Publisher Managing Editor Content Architect Cory Cox Stuart Douglas Biljana Badic

Intel® Technology Journal | Volume 18, Issue 3, 2014 Publisher Managing Editor Content Architect Cory Cox Stuart Douglas Biljana Badic Program Manager Technical Editor Technical Illustrators Stuart Douglas David Clark MPS Limited Technical and Strategic Reviewers Valerio Frascolla Biljana Badic Erfan Majed Jan-Erik Mueller Shilpa Talwar Trevor Wieman Luis Castedo Ribas Kenneth Stewart Dauna Schaus John Aengus Markus Brunnbauer Steve Duffy Marcos Katz Pablo Puente Intel® Technology Journal | 1 Intel® Technology Journal | Volume 18, Issue 3, 2014 Intel Technology Journal Copyright © 2014 Intel Corporation. All rights reserved. ISBN 978-1-934053-64-5, ISSN 1535-864X Intel Technology Journal Volume 18, Issue 3 No part of this publication may be reproduced, stored in a retrieval system or transmitted in any form or by any means, electronic, mechanical, photocopying, recording, scanning or otherwise, except as permitted under Sections 107 or 108 of the 1976 United States Copyright Act, without either the prior written permission of the Publisher, or authorization through payment of the appropriate per-copy fee to the Copyright Clearance Center, 222 Rosewood Drive, Danvers, MA 01923, (978) 750-8400, fax (978) 750-4744. Requests to the Publisher for permission should be addressed to the Publisher, Intel Press, Intel Corporation, 2111 NE 25th Avenue, JF3-330, Hillsboro, OR 97124-5961. E-Mail: [email protected]. This publication is designed to provide accurate and authoritative information in regard to the subject matter covered. It is sold with the understanding that the publisher is not engaged in professional services. If professional advice or other expert assistance is required, the services of a competent professional person should be sought. Intel Corporation may have patents or pending patent applications, trademarks, copyrights, or other intellectual property rights that relate to the presented subject matter. The furnishing of documents and other materials and information does not provide any license, express or implied, by estoppel or otherwise, to any such patents, trademarks, copyrights, or other intellectual property rights. Intel may make changes to specifications, product descriptions, and plans at any time, without notice. Fictitious names of companies, products, people, characters, and/or data mentioned herein are not intended to represent any real individual, company, product, or event. Intel products are not intended for use in medical, life saving, life sustaining, critical control or safety systems, or in nuclear facility applications. Intel, the Intel logo, Intel Atom, Intel AVX, Intel Battery Life Analyzer, Intel Compiler, Intel Core i3, Intel Core i5, Intel Core i7, Intel DPST, Intel Energy Checker, Intel Mobile Platform SDK, Intel Intelligent Power Node Manager, Intel QuickPath Interconnect, Intel Rapid Memory Power Management (Intel RMPM), Intel VTune Amplifier, and Intel Xeon are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the United States and other countries. Software and workloads used in performance tests may have been optimized for performance only on Intel microprocessors. Performance tests, such as SYSmark and MobileMark, are measured using specific computer systems, components, software, operations and functions. Any change to any of those factors may cause the results to vary. You should consult other information and performance tests to assist you in fully evaluating your contemplated purchases, including the performance of that product when combined with other products. For more complete information about performance and benchmark results, visit www.intel.com/benchmarks †Other names and brands may be claimed as the property of others. This book is printed on acid-free paper. ∞ Publisher: Cory Cox Managing Editor: Stuart Douglas Library of Congress Cataloging in Publication Data: Printed in China 10 9 8 7 6 5 4 3 2 1 First printing: May 2014 2 | Intel® Technology Journal Intel® Technology Journal | Volume 18, Issue 3, 2014 Notices and Disclaimers ALL INFORMATION PROVIDED WITHIN OR OTHERWISE ASSOCIATED WITH THIS PUBLICATION INCLUDING, INTER ALIA, ALL SOFTWARE CODE, IS PROVIDED “AS IS”, AND FOR EDUCATIONAL PURPOSES ONLY. INTEL RETAINS ALL OWNERSHIP INTEREST IN ANY INTELLECTUAL PROPERTY RIGHTS ASSOCIATED WITH THIS INFORMATION AND NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHT IS GRANTED BY THIS PUBLICATION OR AS A RESULT OF YOUR PURCHASE THEREOF. INTEL ASSUMES NO LIABILITY WHATSOEVER AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY RELATING TO THIS INFORMATION INCLUDING, BY WAY OF EXAMPLE AND NOT LIMITATION, LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR THE INFRINGEMENT OF ANY INTELLECTUAL PROPERTY RIGHT ANYWHERE IN THE WORLD. Software and workloads used in performance tests may have been optimized for performance only on Intel microprocessors. Performance tests, such as SYSmark and MobileMark, are measured using specific computer systems, components, software, operations and functions. Any change to any of those factors may cause the results to vary. You should consult other information and performance tests to assist you in fully evaluating your contemplated purchases, including the performance of that product when combined with other products. For more information go to http://www.intel.com/performance Intel’s compilers may or may not optimize to the same degree for non-Intel microprocessors for optimizations that are not unique to Intel microprocessors. These optimizations include SSE2, SSE3, and SSE3 instruction sets and other optimizations. Intel does not guarantee the availability, functionality, or effectiveness of any optimization on microprocessors not manufactured by Intel. Microprocessor-dependent optimizations in this product are intended for use with Intel microprocessors. Certain optimizations not specific to Intel microarchitecture are reserved for Intel microprocessors. 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The information here is subject to change without notice. Do not finalize a design with this information. The products described in this document may contain design defects or errors known as errata, which may cause the product to deviate from published specifications. Current characterized errata are available on request. Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order. Copies of documents which have an order number and are referenced in this document, or other Intel literature, may be obtained by calling 1-800-548-4725, or go to: http://www.intel.com/design/literature.htm Intel® Technology Journal | 3 Intel® Technology Journal | Volume 18, Issue 3, 2014 4 | Intel® Technology Journal Intel® Technology Journal | Volume 18, Issue 3, 2014 4G WIRELESS COMMUNicatiONS: REAL WORLD ASPECTS AND TOOLS Articles Foreword ................................................................................................................................................................ 7 Antenna and RF Subsystem Integration in Cellular Communications .................................................................. 10 Spectrum Sharing as a Means Towards Meeting Future Wireless Mobile Broadband Capacity Demands ............................................................................................................................................... 26 Virtual Prototyping Methodology for Mobile Platforms .......................................................................................... 38 The Vienna MIMO Testbed: Evaluation of Future

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