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EMBEDDED PCS GPS MODULES COMPACT FLASH SUMIT PANEL PCS I/O MODULES ENCLOSURES SBCS On the cover Our annual Resource Guide showcases profiles of the latest industry-leading embedded computing products. Featured products: s 3YNOPSYS 6IRTUALIZER ENABLES COMPANIES TO ACCELERATE BOTH www.embedded-computing.com the development and deployment of virtual prototypes. s !VNET 0ERFORMANCE -ATCHED +ITS TAKE THE GUESSWORK OUT Õ}ÕÃÌÊÓ䣣ÊÊNÊÊ6ÕiÊÊUÊ ÕLiÀÊx of hardware compatibility, pairing SBCs with LCD screens.
7 Tracking Trends in 102 -community Beat Embedded Technology Keeping the embedded conversation going Building universal connectivity By Jennifer Hesse By Warren Webb
Silicon Software Strategies
20 26 34 Understanding embedded 8 Model-Based Design 24 Wireless in telehealth: 30 design, all in good time optimizes system behavior Critical considerations for Q&A with Elie Ayache, Silicon Labs Q&A with Ken Karnofsky, MathWorks technology adoption Q&A with Mark D. Benson, Logic PD Smart energy apps making 14 Embedded virtualization 26 the move to ZigBee enables scalability of real-time Fostering an ecosystem 32 Q&A with Øyvind Strøm, PhD, Atmel Corporation applications on multicore of support By Kim Hartman, TenAsys Corporation Q&A with Chuck Kostalnick, Avnet Embedded The duality of low power: 16 Design challenge and opportunity OSGi platform provides 34 for growth Internet-connected secure Q&A with Mitch Little, Microchip Technology and real-time services in embedded devices Silicon SoCs driving 20 By Johnson Yan, aJile Systems Inc. HetNet evolution By Joachim Hallwachs, DesignArt Networks 2011 Resource Guide Silicon 39 Software 46
2011 OpenSystems Media ® © 2011 Embedded Computing Design Strategies 52 All registered brands and trademarks within Embedded Computing Design magazine are the property of their respective owners. COTS Collection 65 ISSN: Print 1542-6408, Online: 1542-6459
4 | August 2011 Embedded Computing Design Resource Guide www.embedded-computing.com
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6 | August 2011 Embedded Computing Design Resource Guide www.embedded-computing.com Tracking Trends in Embedded Technology By Warren Webb
@warrenwebb [email protected]
Building universal connectivity
As we approach the pervasive-computing vision, designers and In our Software section, Kim Hartman of TenAsys Corporation customers alike are starting to expect universal connectivity uncovers the price and performance implications of virtualization in almost every embedded device. A ubiquitous network con- for real-time embedded applications employing multicore pro- nection can enhance an embedded design in a number of ways, cessor technology. He looks at techniques to combine a software such as eliminating the hardware required for a local user inter- platform requiring deterministic performance with a General- face or improving customer satisfaction with remote operation, Purpose Operating System (GPOS) for a graphics-rich user inter- software updates, troubleshooting, and automatic usage moni- face. In the same section, Ken Karnofsky of MathWorks answers a toring. Designers can also increase the apparent performance series of questions covering the fundamentals, trends, and advan- of an embedded product by offloading computing tasks to tages of employing model-based design for embedded projects. remote processors. The Strategies section of this issue includes an in-depth technical A major challenge for embedded designers is to pick the article by Johnson Yan of aJile Systems covering new innovations appropriate connection mechanism depending on the product’s in Java technology from the Open Services Gateway initiative deployment location and security requirements. Designers must (OSGi) Alliance tailored toward embedded devices. These choose from a wide range of networking interface standards, innovations, along with new silicon-based platforms for direct including Modbus or Ethernet for hardwired connections or Java bytecode execution, promise to enable Java-based systems Bluetooth, ZigBee, Wi-Fi, and cellular for wireless links. that meet the performance, cost, and security requirements of today’s embedded devices. In a Strategies Q&A session, To ensure that these networking protocols track user require- Chuck Kostalnick of Avnet Embedded discloses that many of his ments and match new applications, standards organizations are customers are looking for off-the-shelf products to reduce sched- constantly updating and extending their offerings. For example, ules and avoid the costs of board layout, manufacturing, and life- the Bluetooth Special Interest Group (SIG) recently released cycle management. Logic PD’s Mark Benson covers the radio their version 4.0 specification that includes low energy Find Me frequency emissions, security, and data integrity issues facing and proximity profiles to locate or disable portable devices designers of wireless in-home telehealth devices. when they are separated from the authorized user by a specified distance. In addition to the obvious smartphone and laptop loca- This issue also includes our annual Resource Guide, with a host tion tools, the Bluetooth SIG envisions new proximity-sensing of embedded products divided into dozens of categories to sim- applications that protect valuables, pets, and even children. It is plify your next design project. You can find wide-ranging off- easy to predict scores of new personal security products for the the-shelf modules along with specialized embedded components mass market based on this innovation. to solve your unique requirements. You will also find plenty of embedded support software including OSs, development aids, In this issue of Embedded Computing Design, we present a and design automation tools. variety of technical content and opinions from experts in the embedded community. For example, Joachim Hallwachs of The articles, interviews, and product listings in this issue cover DesignArt Networks outlines the infrastructure changes that a broad section of the embedded industry that can serve as a we can expect in data-centric networks, along with the role of a valuable technical reference for your next project. Please give us new generation of System-on-Chip (SoC) technology to simplify your ideas on future topics and information that we can provide the transition. In the Silicon Q&A section, Dr. Øyvind Strøm to support your design efforts. If you have an idea for a tech- of Atmel covers the latest ZigBee specifications and their use nical article that would be of interest to the embedded design in low-power, smart energy embedded applications. In addi- community, please send me a short abstract. tion, Elie Ayache of Silicon Labs explains recent innovations and changes in timing components and how they will affect embedded designs. Mitch Little of Microchip Technology also answers our questions about the technical challenges and future Warren Webb, Editorial Director opportunities facing embedded design teams. [email protected] www.embedded-computing.com Embedded Computing Design Resource Guide August 2011 | 7 Understanding embedded design, all in good time Silicon Q & A Q&A with Elie Ayache, Timing Products, Silicon Labs
Timing devices have evolved to address the growing form factor processing modules. Timing devices have evolved accordingly to diversity of embedded systems. Moving beyond standard address the diverse requirements of these off-the-shelf timing products, many of today’s clocks are embedded systems.
designed to enable flexibility in frequency generation and A key trend in timing devices today is tuning capabilities of the clock signals while also providing to provide flexibility in clock signal frequency generation and tuning capa- a system-wide solution for improved integration and bilities. This latter capability has recently lower costs. Elie describes trends in timing requirements become more vital due to the increased dissemination of differential signaling in for embedded systems and explains how developers can embedded applications. In addition, the leverage the benefits of fully customized, application- ability to provide necessary features to assist the designer in minimizing power specific clocks and oscillators. consumption for mobility and green initiatives, as well as conformity to the ECD: How are recent trends in the into classic embedded designs. If these Federal Communications Commission, timing device market affecting the way legacy chipset architectures required have become a norm in timing devices. embedded products are designed today modifications to the main system clock, versus 5-10 years ago? the changes would be infrequent and rela- In addition, timing devices are now tively minor, and it often made sense to offered in diverse package types that were AYACHE: Timing devices represent accommodate them by adding discrete not available a decade ago. These pack- a substantial market that encompasses components to the board. ages – including some as small 1.2 mm clock ICs and frequency control devices x 1.4 mm – are now available to address used in virtually all electronics products. To a great degree, this trend has kept varying requirements for small form Despite its importance to the electronics the timing requirements for embedded factors and manufacturability in today’s industry, the timing device market has systems very similar to their mainstream embedded applications. been relatively slow to change. In fact, PC predecessors. Differences were during the past two decades, timing device mainly associated with products’ longer ECD: What do embedded suppliers have delivered clocking and fre- production life spans and their confor- developers need to understand quency control products at a surprisingly mity to industrial grades. In a nutshell, about timing devices (clock ICs and slow rate of innovation. However, recent embedded systems have not required frequency control devices) to stay trends in the embedded market are driving frequent and significant changes to on top of these trends? change and innovation in the competitive timing device design. landscape for timing devices. AYACHE: To understand today’s timing In the past seven or eight years, however, devices, it is helpful to comprehend Classic embedded designs historically the basic computation architecture of recent trends in main system design. The have focused on systems such as indus- CPUs, graphics/VGA controllers, mem- first important factor to consider is the trial automation and control, point-of- ory controllers, and I/O interfaces has recent integration of basic timing func- sale, test and measurement, and medical become overwhelmingly pervasive in a tions into mainstream PC chipsets that equipment. Certain mainstream PC multitude of emerging end products that historically would have been provided chipsets, or slightly modified versions of require an operating system and only externally as part of the total timing them, were chosen for these embedded a limited number of applications. This device. The embedded version of these applications. These chipsets typically dynamic has broadened the embedded chipsets might possibly require smaller had life spans of more than six years. market from being mainly industrial timing components, often in the form of After achieving industrial-grade com- to include a wider range of consumer expansion buffers or stand-alone comple- pliance, the x86 chipsets would migrate and enterprise systems, as well as small mentary clock generators.
8 | August 2011 Embedded Computing Design Resource Guide www.embedded-computing.com TS-WIFIBOX-2 A Complete Solution for 802.11g WiFi Applications
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Low power (3.2 watts), fanless Power via 5-12 VDC, USB, PoE (opt.) 64MB DDR-RAM 256MB ultra-reliable XNAND drive Micro-SD Card slot Figure 1 | Embedded x86 clock generation devices, such as Silicon Labs’ SL28541 clock IC, support a wide array of chipsets and processors; provide RS-232, RS-485, CAN, RTC clock generation for the CPU, memory controller, and I/O controller; meet Header with SPI and 11 DIO the latest timing requirements for industry standards such as PCI Express, SATA, USB, and legacy PCI; and offer a multi-PLL platform for independent 480Mbit/s USB, Ethernet, PoE option asynchronous signal generation. Boots Linux 2.6.24 in < 3 seconds
A second factor is the introduction of Although developers should seek timing Un-brickable, boots from SD or flash new chipsets that focus exclusively on solutions that best fit their design require- Customizable FPGA - 5K LUT embedded applications and rely primarily ments, they should also consider a number Optional DIN mountable enclosure on external main system clock generators. of variables in choosing their clock ICs – These timing devices have the flexibility most importantly, configurability and Ideal for gateway or firewall, protocol to address a multitude of form factors programmability, power consumption, converter, web server, WiFi audio, ranging from tiny processor modules to and package size. Developers should and unattended remote applications large-scale main boards. also choose vendors with comprehensive clock IC and frequency control portfolios Over 25 years in business A third important factor is the increased that address multiple embedded plat- Never discontinued a product dissemination of processing architectures forms with different architectures. For Engineers on Tech Support beyond x86 that present somewhat differ- example, Silicon Labs’ recent acquisition Open Source Vision ent system clocking requirements, mainly of SpectraLinear has added more than Custom configurations and designs w/ in the consumer and enterprise segments 100 low-power, highly customizable excellent pricing and turn-around time of embedded applications. These trends clock generator (Figure 1) and clock Most products ship next day are affecting clock IC suppliers who have buffer products to the company’s timing traditionally derived a major part of their product portfolio for high-volume, cost- revenues from the PC market. Clock IC sensitive applications, including various vendors who have dominated the PC embedded system designs. [Figure 1 | Embedded x86 clock generation devices, such as Silicon Labs’ SL28541 clock IC, support a wide array of chipsets and processors; provide clock generation for the CPU, memory controller, and I/O controller; meet the latest timing requirements for industry standards such as PCI Express, SATA, USB, and legacy PCI; and offer a multi-PLL platform for independent asynchronous signal generation.] Technologic timing device market now face rapidly SYSTEMS declining revenue in the PC clock market, To satisfy diverse system requirements, coupled with an underinvestment in other the timing IC industry has introduced We use our stuff. key growth markets such as communica- highly customizable timing devices visit our TS-7800 powered website at tions and consumer electronics. that integrate nonvolatile technology. www.embeddedARM.com (480) 837-5200 Microcontrollers Silicon Silicon |
These devices address the wide range of customer requirements by developing application-specific clocks customized to meet the frequency, type of output, jitter, phase, skew, and other interface require- ments for a particular application.
Perhaps the most significant limitation of traditional programmable clock solutions is that they require I2C-based firmware or BIOS development. In many applications, an I2C interface is either not available or not desirable.
New generations of configurable timing devices address the deficiencies associated with traditional I2C programmability solutions. These new timing products can be customized entirely at the factory or using Web-based utilities. This customiz- able approach benefits the system design by alleviating the burden of using BIOS memory space and allocation of scarce Figure 2 | Edge rate control is an effective technique for controlling EMI. firmware resources, as well as assisting Multiple edge rate settings can be controlled for each clock output and in boot time reduction. Once the device programmed via I2C or customized at the factory. is customized, I2C programming may still be used for post-boot features such rate controls for each individual output common-mode energy. By using the I2C- as hot-swapping, where the clock would allow board designers to customize each programmable or factory-configurable need to be enabled on-the-fly at detection output to its own load and trace length. skew and edge rate features available in
[Figure 2 | Edge rate control is an effective technique for controlling EMI. Multiple edge rate settings can be controlled for each clock output and programmed via I2C or customized at the factory.] of a hardware card plug-in. many clock ICs, each I/O can be indi- When multiple outputs of the same fre- vidually tuned to the PCB environment ECD: How can embedded developers quency are switching at the same point in for cross-point optimization and EMI leverage clock IC technology to address time, the end result is large EMI spurs at reduction. Electromagnetic Interference (EMI)? harmonics of the clock frequency, as well as increased noise at the power supplies Programmable impedance also allows AYACHE: Clock ICs are now available due to the combined amount of switch- board designers to better match load with programmable edge rates, program- ing current. By programming each clock impedance without having to modify dis- mable impedance, programmable skew, output skew to be delayed relative to crete termination networks or PCB trace spread-spectrum technology, and other other outputs, the spur energy is spread design. Mismatched trace impedance built-in features that combat EMI. These out, consequently reducing peak EMI and causes reflections that generate clock features are also used to reduce Radio power supply switching noise. overshoot and undershoot, resulting in Frequency Interference (RFI) in appli- increased EMI and glitches in the clock cations where interference with 3G/4G Most of today’s embedded systems imple- circuitry of the receiving device. radios must be optimized to improve ment differential clocking approaches for device operation. higher bandwidth; many board designers Spread-spectrum technology provides neglect the effects these signal formats an effective way to reduce EMI across Slowing the edge rate is the quickest can have on EMI and system perfor- the system. Radiated emissions are method to reduce EMI (see Figure 2). For mance. Mismatch in the edge slew rate minimized by spreading energy around many clock vendors, edge rate control and skew between true and complement the center of the source frequency. This typically applies to the entire bank, which signals will create common-mode energy technique spreads EMI over a wider limits the ability to tune each signal for that radiates EMI, as well as an unstable frequency range, thereby reducing peak its particular load. If one receiver requires cross-point that causes data loss. Since emissions at every harmonic. a fast edge rate, all other receivers in the clock trees in these systems commonly same output bank will have that same drive multiple buses with differential ECD: Long lead times for some fast edge rate, resulting in higher EMI. outputs, any differential clock misalign- timing devices can severely prolong Timing devices with programmable edge ments can generate a large amount of time to market for embedded products.
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Microcontrollers Silicon Silicon |
[Figure 3 | 250 | center | ECD in 2D: Developers can custom-configure their clocks and develop application-specific clock generators that support any combination of user-specified I/O frequencies using Silicon Labs’ ClockBuilder service. Use your smartphone, scan this code, watch a video: http://opsy.st/j21Q2W. ART]
How can developers get the timing Elie Ayache manages Silicon Labs’ high-volume clock IC business. With more chips they need in a timely manner? than 20 years of experience in the timing industry, Elie joined Silicon Labs in 2011 following the company’s acquisition of SpectraLinear, where he served as a VP AYACHE: Embedded designs have ex- of marketing. Previously, he was the marketing director of the Computation Clock panded beyond classic industrial systems Business Unit at Cypress Semiconductor. Prior to Cypress, he was the director and migrated into faster-paced consumer of marketing and applications engineering at International Microcircuits Inc. and enterprise markets. Coupled with the He also patented the linear frequency shift doze mode for green applications and diversification of processing architectures power-up bidirectional I/O. Elie holds a BSEE from Santa Clara University. and chipsets, this embedded market evo- 3ILICON ,ABS s [email protected] s www.silabs.com lution has contributed to the developer’s need for collaboration with IC vendors ECD in 2D: Developers can custom-configure their clocks and develop who support fast time to market. This application-specific clock generators that support any combination of user- need is especially true for sources of specified I/O frequencies using Silicon Labs’ ClockBuilder service. Use your timing devices. smartphone, scan this code, watch a video: http://opsy.st/j21Q2W. Today’s timing device suppliers must respond quickly to the developer’s cus- tomization needs. Until recently, custom configurations were achieved through changes in the IC design, layout, masks, and new wafer developments. This cus- tomization process often required lengthy lead times of three to four months to deliver working products to the customer.
With the introduction of customization through nonvolatile programmability Fully certified, all-in-one hardware and OpenEmbedded Linux along with deeper sets of available con- development environment figurations, the timing device market Multiple interface options and internal has reached an inflection point. Timing peripherals device vendors such as Silicon Labs can Quickly develop and deploy custom applications deliver platform-specific timing solutions with lead times as short as two weeks. Ready-to-use, flexible platform provides quick ROI Nonvolatile programming is the key to fast Cellular Development Cost-effective alternative to custom manufacturing Platform time to samples, but having the right ingre- Developer community and support dients in the device is important to produce samples in days instead of months.
Frequency customization has become a given, but what about addressing other parameters that developers care about, such as signal optimization or end prod- CFast™ 1.0 Spec. compliant uct compliance with federal regulatory Interface: sATA II -PIO4 and UDMA6 requirements? R/W performance up to ~105/90 MB/s
To determine the sets of available config- Global Wear Leveling with 15bit/512byte ECC urations, it’s crucial to understand trends S.M.A.R.T. support for Life Time Monitoring (LTM) CFast™ Card in timing requirements for embedded Densities: 2GB to 32GB The Next Generation systems. Knowing the appropriate param- CompactFlash Frozen BOM and PCN Process ™ eters to be configured beyond frequency generation also plays an important role. Factors such as drive programmability, skew and signal phase shifts, cross-point adjustments on differential clocks, and The Embedded Products Source controlled impedance matching all con- tribute to a robust design that brings the www.wdlsystems.com 1.800.548.2319 [email protected] developer one step closer to accelerating Scan Code or visit www.wdlsystems.com/QR/ECD for more embedded products. time to market. www.embedded-computing.com Embedded Computing Design Resource Guide August 2011 | 13 Smart energy apps making the move
Silicon to ZigBee Q & A Q&A with Øyvind Strøm, PhD, Senior Director of Wireless Microcontrollers, Atmel Corporation
Operating in the 2.4 GHz frequency that can be used Periodic interoperability events verify almost anywhere, the ZigBee wireless protocol provides that devices work with other certified devices. a low-cost, low-power mesh network ideal for green and global embedded applications such as smart energy The ZigBee PRO and ZigBee RF4CE specifications serve as the base net- and smart home initiatives. Øyvind shares an overview of working system to facilitate ZigBee’s ZigBee specifications and implementation requirements interoperable market standards. Both feature sets define how the ZigBee mesh for ensuring device interoperability. networks must operate and pass interop- erability testing through a ZigBee test ECD: Give us a technical overview companies to track meters wirelessly facility. ZigBee PRO, the most widely of how ZigBee technology fits with through a central station. The standard is used specification, is optimized for low embedded applications. best suited for embedded applications in power consumption and supports large wireless consumer devices such as remote networks with thousands of devices. STRØM: ZigBee is a wireless proto- controls and human interface devices like The ZigBee RF4CE specification was col that is a mesh network designed from keyboards and mice. The protocol can be designed for simple, two-way, device- the ground up for device connectivity. embedded directly into various applica- to-device control applications that don’t Controlled by the ZigBee Alliance, ZigBee tions to allow wireless connectivity at the require the full-featured mesh network- executes on top of the IEEE 802.15.4 2.4 GHz frequency. ing capabilities offered by ZigBee 2007. standard that was finalized in 2006. ZigBee RF4CE has lower memory size ZigBee provides a networking solution ECD: Will ZigBee replace or requirements and enables lower-cost for small devices and wireless remote coexist with current communications implementations. monitoring of sensors and simple input standards? devices such as light switches. These Atmel offers ZigBee-certified wireless devices typically have very low bandwidth STRØM: ZigBee will coexist with microcontrollers that are certified to and power requirements and are deployed different wireless and wired protocols, both specifications using the Atmel in the 2.4 GHz frequency worldwide. including Wi-Fi, power line communica- ATmega128RFA family of devices or the ZigBee has a defined rate of 250 Kbps best tions, and Bluetooth low energy. Wireless RF231 transceiver together with one of suited for periodic or intermittent data or is continuing to grow rapidly, and many the Atmel AVR- or ARM-based standard a single signal transmission from a sensor products are moving to wireless proto- microcontrollers (see Figure 1).
[Figure 1 | Atmel’s ATmega128RFA1 includes an MCU and RF transceiver on a single chip.] or input device. cols. For instance, the wireless 802.15.4 ZigBee RF4CE standard is replacing ECD: What other challenges The ZigBee Alliance focuses on the infrared applications such as remote con- complicate ZigBee implementation, and Smart Energy 2.0 profile, which is man- trols. In addition, many applications in how can designers overcome them? dated in the United States for smart the smart energy and lighting areas are metering implementation. The Alliance moving to wireless protocols including STRØM: There are many software also focuses on smart lighting, Radio ZigBee and Wi-Fi. All these standards debugging and interoperability design Frequency for Consumer Electronics will definitely coexist in the future. challenges when implementing new (RF4CE), and smart home automation. software protocol stacks. With ZigBee ECD: What test and product implementation, the primary challenge ECD: What types of embedded certifications are required to implement is debugging larger networks and ensur- products can benefit from ZigBee? ZigBee? ing interoperability within the system. Specifically for ZigBee, the challenge STRØM: A number of embedded prod- STRØM: To become ZigBee certified as comes down to the high node count in the ucts can benefit from ZigBee, including a semiconductor company, vendors must mesh network, which is hard to debug. smart metering systems that allow utility ensure their applications are interoperable. Atmel solutions make this challenge
14 | August 2011 Embedded Computing Design Resource Guide www.embedded-computing.com 425:9.3,K *7.&1K
RISC computing power. A wealth of I/O features.
The R9 family is an application-ready platform for your next product design. R9 products deliver RISC computing power using the latest Windows®® CE 6.0 embedded software environment and unmatched I/O features that extend capabilities beyond traditional RISC applications. Choose from single board computers, rugged Figure 1 | Atmel’s embedded systems, and panel mount flat paneel touchscreen ATmega128RFA1 includes an MCU and RF transceiver on computers. All R9 solutions offer small size, wide operating a single chip. temperature range, and flexible I/O connectivitty.
R9 Features: easier by providing a complete suite of software and hardware tools in addition F92*1F% F % " F to the appropriate support required to Processor implement these networks. [Figure 2 | 250 | center | ECD in 2D: A demo at this year’s ESC Silicon Valley shows how an Atmel microcontroller handles both the RF and touch sensor interface functionality on a wireless remote control for a light fixture. Use your smartphone, scan this code, watch a video: http://opsy.st/kr8o1T. ART] 3J'4&7)*7.&1N.,.9&1N&3) Analog I/O Øyvind Strøm is the senior director of wireless microcontrollers at Atmel 425&9.'1*<.9-.3)4<8 Embedded CE 6.0 and Linux Corporation. He is co-inventor of the AVR32 microcontroller architecture and :,,*) *(-&3.(&143897:(9.43 was the lead designer and product line . )*5*7&9.3,*25*7&9:7* director of Atmel’s AVR32 design team. Raangn e up to -40 +85C Custom RISC solutions He has published more than 40 technical available – contact us articles and holds three U.S. patents, for more information. in addition to numerous patents pending. He holds an MSc in Electrical Engineering from Delft University of Technology and a PhD in Electrical Engineering from the Norwegian University of Science and Technology.
Atmel Corporation 408-441-0311 [email protected] Twitter: @Atmelcorporatio www.atmel.com
ECD in 2D: A demo at this year’s ESC Silicon Valley shows how an sealevel.com > [email protected] > 864. 843. 4343 Atmel microcontroller handles both the RF and touch sensor interface functionality on a wireless remote control for a light fixture. Use your smartphone, scan this code, watch LeL ara n morore aboboutut RISISC computingng soolluttioonss at a video: http://opsy.st/kr8o1T. seeala evvelel.ccomo /e/ecdcd/r/ issc or sccan this QR codo e witth your smsmart phohonne. © 19986-8866-6 2012010 1,1 Sealelevelvele Syysstestt ms, IInc. Alll rightghg s reserved. The duality of low power: Design challenge and
Silicon opportunity for growth Q & A Q&A with Mitch Little, VP, Worldwide Sales & Applications Engineering, Microchip Technology
Users’ expectations that their devices must be powerful, to exercise equipment, while graphical portable, and extremely intuitive are putting greater burdens displays include everything from simple monochrome LCDs to full-color WVGA on power systems and the engineers designing them. Mitch user interfaces. explains how low-power technologies, especially those Our mTouch portfolio of touch-sensing that enable smart energy control, present opportunities for solutions works in conjunction with innovation and explores how other current demands are our vast microcontroller portfolio to enable everything from capacitive evolving embedded applications. buttons and sliders all the way up to projected-capacitive touch screens with ECD: What are the biggest technical application lifetime, the system’s power multitouch capabilities. In some cases, we challenges Microchip’s customers are consumption must be reduced. have integrated the peripherals for driving dealing with right now? graphics displays and capacitive touch To drive the growth of these applications, sensing into a single microcontroller. LITTLE: The biggest technical chal- power system development and advance- lenges for our customers remain time ment are essential. However, lowering ECD: As you look ahead to the to market for new ideas, and then keep- power consumption while providing future, which markets and technologies ing the new ideas coming. Some of the acceptable performance is challenging, present the most interesting specific areas where embedded systems as low power and high performance are opportunities? designers are facing particular challenges opposing forces. Consequently, low- stem from the demands they face for prod- power development becomes critical for LITTLE: It is widely believed that a good ucts with higher functionality in smaller the growth of these applications. portion of the growth for semiconductor form factors, along with lower power companies will come from energy-related consumption yielding longer battery life Microchip has many innovative semi- and low-power technologies, including and more intuitive display technologies, conductor products that can help designers applications in the telecom, automotive, which are increasingly moving from tra- create these applications. Our eXtreme industrial, and consumer electronics ditional consumer applications to a broad Low Power (XLP) PIC microcontrollers markets. As illustrated in Figure 1, tech- spectrum of embedded applications. have very low active and sleep power nologies that enable the smarter use consumption, along with high levels of energy are particularly high-growth Users have come to expect improved of integration in small packages. This areas, including the digital control of interfaces in all of the products they XLP technology allows us to adopt power supplies and digital power conver- purchase and interact with. This includes more advanced processes, while keep- sion, digital lighting, electronic motor the expectation for touch-sensing inter- ing sleep leakage currents low, which in control, and digital control in solar power faces, as well as technologies that give us turn reduces active power consumption – inverters. Additionally, technologies that bigger, brighter, and better displays. providing the best of both worlds, in terms enable consumers to monitor and control of the lowest overall power consumption. their power consumption, such as Google The iPhone and iPad are examples of PowerMeter, as well as the advanced this. With fewer dollars being spent on As for human interface, we have a broad metering devices and other technologies consumer products, a high-quality user portfolio of touch sensing, graphical being deployed in the emerging smart experience is expected and demanded. display, and audio technologies. For grid, are all increasing in demand.
[Figure 1 | Technologies that enable the smarter use of energy within the home are high-growth areas for semiconductor companies.] Also, portable electronics are increasing example, our microcontrollers provide in sophistication. The computational solutions for everything from simple, seg- Consumer mobile devices are growing horsepower is increasing. This puts a mented LCDs to rich graphical displays. in huge leaps and, as the smartphone great demand on the power system. Segmented LCD is used in a wide variety evolves and tablets expand, are expected Typically, these systems are battery- of applications, ranging from meters to to drive an ever-increasing demand for powered. In order to provide a sufficient portable medical devices to thermostats embedded semiconductors.
16 | August 2011 Embedded Computing Design Resource Guide www.embedded-computing.com including the ever-expanding “Internet of Things.” On the wired side, we have seen the strongest growth in USB connec- tivity, followed by Embedded Ethernet. Microchip has proliferated USB integra- tion throughout our entire portfolio of 8-, 16-, and 32-bit PIC microcontrollers to enable maximum flexibility for design- ers to choose the best MCU for their applications. Additionally, we have many options for both integrated and two-chip Ethernet connectivity with our MCUs.
On the wireless side, we formed our Wireless Products Division several years ago to address the rapidly growing demand for connecting our microcontrollers to Figure 1 | Technologies that enable the smarter use of energy within the home the wireless world. We have found that are high-growth areas for semiconductor companies. our customers are widely adopting wire- less connectivity in three main areas – Finally, medical innovations are bringing does it affect your product Embedded Wi-Fi, IEEE 802.15.4/ZigBee, good opportunities, including home development plans? and the utilization of the unlicensed, health care and telemedicine, portable sub-GHz networking bands. Accordingly, diagnostic devices, and disposable medi- LITTLE: Embedded applications have we are steadily growing our wireless port- cal electronics. evolved from systems that operated in folio of enabling products around these isolation or within closed networks, such three technologies in the form of radio ECD: What is your assessment as those in automobiles, to the increas- transceivers, software protocol stacks, of the growing demand for ingly widespread adoption of many wired agency-certified modules, and develop- ubiquitous connectivity, and how and wireless networking technologies, ment tools that work seamlessly with
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www.embedded-computing.com Embedded Computing Design Resource Guide August 2011 | 17 Microcontrollers Silicon Silicon | our existing microcontroller development month, we introduced our next-generation Embedded applications platforms. MPLAB X IDE, which is now based on the open-source NetBeans platform. This have evolved from ECD: What development tools platform enables us to support embedded and software support does Microchip development using all three major systems that operated provide for the wide range of operating systems – Windows, Mac, in isolation or within 8-, 16-, and 32-bit microcontrollers? and Linux – along with a number of other useful new features, such as call closed networks to the LITTLE: Microchip supports all of graphs and the ability to debug multiple our 8-, 16-, and 32-bit microcontrollers simultaneous targets. increasingly widespread with a single Integrated Development Environment (IDE), including all of our In addition to our IDE, Microchip con- adoption of many more than 800 PIC microcontrollers and tinuously improves the capabilities of wired and wireless dsPIC digital signal controllers. Last our hardware debugging tools while networking technologies.
offering lower-cost, entry-level devel- opment tools that also support all of our 8-, 16-, and 32-bit PIC microcontrollers. And we recently acquired HI-TECH to streamline our compiler offering for our 8-bit PIC microcontrollers. Our large portfolio of in-house hardware and soft- ware development tools is complemented by a broad ecosystem of third-party tool providers.
[Figure 2 | 250 | center | ECD in 2D: At ESC Silicon Valley earlier this year, Embedded Computing Design Editorial Director Warren Webb chatted with Microchip’s Derek Carlson about the new MPLAB X IDE, which supports more than 800 microcontrollers and memory products. Use your smartphone, scan this code, watch a video:http://opsy.st/ilSGxc . ART]
Mitch Little has served as Microchip Technology’s VP of Worldwide Sales and Applications Engineering since July 2000. He has also served as VP of several other Microchip departments, including Americas Sales, the Standard Microcontroller and ASSP Division, and the Memory Products and ASSP Division. Mitch holds a BSET from the United Electronics Institute.
Microchip Technology Inc. 480-792-7200 [email protected] www.microchip.com
ECD in 2D: At ESC Silicon Valley earlier this year, Embedded Computing Design Editorial Director Warren Webb chatted with Microchip’s Derek Carlson about the new MPLAB X IDE, which supports more than 800 microcontrollers and memory products. Use your smartphone, scan this code, watch a video: http://opsy.st/ilSGxc.
18 | August 2011 Embedded Computing Design Resource Guide www.embedded-computing.com X-ES 2nd Generation Intel® Core™ i7 Processor Solutions: Delivering Innovation
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Silicon SoCs driving HetNet evolution
By Joachim Hallwachs
As mobile data consumption explodes and the demand for 3G/4G services increases, the radio equipment market is moving toward a Heterogeneous mobile Network (HetNet). Analyzing the HetNet infrastructure demonstrates how fully integrated, all-in-one System-on-Chip platforms can deliver any type and form factor of equipment needed for the HetNet radio access layer, as well as a new breed of unified wireless mobile access solutions.
