DOCSLIB.ORG

05-17 200Mm Tool List for the Web Site

Total Page：16

File Type：pdf, Size：1020Kb

Download full-text PDF Read full-text
05-17 200Mm Tool List for the Web Site Fab-Finder W. Size Build Code Module Manufacturer Model (mm) Serial No. Year Status Description / Comments LE240 DCVD Advanced Energy RS94A 200 TiCl4 supply unit LE241 DCVD Advanced Energy RS94A 200 TiCl4 supply unit LV110 Test Advantest Corporation M6751AD 200 EDS - 3 units available LV114 Test Advantest Corporation T5382A1 200 EDS LW115 Test Advantest Corporation T5371 2001 Memory type prober - 2 station LV115 Test Advantest Corporation T5585 - 2002 High-Speed Memory Test System LV113 Test Agilent 16702A 200 EDS LF104 Reclaim Akrion 200 Reclaim (Used Tool) LU160 PVD ANELVA ILC-1060 200 2008 Sputtering System LU161 PVD ANELVA ILC-1080 200 2003 Sputtering System LU162 Test ANELVA M-222LD-D 200 2011 Leak Detectors LH105 Cleaning AOC Techno Co AOC 200/300 FK11102 2013 In Crates 4 quartz tanks for chemicals - 2 rinse tanks LF108 Thin Film Applied Materials CENTURA 200 Sub-atmosphereTool never ran. Brand TREOS new. BPSG CVD LJ107 Thin Film Applied Materials P5000 200 4666 1996 Warehouse 2 BPSG Chambers LJ108 Thin Film Applied Materials P5000 200 50014 1996 Warehouse 3 USG + 1 Sputter chambers LJ109 Thin Film Applied Materials P5000 200 A0035 1996 Cleanroom 3 USG Chambers LJ110 Thin Film Applied Materials P5000 200 7347 1997 Warehouse 1 ch. MXP+ / 1 MkII LJ111 Thin Film Applied Materials P5000 200 7348 1997 Warehouse 1 ch. MkII LJ112 Thin Film Applied Materials CENTURA 5200 IPS 200 EA58 1999 Warehouse IPS (oxide etch) - Silicon dome missing LV104 Thin Film Applied Materials ULTIMA 5200 200 2006 CVD LV105 Thin Film Applied Materials CENTURA DxZ 200 1997 SMIF CVD LV106 Thin Film Applied Materials ENDURA 5500 200 1995 PVD LV107 Thin Film Applied Materials ENDURA 200 1993 AlCu/ TiN/Ti LU164 CVD Applied Materials Centura HDP 200 1995 HDP-CVD LT100 CVD Applied Materials P5000 200 1105150 2002 PEOX , 3chamber , DPS+ POLY, CENTURA LV108 Etch Applied Materials I-PH.2 200 1999 POLY ETCH 1997 Centura 1 Body, Flat type, Ph 1, Narrow L/L, HP LT102 Etch Applied Materials SUPER-E (Centura 1) 200 9085 Robot, 3Chamber, ENI OEM-12B 1999 Centura 1 Body, Flat type, Ph 2, Narrow L/L, HP LT103 Etch Applied Materials SUPER-E (Centura 1) 200 EB76 Robot, 3Chamber, ENI OEM-12B LT104 Etch Applied Materials SUPER-E (Centura 1) 200 9957 1998 Centura 1Body. LU163 Etch Applied Materials Centura DPS 200 1998 Poly Etcher LU165 Etch Applied Materials Centura MXP 200 1997 Oxide Etcher LU166 CMP Applied Materials Mirra 200 1998 CMP Oxide - 2 units available LU168 CMP Applied Materials Mirra 200 1999 CMP W - 2 units available LJ106 Implant Applied Materials PI 9500 200 M123 1993 Cleanroom Implanter Particule Wafer Inspection - PDI / CCD installed LW113 Metrology Applied Materials WF-736XS 200 2001 50 / 60Hz common defaults inspection laser Particule Wafer Inspection - PDI / CCD installed LW114 Metrology Applied Materials WF-736XS 200 2001 50 / 60Hz common defaults inspection laser LU166 CMP Applied Materials Mirra 200 1998 CMP-OXIDE LU167 CMP Applied Materials Mirra 200 1998 CMP-OXIDE LU168 CMP Applied Materials Mirra 200 1999 CMP-W LU169 CMP Applied Materials Mirra 200 2000 CMP-W EU157 Wet/CMP Appricia Cenote 200 Aluminum Etch LE261 DIFF ASM UHV-A600 200 HSG Growth (3 units available) LE274 DCVD ASM Eagle10 200 Plasma SiO2 CVD (3 units available) LU170 CVD ASM Eagle10 200 1998 Plasma CVD System LM150 Litho ASML ASML100 200 STEPPER ASM 5500/100 LT112 Litho ASML ASML100 200 3420 1996 LM151 Litho ASML ASML200 200 ASML/200 LT113 Litho ASML ASML250 200 4161 2002 LV101 Litho ASML PAS5500/300C 200 1997 PHOTO LV100 Litho ASML PAS5500/300C 200 1997 Stepper LF111 Bonding ASM- Pacific Tech AB559 200 Wire & Die Bonder LE 200 DCVD Aviza Technology WJ1500TFv1.0 200 Atmosphere TEOS BPSG CVD LM110 Diffusion AVIZA-SPTS AVP8000 200 AVP8000 Oxide Furnace (2 units available) PL110 Thin Film