Fact Sheet: Intel Introduces New Mobile Platforms and Products
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Wind River Vxworks Platforms 3.8
Wind River VxWorks Platforms 3.8 The market for secure, intelligent, Table of Contents Build System ................................ 24 connected devices is constantly expand- Command-Line Project Platforms Available in ing. Embedded devices are becoming and Build System .......................... 24 VxWorks Edition .................................2 more complex to meet market demands. Workbench Debugger .................. 24 New in VxWorks Platforms 3.8 ............2 Internet connectivity allows new levels of VxWorks Simulator ....................... 24 remote management but also calls for VxWorks Platforms Features ...............3 Workbench VxWorks Source increased levels of security. VxWorks Real-Time Operating Build Configuration ...................... 25 System ...........................................3 More powerful processors are being VxWorks 6.x Kernel Compatibility .............................3 considered to drive intelligence and Configurator ................................. 25 higher functionality into devices. Because State-of-the-Art Memory Host Shell ..................................... 25 Protection ..................................3 real-time and performance requirements Kernel Shell .................................. 25 are nonnegotiable, manufacturers are VxBus Framework ......................4 Run-Time Analysis Tools ............... 26 cautious about incorporating new Core Dump File Generation technologies into proven systems. To and Analysis ...............................4 System Viewer ........................ -
Using the Intel® LXT973 Ethernet Transceiver Application Note
Intel® IXP42X Product Line and IXC1100 Control Plane Processor: Using the Intel® LXT973 Ethernet Transceiver Application Note July 2004 Document Number: 253429-002 Intel® IXP42X Product Line and IXC1100 Control Plane Processor: Using the Intel® LXT973 Ethernet Transceiver INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. EXCEPT AS PROVIDED IN INTEL'S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY RELATING TO SALE AND/OR USE OF INTEL PRODUCTS, INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT, OR OTHER INTELLECTUAL PROPERTY RIGHT. Intel Corporation may have patents or pending patent applications, trademarks, copyrights, or other intellectual property rights that relate to the presented subject matter. The furnishing of documents and other materials and information does not provide any license, express or implied, by estoppel or otherwise, to any such patents, trademarks, copyrights, or other intellectual property rights. Intel products are not intended for use in medical, life saving, life sustaining, critical control or safety systems, or in nuclear facility applications. Intel may make changes to specifications and product descriptions at any time, without notice. Designers must not rely on the absence or characteristics of any features or instructions marked "reserved" or "undefined." Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them. Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order. -
Intel® Atom™ Processor E6x5c Series-Based Platform for Embedded Computing
PlAtfOrm brief Intel® Atom™ Processor E6x5C Series Embedded Computing Intel® Atom™ Processor E6x5C Series-Based Platform for Embedded Computing Platform Overview Available with industrial and commercial The Intel® Atom™ processor E6x5C series temperature ranges, this processor series delivers, in a single package, the benefits of provides embedded lifecycle support and the Intel® Atom™ processor E6xx combined is supported by the broad Intel® archi- with a Field-Programmable Gate Array tecture ecosystem as well as standard (FPGA) from Altera. This series offers Altera development tools. Additionally, a exceptional flexibility to incorporate a compatible, dedicated Power Management wide range of standard and user-defined Integrated Circuit (PMIC) solution may be I/O interfaces, high-speed connectivity, obtained from leading PMIC suppliers to memory interfaces, and process accelera- help minimize platform part count and tion to meet the requirements of a variety reduce bill of material costs and design of embedded applications in industrial, medi- complexity. Options include separate PMIC cal, communication, vision systems, voice and clock generator chips (available from over Internet protocol (VoIP), military, high- ROHM Co., Ltd.) or a single-chip solution performance programmable logic control- that integrates the voltage regulator and lers (PLCs) and embedded computers. clock generator (available from Dialog Semiconductor). The Intel Atom processor E6x5C series is a multi-chip, single-package device that Product Highlights reduces board footprint, lowers compo- • Single-package: A compact 37.5 x nent count, and simplifies inventory 37.5 mm, 0.8 mm ball pitch, multi-chip control and manufacturing. This compact device internally connects the Intel Atom design offers single-vendor support while processor E6xx with a user-programma- providing Intel Atom processors for ble FPGA. -
Intel Atom® Processor C2000 Product Family for Microservers