The dramatic shift from low-capacity of cell site backhaul equipment. Four high-capacity service performance while telephony services to high-capacity critical equipment segments serve the maintaining the low total cost of owner- data services is driving the evolution HetNet access infrastructure market: ship essential for successfully operating of a Heterogeneous mobile Network data-centric 3G and 4G services. (HetNet). This architecture requires ❯ Cost-effective and compact the rapid build-out of a more densely radio access equipment Two deployment approaches are available deployed distributed Radio Access ❯ Cell site backhaul equipment in the market today: existing distributed Network (RAN). ❯ Distributed Antenna Systems (DAS) base station infrastructure and low-cost, ❯ Centralized processing and compact, all-in-one radio access equip- HetNet comprises compact, cost-effective control equipment ment. Both of these options allow small equipment targeting small and large and large cells to be deployed using cell service access connected to high- These equipment segments utilize highly different cell site backhaul methods. In performance centralized processing and integrated System-on-Chip (SoC) silicon addition, both options can be combined control locations through various types platforms capable of delivering uniform with DAS to bring antenna installations
20 | August 2011 Embedded Computing Design Resource Guide www.embedded-computing.com even closer to subscribers, especially DAS solutions connect to antenna ports The all-in-one equipment segment inside larger buildings. on third-party base stations combined fundamentally relies on the use of highly with RRH or all-in-one equipment such integrated SoC platforms, driven largely HetNet architecture layers and as picocells to further distribute antenna by a requirement for passive cooling radio access equipment sectors mounting locations. and minimal enclosure size, which are Deployment costs and subsequent directly related to equipment cost. These operational and maintenance costs of SoCs in distributed all-in-one requirements cannot be achieved through the HetNet infrastructure must be kept equipment discrete processing and component below that of existing RAN deployment The distributed RAN comprises cost- layers, thus leading to the need for a fully practices. This facilitates a successful effective in- and outdoor small cell integrated multilayer SoC architecture. transition toward a data-centric mobile equipment and compact, passively cooled business model. large cell equipment connected to a high- As the all-in-one model expands from performance centralized processing and residential femtocells to enterprise and However, exploding mobile data capacity control layer. hot-spot applications, underlying SoC consumption requires the deployment of more cell capacity in existing locations and additional cells in new types of in- and outdoor locations. Small cells are deployed in these new cell sites, while large cells are typically deployed in existing cell sites, for example, on towers and buildings. Industrial & The mobile infrastructure equipment evolution has two components: the cost Embedded Computers optimization of existing base station equipment and deployment practices and Rugged, Low Power & Portable Applications the addition of new types of cell sites with new deployment practices. The terms for the two practices are distributed base 2nd2n Gen Core CPU Mini ITX station deployments and compact, all-in- MANO800M one base station deployments. XXLGA1156 Intel® Core™ i7, Core™ i5, Core™ i3 Processors To reduce existing base station deploy- XXDVI-D/VGA, PCIe x4, DDR3 ment costs, especially in heavily loaded XX4 x SATA-300 with RAID metropolitan areas, operators have X Dual LAN, DIO, CF/CFast already tried implementing a distrib- uted base station architecture, in which Remote Radio Heads (RRH) installed on towers and buildings are connected via a standardized dark fiber interface to centralized baseband units. The distribu- tion transport for this architecture is dark fiber using protocols like Common Public WideWid TTemp, WidWide RRange DC IInput Pico-ITX SBC Radio Interface (CPRI). SBC84823 PICO822 X 1.1/1.33 GHz Intel® Atom™ X Intel® Atom™ Processor E6xx The deployment of all-in-one base station Processor Z510PT/Z520PT Series equipment initially started indoors, X Integrated graphics controller: X LVDS LCD and backlight control VGA & LVDS X Hardware video where operators are now deploying X GigLAN, 6 x USB, 4 x COM, DIO, encoder/decoder femtocells as coverage and offload solu- CF, Mini Card X GigLAN, SSD & DDR2 onboard tions. The expanding femtocell model X +8V ~ +24V DC input X Power saving mode, includes small business, large enterprise, X - 40°C to +85°C fanless range +12V DC-in and private and public hot-spot applica- tions and is projected to extend to form Visit Us at RTECC Denver, CO – August 9th, 2011 metropolitan radio access layers called All specifications and product photos are subject to change without notice. All rights reserved. Axiomtek 2011. © Metrozones. All-in-one base stations require IP-based wired or wireless Metro Email: [email protected] | Call: 1.888.GO.AXIOM | Visit: us.axiomtek.com Ethernet transport. www.embedded-computing.com Embedded Computing Design Resource Guide August 2011 | 21 Microcontrollers Silicon Silicon |
platforms must be able to scale up base station system and Remote Antenna carried out in the multicore DSP layer to support tens or even hundreds of Units (RAUs) as part of a DAS. of all-in-one SoC platforms, presenting subscribers. In the context of 3G and a fully software-defined solution for 4G data capacity, this requirement RRH equipment is installed and managed samples compression. demands the use of a multilayer multi- as an integral part of the serving opera- core SoC architecture. tors’ mobile radio access infrastructure. Moreover, an active DAS solution’s main RRH equipment connects to the digital unit and distribution unit equipment can Multilayer multicore SoC platforms baseband layer of a baseband unit employ scalable multicore baseband include multiple task-optimized process- through a standardized transport and processing SoCs to provide distributed ing cores at each processing layer. These management interface such as CPRI. samples decompression technology cores handle all RAN protocol layers in Due to high capacity and stringent timing and flexible logical RAU management a single-chip product, providing scale requirements, CPRI uses dark fiber con- options, with future in-field software and data capacity as required, as well as nectivity, which enables digital signal upgradability to more frequent spec- optimized cost and power consumption to transmission over extended distances trum reuse, for example, as part of an fit the total system heat dissipation budget where dark fiber facilities are available in-field software-defined system capacity for low-cost, passively cooled in- and at suitable costs. evolution (virtual picocells). outdoor equipment. Using optical fiber DAS, solutions In all of these use cases, the SoC plat- As the all-in-one deployment model distribute RF signals over potentially long forms suggested must abide by the same expands to outdoor infrastructure, the distances to distribution units located principles previously discussed as part of use of higher RF output power becomes throughout a given building, campus, all-in-one equipment – low system-level another system requirement. This adds or metropolitan area. Distribution units cost and heat dissipation. an extra layer of digital processing to the in turn aggregate signals from several multilayer SoC architecture, as power RAUs using cost-effective indoor cabling R&D efficiency improvements amplifier linearization becomes a man- options such as thin coax or CAT5 cabling As integrated multilayer, multicore SoC datory requirement to minimize power over limited distances. platforms for all-in-one equipment come amplifier heat dissipation – again in to market, equipment vendors can choose the context of cost-effective, passively Active DAS equipment is a stand-alone SoC platforms that integrate single RAN cooled outdoor equipment with minimal equipment segment that provides build- digital front-end and signal processing enclosure size and weight. ing owners and operators with a means layers. Fully integrated all-in-one SoCs to distribute a dominant service signal can provide a good R&D platform for Furthermore, the use of SoC-based all- throughout a building or service area, RRH or RAU equipment. in-one equipment as part of the operator- independent of any particular base station installed outdoor RAN infrastructure vendor or mobile service technology. A major benefit of using all-in-one SoC adds another full set of requirements. All platforms in this context is the enor- infrastructure-grade equipment must sup- RAUs and RRH equipment provide mous flexibility of radio head equipment, port two concurrent service generations, digital-to-analog signal conversion, inte- which is in-field software upgradable to be highly reliable and in-field software grating digital RF control and signal process additional layers of all-in-one upgradable, and provide full support of processing layers with analog power equipment, including, but not limited to, carrier-grade Operation, Administration, amplifier subsystems of varying RF the entire Base Transceiver Station (BTS) Maintenance, and Provisioning (OAM&P) output power suitable for in- or outdoor functionality. Thus, from a hardware and tools. Related SoC requirements include deployments on small or large cell layers. software development standpoint, there dual-protocol operation (3G and 4G) Both types of equipment support sev- would be little to no difference between a and non-service-affecting methods for eral mobile service technologies and can 23 dBm femtocell and a 23 dBm RAU – in-service monitoring, diagnostic, and employ digital RF samples compression or a 40 W RRH and a 40 W Micro BTS, alarming procedures. methodologies, thereby decreasing cell for that matter. site backhaul/transmission capacity for Concurrent multiprotocol support cost reduction. This creates a single R&D framework requires the digital front-end layer to sup- with the option of 100 percent software, port multiple carriers, operating 3G and These signal processing capabilities use RF subsystem, and hardware subsystem 4G protocols in different frequencies just the same processing techniques already reuse across an entire product portfolio, like single RAN RRH equipment. discussed for all-in-one outdoor equip- providing a significant improvement in ment. All signal processing related to the R&D cost efficiency across the life cycle SoCs in radio head equipment antenna array is carried out on the base- for the HetNet access layer. The two basic options for distributed band processing layer, as in all-in-one in- and outdoor radio and antenna deploy- equipment. Samples compression (not See Table 1 for a summary of common SoC ments are RRH as part of a distributed required in all-in-one equipment) can be processing layers for HetNet products.
22 | August 2011 Embedded Computing Design Resource Guide www.embedded-computing.com HetNet access products The evaluation kit for the DAN3000 HetNet layer Unified wireless doubles as a complete reference design Processing layer cell site backhaul All-in-one BTS RRH DAS/ARU and comes preloaded with optional base OAM&P X X X X station, radio head, or backhaul soft- Control (L3-L7) X (X) ware packs and integrated development MAC (L2) X X environments for all product design, Baseband (L1) X X X X simulation, implementation, test, and Ant. array (AAA) X X X (X) certification cycles. Programming on embedded multicore processing layers is Power amplifier linearization X X X X based entirely on industry standard C/C++ Digital front-end X X X X [Table 1 | Common SoC processing layers for HetNet products help improve R&D cost efficiency.] language and related development tools. Table 1 | Common SoC processing layers for HetNet products help improve No FPGA, DSP, or assembly language R&D cost efficiency. coding is required for any software layer of a complete all-in-one BTS product. Cell site backhaul technology equipment, and new solutions for sub- Another critical aspect of the evolving 6 GHz PMP/NLOS backhaul in Metrozone An SoC platform such as this gives HetNet architecture is related to cell deployments. OEMs and system integrators a single site service or signal backhaul. As the R&D platform for any type of HetNet HetNet architecture differentiates two Future-proof all-in-one SoC platforms access or backhaul equipment, repre- deployment practices, new technology are built to spec for 4G. How else could senting a huge cost improvement over and equipment will be required for cell they be used as development platforms for traditional development frameworks still site backhaul connecting radio access carrier-grade, in-field software-upgradable in use today. and antenna distribution equipment to a 4G products? Hence, future-proof all- centralized service processing and in-one SoC platforms provide baseband Joachim Hallwachs control layer. These include: processing up to or above the ITU- is VP of marketing mandated 1 Gbps of downlink capacity for for DesignArt ❯ All-in-one BTS: Wired and wireless 4G services. With a small enhancement, Networks. Prior to IP-based backhaul equipment such SoC platforms can be extended to joining DesignArt, ❯ RRH: Dark fiber transmission support more than 1 Gbps of full-duplex he served in execu- such as CPRI baseband processing capacity, making tive assignments ❯ DAS: Proprietary fiber long them an ideal SoC platform for unified at Accelerated haul and small coax or CAT5 wireless HetNet backhaul products. Networks, Avaya, sentitO, SSC, for short-range distribution and Siemens. Joachim has an A reference design example for MS in Physics from Eberhard-Karls Wireless backhaul can be much more the HetNet access layer University in Tübingen, Germany. cost-effective and flexible for deploying A single future-proof all-in-one SoC radio access equipment in new sites such platform can support any distributed DesignArt Networks as lampposts or traffic lights, for which in- and outdoor service access product, +972 9 7421306 any wire-line backhaul would require including all-in-one BTS, RRH, or DAS www.designartnetworks.com untimely construction permits and the equipment. If dimensioned to support very high costs of per-site construction future-proof ITU 4G specs, this SoC and installation. platform provides an ideal solution for gigabit-plus unified wireless cell site he PPC-E7+ is a Compact Panel PC As a fundamental difference between the backhaul products. Figure 1 depicts a ref- based on a 400 M+z ARM9 processor two deployment practices, only all-in-one erence design based on a fully integrated Twith the following features: equipment can utilize wireless backhaul all-in-one SoC platform. • Open Frame Design [Figure 1 | DesignArt Networks’ DAN3000 reference design can be equipped with several RF hardware module options suitable for many types of in- and outdoor HetNet access and backhaul products.] • Fanless with capacity and timing requirements • ARM9 400MHz CPU • Real Time Clock that can be met by almost all wireless • 4 Serial Ports & SPI • I2S Audio I/O Port backhaul technologies, including emerg- • Up to 256MB RAM • Up to 1GB NAND Flash ing high-capacity Point-to-Multi-Point • 10/100 BaseT Ethernet (PMP) and Non-Line-Of-Sight (NLOS) • GPIO, A/D, Timers & PWM • 2 x USB 2.0 Host/OTG ports backhaul technology operating in • 2 x SD/MMC Flash Card Interface • Wide Input Voltage of 12 to 26 Vdc. frequency bands below 6 GHz. • Linux with Eclipse IDE or WinCE 6.0 • WVGA (800 x 480) 7” LCD with Touch • Prices start at $550.00! Figure 1 | DesignArt Networks’ 2.6 KERNEL Compact all-in-one equipment requires For more info visit: www.emacinc.com/panel_pc/ppc_e7.htm DAN3000 reference design can be Since 1985 several types of backhaul solutions, in- equipped with several RF hardware OVER 25 cluding microwave long haul of compact module options suitable for many YEARS OF SINGLE BOARD rural Macro BTS sites, high-capacity types of in- and outdoor HetNet SOLUTIONS EQUIPMENT MONITOR AND CONTROL short haul of suburban Micro BTS access and backhaul products. Phone: (618) 529-4525 · Fax: (618) 457-0110 · Web: www.emacinc.com www.embedded-computing.com Embedded Computing Design Resource Guide August 2011 | 23 Model-Based Design optimizes system behavior Q & A Software Q&A with Ken Karnofsky, Senior Strategist, Signal Processing Applications, MathWorks
Model-Based Design enables rapid prototyping, easy (see example in Figure 1). The model debugging, accurate analysis, and a host of other system represents the embedded system and its environment and enables: design benefits. Ken outlines the fundamentals of Model- ❯ Based Design and shows how techniques and tools such System-level design and simulation. The system model as automatic code generation and parallel computing with can include every element that multicore processors can enhance simulation. affects system behavior – algorithms, logic, physical components, and IP. Simulation ECD: What trends do you see in Furthermore, the proliferation of inex- enables analysis of system embedded design? pensive hardware is transforming the performance in conditions experience of engineering students. otherwise too expensive, risky, KARNOFSKY: The overarching Devices like Arduino and BeagleBoard or time-consuming to consider. trend is accelerating integration of make the integration of classroom and ❯ Automatic code generation. technologies at multiple levels, from project-based learning a reality. We’re Generate C, C++, or HDL code hardware to applications. Interaction seeing a lot of curriculum innovation from models for rapid prototyping between system components is causing that involves integrating MATLAB and and production software and engineering disciplines to collaborate Simulink with these hardware platforms. hardware implementation. The more effectively. One example stems These innovations will make today’s stu- generated code can be optimized from the growth of hardware/software dents better prepared for the work they’ll and combined with handwritten coprocessing. Highly integrated comput- do in industry. code. ing architectures with multiple cores and ❯ Continuous test and verification. hardware accelerators have performance ECD: What are the advantages of The system model captures and cost advantages, but they’re difficult Model-Based Design? requirements in an executable to design and debug using conventional specification. It also provides a tools and processes. KARNOFSKY: Model-Based Design reusable test harness for virtual (MBD) uses a system model as an execut- integration and hardware- A similar phenomenon is happening at able specification throughout development in-the-loop testing.
[Figure 1 | A system-level model of a wind turbine enables analysis of the electrical, hydraulic, mechanical, and control systems.] the interface to the real world, where analog meets digital. We’re seeing increasing interest in mixed-signal sys- tem design, helping engineers use digital algorithms to lower cost and power con- sumption and improve the performance of sensors, RF transceivers, and other analog electronics.
Another integration trend is the increas- ing connectivity of everything. Smart everything – phones, cars, homes, and the power grid contain embedded devices that connect to the Internet and generate huge amounts of data. This requires addi- tional expertise to specify and design the algorithms to communicate and process Figure 1 | A system-level model of a wind turbine enables analysis of the this data. electrical, hydraulic, mechanical, and control systems.
24 | August 2011 Embedded Computing Design Resource Guide www.embedded-computing.com In 2010, Embedded Market Forecasters conducted an analysis to determine the impact of MBD on the Total Cost of Development (TCD). Data was col- lected from companies worldwide in the automotive, aerospace, communica- tions, industrial automation, and medical industries. The results show that:
❯ Development teams that used MBD had an average 37 percent lower TCD compared to teams that did not use MBD. ❯ The number of developers used per project was smaller for MBD across all geographic areas and all vertical markets examined. Figure 2 | A system-level model of a GPS receiver is integrated with test ❯ The percent of developer months hardware for real-time verification. lost to design cancellation or projects behind schedule was (see Figure 2). Code generation enables applications for these devices requires consistently less for MBD reuse of algorithm and physical system an understanding of the target process- development projects across all models for real-time simulation and ing architecture and careful assessment verticals and geographic areas. hardware-in-the-loop testing. These sys- of execution performance, latency, and tems help engineers test more thoroughly task dependencies. This is driving the ECD: Can embedded design by starting before hardware is available need for tools that support the mapping simulation replace physical prototypes? and simulating conditions that would of computationally intensive algorithms be dangerous or costly to examine with onto multicore architectures, as well KARNOFSKY: Simulation with the real system. They also significantly as simulating execution in the target system models enables rigorous system reduce development time and cost in the environment.
[Figure 3 | 250 | center | ECD in 2D: Using Model-Based Design, Bell Helicopter evaluated different aircraft configurations of the world’s first civilian tiltrotor. Use your smartphone, scan this code, watch a video:http://opsy.st/kJUG4e . ART] design verification with less time and testing lab.
[Figure 2 | A system-level model of a GPS receiver is integrated with test hardware for real-time verification.] expense than physical prototypes. This Ken Karnofsky is the senior strategist can significantly reduce the number of ECD: How does the latest wave for signal processing applications at prototypes required, and in some cases of multicore processors affect design MathWorks. Through his 20 years of eliminate them altogether. analysis and optimization? experience, first with BBN Technologies, then with MathWorks, Ken has been The primary advantages of simulation KARNOFSKY: Multicore processors involved in development and marketing are speed of design iterations and early affect design in two ways. First, multi- of software for signal processing and visibility into system behavior for core PCs and servers provide an opportu- data analysis technologies. Ken holds a debugging, analysis, optimization, and nity for dramatic reductions in simulation degree in Systems Engineering from the verification. This reduces the design cost time. Parallel computing tools that are University of Pennsylvania. by identifying errors earlier in the devel- integrated with an MBD environment can opment process, often without physical take advantage of this computing power to MathWorks prototypes. accelerate execution of large-scale prob- 508-647-7443 lems such as Monte Carlo simulations. www.mathworks.com Engineers working toward an optimized For more information on how parallel design must develop their software and computing techniques can speed up physical system together. Today, however, parameter optimization for a complex ECD in 2D: Using advances in tools and techniques enable control system, see the MATLAB Digest Model-Based Design, highly accurate physical models that can article “Improving Simulink Design Bell Helicopter evalu- replace physical prototypes of electrical, Optimization Performance Using Parallel ated different aircraft mechanical, and other components. Computing” at www.mathworks.com. configurations of the world’s first civilian tiltrotor. Use your Many engineering teams also rely on Second, multicore embedded processors smartphone, scan this code, watch a video: automatic code generation with off- make software design and development http://opsy.st/kJUG4e. the-shelf rapid prototyping hardware much more complex. Developing www.embedded-computing.com Embedded Computing Design Resource Guide August 2011 | 25 Software
Embedded virtualization enables scalability of real-time applications on multicore
By Kim Hartman
The advent of multicore processor technology has the potential to revolutionize the way embedded systems are designed. While different technologies are being developed to solve the problem of distributing application functionality among the processors on a multicore chip, the most promising emerging technology from an embedded systems perspective is embedded virtualization. Using global object networking, embedded designers can scale applications with a software platform that maintains determinism, enables upgradability, and reduces development costs.
Embedded virtualization has several virtualization are not designed to meet nor is there a global way of associating positive implications for OEMs. For the needs of time-critical embedded a particular I/O with a client OS and the example, once there is a means for split- processing. These approaches to virtu- application running on it. Consequently, ting up applications to run on multiple alization most often treat all processors there is no way to guarantee exactly how cores while maintaining determinism, the on a multicore chip the same way. In much time will be required to handle solution can subsequently enable real- these systems, a single Operating System an I/O event; hence, this approach is time applications to scale the number (OS) assigns tasks to processors as not appropriate for handling real-time of cores they use, upward or downward. they become available in an attempt to processing in an embedded system. With scalability, OEMs can offer a range keep all processors as heavily loaded as of price/performance options for their possible with processing tasks. Embedded system designers want products without requiring changes to direct control of the system to obtain the software. Server and client virtualization typically determinism and consistent performance. virtualize all hardware including the I/O While it is desirable to balance overall Virtualization is not a new concept in interfaces. When an I/O interface needs processor utilization and keep multicore computer science, but it has gathered servicing, the Virtual Machine Monitor processors as busy as possible, this is new interest with the advent of multi- (VMM) fields the request and passes the not the top priority. First and foremost, core processors. Though virtualization results to the OS clients it is supporting. embedded designers are looking for soft- is recognized as a way to keep multiple There is no way to ensure that a particu- ware technology that helps them maintain processor cores busy, it’s important to lar OS client is loaded when an I/O that determinism while adding features and/or note that most types of server or client belongs to that client requires service, reducing the cost of their OEM products.
26 | August 2011 Embedded Computing Design Resource Guide www.embedded-computing.com Embedded designers are looking for a The real-time tasks running on different software platform that enables them to CPUs communicate when required via combine OSs of different types so that the global object network. This auto- ® processing can be optimized for the tasks mated assembly system includes three CompactPCI at hand – for example, real-time OSs to real-time subsystems: a vision system that handle critical I/O timing requirements guides an assembly robot, the multi-axis Goes Serial and General-Purpose OSs (GPOSs) to robot, and the material transport system leverage COTS graphics-rich applica- that indexes components into place for tions that run human-directed functions. assembly and then carries off assembled They are also looking for solutions to units. The ideal way to develop and scale applications so they can provide debug this type of application to ensure different products using the same appli- that each component performs as reliably cation code base. This reduces engineer- as required is to split the application into ing development cost, improves time to separate components.
[Figure 1 | Embedded systems can save cost and preserve real-time responsiveness while adding features by hosting multiple OSs on a multicore processor.] market, and more importantly, enables new products to be based on tried and For example, the HMI would be a separate proven software that can be continuously application module that might run in a non- upgraded in performance and reliability. real-time environment such as Windows. This requires an OS environment that can Embedded virtualization partition the platform resources – I/O, preserves determinism memory, interrupts, and CPU core (in the For an embedded application to be deter- case of a multicore processor platform) – ministic, it must be engineered as such to allow the application modules to run I ® from the inception of the development totally independently from each other. PCI Express , Etthernet, SATAA, USB on the bacckplane project. Determinism is not something An embedded virtualization environment that can be added at the end. Special con- supports this, allowing different real-time siderations must be made to ensure that tasks to run on specific processor cores. I CompactPCI® PPlusIO application threads have direct control of The operating software partitions physical (PICMG 2.300) 100% the I/O interfaces on which they depend. I/O interfaces so that an interrupt coming compatiblee to ® from one of the devices only interrupts CompactPCI 2.0 Figure 1 shows a pick-and-place assem- the processor handling that device. This bly system in which TenAsys’ INtime for ensures predictable response times for I ComppactPCCI® Seriaal Windows Real-Time Operating Systems handling real-time events. (PPICCMG CPPCII-S.0)0) 100% (RTOSs) are hosted on three cores of a compatiblee to 19”9 quad-core processor and the Human The hosting of multiple OS environ- mechanics (IIEEEE 1101) Machine Interface (HMI) is hosted on the ments on a multicore chip is managed fourth core running Microsoft Windows. either by software called an embedded I Individuall syysteem solutions from inexxpeensive industrial PCs to reeduunddantt systems orr compllexx computer clusters
Embedded Solutions – Rugged Computer Boards and Systems for Harsh, Mobile and Mission-critical Environments
MEN Micro, Inc. 244 North Main Street Ambler, PA 19002 Tel: 215.542.9575 Figure 1 | Embedded systems can save cost and preserve real-time E-mail: [email protected] responsiveness while adding features by hosting multiple OSs on a multicore www.men.de/cpci-serial processor. www.embedded-computing.com Embedded Computing Design Resource Guide August 2011 | 27 Software
virtualization manager or by special of platform partitioning and have typi- Over the years some of these implemen- embedded virtualization functionality cally been limited to running two OSs tations have been optimized to provide contained in the RTOS. at a time on a platform – an RTOS and the best performance for a particular a GPOS. Some implementations have combination of OSs. The downside Embedded virtualization can be imple- evolved to the point where the GPOS to this is that each implementation is mented in different ways, depending on doesn’t require any modification and specific to the particular combina- the amount of hardware virtualization the latest version of the GPOS is readily tion of OSs, and it is an impractical support provided by the processor. Para- supported. This is a real plus when the approach to providing a generic virtual- virtualization solutions use software object of coupling the GPOS to the ization solution to support multiple OS techniques to modify the guest OSs, RTOS is to make use of legacy RTOS combinations. allowing them to work side by side with- application software as is, without any out affecting each other or compromising modification, while adding an HMI based Hardware-assisted virtualization features the system’s real-time responsiveness. on an OS like Windows that leverages the like VT (supported by Intel processors) Implementations provide varying degrees latest HMI development tools. that have recently become available elim- inate some of the software complexity of paravirtualization by providing hardware assistance built into the processor. By using the hardware virtualization support, a VMM can be constructed to function without knowledge of the guest OS. As a result, the VMM can support any OS targeted for that platform.
Intel processor features like VT-x (a subset of the VT features) ensure that any memory address issued by a guest OS is automatically mapped to the appropriate address location in physical memory. Likewise, the hardware-assisted virtualization feature called VT-d auto- matically maps I/O memory accesses for bus-master DMA devices, enabling native I/O drivers that are part of the guest RTOS application to be used without modification in the virtualized environ- ment. These hardware-assist features substantially reduce the complexity of a VMM and make embedded virtualization a more viable solution.
Making scalability work in real-time applications While embedded virtualization provides the ideal environment for enabling real-time applications to be split into individual independently operating com- ponents, breaking up applications creates the need for a mechanism to support Inter-Process Communications (IPC).
In the past, designers often set up Ethernet links between application subsystems and used TCP/IP stacks to communicate between the subsystems, but this method is cumbersome, slow, sometimes unreli- able, and adds uncertainty to the system’s behavior, affecting determinism.
28 | August 2011 Embedded Computing Design Resource Guide www.embedded-computing.com A better IPC approach is to use a concept called global object networking. A global object network provides a managed communication environment with built-in initiation and discovery services, enabling an application to be dynamically distrib- uted across one or several CPUs at load time. Processes requiring services of other processes are found automatically, and a local manager records their location to keep track of established IPC links. If a communications link or targeted process fails, the manager notifies an initiating process. In addition, the local manager keeps the system clean by clearing up all records when the IPC links are no longer required by the initiating process. Because Figure 2 | GOBSnet facilitates communication between real-time processes the global object network is integrated running on different processor cores. with the OS, its overheads are low and it does not require the application developer on another core using a global memory the memory object is removed only to create any custom software. It is deter- object. The initiating process, “Process 1” when all the processes connected to it ministic and substantially more efficient in Figure 2, creates the memory object are terminated. This allows the situation than traditional IPC interfaces. and catalogs it in that core’s root process. where remote processes, Process 2 and After this is done, processes running on Process 3, can continue passing informa- The OS manages the location and other processing nodes can find the mem- tion via the memory object even though existence of global objects through which ory object, resulting in an efficient shared the initiating process, Process 1, has processes pass information to ensure the memory interface for all processes to use. terminated. system’s integrity. For instance, objects The same applies to all ranges of objects used by a process across several proces- (including semaphores and mailboxes) GOBSnet communications can be used sors are “kept alive,” and only removed for IPC use. whether the real-time application is when all the processes have terminated. spread among CPUs on the same multi- This requires an underlying manage- The second step is for other processes to core chip or among separate CPU cores ment infrastructure to ensure that an locate the memory object and obtain its on different microprocessor components object is not removed prematurely, or memory location. This is done by specify- that are networked together. By design- that it isn’t removed causing memory ing the processor name to start the search. ing systems around this flexible system leakage through poor cleanup of unused When the process finds the object, it software architecture, embedded system resources. Likewise, in the event that a stores its location, type, and parameter in developers have headroom to grow their processing node goes down before its a reference object in the processor node’s products’ processing power or shrink it processes are terminated, the manager GOBS manager and keeps the handle of accordingly to meet the challenges of needs to inform the global object manag- that reference object. From then on, when the future. ers on all the other processing nodes that a remote process (Process 2 or Process 3 they should clean up any local references in this example) wants to write or read to Kim Hartman is to objects on the down node. the memory object, it uses the reference VP of TenAsys object’s handle to retrieve the appropriate Corporation. He An example of GOBSnet memory object information to access it. has worked in the communications embedded market Figure 2 shows a highly simplified view When Process 2 or Process 3 terminates focusing on hardware of the software architecture of the system its node’s GOBS manager, the manager analysis tools and depicted in Figure 1. In addition to the clears all reference object informa- RTOS products for RTOS and the real-time process software, tion about the remote memory object. 26 years, first at Tektronix and then at Cores 0-2 also run the INtime GOBS When Process 1 terminates, it removes RadiSys before cofounding TenAsys in manager software, whose function is to all objects it has created, including the 2000. He is a Computer Engineering manage global object communications. memory object. In cases where that is graduate of the University of Illinois, (GOBSnet is TenAsys’ global object not the optimum action, there is the Urbana-Champaign, and received his network supported by the company’s option of creating a memory object with MBA from Northern Illinois University. INtime Distributed RTOS and INtime for a counter. The counter is incremented Windows RTOS.) every time another process connects to TenAsys Corporation
[Figure 2 | GOBSnet facilitates communication between real-time processes running on different processor cores.] the memory object and is decremented 503-748-4720 With GOBSnet, a process on one core every time one of those associated pro- [email protected] can communicate with another process cesses is terminated. The result is that www.tenasys.com www.embedded-computing.com Embedded Computing Design Resource Guide August 2011 | 29 Wireless in telehealth: Critical considerations for technology adoption Q & A Q&A with Mark D. Benson, Director of Software Strategy, Logic PD Strategies
As telehealth home care continues to evolve, the wireless and medical device industries face numerous challenges. Mark explores technology, patient, and standards considerations, in addition to the necessary improvements to wireless technology – all factors critical to the ultimate success of in-home health care management.
ECD: What are the primary challenges involved in using and serve as a guide for handling electromagnetic compatibility wireless technologies when designing in-home telehealth issues in a design. devices? Data integrity BENSON: Primary challenges include wireless coexistence, Accurate and on-time data transmission is essential for many data integrity, and security. medical devices. Because error rates and data transmission latency can increase when devices using the same spectrum are Wireless coexistence in the same location, it’s important to use techniques such as More and more devices (both medical and nonmedical) now frequency hopping to ensure that critical control signals are trans- include wireless radios. This creates a potential for competition mitted and received reliably and without error, as the data might between devices when they operate within the same RF spec- be used for making diagnoses and medical treatment decisions. trums. To counter this effect, medical devices that include RF must be designed to behave nicely toward other devices Security (RF emissions) and must be tolerant of other poorly behaved It is impossible to underestimate the role security plays in home devices (RF immunity) when operating in close proximity. telehealth devices. Security means more than patient privacy and protection from wireless eavesdropping or malicious hacking. For example, Wi-Fi-enabled devices, cordless phones, cell Perceived security by the user is equally important, as it affects phones, and wireless video transmitters all claim to be able to the patient’s willingness to use the device and trust it with private coexist in a small physical space such as a residence or apartment. medical data. The reality is that many of these consumer devices are built with- out much front-end filtering to save component costs and design The idea of perceived security carries the notion that if a user does time, making them susceptible to electromagnetic interference. not believe the data is secure, it doesn’t really matter how secure the device actually is since the user won’t use it. Conversely, if RF coexistence issues can cause unintended negative user the patient perceives the wireless in-home telehealth device to be experiences that have nothing to do with the medical device’s secure (and reliable, safe, effective, and useful), they will likely fundamental operation. For example, consider a patient whose use the device regardless of how secure the device actually is. wireless router at home stops working every time he or she uses A significant factor in perceived security lies within the boundar- a wireless blood pressure cuff to collect data. While this might ies of the brand, but might be influenced by the device design or not be considered a failure by the medical device manufacturer the marketing material that accompanies it. during software verification and validation testing, it would be a significant drawback and perhaps constitute failure in the eyes Perceived security, which can influence user adoption and of the user. overall business success, is not a replacement for actual security (encrypting patient data, plugging security holes). Only by To help mitigate potential RF coexistence issues, following con- employing a wide range of technical, business, and user-centered sensus standards can help. For example, “IEC 60601-1-2:2001 design techniques can we ensure the overall security of a Medical Electrical Equipment – Part 1: General Requirements wireless medical device (example shown in Figure 1).