AVP AVP 8000 200 SELOX LJ113 Strip AXCELIS Fusion MCU 200 200 MU5J331C 1996 Cleanroom Stripper/Asher - HV module not functional (2 units LJ114 Strip AXCELIS Fusion MCU 200 MU5J3228B 1996 Warehouse each available) LE265 PVD Beckman Coulter DU-650 200 Surface reflection measurement LG110 Metrology BRUCKER Nano defectivity 200/300 120 2003 Discon'ed Not operational, need to change parts LM115 Metrology CAMITEK FALCON 200 200 Thelma inspection camitek LU171 RTP Canon HP-8800 200 2000 TIN Anneal - 2 units available LS101 Litho Canon FPA-2500 i2 200 309144 1993 Lithography - stepper (4 units available) LS105 Litho Canon MPA600 super 200 9105131 Lithography - Aligner LT114 Litho Canon ES3 200 1046247 2001 Cymer Laser (good Condition) LE246 Etch Canon-ANELVA ILD-4100SR & SD II 200 W Dry Etcher (14 units available) LE207 PVD Canon-ANELVA I-1060SV2+1 200 PVD (5 units available LE257 DIFF Canon Marketing Japan HeatPulse8108 200 Std RTA (3 units available) LE258 DIFF Canon Marketing Japan HeatPulse8800 200 Std RTA LW111 Thermal CELTU (Youtec) HPK03Z 2003 4'' PMC3 groups - 600°C Hi Temp substrate LE110 TF Dainippon Screen SP-W813-AS 200 Scrubber for CMP (4 units available) LJ120 Cleaning Dainippon Screen AS 2000 200 57530-5044 1998 Cleanroom Cleaning Equipment LJ121 Cleaning Dainippon Screen AS 2000 200 59530-5230 1998 Cleanroom Cleaning Equipment LJ122 CMP Clean Dainippon Screen SPW813-AS 200 53530-4003 1993 Warehouse Single Wafer Processing (3 units available) LE115 Litho Dainippon Screen SD-W80A-AVQ 200 Polyimide Coater LE116 Litho Dainippon Screen SD-W80A-AVQ 200 Polyimide Developper LE205 Litho Dainippon Screen SC-W80A-AG 200 SOG Coater (2 units available) LU177 PHOTOLITHO Dainippon Screen SK-80BW 200 1998 Coater - Fab-Finder Confidential - May 2016, Page !1 /!4 DNS-11: SKW-80B coat/develop; 2xCoat/2xDevelop PL111 Litho Dainippon Screen SKW-80B 200 LE225 Etch Dainippon Screen DP-W80 A-AV (UV） 200 UV/O3 treatment LE239 WET Dainippon Screen IPA Recycle unit 200 IPA Recycle unit LU173 WET Dainippon Screen AS2000 200 1998 Cleaning System - 2 units available LU176 WET Dainippon Screen MP-2000 200 Cleaning System LU179 WET Dainippon Screen SS-W80A-AR 200 2000 Wafer Scrubber - 2 units available LU181 WET Dainippon Screen SS-W80A-AVR 200 2002 Wafer Scrubber - 2 units available LE269 CMP Dainippon Screen VM-8200 200 Thickness Measurement (2 units available) LE271 CMP Dainippon Screen VM-2010 200 Thickness Measurement LU175 RTP Dainippon Screen LA820 200 1996 RTA JLU177 Metrology Dainippon Screen VM1210 100〜 200 2013 Film Thickness Measurement EU157 BEOL Disco DFG840 200 Backgrinder LV117 Back End ESI M9275 200 1998 Laser Memory Fuser - 4 units available LU190 TEST ESI ESI 9350 200 2004 Laser Repair System - 2 units available LG111 Grinding EMTEC WBM210 100~200 800 2003 Running 2 load & 2 unload ports. Use Tokyo diamond wheels. LJ126 Bake FUSION M200PC 200 2063.96 1995 Cleanroom UV HARD M200PC LJ127 Fuser GSI M40 200 1139 2003 Cleanroom Fuser LJ128 Bake HERAEUS TUF-50/60-230 200 4970-00 1992 Warehouse Oven LF122 Metrology Hilevel Dragon 200/300 For low-end logic device probing (6 units avail.) LS126 Metrology Hitachi S-4500 - CD-SEM LR121 Metrology Hitachi S-4800+EDX 200 9043-06 2008 FE SEM LR122 Metrology Hitachi S-5000 200 - - FE SEM LR126 Metrology Hitachi S-5200 200 0632-04 2005 FE SEM LS131 Metrology Hitachi S5200 with EDAX - CD-SEM LS110 Metrology Hitachi S-6000 200 5333884 1993 Metrology - CD-SEM LS106 Metrology Hitachi S-8820S 200 8323-07 1995 Metrology - CD-SEM LS107 Metrology Hitachi S-8840 200 8352-09 1997 Metrology - CD-SEM LT107 Metrology Hitachi S9200SA 200 9718-04 2000 Working condition LR125 Metrology Hitachi S-9220 200 9722-05 2000 CD SEM Measure LS108 Metrology Hitachi S-9220 200 9724-04 2000 Metrology - CD-SEM - 2 units available LT108 Metrology Hitachi S9220 200 9737-04 1999 Working condition LT109 Metrology Hitachi S9360 200 0107-03 2003 LU192 Metrology Hitachi FB 2100 200 2002 FIB LU193 Metrology