Intel® Atom™ Processor C2000 Product Family for Microservers PRODUCT BRIEF Maximize Efficiency for Your Lightweight Scale-Out Workloads Extreme Density and Energy-Efficiency for Low-End, Scale-Out Workloads With a need to rapidly deliver new services, cope with massive data growth, and contain costs, cloud service providers and hosters seek increasingly efficient ways to handle the demands on their infrastructure. Today’s servers based on Intel® Xeon® processors provide leadership performance and performance per watt with the flexibility to handle a wide range of workloads and peak demands. 2nd generation 64-bit However, certain lightweight, scale-out workloads—such as basic dedicated hosting, low-end static Intel® Atom™ Processor web serving, and simple content delivery can sometimes be hosted more efficiently on larger C2000 Product Family numbers of smaller servers built for extreme power efficiency. for microservers To address this need, Intel worked with a broad giving you the flexibility to right-size your infra- • Up to 7x higher7 perfor- ecosystem of leading server manufacturers to structure without limiting software mobility and mance, up to 6x better8 develop and deliver a variety of extreme low-power interoperability as your applications evolve. systems to support an emerging server category— performance/watt Optimized Platform Support microservers. With up to a 1,000 nodes1 per Intel provides complete microserver platform 9 rack and shared power, cooling, and networking • 6-20 watt TDP solutions that simplify implementation, improve resources, microservers can help you improve data overall efficiency and enable higher node density. • Up to 1000+ server center efficiency by right-sizing infrastructure for New innovations include: 10 relatively light processing requirements. -
Debuggers, Programmers and Erasers Products May Be Rohs Compliant
Debuggers, Programmers and Erasers Products may be RoHS compliant. Check mouser.com for RoHS status. USB2Wiggler Features: DEVELOPMENT PROGRAMMERS • Universal Serial Bus interface for JTAG and BDM debugging TopMaxII Programmer • Faster than the classic parallel port Wiggler • Fully compatible with all Macraigor Systems software Features: • Operates up to Hi-Speed USB rates (480Mb/s) • High speed device programmer and TTL/LOGIC/DRAM tester • One side interfaces to USB port of host IBM compatible PC, other • PC driven: USB 2.0 interface side connects to OCD (On-Chip Debug) port of target system • Device libraries > 18000 • Port may be JTAG, E-JTAG, OnCE, COP, BDM, or any of several • Standard 48-pin DIL ZIF socket other types of connections • Supported devices: EPROM, EEPROM, FLASH (NOR/NAND) Programmers memory, PLD, FPGA, Serial PROM, Parallel PROM, CMOS USB2Demon Features: PROM, PIC and microcontrollers • Interfaces to USB 1.1 or USB 2.0 port of host PC on one side, other • B/P/V takes 65 sec. for 64Mbit flash memory • External start key for auto programming mode side connects to OCD (On-Chip Debug) port on target system • All socket adapters are available in stock (USA): PLCC, SOP, • Win 95/98/NT/2000/XP/Vista/Windows 7 • Simultaneously debugs up to 255 devices on a single scan chain SOIC, QFP, TSOP, SON, BGA, TSSOP, and TSOPII • Approved by CE • Supports configurable JTAG/BDM clock rates up to 20MHz • Supported low-voltages: 1.8/2.0/2.7/3.0/3.3/5.0 volt • Made in USA • Compatible with Windows and Linux hosts • Built-in AC (110-240) power supply • Free software update for lifetime • Supported versions of Linux: Red Hat 7.2-9 and Fedora Core 2 For quantities greater than listed, call for quote. -
Intel® Technology Journal
9/4/09 8:28:45 AM Intel® Technology Journal Technology Intel® SEPTEMBER 2009 in the Home Enabling Healthcare INTEL® TECHNOLOGY JOURNAL | ENABLING HEALTHCARE IN THE HOME VOL 13 | ISSUE 03 | SEPTEMBER 2009 35858 21143 77 ISBN 978-1-934053-23-2 9 781934 053232 $49.95 US Copyright © 2009 Intel Corporation. All rights reserved. Intel, and the Intel logo, are trademarks of Intel Corporation in the U.S. and other countries. Copyright © 2009 Intel Corporation. More information, including current and past issues of Intel Technology Journal, can be found at: at: Journal, can be found Technology Intel issues of and past including current information, More http://developer.intel.com/technology/itj/index.htm ITJ9-3_Cover_BFC_39spn_090409.indd 1 About the Cover Enabling Healthcare in the Home is the theme of the Intel Technology Journal, Volume 13, Issue 3. The physician in the foreground (1) is remotely performing a house call. The doctor is able to see the patient (2) and to obtain diagnostic information, such as blood pressure and pulse vitals. The patient is able to remain at home, which is helpful and efficient for those with ambulatory or transportation issues. Next door (3) is an elderly person who can safely live independently because the home is out- fitted with sensors (the yellow spots) that monitor motion. Family caregivers located elsewhere can be aware that this individual is performing routine tasks. Upstairs is (4) someone sleeping. Sensors measure nighttime activity, which can be an indicator of health risk. Also upstairs (5) is a child or an elderly person for whom reading is difficult. -
Usersguide Ghana-EB-1985WU.Pdf
