Intel® Technology Journal

Total Page:16

File Type:pdf, Size:1020Kb

Intel® Technology Journal 9/4/09 8:28:45 AM Intel® Technology Journal Technology Intel® SEPTEMBER 2009 in the Home Enabling Healthcare INTEL® TECHNOLOGY JOURNAL | ENABLING HEALTHCARE IN THE HOME VOL 13 | ISSUE 03 | SEPTEMBER 2009 35858 21143 77 ISBN 978-1-934053-23-2 9 781934 053232 $49.95 US Copyright © 2009 Intel Corporation. All rights reserved. Intel, and the Intel logo, are trademarks of Intel Corporation in the U.S. and other countries. Copyright © 2009 Intel Corporation. More information, including current and past issues of Intel Technology Journal, can be found at: at: Journal, can be found Technology Intel issues of and past including current information, More http://developer.intel.com/technology/itj/index.htm ITJ9-3_Cover_BFC_39spn_090409.indd 1 About the Cover Enabling Healthcare in the Home is the theme of the Intel Technology Journal, Volume 13, Issue 3. The physician in the foreground (1) is remotely performing a house call. The doctor is able to see the patient (2) and to obtain diagnostic information, such as blood pressure and pulse vitals. The patient is able to remain at home, which is helpful and efficient for those with ambulatory or transportation issues. Next door (3) is an elderly person who can safely live independently because the home is out- fitted with sensors (the yellow spots) that monitor motion. Family caregivers located elsewhere can be aware that this individual is performing routine tasks. Upstairs is (4) someone sleeping. Sensors measure nighttime activity, which can be an indicator of health risk. Also upstairs (5) is a child or an elderly person for whom reading is difficult. The child or elder can snap-shot a page and listen to the words. Thus, technology can enable healthcare in the home for all ages. ITJ9-3_Cover_BFC_39spn_090409.indd 2 9/4/09 8:28:46 AM Intel® Technology Journal | Volume 13, Issue 3, 2009 Intel Technology Journal Publisher Managing Editor Content Architects Richard Bowles David King Doug Busch Eric Dishman Program Manager Technical Editor Technical Illustrators Stuart Douglas Marian Lacey Richard Eberly Margaret Anderson Technical and Strategic Reviewers Steve Agritelley Alan Boucher Doug Bugia Doug Busch Eric Dishman Farzin Guilak Kristina Kermanshasche George Korinsky Brad Needham Kevin Rhodes Intel® Technology Journal | 1 Intel® Technology Journal | Volume 13, Issue 3, 2009 Intel Technology Journal Copyright © 2009 Intel Corporation. All rights reserved. ISBN 978-1-934053-23-2, ISSN 1535-864X Intel Technology Journal Volume 13, Issue 3 No part of this publication may be reproduced, stored in a retrieval system or transmitted in any form or by any means, electronic, mechanical, photocopying, recording, scanning or otherwise, except as permitted under Sections 107 or 108 of the 1976 United States Copyright Act, without either the prior written permission of the Publisher, or authorization through payment of the appropriate per-copy fee to the Copyright Clearance Center, 222 Rosewood Drive, Danvers, MA 01923, (978) 750-8400, fax (978) 750-4744. Requests to the Publisher for permission should be addressed to the Publisher, Intel Press, Intel Corporation, 2111 NE 25th Avenue, JF3-330, Hillsboro, OR 97124-5961. E-mail: [email protected]. This publication is designed to provide accurate and authoritative information in regard to the subject matter covered. It is sold with the understanding that the publisher is not engaged in professional services. If professional advice or other expert assistance is required, the services of a competent professional person should be sought. Intel Corporation may have patents or pending patent applications, trademarks, copyrights, or other intellectual property rights that relate to the presented subject matter. The furnishing of documents and other materials and information does not provide any license, express or implied, by estoppel or otherwise, to any such patents, trademarks, copyrights, or other intellectual property rights. Intel may make changes to specifications, product descriptions, and plans at any time, without notice. Third-party vendors, devices, and/or software are listed by Intel as a convenience to Intel’s general customer base, but Intel does not make any representations or warranties whatsoever regarding quality, reliability, functionality, or compatibility of these devices. This list and/or these devices may be subject to change without notice. Fictitious names of companies, products, people, characters, and/or data mentioned herein are not intended to represent any real individual, company, product, or event. Intel products are not intended for use in medical, life saving, life sustaining, critical control or safety systems, or in nuclear facility applications. Intel, the Intel logo, Celeron, Intel Centrino, Intel Core Duo, Intel NetBurst, Intel Xeon, Itanium, Pentium, Pentium D, MMX, and VTune are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the United States and other countries. †Other names and brands may be claimed as the property of others. This book is printed on acid-free paper. Publisher: Richard Bowles Managing Editor: David King Library of Congress Cataloging in Publication Data: Printed in the United States 10 9 8 7 6 5 4 3 2 1 First printing September 2009 2 | Foreword Intel® Technology Journal | Volume 13, Issue 3, 2009 INTEL® TECHNOLOGY JOURNAL IMPROVING Healthcare THROUGH TECHNOLOGY AND Innovation Articles Foreword ���������������������������������������������������������������������������������������������������������������������������������������������������������������� 