsets, disk drives, DVD players, capabilities that CEVA’s DSP cores bring to the world of Digital TVs, game consoles, digital cameras, portable consumer electronics. multimedia players and more.

More than 35 companies demonstrated CEVA-powered CEVA’s extensive portfolio of DSP and multimedia IP solutions and products at CES 2009. CEVA’s technologies enables lower power consumption, lower cost, smaller die powered a range of innovative applications that were size and industry leading performance for the design of on display at the show including the first netbooks to SoCs. These advantages are instrumental in the adoption utilize the company’s DSP cores. Other products that of CEVA’s technology by many of the world’s leading were enabled by CEVA included plasma and LCD TVs, semiconductor and consumer electronics companies. wireless handsets, home entertainment audio systems, home media servers, SSD Drives, Blu-ray players, game consoles and Portable Multimedia Players (PMPs).

These companies included the world’s largest electronics producers, such as: Broadcom, Lenovo, LG Electronics, Samsung, Sony Electronics and Sony Ericsson. In addition, CEVA’s customers and CEVA-powered OEMs at the show included; Aigo, Asus, Atmel, Broadcom, Changhong, Control4, C&S Telecom, Freescale, Hauppauge, Hisense, INDILINX,

9 CEVA NEWS > FEBRUARY 2009 CEVA NEWS > FEBRUARY 2006

< PRESS ANNOUNCEMENTS PANOVASIC Panovasic Technology Co., Ltd., a subsidiary of Sichuan Changhong Group, has licensed and deployed the fully programmable MM2000 portable multimedia solution for the Apollo™ family of portable multimedia processors. The first processor in the family, the Apollo-1™, will begin shipping in portable multimedia devices from Changhong, one of the largest suppliers of consumer electronics in Asia.

Targeting applications such as portable media players (PMP), mobile TV, smart mobile phones, digital photo frames, online digital broadcast, videophones, in-car entertainment and personal navigation devices, the Apollo-1 multimedia processor leverages the power- efficient CEVA-X DSP core at the heart of MM2000 to handle the multi-standard video decode and encode functions. Panovasic is the third MM2000 licensee to commence shipping CEVA-powered multimedia processors.

Yong Chen, Director of R&D Department at Panovasic, said, “CEVA’s MM2000 portable multimedia solution provides us with a flexible and fully programmable engine on which to develop video codecs in software, eliminating the need for any hardware multimedia accelerators. Our Apollo-1 processor leverages this performance and flexibility to support multiple video standards, a critical requirement for today’s PMPs and ‘always-connected’ portable multimedia devices.”

FREESCALE Freescale Semiconductor has licensed and deployed CEVA’s latest generation Enterprise SATA Intellectual Property (IP) within its product line, including their MPC8315E PowerQUICC SEMICONDUCTOR II Pro Communications Processor family.

The MPC8315E communications processor family enables a wide range of feature- rich applications that make the digital home experience easier, richer and safer. The cost-effective MPC8315E processor meets the requirements of several small office/home office (SOHO) applications including consumer network attached storage (NAS), digital media server, residential gateway, WLAN access point, printing, and industrial control.

“CEVA’s Enterprise Serial ATA Controller and PHY helps Freescale deliver world class products featuring silicon-proven, high performance SATA interfaces,” said Nikolay Guenov, portfolio manager within Freescale’s Networking & Multimedia Group, Freescale Semiconductor. “Our PowerQUICC II Pro MPC8315E processor with integrated SATA positions Freescale well for success in residential/SOHO markets.”

BROADLIGHT BroadLight licensed and deployed the CEVA-VoP™ Voice-Over-Packet platform in their newest BL2348 GPON Residential Gateway (RG) System-on-Chip (SoC) solution. BroadLight’s latest SoC provides high bandwidth internet and VoIP capabilities for a new breed of cost-effective Customer Premise Equipment (CPE) connected to the Internet via Passive Optical Network (PON).

