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Using the Intel® LXT973 Ethernet Transceiver Application Note
Intel® IXP42X Product Line and IXC1100 Control Plane Processor: Using the Intel® LXT973 Ethernet Transceiver Application Note July 2004 Document Number: 253429-002 Intel® IXP42X Product Line and IXC1100 Control Plane Processor: Using the Intel® LXT973 Ethernet Transceiver INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. EXCEPT AS PROVIDED IN INTEL'S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY RELATING TO SALE AND/OR USE OF INTEL PRODUCTS, INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT, OR OTHER INTELLECTUAL PROPERTY RIGHT. Intel Corporation may have patents or pending patent applications, trademarks, copyrights, or other intellectual property rights that relate to the presented subject matter. The furnishing of documents and other materials and information does not provide any license, express or implied, by estoppel or otherwise, to any such patents, trademarks, copyrights, or other intellectual property rights. Intel products are not intended for use in medical, life saving, life sustaining, critical control or safety systems, or in nuclear facility applications. Intel may make changes to specifications and product descriptions at any time, without notice. Designers must not rely on the absence or characteristics of any features or instructions marked "reserved" or "undefined." Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them. Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order. -
GPU Developments 2018
GPU Developments 2018 2018 GPU Developments 2018 © Copyright Jon Peddie Research 2019. All rights reserved. Reproduction in whole or in part is prohibited without written permission from Jon Peddie Research. This report is the property of Jon Peddie Research (JPR) and made available to a restricted number of clients only upon these terms and conditions. Agreement not to copy or disclose. This report and all future reports or other materials provided by JPR pursuant to this subscription (collectively, “Reports”) are protected by: (i) federal copyright, pursuant to the Copyright Act of 1976; and (ii) the nondisclosure provisions set forth immediately following. License, exclusive use, and agreement not to disclose. Reports are the trade secret property exclusively of JPR and are made available to a restricted number of clients, for their exclusive use and only upon the following terms and conditions. JPR grants site-wide license to read and utilize the information in the Reports, exclusively to the initial subscriber to the Reports, its subsidiaries, divisions, and employees (collectively, “Subscriber”). The Reports shall, at all times, be treated by Subscriber as proprietary and confidential documents, for internal use only. Subscriber agrees that it will not reproduce for or share any of the material in the Reports (“Material”) with any entity or individual other than Subscriber (“Shared Third Party”) (collectively, “Share” or “Sharing”), without the advance written permission of JPR. Subscriber shall be liable for any breach of this agreement and shall be subject to cancellation of its subscription to Reports. Without limiting this liability, Subscriber shall be liable for any damages suffered by JPR as a result of any Sharing of any Material, without advance written permission of JPR. -
Passmark Intel Vs AMD CPU Benchmarks - High End
PassMark Intel vs AMD CPU Benchmarks - High End http://www.cpubenchmark.net/high_end_cpus.html Shopping cart | Search Home Software Hardware Benchmarks Services Store Support Forums About Us Home » CPU Benchmarks » High End CPU's CPU Benchmarks Video Card Benchmarks Hard Drive Benchmarks RAM PC Systems Android iOS / iPhone CPU Benchmarks Over 600,000 CPUs Benchmarked High End CPU's - Intel vs AMD How does your CPU compare? This chart comparing high end CPU's is made using thousands of PerformanceTest benchmark Add your CPU to our benchmark results and is updated daily. These are the high end AMD and Intel CPUs are typically those chart with