Hitachi FSM-128 200 Flatness Measuring System - 2 units available LU195 Metrology Hitachi LS 6700 200/300 2008 Wafer Particle Counter LU199 Metrology Hitachi TS-3700 200 1990 Laser Dust Monitor LU200 Metrology Hitachi TS-6500 200 2000 Laser Dust Monitor LE250 Etch Hitachi M-501A 200 AL Dry Etcher (2 units available) LU196 Etch Hitachi M-501AW 200 1995 Metal Etcher - 2 units available LU198 Etch Hitachi M-511A 200 1996 Poly Etcher LE252 Etch Hitachi M-602A 200 AL Dry Etcher LR123 Implant Hitachi E-1030 200 0429-001 1996 Ion Sputter LR124 Implant Hitachi E-1045 200 0614-07 2008 Ion Sputter EU157 Metrology Irvine Optical Ultrastation 200 Wafer Sorter LE229 PVD JAPAN PIONICS URT-3-S （ SPU-A-3B） 200 Ar Purifier LE230 DIFF JAPAN PIONICS WGC-200B-1-S 200 CLF3 absorb unit (5 units available) LE235 DIFF JAPAN PIONICS JIP-100E-S 200 N2 Purifier (2 units available) LE236 DIFF JAPAN PIONICS MANN-07N-S 200 NH3 Purifier (8 units available) LE237 DIFF JAPAN PIONICS JOP-50E-S 200 O2 Purifier (2 units available) LR118 Litho KE DD-853V H2 Anneal 200 DD3-00028-1 1997 H2 Anneal . Ball bonder - Sheartester LW120 Metrology Keller Technology (KTC) BT-30 - " Bausch & Lomb Lens (Zoom: 0,8x ~ 4,0x) LE233 TF KEYENC GR-3500 200 Data-Logger (3 units available) LV121 Metrology KLA-Tencor 2131 200 1995 Wafer Defect Inspection System LJ137 Metrology KLA Tencor CRS 1010 1010A 092 1996 Cleanroom Wafer Confocal Review Station LJ138 Metrology KLA Tencor CRS 1010 1010A 094 1997 Warehouse Wafer Confocal Review Station LS124 Metrology KLA Tencor P-20H 200 1996 Profiler LJ136 Metrology KLA Tencor eS20 XP 200 ES2XX159 2001 Cleanroom Scanning Electron Beam LE264 PVD KLA-Tencor M-gage300 200 Al Thickness measurement LE266 ETCH KLA-Tencor P-20H 200 Step hight measurement LG115 Metrology KLA Tencor ALERIS HX 200 & 300 200612120018 2005 idle, conn'ted 2 load ports (1 x 300mm & 1x 200mm) LJ130 Metrology KLA Tencor AIT Model 200 0996 8036 1996 Cleanroom PatternModes: WaferBBSE InspectionUV, UVR, Patternsystem Recognition(no UV cap.) LL155 Metrology KLA-Tencor KLA5200 200 In Fab MEASUREMENT LL156 Metrology KLA-Tencor KLA5200 200 In Fab MEASUREMENT Overlay Measurement System - Has KLAOUT option.
Load more

Recommended publications
  • Oleds and E-PAPER Disruptive Potential for the European Display Industry
    OLEDs AND E-PAPER Disruptive potential for the European display industry Authors: Simon Forge and Colin Blackman Editor: Sven Lindmark EUR 23989 EN - 2009 The mission of the JRC-IPTS is to provide customer-driven support to the EU policy- making process by developing science-based responses to policy challenges that have both a socio-economic as well as a scientific/technological dimension. European Commission Joint Research Centre Institute for Prospective Technological Studies Contact information Address: Edificio Expo. c/ Inca Garcilaso, 3. E-41092 Seville (Spain) E-mail: [email protected] Tel.: +34 954488318 Fax: +34 954488300 http://ipts.jrc.ec.europa.eu http://www.jrc.ec.europa.eu Legal Notice Neither the European Commission nor any person acting on behalf of the Commission is responsible for the use which might be made of this publication. Europe Direct is a service to help you find answers to your questions about the European Union Freephone number (*): 00 800 6 7 8 9 10 11 (*) Certain mobile telephone operators do not allow access to 00 800 numbers or these calls may be billed. A great deal of additional information on the European Union is available on the Internet. It can be accessed through the Europa server http://europa.eu/ JRC 51739 EUR 23989 EN ISBN 978-92-79-13421-0 ISSN 1018-5593 DOI 10.2791/28548 Luxembourg: Office for Official Publications of the European Communities © European Communities, 2009 Reproduction is authorised provided the source is acknowledged Printed in Spain PREFACE Information and Communication Technology (ICT) markets are exposed to a more rapid cycle of innovation and obsolescence than most other industries.