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Gal Sitton, Vice President of Systems at BroadLight, said, “BroadLight has a long history of developing feature-rich and cost effective PON solutions in minimal time. Using the CEVA- VoP platform for our BL2348 GPON System-on-Chip and leveraging CEVA’s expertise in DSP cores, we were once again able to meet the cost, performance and time-to-market requirements for the successful deployment of our product.”

SUNPLUS Sunplus mMedia, Inc., a leader in highly integrated and high quality ICs for digital still camera, handheld game, mobile phone and PMP products, licensed the fully programmable CEVA-MM2000 portable multimedia solution. These devices require a power-efficient solution to handle processor-intensive, multi-standard video and audio processing tasks. CEVA’s MM2000 solution uses a single DSP engine to support all video and audio encode and decode processing without the need for additional accelerators or hardware, significantly lowering the power consumption required to deliver high quality multimedia functionality in Sunplus mMedia’s latest multimedia processors.

Mountain Lee, Director of R&D Division at Sunplus mMedia, said, “Our competitive advantage is developing highly integrated SoC products that deliver feature-rich capabilities and meet demanding consumer product requirements. CEVA’s MM2000 solution provides the range of functionality support we need for our new line of PMP ICs, and does so with power efficiency required for all types of portable consumer products such as MP3 players, cell phones and gaming devices. The MM2000 programmable platform allows us to adapt quickly to changing market dynamics, and incorporate new features easily.”

SOLOMON Solomon Systech Limited licensed and deployed the fully programmable MM2000 portable multimedia solution for their MagusCore™ multimedia processor platform family. Solomon SYSTECH recently introduced the first processor platform based on the MagusCore dual-core ARM + CEVA DSP architecture, the SSD1933 multimedia processor.

Targeting applications such as mobile digital TV (MDTV), portable media players (PMP), personal navigation devices (PND), smart mobile phones and mobile internet devices (MID), the dual-core distributed architecture of SSD1933 leverages the power-efficient CEVA-X DSP core at the heart of MM2000 to handle all multimedia-related tasks including multi-standard video and audio, and recorder functions.

Jose Lau, VP Marketing of Solomon Systech, said, “Deploying CEVA’s MM2000 multi- standard and fully programmable multimedia solution in our dual-core distributed MagusCore SSD1933 processor platform has given us great flexibility and the capability to differentiate each end product design. The ability to encode and decode video and audio on a single DSP engine supporting multiple multimedia codec standards in software enables our MagusCore™ processor platform to reduce design costs while addressing a wide range of end markets. Utilizing a DSP for these functions offloads the CPU from all multimedia-related tasks guaranteeing optimal performance, which are deemed critical success factors for such products.”

11 CEVA NEWS > FEBRUARY 2009 CEVA NEWS > FEBRUARY 2006

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PRINCIPAL OFFICES OTHER LOCATIONS

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©2009 CEVA, Inc. All rights reserved. CEVA-Teak™, TeakLite™, CEVA-TeakLite™, CEVA-TeakLite-II™, CEVA-TeakLite-III™, CEVA-X™, CEVA-Audio™, Mobile-Media2000™, Xpert-Teak™, CEVA-HD-Audio™, CEVA-XC™ and CEVAnet™ are trademarks or registered trademarks of CEVA, Inc. Other company and product names mentioned in this document may be the trademark or registered trademark of their respective owners.

Disclaimer: the information in this document is provided “AS IS” without any express or implied warranty of any kind including warranties for merchantability, non-infringement of intellectual property, or fitness for any particular purpose. In no event shall CEVA, Inc. or its affiliated companies be liable for any costs and damages of any kind including without limitation incidental, consequential, special or speculative damages, lost profits, or loss of business, in connection with this document or arising out of the use of or inability to use the materials described therein. CEVA, Inc. and its affiliates further do not warrant the accuracy or completeness of the information, text, graphics or other items contained within this document. CEVA, Inc. may make changes to the materials and products presented in this document, or to the products described therein.