4 Powering Healthcare Visions: Taking Advantage of Complexity, Connectivity, and Consumerism ������������������������ 6 From People to Prototypes and Products: Ethnographic Liquidity and the Intel Global Aging Experience Study �������������������������������������������������������������������������������������������������������������������� 20 Adapting Technology for Personal Healthcare ����������������������������������������������������������������������������������������������������� 40 Healthcare IT Standards and the Standards Development Process: Lessons Learned from Health Level 7 �������������������������������������������������������������������������������������������������������������������������������� 58 Healthcare Information Integration: Considerations for Remote Patient Monitoring �������������������������������������������� 80 Personal Health Device Interoperability ������������������������������������������������������������������������������������������������������������� 104 A Common Personal Health Research Platform — SHIMMER™ and BioMOBIUS™ ��������������������������������������� 122 Gathering the Evidence: Supporting Large-Scale Research Deployments �������������������������������������������������������� 148 Assistive Technology for Reading ����������������������������������������������������������������������������������������������������������������������� 168 Developing Consumer and IT Platforms in a Regulated Medical Device Environment �������������������������������������� 188 Table of Contents | 3 Intel® Technology Journal | Volume 13, Issue 3, 2009 FOREWORD Douglas F. Busch Vice President Chief Technology Officer Digital Health Group Intel Corporation Fundamental medical science has made enormous strides over the past several Eric Dishman decades, and the length and quality of life in developed countries has improved Intel Fellow remarkably. However, trends in demographics, lifestyles, and treatment Digital Health Group practices are making our healthcare systems unsustainable. Improving access Intel Corporation to healthcare and controlling healthcare costs are two of the most contentious current issues in United States politics, and are a huge concern in most other countries also. Better use of technology in healthcare is an obvious strategy to help solve these problems by applying innovation to how and where we deliver care. Science and technology have been applied aggressively to clinical diagnostics and treatment. Diagnostic imaging, advanced surgical techniques, and sophisticated pharmaceuticals have all had strong positive benefits. We have not “Better use of technology in healthcare yet seen the benefits of applying everyday technologies that we take for granted in other aspects of our lives, though. Much attention is now being given to is an obvious strategy to help solve applying information technology to record keeping and communication in clinical settings. The recent American Recovery and Reinvestment Act (part these problems by applying innovation of the 2009 economic stimulus package) focuses strongly on deployment and to how and where we deliver care.” meaningful use of Electronic Medical Records. This is not enough. To really impact the availability and cost of healthcare, and improve the quality of our citizen’s lives, we need to shift some of the focus of healthcare from the clinical setting to the home. Just as much of banking has moved from marble lobbies filled with tellers to a self-service model enabled by technology, we can use readily-available technologies to move some aspects of healthcare from clinical settings to the home. We can also use technology to allow our aging population to stay in their homes longer, living independently. Both of these approaches have the potential to improve quality of life and reduce the cost of providing the healthcare and living assistance our population needs. We need to really understand how to use technology effectively
Recommended publications
  • Using the Intel® LXT973 Ethernet Transceiver Application Note
    Intel® IXP42X Product Line and IXC1100 Control Plane Processor: Using the Intel® LXT973 Ethernet Transceiver Application Note July 2004 Document Number: 253429-002 Intel® IXP42X Product Line and IXC1100 Control Plane Processor: Using the Intel® LXT973 Ethernet Transceiver INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. EXCEPT AS PROVIDED IN INTEL'S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY RELATING TO SALE AND/OR USE OF INTEL PRODUCTS, INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT, OR OTHER INTELLECTUAL PROPERTY RIGHT. Intel Corporation may have patents or pending patent applications, trademarks, copyrights, or other intellectual property rights that relate to the presented subject matter. The furnishing of documents and other materials and information does not provide any license, express or implied, by estoppel or otherwise, to any such patents, trademarks, copyrights, or other intellectual property rights. Intel products are not intended for use in medical, life saving, life sustaining, critical control or safety systems, or in nuclear facility applications. Intel may make changes to specifications and product descriptions at any time, without notice. Designers must not rely on the absence or characteristics of any features or instructions marked "reserved" or "undefined." Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them. Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order.