PerformanceTest V8 found in newer computers. The chart below compares the performance of Intel Xeon CPUs, Intel Core i7 CPUs, AMD Phenom II CPUs and AMD Opterons with multiple cores. Intel processors vs ---- Select A Page ---- AMD chips - find out which CPU's performance is best for your new gaming rig or server! CPU Mark | Price Performance (Click to select desired chart) PassMark - CPU Mark High End CPUs - Updated 26th of August 2013 Price (USD) Intel Xeon E5-2687W @ 3.10GHz 14,564 $1,929.99 Intel Xeon E5-2690 @ 2.90GHz 14,511 $1,920.99 Intel Xeon E5-2680 @ 2.70GHz 13,949 $1,725.99 Intel Xeon E5-2689 @ 2.60GHz 13,444 NA Intel Xeon E5-2670 @ 2.60GHz 13,312 $1,509.00 Intel Core i7-3970X @ 3.50GHz 12,873 $1,006.99 Intel Core i7-3960X @ 3.30GHz 12,749 $965.99 Intel Xeon E5-1660 @ 3.30GHz 12,457 $1,086.99 Intel Xeon E5-2665 @ 2.40GHz 12,453 $1,499.99 Intel Core i7-3930K @ 3.20GHz 12,086 $567.27 Intel Xeon -
Intel® Technology Journal
9/4/09 8:28:45 AM Intel® Technology Journal Technology Intel® SEPTEMBER 2009 in the Home Enabling Healthcare INTEL® TECHNOLOGY JOURNAL | ENABLING HEALTHCARE IN THE HOME VOL 13 | ISSUE 03 | SEPTEMBER 2009 35858 21143 77 ISBN 978-1-934053-23-2 9 781934 053232 $49.95 US Copyright © 2009 Intel Corporation. All rights reserved. Intel, and the Intel logo, are trademarks of Intel Corporation in the U.S. and other countries. Copyright © 2009 Intel Corporation. More information, including current and past issues of Intel Technology Journal, can be found at: at: Journal, can be found Technology Intel issues of and past including current information, More http://developer.intel.com/technology/itj/index.htm ITJ9-3_Cover_BFC_39spn_090409.indd 1 About the Cover Enabling Healthcare in the Home is the theme of the Intel Technology Journal, Volume 13, Issue 3. The physician in the foreground (1) is remotely performing a house call. The doctor is able to see the patient (2) and to obtain diagnostic information, such as blood pressure and pulse vitals. The patient is able to remain at home, which is helpful and efficient for those with ambulatory or transportation issues. Next door (3) is an elderly person who can safely live independently because the home is out- fitted with sensors (the yellow spots) that monitor motion. Family caregivers located elsewhere can be aware that this individual is performing routine tasks. Upstairs is (4) someone sleeping. Sensors measure nighttime activity, which can be an indicator of health risk. Also upstairs (5) is a child or an elderly person for whom reading is difficult. -
Components © 2017
PCDS.fi Components Mini-ITX SFF Gaming & HTPC Chassis 1/11 2017 AKASA Mini-ITX Compact Thin Cypher Black ALU 1x2.5” VESA 120W Power Adapter 99€ S ILVERSTONE Mini-ITX SFF Slim HTPC Milo ML0 5 Black Slot Loading 1x5.25” 4x2.5” Audio USB 69€ Milo ML0 6 ALU Black Slot Loading 1x5.25” 4x2.5” Audio USB 82€ NEW Milo ML0 9 Black Slim 1x5.25” 4x2.5” Audio USB 82€ NEW Milo ML0 6-E ALU Black Slot Loading 1x5.25” 4x2.5” Audio USB 115€ FRACTAL DESIGN Mini-ITX SFF Slim Gaming & VR NEW Node 202 Black 2x2.5” CC56mm Audio USB Filter 109€ NEW Node 20 2 Integra Black 2x2.5” CC56mm Audio USB Filter Integra 450 PSU 165€ PHANTEKS Mini-ITX SFF Tower NEW ENTHOO EVOLV SHIFT Black 2x3.5” 1x2.5” Audio USB 200mm Fan 135€ S ILVERSTONE Mini-ITX SFF Slim Gaming & VR Milo ML0 7 Black Slot Loading 1x5.25” 1x3.5” 3x2.5” Audio USB 82€ NEW Milo ML0 8 Black Slim 1x5.25” 1x3.5” 2x2.5” CC58mm Audio USB Filter 115€ R AVEN RVZ01 Black Slot Loading 1x5.25” 1x3.5” 3x2.5” Audio USB 2x120mm Fans 129€ NEW R AVEN RVZ01- E Black 3x2.5” CC83mm Audio USB 2x120mm Fans 129€ NEW RAVEN RVZ03 Black 4x2.5” CC83mm Audio USB 2x120mm Fans 135€ NEW R AVEN RVZ0 2 Black Slim 1x5.25” 1x3.5” 2x2.5” Audio USB 115€ NEW R AVEN RVZ0 2 Window Black Slim 1x5.25” 1x3.5” 2x2.5” Audio USB Filter 125€ NEW Fortress FTZ 01 Black / Silver Slot Loading 1x5.25” 1x3.5” 3x2.5” Audio USB 3x120mm Fans 155€ Mini-ITX SFF Cube Chassis 1/11 2017 COOLER MASTER Mini-ITX SFF Cube Elite 1 3 0 Black 1x5.25” 2x3.5” 3x2.5” Audio USB 80+120mm Fans 69€ Elite 1 2 0 Black 1x5.25” 3x3.5”/2.5” Audio USB 80+120mm Fans 71€ Elite 110 Black -