    [Show full text]
  • Enclosure of Xetra Circular 105/02 Dated June 3, 2002
    Enclosure of Xetra Circular 105/02 dated June 3, 2002 Instrument ISIN WKN Name Short Liquidity Max. A/P Min. Group Code Class Spread Quantity ASI1 JP3126400005 856461 ALPS EL.CO.LTD YN 50 ALE 3 5 P 800 ASI1 JP3352400000 856503 CITIZEN WATCH YN 50 CTZ 3 5 P 1500 ASI1 JP3481800005 857771 DAIKIN IND. LTD YN 50 DKI 3 5 P 600 ASI1 DE0008787557 878755 DAIWA SEC.GRP YN50 DZ DSED 3 5 P 1300 ASI1 JP3814000000 854607 FUJI PHOTO FILM YN 50 FJI 3 5 P 400 ASI1 JP3818000006 855182 FUJITSU LTD YN 50 FUJ1 3 5 P 1400 ASI1 JP3788600009 853219 HITACHI LTD YN 50 HIA1 3 5 P 1300 ASI1 HK0013000119 864287 HUTCHISON WHAMPOA HD-,25 HUWA 3 5 P 1200 ASI1 DE0008644402 864440 IZUMIYA CO. YN 50 DZ IZU 3 5 P 1700 ASI1 DE0008815002 881500 KIRIN BREW.LTD YN50DZ KIRD 3 5 P 1200 ASI1 DE0008621392 862139 MITSUBISHI EL.YN50 DZ MIE 3 5 P 2000 ASI1 JP3902400005 856532 MITSUBISHI EL. CORP. YN50 MIE1 3 5 P 2000 ASI1 DE0008618687 861868 MITSUI + CO. YN 50 DZ MTS 3 5 P 1500 ASI1 DE0008620634 862063 NEC CORP. YN 50 DZ NEC 3 5 P 1300 ASI1 JP3733000008 853675 NEC CORP. YN 50 NEC1 3 5 P 1300 ASI1 JP3695200000 862417 NGK INSULATORS YN 50 NGI 3 5 P 1200 ASI1 JP3738600000 863460 NGK SPARK PLUG YN 50 NGK 3 5 P 1200 ASI1 DE0009284844 928484 NICHIEI YN 50 DZ NIHD 3 5 P 1500 ASI1 JP3679700009 859572 NIPPON MITS.OIL YN 50 NIO 3 5 P 1800 ASI1 DE0008613985 861398 NISSAN MOTOR YN 50 DZ NIS 3 5 P 1400 ASI1 JP3672400003 853686 NISSAN MOTOR YN 50 NISA 3 5 P 1400 ASI1 DE0008644782 864478 SANYO EL.
    [Show full text]
  • EHS Japan TC Chapter Meeting Summary and Minutes
    EHS Japan TC Chapter Meeting Summary and Minutes SEMI Japan Standards Spring 2014 Meetings Thursday, April 17, 2014, 11:00-13:00 SEMI Japan, Tokyo, Japan Next TC Chapter Meeting Thursday, July 24, 2014, 13:00-17:00 SEMI Japan, Tokyo, Japan Table 1 Meeting Attendees Co-Chairs: Supika Mashiro (Tokyo Electron), Hidetoshi Sakura (Intel), Moray Crawford (Hatsuta Seisakusho) SEMI Staff: Naoko Tejima (SEMI Japan) Company Last First Company Last First Hatsuta Seisakusho Crawford Moray Dainippon Screen Manufacturing Nishiguchi Naokatsu Cosmos Corporation Fujita Takuma Safe Techno Nogawa Kaoru Daifuku Hosaka YoshihiroIntel Sakura Hidetoshi Tokyo Electron Hoshi George TÜV SÜD Japan Shibuya Sosuke Tokyo Electron Mashiro Supika Panasonic Sugihara Kenji Dainippon Screen Manufacturing Nakatani Eiji SEMI Japan Tejima Naoko * alphabetical order by last name Table 2 Leadership Changes Group Previous Leader New Leader - Ikuo Goto (Murata Machinery) FPD System Safety Task Force Naokatsu Nishiguchi - Naokatsu Nishiguchi Co-leaders (Dainippon Screen Manufacturing) (Dainippon Screen Manufacturing) Table 3 Ballot Results None Table 4 Authorized Ballots Document # When SC/TF/WG Details 5719 Cycle 4, FPD System Line Item Revision to SEMI S26-0811, Environmental, Health, and Safety 2014 Safety Task Guideline for FPD Manufacturing System, Delayed Revisions Related to Force Limitations 5720 Cycle 4, FPD System Line Item Revisions to SEMI S26-0811, Environmental, Health, and Safety 2014 Safety Task Guideline for FPD Manufacturing System, General Harmonization to SEMI
    [Show full text]
  • TOBAM Maximum Diversification Japan JPY