[Figure 1 | An in-home telehealth device should be developed with security, both perceived and actual, in mind.] for Safety; Electromagnetic Compatibility – Requirements and Tests” and “IEC 61326 Electrical Equipment for Measurement, ECD: What important concerns regarding patient care Control, and Laboratory Use – EMC Requirements” provide should drive the design of a preventive in-home telehealth requirements and tests for verifying electromagnetic compatibility device?
30 | August 2011 Embedded Computing Design Resource Guide www.embedded-computing.com interoperability across a majority of devices. For example, USB, RS-232, Bluetooth, and proprietary wired and wireless protocols are all in widespread use today.
Some organizations such as the Continua Health Alliance and American Telemedicine Association are working hard to create and support wireless medical communications standards. However, until ubiquitous standards become widely adopted, this will remain a challenging area for any in-home telehealth device, sensors and gateways alike. Figure 1 | An in-home telehealth device should be developed with security, both perceived and actual, Low power in mind. As wireless radios and the software that enables them become less power-hungry, it will open doors to new use cases. With BENSON: In terms of patient care, the most important consid- smaller batteries, longer battery life, lighter weight devices, erations are usability and cost. and better overall performance, users will be more apt to carry a sensor like a wireless portable blood glucose monitor around Usability with them all day instead of leaving it at home. Semiconductor Many users of in-home telehealth devices are elderly and perhaps fabrication technology, digital and analog circuit design, and not tech-savvy. In addition, users might have cognitive impair- software integration all have a part to play in the future develop- ments, difficulty hearing, poor sight, or trouble using fine motor ment of lower-power wireless medical devices. skills to navigate complicated touch-screen user interfaces. ECD: How can designers select the most appropriate For these reasons and many others, usability is becoming more wireless technologies and gain rapid FDA approval for their important. In fact, the FDA is showing a growing interest in the telehealth device designs? human factors of medical devices as key device design elements. The FDA recognizes that even though a device might be bullet- BENSON: Follow the FDA’s RF guidance as closely as proof from a technical perspective, usability issues can cause possible throughout the entire design process. Pay special confusion and increase the probability of errors. attention to the items the FDA considers particularly critical to the safe and effective use of wireless technology: wireless The general approach for success here is to follow a user-centered coexistence, performance, data integrity, security, and electro- design approach that is empathetic and nonassuming. magnetic compatibility.
Cost In addition to following the FDA’s guidance documents closely, As health care insurance providers evolve their position on reim- choosing commercial off-the-shelf technologies, managing and bursement for in-home telehealth products, some devices might mitigating RF risk throughout the entire program, and paying not yet have assigned reimbursement codes. When a patient pays special attention to security issues that have the potential to cause for a device, the cost of a device can be a sensitive issue, and accidental exposure of sensitive data can help designers acceler- its perceived value is eminently critical. Although device cost is ate approvals. always important from a business and profit-margin perspective, in this case it is acutely important when the patient is paying for Mark D. Benson is the director of software strategy at the device out of pocket. Logic PD, where he leads product software development, championing the software aspects of the technology roadmap ECD: What wireless technology advancements are needed and setting the overall software strategy for the company. to improve telehealth systems? Mark has led multidiscipline teams in developing advanced embedded designs for the industrial, medical, aerospace, BENSON: Two important areas for improvement are standards military, and consumer industries. Mark holds a BS in and low power. Computer Science from Bethel University and an MS in Software Engineering from the University of Minnesota. Standards There are many brands and models of in-home telemonitoring Logic PD sensors, including blood pressure cuffs, weight scales, pulse 612-436-5115 oximeters, and blood glucose monitors. Unfortunately for the [email protected] designers of base stations or gateway devices that collect and www.linkedin.com/in/markbenson relay data, the telemonitoring sensor market is fragmented Twitter: @markbenson and there is no clear wireless standard for achieving true www.logicpd.com www.embedded-computing.com Embedded Computing Design Resource Guide August 2011 | 31 Fostering an ecosystem of support Q & A Q&A with Chuck Kostalnick, Senior VP, Avnet Embedded Strategies
Facing the pressure of getting products with more features to market faster than ever before, OEMs are seeking partners who can help them meet performance requirements and cut development costs. Chuck highlights the need for comprehensive development support including integration services and emphasizes the value of educational advancement.
ECD: As a major component supplier to OEMs, what holding Speedway seminars throughout North America and new or changing trends have you identified in the embedded Europe focusing on the Nano-ITX/Spartan-6 Development Kit. marketplace? During these workshops, designers learn how to develop Microsoft Windows Embedded images optimized to take advantage of the KOSTALNICK: Within the embedded space we’re seeing features in the Intel Atom E600 series and Xilinx Spartan-6 series more OEMs looking for COTS products to help avoid the costs FPGA. Engineers leave the workshop able to develop custom I/O associated with board layout, manufacturing, and the life-cycle in their embedded applications via the FPGA while simultane- management of discrete components. In addition, OEMs want ously leveraging the robust Windows software libraries. reduced footprints (shrinking the physical size of board and/or reduced component counts), coupled with lower power require- Our On-Ramp technical sessions feature live, solutions-oriented ments and improved thermal management. presentations and demonstrations conducted by Avnet subject matter experts at the participants’ offices. These technical Beyond hardware development, we’re also seeing more customers sessions typically focus on new products from an Avnet supplier looking for a complete ecosystem of support for their applica- and are facilitated by an Avnet field applications engineer. tions – specifically, supply-chain support, integration services, and post-sales support, including reverse logistics. Another area The Behind the Wheel seminars are available free of charge at of support our customers look for is flexibility. This flexibility www.AvnetOnDemand.com. We also recently teamed up with includes a portfolio of processing solutions (x86, ARM, MIPS, Digital Signage Today and Intel to produce a webinar titled, and so on), form factors, technologies, and integration for not “Choosing the Right Platform to Power Your Digital Signage.” only complete system builds, but also the ability to match SBCs Running through the end of 2011, this webinar teaches design with LCD displays, touch screens, and storage. engineers how to choose the right platform to power their content, covering requirements for everything from low-end applica- We’re also seeing a rise in requests for combinations of hardware, tions with static images all the way up to high-end deployments software, remote content management, installation, and repair with streaming HD video and anonymous analytics, as well as for digital signage applications. everything in between. The discussion also includes a high-level overview of platforms based on market and a look at typical ECD: Avnet offers a free seminar series on solid-state applications such as digital menu boards, retail, point-of-sale, drives. What other educational opportunities do you provide and advertising. for embedded designers? All of Avnet’s technical training offerings can be accessed at KOSTALNICK: One of the biggest values any distributor can www.em.avnet.com/embedded. bring to their customers is access to technical education. Avnet’s technical training offerings are segmented into the following ECD: Give us an example of how an embedded device three types: Speedway Design Workshops, On-Ramps, and manufacturer utilized Avnet’s integration services. Behind the Wheel webinars. KOSTALNICK: Send A Message, Inc. (SAM), a hospitality Speedways are daylong, hands-on workshops taught by Avnet kiosk manufacturer, approached Avnet in June 2010 seeking what technical experts covering a range of technologies. We just many embedded device manufacturers are looking for: integrated concluded the solid-state drive seminars and trained nearly components that not only meet their price/performance require- 200 engineers in six cities around North America. We’re currently ments, but also interface properly with their proprietary software.
32 | August 2011 Embedded Computing Design Resource Guide www.embedded-computing.com Avnet Embedded worked with SAM to source embedded boards, interactive LCD touch screens, and hardware to power the com- pany’s digital postcard kiosks and Lobby EDGE (Elite Digital Guest Experience) kiosks, shown in Figure 1.
[Figure 1 | Avnet engineers identified components that would work together effectively to meet the system requirements for SAM’s Lobby EDGE kiosk.]
Avnet Embedded was able to meet the demands of SAM in part due to our global integration centers. Avnet currently has five global facilities around the world, with three operating in North America. Each facility is ISO 9001:2000 certified and capable of handling integration needs from PC and server inte- gration to flat-panel display integration, custom enclosures and storage, and display subsystem manufacturing.
[Figure 2 | 250 | center | ECD in 2D: In a demo at ESC Silicon Valley 2011, Avnet shows how its Performance Matched Kits validate the direct connectivity and firmware between an SBC and an LCD. Use your smartphone, scan this code, watch a video: http://opsy.st/j2FZBk. ART]
Chuck Kostalnick is senior VP of Avnet Embedded, where he oversees embedded distribution activity in the Americas. He is a seasoned distribution industry executive with more than 20 years of experience, most recently joining Avnet with the acquisition of Bell Micro, where he served as president of North American distribution.
Avnet Embedded 800-332-8638 www.em.avnet.com
ECD in 2D: In a demo at ESC Silicon Valley 2011, Avnet shows how its Performance Matched Kits validate the direct connectivity and Figure 1 | Avnet engineers identified components that would work together effectively to meet the system firmware between an SBC and an LCD. Use your requirements for SAM’s Lobby EDGE kiosk. smartphone, scan this code, watch a video: http://opsy.st/j2FZBk.
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www.embedded-computing.com Embedded Computing Design Resource Guide August 2011 | 33 Strategies OSGi platform provides Internet-connected secure and real-time services in embedded devices
By Johnson Yan
Although Java has been widely used in enterprise software applications running on high-performance servers and in clients running on PC or mobile devices, its use in secure and real-time embedded systems has been limited. However, several recent developments in Java technology promise to change this, including the emergence of the Open Services Gateway initiative (OSGi) Java-based platform intended for software delivery, remote management, and product life-cycle management of services provided on Internet- connected embedded devices.
OSGi overview and advantages the addition or removal of services and Hard real time provides deterministic The Open Services Gateway initiative adapt accordingly. response (within microseconds) and (OSGi)[1] Alliance is a worldwide guaranteed service. Failure to meet time consortium of technology innovators Due to these advantages, OSGi has become constraints means disaster or loss of life. advancing a proven and mature process the de facto standard for secure and real- Hard real time is necessary for mission- to create open specifications that enable time embedded devices for Internet- critical applications. the modular assembly of software built connected residential gateways, home with Java technology. The OSGi frame- energy management, medical monitoring, Soft real time, on the other hand, provides work is a modular system and service home security, telematics, automotive, and fast average response time without unac- platform for the Java programming lan- process control systems applications. ceptable long pauses or delays. Failure guage that implements a complete and to meet time constraints means degraded dynamic component model, something Requirements for secure and service. Soft real time is required for high that does not exist in stand-alone Java real-time services quality of service, customer satisfaction, Virtual Machine (JVM) environments. Secure and low churn rate. Internet-connected embedded devices Applications or components (coming in are susceptible to viruses, hacking, Size, power, cost the form of bundles for deployment) can and denial-of-service attacks. A secure In addition to being secure and real-time, be remotely installed, started, stopped, embedded device must be immune to Internet-connected embedded devices updated, and uninstalled without requir- these attacks to achieve a high degree of must have low memory footprint, power ing a reboot. Java package/class man- customer satisfaction. consumption, and costs. agement is specified in great detail. Life-cycle management is accomplished Real time Java innovations via APIs that enable management A real-time system can be divided into Several Java innovations help satisfy the policies to be remotely downloaded. A two categories: hard real time and soft aforementioned requirements for secure service registry allows bundles to detect real time. and real-time embedded devices.
34 | August 2011 Embedded Computing Design Resource Guide www.embedded-computing.com Direct Java bytecode execution With direct Java bytecode execution, Java Bytecode Java Bytecode Java Bytecode Java Bytecode the JVM bytecodes are the proces- sor’s instruction set. Their executions JVM are fast and atomic (non-interruptible). JVM JIT Compiler Partial JVM Interpreter Interpreter Interpretation and Just-In-Time (JIT) compilation are not required. This inno- RTOS RTOS RTOS vation allows: Java Direct Execution General CPU General CPU Other Java Silicon Silicon ❯ Fast Java bytecode execution: Interpreter JIT compiler Java execution (60%) Direct execution (100%) No slowdown by interpretation Slow Fast Medium fast Fastest Medium Memory Large Memory Small Memory Smallest Memory or JIT compilation. External OS External OS External OS Embedded OS ❯ Low memory footprint: Interpreter and JIT compilation Figure 1 | Direct Java bytecode execution offers lower memory footprint, adds to the memory requirement. power consumption, and costs compared to traditional JVMs. ❯ Low power consumption: Can use lower clock due to Java threading primitives, deterministic link makes the processor less prone to higher Java performance. threading, a fixed-priority preemptive crashes, hacking, or virus attacks. This ❯ Low cost: No JVM interpreter thread scheduler, and automatic interrupt innovation allows: or JIT compiler license cost. vectoring. Without hardware real-time Java, a dual language platform must be ❯ Hard real time: Standard Figure 1 illustrates the contrast between employed (C for real-time functions and Java programs can use real- direct execution and traditional Java Java for non-real-time functions), result- time features automatically. implementations. ing in high development and maintenance ❯ Low memory footprint: The
[Figure 1 | Direct Java bytecode execution offers lower memory footprint, power consumption, and costs compared to traditional JVMs.] costs to support two programming lan- RTOS is built in and does not Hardware Real-Time Operating guages and environments. The weak link require an external RTOS, which System (RTOS) between C and Java inherent in the dual adds to the memory requirement. Real-time Java is achieved with native language platform is also a key source ❯ Low cost: No external hardware implementation of real-time of security issues. Eliminating this weak RTOS licensing cost.
www.embedded-computing.com Embedded Computing Design Resource Guide August 2011 | 35 Small Form Factors Microcontrollers Microcontrollers Strategies | Silicon | Silicon |
Hardware multiple JVM JVM while a non-real-time Secured Internet-Connected Hardware multiple JVM allows multiple application runs on the other JVM Or NonOr real-time independent JVMs to run independently with fast context switching. Real-Time Non-Real-TimeApplications Applications Applications in one processor with firewalls securely ❯ Low power consumption: separating the applications running on Different power management Linker/ each JVM. This is achieved by hardware policies can run on the two JVMs. JVM 0 ApplicationJVM 1 Builder support for deterministic time slicing and Thread Manager JEMThread Manager memory space slicing among the multiple Figure 2 illustrates hardware multiple Interrupt BuilderInterrupt JVMs. Also, fast JVM context switch- JVM implementation with two JVMs. Timer Fire Timer [Figure 2 | Using hardware multiple JVM, one JVM can run secured or real-time processes while the other runs Internet-connected or non-real-time applications.] Wall ing is achieved with hardware support. Memory for JVM0 Moreover, each independent JVM can Silicon-based implementation be restarted without affecting the other To simplify Java application develop- Memory for JVM1 Memory Protection JVMs. ment and reduce the cost of deploying Global Memory secure and real-time services on Software Semaphore One practical application of this feature embedded systems, designers can use Synchronization is to use two JVMs to enhance security silicon-based Systems-on-Chips (SoCs). Figure 2 | Using hardware multiple by running secured processes in one A cost-effective SoC Java solution JVM, one JVM can run secured or JVM and Internet-connected applications with a built-in RTOS, complete set of real-time processes while the other (exposed to outside threat) on the other. drivers for industry-standard peripher- runs Internet-connected or non- This, along with the elimination of the als and I/O (communication, storage, real-time applications. weak links between C and Java in the networking, security, and so on), and dual language platform, makes the pro- OSGi middleware support allows users growing vertical markets for embedded cessor less prone to crashes, hacking, or to focus on the Java application for fast devices: residential, automotive, and virus attacks. time to market. industrial. This trend is accelerated by the availability of silicon-based OSGi Another useful application is to run one An example of a silicon-based imple- platforms that make economic deploy- JVM for real-time processes and the mentation from aJile Systems is shown ment possible. other JVM for non-real-time processes. in Figure 3. In this implementation, the This approach significantly reduces the SoC incorporates the three major Java References complexity of real-time system design. innovations discussed earlier to enable [1] About the OSGi Service Platform, June 7, 2007: www.osgi.org/wiki/uploads/ This innovation enables: low-cost and low-power deployment of Links/OSGiTechnicalWhitePaper.pdf secure and real-time Internet-connected ❯ Security: Each JVM is applications. Johnson Yan
[Figure 3 | A silicon-based OSGi platform helps decrease the cost of deploying secure and real-time services on embedded systems.] independent and secure from is senior VP of the other. A failed JVM can be OSGi-based deployment of Internet- sales and business restarted without affecting connected embedded applications is development at the other. gaining momentum and acceptance aJile Systems Inc. ❯ Real time: A real-time as a means of providing secure and Prior to joining application can run on one real-time services in the emerging and aJile Systems, he was VP of marketing and business development Java Applications M2M Java Games Phone Customer MPOS at Silicon Motion and founder and Applications Edutainments Applications Applications De facto Industry OSGi CEO of Jaxstream, and held VP Std Java Middleware Application Framework and management positions at Tvia, JME/CLDC/CDC/FP/PBP ATI Technologies, Oak Technologies, TCP/IP Network Stack File System Security MPEG/JPEG Driver Media and Trident Microsystems. Johnson has LAN Driver Wi-Fi Driver AES/DESAE Driver DisplayD Driver CameraC Driver GPIO Driver I2C Driver I2S/AC97I2 Driver SPI Driver UART/IrDAUA Driver a BSEE from the University of Texas Silicon- InterruptI Driver RTC Driver WDT Driver CF/SDIOC Driver USB Driver Based at Austin and a Master’s degree in Silicon-Based OSGi EECS from the University of California JME Platform Platform at Berkeley. He holds four patents in Secure and Real-Time Silicon-Based Java Platform graphics/imaging technology.
Java Direct Execution Hardware Real-Time OS Hardware Multiple JVM aJile Systems Inc. 408-557-8018 Figure 3 | A silicon-based OSGi platform helps decrease the cost of deploying [email protected] secure and real-time services on embedded systems. www.ajile.com
36 | August 2011 Embedded Computing Design Resource Guide www.embedded-computing.com SmartFusion™— an FPGA, hard ARM® Cortex™-M3 and programmable analog on a single chip.
Integrating these technologies time of board-level changes. With on a single platform gives you the SmartFusion you can essentially freedom and flexibility to continually create a microcontroller customized push your design further. Now you to the application rather than can optimize hardware/software compromising with a processor tradeoffs at any point in development that might fall short of your vision. without incurring the cost and added So go ahead and design fearlessly. © 2011 Microsemi Corporation. All rights reserved.
www.microsemi.com/soc 2011 Resource Guide PROFILE INDEX Advertiser Category Page Advertiser Category Page
AAEON Electronics, Inc. Small form factors 80 Kontron PICMG 77 Aaeon Systems Inc. Systems 56 Kontron Small form factors 82 Aaeon Systems Inc. Systems 57 Kontron VITA 95 ACCES I/O Products, Inc. Systems 57 Kontron VITA 96 ACCES I/O Products, Inc. Small form factors 81 Memoright Corporation Storage 55 Annapolis Micro Systems, Inc. EDA 48 Mercury Computer Systems, Inc. VITA 96 Annapolis Micro Systems, Inc. Mezzanines 65 Mercury Computer Systems, Inc. VITA 97 Annapolis Micro Systems, Inc. Mezzanines 66 Mercury Computer Systems, Inc. VITA 98 Annapolis Micro Systems, Inc. Mezzanines 67 Mercury Computer Systems, Inc. VITA 101 Annapolis Micro Systems, Inc. Mezzanines 68 MKS, a PTC Company Development aids 46 Annapolis Micro Systems, Inc. Mezzanines 69 MontaVista Operating systems 50 Annapolis Micro Systems, Inc. Mezzanines 70 MSI (Micro-Star INT’L Co., LTD.) Systems 62 Annapolis Micro Systems, Inc. Mezzanines 71 MSI (Micro-Star INT’L Co., LTD.) Small form factors 83 Annapolis Micro Systems, Inc. Motherboards, blades, slot cards 72 Onyx Healthcare Inc. Systems 62 Annapolis Micro Systems, Inc. Motherboards, blades, slot cards 73 Radian Heatsinks Processing and logic 43 Annapolis Micro Systems, Inc. PICMG 74 RadiSys Corporation Small form factors, Systems 83 Annapolis Micro Systems, Inc. VITA 90 RunCore Co., Ltd. Storage 53 Annapolis Micro Systems, Inc. VITA 91 Saelig Company, Inc. Development aids 41 ATP Electronics Storage 52 Scan Engineering Telecom GmbH PICMG 77 ATP Electronics Storage 53 Scan Engineering Telecom GmbH PICMG 78 Avalue Technology Inc. Systems 58 Schroff PICMG 79 Avnet Embedded Development aids 39 Schroff VITA 99 AXIOMTEK Systems 58 Sealevel Systems, Incorporated Systems 63 BittWare PICMG 75 Skelmir, LLC App enablers 49 BittWare VITA 92 Synopsys, Inc. Development aids 42 Byte Paradigm sprl Development aids 41 Synopsys, Inc. Development aids 47 CES Creative Electronic Systems VITA 92 SYSGO Operating systems 51 EMAC, Inc. Systems 59 Technologic Systems Small form factors 84 EMAC, Inc. Small form factors 81 Technologic Systems Small form factors 85 Emerson Network Power Design services 52 Vector Electronics & Technology, Inc. VITA 100 Emerson Network Power Systems 59 VersaLogic Corp. Small form factors 86 Excalibur Systems Systems 60 VIA Technologies Systems 64 Hartmann Electronic Systems 61 VIA Technologies Small form factors 86 Hilscher North America Inc. Processing and logic 43 VIA Technologies Small form factors 87 Hilscher North America Inc. Systems 61 WinSystems, Inc. Storage 56 Imagination Technologies Development aids 40 WinSystems, Inc. Systems 64 INNODISK USA CORPORATION Storage 54 WinSystems, Inc. Small form factors 88 Innovative Integration VITA 93 WinSystems, Inc. Small form factors 89 Innovative Integration VITA 94 Xilinx, Inc. Processing and logic 44 Kontron PICMG 75 Xilinx, Inc. Processing and logic 45 Kontron PICMG 76 Xilinx, Inc. EDA 49
38 | August 2011 Embedded Computing Design Resource Guide www.embedded-computing.com Development aids: Development kits Silicon | Avnet Embedded 4UI4USFFUt1IPFOJY "; www.em.avnet.com/embeddedpmh
Performance Matched Kits Embedded Computing Design Resource Guide OVERVIEW Introduced earlier this year at Embedded Systems Conference in San Jose, CA, Avnet’s Performance Matched Kits take the guess- work out of hardware compatibility, pairing Single Board Computers (SBCs) with Liquid Crystal Display (LCD) screens. Each base kit within the Performance Matched Kits portfolio has a single part number for easy ordering and is plug-and-play compatible, straight out of the box. Avnet’s technical team fully validates the interoperability of the products, eliminating the need for the customer to perform validation through trial and error or through time-consuming datasheet matching.
Add-ons or enhancements to existing kits can include touch sensors, storage, memory, power supplies and operating systems. Avnet Embedded also offers many LCD visual enhancement services such as optical bonding of touch sensors or protective materials to LCDs, LCD passive enhancement to increase brightness, reduced refl ec- tion, infrared blocking, Electromagnetic Interference (EMI) shields, privacy fi lms, as well as enhancements such as high-brightness FEATURES LED backlighting systems. i Emerson Network Power MITX-440 Mini-ITX Motherboard i Designed for use in a variety of applications such as point-of-sale Emerson Network Power Mini-ITX SBC with a Sharp 15" TFT LCD or terminals, intelligent kiosks, ATMs, audio visual display systems NEC 10.4" TFT LCD Now Available! and other applications that require an easy-to-use Mini-ITX motherboard with support for a variety of operating systems
® ™ " i Intel Atom processor D510-based Mini-ITX board offers improved Sharp 15 TFT LCD processing and graphics performance t Part number: LQ150X1LG71 i Size format of 170 mm x 170 mm t High contrast at 550:1 t LVDS interfacing i Up to 4 GB DDR2 memory, onboard USB fl ash option t Wide storage specs (-25 °C to +60 °C) i Gigabit Ethernet, SATA and USB ports t Wide operating specs (0 °C to +60 °C) i PCI Express® x1 and PCI Express Mini Card socket t 18-bit (262 K) or 24-bit (16.7 M) colors i Dual display support t Long life CCFL backlighting i Six serial ports t RoHS compliant t Sharp long life availability i Wide range of built-in connectivity, including LCD and/or CRT displays i Available with a Sharp 15" TFT LCD or NEC 10.4" TFT LCD NEC 10.4" TFT LCD t Part number: NL10276BC20-18 t High brightness t LVDS interfacing t Wide storage specs (-20 °C to +70 °C) t Wide operating specs (-30 °C to +80 °C) t 18-bit (262 K) or 24-bit (16.7 M) colors t White LED backlighting t Long life LED backlighting t Low power, 4.8 Watts at full brightness t NEC long life availability t Avnet High Brightness LED Services http://www.youtube.com/watch?v=jbRtfWBJ7qw
For more information, contact: [email protected] www.embedded-computing.com/p52933 www.embedded-computing.com Embedded Computing Design Resource Guide August 2011 | 39 Development aids: Reference designs Imagination Technologies )PNF1BSL&TUBUFt,JOHT-BOHMFZ )FSUTGPSETIJSF 8%-; 6, www.imgtec.com
| Silicon Meta HTP221-dp2 ’MiniMorph’ The Meta HTP221-dp2 ‘MiniMorph’ is a simple and convenient board-level system based on the Xenif TZ1090 SoC from Toumaz Technologies, which uses Imagination’s Meta HTP 32-bit hardware multi-threaded RISC and DSP CPU core and two Ensigma UCCP310 multi-standard communications IP cores.
The Meta HTP221-dp2 development platform includes compre- hensive tools and peripherals that enable project development on leading-edge embedded technology that has shipped in millions of products worldwide.
Measuring just 10cm x 10cm, the board comes with with full docu- mentation and comprehensive tools. Integrated on-chip Wi-Fi with RF on-board make the platform suitable for developing a wide range of Internet-connected devices.
A rich set of interfaces and peripherals including SD, HDMI and FEATURES USB, plus connections for a range of TV or radio tuners (requires i 400MHz (500MHz planned), Meta HTP221 32-bit, dual (GP and DSP) thread processor custom hardware) make this one of the most powerful and fl ex- ible development systems for multimedia and Internet-connected i Linux OS (RTOS on request) embedded solutions. i Two Ensigma UCCP310 communications processors support simultaneous Wi-Fi and TV/radio demodulation (requires custom hardware, not included) INCLUDED SOFTWARE AND TOOLS Embedded Computing Design Resource Guide i 2D graphics and display controller that supports up to 1024 x 768 Meta Linux SDK XGA TFT display Meta Linux is a port of the latest open source Linux OS for Meta pro- i High quality audio subsystem with integrated headphone amplifi ers, cessors. It enables developers to access both the wealth of application multiple digital audio inputs and outputs – better than 96dB and device support available for Linux-based systems and the real-time throughout and Class D output 32-bit DSP capabilities of the Meta processor. i USB 2.0 OTG interface i IQ ADC for TV and radio tuners, plus on-board WLAN AFE CODESCAPE Debugger i Multiple analog/digital audio inputs/outputs Imagination’s comprehensive debugger with full GCC support is included. Debugging is accessed via the USB interface. i UART, SPI, SDIO, SD Card, I2S, I2C, transport stream i Support for 802.11abgei Wi-Fi Advanced Audio Framework i Optional baseband support available for the following standards The Meta Advanced Audio Framework (AAF) is a collection of highly – contact Imagination for further details (needs custom hardware optimized implementations of the most widely used audio codecs and tuner, not supplied): DAB, DAB+, DMB-R and FM-RDS radio, T-DMB, post-processing effects, tuned to run effi ciently on Meta DSP threads DVB-H, DVB-T, ISDB-T 1-Seg, ISDB-T 3-Seg, ISDB-T 13-Seg and and presented in a simple framework using component-based stream ATSC TV construction. Imagination Technologies is a global leader in multimedia and Flow Connectivity Technology communication technologies that creates and licenses market-leading multimedia IP cores for graphics, video, and display processing, Included is Imagination’s innovative Flow technology, a complete cloud multi-threaded embedded processing/DSP cores and multi-standard and client connectivity solution. A full set of APIs is included, plus communications and connectivity processors. These silicon IP access to the FlowWorld web portal and services from the growing Flow solutions for SoCs are complemented by platform level IP and services, ecosystem. a strong array of software tools and drivers and extensive developer and middleware ecosystems. Target markets include mobile phone, Tutorials and Examples handheld multimedia, home consumer entertainment, mobile and Working tutorials, documentation and examples are provided to low-power computing, and in-car electronics. Licensees include many of the leading semiconductor and consumer electronics companies. familiarize developers with Meta’s architecture and DSP features.
For more information, contact: [email protected] www.embedded-computing.com/p52926
40 | August 2011 Embedded Computing Design Resource Guide www.embedded-computing.com Development aids: Scopes, analyzers, meters Silicon | Saelig Company, Inc. %1JUUTGPSE7JDUPS3PBEt1JUUTGPSE /: 5PMM'SFF www.saelig.com/ds1052e
Rigol Technologies DS1052E 50 MHz 2-Ch Digital Oscilloscope Embedded Computing Design Resource Guide The DS1052E Digital Oscilloscope sets a new standard for tech- nology and capability. With features including 1 million points of deep memory, FFTs, record and replay, roll mode, alternate trigger mode, adjustable trigger sensitivity and PictBridge printing, the DS1052E is the new bench standard.
Since the Rigol DS1052E was named Product of the Year by Electronic Products Magazine in 2008, sales have been skyrocketing and Rigol has become known for offering high-end features at a low-end FEATURES price. Here are some of the reasons you can buy this oscilloscope i 2 analog channels + external trigger from Saelig Company with confi dence: i 1 million-point deep memory i Bandwidth: 50MHz, 1 GSa/sec max sample rate t The DS1052E is the most often evaluated oscilloscope in its class i 5.7" TFT with 64K color LCD backlit display t It gets overwhelmingly positive marks in every evaluation The web abounds with glowing DS1052E testimonials, video reviews i Trigger modes: edge, pulse width, slope, video, pattern, continuous t time and alternate t and blog posts t The assurance of Saelig’s friendly customer service and free USA i Direct print to PictBridge compatible printers via USB device t ground shipping from stock interface i Compact design to save your desktop space Saelig is a USA authorized distributor for Rigol Technologies’ i Waveform intensity – adjustable waveform intensity provides a products. The DS1052E is currently on sale for only $399 – you save personalized waveform display $120! i Comes with a free Saelig equipment bag and 3 year warranty!
For more information, contact: [email protected] www.embedded-computing.com/p52813
Development aids: HW debug tools Byte Paradigm sprl $IBVTTFFEF/BNVS CUF #t5IJOFT #FMHJVN +32 (0) 67 34 28 94 www.byteparadigm.com USA Authorized Distributor, Saelig Co.twww.saelig.com SPI Storm – Serial Protocol Host Adapter USB SPI Host Adapter with support of dual-, quad- and custom- serial protocol. SPI Storm is capable of accessing FPGA, ASIC, SoC and other digital embedded systems that use serial protocols up to 100 MHz. Protocols can be chosen from a library that includes: SPI (Serial Peripheral Interface), variants of SPI in 3 wires, and for the fi rst time, dual- and quad-SPI protocols. Alternatively, SPI Storm Studio software allows defi ning custom interfaces, including protocols requiring bi-directional and open-drain signal lines. FEATURES Serial protocols are common in embedded systems that use FPGA, i Support of SPI, 3-wires SPI, dual-SPI and quad-SPI as a master ASIC, SoC, fl ash memories, DAC, ADC, etc. They are preferred over i User-defi nable protocol up to 100 MHz larger bus topologies for chip-to-chip communications because i Bi-directional and open drain signal support they save on I/O pins, minimize board layout efforts and ensure i 8-bit GPO (General Purpose Output) for cycle-accurate digital pattern generation better signal integrity. With increased fl exibility and performance, i 32 MB total memory SPI Storm Host Adapter is a convenient tool for register access, system debug through serial protocols, memory programming, and i USB 2.0 PC interface for control and power supply system stimulation through standard and custom chip-to-chip serial i Delivered with SPI Storm Studio software, including C DLL for inte- gration in user environment interfaces.