I Processori Amd Trinity
UNIVERSITA’ DEGLI STUDI DI PADOVA __________________________________________________ Facoltà di Ingegneria Corso di laurea in Ingegneria Informatica I PROCESSORI AMD TRINITY Laureando Relatore Luca Marzaro Prof. Sergio Congiu ___________________________________________________________ ANNO ACCADEMICO 2012/2013 ii iii A Giulia, mamma, papà e Diego iv Indice 1. Introduzione 1 1.1 Cenni storici AMD . 1 1.2 Evoluzione del processore: dall' Am386 alle APU Trinity . 2 2. Trinity: Architettura 5 2.1 Introduzione . 5 2.2 Da Llano a Trinity: architettura Piledriver . 6 2.3 Graphics Memory Controller: architettura VLIW4 . 8 2.4 Un nuovo socket: FM2 . 12 3. Specifiche tecniche 15 3.1 Modelli e dati tecnici . 15 3.2 Comparazione con Llano e Intel core i3 . 17 4. Prestazioni 19 4.1 Introduzione . 19 4.2 Applicazioni multimediali . 22 4.3 Calcolo e compressione . 25 4.4 Consumi . 30 5. Considerazioni finali 35 vi INDICE Bibliografia 37 Capitolo 1 Introduzione 1.1 Cenni storici AMD AMD (Advanced Micro Devices) è una multinazionale americana produttrice di semiconduttori la cui sede si trova a Sunnyvale in California. La peculiarità di tale azienda è la produzione di microprocessori, workstation e server, di chip grafici e di chipset. Si classifica seconda al mondo Figura 1.1: Jerry Sanders nella produzione di microprocessori con architettuta x86 dopo Intel. Il primo maggio 1969 Jerry Sanders (vedi Figura 1.1) e sette amici fondano la AMD. Sei anni più tardi, lanciano nel mercato la prima memoria RAM marchiata AMD, la Am9102 e presentano AMD 8080, una variante dell'INTEL 8080 che lancia l'azienda nel mondo dei microprocessori. Dal 1980 AMD si impone come uno dei principali concorrenti di Intel nel mercato dei processori x86- compatibili. -
Sensors and Data Encryption, Two Aspects of Electronics That Used to Be Two Worlds Apart and That Are Now Often Tightly Integrated, One Relying on the Other
www.eenewseurope.com January 2019 electronics europe News News e-skin beats human touch Swedish startup beats e-Ink on low-power Special Focus: Power Sources european business press November 2011 Electronic Engineering Times Europe1 181231_8-3_Mill_EENE_EU_Snipe.indd 1 12/14/18 3:59 PM 181231_QualR_EENE_EU.indd 1 12/14/18 3:53 PM CONTENTS JANUARY 2019 Dear readers, www.eenewseurope.com January 2019 The Consumer Electronics Show has just closed its doors in Las Vegas, yet the show has opened the mind of many designers, some returning home with new electronics europe News News ideas and possibly new companies to be founded. All the electronic devices unveiled at CES share in common the need for a cheap power source and a lot of research goes into making power sources more sus- tainable. While lithium-ion batteries are commercially mature, their long-term viability is often questioned and new battery chemistries are being investigated for their simpler material sourcing, lower cost and sometime increased energy density. Energy harvesting is another feature that is more and more often inte- e-skin beats human touch grated into wearables but also at grid-level. Our Power Sources feature will give you a market insight and reviews some of the latest findings. Other topics covered in our January edition are Sensors and Data Encryption, two aspects of electronics that used to be two worlds apart and that are now often tightly integrated, one relying on the other. Swedish startup beats e-Ink on low-power With this first edition of 2019, let me wish you all an excellent year and plenty Special Focus: Power Sources of new business opportunities, whether you are designing the future for a european business press startup or working for a well-established company. -
Hardware-Assisted Rootkits: Abusing Performance Counters on the ARM and X86 Architectures