    [Show full text]
  • Tech Heaven: Intel Technology Innovation on Display
    Intel Corporation 2200 Mission College Blvd. P.O. Box 58119 Santa Clara, CA 95052-8119 Showcase Overview Tech Heaven: Intel Technology Innovation On Display This interactive showcase highlights technology innovations that are in some stage of active research or development and have the potential to change how we live, work and play in the following areas: home, hands-free technology, fashion/shopping, communication/social media, health and transportation. We see a world where personal computing is expanding beyond the PC to nearly every kind of electronic device. We see “smart” computers themselves vanishing into the background – a network of billions of connected people and trillions of “smart” connected electronic products, many connecting without human intervention. Intel is investing some of its annual USD$6 billion in research in order to make this vision a reality. Moore’s Law is enabling Intel to pack more and more technology and innovation into ever shrinking chips. As we are multiplying the number of “brains” or cores inside the chip and computer, our computing experiences continues to get faster, stronger, smarter, more personalized and with unprecedented vividness. And with the unfettered Internet connectivity in the home, car and everywhere in between, this new computing experience follows us wherever we go. Intel has been at the forefront of the computer industry’s rapid pace of change. Things that were unimaginable just a decade or two ago are now considered common place. The pace of technological innovation is accelerating, and the number of inventions in the next 40 years will equal or surpass all of the inventive activity that has taken place in history.
    [Show full text]
  • Intel IXP45X and Intel IXP46X Product Line of Network Processors
    Intel® IXP45X and Intel® IXP46X Product Line of Network Processors Datasheet Product Features For a complete list of product features, see “Product Features” on page 9. This document describes in full the features of the silicon. Some of these features require enabling software supplied by Intel. Please refer to the Intel® IXP400 Software Programmer’s Guide for information on which features are enabled at this time. These features do not require These features require enabling enabling software software. For information on which ® Intel XScale Processor — Up to features are enabled at this time, ® 667 MHz see the Intel IXP400 Software Programmer’s Guide. PCI v. 2.2 33/66 MHz (Host/Option) Cryptography Unit (Random Number USB 1.1 Device Controller Generator and Exponentiation Unit) USB 2.0 Host Controller Encryption/Authentication (AES/ DDRI SDRAM Interface AES-CCM/3DES/DES/SHA-1/SHA-256/ Master/Target Capable Expansion bus SHA-384/SHA-512/MD-5) Two UARTs Two High-Speed, Serial Interfaces Internal Bus Performance Monitoring Three Network Processor Engines Unit Up to three MII Interfaces 16 GPIO Up to three SMII Interfaces Four Internal Timers Up to one UTOPIA Level 2 Interface Synchronous Serial Protocol (SSP) IEEE-1588 Hardware Assist Port 2 I C Interface Spread Spectrum clocking for Reduced EMI Packaging —544-Pin PBGA — Commercial/Extended Temperature — Lead-Free Support Typical Applications Small-to-Medium Business Router VoIP Integrated Access Device (IAD) Industrial Controllers Video IP Telephones Modular Router Security Gateway/Router Access Points (802.11a/b/g) Network Printers Network-Attached Storage Control Plane Wired/Wireless RFID Readers Mini-DSLAM Document Number: 306261-004US August 2006 INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS.