For more information, contact: [email protected] www.embedded-computing.com/p52812 www.embedded-computing.com Embedded Computing Design Resource Guide August 2011 | 41 Development aids: Virtualization Synopsys, Inc. &.JEEMFGJFME3Et.PVOUBJO7JFX $" TMTJOGP!TZOPQTZTDPN www.synopsys.com/Systems/ArchitectureDesign
| Silicon Platform Architect Multicore Optimization Technology To predict the dynamic system performance of multi-function SoC architectures, system-level simulation and performance analysis must be done earlier in the design cycle. While traditional spread- sheets are good for aggregating data, static spreadsheet calculations are not accurate enough to estimate performance and make design decisions. Risks include over-design, under-design, cost increases, schedule delays and re-spins.
Synopsys’ Platform Architect with Multicore Optimization Technology (MCO) provides architects and system designers with SystemC transaction-level modeling (TLM) tools and methods for the effi cient design, performance analysis and optimization of multicore SoC architectures.
Platform Architect enables system designers to explore and optimize the hardware-software partitioning and the confi guration of the SoC infrastructure, specifi cally the global interconnect and memory subsystem, to achieve the right system performance and cost. Using this technology, designers can explore hundreds of alternatives at a time. Its effi cient turnaround time, powerful analysis views, and FEATURES available IP models make Platform Architect the premier choice i Broadest commercially available portfolio of pre-instrumented for system-level performance analysis and optimization of ARM SystemC TLM IP models for architecture exploration and validation, AMBA®-based SoCs. including: traffi c generators, interconnect models, memory Embedded Computing Design Resource Guide controller models, and processor models Highlights i Application task analysis for early optimization of multicore t )BSEXBSFTPGUXBSFQBSUJUJPOJOHBOEPQUJNJ[BUJPOPGNVMUJDPSF systems systems i Model debugging using TLM port transaction tracing and analysis t 4P$JOUFSDPOOFDUNFNPSZTVCTZTUFNQFSGPSNBODFPQUJNJ[BUJPO i Sensitivity analysis using pivot charts to aggregate and explore t &GmDJFOUFYQMPSBUJPOVTJOHUSBGmDHFOFSBUJPODZDMFBDDVSBUF results TLM interconnect models i &YUFOTJWFTFUPGQFSGPSNBODFBOBMZTJTWJFXTUPNFBTVSFMBUFODZ t %FUBJMFESPPUDBVTFBOBMZTJTUPJEFOUJGZQFSGPSNBODFCPUUMFOFDLT throughput, utilization, and effi ciency as well as poor utilization of resources i Ability to combine hardware and software analysis for performance t )BSEXBSFTPGUXBSFWBMJEBUJPOVTJOHDZDMFBDDVSBUF5-. validation processor models i *&&&4ZTUFN$5-.TUBOEBSETCBTFEFOWJSPONFOU t 4FBNMFTTSFmOFNFOUGSPNFBSMZBSDIJUFDUVSFBOBMZTJTXJUI i CoStart methodology guidelines and examples as well as CoStart workload models to fully cycle accurate virtual prototypes to &OBCMFNFOU4FSWJDFT validate early design decisions t 'BTUUVSOBSPVOEUJNFTJODFUIFBSDIJUFDUVSFBOBMZTJT environment can be set up within days, allowing the rapid exploration of hundreds of design alternatives
Using Platform Architect, system architects and designers can expect measurable improvements in product performance and a reduction in schedule risk by fi fty percent versus traditional meth- ods. Platform Architect is a production-proven solution used by MFBEJOHTZTUFNT0&.TBOETFNJDPOEVDUPSDPNQBOJFTXPSMEXJEF
For more information, contact: [email protected] www.embedded-computing.com/p52952
42 | August 2011 Embedded Computing Design Resource Guide www.embedded-computing.com Processing and logic: Network/communication processors Silicon | Hilscher North America Inc. 8BSSFOWJMMF3PBE 4VJUFt-JTMF *- www.hilscher.com
netX Network Controller Embedded Computing Design Resource Guide 5IF )JMTDIFS GBNJMZ PG OFU9 OFUXPSL DPOUSPMMFS NPEVMFT PGGFST intelligent solutions that support all popular fi eldbus and real-time &UIFSOFU TZTUFNT XJUI B TJOHMF DIJQ 5IF JOOPWBUJWF iOFUXPS9 PO chip” design reduces part count and eliminates network mainte- nance costs without sacrifi cing performance.
8JUI GPVS DPOmHVSBCMF OFUXPSL DPNNVOJDBUJPOT DIBOOFMT OFU9 can support multiple communications protocols simultaneously. It FEATURES can be used as a network coprocessor with a standard dual-port i 4 confi gurable communication channels memory interface, or as a highly integrated single-chip solution for i Masters and slaves your custom control solution. i "MMTUBDLTGSPN)JMTDIFS i One platform for all networks i 3FBMUJNF &UIFSOFU OFUXPSLT TVQQPSUFE JODMVEF &UIFS/FU*1 (VBSBOUFFEZFBSBWBJMBCJMJUZ i CJU.)["3.XJUI.*1TDPNQVUJOHQPXFS 130'*/&5 &UIFS$"5 4&3$04 *** &UIFSOFU 108&3-*/, BOE i *OUFHSBUFE&UIFSOFUIVCBOETXJUDIGVODUJPOT .PECVT5$1'JFMECVTFTTVQQPSUFEJODMVEF%FWJDF/&5 130'*#64 i *&&&DMPDL $"/PQFO $$-JOLBOE"4*OUFSGBDF i %VBMQPSUNFNPSZ
i "%DPOWFSUFS i #VJMUJO*0
For more information, contact: [email protected] www.embedded-computing.com/p52945
Processing and logic: Heat sinks Radian Heatsinks 8BMTI"WFOVFt4BOUB$MBSB $" www.radianheatsinks.com Meet Your Time-to-Market Goals with Radian’s Full-service Thermal Solutions.
3BEJBO)FBUTJOLTQSPWJEFTWBMVFBEEFEUIFSNBMEFTJHOTPMVUJPOT for the advanced microelectronics and components industries worldwide. We are a division of Intricast Company, Inc., which has supplied quality custom metal components to a variety of industries TJODF
Radian is located in Santa Clara, California, to provide customers with a dedicated domestic facility for immediate prototypes and FEATURES short-run production. Our offshore subsidiary provides world class i &YUFOTJWF$BUBMPHPG4UBOEBSE)FBUTJOLT products and pricing for higher volume designs. i $VTUPN)FBUTJOL%FTJHOBOE.BOVGBDUVSJOH i 5IFSNBM4JNVMBUJPOT6TJOH$'%ø i )FBU1JQFTBOE7BQPS$IBNCFST i &YUSVTJPO %JF$BTUJOH 4UBNQJOH 'PSHJOH 4LJWJOH BOE.BDIJOJOHø i BGA Clip Attachment, Pushpins, Captive Spring-Loaded Screws and Other Types of Attachments
For more information, contact: [email protected] www.embedded-computing.com/p53038 www.embedded-computing.com Embedded Computing Design Resource Guide August 2011 | 43 Processing and logic: FPGAs Xilinx, Inc. -PHJD%SJWFt4BO+PTF $" www.xilinx.com
| Silicon Xilinx 7 Series FPGAs Xilinx® 7 Series FPGAs comprise three new FPGA families that address the complete range of system requirements ranging from small form factor, cost- sensitive, high-volume applications to ultra high bandwidth, logic capac- ity, connectivity, and signal processing capability for the most demanding high-performance applications. The 7 Series devices are the programmable silicon foundation for Targeted Design Platforms that enable designers to focus on innovation from the outset of their development cycle. The 7 Series FEATURES FPGAs include: i Advanced, high-performance FPGA logic based on 6-input lookup table (LUT) technology confi gurable as distributed memory. ™-7 Family: Optimized for lowest cost and power with small form t "SUJY i 36 Kb dual-port block RAM with built-in FIFO logic for on-chip data factor packaging for the highest volume applications. buffering. ™ t ,JOUFY -7 Family: Optimized for best price-performance with a 2X i High-performance SelectIO™ technology with support for DDR3 improvement compared to previous generation FPGAs. interfaces up to 1,866 Mb/s. t 7JSUFY®-7 Family: Optimized for highest system performance and i High-speed serial connectivity with built-in multi-gigabit transceivers capacity with a 2X improvement over previous generation FPGAs. that support from 500 Mb/s to maximum rates of up to 28.05 Gb/s, and offer a special low-power mode optimized for chip-to-chip interfaces. Built on a state-of-the-art, high-performance, low-power (HPL), 28 nm, high-k i Dual 12-bit, 1 MSps general purpose Analog-to-Digital converters metal gate (HKMG) process technology, 7 Series FPGAs enable an unpar- (XADC) with on-chip temperature and power supply sensors. alleled increase in system performance with 2.7 Tb/s of I/O bandwidth, i DSP slices with 25 x 18 multiplier, 48-bit accumulator, and pre-adder for 2 million logic cell capacity, and 5.1 TMACS DSP while consuming 50% less high-performance fi ltering, including symmetric coeffi cient fi ltering. i Powerful clock management tiles (CMTs), combining phase-locked loop power than previous generation devices to offer a fully programmable alter- (PLL) and mixed-mode clock manager (MMCM) blocks for high precision native to ASSPs and ASICs. and low jitter.
For more information, contact: [email protected] www.embedded-computing.com/p53039
Processing and logic: FPGAs Embedded Computing Design Resource Guide Xilinx, Inc. -PHJD%SJWFt4BO+PTF $" www.xilinx.com
Xilinx Spartan-6 FPGAs for Low Power and High-Speed Connectivity The Xilinx Spartan®-6 FPGA family offers an optimal balance of cost, power, and performance for consumer, automotive, surveillance, wireless, and cost/power-sensitive applications. Built for connec- tivity and low power, Spartan-6 FPGAs provide the programmable foundation for Xilinx Targeted Design Platforms that accelerate innovation and improve differentiation of next-generation electron- ics products. FEATURES i Spartan-6 LX FPGAs optimized for absolute lowest cost, with up to System developers can meet the demand for new features while 150K logic density, 4.8 Mb memory, integrated memory controllers, and easy-to-use, high-performance system IP including DSP blocks reducing system costs by up to half for lower-power, “greener” prod- i Spartan-6 LXT FPGAs optimized for lowest risk and lowest cost ucts. A rich selection of built-in system-level blocks – including DSP serial connectivity solution, with up to eight 3.2 Gbps GTP slices, high-speed transceivers, and PCI Express® interface cores transceivers and embedded PCI Express-compatible core – enable greater system-level integration. Spartan-6 FPGAs bring i Performance and fl exibility to meet changing consumer 65 percent lower power than previous Spartan families, with inno- requirements of automotive infotainment applications i Cost-effective alternative to ASICs for rapid development vations in advanced power management technology and a lower- of consumer products, such as fl at panel displays, within power 1.0 V core option. In addition, fast, fl exible I/O deliver over ever-shrinking product life cycles 12 Gbps memory access bandwidth with 3.3 V compatibility and i Ideal for video surveillance with standard- and high-defi nition RoHS-compliant Pb-free packaging. resolution image processing, video analytics, and multi-channel video encoding for fast, effi cient transmission
For more information, contact: [email protected] www.embedded-computing.com/p42301
44 | August 2011 Embedded Computing Design Resource Guide www.embedded-computing.com Processing and logic: FPGAs Silicon | Xilinx, Inc. -PHJD%SJWFt4BO+PTF $" www.xilinx.com
™ Zynq -7000 Extensible Processing Platform (EPP) Embedded Computing Design Resource Guide The Zynq™-7000 family is Xilinx’s fi rst Extensible Processing Platform (EPP). This new class of product combines an industry-standard ARM® dual-core Cortex™-A9 MPCore™ processing system with Xilinx 28 nm unifi ed program- mable logic architecture. This processor-centric architecture offers the fl exibility and scalability of an FPGA combined with ASIC-like performance and power, plus the ease of use of an ASSP. FEATURES i Dual ARM Cortex™-A9 MPCore The four devices of the Zynq-7000 EPP family allow designers to target cost i Unifi ed 512 kB L2 cache sensitive as well as high-performance applications from a single platform i 256 kB on-chip memory using industry-standard tools. The tight integration of the processing system i DDR3, DDR2, and LPDDR2 Dynamic Memory Controller with programmable logic allows designers to build accelerators and i 2x QSPI, NAND Flash, and NOR Flash Memory Controller peripherals to speed key functions by up to 10x. The ARM architecture and i 2x USB 2.0 (OTG), 2x GbE, 2x CAN, 2x SD/SDIO, 2x UART, 2x SPI, 2x I2C ecosystem maximizes productivity and eases development for software i AES & SHA 256b encryption engine for secure boot and secure confi guration and hardware developers. i Dual 12-bit, 1MSps Analog-to-Digital converter; up to 17 inputs i Advanced low power 28 nm programmable logic: Unlike ASICs and ASSPs, Zynq-7000 devices allow designers to modify – 28K to 235K logic cells (430K to 3.5M of equivalent ASIC gates) their design throughout the development phase and after the system is – 240 kB to 1.86 MB of Extensible Block RAM in production. In addition, the Zynq-7000 EPP family, with over 3000 inter- – 80 to 760 18x25 DSP slices (58 to 912 GMACS peak DSP performance) connections between its processing system and the programmable logic, i PCI Express® Gen2x8 (in largest devices) offers levels of performance that two-chip solutions (ASSP+FPGA) cannot i 154 to 404 user I/O (multiplexed + SelectIO™) match due to limited I/O bandwidth and limited power budgets. i 4 to 12 12.5 Gbps transceivers (in largest devices)
For more information, contact: [email protected] www.embedded-computing.com/p53041
Processing and logic: FPGAs Xilinx, Inc. -PHJD%SJWFt4BO+PTF $" www.xilinx.com
ISE® Design Suite 13 ISE® Design Suite 13 maximizes productivity by leveraging open industry standards to accelerate design creation, verifi cation, implementation, and lower system power for design teams target- ing Xilinx FPGAs and Extensible Processing Platforms. New to the award-winning design tool and IP suite are enhancements that improve productivity across SoC design teams, including the pro- gression towards true plug-and-play IP targeting Spartan-6, Virtex-6 and 7 series FPGAs, including the industry-leading 2-million-logic- cell Virtex-7 2000T device.
FEATURES i Plug-and-Play IP – The new AMBA® 4 AXI-4 interconnect protocol IP enables design teams to easily customize their system topology for either performance or area, resulting in optimal system bandwidth for interconnect and memory interfaces. i Accelerated Verifi cation – Leveraging Xilinx’s large portfolio of development boards, kits, and Xilinx’s ISE Simulator new hardware Co-Simulation, verifi cation engineers can test implemented blocks of the design while leaving blocks under development in the simulator, accelerating overall verifi cation by up to 100 times faster than native simulation. i Design Analysis – PlanAhead accelerates time to production with an integrated front-to-back environment with design analysis at each phase of the design cycle – RTL development, IP integration, verifi cation, synthesis, place, and route. The end result is rapid convergence on power consumption, resource utilization, and performance with fewer time-consuming design iterations. i Team Design – The new team design methodology addresses the challenge of multiple engineers working on a single project by providing a methodology for groups of developers to work in parallel. i Enhanced Optimizations – Advanced optimizations, including intelligent clock gating that provides up to 30 percent dynamic power reduction, facilitates faster timing closure and timing preservation, increasing overall productivity and reducing design iterations.
For more information, contact: [email protected] www.embedded-computing.com/p53040 www.embedded-computing.com Embedded Computing Design Resource Guide August 2011 | 45 Development aids: Software development kits, libraries MKS, a PTC Company 4PVUI.FZFST3PBE 4VJUFt0BLCPPL5FSSBDF *- www.mks.com
Integrity Integrity, a PTC product (formerly MKS Integrity), accelerates | Software software innovation through managing the software system lifecycle management process by connecting all engineering artifacts, including requirements, models, code and test, ensuring comprehensive lifecycle traceability. Engineering teams improve productivity, which ultimately drives more innovative products into the market.
Integrity’s open architecture integrates disparate tools into a streamlined engineering process, allowing orchestration of engi- neering change and collaboration across the technology supply chain. '&"563&4 A totally unique product for companies looking to improve their competitiveness in the market, Integrity offers organizations: i Disciplines: Integrity offers deep and rich func tionality to support all of the traditional disciplines across the software system management lifecycle, including: Change Control, Confi guration t&OHJOFFSJOHBSUJGBDUPSDIFTUSBUJPO Management, Require ments Management, Test & Quality t$PNQMFUFFDPTZTUFNJOUFHSBUJPO Man agement, Source Code Management, Build/Release/ Deployment Management, Issue/Defect Management, Process/ t5SVFFOUFSQSJTFXJEFWBMVF Workfl ow Management, and Project/Portfolio Management.
i Aerospace/Defense Industry: Enables man aged innovation and collaboration among large global teams (often also facing regulatory or export control scrutiny) to produce systems and products with unprecedent ed levels of complexity and interdependence. Embedded Computing Design Resource Guide i Automotive Industry: With the accelerating amount of software onboard modern automobiles, Integrity helps solve challenges re lating to quality, process maturity (SPICE, CMMI), safety (ISO 26262 and IEC 61508) and data exchange between OEMs and suppliers (including AUTOSAR and ReqIF).
i Electronics Industry: Ensures that mobile device manufacturers and other electron ics manufacturers with embedded software can address the incredibly complex technical challenges, variations in devices, carriers and regions in one of the fastest growing and most competitive markets.
i Medical Device Industry: Medical device organizations radically improve their ability to address compliance and audit demands from the FDA (United States), CE mark (Europe), MHW (Japan) and other regulators for medical devices that contain increasing amounts of safety-critical software. i 0UIFSWFSUJDBMNBSLFUTIntegrity provides solutions that also address the needs of avionics, fi nancial services, government, life sciences, telecom and retail customers. Tailored solutions and deep domain expertise enable reliable implementations with rapid time-to-value.
For more information, contact: [email protected] XXXFNCFEEFEDPNQVUJOHDPNQ
46 | August 2011 Embedded Computing Design Resource Guide www.embedded-computing.com Development aids: Virtual platforms Software | Synopsys, Inc. &.JEEMFGJFME3Et.PVOUBJO7JFX $" TMTJOGP!TZOPQTZTDPN www.synopsys.com/Systems/VirtualPrototyping
Virtualizer Virtualizer addresses the increasing development challenges asso- ciated with software-rich semiconductor and electronic products Embedded Computing Design Resource Guide by enabling companies to accelerate both the development and deployment of virtual prototypes. The results? Accelerated time to market. Increased productivity. Improved quality.
The Virtualizer tool set focuses on two distinct users: the developer creating the virtual prototype and the end user. For each of these users we focus on delivering higher productivity through ease of use and debugging/analysis effi ciency.
t 7JSUVBM1SPUPUZQFT%FWFMPQFSTo the complete Virtualizer tool set focuses on the effi cient creation of basic modeling blocks and the assembly of these blocks into a virtual prototype of the system.
t 7JSUVBM1SPUPUZQFT6TFSTo Virtualizer Development Kits (VDKs or VDK+) focus on executing the virtual prototype in '&"563&4 order to complete specifi c design tasks such as software Virtualizer for Virtual Prototype Development development integration and testing, hardware verifi cation, i Extensive model portfolio of processors, interconnects, peripherals and reference designs enabling designers to quickly SoC integration or system validation/testing. start assembling virtual prototypes i Peripheral modeling tool that automatically generates template Use Cases models, documentation and unit tests These virtual prototypes are used for multiple use cases including: i Integrated fl ows with component design tools for high-level embedded software development, integration and testing, software- synthesis, processor design, algorithm design and model-based driven verifi cation, and to improve communication within the supply design tools chain. i Intuitive graphical and script-based prototype assembly i SystemC/TLM-aware model debugging tools based on the Eclipse framework t 4PGUXBSFEFWFMPQNFOU JOUFHSBUJPOBOEUFTUJOHoenables a i Simulator delivering high-speed as well as timing-accurate wide range of embedded software development activities such simulation performance as device driver development and operating system porting, i Automated packaging for easy distribution of the virtual prototype non-intrusive multicore software debugging, application and the associated debug and analysis tools to end users performance optimization, software-centric power analysis, i Support for multiple levels of abstraction and design methodologies fault injection testing and QA testbench replacement. VDKs for Virtual Prototype Deployment t 4PGUXBSFESJWFOWFSJmDBUJPOohardware can be verifi ed more i Supports both Linux and Windows. 32-bit and 64-bit host platforms effi ciently in the context of the complete system (hardware are supported (dependent on model availability) and software co-verifi cation). i Deterministic, high-speed and software-accurate simulation of multicore, multi-processor and multi-board designs
i Non-intrusive system-level software debugging tools enabling t 4VQQMZDIBJODPNNVOJDBUJPOoused to effi ciently communicate higher visibility and controllability of the virtual prototype specifi cation, enable concurrent/joint hardware and embedded i Non-intrusive system-level software analysis, providing a clearer software development. understanding of the software behavior i Synchronized execution and interfaces with the most common third-party debuggers i Interfaces to other domain simulators such as HDL, physical system simulation, algorithm design simulators, etc.
For more information, contact: [email protected] XXXFNCFEEFEDPNQVUJOHDPNQ www.embedded-computing.com Embedded Computing Design Resource Guide August 2011 | 47 EDA: Layout and design Annapolis Micro Systems, Inc. "ENJSBM$PDISBOF%SJWF 4VJUFt"OOBQPMJT .% www.annapmicro.com
CoreFire Develop your application very quickly and easily with our CoreFire™ | Software FPGA Application Builder, which transforms the FPGA development process, making it possible for theoreticians to easily and quickly build and test their algorithms on the real hardware that will be used in the fi eld.
Use CoreFire’s graphical interface to drag and drop library elements onto the design window. Modify your input and output types, num- bers of bits, and other core variables by changing module param- eters with pull-down menus. The modules automatically provide correct timing and clock control. Insert debug modules to report actual hardware values for hardware-in-the-loop debugging. Hit the Build button to check for errors and as-built core sizes and to build an encrypted EDIF fi le. Use the Xilinx ISE tool to place and route each FPGA design. Modify and use the jar fi le or the C program created by the CoreFire Build to load your new fi le into your WILDSTAR and I/O card hardware. Use the CoreFire Debugger to view and modify register and memory contents in the FPGA and to step through the datafl ow of your design running in the real physical hardware. FEATURES i Datafl ow-based – automatically generates intermodule control Our extensive IP and board support libraries contain more than fabric 1,000 proven, reusable, high-performance cores, including FIR and i Drag-and-drop graphical interface CIC fi lters, a channelizer, and the world’s fastest FFT. We support i Works at high conceptual level – concentrate on solving algorithmic conversion between data types: bit, signed and unsigned integers, problems i Hardware-in-the-loop debugging
Embedded Computing Design Resource Guide single-precision fl oating point, integer and fl oating point complex, and arrays. A few of the newly added array cores include array com- i More than 1,000 modules incorporate years of application experience position and decomposition; slice, parallelize, serialize, repack, split, i Reduce risk with COTS boards and software merge, reorder, rotate, and concatenate transformations; matrix i Save time to market math, sliding windows, and convolutions. i Save development dollars i Easily port completed applications to new technology chips and The combination of our COTS hardware and CoreFire enables our boards customers to make massive improvements in processing speed i Training and custom application development available while achieving signifi cant savings in size, weight, power, person- i Achieve world-class performance; WILD solutions outperform hours, dollars, and calendar time to deployment. the competition i Annual node locked or networked licensed; includes customer support and updates
For more information, contact: wfi [email protected] www.embedded-computing.com/p33544
48 | August 2011 Embedded Computing Design Resource Guide www.embedded-computing.com EDA: Design Software | Xilinx, Inc. -PHJD%SJWFt4BO+PTF $" www.xilinx.com
ISE® Design Suite 13 ISE® Design Suite 13 maximizes productivity by leveraging open industry standards to accelerate design creation, verifi cation, Embedded Computing Design Resource Guide implementation, and lower system power for design teams target- ing Xilinx FPGAs and Extensible Processing Platforms. New to the award-winning design tool and IP suite are enhancements that improve productivity across SoC design teams, including the pro- gression towards true plug-and-play IP targeting Spartan-6, Virtex-6 and 7 series FPGAs, including the industry-leading 2-million-logic- cell Virtex-7 2000T device.
FEATURES i Plug-and-Play IP – The new AMBA® 4 AXI-4 interconnect protocol IP enables design teams to easily customize their system topology for either performance or area, resulting in optimal system bandwidth for interconnect and memory interfaces. i Accelerated Verifi cation – Leveraging Xilinx’s large portfolio of development boards, kits, and Xilinx’s ISE Simulator new hardware Co-Simulation, verifi cation engineers can test implemented blocks of the design while leaving blocks under development in the simulator, accelerating overall verifi cation by up to 100 times faster than native simulation. i Design Analysis – PlanAhead accelerates time to production with an integrated front-to-back environment with design analysis at each phase of the design cycle – RTL development, IP integration, verifi cation, synthesis, place, and route. The end result is rapid convergence on power consumption, resource utilization, and performance with fewer time-consuming design iterations. i Team Design – The new team design methodology addresses the challenge of multiple engineers working on a single project by providing a methodology for groups of developers to work in parallel. i Enhanced Optimizations – Advanced optimizations, including intelligent clock gating that provides up to 30 percent dynamic power reduction, facilitates faster timing closure and timing preservation, increasing overall productivity and reducing design iterations.
For more information, contact: [email protected] www.embedded-computing.com/p53040
App enablers: Java virtual machine Skelmir, LLC ® %BWJT4RVBSF OEGMPPSt4PNFSWJMMF ." www.skelmir.com ® CEE-J® Virtual Machines CEE-J is Skelmir’s fast, compact, proven, clean room virtual machine suite for hosting Java applications on embedded devices. Market- proven since 1998, CEE-J runs on more than 15 million devices worldwide and counting.
® CEE-J is available and optimized for a vast array of operating sys- tems, processors, and virtual machine specifi cations. It is the ideal platform for resource-constrained embedded devices including: FEATURES digital set-top boxes, onboard navigation and infotainment systems, i Full VM footprint with advanced graphics: 1.5 to 5MB Point-of-Sale and handheld wireless devices, routers and gateways, i + 500KB footprint addition to include animation support industrial automation, multifunction printers, and more. i Host apps written to PersonalJava through J2SE specifi cations i Highly optimized interpreters for each supported architecture CEE-J VMs feature advanced graphics engines with support for i Ahead-of-time, dynamic, and JIT compilation options available hardware acceleration and OpenGL. Built directly into the CEE-J i Supported OSs: Linux, VxWorks, WinCE, eCos, Nucleus Plus, VM, the CEE-J graphics engine offers TrueType font engine support, STOS20/21, other proprietary RTOSs, Windows, Mac OS X anti-aliased text and graphics, full alpha channel support, and i Supported CPUs: MIPS32, MIPS64, ARM9/11, StrongARM, XScale, more. Add CEE-J Animator to quickly and easily bring accelerated x86, PowerPC, SuperH, STMicro, DSPs animations to user interfaces. Also available without graphics for i Flexible licensing plus porting, integration, and ongoing support by headless devices. Skelmir’s team of embedded experts
For more information, contact: [email protected] www.embedded-computing.com/p45586 www.embedded-computing.com Embedded Computing Design Resource Guide August 2011 | 49 Operating systems: Linux and tools MontaVista 1BUSJDL)FOSZ%SJWFt4BOUB$MBSB $" www.mvista.com
MontaVista Linux 6 MontaVista Linux 6 is a complete embedded development solution | Software including a Market Specifi c Distribution (MSD), the Software Development Kit (comprising the MontaVista Integration Platform, cross-development toolchain, and DevRocket Eclipse-based IDE), expert support and maintenance, and the MontaVista Zone Content Server to help developers deliver commercial-ready devices faster. The MSD saves time by providing all necessary software to get up and running immediately while the SDK’s Integration Platform allows developers to easily extend and customize their software stack, fully leveraging the open source community while maintain- ing control over the build process.
MontaVista Market Specifi c Distributions (MSD) are new Linux distributions built on a common framework and optimized for the respective hardware platform and its target market. An MSD comprises an embedded Linux kernel, appropriate device driv- ers, userland, and applications necessary to support the full breadth of functionality provided by the semiconductor vendor. FEATURES Each MSD is feature-compatible with the semiconductor i Market Specifi c Distribution vendors’ Linux technology and provides the value-add features, – Embedded Linux kernel – Device drivers expert support, and high quality MontaVista is known for. – Libraries – Userland applications MontaVista Support and Maintenance provides systems develop- i Integration Platform ers with assistance from the leader in embedded Linux commercial- – Based on BitBake build system – Build independence
Embedded Computing Design Resource Guide ization and top experts in their fi eld. While working with MontaVista, – Relocatable build environment developers are sure not to be alone, and backed by over 10 years – Optional pre-sets of experience. i Support and Maintenance – Support from top Linux experts with over 10 years of company Software Development Kit, including the MontaVista Integration – experience Platform, allows developers to easily extend and customize their – Updates and bug fi xes software stack, while maintaining control over the build process. i MontaVista Zone Content Server – Build image from source with one command – Network binary cache (pre-built binaries) MontaVista Zone Content Server delivers source code and other – Local source mirror Cross-Development Toolchain content dynamically to the Integration Platform, freeing the – C/C++ compilers – Run-time libraries developer from the constant task of searching for new source code – Source-level and assembly-level debuggers and updates. The developer can identify changes, updates, and i MontaVista DevRocket dependencies in the code via the Integration Platform, with the – Eclipse-based IDE option of incorporating these changes to the build environment. – Performance monitoring and profi ling – Memory leak detection and usage analysis – System-level and application-level tracing MontaVista Linux 6 Key Benefi ts i Target Support t'BTUFS5JNF5P%FWFMPQNFOU o'SFFTDBMF *OUFM 5FYBT*OTUSVNFOUT $BWJVN t*ODSFBTFE'MFYJCJMJUZJO*OUFHSBUJPOBOE$VTUPNJ[BUJPO – Complete list: www.mvista.com/boards.php t&YQFSJFODFE)FMQ i Host Support t$PNQMFUF%FWFMPQNFOU5PPMLJU – LSB 3.0 (or higher) x86 and x86-64 Linux distribution
http://www.youtube.com/watch?v=EeJBzqeoVTo&feature=mfu_in_order&list=UL
For more information, contact: [email protected] www.embedded-computing.com/p42745
50 | August 2011 Embedded Computing Design Resource Guide www.embedded-computing.com Operating systems: RTOS and tools Software |
SYSGO "N1GBGGFOTUFJOt%,MFJO8JOUFSOIFJN (FSNBOZ www.sysgo.com
PikeOS Safe and Secure Virtualization PikeOS is an innovative OS providing an embedded systems platform where multiple virtual machines can run simultaneously Embedded Computing Design Resource Guide in a secure environment. The Safe and Secure Virtualization (SSV) technology allows multiple operating system APIs to run concur- rently on one machine. PikeOS provides the widest range of “per- sonalities” on the market. Its microkernel architecture allows it to be used in cost-sensitive, resource-constrained devices as well as large, complex systems. The simplicity, modularity, and compactness FEATURES of the PikeOS design results in real-time performance that competes i Based on separation microkernel head-to-head with conventional, proprietary RTOS solutions while i Strict time and resource partitioning offering innovations in platform independence. PikeOS includes i Combines paravirtualization and hard real-time CODEO, an Eclipse-based integrated development environment that i MILS compliant and up to CC’s EAL6+ certifi able provides guided confi guration, remote debugging (often down to the i Eclipse-based development environment hardware instruction level), target monitoring, remote application i Certifi cation to safety-critical standards (DO-178B, IEC 61508, and deployment, and timing analyses in addition to standard application EN 50128) development features such as compilers and assemblers. i Personalities examples: Linux, legacy RTOS, ARINC 653, POSIX, RTEMS, Android, AUTOSAR, C/C++, Java, Ada i Available for PowerPC, x86, ARM, MIPS, SPARC V8/LEON, and others i Single and multicore processor support
For more information, contact: [email protected] www.embedded-computing.com/p33227
Operating systems: Linux and tools
SYSGO "N1GBGGFOTUFJOt%,MFJO8JOUFSOIFJN (FSNBOZ www.sysgo.com
ELinOS Industrial Grade Linux ELinOS is a comprehensive development environment for embedded Linux software development. Unlike traditional Linux implementations, SYSGO’s ELinOS is purpose-built for use in demanding industrial applications. SYSGO brings 15+ years of fi eld expertise to make an embedded Linux offering well-suited for real-world, complex applications and to back it up with world-class support. Many BSPs corresponding to the most successful boards on the market are included, as well as BSPs for virtualization engines such as QEMU and VMware or for the other SYSGO fl agship product, PikeOS. Besides the widely used x86 version, ELinOS also supports FEATURES 1PXFS1$ "3. .*14 BOE4)QMBUGPSNT&-JO04JODMVEFT$0%&0 i Industrial grade the Eclipse-based development environment that provides guided i Integrated Eclipse-based development environment confi guration, remote debugging (often down to the hardware i Real-time extensions support instruction level), target monitoring, remote application deployment, i Target confi guration editor and timing analyses in addition to standard application development i Runs out of the box features such as compilers and assemblers. i One-year support included i 7BMJEBUFEBOEUFTUFEGPS11$ Y YY & Y "3. 4) .*14 i BSPs for major embedded boards and chip vendors included
For more information, contact: [email protected] www.embedded-computing.com/p45461 www.embedded-computing.com Embedded Computing Design Resource Guide August 2011 | 51 Design services Emerson Network Power 4%JBCMP8BZ 4VJUFt5FNQF "; PS www.Emerson.com/EmbeddedComputing
RapiDex™ Board Customization Service The RapiDex™ board customization service from Emerson enables cost-effective embedded solutions by tailoring motherboard | Strategies design to match your requirements. Emerson’s unique design and manufacturing technology delivers quick turns with minimal setup fees. First boards are delivered within eight (8) weeks of the order. Any following production order has a volume commitment of only 100 pieces, with unit costs comparable to standard products. Emerson’s rapid customization capability can remove the need to use a less optimized standard product, leading to improved cost, space and power profi les. FEATURES As one of the most respected vendors in the embedded board i Custom motherboards, COMs, or COM Express carriers space, Emerson is a Premier member of the Intel® Embedded i Intel® Atom™ processor E6xx series Alliance and collaborates closely with Intel to enable customers i Fast turnaround time to bring products to market quickly. Emerson’s RapiDex service is i Designed and built by Emerson ® based on select embedded Intel processors and chipsets, with i For more information, visit www.Emerson.com/RapiDex custom boards available within a few weeks of silicon launch. The fi rst supported platform is the Intel® Atom™ processor E6xx series coupled with the Intel® Platform Controller Hub EG20T.