    TOBAM Maximum Diversification Japan JPY 30/12/2019 Instrument Weight COSMO ENERGY HOLDINGS CO LTD 0.05% IDEMITSU KOSAN CO LTD 0.46% INPEX HOLDINGS INC 0.47% JX HOLDINGS INC 0.35% DAICEL CHEMICAL INDUSTRIES 0.07% DOWA HOLDINGS CO LTD 0.05% HITACHI CHEMICAL CO LTD 0.38% HITACHI METALS LTD 0.05% JSR CORP 0.09% KANSAI PAINT CO LTD 0.14% KOBE STEEL LTD 0.05% MITSUBISHI MATERIALS CORP 0.08% NIPPON KAYAKU CO LTD 0.05% NIPPON PAINT CO LTD 0.23% NIPPON PAPER INDUSTRIES CO L 0.24% NIPPON SHOKUBAI CO LTD 0.18% NISSAN CHEMICAL INDUSTRIES 0.12% NITTO DENKO CORP 0.05% OJI PAPER CO LTD 0.13% SHOWA DENKO K K 0.10% SUMITOMO METAL MINING CO LTD 0.20% TAIHEIYO CEMENT CORP 0.05% TAIYO NIPPON SANSO CORP 0.30% TOKAI CARBON CO LTD 0.93% TORAY INDUSTRIES INC 0.26% TOYO SEIKAN KAISHA LTD 0.07% ALL NIPPON AIRWAYS CO LTD 0.27% CENTRAL JAPAN RAILWAY CO 0.02% COMSYS HOLDINGS CORP 0.09% FANUC LTD 0.38% HINO MOTORS LTD 0.07% HOSHIZAKI CORP 1.50% IHI CORP 0.08% ITOCHU CORP 0.16% TOBAM Maximum Diversification Japan JPY 30/12/2019 Instrument Weight JAPAN AIRLINES CO LTD 0.49% JGC HOLDINGS CORP 0.09% JS GROUP CORP 0.85% KEIHAN ELECTRIC RAILWAY CO 0.13% KEIO CORP 0.18% KINTETSU CORP 0.26% KOMATSU LTD 0.07% KYOWA EXEO CORP 0.06% KYUSHU RAILWAY COMPANY 0.13% MAKITA CORP 0.22% MITSUBISHI CORP 0.69% MITSUBISHI HEAVY INDUSTRIES 0.31% NAGOYA RAILROAD CO LTD 0.14% NANKAI ELECTRIC RAILWAY CO 0.08% OBAYASHI CORP 0.13% ODAKYU ELECTRIC RAILWAY CO 0.20% PARK24 CO LTD 1.15% RECRUIT HOLDINGS CO LTD 0.10% SANKYU INC 0.07% SECOM CO LTD 0.06% SEIBU HOLDINGS INC 0.09% SEINO HOLDINGS CO LTD
    [Show full text]
  • ICC Heritage
    International Color Consortium June 19, 2007 Chiba University William Li Kodak Graphic Communications Group ICC Chair What is the ICC? “Making Color Seamless Between Devices and Documents” • Founded 1993 • Mission: —To create, promote, and encourage the standardization and evolution of an open, vendor-neutral, cross-platform color management system architecture and components. 6/19/2007 International Color Consortium Overview 2 Who is the ICC? • 69 active members, including 4 founding members • Vendors & Users, including companies such as: Adobe Hewlett Packard R.R. Donnelly Agfa Kikuze Solutions Samsung Apple Konica Minolta Seiko EPSON Canon Kyocera Mita Sharp Dainippon Screen Lexmark Sony Kodak Matsushita Sun Chemical Fogra NEC Toppan Printing Fujifilm Nikon Toshiba Fujitsu Onyx Graphics Xerox Heidelberg Quark X-Rite 6/19/2007 International Color Consortium Overview 3 Purpose of ICC • Consortium of companies: — Not just a standards organization, but also a force for promoting color standardization. — Goal: Create, promote and encourage evolution of an open, vendor- neutral, cross-platform colour management system architecture and components. • Published ICC.1:2004-10 profile specification, also available as ISO 15076-1:2005. • ICC v4 implementation — Improved perceptual & colorimetric rendering intent interoperability. — Less ambiguity in specification. — Improved display profiles via chromatic adaptation. 6/19/2007 International Color Consortium Overview 4 ICC Heritage • Several profile-like formats appeared in early 1990s —Kodak (Precision
    [Show full text]
  • First Edition