    [Show full text]
  • The History of the 4004
    Federico Faggin nty-five years ago, in November 71, an advertisement appeared in In April of 1969, Intel agreed to develop a Synaptics, Inc. Electronic News: “Announcing a new set of calculator chips for a Japanese firm. era in integrated electronics, a micropro- The firm consisted of two companies: Marcian E. Hofflr. grammable computer on a chip.” The ad was Electro-Technical industries handled prod- placed by Intel Corporation of Santa Clara, uct development, and Nippon Calculating Teklicon California, then just over three years old. From Machines Company handled marketing. The that modest but prophetic beginning, the calculators bore the brand name Busicom. Stanley Mazor microprocessor market has grown into a Busicom intended to use the chip set in sev- multibillion-dollar business, and Intel has eral different models of calculators, from a BEA Systems maintained a leadership position, particularly low-end desktop printing calculator to cal- in microprocessors for personal computers. culator-like office machines such as billing Masatoshi Shima In 1968, Bob Noyce and Gordon Moore, machines, teller machines, and cash regis- who had both just left Fairchild Semicon- ters. The firm made arrangements for three VM Technology Inc. ductor, founded Intel Corporation, and oper- of its engineers to come to Intel to finish the ations began in September of the same year. logic design for the calculator chips and to The new company was committed to devel- work with Intel personnel to transfer the oping semiconductor mainframe memory designs into silicon. The three engineers from products using both bipolar and MOS (metal- Japan-Masatoshi Shima and his colleagues oxide-semiconductor) technologies.
    [Show full text]
  • Fact Sheet: Intel Introduces New Mobile Platforms and Products
    News Fact Sheet Intel Introduces New Mobile Platforms and Products at Mobile World Congress March 2, 2015 — At Mobile World Congress, Intel Corporation announced new platforms and products for mobile devices, offering a comprehensive portfolio of products that supports the full spectrum of mobile devices across form factors and price points. Products introduced at the show include the Intel® AtomTM x3 processor for entry and value smartphones, phablets and tablets; Intel® AtomTM x5 and x7 processors for mainstream and premium tablets and 2 in 1s; the third-generation Intel® XMM™ 7360 LTE modem; and three new wireless connectivity products for mobile devices: the Intel® Wireless-AC 8x70, Intel® Wireless-GNSS 2x00 and Intel® Wireless-NFC 4000. Intel Atom x3 Processor The Intel Atom x3 processor (previously code-named “SoFIA”) is Intel’s first system-on-a-chip (SoC) for entry and value smartphones, phablets and tablets, combining a 64-bit multi-core Intel Atom processor with 3G or 4G LTE connectivity, an image sensor processor (ISP), graphics, and audio and power management components. This full-featured integration will help device manufacturers bring new mobile products to market faster and more cost-effectively for the rapidly growing entry and value market segments. The Intel Atom x3 processor family includes: Intel® Atom™ x3-C3130, a dual-core platform with an Intel Atom processor integrated with a 3G modem Intel® Atom™ x3-C3230RK, a quad-core platform with an Intel Atom processor integrated with a 3G modem, manufactured by Intel’s development partner, Rockchip* Intel® Atom™ x3-C3440, a quad-core platform with an Intel Atom processor integrated with an LTE modem Key benefits of the Intel Atom x3 processor include: SoC integration for great mobile experiences.
    [Show full text]
  • Intel® Vmdq Technology: an Overview
    Intel VMDq Technology NOTES ON SOFTWARE DESIGN SUPPORT FOR INTEL VMDQ TECHNOLOGY Network Division (ND) March 2008 Revision 1.2 0BLegal INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL'S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. Intel products are not intended for use in medical, life saving, life sustaining applications. Intel may make changes to specifications and product descriptions at any time, without notice. Designers must not rely on the absence or characteristics of any features or instructions marked “reserved” or “undefined.” Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them. This manual may contain design defects or errors known as errata, which may cause the product to deviate from published specifications. Current characterized errata are available on request. This manual as well as the software described in it, is furnished under license and may only be used or copied in accordance with the terms of the license. The information in this document is furnished for informational use only, is subject to change without notice, and should not be construed as a commitment by Intel Corporation.
    [Show full text]
  • Intel® 80333 I/O Processor
    Intel® 80333 I/O Processor Specification Update April 2006 The Intel® 80333 I/O Processor may contain design defects or errors known as errata which may cause the product to deviate from published specifications. Current characterized errata are doc- umented in this specification update. Order Number: 305435-011US INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. EXCEPT AS PROVIDED IN INTEL’S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY RELATING TO SALE AND/OR USE OF INTEL PRODUCTS, INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT, OR OTHER INTELLECTUAL PROPERTY RIGHT. Intel Corporation may have patents or pending patent applications, trademarks, copyrights, or other intellectual property rights that relate to the presented subject matter. The furnishing of documents and other materials and information does not provide any license, express or implied, by estoppel or otherwise, to any such patents, trademarks, copyrights, or other intellectual property rights. Intel products are not intended for use in medical, life saving, life sustaining, critical control or safety systems, or in nuclear facility applications. Intel may make changes to specifications and product descriptions at any time, without notice. Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order. Copies of documents which have an ordering number and are referenced in this document, or other Intel literature may be obtained by calling 1-800-548-4725 or by visiting Intel's website at http://www.intel.com.