For more information, contact: [email protected] www.embedded-computing.com/p52942
Storage: DRAM DIMMs ATP Electronics /.BSZ"WFt4VOOZWBMF $"
Embedded Computing Design Resource Guide www.atpinc.com
ATP DRAM MODULES ATP DRAM modules are designed for high-performance, mission- critical applications such as industrial PC, telecom, medical, health- care and enterprise computing, where high levels of technical support, operating consistency, and wide operating tempera- ture ranges are required. Built with high quality IC components and 100% tested, the ATP DRAM module family includes a full spectrum of form factors including VLP, ULP, UDIMM, RDIMM, SODIMM, and MINI-DIMM, as well as multiple generations of DRAM technologies. FEATURES ATP is a true manufacturer with over twenty years of experience i JEDEC compliant in the production of NAND Flash memory solutions and DRAM i Extensive support on DDR3, DDR2, DDR1, and PC133 SDRAM memory modules. ATP offers in-house design, testing and product generation memory modules tuning, as well as extensive supply chain support with controlled/ i Industrial Grade temperature range (-40°C to 85°C) fi xed BOMs and long product life cycles. i Conformal coating for environmentally rugged applications i Long-term supply chain commitment upon module qualifi cation i Customization/SPD tuning available i Simulation model fi les available upon request
For more information, contact: [email protected] www.embedded-computing.com/p52934
52 | August 2011 Embedded Computing Design Resource Guide www.embedded-computing.com Storage: Solid-state disks Strategies | ATP Electronics /.BSZ"WFt4VOOZWBMF $" www.atpinc.com
ATP INDUSTRIAL GRADE FLASH PRODUCTS Flash Product Line Summary: Memory Cards (micro/mini/SD, MMCplus), Embedded Modules (SATA, USB, eUSB), and HDD Replacement SSD (2.5" SATAII/III). Embedded Computing Design Resource Guide
ATP Industrial Grade Flash products are designed for high-perfor- mance, mission-critical applications such as enterprise computing and mobility, healthcare, transportation, and military/aerospace, where high levels of durability, operating consistency, and wide operating temperature ranges are required. All ATP Industrial Grade FEATURES Flash products implement ECC and wear-leveling algorithms to i SLC NAND Flash Components maximize Flash component utilization and long-term data integ- i Patented Power Protector Technology – Data integrity during a rity. The product line is also built using SLC (Single Level Cell)-type sudden power down NAND fl ash components, which are specifi ed to at least 20 times i SMART Life Monitor Technology – Flash health status feedback the rating for program/erase cycles (lifetime) compared to commer- to host cial and consumer level MLC-type NAND Flash. i Integrated Secure Erase Technology i Industrial Grade temperature range (-40°C to 85°C) Commercial grade products also available for most form factors i Supply chain roadmaps by BOM upon product qualifi cation and densities. i Onboard AES Encryption (SSD Products)
For more information, contact: [email protected] www.embedded-computing.com/p52935
Storage: Solid-state disks RunCore Co., Ltd. UI'MPPS /P-VHV"WFOVFt:VFMV%JTUSJDU $IBOHTIB )VOBO1SPWJODF 13$ www.runcore.com/en/
RunCore mSATA SSD RunCore Elite III mSATA interface solid-state drive adopts an advanced SSD controller and NAND Flash chip with fast boot- up, zero noise, high write and read rate, wide temperature range, and excellent anti-vibration performance compat- ible with SATA 2.6. The product supports mainstream OS, such as Windows/MAC/Linux/Unix/Solaris/VxWorks. It is widely used in the reinforcement computer/industrial control computer/embedded computer and national defense fi elds.
Runcore Elite III mSATA SSD has an excellent read- and write- rate performance of up to 94MB/s and 57MB/s, respectively, and it is suitable for high speed requirements. Available in 8 and 64GB FEATURES capacities, MLC and SLC NAND Flash are provided for varying i Bad Block Management algorithm applications and computing needs. There are several operating i Advanced wear-leveling algorithms temperature levels for adaptation to different working environ- i Built-in hardware ECC ments: commercial (0°C ~ 70°C), industrial (-20°C ~ 70°C), and wide i Enhanced data integrity temperature (-40°C ~ 85°C). i Intelligent power failure recovery
For more information, contact: [email protected] www.embedded-computing.com/p52821 www.embedded-computing.com Embedded Computing Design Resource Guide August 2011 | 53 Storage: Solid-state disks INNODISK USA CORPORATION 0THPPE3PBEt'SFNPOU $" 5&-t'"9 8FCXXXJOOPEJTLDPNt&NBJMVTBTBMFT!JOOPEJTLDPN
MODELS: mSATA D150Q and DDR3 RDIMM ECC ************************************************************ Summary
| Strategies As a leader of industrial storage solution providers, Innodisk commits to excellent achievement, higher standards of quality, and reliability as well as performance. With dedicated service and professional, technical know-how, Innodisk delivers the right solutions for your requirements. mSATA D150Q ************************************************************ mSATA Innodisk mSATA solid state disk is compliant with mini SATA and MO-300 specifi cations, which are defi ned by SATA-IO and JEDEC, respectively. It has the compact Mini PCIe* form factor and enables more effective SATA integration in small form factor applications, such as thin client, digital signage, and portable devices.
*mSATA follows SATA interface but has same form factor as Mini PCIe card. DDR3 RDIMM ECC DDR3 RDIMM ECC ACTICA DDR3 Registered ECC DIMM is designed according to JEDEC standards to ensure compatibility and reliability of the memory. ACTICA FEATURES DDR3 RDIMM delivers high bandwidth with data rates currently up mSATA D150Q: to 1.3Gbps, while consuming signifi cantly less power than DDR2. It is the ideal memory for HPC, cloud computing, and data center appli- i Compliant with JEDEC MO-300, SATA-IO, mini SATA cations. With the thermal sensors built in, it will help IT managers i High reliability: anti-shock and anti-vibration monitor the memory module temperature to prevent any overheating. i Low profi le i Excellent data transfer speed ************************************************************ i SMART: Own AP to monitor the health of the SSD mSATA Specifi cations: i Supports static wear-leveling algorithms Capacity: 2GB ~ 32GB
Embedded Computing Design Resource Guide Interface: Mini PCIe (SATA II) DDR3 RDIMM ECC: Data Transfer Rate: Read: 120MB/sec. (max.) i Compliant with JEDEC standards Write: 100MB/sec. (max.) i RoHS compliant Operation Temp: 0C ~ +70C (Standard); -40C ~ +85C (Industrial) i Low profi le Storage Temp: -55C ~ +95C i Supports triple and quad channels Vibration: 20G (7Hz ~ 2000Hz) i 100% compatible with the Intel and AMD server memory solutions Shock: 1500G/0.5ms DC Input Voltage: 3.3V i Highly reliable – for mission-critical server memory solutions Power Consumption: 250mA (max.) i Thermal sensor built in Dimensions: 30mm x 50.95mm x 3.4mm (W x L x H) i High performance SMART: Supported ATA Security: Supported *********************************************************** DDR3 RDIMM ECC Specifi cations: Capacity: 1GB ~ 16GB Markets: Module Type: DDR3 Registered ECC i Cloud computing I/O Signaling: SSTL_15 i Enterprise server Data Transfer Rate: 800MHz ~ 1333MHz i Communications and networking CL/tRCD/tRP: DDR3-800 – 6/6/6; DDR3-1066 – 7/7/7; DDR3-1333 – 9/9/9 Mission-Critical Applications: Operation Temp: 0C ~ +85C i Military Storage Temp: -55C ~ +100C i Scientifi c Supply Voltage: 1.5 ±0.075V Dimensions: 133.35mm x 30mm x 4mm (L x H x W) Pins/DIMM: 240-pin DIMM Performance Applications: On-Die Termination: Supported i Gaming server i Video/Audio
For more information, contact: VTBTBMFT!JOOPEJTLDPNt5FM www.embedded-computing.com/p53032
54 | August 2011 Embedded Computing Design Resource Guide www.embedded-computing.com Storage: Solid-state disks Strategies | Memoright Corporation 0ME*SPOTJEFT%SJWF 4VJUFt4BOUB$MBSB $" www.memoright.com
Memoright Military Grade SSD and IPC Storage Total Solution Memoright, a Taiwan-based company dedicated to technological development and integration for SSDs (solid-state drives) and high-end storage equipment, provides an array of military, industrial Embedded Computing Design Resource Guide and enterprise level ruggedized SSD products with customized services.
The military and industrial level ruggedized SSDs GTR, GTR II and GTR-P series all meet both the U.S. MIL-STD-810F/G and the Chinese GJB standards, which are the strictest sets of environmen- tal tests that include low pressure for altitude testing, exposure to wide temperature, humidity, fungus, salt fog (as a corrosion test), shock, vibration and so on.
Memoright’s self-developed circuit design and close-examination manufacturing process for the military grade SSD provides high performance and 100% constant speed. GTR II supports SATA II interface and is available in 16GB, 32GB, 64GB and 128GB capacities. With its emphasis on stable and reliable performance, Memoright SSD has been widely adopted for military and industrial storage FEATURES purposes. i Ruggedized Series SSD – Wide Temperature (-40 °C ~ +85 °C) & SLC NAND Type Memoright IPC storage solution delivers an outstanding balance – Constant Speed of system performance and solid reliability. With proprietary – Form Factor: 2.5"/1.8"; Interface: SATA/PATA core technologies, Memoright is proud of being able to pro- – In-Drive UPS: A specifi c energy storage element guarantees no vide a series of products meeting the strictest military standard, – data loss during any unexpected power spikes, dips or failures. MIL-STD-810F/G, which combines various extreme environmental – Security Erase: Memoright provides users both commercial and – military Secure Erase modes, which can be triggered either by tests. Memoright’s SSDs for industrial control IPC solutions support – the hardware button or a sequence of commands. 2.5", 1.8" and 1.2" form factors, and DiskOnModule, SD and CF for- mats, as well as transmission interfaces of PATA/IDE, SATA, mSATA, and PCIe. i IPC Storage – Wide Temperature : -40 °C ~ +85 °C/-20 °C ~ +70 °C/0 °C ~ +70 °C – Form Factor: 2.5"/1.8"/Half Slim (JEDEC MO297)/SATA DOM/ – IDE DOM/True IDE Mode/CFast Card Type I/SD V2.0/eMMC/ – mSATA / – Interface: SATA/PATA/PATA ZIF/IDE/mPCIe/SD/SDHC/CF – SLC/MLC NAND Type – In-Drive UPS (Optional) & Security Erase/Switch (Optional)
For more information, contact: [email protected] www.embedded-computing.com/p52820 www.embedded-computing.com Embedded Computing Design Resource Guide August 2011 | 55 Storage: CompactFlash WinSystems, Inc. 4UBEJVN%SJWFt"SMJOHUPO 59 www.WinSystems.com
Extended Temperature CompactFlash These CompactFlash cards are targeted for applications that need industrial-grade reliability, industry-standard compatibility and IDE | Strategies hard disk drive emulation for fast program and data storage. Our CompactFlash cards have greater than 2 million program/erase cycles and unlimited Reads while maintaining fast transfer speeds of up to 66MB/s in burst mode.
Fully operational from -40°C to +85°C, these CompactFlash cards are available in storage densities from 128MB to 16GB, and fi t any computer, SBC or instrument with a CompactFlash socket. Since FEATURES they are True IDE Mode and ATA-3 compliant, they are compatible i 128MB to 16GB storage capacity with different operating systems such as Linux, Windows® and other i Up to 66MB/s burst with 37MB/s Read and 16MB/s Write sustained RTOSs without requiring special drivers. i Sophisticated error-checking and wear-leveling algorithms i Withstands 2,000G’s shock and 16.3G’s vibration We offer in-stock product availability plus free technical telephone i -40°C to +85°C operating temperature support with a factory applications engineer. i In-stock availability and RoHS compliant
www.IndustrialCompactFlash.com
For more information, contact: [email protected] www.embedded-computing.com/p35888
Systems: Panel computers Aaeon Systems Inc. 4BUVSO4USFFUt#SFB $"
Embedded Computing Design Resource Guide www.aaeonsystems.com/products/hmipanel.php
AHP-1000 Series (HMI Panel PCs) AAEON’s AHP-Series is a perfect blend of form and function. These compact, sleek Panel PCs are well suited for working around any machinery. Whether it be an automated factory, a fi tness center, or any other type of industrial environment, these well-featured PCs are perfect for the job.
The AHP Series offers an array of custom options as well. The selections include a variety of LCD sizes, CPU power, LCD bright- ness, and system designs. This fl exibility can help tailor your AHP FEATURES unit to suit your specifi c needs. i 7"/8.4"/12.1"/15" multifunctional touch Panel PC i Onboard TI OMAP, Intel Atom N270/D510 Processor Further options for high-end use include RFID, Wi-Fi/GSM/GPS, SD i Dual Gigabit Ethernet and rich I/O ports slot expansions, and mini card expansions for optimal choices. i Optional Wi-Fi/GSM/GPS i Fanless thermal design i IP65 compliant i Streamlined industrial design
For more information, contact: [email protected] www.embedded-computing.com/p52932
56 | August 2011 Embedded Computing Design Resource Guide www.embedded-computing.com Systems: Panel computers Strategies | Aaeon Systems Inc. 4BUVSO4USFFUt#SFB $" www.aaeonsystems.com/products/mtpanel.php
ACP-Series: Multi-Touch Infotainment Panel PC AAEON’s new ACP product line allows for endless possibilities as it is one of the world’s fi rst Panel PCs with projected capacitive multi-touch screens, offered in 15", 18", and 21". The ACP-Series is a Embedded Computing Design Resource Guide remarkable new design that can be customized to suit all your needs.
AAEON’s ACP unit has the ability to be outfi tted with an array of extra features, one of which is a scanner. Oftentimes, a sales associate may have diffi culty fi nding a price on an item. The ACP unit can easily solve this problem with its ability to scan the UPC of any product and FEATURES display the price and details. i 15.6"/18.5"/21.5" Wide Screen TFT LCD The ACP unit can be the solution for quick and easy transactions. i Intel Atom Dual Core D510/Intel Core i5/i7 Processor Units may be outfi tted with a smart card reader, RFID, and magnetic i Fanless and Multi-Touch Screen Design strip reader to help the transaction go quickly and smoothly. Whether i Projected Capacitive Touch Screen your application is for Point Of Sale, Kiosks, or Digital Signage, our i IP-65 Front Bezel and IPX1 Back Cover ACP solutions can lessen the load for your company and employees. i Anti-Scratch Screen: 7H Hardness With network capabilities, the relay of information from a kiosk to a i Smart Card Reader/RFID/MSR/VoIP/Web cam supported human associate or server, for instance, is accomplished with no hassles.
For more information, contact: [email protected] www.embedded-computing.com/p52931
Systems: Industrial systems ACCES I/O Products, Inc. 3PTFMMF4USFFUt4BO%JFHP $" www.accesio.com
Multifunction DAQ-PACK Series (Up to 128 Channels) The DAQ-PACK Series is a highly integrated multifunction data acquisition and control system. The system offers an ideal solution for adding portable, easy-to-install high-speed analog and digital I/O capabilities to any PC or embedded system with a USB port. It performs signal conditioning such as RC fi ltering, current inputs, RTD measurement, bridge completion, thermocouple break detec- tion, voltage dividers, small signal inputs, and sensor excitation voltage supply. FEATURES i 32, 64, 96, or 128-channel single-ended or differential analog inputs i High-speed USB 2.0 multifunction DAQ The small, compact, multifunction I/O DAQ-PACK Series units pro- i Sustained sampling speeds up to 500kHz vide the user with everything needed to start acquiring, measur- i 12 or 16-bit resolution A/D converter ing, analyzing, and monitoring in a variety of applications. These i Flexible, software-confi gured functionality data acquisition and control devices can be used in many current i 18 input ranges, 9 unipolar and 9 bipolar, per 8-channel real-world applications such as precision measurement, analysis, programmable monitoring, and control in countless embedded applications. i Wide range of fl exible signal conditioning types i Autocalibration and oversampling for real-time accurate data i A/D starts via software, timer, or external trigger i Two 16-bit analog outputs and 16 high-current digital I/O lines i 16-bit programmable counter/timer
For more information, contact: [email protected] www.embedded-computing.com/p52224 www.embedded-computing.com Embedded Computing Design Resource Guide August 2011 | 57 Systems: Industrial systems AXIOMTEK 3PXMBOE4Ut$JUZPG*OEVTUSZ $" www.axiomtek.com Intel® Tunnel Creek CPU & Intel® TopCliff IOH combine to deliver excellent computing performance with low power consumption
| Strategies The PICO822 is a highly integrated, small form factor x86 embedded computer targeted at system developers and OEMs who need excellent computing performance with very little power consumption and up to 32GB of integrated SSD (optional). It’s hard to beat the cost per performance offered by the PICO822. This board is ideally suited for portable and medical devices, in-vehicle and in-fl ight computing or entertainment systems. The board ships with a specially designed low profi le heatsink that doesn’t restrict FEATURES ® ™ access to the full-featured I/O (see features section). A proprietary i Intel Atom Processor E600 Series expansion interface on the bottom of the board interface allows for i Intel® Atom™ EG20T PCH additional expansion (USB, UART, Tx/Rx, SMBus, DC input, SDVO). i Onboard DDR2-667/800 max. up to 1GB i Onboard SSD max. up to 32GB i LVDS display interface i 2 x COM port, 1 x SATA, 4 x USB 2.0 + 1 client port i HD audio i ACPI S0, S3, S4, S5
For more information, contact: [email protected] www.embedded-computing.com/p52226
Systems: Panel computers Avalue Technology Inc. ' /P -JBO$IFOH3Et/FX5BJQFJ$JUZ 5BJQFJ 5BJXBO
Embedded Computing Design Resource Guide www.avalue.com.tw
Panel PCs Avalue’s Panel PCs adopt Intel® Atom™ series and latest Core™ i7 series processors, featuring low-power, fanless and quick heat- dissipation conditions. Touch panels leverage low refractive touch technology and a unique, super anti-abrasion (SAA) design, which allows the touch panels to reach a hardness of 6.2 to 6.5, preventing scratches and increasing its durability. Mostly using LED backlight display to reduce heat, power consumption and cost, the aluminum and stainless steel chassis protects the computer when it is used in more humid environments, such as factories or testing labs, ensur- FEATURES ing the computer operates reliably. The front panel is IP65 safety- i 8~42 Inch 4:3/16:9/17:10 Multifunctional Touch Panel PC certifi ed, while entire-computer waterproof certifi cation is optional. i Onboard Intel® Atom™ N270/D510/D525, Core™ i7, AMD LX800 CPU Inside the modular embedded COMe/ETX/XTX CPU modules i Onboard Up to 3GB (1GB per bank) SDRAM equipped with scalable baseboards are diversifi ed tiers of system i Dual Gigabit Ethernet and Rich I/O Ports, Optional Wireless Module performance. The modular concept makes the computer price- i Fanless Thermal Design, Streamline Industrial Design competitive and extends product lifetime. Avalue Panel PCs are widely applied in automation, human-machine interface, point-of- i IP-65 Compliant, Up-to-date Technology Panel service, the food industry and digital signage.
For more information, contact: [email protected] www.embedded-computing.com/p52936
58 | August 2011 Embedded Computing Design Resource Guide www.embedded-computing.com Systems: Panel computers Strategies | EMAC, Inc. &."$8BZt$BSCPOEBMF *- www.emacinc.com
PPC-E4 Compact Panel PC The PPC-E4, is a compact Panel PC with a 4.3" WQVGA TFT color LCD and a resistive touch screen. The dimensions of the PPC-E4 are 4.8" x 3.0", about the same dimensions as that of popular touch cell Embedded Computing Design Resource Guide phones. The PPC-E4 is small enough to fi t in a 2U rack enclosure.
The PPC-E4 compact Panel PC utilizes a System-on-Module (SoM) for the processing core. This allows the user to easily upgrade if more memory capacity or processing power is required. The PPC-E4 FEATURES includes an embedded ARM9 SoM, which features a 200 MHz i ARM9 200 MHz Fanless Low Power Processor fanless low-power processor with a hardware fl oating point math i MaverickCrunch Hardware Floating Point Math Coprocessor coprocessor and 2D video accelerator. The SoM provided with i 10/100BASE-T Ethernet with Onboard PHY the PPC-E4 supports up to 128 MB of SDRAM, 64 MB of Flash, i 2 RS-232 & 1 RS-232/422/485 and 128 KB of serial fl ash. Typical power consumption is less than i 2 USB 2.0 (Full Speed) Host Ports 5 Watts, and the LED backlight can be shut off when not in use to i Up to 128 MB of SDRAM further decrease its power consumption. i Up to 64 MB of Flash i MicroSD Flash Card Interface i 1 SPI Port, 1 I2S Port & GPIO The PPC-E4 starts at $345.00. For more information please visit: i Battery-backed Real Time Clock www.emacinc.com/panel_pc/ppc_e4.htm i WQVGA (480 x 272) Resolution with LED Backlight
For more information, contact: [email protected] www.embedded-computing.com/p43199
Systems: Industrial Systems Emerson Network Power 4%JBCMP8BZ 4VJUFt5FNQF "; PS www.Emerson.com/EmbeddedComputing
Embedded Computers The Emerson Network Power Embedded Computers are based around x86 Intel® Architecture embedded motherboards with processor and memory, plus a disk. These are integrated into an application-specifi c enclosure that is designed for long-life appli- cations with very little or no maintenance. Typical uses include medical clinical instruments, digital security and surveillance, industrial control and digital signage.
The KR8-315 is a fully integrated embedded computer. Enclosed in FEATURES a custom, fanless case, the KR8-315 features the Intel® Atom™ E640 Emerson is offering two classes of Embedded Computers that are processor running at 1.0 GHz. Two versions are available – a standard ideal for digital signage applications: temperature and an extended temperature version. The extended i Fanless, small, metal solutions that are designed to be mounted temperature version utilizes a solid state drive, eliminating all to a screen or instrument. These are noiseless, maintenance-free moving parts. embedded computers that are available to suit a variety of operating temperature environments. They are easy to use and offer capability The MCASE series consists of a Mini-ITX plastic enclosure and to fi t a wireless module. features the 2nd gen Intel® Core™ processor family. MCASE is a fully i Small, low-cost embedded computers with some expansion confi gured, application-ready platform ready to be powered up and capability. These are typically supplied in a plastic enclosure with loaded with applications. mounting options, operate in an environment of 0 °C to 35 °C and are air cooled.
For more information, contact: [email protected] www.embedded-computing.com/p52909 www.embedded-computing.com Embedded Computing Design Resource Guide August 2011 | 59 Systems: Industrial, Mission/safety-critical, Mobile computers, Rack-mount, Transportation Excalibur Systems .FBDIBN"WFt&MNPOU /: 5FMt'BY www.mil-1553.com
DRAGON &YDBMJCVST%3"(0/JTBSVHHFEJ[FENPEVMBS$0541$Plus system with the option of a customer-specifi ed confi guration. The | Strategies TZTUFNJTDBQBCMFPGTVQQPSUJOHVQUPTJY1$1$Plus cards in addition to the processor and power supply. The modular, stack- through design allows you to build a tailor-made confi guration based on Excalibur’s extensive range of boards as well as other compliant third-party’s cards.
5IF%3"(0/JTEFMJWFSFEGVMMZJOUFHSBUFEXJUIUIF04PGDIPJDFo FEATURES including installation of all hardware with appropriate drivers, test i Conduction cooled software and cables – cutting integration time and letting you get on i Modular design for easy confi guration and upgrade with the real project. i 'VMMZUFTUFEUP.*-45%' & #BOE& i Removable SSD memory option for security and backup i 'VMMZDPOEVDUJPODPPMFE1FOUJVN. VQUP()[ i %%33". VQUP .# i 4PMJE4UBUF%SJWF 44% VQUP(# i $PNQBDU'MBTI UP(# i 'PVS64#QPSUT
For more information, contact: [email protected] www.embedded-computing.com/p34031
Systems: Industrial, Mission/safety-critical, Mobile computers, Rack-mount, Transportation Excalibur Systems .FBDIBN"WFt&MNPOU /:
Embedded Computing Design Resource Guide 5FMt'BY www.mil-1553.com
MACC – Miniature Airborne Communications Converter Excalibur’s MACC is a complete Miniature Airborne Communications Converter designed to convert bi-directional messages. Small, light, and with low power dissipation, the MACC is the perfect solution for airborne communications incompatibilities.
When designing or upgrading an avionics system, engineers are often faced with integrating components that were not originally designed to work together. For example, a fl ight computer that communicates using RS-232 may need to control a component that expects MIL-STD-1553 messages, or an INS may transmit ARINC 429 labels needed by a multifunctioning display designed around RS-422. No longer will you have to choose between giving FEATURES up one of the units because of communications incompatibility, i Conduction cooled or adding another computer system to convert between the two. i Waterproof aluminum case Excalibur’s MACC converts messages between: i Black, anodized casing with built-in heat sink t.*-45% i No moving parts – fanless t"3*/$ i Industrial temperature range t4FSJBM i t&UIFSOFU 6TFT.*-*0DPOOFDUPST t%JTDSFUF i Rugged, screw down internal assembly for shock
For more information, contact: [email protected] www.embedded-computing.com/p53031
60 | August 2011 Embedded Computing Design Resource Guide www.embedded-computing.com Systems: Industrial systems Strategies | Hartmann Electronic &"VCVSO"WFt4QSJOHGJFME 0) 1t' www.hartmann-electronic.com LMH0000220 – CompactPCI System Platform 2U including voltage and temperature monitoring 5IF NFDIBOJDT PG UIF -.) TZTUFN QMBUGPSN JODPSQPSBUF
TQFDJmDBUJPOT*&&& BOE*&$ BOE Embedded Computing Design Resource Guide 5IFCBDLQMBOFJTEFTJHOFEQFS1*$.(3BOE3IPU TXBQTQFDJmDBUJPO4UVSEZ ZFUFDPOPNJDBM )BSUNBOOTZTUFNQMBUGPSNT have successfully passed shock and vibration tests for shipboard and IJHIXBZ BDDPSEJOH UP .*-45%' BOE SBJMXBZ &/ &/ class 1 B. The 2U tall compact design houses a monolithic 9U horizontal mount FEATURES CBDLQMBOF 6 GPS CPBSET BOE 6 GPS QPXFS 'PS CPBSET UIF VOJU QSPWJEFT TMPUT 6 $PNQBDU1$* CBDLQMBOF XJUI SFBS *0 'PS QPXFS i 6 TMPU$PNQBDU1$*#BDLQMBOFXJUI3FBS*0 UIF VOJU DPNFT TUBOEBSE XJUI POF 8 IPU TXBQ D1$* QPXFS i $PNQBDU1$*QPXFSTVQQMZ8 XJUIBEEJUJPOBM146TMPU TVQQMZ XJUI BO BEEJUJPOBM 1 DPOOFDUPS NPVOUFE PO UIF CBDLQMBOF i )PUTXBQGBOESBXFSGPSDPPMJOHGSPOUBOESFBSCPBSET for easy installation of an additional power supply for increased power i Filter, easy switchable without tools requirements or for systems that require redundancy. i Voltage monitoring Forced air cooling is provided via a hot swap fan tray with removable i Temperature control fi lter. Incorporated into the backplane are dip switches for changing i Front LED display for power-in and fan fail the characteristic curve. An LED display is available for power on and i Confi guration of the characteristic curve of the fans with dip fan fail. switches, to adapt the cooling to the load In addition to a broad range of standard, preconfi gured platforms, Hartmann Electronic offers system platforms )BSUNBOOPGGFSTnFYJCJMJUZBOERVJDLUVSOBSPVOEGPSDVTUPNFSTQFDJmD in different sizes and variations. requirements, with no minimums.
For more information, contact: [email protected] www.embedded-computing.com/p53042
Systems: Industrial systems Hilscher North America Inc. 8BSSFOWJMMF3PBE 4VJUFt-JTMF *- www.hilscher.com
comX Industrial Communication Module The comX communication module is designed for integration in BVUPNBUJPOEFWJDFT TVDIBTSPCPUDPOUSPMMFST 1-$TBOEESJWFT UPBEEBOFUXPSLJOUFSGBDF5IFPOCPBSE)JMTDIFSOFU9OFUXPSL controller chip carries out all communication tasks, independent GSPNUIFQSPDFTTPSPGUIFUBSHFUEFWJDF8JUIBOCJUEBUBCVT the application has direct access to the process data via a dual-port memory.
comX supports Ethernet protocols and popular fi eldbus networks FEATURES as master or slave, and covers all network-specifi c require- i All major network protocols as master and slave ments in a single module. Real-time Ethernet networks supported i %VBMQPSUNFNPSZXJUICJUEBUBCVTUPUIFIPTU JODMVEF &UIFS/FU*1 130'*/&5 &UIFS$"5 4&3$04 *** &UIFSOFU i Single hardware for all real-time Ethernet protocols 108&3-*/, BOE .PECVT 5$1 'JFMECVTFT TVQQPSUFE JODMVEF i Complete communication device including network-specifi c %FWJDF/FU 130'*#64 $"/PQFO $$-JOLBOE$PNQP/FU"MMDPN9 connection modules are available as variant CA with angled network connector i Ready to use, with preloaded fi rmware or as variant CN with a connector plug to the baseboard. i 0OFEFTJHOGPSBMMOFUXPSLTEVFUPDPOTJTUFOUJOUFSGBDFTBOEUPPMT i Common driver model i 130'*/&5*35EFWJDFXJUImCFSPQUJDTQVSTVBOUUP"*%"
For more information, contact: [email protected] www.embedded-computing.com/p52943 www.embedded-computing.com Embedded Computing Design Resource Guide August 2011 | 61 Systems: Industrial systems MSI (Micro-Star INT’L Co., LTD.) /P -JEF4U ;IPOHIF%JTUt/FX5BJQFJ$JUZ 5BJXBO 30$ 5FM www.msi.com/ipc
MSI WindBOX III with Intel® Core™ 2 Duo for Fanless Systems MSI WindBOX III is based on the Intel® Core™ 2 Duo processor and Intel® GS45 + ICH9M chipset to provide the latest ultra-low power, | Strategies fanless design and slim form factor in embedded applications, including digital signage, kiosk, POS, gaming, and medical.