    dfd Monday, 13 May 2013 (First Edition) Japan Daily Featured stocks Top of the Pack Price TP Upside Nissan Motor (7201) OUTPERFORM TP ¥1,150 Takahashi Rating 10 May TP FY3/13 results: when will "surplus" cash be returned to shareholders? Results Panasonic 6752 Corporation O 749 750 0.1% FOCUS LIST STOCK Square Enix Sumitomo Electric Industries (5802) OUTPERFORM TP ¥1,500 Okumoto/ Yamada 9684 Holdings O 1240 1450 16.9% Potential OP upside of ¥50bn; margin deterioration unlikely amid rising production Results 6501 Hitachi N 645 510 -20.9% FOCUS LIST STOCK Dainippon Screen 7735 Mfg. N 536 510 -4.9% Square Enix Holdings (9684) Neutral->OUTPERFORM TP ¥1,150->¥1,450 Tsuchiya Nippon Telegraph Announcement of additional structural reforms should mark the end of bad news Upgrade Rating 9432 and Telephone O 5080 4700 -7.5% Yakult Honsha (2267) Underperform-> NEUTRAL TP ¥2,700->¥4,100 Kawasaki/Yamate Konica Minolta Upgrade to NEUTRAL; Positive on better cost awareness Upgrade Rating 4902 Holdings N 759 650 -14.4% 3659 NEXON O 1192 1300 9.1% Technology 6640 Dai-ichi Seiko N 1548 1300 -16.0% Panasonic Corporation (6752) OUTPERFORM TP ¥750 Tsuchiya 7915 Nissha Printing N 2186 1660 -24.1% Prospects for bringing forward restructuring positive Results 7201 Nissan Motor Co. O 1063 1150 8.2% Square Enix Holdings (9684) Neutral->OUTPERFORM TP ¥1,150->¥1,450 Tsuchiya 6141 Mori Seiki U 1267 900 -29.0% Announcement of additional structural reforms should mark the end of bad news Upgrade Rating 6471 NSK O 873 800 -8.4% 6326 Kubota U 1434 1150 -19.8% Hitachi (6501) NEUTRAL TP ¥510 Maekawa/ Fukumoto 6268 Nabtesco Corp N 2457 1650 -32.8% Little prospect of organic growth, Smart Transformation-driven profit expansion Results 2229 Calbee N 9490 7300 -23.1% Dainippon Screen Mfg.
    [Show full text]
  • Japan Information & Control Standards Committee
    Japan Information & Control Standards Committee Meeting Summary and Minutes Japan Standards Fall Meetings 2012 September 7, 2012, 13:30-17:00 Japan Time Oshima Conference Room 1 & 2, SEMI Japan, Tokyo, Japan Committee Announcements Next Committee Meeting Friday, December 7, 2012, 13:00-17:00 Japan Time Makuhari Messe, Chiba, Japan Table 1 Meeting Attendees Italics indicate virtual participants Co-Chairs: Takayuki Nishimura (Dainippon Screen MFG.), Mitsuhiro Matsuda (Hitachi Kokusai Electric) SEMI Staff: Chie Yanagisawa Attendee: 13 + SEMI: 2 Company Last First Company Last First Algosystem Tanaka Yasuhiro Tokyo Electron Murata Naoko Cannon Anelva Sato Mitsugu Tokyo Electron Sakamoto Mitch Software Technologies Dainippon Screen MFG. Nishimura Takayuki Tokyo Electron Mochizuki Tadashi Software Technologies FB Consult Somei Tadashi Tokyo Seimitsu Sasaki Mie Hitachi High Toyoshima Yuko YOKOGAWA Nakagawa Takashi Technologies Mitsubishi Electric Sambu Ken Tokyo Electron Asakawa Terry SEMI Korea Shim Natalie Tokyo Electron Murakami Takashi SEMI Japan Yanagisawa Chie Table 2 Leadership Changes Group Previous Leader New Leader Predictive Carrier Logistics (PCL) TF --- Terry Asakawa (Tokyo Electron) Table 3 Ballot Results (or move to Section 4, Ballot Review) Passed ballots and line items will be submitted to the ISC Audit & Review Subcommittee for procedural review. Failed ballots and line items were returned to the originating task forces for re-work and re-balloting. Document # Document Title Committee Action None Table 4 Authorized Ballots
    [Show full text]
  • Ultraclean Surface Processing of Silicon Wafers Springer-Verlag Berlin Heidelberg Gmbh Takeshi Hattori (Ed.)