    [Show full text]
  • Oral History Panel on the Development and Promotion of the Intel 4004 Microprocessor
    Oral History Panel on the Development and Promotion of the Intel 4004 Microprocessor Interviewees: Federico Faggin Hal Feeney Ted Hoff Stan Mazor Masatoshi Shima Interviewed by: Dave House Edited by David Laws Recorded: April 25, 2007 Mountain View, California CHM Reference number: X4024.2007 © 2007 Computer History Museum Oral History Panel of the Intel 4004 Microprocessor Dave House: Welcome to the video history of the MCS-4, [also known as] 4004 microprocessor development. I joined Intel in February of 1974, so I was not at Intel at the time of the 4004, but later worked with each of these individuals in one way or another. So what I’d like to do is start out, just go through the table here, and have everyone give their background up to the point where they started working on this product. So, Stan, could you start? Stanley Mazor: Thank you, Dave. My name is Stanley Mazor. I was raised in Oakland, California, and attended Oakland public high schools. I went to San Francisco State in 1960, and was introduced to a computer for the first time during the years 1960-1962. I took the two computer courses they had in programming. There was no computer science at San Francisco State in those days. And one of the projects that I had in school was to write an interpreter for a virtual machine called IPL-V. The IBM 1620 was a decimal machine and was to affect my career and some of the contributions I made in subsequent years. I was a lab assistant at the computer center at San Francisco State, and left in 1963 to work at the University of California, also as a programmer on a 1620, and that was the fanciest 1620 in the United States, having many special features.
    [Show full text]
  • Demystifying Microprocessor Design 27 Able to Isolate Various Sections with MOS Switches
    APPLICATIONS Solid state/computers • tif I III II ml r r s r I n Big chips require artful compromises, as demonstrated by this design case history Stripped of its mystique, designing a high-performance wasted interconnection space, no speed bottlenecks. Op­ microprocessor like the Zilog 28000 is like designing any timum power line widths must be correctly specified to in­ other complex system ofdigital electronics, except that good sure good noise margins. The designers must provide the engineering practices, instead of being merely desirable, are draftsmen with rough layouts of critical chip areas and crucial. Here are the key rules that the designers of the 28000 monitor the draftsmen's final layout closely to insure that followed: the propagation time will be as predicted. If those precau­ • Top-down design is essential (Fig. 1) because once the tions are not taken, the layout may have to be redone. concepts are frozen in silicon, it takes many months to cor­ • Experience counts in speeding the work flow. The rect even a minor error. And time is of the essence, because author was fortunate to have acquired design experience on LSI density increases so rapidly each year that nobody wants previous processors, the 4004, 8080, and Z80. This expertise a design geared to last year's capability. was handed down in an orderly way to the associate designer, • Accurateproduct cost predictions are more critical than both for the present design and for future ones he might when designing with off-the-shelf tcs. The LSI analog of ic undertake. All of the Z8000 detailed circuit design was, in parts count is chip area, which is much more critical than a fact, done by Mr.
    [Show full text]
  • Intel Paves 5G Way with Gigabit LTE Modem Aiming for Iphone
    1 / 2 Intel Paves 5G Way With Gigabit LTE Modem Aiming For IPhone This reform paves the way for new fibre and 5G networks, and also expands the ... by the Commission for 2025: gigabit speeds for digital businesses and public… ... is expected to launch their 5G iPhone in 2020, with an Intel 8161 5G modem ... technologies to their devices, such as occurred with 3G or LTE enabled Apple .... Dec 15, 2014 — from LTE towards 5G and SDN,” chaired by Prof. Rui Aguiar from ... ated techniques pave a way for achieving intel- ligent services in PSSs by .... Jan 31, 2014 — On the supply side, the next big development is 5G, the new mobile ... publish two policy articles aimed at encouraging positive outcomes for the new NBN. ... paper '2020: Beyond 4G Radio Evolution for the Gigabit Experience' (NSN 2011). ... 'ITU paves way for next-generation 4G mobile technologies', .... Feb 24, 2021 — 1 modems are built for gigabit-speed connections, but they can also work ... 4G and 5G solution to meet specific network, market and geographic conditions worldwide. ... You only need a Modem not a Modem Router if the aim is just to have control over the DNS. ... The move paves the way for AVM's Fritz!. The latest ROG Strix Scar 17 forgoes Intel entirely for a liquid metal-cooled ... the Spectre x360 13 almost obsolete, paves the way for potential 3:2 EliteBooks ... 21.07.2020 Dell Latitude 9510 2-in-1 Review: A 5G 15-inch Convertible That Isn't Huge ... 28.09.2017 The iPhone 8 in North America may have faster LTE modems ...