MSI WindBOX III is equipped with great 3D graphics performance for high-defi nition video up to 1080p. WindBOX III supports multi- display outputs, including dual channel 24-bit LVDS, DVI, and HDMI for dual-independent display. FEATURES MSI WindBOX III’s enhanced I/O connectivity covers 6 USB 2.0 i Slim and fanless system design with Mini-ITX board inside ports and 2 powered COM ports. To fulfi ll the expansion and storage demand, WindBOX III includes two Mini-PCIe slots and i Great 3D graphics performance for high defi nition up to 1080p 2 x SATA II. Moreover, WindBOX III comes with a module that has a i Multiple video outputs with dual-independent display built-in Wi-Fi 802.11b/g/n and Bluetooth module. i Built-in Wi-Fi 802.11 b/g/n and Bluetooth module i Flexible design for easy-change memory and HDD MSI WindBOX III contains an enhanced, fl exible back cover design i VESA mounting support for easily changing preferred memory, HDD, and Mini-PCIe devices. MSI WindBOX III supports VESA wall-mount interfaces for easily mounting fl at panel monitors and the back side of the TV.
For more information, contact: [email protected] www.embedded-computing.com/p52948
Systems: Medical systems Onyx Healthcare Inc. 4BUVSO4USFFUt#SFB $"
Embedded Computing Design Resource Guide www.onyx-healthcare.com
ONYX BE-185 Medical Bedside Terminal ONYX bedside infotainment terminals are offered in 10.1"/15.6"/18.5" LCDs and are all low-power, high-performance all-in-one terminals with high brightness, wide viewing angles, anti-microbial design, and touch control support. The high-performance processor (up to Intel® Core 2 Duo level) and chipset, which supports iAMT remote virtual management and various add-on features, enhances the ONYX bedside infotainment terminal with effi ciency, remote patient monitoring, and smooth hospitalization experiences. FEATURES " To further expand the communication demands in patient ward i 18.5 Wide Color TFT LCD Display ® ™ areas, the ONYX bedside infotainment terminal also supports i Intel Core 2 Duo U7500 1.06GHz Processor extensive I/O expansions via multiple USB interfaces, Giga LAN port, i Easy Wipe/Easy Clean i Fanless and Compact Design WLAN mobile solution, RFID/barcode scanner, smart card reader, i VoIP Phone, Web Camera, High Quality Speakers magnetic strip reader, built-in webcam, and VoIP phone. The i Multimedia Entertainment: TV, Game, VoIP, Web Radio ONYX bedside infotainment terminal delivers a powerful unit to the i Analog Phone, Magnetic Stripe Reader (Optional) electronic medical record infrastructure with real-time, error-free i RFID/2nd Smart Card Reader/Barcode Scanner (Optional) operation, all while offering a greener, paperless solution. i Nurse call/TV Tuning/HD Decoding Function (Optional) i Bluetooth/WLAN b/g/n (Optional)
For more information, contact: [email protected] www.embedded-computing.com/p52949
62 | August 2011 Embedded Computing Design Resource Guide www.embedded-computing.com Systems: Industrial systems Strategies | Sealevel Systems, Incorporated (SFFOWJMMF)JHIXBZt-JCFSUZ 4$ www.sealevel.com/ecd/r92100
SBC-R9-2000 The SBC-R9-2000 delivers RISC computing power and powerful I/O features in a compact, rugged form factor. Embedded Computing Design Resource Guide
The SBC-R9-2000 is an application-ready platform for your next product design. The system is based on the 200MIPS Atmel AT91SAM9263 microcontroller, boasting a 32-bit ARM instruction set for maximum performance. With up to 256MB RAM and 256MB Flash memory, the I/O features of the board make it a perfect choice for a wide variety of applications. The SBC-R9-2000 is the perfect platform for embedded applications requiring small size, wide oper- ating temperature range, and fl exible I/O connectivity.
Standard I/O includes Ethernet, serial, USB, audio, digital input/ output. For wireless connectivity, an 802.11b/g option is available.
To provide the fastest time to market, the Windows CE 6.0 BSP binary and low-level drivers for system I/O are included. Additionally, the SBC-R9-2000 software package is equipped with the Sealevel Talos Framework, which offers a high-level, object-oriented .NET FEATURES Compact Framework (CF) device interface to simplify application i Atmel AT91SAM9263 Microprocessor development. i Up to 256MB RAM and 256MB Flash Memory i 10/100BASE-T Ethernet Port Measuring just 3.9" x 4.9" in size, the SBC-R9-2000 is small enough i USB Device port to fi t in most embedded applications and is rated for a full -40°C to i USB Host port with High Retention Connector +85°C operating temperature range. The SBC-R9 is powered from your 7-30VDC source, or select from a variety of Sealevel power i 2 Software-selectable RS-232/422/485 Ports supply options. i 2 Isolated Digital Inputs i 2 Isolated Digital Outputs A QuickStart development kit is available, which includes the most i Optional 802.11b/g Wi-Fi common accessories. For applications with specialized hardware i Small 3.9" x 4.9" Footprint requirements, developers can use the SBC-R9-2000 as a platform i 7-30 VDC Power Operation for application development while Sealevel designs a customized target system specifi c to the user’s application requirements.
For more information, contact: [email protected] www.embedded-computing.com/p52951 www.embedded-computing.com Embedded Computing Design Resource Guide August 2011 | 63 Systems: Industrial systems VIA Technologies .JTTJPO$PVSUt'SFNPOU $" www.viaembedded.com
VIA AMOS-5001 Fanless, Compact Embedded Chassis Kit The VIA AMOS-5001 chassis kit makes it easy to assemble robust x86 embedded systems that can withstand a wide temperature | Strategies range of -20°C to 55°C and are capable of sustaining a g-force of up to 50. VIA AMOS-5001 chassis are easy to assemble and maintain, utilizing only four separate mechanical parts to form a slim, robust fanless system.
The VIA AMOS-5001 chassis combines with the unique integrated heatsink design found on Em-ITX boards. The discrete aluminum FEATURES heatsink has direct contact with the processor and chipset on the i Only four mechanical parts make up a powerful system. Easy, quick installation and maintenance reverse side of the board, forming a solid, robust base for chassis i Super slim. ONLY 35.2mm of height assembly. An optional storage compartment can also be added. i Supports operating temperatures from -20°C ~ 55°C i Modularized design with compact dimensions: 231.44mm (W) x 35.2mm (H) x 124.8mm (D) i Easy-to-use interchangeable and customizable front and rear panels i Built-in rich I/O functional-feature cutouts for easy external access i Maximum space effi ciency for optimized electromagnetic compatibility i Optional stackable-storage sub-system chassis for carrying 2.5" HDD
For more information, contact: [email protected] www.embedded-computing.com/p52342
Systems: Panel computers WinSystems, Inc. 4UBEJVN%SJWFt"SMJOHUPO 59 817-274-7553 Embedded Computing Design Resource Guide www.WinSystems.com
IPC65-rated industrial 1.6GHz Atom™-based Panel PCs WinSystems’ PPC65 Panel PC is a complete system that includes dis- play, touch panel and single board computer mounted in a rugged, brushed aluminum alloy enclosure. Available screen sizes are 12, 15, 17 and 19 inches. This family of products meets the IP65 certifi cation for ingress against dust and water. Also, the PPC65 meets and exceeds industry standards for RF emissions, suscepti- bility, and shock/vibration.
The PPC65 has been tested for electrical plus electromagnetically FEATURES induced or radiated interference that could possibly degrade i IP65-compliant rugged Panel PC its performance when electronic and electrical systems are i 12-, 15-, 17-, or 19-in fl at panel displays positioned closely together in confi ned spaces. This unit is in i Intel® Atom™ 1.6GHz Single Board Computer compliance with IEC 61000 Electrical Fast Transient (EFT or i 5-wire resistive touch screen “Bursts”), Surge, Drop in Power (DIPS), Conducted Susceptibility i Ethernet, USB, COM, SATA and CF supported (CS), and Conducted Immunity Tests (CIT). i CE/FCC Class B and CE EMC Directive-certifi ed i Meets IEC 61000: EFT, Surge, DIPS, CIT and CS For more information go to i Runs Linux, Windows® XP embedded, CE 6, and WES7 www.winsystems.com/PPC65_CAT i Custom bezel available for OEM applications
For more information, contact: [email protected] www.embedded-computing.com/p52924
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2.0 GSps 10-bit A/D The Annapolis Single Channel 2.0 GSps A/D I/O Card provides one 2.0 GHz A/D input with a resolution of 10 bits. The board has one e2v AT84AS004 that is fed by an onboard analog input circuit, which converts the single-ended 50-ohm SMA input into differen- tial signals for the ADC. There is a universal single-ended 50-ohm SMA clock input and a high-precision trigger input allowing multiple A/D I/O cards to be synchronized together. Synchro- Embedded Computing Design Resource Guide nization of A/D I/O cards can be facilitated by the Annapolis 4 or 8 Channel Clock Distribution Boards.
In concert with the WILDSTAR 4 or WILDSTAR 5 FPGA processing main boards, this mezzanine supplies user-confi gurable, real-time continuous sustained processing of the full data stream. Up to two A/D and up to two serial I/O cards can reside on each WILDSTAR 4 or WILDSTAR 5 VME/VXS or IBM Blade main board, or up to one A/D and up to one Serial I/O card on each PCI-X or PCIe main board.
Our boards run on many different operating systems. We support our boards with a standardized set of drivers, APIs, and VHDL simulation FEATURES models. VHDL source is provided for the interfaces to A/Ds, D/As, i One e2v AT84AS004 (2.0 GHz, 10-bit) A/D ™ DRAM/SRAM, LAD bus, I/O bus, and PPC Flash. CoreFire users will i Four SMA front panel connectors: one 50-ohm analog input, one have the usual CoreFire Board Support Package. single-ended 50-ohm clock input, or differential 1.65 V LVPECL clock input The combination of our COTS hardware and our CoreFire FPGA i One high-precision trigger input with Fs precision; high-precision Application Development tool allows our customers to make mas- trigger input – 1.65 V LVPECL, 2.5 V LVPECL, 3.3 V LVPECL sive improvements in processing speed, while achieving signifi cant i Analog input bandwidth is 100 KHz-3.0 GHz savings in size, weight, power, person-hours, dollars, and calendar i I/O card plugs into WILDSTAR 4 or 5 VME/VXS/PCI-X/PCIe/ IBM Blade main boards time to deployment. i JTAG, ChipScope, and Serial Port access Annapolis Micro Systems, Inc. is a world leader in high-performance, i Full CoreFire Board Support Package for fast, easy application development COTS FPGA-based boards and processing for RADAR, SONAR, SIGINT, ELINT, DSP, FFTs, communications, Software-Defi ned Radio, i VHDL model, including source code for board-level interfaces encryption, image processing, prototyping, text processing, and i Proactive thermal management system other processing-intensive applications. i Includes one-year hardware warranty, software updates, and customer support Annapolis is famous for the high quality of our products and for our i We offer training and exceptional special application development support, as well as more conventional customer support unparalleled dedication to ensuring that the customers’ applications i Designed and manufactured in the USA succeed.
For more information, contact: wfi [email protected] www.embedded-computing.com/p36021 www.embedded-computing.com Embedded Computing Design Resource Guide August 2011 | 65 Mezzanines Annapolis Micro Systems, Inc. "ENJSBM$PDISBOF%SJWF 4VJUFt"OOBQPMJT .% www.annapmicro.com
Dual 4.0 GSps DAC The Annapolis Micro Systems Dual Channel 4.0 GSps D/A I/O Card provides one or two 12-bit digital output streams at up to 4.0 GSps. The board has one or two Max 19693 for 4.0 GSps, Max 19692 for 2.3 GSps, or Max 5859 for 1.5 GSps.
The Dual Channel DAC board has fi ve SMA front connectors: two | COTS Collection single-ended DAC outputs, a high-precision trigger input with Fs precision, and a universal single- or double-ended 50-ohm clock input. It has excellent gain fl atness in the fi rst 3 Nyquist Zones, ultra- low skew and jitter saw-based clock distributions, and main board PCLK sourcing capability.
In concert with the WILDSTAR 4 or WILDSTAR 5 FPGA processing main boards, this mezzanine supplies user-confi gurable, real-time A to D conversion and digital output. Up to two A/D or D/A and up to two serial I/O cards can reside on each WILDSTAR 4 or WILDSTAR 5 VME/VXS or IBM Blade main board, or up to one A/D or D/A and up to one Serial I/O card on each PCI-X or PCIe main board. FEATURES Our boards run on many different operating systems. We support our i One or two 12-bit Analog to Digital Converters: Max 19693 for boards with a standardized set of drivers, APIs, and VHDL simulation 4.0 GSps, Max 19692 for 2.3 GSps, or Max 5859 for 1.5 GSps models. VHDL source is provided for the interfaces to A/Ds, D/As, i Five SMA front panel connectors: two single-ended DAC outputs, DRAM/SRAM, LAD bus, I/O bus, and PPC Flash. CoreFire™ users will one high-precision trigger input with Fs precision have the usual CoreFire Board Support Package. i One universal single- or double-ended 50-ohm clock input i High-precision trigger input manufacturing options – 1.65 V LVPECL,
The combination of our COTS hardware and our CoreFire FPGA 2.5 V LVPECL, 3.3 V LVPECL Application Development tool allows our customers to make mas- i I/O card plugs into WILDSTAR 4 or 5 VME/VXS/PCI-X/PCIe/ sive improvements in processing speed, while achieving signifi cant IBM Blade main boards savings in size, weight, power, person-hours, dollars, and calendar i JTAG, ChipScope, and Serial Port access time to deployment. Embedded Computing Design Resource Guide i Full CoreFire Board Support Package for fast, easy application development Annapolis Micro Systems, Inc. is a world leader in high-performance, i VHDL model, including source code for board-level interfaces COTS FPGA-based boards and processing for RADAR, SONAR, SIGINT, ELINT, DSP, FFTs, communications, Software-Defi ned Radio, i Proactive thermal management system encryption, image processing, prototyping, text processing, and i Industrial temperature range other processing-intensive applications. i Includes one-year hardware warranty, software updates, and customer support Annapolis is famous for the high quality of our products and for our i Designed and manufactured in the USA unparalleled dedication to ensuring that the customers’ applica- tions succeed. We offer training and exceptional special applica- tion development support, as well as more conventional customer support.
For more information, contact: wfi [email protected] www.embedded-computing.com/p36023
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SFPDP UNI6 I/O Annapolis Micro Systems Inc.’s FPGA-based WILDSTAR family provides 24 SFPDP channels per VME slot.
The Annapolis SFPDP cards (UNI3 or UNI6) come with an easy-to- use Serial FPDP interface supporting up to 12 lanes of 2.5 Gb full duplex data. Three frame types are supported: Normal Data Fiber
Frame, Sync without Data Fiber Frame, and Sync with Data Fiber Embedded Computing Design Resource Guide Frame in Point-to-Point Mode.
The card has three individually confi gurable, industry-standard 4X connectors, providing four lanes per connector, with dedicated sig- nal conditioners to ensure clean communication. It supports up to 7.5 GB full duplex per I/O card and a wide variety of readily available copper and fi ber cables.
Up to two Serial I/O cards and two LVDS I/O cards can reside on each WILDSTAR 4 or WILDSTAR 5 VME/VXS main board, with half that number for the PCI-X or PCIe. The SFPDP card (UNI6) supports RocketIO protocol at up to 75 Gb full duplex per I/O card, three ports of 10 G full duplex Infi niBand per I/O card, or 10 G full duplex Ethernet per I/O card. FEATURES i Three individually confi gurable 4X connectors – four lanes per No other FPGA board vendor can match the volume of data we can connector send straight into the heart of the processing elements and then i Up to four 2.5 Gb full duplex Serial FPDP ports per connector straight back out again. i Up to 25 Gb full duplex RocketIO per connector i Up to 10 Gb full duplex Infi niBand per connector An FPGA-based high-performance processing engine thrives on in- and-out data streaming at high rates of speed. The FPGAs should be i Up to 10 Gb full duplex Ethernet per connector part of a balanced and unifi ed system architecture, providing maxi- i Optional onboard oscillators for other line rates like Fibre Channel mum performance, with memory, processing power, and I/O speeds i I/O card plugs onto WILDSTAR 4 or 5 VME/VXS/IBM Blade chassis/ designed and integrated for performance, scalability, and growth. PCI-X/PCI Express main board i JTAG, ChipScope, and Serial Port access Annapolis Micro Systems, Inc.’s WILDSTAR 4 (Xilinx Virtex-4-based) and WILDSTAR 5 (Xilinx Virtex-5-based) families of FPGA-based i Proactive thermal management system; available in both processing boards also support an extensive set of extremely high- commercial and industrial temperature grades quality A/D and D/A boards. i Includes one-year hardware warranty, software updates, and customer support Annapolis Micro Systems, Inc. is a world leader in high-performance, i We offer training and exceptional special application development COTS FPGA-based boards and processing for RADAR, SONAR, support, as well as more conventional customer support SIGINT, ELINT, DSP, FFTs, communications, Software-Defi ned Radio, i Full CoreFire Board Support Package for fast, easy application encryption, image processing, prototyping, text processing, and development other processing-intensive applications. i VHDL model, including source code for hardware interfaces Annapolis is famous for the high quality of our products and for our unparalleled dedication to ensuring that the customers’ applications succeed.
For more information, contact: wfi [email protected] www.embedded-computing.com/p35968 www.embedded-computing.com Embedded Computing Design Resource Guide August 2011 | 67 Mezzanines Annapolis Micro Systems, Inc. "ENJSBM$PDISBOF%SJWF 4VJUFt"OOBQPMJT .% www.annapmicro.com
Tri XFP I/O Card Annapolis Micro Systems, Inc. is a world leader in high-performance, COTS FPGA-based boards and processing for RADAR, SONAR, SIGINT, ELINT, DSP, FFTs, communications, Software-Defi ned Radio, encryption, image processing, prototyping, text processing, and other processing-intensive applications.
| COTS Collection The Annapolis Tri XFP I/O Card, which works with the WILDSTAR 4/5 Family Architecture, has three 10 Gb individually confi gured XFP con- nectors, each with its own XAUI-to-XFI converter. Industry-standard pluggable fi ber optic transceivers can be purchased from Annapolis or from other vendors. The Tri XFP provides up to 30 Gb full duplex I/O directly between the outside world and the RocketIO pins on the Xilinx Virtex-II Pro or Virtex-4 I/O FPGA on the WILDSTAR 4 main board. No other vendor provides that volume of data straight into the heart of the processing elements and then back out again.
Two I/O cards can reside on each WILDSTAR 4 or WILDSTAR 5 VXS or PCI-X/PCI Express board, with up to 30 million user reprogram- mable gates. FEATURES i Up to 10 Gb Full Duplex Ethernet per connector The Tri XFP card will support 10 Gb Ethernet, 10 Gb Fibre Channel, i Up to 10 Gb Fibre Channel and OC-192. Although the protocols will be provided as black box i OC-192 solutions with few modifi cations by users allowed, more adventur- ous users who choose to develop their own communications proto- i Three 10 Gb XFP connectors cols from the basics already have access to all the board resources i Accepts industry-standard pluggable transceivers through VHDL source for the interfaces to SRAM, signal condition- i Available in both commercial and industrial temperature grades ™ ers, LAD bus, I/O bus, and PPC Flash. CoreFire users will have the i Includes one-year hardware warranty, software updates, and usual CoreFire Board Support Package. customer support i One or two I/O cards fi t on a single WILDSTAR 4/5 processing board The Tri XFP is the fi rst of many I/O cards Annapolis will be releasing Embedded Computing Design Resource Guide i New I/O form factor for improved thermal performance for its new WILDSTAR 4/5 Family Architecture, which uses Xilinx i First of many WILDSTAR 4/5 Family I/O cards, including superior per- Virtex-4 and Virtex-5 FPGAs for processing elements. WILDSTAR 4 is formance A/D, D/A, and additional high-speed communication cards the tenth generation of Xilinx FPGA processing-based COTS boards i Save time and effort; reduce risk with COTS boards and software from Annapolis. i Achieve world-class performance; WILD solutions outperform the competition Annapolis is famous for the high quality of our products and for our unparalleled dedication to ensuring that the customers’ applica- tions succeed. We offer training and exceptional special applica- tion development support, as well as more conventional customer support.
For more information, contact: wfi [email protected] www.embedded-computing.com/p35857
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WILDSTAR 6 – Pluggable Virtex-6 Module for IBM Blade Annapolis Micro Systems is a world leader in high-performance, COTS FPGA-based boards and processing for RADAR, SONAR, SIGINT, ELINT, DSP, FFTs, communications, Software-Defi ned Radio, encryption, image processing, prototyping, text processing, and other processing-intensive applications.
Our 14th-generation Pluggable Virtex-6 Module for WILDSTAR 5 for Embedded Computing Design Resource Guide IBM BladeCenter uses Xilinx’s newest Virtex-6 FPGAs for state-of- the-art performance. This module plugs into the WILDSTAR 5 for IBM BladeCenter. Other potential modules available today include Virtex-5 and Tilera. We support our board products with a standard- ized set of drivers, APIs, and VHDL simulation models.
Develop your application very quickly with our CoreFire™ FPGA Application Builder, which transforms the FPGA development pro- cess, making it possible for theoreticians to easily build and test their algorithms on the real hardware that will be used in the fi eld. CoreFire, based on datafl ow, automatically generates distributed control fabric between cores. FEATURES i One Virtex-6 FPGA processing element – XC6LX240T, XC6LX365T, Our extensive IP and board support libraries contain more than 1,000 XC6LX550T, XC6SX315, or XC6SX475 cores, including fl oating point and the world’s fastest FFT. CoreFire i Up to 3.5 GB DDR2 DRAM in 7 banks or up to 224 MB DDRII or QDRII uses a graphical user interface for design entry, supports hard- SRAM ware-in-the-loop debugging, and provides proven, reusable, high- i Plugs into any of 6 pluggable processing module slots on WILDSTAR 5 performance IP modules. The Virtex-6 Pluggable Module provides for IBM BladeCenter extremely high overall throughput and processing performance. The i Up to 16 RocketIO lanes to crossbar combination of our COTS hardware and CoreFire allows our cus- i 4 lanes connect to PCIe switch on WILDSTAR 5 Blade board tomers to make massive improvements in processing speed, while i LVDS systolic ring connecting all I/O FPGAs and computing FPGAs achieving signifi cant savings in size, weight, power, person-hours, i RocketIO systolic ring connecting pluggable positions 0-2 and 3-5 dollars, and calendar time to deployment. i Programmable Flash to store FPGA images on WILDSTAR 5 Blade board, which acts as host Annapolis is famous for the high quality of our products and for our i Full CoreFire Board Support Package for fast, easy application unparalleled dedication to ensuring that the customers’ applica- development tions succeed. We offer training and exceptional special application i VHDL model, including source code for hardware interfaces and development support, as well as more conventional support. ChipScope access i Host software: Windows, Linux, VxWorks, etc. i Available in both commercial and industrial temperature grades i Proactive thermal management system – board-level current measurement and FPGA temperature monitor, accessible through Host API i Save time and effort and reduce risk with COTS boards and software i Achieve world-class performance – WILD solutions outperform the competition i Includes one-year hardware warranty, software updates, and customer support; training available
For more information, contact: wfi [email protected] www.embedded-computing.com/p45438 www.embedded-computing.com Embedded Computing Design Resource Guide August 2011 | 69 Mezzanines Annapolis Micro Systems, Inc. "ENJSBM$PDISBOF%SJWF 4VJUFt"OOBQPMJT .% www.annapmicro.com
WILDSTAR 6 PCIe Annapolis Micro Systems, Inc. is a world leader in high-performance, COTS FPGA-based processing for radar, sonar, SIGINT, ELINT, DSP, FFTs, communications, Software-Defi ned Radio, encryption, image processing, prototyping, text processing, and other processing- intensive applications. Our 15th-generation WILDSTAR 6 for PCI Express uses Xilinx’s newest Virtex-6 FPGAs for state-of-the-art | COTS Collection performance. It accepts one or two I/O mezzanine cards, including single 1.5 GHz 8-bit ADC, quad 250 MHz 12-bit ADC, single 2.5 GHz 8-bit ADC, quad 130 MHz 16-bit ADC, dual 2.3/1.5 GSps 12-bit DAC, quad 600 MSps 16-bit DAC, Universal 3Gbit Serial I/O, (RocketIO, 10 Gb Ethernet, Inifi niBand) and Tri XFP (OC-192, 10G Fibre Channel, 10 Gb Ethernet).. Our boards work on a number of operating sys- tems, including Windows, Linux, Solaris, IRIX, ALTIX, and VxWorks. We support our board products with a standardized set of drivers, APIs, and VHDL simulation models.
Develop your application very quickly with our CoreFire™ FPGA Application Builder, which transforms the FPGA development process, making it possible for theoreticians to easily build and test their algorithms on the real hardware that will be used in the fi eld. FEATURES CoreFire, based on datafl ow, automatically generates distributed i Up to three Xilinx Virtex-6 FPGA I/O processing elements – LX240T, control fabric between cores. LX365T, LX550T, SX315T, or SX475T i Up to 8 GB DDRII DRAM or DDRIII DRAM in 14 memory banks per Our extensive IP and board support libraries contain more than WILDSTAR 6 for PCI Express board, or up to 480 MB DDRII+/QDRII 1,000 cores, including fl oating point and the world’s fastest FFT. DRAM in 15 memory banks CoreFire uses a graphical user interface for design entry, supports i Programmable Flash for each FPGA to store FPGA images hardware-in-the-loop debugging, and provides proven, reusable, i 8X PCI Express Bus Gen 1 or Gen 2 high-performance IP modules. WILDSTAR 6 for PCI Express, with its associated I/O Cards, provides extremely high overall through- i Supports PCI Express standard external power connector put and processing performance. The combination of our COTS i High-speed DMA Multi-Channel PCI controller Embedded Computing Design Resource Guide hardware and CoreFire allows our customers to make massive i Full CoreFire Board Support Package for fast, easy application improvements in processing speed, while achieving signifi cant development savings in size, weight, power, person-hours, dollars, and calendar i VHDL model, including source code for hardware interfaces and time to deployment. ChipScope access i Available in both commercial and industrial temperature grades Annapolis is famous for the high quality of our products and for our i Proactive thermal management system – Board-level current unparalleled dedication to ensuring that the customers’ applica- measurement and FPGA temperature monitor, accessible through tions succeed. We offer training and exceptional special application Host API development support, as well as more conventional support. i Includes one-year hardware warranty, software updates, and customer support. Training available. Save time and effort and reduce risk with COTS boards and software. Achieve world-class performance – WILD solutions outperform the competition.
For more information, contact: wfi [email protected] www.embedded-computing.com/p46784
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WS4 Quad 250/400/500 MSps A/D The Annapolis Quad Channel 250/400/500 MSps A/D I/O Card pro- vides 4 A/D inputs with converter speeds of up to 250, 400, or 500 MHz and resolutions of 13, 14, or 12 bits, respectively. The board has four A/D converters from TI (ADS5444, ADS5474, or ADS5463) fed by onboard analog input circuits that convert the single-ended, 50-ohm SMA input into differential signals for the ADC. Embedded Computing Design Resource Guide There is an onboard ultra-low jitter and skew clock distribution circuit to allow all four channels on a single A/D I/O board to be synchronized together. There is also an external clock input and a trigger input allowing multiple A/D I/O cards to be synchronized together. Synchronization of A/D I/O cards can be facilitated by the Annapolis 4 or 8 Channel Clock Distribution Boards.
In concert with the WILDSTAR 4 or WILDSTAR 5 FPGA processing main boards, this mezzanine board supplies user-confi gurable real- time continuous sustained processing of the full data stream. Up to two A/D I/O cards can reside on each WILDSTAR 4 or WILDSTAR 5 VME/VXS or IBM Blade main board or reside on one A/D I/O card on FEATURES each PCI-X or PCIe main board. i Four TI A/D converters of one of the speed and bit size types: ADS5444 250 MSps 13 bits, ADS5474 400 MSps 14 bits, ADS5463 Annapolis Micro Systems, Inc. is a world leader in high-performance, 500 MSps 12 bits COTS FPGA-based boards and processing for RADAR, SONAR, i Analog input bandwidths of up to: 500 MHz for the 250 MSps A/D board, 1,400 MHz for the 400 MSps A/D board, 2,000 MHz for the SIGINT, ELINT, DSP, FFTs, communications, Software-Defi ned Radio, 500 MSps A/D encryption, image processing, prototyping, text processing, and i Six SMA front panel connectors: four 50-ohm analog inputs, one other processing-intensive applications. single-ended 50-ohm clock input, one trigger input i Onboard ultra-low jitter and skew clock distribution circuit to allow Our boards run on many different operating systems. We support our synchronization of all four channels on a single I/O card boards with a standardized set of drivers, APIs, and VHDL simulation i I/O card plugs onto WILDSTAR 4 or 5 VME/VXS/PCI-X/PCIe/ models. VHDL source is provided for the interfaces to A/Ds, D/As, IBM Blade main boards DRAM/SRAM, LAD bus, I/O bus, and PPC Flash. CoreFire™ users will i JTAG, ChipScope, and Serial Port access have the usual CoreFire Board Support Package. i Proactive thermal management system; available in both commercial and industrial temperature ranges The combination of our COTS hardware and our CoreFire FPGA i Full CoreFire Board Support Package for fast, easy application Application Development tool allows our customers to make mas- development and technology refresh sive improvements in processing speed, while achieving signifi cant i VHDL model, including source code for hardware interfaces savings in size, weight, power, person-hours, dollars, and calendar i Includes one-year hardware warranty, software updates, and time to deployment. customer support; reduce risk with COTS i We offer training and exceptional special application development support, as well as more conventional customer support i Annapolis is famous for the high quality of our products and for our unparalleled dedication to ensuring that the customers’ applications succeed
For more information, contact: wfi [email protected] www.embedded-computing.com/p35976 www.embedded-computing.com Embedded Computing Design Resource Guide August 2011 | 71 Motherboards, blades, slot cards Annapolis Micro Systems, Inc. "ENJSBM$PDISBOF%SJWF 4VJUFt"OOBQPMJT .% www.annapmicro.com
Dual 40/100G CFP IBM Blade 2nd-Slot Card Annapolis Micro Systems, Inc. is releasing the fi rst COTS board in the world capable of capturing and processing multiple 100Gbit signals in real time! The Annapolis Dual 40/100G CFP IBM Blade 2nd-Slot Card enables the capture and real-time processing of massive amounts of data for Network Security and Signal Intelligence applications. Annapolis has integrated two CFP interfaces into their | COTS Collection Dual CFP IBM Blade 2nd-Slot Card, allowing the capture, buffering, and processing or transmission of two 100Gbit Ethernet streams per card or four 40Gbit Ethernet streams per card. The Dual CFP IBM Blade 2nd-Slot Card features one or two CFP transceiver cage interfaces, which can support either 100Gbit or 40Gbit Ethernet, 100Gbit OTU4, or 40Gbit SDH/OTU3.
Integral to any massively bandwidth-intensive application is the ability to process that data. The Dual CFP IBM Blade 2nd-Slot Card is designed to interface to the eight processors available on the WILDSTAR 5 IBM Blade main board. Using Altera Stratix IV FPGA processors, up to 37 GB of DDRIII DRAM, and a 160x160 6.5Gbit crossbar, the Dual CFP card is able to buffer and distribute the data from the CFP interfaces to the processors on a WILDSTAR 5 IBM FEATURES Blade main board at full bandwidth. i One or two CFP interfaces, each supporting full duplex: – 100Gbit and 40Gbit Ethernet (802.3ba) Annapolis will supply the Dual CFP IBM Blade 2nd-Slot Card with Ethernet MACs for 40Gbit and 100Gbit Ethernet, and full standardized – 100Gbit (OTU4) and 40Gbit (SDH/OTU3) for Telecommunications board support for VHDL models, drivers, and APIs. – Three 40Gbit Ethernet streams i One or two Altera Stratix IV GT EP4S100G5 FPGAs i Up to 37 GB of DDRIII DRAM arranged in up to eight 72-bit ports i Integrated as 2nd slot of WILDSTAR 5 for IBM Blade main processor
Embedded Computing Design Resource Guide board i Up to 68 full duplex Serial I/O lanes from CFP 2nd-slot board to WILDSTAR 5 IBM Blade main board i Supports enough memory bandwidth for buffering the incoming data i Includes 100Gbit and 40Gbit Ethernet MACs for Altera Stratix IV
For more information, contact: wfi [email protected] www.embedded-computing.com/p46786
72 | August 2011 Embedded Computing Design Resource Guide www.embedded-computing.com Motherboards, blades, slot cards COTS Collection | Annapolis Micro Systems, Inc. "ENJSBM$PDISBOF%SJWF 4VJUFt"OOBQPMJT .% www.annapmicro.com
WILDSTAR 5 for IBM Blade Perfect Blend of Processors and Xilinx Virtex-5 FPGAs. Eleventh Annapolis Generation.