User's Guide Contents 2 Notations Used in This Guide Connecting to a USB Device or Camera.............................28 Disconnecting a USB Device or Camera.............................28 Connecting to a Document Camera.................................28 Connecting to External Output Devices..............................28 Introduction to Your Projector Connecting to an External Computer Monitor........................29 Connecting to External Speakers.................................29 Projector Features.......................................... 9 Installing Batteries in the Remote Control................... 31 Quick and Easy Setup............................................9 Flexible Connectivity............................................9 Remote Control Operation.......................................31 Connect with Computer.......................................10 Opening the Lens Cover . ............................. 33 Connect with Mobile Devices...................................11 Projector Parts and Functions ............................... 12 Projector Parts - Front..........................................12 Using Basic Projector Features Projector Parts - Rear...........................................13 Projector Parts - Base...........................................14 Turning On the Projector ................................... 35 Projector Parts - Control Panel.....................................15 Turning Off the Projector ................................... 37 Projector Parts - Remote Control...................................16 -
Intel Atom® Processor C3000 Series for Embedded and Iot Applications: Product Brief
Product brief Internet of Things Intel Atom® Processor C3000 Series Expanding Intelligence and Flexibility at the Edge Scalable, dense-compute SoC for demanding IoT workloads From the factory foor to the energy grid, airplanes to supply chains, the sensors, controls, gateways, and other connected devices of Internet of Things (IoT) are driving the next industrial revolution. As IoT continues its explosive growth, the need for intelligent devices for more specialized applications is also growing exponentially. Industrial, energy, aerospace, robotics, public sector, and other customers with demanding IoT workloads want new ways to easily extract value from their data, reduce their time to market, and innovate connected technologies quickly and efciently. Moreover, they increasingly require reliable IoT solutions that bring maximum performance and greater capabilities to an ever-expanding array of challenging locations and operating conditions. The Intel Atom® processor C3000 series extends low-power Intel® architecture into new segments and accelerates IoT innovation across a wide range of demanding environments and use cases. With high performance per watt, low thermal design power (TDP) of 9.5W, and up to 20 confgurable high-speed input/output (HSIO) lanes, and pin-to-pin compatibility, this new system-on-a-chip (SoC) family delivers next-generation, multicore performance and scalability for a broad variety of low-power, high-density, and fanless designs. Multicore scalability With the Intel Atom processor C3000 series, customers are able to scale performance and achieve workload consolidation in situations and use cases that uP to require very low power, high density, and high I/O integration. Designed in an FCBGA 34mm x 28mm compact form factor, this SoC-based CPU is manufactured on Intel’s optimized 14nm process technology, available from 2 to 12 cores from 2.3X 1.6 to 2.0 GHz, and includes up to 256 GB DDR4 2133 MHz ECC (SODIMM, UDIMM, better PerforMANce or RDIMM) of addressable memory. -
Designed to Engage Students and Empower Educators
PRODUCT BRIEF Intel® classmate PC – Convertible Intel® Celeron® Processors 847/NM70 (dual-core) Part of Intel® Education Solutions Designed to Engage Students and Empower Educators Designed to make learning more fun, creative, and engaging, the Intel® classmate PC – convertible brings together the best of Windows* 8 touch and keyboard experiences, the amazing performance of Intel® Celeron® processors, and Intel® Education Software. The new Intel classmate PC – convertible keeps students excited about learning. With the flip of the display, it quickly transforms from a full-featured PC to convenient tablet—with pen— making it easy to adapt the device to the teaching method and learning task at hand. Whether gathering field data with the HD camera and notating it with the pen, or analyzing, interpreting, and reporting results using collaborative Intel Education Software, the convertible classmate “The Intel classmate PC – convertible PC is designed for education and engineered for students to develop the 21st century skills needed to succeed in today’s global economy. creates an ecosystem of digital learning which encompasses 1:1 Highlights: technologies, independent learning, • Two devices in one: tablet and full-feature PC digital creativity, device management, • Supports both Windows 8 desktop and touch modes and learning beyond school. It is truly • Together with Intel Education Software, the convertible classmate PC is part of Intel Education Solutions versatile, easily catering for the • High Definition LCD display produces vivid -
Intel Atom® P5900 Processors for 5G Network Edge Acceleration