    Ultraclean Surface Processing of Silicon Wafers Springer-Verlag Berlin Heidelberg GmbH Takeshi Hattori (Ed.) Ultraclean Surface Processing of Silicon Wafers Secrets of VLSI Manufacturing With 464 Figures , Springer Dr. Takeshi Hattori ULSI R&D Laboratories Sony Corporation Semiconductor Company Atsugi 243-8585, Japan E-mail: [email protected] Translators: Dr. Takeshi Hattori Stefan Heusler ULSI R&D Laboratories Blumenthalstr. 83 Sony Corporation Semiconductor Co. D-50668 KOln, Germany Jason P. Webb 12107 Lake Carrol Drive Tampa, FL 33618-3729, USA Revised, updated and enlarged translation of the original Japanese edition Originally published in Japanese under the title: Silicon Wafer Hyomen no Clean-ka Gijutsu Published by Realize Inc. © 1995 Library of Congress Cataloging-in-Publication Data. Ultraclean surface processing of silicon wafers: secrets of VLSI manufacturing 1 Takeshi Hattori (ed.). p. cm. ISBN 3-540-61672-1 (alk. paper) 1. Semiconductor wafers-Cleaning. 2. Silicon-Surfaces. 3. Surface preparation. l. Hattori, Takeshi, 1945-. TK7871.85.U48 1998 621.3815'2-DC21 98-10353 ISBN 978-3-642-08272-6 ISBN 978-3-662-03535-1 (eBook) DOI 10.1007/978-3-662-03535-1 This work is subject to copyright. All rights are reserved, whether the whole or part of the material is concerned, specifically the rights of translation, reprinting, reuse of illustrations, recitation, broad­ casting, reproduction on microfilm or in any other way, and storage in data banks. Duplication of this publication or parts thereof is permitted only under the provisions of the German Copyright Law of September 9, 1965, in its current version, and permission for use must always be obtained from Springer-Verlag.
    [Show full text]
  • Tokyo Electron
    TOKYO ELECTRON LIMITED World Headquarters CONTENTS 目次 Akasaka Biz Tower 3-1, Akasaka 5-chome Industry Data C2 Minato-ku, Tokyo 107-6325, Japan インダストリー・データ Tel: +81-3-5561-7000 Fax: +81-3-5561-7400 Tokyo Electron (TEL) Overview 1 URL: http://www.tel.com 東京エレクトロン（TEL）の事業概要 Global TEL Investor Relations 2 TELの世界展開 Corporate Communications Dept. Tel: +81-3-5561-7003 Topics in Recent Years 3 Fax: +81-3-5561-7400 近年のトピックス Semiconductor & TFT-LCD 4 Manufacturing Process Flow 半導体製造工程及び TFT-LCD製造工程 Consolidated Operating Results 6 連結業績 TOKYO Semiconductor 8 Production Equipment (SPE) and FPD Production Equipment 半導体製造装置・FPD製造装置 Consolidated Financial Data 10 連結財務データ ELECTRON Consolidated Balance Sheets 14 連結貸借対照表 Consolidated Statements of Operations 16 連結損益計算書 Consolidated Statements of Cash Flows 17 連結キャッシュ・フロー計算書 Consolidated Quarterly Data 18 FACT 連結四半期データ Stock Information 20 株式情報 2008As of March 31, 2008 BOOK Printed on recycled paper. 本誌は再生紙を使用しています。 Printed in Japan PR46-133 010_0454002472006.indd 2 2008/07/11 16:38:13 Industry Data インダストリー・データ World Electronic System (US$ Billion 十億ドル) 1,214 1,081 Market 972 2007 世界電子機器市場 667 Source 出典：IC Insights World Electronic System 437 Market 世界電子機器市場 US$1,214B CY 歴年 ’90 ’95 ’00 ’05 ’07 World Semiconductor World Semiconductor (US$ Billion 十億ドル) 256 Market Market 227 世界半導体市場 204 世界半導体市場 US$256B 144 Source 出典：WSTS World Wafer Fab Equipment Market 50 世界半導体前工程製造装置市場 US$ B 36 CY 歴年 ’90 ’95 ’00 ’05 ’07 World Wafer Fab (US$ Billion 十億ドル) Equipment Market 36 世界半導体前工程製造装置市場 33 26 Source 出典：Gartner Dataquest
    [Show full text]
  • Top 300 Organizations Granted U.S. Patents in 2020
    Top 300 Organizations Granted U.S. Patents in 2020 38th Annual Listing This list of organizations that received the most U.S. utility patents is being published by IPO for the 38th consecutive year, in collaboration with Harrity Analytics. It is based on data obtained from the U.S. Patent and Trademark Office. For additional patent prosecution, technology, and law firm statistics related to the U.S. Patents issued in 2020, visit the Patent 300® website for an interactive dashboard. January 14, 2021 2020 Patent Owners Numerical Listing The total number of patents granted by the USPTO in 2020 was 352,469, down less than 1 percent from 2019. The data for an individual organization could be affected by mergers, acquisitions, divestitures, inconsistent treatment of subsidiaries in 2019 and 2020, and many other factors. New organizations on the list are provided on page 9. Change Change 2020 from 2020 from Rank Organization Patents 2019 Rank Organization Patents 2019 1 INTERNATIONAL BUSINESS MACHINES 9435 0% 51 TCL CORPORATION 880 -30% 2 SAMSUNG ELECTRONICS CO., LTD. 8539 -1% 52 INFINEON TECHNOLOGIES AG 834 -12% 3 LG CORPORATION 5112 4% 53 HEWLETT PACKARD ENTERPRISE 831 1% 4 CANON K.K. 3689 -9% 54 GENERAL MOTORS COMPANY 802 -40% 5 INTEL CORPORATION 3284 -12% 55 WESTERN DIGITAL CORPORATION 788 6% 6 RAYTHEON TECHNOLOGIES 3213 1% 56 ORACLE CORPORATION 783 -11% 7 HUAWEI TECHNOLOGIES CO., LTD. 3178 9% 57 HALLIBURTON COMPANY 778 -24% 8 MICROSOFT CORPORATION 2972 -5% 58 NOKIA CORPORATION 757 -20% 9 TAIWAN SEMICONDUCTOR MFG. CO. 2892 22% 59 KIOXIA HOLDINGS CORPORATION 756 4% 10 SONY CORPORATION 2886 5% 60 CAPITAL ONE FINANCIAL CORP.