Direct Seamless Connections – No data reduction between: exter- nal sensors and FPGAs, FPGAs and processors over Infi niBand or 10 Gb Ethernet backplane, FPGAs and standard output modules. Embedded Computing Design Resource Guide Ultimate Modularity – From zero to six Virtex-5 processing FPGA/ memory modules, and two Virtex-5 I/O FPGAs. Accepts one or two standard Annapolis WILDSTAR 4/5 I/O mezzanines: quad 130 MSps through quad 500 MSps A/D, 1.5 GSps through 2.2 GSps A/D, quad 600 MSps DAC, Infi niBand, 10 Gb Ethernet, SFPDP.
Fully Integrated into the IBM Blade Management System – Abundant power and cooling for maximum performance.
Annapolis Micro Systems, Inc. is a world leader in high-performance, COTS FPGA-based boards and processing for RADAR, SONAR, SIGINT, ELINT, DSP, FFTs, communications, Software-Defi ned Radio, encryption, image processing, prototyping, text processing, and FEATURES other processing-intensive applications. We support our board i From two to eight Virtex-5 FPGA processing elements – LX110T, products with a standardized set of drivers, APIs, and VHDL simula- LX220T, LX330T, FX100T, FX130T, or FX200T; six are pluggable with tion models. power module and memory i Up to 10.7 GB DDR2 DRAM per WILDSTAR 5 for IBM Blade board Develop your application very quickly with our CoreFire™ FPGA i 144 x 144 crossbar; 3.2 Gb per line; two external PPC 440s – 1 per Application Builder, which transforms the FPGA development pro- each I/O FPGA cess, making it possible for theoreticians to easily build and test i Full CoreFire Board Support Package for fast, easy application their algorithms on the real hardware that will be used in the fi eld. development CoreFire, based on datafl ow, automatically generates distributed i VHDL model, including source code for hardware interfaces and control fabric between cores. Our extensive IP and board support ChipScope access libraries contain more than 1,000 cores, including fl oating point and i Available in both commercial and industrial temperature grades the world’s fastest FFT. A graphical user interface for design entry i Proactive thermal management system – board-level current supports hardware-in-the-loop debugging and provides proven, measurement and FPGA temperature monitor, accessible through reusable, high-performance IP modules. Host API i Includes one-year hardware warranty, software updates, and WILDSTAR 5 for IBM Blade, with its associated I/O cards, provides customer support extremely high overall throughput and processing performance. The i Blade management controller; USB, RS-485, Ethernet, KVM, 16 RIO, combination of our COTS hardware and CoreFire allows our cus- switch to 1 GbE over backplane tomers to make massive improvements in processing speed, while i Save time and effort; reduce risk with COTS boards and software achieving signifi cant savings in size, weight, power, person-hours, i We offer training and exceptional special application development dollars, and calendar time to deployment. support, as well as more conventional support i Famous for the high quality of our products and our unparalleled Achieve world-class performance; WILDSTAR solutions outperform dedication to ensuring that the customers’ applications succeed the competition.
For more information, contact: wfi [email protected] www.embedded-computing.com/p35882 www.embedded-computing.com Embedded Computing Design Resource Guide August 2011 | 73 PICMG: CompactPCI, MicroTCA, AdvancedTCA, COM Express, AMC, chassis, backplanes Annapolis Micro Systems, Inc. "ENJSBM$PDISBOF%SJWF 4VJUFt"OOBQPMJT .% www.annapmicro.com
WILDSTAR 6 for AMCs Annapolis Micro Systems, Inc. is a world leader in high-perfor- mance, COTS FPGA-based processing for radar, sonar, SIGINT, ELINT, DSP, FFTs, communications, Software-Defi ned Radio, encryp- tion, image processing, prototyping, text processing, and other pro- cessing-intensive applications. Our 14th-generation WILDSTAR 6 for AMC uses Xilinx’s newest Virtex-6 FPGAs for state-of-the-art | COTS Collection performance. It accepts one FMC I/O Card. Our boards work on a number of operating systems, including Windows, Linux, Solaris, IRIX, ALTIX, and VxWorks. We support our board products with a standardized set of drivers, APIs, and VHDL simulation models.
Develop your application very quickly with our CoreFire™ FPGA Application Builder, which transforms the FPGA development pro- cess, making it possible for theoreticians to easily build and test their algorithms on the real hardware that will be used in the fi eld. CoreFire, based on datafl ow, automatically generates distributed control fabric between cores.
Our extensive IP and board support libraries contain more than 1,000 cores, including fl oating point and the world’s fastest FFT. FEATURES CoreFire uses a graphical user interface for design entry, sup- i One Xilinx Virtex-6 FPGA I/O Processing Element – LX240T, LX365T, ports hardware-in-the-loop debugging, and also provides proven, LX550T, SX315T, or SX475T reusable, high-performance IP modules. WILDSTAR 6 for AMC, with i Onboard Host Freescale P1020 or P2020 PowerPC its associated I/O Cards, provides extremely high overall through- put and processing performance. The combination of our COTS i Up to 2.5 GB DDRII DRAM in 5 memory banks or up to 80 MB DDRII or QDRII DRAM in 5 memory banks hardware and CoreFire allows our customers to make massive improvements in processing speed, while achieving signifi cant i Programmable Flash to store FPGA image savings in size, weight, power, person-hours, dollars, and calendar i 4X PCI Express Bus Gen 2 between PPC and FPGA time to deployment. i Supports VITA 57 FMC I/O Cards
Embedded Computing Design Resource Guide i Full CoreFire Board Support Package for fast, easy application Annapolis is famous for the high quality of our products and for our development unparalleled dedication to ensuring that the customers’ applications i VHDL model, including source code for hardware interfaces and succeed. We offer training and exceptional special application ChipScope access development support, as well as more conventional support. i Available in both commercial and industrial temperature grades i Proactive thermal management system – current, voltage, and Save time and effort and reduce risk with our COTS boards and temperature monitoring sensors via Host API software. Achieve world-class performance – WILD solutions i Includes one-year hardware warranty, software updates, and outperform the competition. customer support. Training available.
For more information, contact: wfi [email protected] www.embedded-computing.com/p46785
74 | August 2011 Embedded Computing Design Resource Guide www.embedded-computing.com PICMG: CompactPCI, MicroTCA, AdvancedTCA, COM Express, AMC, chassis, backplanes COTS Collection | BittWare )JMMT"WFOVFt$PODPSE /) www.bittware.com
S4-AMC: Altera Stratix® IV GX AdvancedMC with VITA 57 Site BittWare’s S4-AMC (S4AM) is a mid- or full-size, single-wide AdvancedMC featuring a high-density, low-power Altera Stratix IV designed specifi cally for Serial I/O-based applications, creating a com- pletely fl exible, reconfi gurable AMC.
BittWare’s ATLANTiS FrameWork, in conjunction with the FINe III Host/Control Bridge, greatly simplifi es application development and Embedded Computing Design Resource Guide integration of this powerful board. FEATURES The board also provides an IPMI system management interface, a i VITA 57 FMC site for I/O and processing expansion confi gurable 15-port AMC SerDes interface supporting a variety of i High-density Altera Stratix IV GX supported by BittWare’s protocols, and a front panel 4x SerDes interface supporting CPRI ATLANTiS™ FrameWork and OBSAI. Additionally, the board features 10/100/1000 Ethernet, i BittWare’s FINe™ III Host/Control Bridge provides control plane Gigabit Ethernet, 2 banks of DDR3 SDRAM, 2 banks of QDRII+ SRAM, processing and interface and Flash memory for booting the FPGAs and FINe. i Fully connected to AMC (16 ports SerDes, 4 ports LVDS) i I/O includes 10/100/1000 Ethernet, SerDes, LVDS, RS-232, and JTAG Providing enhanced fl exibility is the VITA 57 FMC site, providing 8 SerDes, 60 LVDS pairs, and 6 clocks directly to the FPGA.
For more information, contact: [email protected] www.embedded-computing.com/p41361
PICMG: CompactPCI, MicroTCA, AdvancedTCA, COM Express, AMC, chassis, backplanes Kontron 4UPXF%SJWFt1PXBZ $" www.kontron.com
Kontron COM Express Modules Kontron offers the most expansive portfolio of COM Express compliant and compatible modules. Modules range in performance and power consumption from the ultra small, extremely power effi cient nanoETXexpress-TT with the newest Intel Atom Exxx processor series all the way up to the top-performing ETXexpress-SC featuring 2nd generation Intel® Core™ i7 processors.
For more information on all of the Kontron COM Express solutions, visit www.kontron.com/ETXexpress. FEATURES i COM Express Type 1, Type 2, Type 6 and Type 10 solutions i Processing performance up to 2.53 GHz Intel® Core™ i7 processors i Integrated advanced graphics capability with the AMD G-Series APUs and the Fusion Controller Hub i Other low-power, CPU-based modules also available i Up to 16 MB system memory on COMs with dual-channel and ECC memory support i ETXexpress, microETXexpress, nanoETXexpress – size options all following the COM Express standard pin-outs i Request a sample today and start evaluating immediately
For more information, contact: [email protected] www.embedded-computing.com/p42374 www.embedded-computing.com Embedded Computing Design Resource Guide August 2011 | 75 PICMG: CompactPCI, MicroTCA, AdvancedTCA, COM Express, AMC, chassis, backplanes Kontron 4UPXF%SJWFt1PXBZ $" www.kontron.com
Kontron 3U CompactPCI CP3002 and CP3923 Processor Board & Gigabit Ethernet Switch 5IF ,POUSPO $13$ XJUI UIF *OUFM® Core™ i7 mobile processor -&o85%1 JTDPOEVDUJPODPPMFEBOETVQQPSUTPQFSBUJPOBM temperatures ranging from -40° to +85°C according to VITA 47. The powerful processor and the ruggedness make the Kontron CP3002 ideal for a range of new real-time, data-intensive and network- | COTS Collection centric applications in the defense and aerospace industry as well as transportation and other sectors that require reliable per- FEATURES i CP3002-RC GPSNBODF JO IBSTI FOWJSPONFOUT 6Q UP (# PG TPMEFSFE %%3 t3VHHFEDPOEVDUJPODPPMFE .)[&$$NFNPSZFOTVSFTEBUBBDDVSBDZGPSEFNBOEJOHBOE t0QFSBUJOHUFNQFSBUVSF¡UP ¡$ 7*5" mission-critical and safety-critical applications. t(#TPMEFSFENFNPSZ&$$BU.)[ t$PNQSFIFOTJWFGFBUVSFTFUoY(C& Y64# 7(" Y$0. 5IF,POUSPO$1JTBGVMMZNBOBHFE-BZFS(JHBCJU&UIFSOFU switch offering IPv4/IPv6 routing and full management capabilities. It i CP3923 t'VMMZNBOBHFE-BZFSBOE-BZFSTXJUDIJOHBOESPVUJOH TVQQPSUTBQPXFSGVMTFUPG$-* 5FMOFU 8FCBOE4/.1NBOBHFNFOU t-FBEJOHFEHFUFDIOPMPHZCBTFEPO#$. JOUFSGBDFTUPDPOmHVSFUIFFOUJSFTFUPGQSPUPDPMTBOEQBSBNFUFST t7FSTBUJMFEFTJHOXJUI3+PS.%GSPOUPQUJPOT JODMVEJOH -BZFS BOE -BZFS *1W*1W QSPUPDPMT NVMUJDBTUJOH t&/DPNQMJBOU XJUI.WFSTJPOT QoS and security. t%FTJHOQSFQBSFEGPSDPOEVDUJPODPPMJOH
For more information, contact: [email protected] www.embedded-computing.com/p45804
PICMG: CompactPCI, MicroTCA, AdvancedTCA, COM Express, AMC, chassis, backplanes Kontron 4UPXF%SJWFt1PXBZ $" www.kontron.com
Kontron 6U CompactPCI CP6003-SA and CP6930 Processor Board & 10 Gigabit Ethernet Switch Embedded Computing Design Resource Guide The Kontron CP6003-SA, available with the 2nd Generation Intel® Core™ i7/i5 quad and dual core processors, meets the highest com- puting and graphics performance requirements at the lowest power budgets (32 nm technology). The power of up to four cores enables virtualization and multithreading applications to run in full 64-bit mode using Intel® Enhanced Virtualization, HD Graphics and Turbo FEATURES Boost Technology. i CP6003-SA t6QUP(#%%3.)[NFNPSZXJUI&$$WJBUXP40%*.. The Kontron CP6930 is a hot-swappable CPCI and VITA 31 switch t sockets with 26 GbE ports and six high-performance uplinks (10 GbE). The tY(JHBCJU&UIFSOFUJOUFSGBDFTWJB1$*&YQSFTT t-BUFTU*0UFDIOPMPHZXJUI4"5"(FO 3"*% 44% CP6930 is designed for future-oriented applications requiring out- t9.$1.$ POCPBSE)%% 44%'MBTIDPOmHVSBUJPOQPTTJCMF standing bandwidth and communication safety. Six SFP+ front ports running at 10 Gb/s full line speed and two SFP ports at the front i CP6930 providing 1 Gb support give fl exibility and an intrinsic value for t/POCMPDLJOH-BZFSBOETXJUDIJOHBOESPVUJOH *1WDPNQMJBOU today’s investments. tY(JHBCJU&UIFSOFUQPSUTBDDPSEJOHUP1*$.(7*5" t'VMMZNBOBHFE IPUTXBQ *1.*
t%)$1TFSWFSBOECPPUNFEJBTVQQPSU t$PNQSFIFOTJWFmSNXBSFQBDLBHF
For more information, contact: [email protected] www.embedded-computing.com/p53035
76 | August 2011 Embedded Computing Design Resource Guide www.embedded-computing.com PICMG: CompactPCI, MicroTCA, AdvancedTCA, COM Express, AMC, chassis, backplanes COTS Collection | Kontron 4UPXF%SJWFt1PXBZ $" www.kontron.com
Kontron AdvancedMC™ processor module AM4120 5IF,POUSPO"EWBODFE.$™ QSPDFTTPSNPEVMF".JTFRVJQQFE with the Freescale™ QorIQ P2020 dual core processor with up to 1.2 GHz and based on the Power Architecture® e500. Application reliability is ensured with features such as the redundant universal CPPUMPBEFS6#PPUBOEQFSTJTUFOUNFNPSZGPSDZDMFEBUBTUPSBHF " EFEJDBUFE .PEVMF .BOBHFNFOU $POUSPMMFS ..$ XIJDI TVQ QPSUTCBTJD*1.*DPNNBOET JTVTFEGPSCPBSENBOBHFNFOU FOBCMJOH Embedded Computing Design Resource Guide PQFSBUPST UP NPOJUPS UIF TUBUVT PG UIF "EWBODFE.$™ module in the system, simplifying system management and improving avail- FEATURES BCJMJUZ5IF,POUSPO".BMTPPGGFSTJODSFBTFEMPOHFWJUZEVFUP i Freescale™ QorIQ P2020 – dual core @ 1.2 GHz Freescale’s processor availability until at least 2018, careful i 6QUP(#3".XJUI&$$ DPNQPOFOU TFMFDUJPO BOE B .JDSP4%)$ DBSE TPDLFU UIBU JT OPU i Y(C&".$QPSU YGSPOU PSQPSU YGSPOU impacted by regular Flash discontinuation. i microSD card socket
i Extended temperature range on project request ® 5IFVOJWFSTBM,POUSPO".PGGFSTDPTUTFOTJUJWF"EWBODFE5$" i 6TFBCMFJONBOBHFE XJUI.$) BOEVONBOBHFE XJUIPVU.$) BOE .JDSP5$"™ system designs long-term availability, support of systems various fabrics and an extraordinary performance-per-watt ratio. i Processor roadmap until 2018
For more information, contact: [email protected] www.embedded-computing.com/p52841
PICMG: CompactPCI, MicroTCA, AdvancedTCA, COM Express, AMC, chassis, backplanes Scan Engineering Telecom GmbH &MJTBCFUITUSBTTF t.VOJDI (FSNBOZ www.setdsp.com
SAMC-404 – High-performance DSP AMC board 5IF 4".$ TJOHMF NJEGVMMTJ[F "EWBODFE .F[[BOJOF $BSE (".$ JTEFTJHOFEBSPVOEIJHIQFSGPSNBODF5*5.4$%41T combining a wide range of fabric interfaces with colossal external NFNPSZ5IF4QBSUBO"/'1("JOUFSDPOOFDUTXJUI%41TWJB(1*0 MJOFTBOETVQQPSUTUIFJSDPOmHVSBUJPOWJB*$CVT
5IF4".$JTJOUFOEFEGPSQSPDFTTJOHBQQMJDBUJPOTUIBUSFRVJSF high performance, high bandwidth and low latency. The board takes FEATURES GVMMBEWBOUBHFPGUIF5*5.4$%41TQPXFS XIJDINBLFT i 'PVSIJHIQFSGPSNBODF5*5.4$%41T FBDISVOOJOH up to 1.20GHz UIF4".$QFSGFDUGPSSFEVDJOHTJ[F DPNQMFYJUZ SJTLTBOEDPTUT i 1FBLQFSGPSNBODFPG.*14 BTTPDJBUFE XJUI MFBEJOHFEHF 4PGUXBSF%FmOFE 3BEJP 4%3 OFU i Integrated Viterbi and turbo-code processors working, data processing, telecommunication, industrial, defense i )JHIMZFGmDJFOU&%."DPOUSPMMFSXJUIJOEFQFOEFOUMJOFTJO and medical applications. each DSP i 5PUBM%%3**4%3".NFNPSZDBQBDJUZPG.# i Two Gigabit Ethernet channels i 5XP4FSJBM3BQJE*0YCVTFT i 4VQQPSUT$-, $-,BOE$-, i 4JOHMFNJEGVMMTJ[F".$GPSNGBDUPS i Available now
For more information, contact: [email protected] www.embedded-computing.com/p47262 www.embedded-computing.com Embedded Computing Design Resource Guide August 2011 | 77 PICMG: CompactPCI, MicroTCA, AdvancedTCA, COM Express, AMC, chassis, backplanes Scan Engineering Telecom GmbH &MJTBCFUITUSBTTF t.VOJDI (FSNBOZ www.setdsp.com
SAMC-514 – High-performance quad-core processor AMC board The SAMC-514 single full-size processor AMC board is the second generation of SET’s high-performance quad-core processor AMC boards. The SAMC-514 is designed around the 2nd Generation Intel Core i7 CPU, combining an unsurpassed range of fabric interfaces with a great amount of soldered DDRIII memory.
| COTS Collection The SAMC-514 is intended for processing applications that require high performance, high bandwidth and a variety of interfaces. FEATURES The board takes full advantage of the 2nd Generation Intel i 2nd Generation quad-core Intel Core i7 CPU running at 2.10GHz Core i7’s power, which makes the SAMC-514 perfect for reducing i Up to 8GB soldered 1333MHz DDRIII memory with ECC size, complexity, risks and costs associated with leading-edge i Up to 128GB onboard SATAII SSD telecommunications, networking, data processing, DSP, industrial, i Main fabric interface: 2x Gigabit Ethernet, 2x SATAIII, defense and medical applications. The SAMC-514’s fabric interfaces 2x PCI Express Gen2 x4 offer almost endless interconnect possibilities with other boards i Extended fabric interface: 2x SATAII, PCI Express Gen2 x4, in the chassis. 2x USB 2.0, 2x UART i Front panel: 2x Gigabit Ethernet, HDMI, 2x USB 2.0, COM via USB i Single full-size AMC board i Available in Q’2 2011
For more information, contact: [email protected] www.embedded-computing.com/p47263
PICMG: CompactPCI, MicroTCA, AdvancedTCA, COM Express, AMC, chassis, backplanes Scan Engineering Telecom GmbH &MJTBCFUITUSBTTF t.VOJDI (FSNBOZ www.setdsp.com
SAMC-713 – AMC board with FMC site The SAMC-713 single mid-/full-size Advanced Mezzanine Card Embedded Computing Design Resource Guide (AMC) is designed around the powerful Xilinx Virtex-6 FPGA LXT or SXT family, combining a wide range of fabric interfaces with colos- sal external memory. The board’s FMC expansion site offers almost endless I/O possibilities for installed FMC boards.
The SAMC-713 is intended for processing applications that require high performance, high bandwidth and low latency. The board FEATURES takes full advantage of the Xilinx Virtex-6 FPGA’s power, which i Xilinx Virtex-6 FPGA LXT (LX130T to LX364T) or SXT (SXT315T or makes the SAMC-713 perfect for reducing size, complexity, risks 495T) family i Four independent 16-bit 2Gb DDRIII SDRAM memory banks, and costs associated with leading-edge Software-Defi ned Radio 8Gb in total (SDR), telecommunication, networking, data processing, industrial i FMC expansion site for air/conduction cooled FMC boards and medical applications. i 75 LVDS DDR pairs between FMC and FPGA, data transfer rate of 75Gb/s i 12 full-duplex GTX lines i Supports Gigabit Ethernet, PCI Express Gen1/Gen2 x8/x4/x1, Serial RapidIO x4/x1, XAUI, SATA i Supports CLK1, CLK2 and CLK3 i Operating temperature range: 0 to +50° C or -40 to +85° C
For more information, contact: [email protected] www.embedded-computing.com/p47264
78 | August 2011 Embedded Computing Design Resource Guide www.embedded-computing.com PICMG: CompactPCI, MicroTCA, AdvancedTCA, COM Express, AMC, chassis, backplanes COTS Collection | Schroff $PNNFSDF%SJWFt8BSXJDL 3* 5FM t'BY t5PMMGSFF www.schroff.co.uk Always one step ahead. Backplanes, power supplies, accessories up to the system platform solution from a single source Pentair Technical Products with its brand Schroff delivers a diver- sifi ed product range. Their products are based on standardized components that can be matched quickly and simply to individual requirements. Based on modular building blocks, they ensure that even for the highest demands, functionality and security are Embedded Computing Design Resource Guide maintained under all conditions. Whether you are interested in mechanical components, power supplies, backplanes, accessories or complete PICMG system solutions, you will collaborate with a reliable partner.
Schroff supplies a broad range of PICMG products such as CompactPCI, CompactPCI PlusIO, CompactPCI Serial, AdvancedTCA and MicroTCA. With our outstanding experience in mechanical design, cooling solutions, EMC, high-speed backplane design and shelf management, we assist you in defi ning your system solution. Even for harsh environments we have the adequate range of products: our rugged mechanical solution or the conformal coating capabilities for backplanes and electronic circuitries. FEATURES The Schroff AdvancedTCA systems already fulfi l the near-future i Large product range market requirements. All new standard systems have a 40G back- i Superior cooling capabilities plane installed. Power distribution and cooling capacity are dimen- i Excellent backplanes, signal integrity sioned for 300 W per slot. The Schroff standard product range i Data transfer rates up to 40G covers 2-, 6-, 14- or 16-slot confi gurations with DC input. AC solu- tions are available on request. All chassis are controlled via a shelf i Expertise in shelf management manager with PPS SHMM module 500. i Comprehensive range of accessory products i Engineered confi gurations to meet your exact requirements Schroff has a new family member for the MicroTCA.0 chassis family. The new chassis with only 4 U height houses 12 AMC slots, 2 redundant MCH and 2 power module slots. Two removable fan trays on the system backside guarantee powerful front-to-back cooling in only 4 U system height.
Schroff has, in addition, broadened the product portfolio into a sys- tem line in accordance to MTCA.4. A cube and a 19"-wide system with rear I/O and special clock and trigger signals are available.
The CompactPCI system family also has new members. Schroff has designed a new 4 U system and 2 backplanes in accordance with the newly released CompactPCI PlusIO dot-specifi cation. The system allows a smooth migration from the legacy CompactPCI bus to the new, fast serial data communication with PCIe, Ethernet, SATA and USB. Schroff has 2 new systems and 6 backplanes in accordance with the newest PICMG specifi cation, CompactPCI Serial. They implement the new serial communications with up to 32 Gb/s.
All chassis are UL-ready, and the AdvancedTCA and MicroTCA chassis are NEBS-ready.
For more information, contact: [email protected] www.embedded-computing.com/p46576 www.embedded-computing.com Embedded Computing Design Resource Guide August 2011 | 79 Small form factors: PC/104, SUMIT, -ITX, FeaturePak, chassis AAEON Electronics, Inc. $SPXO1MB[Bt)B[MFU /+ www.AAEON.com
Intel® Atom™ E6xx Platforms If you are looking for maximum performance fused with effi ciency in a small form factor, look no further than AAEON. We offer the latest Intel® Atom™ modular solutions in all platforms. The COM-TC, NanoCOM-TC and AQ7-TC offer the robustness and the versatil- ity of a 4" x 5.75" single board computer as seen in our GENE-TC05. In addition, the GENE-TC05 offers an abundant feature set with | COTS Collection single board computer independence and ease of use in a compact solution.
Take advantage of AAEON’s Design-to-Delivery Computer On FEATURES Module Services with a customized carrier board and get the most i High performance out of our AAEON boards with Intel® Atom™ processors for all of i Low power consumption your applications. i 24-bit LVDS support i Gigabit Ethernet i PCI Express i MPEG-4 decoder
For more product information, please visit: www.AAEON.com www.embedded-computing.com/p47791
Small form factors: PC/104, SUMIT, -ITX, FeaturePak, chassis AAEON Electronics, Inc. $SPXO1MB[Bt)B[MFU /+ www.AAEON.com
PFM-LNP AAEON is pleased to announce the launch of the PFM-LNP, a small Embedded Computing Design Resource Guide full function PCI-104 module. AAEON’s PFM-LNP comes with an Intel® Atom™ N450 processor and 1GB DDR2 667 onboard memory. The PFM-LNP provides rich I/O ports: (1) 10/100/1000 Ethernet, (1) SATA 3.0Gb/s, (1) CompactFlash™, (3) RS-232 serial ports, (1) RS-232/422/485 serial port and (4) USB 2.0. The PFM-LNP offers both PCI-104 and full function PCI Express Mini Card expansion. Suitable applications include transportation, kiosk, building automa- tion, factory automation and instrumentation. FEATURES
i Intel® Atom™ N450 + ICH8M i 1GB DDR2 667 onboard memory i PCI-104, mini PCI Express card (USB + PCIe [x1]) i VGA, 18-bit single channel LVDS i 1x SATAII, CompactFlash™ i 4 USB, 4x serial ports, 1x GbE
For more product information, please visit: www.AAEON.com www.embedded-computing.com/p47790
80 | August 2011 Embedded Computing Design Resource Guide www.embedded-computing.com Small form factors: PC/104, SUMIT, -ITX, FeaturePak, chassis COTS Collection | ACCES I/O Products, Inc. 3PTFMMF4USFFUt4BO%JFHP $" www.accesio.com
USB-DIO-96 High-Density Digital I/O Designed for compact control and monitoring applications, this product features 96 or 48 industrial strength TTL digital I/O. This USB device is an ideal solution for adding portable, easy-to-install digital I/O to any PC or embedded system with a USB port. The USB-DIO-96 is useful for monitoring dry contacts or generating outputs for controlling external devices such as LEDs and other indicators or system equipment. Applications include home, Embedded Computing Design Resource Guide portable, laptop, education, laboratory, industrial automation, and FEATURES embedded OEM. i 96 or 48 lines of digital I/O i High-speed USB 2.0 device, USB 1.1 backward-compatible These boards use 2 or 4 industry standard 50-pin IDC-type shrouded i Twelve or six 8-bit ports independently selectable for inputs or outputs headers with 24 lines per connector. Utility 5VDC is available on i All I/O lines buffered with 32mA source, 64mA sink current pin 49 of each connector with grounds on all even numbered pins capabilities to reduce crosstalk and maintain industry compatibility. A mini i I/O buffers can be enabled or tri-stated under program control USB header connector is provided in parallel with the high retention i Jumper-selectable I/O pulled up to 5V for contact monitoring, type B connector for stacking and embedded applications. Available down-to-ground, or fl oating accessories include a wide variety of cables and screw terminal i Resettable fused +5VDC outputs per 50-pin connector boards for quick and easy connectivity. i OEM version (board only) features PC/104 module size and mounting compatibility
For more information, contact: [email protected] www.embedded-computing.com/p42373
Small form factors: COM/SOM EMAC, Inc. &."$8BZt$BSCPOEBMF *- www.emacinc.com
SoM-9G45/9M10 The SoM-9G45/9M10 is a System-on-Module (SoM) based on the Atmel ARM9 AT91SAM9G20 or AT91SAM9M10 processor. This fanless ARM9, 400 MHz SoM has an Ethernet PHY included with 4 serial ports. It utilizes up to 256 MB of external DDR2/SDRAM, 1 GB of NAND Flash, and includes an MMU that allows it to run Linux and Windows CE Operating Systems. A SoM is a small embedded module that contains the core of a microprocessor system. FEATURES i Small, 200-pin SODIMM form factor (2.66" x 2.375") Using the same small 200-pin SODIMM form factor utilized by other i Atmel ARM9 Jazelle AT91SAM9G45 or 9M10 400 MHz processor EMAC SoMs, the SoM-9G45/9M10 is the ideal processor engine for i 10/100BASE-T Ethernet with onboard PHY your next design. All of the ARM processor core is included on this i 4 serial ports with handshake and 1 I2C and 2 SPI ports 2 tiny board featuring: Flash, memory, serial ports, Ethernet, I S audio, i 1 USB 2.0 Host and 1 Host/Device (USB OTG) high-speed ports PWMs, timer/counters, A/D, digital I/O lines, video, clock/calendar, i Up to 1 GB of NAND Flash, 8 MB of Datafl ash, and 256 MB of RAM and more. Price is $190, quantity 1. i On-module microSD card socket and 2nd external SD card interface i 1 I2S audio port www.emacinc.com/som/som9g45.htm i Graphic LCD interface with up to 1280 x 860 resolution i Resistive touchscreen interface i Hardware CODECs: H.264, MPEG-4, MPEG-2, VC-1, H.263 i Typical power requirement less than 1 Watt
For more information, contact: [email protected] www.embedded-computing.com/p44298 www.embedded-computing.com Embedded Computing Design Resource Guide August 2011 | 81 Small form factors: PC/104, SUMIT, -ITX, FeaturePak, chassis Kontron 4UPXF%SJWFt1PXBZ $" www.kontron.com
Kontron mini-ITX Motherboards Kontron motherboards are the ideal solution for embedded applica- tions. As the options for embedded computing continue to expand, identifying the right choice becomes more complicated and can be very confusing. In applications where longevity and risk avoidance must be optimized, Kontron’s experience in a variety of markets can lead customers to the solution that meets their technical needs as
| COTS Collection well as critical programming and time-to-market objectives. Kontron’s latest addition to the motherboards portfolio of products FEATURES ® is the KTQM67/mITX based on 2nd Generation Intel Core i7, i5 i Longevity and risk avoidance are optimized and i3 dual and quad core processors paired with the Intel® QM67 i Up to 2nd Generation Intel® i7, i5 and i3 dual and quad core chipset. Not only does this small motherboard deliver the desirable processors storage device resource connection (6x SATA) plus second-gen. i Long life support PCI Express x16 and 14x USB 2.0, it also supports Intel® Active Management Technology (AMT) 7.0 for remote management and i Offering the ideal performance-per-watt ratio easy maintenance. i Solutions that meet performance, critical programming and cost needs Each board is designed for processor- and graphics-intensive applications such as: gaming, medical technology, multimedia, point of information, point of sale, data communications and high-end thin clients.
For more information, contact: [email protected] www.embedded-computing.com/p52373
Small form factors: PC/104, SUMIT, -ITX, FeaturePak, chassis Kontron 4UPXF%SJWFt1PXBZ $" www.kontron.com
Kontron Small Form Factor PC/104 SBCs The demands placed on appliances used in the fi eld range from Embedded Computing Design Resource Guide extreme temperature exposure to constant vibration and much more. The solutions need to be designed to be reliable and survive under such conditions. Kontron offers PC/104 SBCs including Intel® Atom ™ and Core™ Duo processor offerings within the MICROSPACE® family that do just that. Kontron uses industrial-grade components for by-design solutions that can withstand harsh conditions. Additionally, 100 percent extended temperature-tested solutions are available to ensure the solution meets the application-specifi c temperature requirements. FEATURES i Scalable solutions offering power effi ciency and performance including the latest Intel dual core Atom processor and FPGA technology as well as the new AMD G-Series APU i Support for onboard and expandable system memory i Drop-in replacements within the Kontron SBC product family i PCIe/104™, PCI/104-Express and PC/104-Plus i Request a sample today and start evaluating immediately
For more information, contact: [email protected] www.embedded-computing.com/p46615
82 | August 2011 Embedded Computing Design Resource Guide www.embedded-computing.com Small form factors: PC/104, SUMIT, -ITX, FeaturePak, chassis COTS Collection | MSI (Micro-Star INT’L Co., LTD.) /P -JEF4U ;IPOHIF%JTUt/FX5BJQFJ$JUZ 5BJXBO 30$ 5FM www.msi.com/ipc
MSI IM-QM67 with Intel® Sandy Bridge Processor MSI IM-QM67, which is powered by the Intel® Sandy Bridge pro- cessor and Intel® QM67 Express chipset, supports multiple display outputs in a Mini-ITX form factor.