Hardware-Assisted Rootkits: Abusing Performance Counters on the ARM and x86 Architectures Matt Spisak Endgame, Inc. [email protected] Abstract the OS. With KPP in place, attackers are often forced to move malicious code to less privileged user-mode, to ele- In this paper, a novel hardware-assisted rootkit is intro- vate privileges enabling a hypervisor or TrustZone based duced, which leverages the performance monitoring unit rootkit, or to become more creative in their approach to (PMU) of a CPU. By configuring hardware performance achieving a kernel mode rootkit. counters to count specific architectural events, this re- Early advances in rootkit design focused on low-level search effort proves it is possible to transparently trap hooks to system calls and interrupts within the kernel. system calls and other interrupts driven entirely by the With the introduction of hardware virtualization exten- PMU. This offers an attacker the opportunity to redirect sions, hypervisor based rootkits became a popular area control flow to malicious code without requiring modifi- of study allowing malicious code to run underneath a cations to a kernel image. guest operating system [4, 5]. Another class of OS ag- The approach is demonstrated as a kernel-mode nostic rootkits also emerged that run in System Manage- rootkit on both the ARM and Intel x86-64 architectures ment Mode (SMM) on x86 [6] or within ARM Trust- that is capable of intercepting system calls while evad- Zone [7]. The latter two categories, which leverage vir- ing current kernel patch protection implementations such tualization extensions, SMM on x86, and security exten- as PatchGuard. -
Arxiv:1910.06663V1 [Cs.PF] 15 Oct 2019
AI Benchmark: All About Deep Learning on Smartphones in 2019 Andrey Ignatov Radu Timofte Andrei Kulik ETH Zurich ETH Zurich Google Research [email protected] [email protected] [email protected] Seungsoo Yang Ke Wang Felix Baum Max Wu Samsung, Inc. Huawei, Inc. Qualcomm, Inc. MediaTek, Inc. [email protected] [email protected] [email protected] [email protected] Lirong Xu Luc Van Gool∗ Unisoc, Inc. ETH Zurich [email protected] [email protected] Abstract compact models as they were running at best on devices with a single-core 600 MHz Arm CPU and 8-128 MB of The performance of mobile AI accelerators has been evolv- RAM. The situation changed after 2010, when mobile de- ing rapidly in the past two years, nearly doubling with each vices started to get multi-core processors, as well as power- new generation of SoCs. The current 4th generation of mo- ful GPUs, DSPs and NPUs, well suitable for machine and bile NPUs is already approaching the results of CUDA- deep learning tasks. At the same time, there was a fast de- compatible Nvidia graphics cards presented not long ago, velopment of the deep learning field, with numerous novel which together with the increased capabilities of mobile approaches and models that were achieving a fundamentally deep learning frameworks makes it possible to run com- new level of performance for many practical tasks, such as plex and deep AI models on mobile devices. In this pa- image classification, photo and speech processing, neural per, we evaluate the performance and compare the results of language understanding, etc. -
Tech Heaven: Intel Technology Innovation on Display
Intel Corporation 2200 Mission College Blvd. P.O. Box 58119 Santa Clara, CA 95052-8119 Showcase Overview Tech Heaven: Intel Technology Innovation On Display This interactive showcase highlights technology innovations that are in some stage of active research or development and have the potential to change how we live, work and play in the following areas: home, hands-free technology, fashion/shopping, communication/social media, health and transportation. We see a world where personal computing is expanding beyond the PC to nearly every kind of electronic device. We see “smart” computers themselves vanishing into the background – a network of billions of connected people and trillions of “smart” connected electronic products, many connecting without human intervention. Intel is investing some of its annual USD$6 billion in research in order to make this vision a reality. Moore’s Law is enabling Intel to pack more and more technology and innovation into ever shrinking chips. As we are multiplying the number of “brains” or cores inside the chip and computer, our computing experiences continues to get faster, stronger, smarter, more personalized and with unprecedented vividness. And with the unfettered Internet connectivity in the home, car and everywhere in between, this new computing experience follows us wherever we go. Intel has been at the forefront of the computer industry’s rapid pace of change. Things that were unimaginable just a decade or two ago are now considered common place. The pace of technological innovation is accelerating, and the number of inventions in the next 40 years will equal or surpass all of the inventive activity that has taken place in history. -
Gables: a Roofline Model for Mobile Socs
2019 IEEE International Symposium on High Performance Computer Architecture (HPCA) Gables: A Roofline Model for Mobile SoCs Mark D. Hill∗ Vijay Janapa Reddi∗ Computer Sciences Department School Of Engineering And Applied Sciences University of Wisconsin—Madison Harvard University [email protected] [email protected] Abstract—Over a billion mobile consumer system-on-chip systems with multiple cores, GPUs, and many accelerators— (SoC) chipsets ship each year. Of these, the mobile consumer often called intellectual property (IP) blocks, driven by the market undoubtedly involving smartphones has a significant need for performance. These cores and IPs interact via rich market share. Most modern smartphones comprise of advanced interconnection networks, caches, coherence, 64-bit address SoC architectures that are made up of multiple cores, GPS, and many different programmable and fixed-function accelerators spaces, virtual memory, and virtualization. Therefore, con- connected via a complex hierarchy of interconnects with the goal sumer SoCs deserve the architecture community’s attention. of running a dozen or more critical software usecases under strict Consumer SoCs have long thrived on tight integration and power, thermal and energy constraints. The steadily growing extreme heterogeneity, driven by the need for high perfor- complexity of a modern SoC challenges hardware computer mance in severely constrained battery and thermal power architects on how best to do early stage ideation. Late SoC design typically relies on detailed full-system simulation once envelopes, and all-day battery life. A typical mobile SoC in- the hardware is specified and accelerator software is written cludes a camera image signal processor (ISP) for high-frame- or ported. -
VIV:Vivo-X60-5G-Phone Datasheet Overview
VIV:vivo-X60-5G-Phone Datasheet Get a Quote Overview Note: Shipment will start on January 10. Vivo X60 5G, samsung Exynos 1080 flagship chip, zeiss optical lens, micro-head black light night market 2.0 Compare to Similar Items Table 2 shows the comparison. Product Code Vivo X50 5G Phone Vivo X60 5G Phone Front Camera 32 MP 8 MP Battery 4200 mAh 4500 mAh Processor Qualcomm Snapdragon 765G Exynos 880 Display 6.56 inches 6.53 inches Ram 8 GB 6 GB Rear Camera 48 MP + 13 MP + 8 MP + 5 MP 48 MP + 2 MP + 2 MP Fingerprint Sensor Position On-screen Side Fingerprint Sensor Type Optical \ Other Sensors Light sensor, Proximity sensor, Accelerometer, Acceleration, Proximity, Compass Compass, Gyroscope Fingerprint Sensor Yes Yes Quick Charging Yes \ Operating System Android v10 (Q) \ Sim Slots Dual SIM, GSM+GSM Dual SIM, GSM+GSM Custom Ui Funtouch OS \ Brand Vivo Vivo Sim Size SIM1: Nano SIM2: Nano SIM1: Nano, SIM2: Nano Network 5G: Supported by device (network not rolled- 5G: Supported by device (network not rolled- out in India), 4G: Available (supports Indian out in India), 4G: Available (supports Indian bands), 3G: Available, 2G: Available bands),, 3G: Available, 2G: Available Fingerprint Sensor Yes Yes Audio Jack USB Type-C 3.5 MM Loudspeaker Yes Yes Chipset Qualcomm Snapdragon 765G Exynos 880 Graphics Adreno 620 Mali-G76 Processor Octa core (2.4 GHz, Single core, Kryo 475 + Exynos 880 2.2 GHz, Single core, Kryo 475 + 1.8 GHz, Hexa Core, Kryo 475) Architecture 64 bit 64 bit Ram 8 GB 6 GB Width 75.3 mm 76.6 mm Weight 173 grams 190 grams Build Material