    [Show full text]
  • Company Vendor ID (Decimal Format) (AVL) Ditest Fahrzeugdiagnose Gmbh 4621 @Pos.Com 3765 0XF8 Limited 10737 1MORE INC
    Vendor ID Company (Decimal Format) (AVL) DiTEST Fahrzeugdiagnose GmbH 4621 @pos.com 3765 0XF8 Limited 10737 1MORE INC. 12048 360fly, Inc. 11161 3C TEK CORP. 9397 3D Imaging & Simulations Corp. (3DISC) 11190 3D Systems Corporation 10632 3DRUDDER 11770 3eYamaichi Electronics Co., Ltd. 8709 3M Cogent, Inc. 7717 3M Scott 8463 3T B.V. 11721 4iiii Innovations Inc. 10009 4Links Limited 10728 4MOD Technology 10244 64seconds, Inc. 12215 77 Elektronika Kft. 11175 89 North, Inc. 12070 Shenzhen 8Bitdo Tech Co., Ltd. 11720 90meter Solutions, Inc. 12086 A‐FOUR TECH CO., LTD. 2522 A‐One Co., Ltd. 10116 A‐Tec Subsystem, Inc. 2164 A‐VEKT K.K. 11459 A. Eberle GmbH & Co. KG 6910 a.tron3d GmbH 9965 A&T Corporation 11849 Aaronia AG 12146 abatec group AG 10371 ABB India Limited 11250 ABILITY ENTERPRISE CO., LTD. 5145 Abionic SA 12412 AbleNet Inc. 8262 Ableton AG 10626 ABOV Semiconductor Co., Ltd. 6697 Absolute USA 10972 AcBel Polytech Inc. 12335 Access Network Technology Limited 10568 ACCUCOMM, INC. 10219 Accumetrics Associates, Inc. 10392 Accusys, Inc. 5055 Ace Karaoke Corp. 8799 ACELLA 8758 Acer, Inc. 1282 Aces Electronics Co., Ltd. 7347 Aclima Inc. 10273 ACON, Advanced‐Connectek, Inc. 1314 Acoustic Arc Technology Holding Limited 12353 ACR Braendli & Voegeli AG 11152 Acromag Inc. 9855 Acroname Inc. 9471 Action Industries (M) SDN BHD 11715 Action Star Technology Co., Ltd. 2101 Actions Microelectronics Co., Ltd. 7649 Actions Semiconductor Co., Ltd. 4310 Active Mind Technology 10505 Qorvo, Inc 11744 Activision 5168 Acute Technology Inc. 10876 Adam Tech 5437 Adapt‐IP Company 10990 Adaptertek Technology Co., Ltd. 11329 ADATA Technology Co., Ltd.
    [Show full text]
  • Cézanne Elite Desktop Flatbed Scanner Today’S Workplace Demands Ever-Increasing Quality and Productivity
    INPUT Cézanne Elite Desktop Flatbed Scanner Today’s workplace demands ever-increasing quality and productivity. Responding to the increasingly stringent demands of our worldwide customers, Dainippon Screen now presents the Cézanne Elite, a scanner in a class of its own.The outstanding features and versatility of the industry-acclaimed Cézanne are just the beginning, as the new Cézanne Elite offers significant improvements in many fundamental areas. Scanning with the Cézanne Elite is approximately twice as fast as our previous model, ensuring dramatic increases in productivity. In addition, the latest ColorGenius EX image processing software combines an even easier to use GUI with new functions that make achieving superior output supremely easy. The Cézanne Elite leads the way to a new era of unparalleled performance that will exceed your most demanding expectations. Embrace the most advanced technology with the latest generation of superlative flatbed scanners from Dainippon Screen. Quality and performance, delivered in a rock-solid package High speed scanning offering the same time, for scanning in quick succes- exceptionally productivity sion. Even A3 size mechanicals, including The Cézanne Elite features an incredibly registration marks, can be placed flat on the high scanning speed. In just one hour, for Cézanne’s bed for scanning at high resolutions. example, it can scan up to one-hundred-four 35 mm originals at 350 dpi and 400% mag- Ideal for network scanning nification, or ninety-four 6 x 7 cm originals Remote setup and operation is available at 300 dpi and 250% magnification, includ- via the ColorGenius EX client/server archi- ing the time required for conversion from tecture, enabling client and server programs RGB to CMYK.* to run on two different computers for scan- tors to use the most appropriate resolutions When compared with the previous ning across networks.
    [Show full text]