    [Show full text]
  • The MOS Silicon Gate Technology and the First Microprocessors
    The MOS Silicon Gate Technology and the First Microprocessors Federico Faggin This is a preprint of the article published in La Rivista del Nuovo Cimento, Società Italiana di Fisica, Vol. 38, No. 12, 2015 1. – Introduction There are a few key technological inventions in human history that have come to characterize an era. For example, the animal-pulled plow was the invention that enabled efficient agriculture, thus gradually ending nomadic culture and creating a new social order that in time produced another seminal invention. This was the steam engine which gave rise to the industrial revolution and created the environment out of which the electronic computer emerged – the third seminal invention that started the information revolution that is now defining our time. All such inventions have deep roots and a long evolution. Engines powered by water or wind were used for many centuries before being replaced by steam engines. Steam engines were then replaced by internal combustion engines, and finally electric motors became prevalent; each generation of engines being more powerful, more efficient, more versatile, and more convenient than the preceding one. Similarly, the origin of our present computers dates back to the abacus, a computational tool that was used for several millennia before being replaced by mechanical calculators in the 19th century, by electronic computers in the 1950’s, and by microchips toward the end of the 20th century. The invention of the electronic computer was originally motivated by the need for a much faster computational tool than was possible with electromechanical calculators operated by human beings. This improvement was accomplished not only by performing the four elementary operations considerably faster than previously possible with calculators, but even more importantly, by adding the ability to program a long sequence of arithmetic operations that could be executed automatically, without human intervention.
    [Show full text]
  • GROWTH THROUGH TECHNOLOGY LEADERSHIP 36 1.6 100 33.7 1.51 Americas 50% 45% 28%
    2003 Annual Report intel.com intc.com GROWTH THROUGH TECHNOLOGY LEADERSHIP 36 1.6 100 33.7 1.51 Americas 50% 45% 28% 30.1 29.4 26.8 26.3 26.5 27 1.2 75 25.1 1.05 40% 0.97 20.8 0.86 0.85 20% 18 0.8 50 16.2 0.73 20% Asia- 14% Pacific 11.5 0.50 0.46 Europe 28% 28% 23% 9 0.4 25 0.33 0.19 9% Japan 8% 7% 0 0 0 94 95 96 97 98 99 00 01 02 03 94 95 96 97 98 99 00 01 02 03 93 98 03 NET REVENUE DILUTED EARNINGS PER SHARE† GEOGRAPHIC BREAKDOWN Dollars in billions Dollars, adjusted for stock splits OF REVENUE †Amortization of goodwill reduced earnings per share Percent in 2001 by $0.22 ($0.18 in 2000 and $0.05 in 1999). Goodwill is no longer amortized, beginning in 2002. “Our continuing commitment to investments in leading-edge technology and our dedication to product innovation have set the stage for the positive results we began to see by year’s end.” Craig R. Barrett Chief Executive Officer 38.4 40 8.0 5.0 Machinery and equipment 7.3 35.6 Land, buildings and 4.4 33.3 improvements 6.7 4.0 3.9 4.0 30.2 3.8 28.4 30 6.0 27.3 26.2 3.1 4.7 4.5 3.0 4.0 2.5 20 3.7 4.0 3.6 2.3 3.4 15.4 3.0 1.8 2.0 2.4 1.3 8.7 10 2.0 1.1 1.0 3.5 0 0 0 94 95 96 97 98 99 00 01 02 03 94 95 96 97 98 99 00 01 02 03 94 95 96 97 98 99 00 01 02 03 RETURN ON AVERAGE CAPITAL ADDITIONS TO PROPERTY, RESEARCH AND DEVELOPMENT† STOCKHOLDERS’ EQUITY PLANT AND EQUIPMENT Dollars in billions Percent Dollars in billions †Excluding purchased in-process research and development Past performance does not guarantee future results.
    [Show full text]