PRODUCT BRIEF | Intel Atom® P5900 Processors ADVANCED PERFORMANCE FOR 5G WIRELESS BASE STATIONS As the radio access network (RAN) infrastructure of wireless carriers evolves to meet the intense demands of 5G, additional compute is required at the edge of the network. Careful consideration is critical across the board—from overarching design down to the selection of key components in base transceiver station equipment—for 5G networks to reliably meet the demands of next-generation service opportunities with lower latencies, higher bandwidth, and increased network capacity. RAN INFRASTRUCTURE EVOLUTION Intel has never had a stronger or more comprehensive portfolio of solutions to enable the RAN. From Intel® Xeon® Scalable processors to Intel Atom® processors, FPGAs, ASICS, and more, Intel continues to deliver cutting-edge hardware for 5G infrastructure. Even so, it’s our significant investments in software that enable service providers to make the most of our hardware, from drivers and operating systems up through entire production-quality software stacks. This interconnected platform of hardware and software allows service providers to get to market quickly while still offering the flexibility needed to address various deployment scenarios. Furthermore, with the increasing adoption of innovations found in cloud deployments, service providers are realizing the benefits of extending a platform combining common cloud software with Intel® architecture-based hardware from the core to the edge. A common software ecosystem for platform virtualization and customer applications—using a common Intel instruction set architecture across the infrastructure—enables faster deployment of new software and features while also making new service offerings and revenue models possible. PRODUCT BRIEF | Intel Atom® P5900 Processors AN EXCITING NEW CLASS OF EDGE PROCESSORS Intel Atom P5900 processors are the first of an all-new class of high-throughput, low-latency Intel Atom P processors for high-density network edge and security solutions. -
Widi" to WIRELESSLY CONNECT YOUR COMPUTER to a TV OR a MONITOR
USING "WiDi" TO WIRELESSLY CONNECT YOUR COMPUTER TO A TV OR A MONITOR 1 Web location for this presentation: http://aztcs.org Click on “Meeting Notes” 2 SUMMARY "WiDi" is a robust technology that can wirelessly connect your "Windows.." computer to a TV or a monitor. "WiDi" is also known as "Intel Wireless Display". 3 TOPICS • "WiDi" Fundamentals • Using "WiDi" • Obtaining a Computer That Supports "WiDi" • Installing a "WiDi" Receiver For a TV or a Monitor 4 "WiDi" FUNDAMENTALS • "WiDi" stands for "Intel Wireless Display" • You can use "WiDi" to wirelessly connect a "Windows.." computer directly to a monitor or a TV set. This wirelessly-connected monitor or TV becomes an additional monitor for your computer. 5 "WiDi" FUNDAMENTALS (continued) • At the computer end, video and sound is transmitted by a WiDi- capable WiFi wireless networking adapter • At the TV or monitor end, either you need to add a "WiDi Receiver" or your "smart tv" may already have one in it 6 "WiDi" FUNDAMENTALS (continued) • If your Intel "Windows.." computer only has one monitor attached to it, "WiDi" cannot be used to connect this single monitor to your computer. 7 "WiDi" FUNDAMENTALS (continued) • At the computer end, you usually have to buy the computer with "WiDi" already designed into the computer: At the computer end, you usually cannot add in "WiDi" capability if this capability was not part of the computer when you purchased it. 8 "WiDi" FUNDAMENTALS (continued) • Warning: "WiDi" and other wireless technologies all have too much latency and unpredictability for -
Publisher Managing Editor Content Architect Cory Cox Stuart Douglas Biljana Badic
Intel® Technology Journal | Volume 18, Issue 3, 2014 Publisher Managing Editor Content Architect Cory Cox Stuart Douglas Biljana Badic Program Manager Technical Editor Technical Illustrators Stuart Douglas David Clark MPS Limited Technical and Strategic Reviewers Valerio Frascolla Biljana Badic Erfan Majed Jan-Erik Mueller Shilpa Talwar Trevor Wieman Luis Castedo Ribas Kenneth Stewart Dauna Schaus John Aengus Markus Brunnbauer Steve Duffy Marcos Katz Pablo Puente Intel® Technology Journal | 1 Intel® Technology Journal | Volume 18, Issue 3, 2014 Intel Technology Journal Copyright © 2014 Intel Corporation. All rights reserved. ISBN 978-1-934053-64-5, ISSN 1535-864X Intel Technology Journal Volume 18, Issue 3 No part of this publication may be reproduced, stored in a retrieval system or transmitted in any form or by any means, electronic, mechanical, photocopying, recording, scanning or otherwise, except as permitted under Sections 107 or 108 of the 1976 United States Copyright Act, without either the prior written permission of the Publisher, or authorization through payment of the appropriate per-copy fee to the Copyright Clearance Center, 222 Rosewood Drive, Danvers, MA 01923, (978) 750-8400, fax (978) 750-4744. Requests to the Publisher for permission should be addressed to the Publisher, Intel Press, Intel Corporation, 2111 NE 25th Avenue, JF3-330, Hillsboro, OR 97124-5961. E-Mail: [email protected]. This publication is designed to provide accurate and authoritative information in regard to the subject matter covered. It is sold with the understanding that the publisher is not engaged in professional services. If professional advice or other expert assistance is required, the services of a competent professional person should be sought.