MSI IM-QM67 is based on the Intel® Core™ i7/i5/i3 processors to offer lower power consumption and enhanced graphic and media performance. The IM-QM67 is equipped with dual-channel DDR3 Embedded Computing Design Resource Guide 1067/1333/1600 MHz memory, up to 16 GB in dual SO-DIMM slots. MSI IM-QM67 provides improved power effi ciency and high-speed data transfer for performance-driven industrial applications, such as FEATURES industrial control, automation, digital signage, kiosk, POS, gaming, i Intel® Core™ i7/i5/i3 processor and Intel® QM67 Express chipset ATM, and medical electronics. i Multi-HD videos up to 1080p and multi-displays, including HDMI, VGA, LVDS, dual DVI MSI IM-QM67 supports multi-display outputs, including dual- i Dual-channel DDR3 1067/1333/1600 MHz memory, up to 16 GB channel 18/24-bit LVDS, VGA, dual DVI, HDMI, and dual-display i 4 COM ports, 8 USB ports confi gurations. It has great 3D graphics performance and support for up to 1080p high-defi nition video. IM-QM67 provides a wide range i 5 x SATA (2 x SATA 3.0, 2 x SATA 2.0, 1 x SATA 2.0 for CFast, supports RAID 0/1/5/10) of storage, I/O, and expansion connectivity, including 4 COM ports, i Suited for performance-driven industrial applications, including 8 USB ports, and 4 SATA ports. Expansion takes the form of one CFast industrial control, automation, digital signage, kiosk, POS, gaming, slot, one PCI slot, and one Mini-PCIe slot. ATM, and medical electronics
For more information, contact: [email protected] www.embedded-computing.com/p52947
Small form factors: PC/104, SUMIT, -ITX, FeaturePak, chassis – Systems: Mobile computers RadiSys Corporation /&%BXTPO$SFFL%SJWFt)JMMTCPSP 03 t'BYt5PMM'SFF www.radisys.com
RadiSys COM Express CEQM57XT Next-Generation Performance The RadiSys COM Express CEQM57XT combines the next-generation performance Intel® Core™ i5 and i7 processors and the Mobile Intel® QM57 Express chipset with RadiSys’ -25C to +70C extended temperature and vibration specifi cations to provide breakthrough processing performance on a ruggedized COM Express module. The basic size 95mm x 125mm module is ideal for compute- intensive applications such as military-aerospace, transportation and FEATURES industrial applications requiring high levels of performance and i -25C to +70C extended temperature range ® ™ durability. i Intel Core i5 and i7 processor options: t*OUFM$PSF™ i7 610E 2.53GHz t*OUFM$PSF™ i7 620L 2.0GHz t*OUFM$PSF™ i7 620U 1.06GHz i Mobile Intel® QM57 Express chipset i Dual-channel DDR3, up to 8GB i Type 2 pin-out i TPM i Six PCI Express x1 ports, one PCI Express x8 port i Single or dual Gigabit Ethernet options i Conformal coat option – Humiseal 1B31
For more information, contact: [email protected] www.embedded-computing.com/p47710 www.embedded-computing.com Embedded Computing Design Resource Guide August 2011 | 83 Small form factors: COM/SOM Technologic Systems &BTU-BTFS%SJWFt'PVOUBJO)JMMT "; www.embeddedARM.com
TS-7500 Ultra-Compact 250 MHz ARM9 Computer Module The TS-7500 is an ultra-compact embedded computer module based on a 250 MHz ARM9 CPU from Cavium Networks. With 64 MB RAM, 4 MB bootable onboard fl ash, a microSD card slot, and a 5K LUT programmable FPGA, the TS-7500 is a powerful and fl exible embed- ded solution. The TS-7500 boots Linux 2.6 from onboard fl ash or SD card in under 3 seconds. 10/100 Ethernet, USB slave, and dual | COTS Collection USB host ports are brought out directly. The 44-pin downward facing header brings out I2C and 31 FPGA-controlled lines, making it easy to interface with a base board of your own design. The kit also includes a microSD card pre-loaded with Debian Linux for the TS-7500, a complete self-hosted GNU C/C++ development toolchain, and a Windows cross toolchain utilizing Eclipse IDE.
User-Programmable FPGA The TS-7500 features a 5K LUT LatticeXP2 FPGA. Although loaded by default with a standard bitstream that implements SD card access, GPIO, SPI, and 8 XUART high-performance UARTs, the FPGA can easily be reloaded automatically at startup with a user- programmed bitstream. Does your application require custom real- time logic such as non-standard bus interfaces, PWM outputs, quadrature decoding, pulse timing, or digital counters? Technologic FEATURES Systems can integrate that functionality into a custom TS-7500 FPGA i 250 MHz ARM9 CPU confi guration for an elegant and affordable solution. For our custom- i 64 MB DDR-RAM ers who prefer to do their own development, Technologic Systems i 4 MB NOR Flash has made available a TS-7500 open-core Verilog project. A bitstream i 5K LUT user-programmable FPGA that implements CAN and SPI is also available. i 1 microSDHC card slot i USB 2.0 480 Mbps host (2) The TS-7500 Development Kit The development kit includes the TS-ENC750 enclosure with the i USB 2.0 480 Mbps slave (1) TS-752 base board. The base board demonstrates the power of i 1 10/100 Ethernet Embedded Computing Design Resource Guide the TS-7500, implementing relays, RS-232, RS-485, CAN, Power- i 8 TTL UARTs or 3 UARTs & CAN over-Ethernet, and DIO signal protection. The kit also includes i 33 DIO, SPI, and I2C interfaces a microSD card pre-loaded with Debian Linux for the TS-7500, a i Watchdog timer complete GNU C/C++ development environment, and Eclipse IDE i Optional battery backed RTC for Windows. i Power-over-Ethernet ready i Small size (67 mm x 75 mm) Similar Boards Also Available: i Low power (400 mA @ 5 V) TS-7550 features a 256 MB ultra-reliable XNAND drive for a i Fanless operation from -20 °C to +70 °C guaranteed successful bootup. Please visit our website for more i Unbrickable, boots from SD or Flash information on XNAND technology. i Boots Linux 2.6 in less than 3 seconds TS-7552 features a 256 MB ultra-reliable XNAND drive, additional i AppKit includes baseboard and enclosure USB ports, and Wi-Fi option.
TS-7553 features a 256 MB ultra-reliable XNAND drive, Wi-Fi option, and an inexpensive DIN mountable plastic enclosure option.
For more information, contact: [email protected] www.embedded-computing.com/p42440
84 | August 2011 Embedded Computing Design Resource Guide www.embedded-computing.com Small form factors: COM/SOM COTS Collection | Technologic Systems &BTU-BTFS%SJWFt'PVOUBJO)JMMT "; www.embeddedARM.com
TS-SOCKET MACROCONTROLLERS JUMP-START YOUR EMBEDDED SYSTEM DESIGN The TS-SOCKET Macrocontrollers are a series of embedded computers based on the TS-SOCKET connector standard. These CPU core modules securely connect to your custom base board, enabling drastically reduced design time and complexity. Start your embedded system design around one of our TS-SOCKET Macro- controllers to reduce your overall project risk and accelerate time- Embedded Computing Design Resource Guide to-market.
TS-SOCKET MACROCONTROLLER STANDARD TS-SOCKET is an embedded computer standard designed and con- trolled by Technologic Systems, Inc. It defi nes both a form factor and a connection pin-out and is based on two 100-pin low-profi le con- nectors, allowing secure connection between a Macrocontroller and a base board.
A TS-SOCKET Macrocontroller is an embedded CPU board that implements the TS-SOCKET specifi cation. The form factor is 75 mm x 55 mm, about the size of a credit card. In addition to two 100-pin off-board male connectors, a TS-SOCKET Macrocontroller features CPU, RAM, NAND Flash, SD Card socket, and Ethernet MAC/PHY FEATURES and requires a single 5 V power source. Peripherals can include USB i 75 mm x 55 mm (credit card sized) host and device, I2C, CAN, GPDIO, external bus, video, touchscreen, i Dual 100-pin connectors audio, SPI, and UART. All parts are soldered on and no moving parts i Secure connection with mounting holes are used, ensuring embedded ruggedness and reliability. i Common pin-out interface i Low profi le with 6 mm spacing A TS-SOCKET base board can be any piece of hardware, supplied by the customer or Technologic Systems, that interfaces with a BENEFITS macrocontroller through the dual TS-SOCKET standard connectors. i Simplifi es custom embedded systems i Rapid design process gets products to market faster INEXPENSIVE CUSTOM DESIGNS, FAST TIME-TO-MARKET i Several COTS base boards for evaluation and development All TS-SOCKET Macrocontrollers will be designed with a com- i Design your own base board or use our design services mon pin-out, which means that they are interchangeable. This will i Macrocontrollers are interchangeable for future upgrades give our customers more options and fl exibility when selecting an embedded system, since a base board can be used with multiple TS-SOCKET MACROCONTROLLER PROJECTS macrocontrollers. As an application example, a base board designed i TS-4200: Atmel ARM9 with super low power to provide video and touchscreen functionality can have its CPU i TS-4500: Cavium ARM9 at extremely low cost easily upgraded to improve video playback performance, or later as i TS-4700: Marvell PXA168 with video and 1.0 GHz CPU a second generation upgrade. Lower design costs and faster time- i TS-4800: Freescale iMX515 with video and 800 MHz CPU to-market directly result from the TS-SOCKET board interchange- ability feature because the standardization signifi cantly reduces PRICE AND AVAILABILITY design complexity. i TS-4200, TS-4500, TS-4700, and TS-4800 are available now. Several COTS development base boards are available, and TS-TPC-8390 is available as a complete touch panel computer product using either TS-4700 or TS-4800 Macrocontroller CPUs. i Prices start at $92 at quantity 100.
For more information, contact: [email protected] www.embedded-computing.com/p44297 www.embedded-computing.com Embedded Computing Design Resource Guide August 2011 | 85 Small form factors: PC/104, SUMIT, -ITX, FeaturePak, chassis VersaLogic Corp. 8UI"WFt&VHFOF 03 www.VersaLogic.com/tiger
This Tiger is as solid as a rock!
Low-power Intel Atom Z5xx processor on a PC/104-Plus form factor VersaLogic’s new ”Tiger“ single board computer is compact and rugged on a 3.6" x 4.5" PC/104-Plus form factor. Featuring the low- power Intel® Atom™ Z5xx (Menlow-XL) processor, the Tiger packs powerful 1.6GHz performance backed by legendary VersaLogic
| COTS Collection quality. It’s available in both commercial (0º to +60ºC) and industrial FEATURES (-40º to +85ºC) temperature versions! i Intel Atom Z5xx processor (up to 1.6GHz) i Low power, 6W (typical) Add VersaLogic’s long-term (5+ year) product availability guarantee i True industrial temp. version (-40º to +85ºC) and customization options and feel the power of the Tiger! i High-performance video and HD audio i Gigabit Ethernet With more than 30 years of experience delivering extraordinary i DDR2 RAM (up to 2GB) support and on-time delivery, VersaLogic has perfected the art i PCI & ISA expansion of service, one customer at a time. Experience it for yourself. i Fanless operation i USB 2.0 (7 ports) Call 800-824-3163 for more information! i Serial I/O (4 ports) i IDE interface i DiskOnModule Flash socket i MIL-STD-202G shock/vibe
For more information, contact: [email protected] www.embedded-computing.com/p52216
Small form factors: PC/104, SUMIT, -ITX, FeaturePak, chassis VIA Technologies .JTTJPO$PVSUt'SFNPOU $" www.viaembedded.com
The First High-Performance Full HD Mini-ITX Embedded Board – EPIA-M850
Embedded Computing Design Resource Guide The VIA EPIA-M850 Mini-ITX board pairs the latest 64-bit VIA Nano E-Series processor with the VIA VX900 media system processor, creating the most complete platform for commercial embedded multimedia and media center devices.
The VIA EPIA-M850 board features a choice of VIA Nano E-Series processor, available in both 1.6GHz and fanless 1.2GHz SKUs. The VIA Nano E-Series leverages the VIA VX900 MSP to support up to Dual core solution is available in Q3 2011. 8GB of DDR3 system memory. FEATURES The VIA VX900 features the latest ChromotionHD 2.0 video engine, i Supports VC1, MPEG-2, H.264 and WMV9 at 1080p boasting comprehensive hardware acceleration for the latest VC1, i Supports up to 8GB of DDR3 memory H.264, MPEG-2 and WMV9 HD formats at screen resolutions of up i Supports one HDMI port, one VGA port and one dual-channel 24-bit to 1080p without incurring a heavy CPU load. Display connectivity LVDS port support includes onboard HDMI and VGA ports with pin headers for i Supports two SATA ports, eight USB ports, one USB device port, dual-channel 24-bit LVDS. four COM ports, one 4-lane PCIe slot and one GigaLAN port i Supports Windows 7, Windows Embedded Standard 7, XP, XPe, CE and Linux
For more information, contact: [email protected] www.embedded-computing.com/p46182
86 | August 2011 Embedded Computing Design Resource Guide www.embedded-computing.com Small form factors: PC/104, SUMIT, -ITX, FeaturePak, chassis COTS Collection | VIA Technologies .JTTJPO$PVSUt'SFNPOU $" www.viaembedded.com
World’s Smallest Full HD Pico-ITX Board – EPIA-P830 Based on the incredibly compact Pico-ITX form factor, measuring 10cm x 7.2cm, the VIA EPIA-P830 Pico-ITX board takes advantage of a 1.2GHz 64-bit VIA Nano processor and the latest VIA VX900 media system processor. The EPIA-P830 also supports a broad Dual core variety of connectivity and network options via an expansion board solution is that provides two Mini-PCIe slots, the fi rst of its kind on a Pico-ITX available in Q3 2011. form factor board. These Mini-PCIe slots provide connectivity Embedded Computing Design Resource Guide through Wi-Fi and GSM/3G technologies, making the VIA EPIA-P830 a well connected portable device platform. FEATURES i Integrated VIA Chrome9 HC DX9 3D/2D graphics with VC1, MPEG-2, The latest VIA VX900 MSP adds support for DDR3 memory, HD WMV9 and H.264 decoding acceleration audio, HDMI, VGA and LVDS display connectivity, as well as a high- i Supports high-bandwidth DDR3 memory, up to 4GB performance hardware HD video decoder in the shape of the latest i Supports two SATA VIA ChromotionHD 2.0 video engine. i Supports seven USB 2.0 ports (fi ve as pin headers) i Supports digital I/O The VIA ChromotionHD 2.0 provides advanced fi ltering and cutting- i Supports one VGA and one HDMI port edge post-processing to perform ultra smooth decoding of H.264, i Supports one single-channel 24-bit LVDS panel MPEG-2, VC-1 and WMV9, providing smooth playback of the most i Flawless HD video performance, including 1080p demanding multimedia formats at resolutions up to 1080p without i Support for two 1x PCIe expansion connectors incurring a heavy CPU load. i Legacy I/O support including GPIO, SMBus
For more information, contact: [email protected] www.embedded-computing.com/p44387
Small form factors: PC/104, SUMIT, -ITX, FeaturePak, chassis VIA Technologies .JTTJPO$PVSUt'SFNPOU $" www.viaembedded.com
VIA System-on-Module Solutions t COTS designs that can be tailored to specifi c requirements and applications t Full breadth of CPU performance range including multi-core readiness t Availability of starter kits, embedded APIs, tools, technical documentation and SDKs t Optimized to address SWaP-C (Space, Weight, Power and Cost) requirements t Comprehensive support of RTOS and GPOS t Up to 7 years of product lifecycle support t Product offering: COM Express Module, Qseven Module and Em-ITX embedded SBCs Em-ITX Form Factor t Dimensions: 17cm x 12cm t Self-reliant embedded board that accommodates two full I/O coastlines. The baseboard can contain a series of standard interfaces, such as USB 2.0, Gigabit Ethernet, mouse, keyboard, COM, CompactFlash, IDE, SATA, VGA, LVDS, etc. t Scalability in Em-IO interface t Reliable 160-pin high density and ruggedized Em-IO interface
For more information, contact: [email protected] www.embedded-computing.com/p52368 www.embedded-computing.com Embedded Computing Design Resource Guide August 2011 | 87 Small form factors: PC/104 WinSystems, Inc. 4UBEJVN%SJWFt"SMJOHUPO 59 817-274-7553 www.WinSystems.com
Multifunction PC/104 A/D, D/A, & DIO Module The PCM-MIO is a versatile, PC/104-based analog input, analog output and digital I/O board. The board’s precision converters and voltage references require no calibration.
It will support up to 16 single-ended input channels or 8 differen- tial input channels with a 16-bit A/D. The software programmable | COTS Collection input ranges are ±5V, ±10V, 0-5V and 0-10V. There are eight 12-bit Digital-to-Analog (D/A) converters with individual software pro- grammable voltage ranges of ±5V, ±10V, 0-5V and 0-10V. A total of FEATURES 48 bidirectional TTL-compatible digital I/O lines can be software i Two 16-bit 100K samples/sec Analog-to-Digital (A/D) converters confi gured as input, output or output with readback. i Two quad 12-bit Digital-to-Analog (D/A) converters i 48 bidirectional TTL-compatible digital I/O lines The PCM-MIO operates over the industrial temperature range of i Free software drivers in C, Windows® and Linux -40°C to +85°C. Free software drivers are available for C, Windows® ° ° and Linux. i -40 C to +85 C operational temperature i Lower cost A/D- or D/A-only confi gurations available WinSystems also offers one confi guration with A/D only and another i 30-day product evaluation program with only D/A.
For more information, contact: [email protected] www.embedded-computing.com/p41298
Small form factors: PC/104 WinSystems, Inc. 4UBEJVN%SJWFt"SMJOHUPO 59 817-274-7553 www.WinSystems.com
-40°C to +85°C PC/104-Plus SBC with Video and Ethernet The PPM-LX800-G is a highly integrated PC/104-Plus Single Board Embedded Computing Design Resource Guide Computer (SBC) designed for space-limited and low-power appli- cations. It is a full-featured SBC that includes the AMD LX800 x86-compatible CPU. Its low power dissipation permits fanless operation over a temperature range from -40°C to +85°C. This board is well suited for rugged applications requiring excellent processor performance in an embedded PC design.
The PPM-LX800-G has x86 PC software compatibility, which assures FEATURES a wide range of tools to aid in your application’s program develop- i AMD LX800 CPU; x86-compatible i Small size: 90mm x 96mm ment and checkout. It supports both Windows® XP Embedded and i Video with CRT resolutions to 1920 x 1440 and fl at panel resolutions Linux operating systems and other real-time operating systems. to 1600 x 1200 WinSystems provides free technical phone support to assist i Custom splash screen on start-up customers with system integration of our SBCs and I/O modules in i 10/100 Mbps Ethernet controller i Two USB 2.0 ports with overcurrent protection their designs. i Four serial RS-232/422/485 channels with FIFOs i 16 digital I/O lines with event sense supported For more information go to i AC’97 audio, LPT, mouse and keyboard controllers www.winsystems.com/PPM-LX800 i -40°C to +85°C operating temperature i Long-term PC/104-Plus product availability
For more information, contact: [email protected] www.embedded-computing.com/p41296
88 | August 2011 Embedded Computing Design Resource Guide www.embedded-computing.com Small form factors: PC/104 COTS Collection | WinSystems, Inc. 4UBEJVN%SJWFt"SMJOHUPO 59 817-274-7553 www.WinSystems.com
-40° to +85°C PC/104 SBC with Dual Ethernet The PCM-VDX-2 is a highly integrated PC/104-compatible Single Board Computer (SBC) designed for space-limited and low-power applications.
The full-featured SBC includes a 1GHz Vortex86DX with 512KB of DRAM. I/O support includes two 10/100 Ethernet ports, four USB 2.0 ports and four COM channels. Its low power dissipation permits fan- Embedded Computing Design Resource Guide less operation over a temperature range from -40°C to +85°C. This board is well suited for rugged applications requiring excellent pro- FEATURES cessor performance in an embedded PC design. i Fanless 1GHz Vortex86DX processor i Small size: 90mm x 96mm The PCM-VDX-2 has x86 PC software compatibility, which assures i Two 10/100 Mbps Ethernet controllers a wide range of tools to aid in your application’s program develop- i Four USB 2.0 ports with overcurrent protection ment and checkout. It supports both Windows® XP Embedded and i Four serial RS-232/422/485 channels with FIFOs Linux operating systems and other real-time operating systems. i 16 digital I/O lines with event sense supported i AC’97 audio, PATA, LPT, mouse and keyboard controllers WinSystems provides free technical phone support to assist i MiniPCI and PC/104 expansion connectors customers with system integration of our SBCs and I/O modules with i -40°C to +85°C operating temperature their designs. i Long-term PC/104 product availability
For more information, contact: [email protected] www.embedded-computing.com/p52377
Small form factors: PC/104, EPIC WinSystems, Inc. 4UBEJVN%SJWFt"SMJOHUPO 59 817-274-7553 www.WinSystems.com
Fanless 1.66GHz Intel® Atom™ EPIC SBC WinSystems’ EPX-C380 is a full-featured EPIC-compatible SBC with a rich array of onboard peripherals such as video, Ethernet, USB, and serial, plus more I/O expansion options with PC/104 and MiniPCIe modules.
It also supports either the Intel® Atom™ single core N450 or dual core D510 processors. Since the EPX-C380’s architecture is PC-compatible, it supports Windows® XP Embedded, WES7, and Linux software operating systems along with a vast software development tool set FEATURES including device drivers and libraries. i Intel® Atom™ 1.66GHz single or dual core CPU i Advanced power management features The board is designed for rugged applications, including industrial i Supports CRT and fl at panels simultaneously automation, security, Mil/COTS, and transportation. It operates over i Two Intel Gigabit Ethernet controllers a temperature range of -40°C to +70°C without a fan or the necessity i 802.11a/b/g wireless supported with MiniPCIe to slow down the CPU clock frequency. i Four serial COM ports, four USB 2.0 ports, and 48 bidirectional TTL digital I/O lines i Two SATA channels and CompactFlash supported For more information go to i PC/104 and MiniPCIe module expansion www.winsystems.com/EPX-C380ER i Starter kits to speed system development
For more information, contact: [email protected] www.embedded-computing.com/p47868 www.embedded-computing.com Embedded Computing Design Resource Guide August 2011 | 89 VITA: VME, VPX, VXS, PMC/XMC, FMC, chassis, backplanes Annapolis Micro Systems, Inc. "ENJSBM$PDISBOF%SJWF 4VJUFt"OOBQPMJT .% www.annapmicro.com
WILDSTAR 6 for OpenVPX Annapolis Micro Systems is a world leader in high-performance, COTS FPGA-based boards and processing for RADAR, SONAR, SIGINT, ELINT, DSP, FFTs, communications, Software-Defi ned Radio, encryption, image processing, prototyping, text processing, and other processing-intensive applications.
| COTS Collection Our 14th-generation WILDSTAR 6 for OpenVPX uses Xilinx’s newest Virtex-6 FPGAs for state-of-the-art performance. It accepts one or two I/O mezzanine cards in one VPX slot or up to 4 in a double- wide VPX slot, including single 1.5 GHz 8-bit ADC, quad 250 MHz 12-bit ADC, single 2.5 GHz 8-bit ADC, quad 130 MHz 16-bit ADC, dual 2.3/1.5 GSps 12-bit DAC, quad 600 MSps 16-bit DAC, Universal 3Gbit Serial I/O (RocketIO, 10 Gb Ethernet, Infi niBand), and Tri XFP (OC-192, 10G Fibre Channel, 10 Gb Ethernet). Our boards work on a number of operating systems, including Windows, Linux, Solaris, IRIX, ALTIX, and VxWorks. We support our board products with a standardized set of drivers, APIs, and VHDL simulation models.
Develop your application very quickly with our CoreFire™ FPGA FEATURES Application Builder, which transforms the FPGA development pro- i Up to three Virtex-6 FPGA processing elements – XC6LX240T, cess, making it possible for theoreticians to easily build and test XC6LX365T, XC6LX550T, XC6SX315, or XC6SX475 their algorithms on the real hardware that will be used in the fi eld. i Up to 7 GB DDR2 DRAM in 14 banks or up to 448 MB DDRII or QDRII CoreFire, based on datafl ow, automatically generates distributed SRAM control fabric between cores. i OpenVPX backplane i 80 x 80 crossbar connecting FPGAs and VPX backplane Our extensive IP and board support libraries contain more than 1,000 i 1 GHz 460EX PowerPC onboard host cores, including fl oating point and the world’s fastest FFT. CoreFire i 4X PCIe controller uses a graphical user interface for design entry, supports hard- i Programmable Flash to store FPGA images and for PCI controller ware-in-the-loop debugging, and provides proven, reusable, high- i Full CoreFire Board Support Package for fast, easy application performance IP modules. WILDSTAR 6 for OpenVPX, with its development Embedded Computing Design Resource Guide associated I/O Cards, provides extremely high overall through- i VHDL model, including source code for hardware interfaces and put and processing performance. The combination of our COTS ChipScope access hardware and CoreFire allows our customers to make massive i Host software: Windows, Linux, VxWorks, etc. improvements in processing speed, while achieving signifi cant i Available in both commercial and industrial temperature grades savings in size, weight, power, person-hours, dollars, and calendar i Proactive thermal management system – board-level current time to deployment. measurement and FPGA temperature monitor, accessible through Host API Annapolis is famous for the high quality of our products and for our i Save time and effort and reduce risk with COTS boards and unparalleled dedication to ensuring that the customers’ applica- software tions succeed. We offer training and exceptional special application i Achieve world-class performance – WILD solutions outperform the competition development support, as well as more conventional support. i Includes one-year hardware warranty, software updates, and customer support; training available
For more information, contact: wfi [email protected] www.embedded-computing.com/p45439
90 | August 2011 Embedded Computing Design Resource Guide www.embedded-computing.com VITA: VME, VPX, VXS, PMC/XMC, FMC, chassis, backplanes COTS Collection | Annapolis Micro Systems, Inc. "ENJSBM$PDISBOF%SJWF 4VJUFt"OOBQPMJT .% www.annapmicro.com
Four Channel Clock Synchronization Board The Four Channel Clock Distribution Board distributes a common clock and synchronized control signal triggers to multiple cards in the system. This 6U VME64x/VXS board provides four high-speed, ultra-low jitter, ultra-low skew differential bulkhead mounted clock outputs, two ultra-low skew differential vertical SMA onboard clock outputs, and four ultra-low skew and clock synchronized single- ended bulkhead mounted control signal triggers. Embedded Computing Design Resource Guide
A jumper set at board installation time or via optional P2 serial port determines which one of the two installed clock sources is active. Manufacturing options for Clock Source 0 are single-ended or dif- ferential external clock, a PLL ranging from 700 MHz to 3 GHz with an onboard reference oscillator, or a PLL ranging from 700 MHz to 3 GHz with a 10 MHz external reference. Manufacturing options for Clock Source 1 are a PLL ranging from 700 MHz to 3 GHz with an onboard reference oscillator, a PLL ranging from 700 MHz to 3 GHz with a 10 MHz external reference, or an onboard low frequency oscillator ranging up to 800 MHz. FEATURES The four control trigger outputs can originate from a high-precision i Four synchronized differential front panel clock outputs up to external source via front panel SMA, from a manual push button 3 GHz with typical skew of 5 ps on the front panel, or from software via an optional backplane P2 i Ultra-low clock jitter and phase noise – 275 Fs with 1,280 MHz PLL connector serial port. These trigger outputs are synchronized to the and external 10 MHz reference distributed clock to provide precise output timing relationships. i Onboard PLL’s manufacturing options provide fi xed frequencies of 700 MHz to 3 GHz, locked to internal or external reference Annapolis Micro Systems is a world leader in high-performance, i Onboard low frequency oscillator provides fi xed frequencies up to COTS FPGA-based boards and processing for RADAR, SONAR, approximately 800 MHz SIGINT, ELINT, DSP, FFTs, communications, Software-Defi ned Radio, i Four synchronized trigger outputs, always synchronized with encryption, image processing, prototyping, text processing, and the output clock, with typical skew of 5 ps other processing-intensive applications. i Jumper-selectable trigger output levels of 3.3 V PECL, 2.5 V PECL, or 1.65 V PECL Annapolis is famous for the high quality of our products and for our i Source trigger from front panel SMA, push button, or optional unparalleled dedication to ensuring that the customers’ applica- P2 serial port tions succeed. We offer training and exceptional special application i Cascade boards to provide up to 16 sets of outputs development support, as well as more conventional support. i Compatible with standard VME64x and VXS 6U backplanes i Universal clock input supports wide range of signal options, including sine wave signal generator i Differential clock input permits multiple standards including: LVDS, 3.3 V PECL, 2.5 V PECL, and 1.65 V PECL i Clock and trigger outputs compatible with all Annapolis Micro Systems, Inc. WILDSTAR™ 2 PRO I/O Cards and WILDSTAR™ 4/5 Mezzanine Cards
For more information, contact: wfi [email protected] www.embedded-computing.com/p33661 www.embedded-computing.com Embedded Computing Design Resource Guide August 2011 | 91 VITA: VME, VPX, VXS, PMC/XMC, FMC, chassis, backplanes BittWare )JMMT"WFOVFt$PODPSE /) www.bittware.com
S4-3U-VPX: Comm & Rugged Altera Stratix® IV GX 3U VPX Board BittWare’s S4-3U-VPX (S43X) is a commercial or rugged 3U VPX card based on the high-density, low-power Altera Stratix IV GX FPGA.
The Stratix IV GX is designed specifi cally for Serial I/O-based applications, creating a completely fl exible, reconfi gurable VPX board. BittWare’s ATLANTiS FrameWork and the FINe Host/Control | COTS Collection Bridge greatly simplify application development and integration of this powerful board. FEATURES The board provides a confi gurable 25-port SerDes interface sup- i VITA 57 FMC site for processing and I/O expansion porting a variety of protocols, including Serial RapidIO, PCI Express, i High-density Altera Stratix IV GX supported by BittWare ATLANTiS™ and 10 GigE. The board also features 10/100/1000 Ethernet, and up FrameWork for FPGAs to 4 GB of DDR3 SDRAM. i BittWare FINe™ Host/Control Bridge provides control plane processing and interface Providing enhanced fl exibility is the VITA 57-compliant FMC site, i Fully connected to VPX: GigE, 15 SerDes, 32 LVDS which supports 10 SerDes, 60 LVDS pairs, and 6 clocks. i Additional I/O: 10/100/1000 Ethernet, RS-232, JTAG
For more information, contact: [email protected] www.embedded-computing.com/p52808
VITA: VME, VPX, VXS, PMC/XMC, FMC, chassis, backplanes CES Creative Electronic Systems "WFOVF&VHFOF-BODFt(SBOE-BODZ (FOFWB 4XJU[FSMBOE www.ces.ch
ETS-8227 The ETS-8227 is the world’s fi rst 3U OpenVPX multi-fabric switch- Embedded Computing Design Resource Guide board featuring PCIe, SRIO and GbE switches for ground or airborne applications. This board allows the switching between PCI Express (Gen1/Gen2) and Serial RapidIO (1.3/2.1) data planes. In addition, the two onboard crosspoint switches permit fl exibility of the payload profi le confi guration in accordance with OpenVPX. The ETS-8227 also incorporates a Gigabit Ethernet switch for the control plane, which includes Layer 2 switching and aggregation features. An integrated Advanced Board Management Controller provides FEATURES high-speed system status monitoring, logging and dynamic reload i 3U OpenVPX form factor (VITA 65) functions in real-time. i One PCI Express Gen2 switch (12 ports) for data plane i One Serial RapidIO 2.1 switch (12 ports) for data plane i One Gigabit Ethernet switch (8 ports) for control plane i Two crosspoint switches (40x40) for programmable payload profi le confi guration (PCIe x4 Gen2, SRIO x4, GbE) i Integrated advanced board management controller i Rear I/O transition module for additional interfaces
For more information, contact: [email protected] www.embedded-computing.com/p52941
92 | August 2011 Embedded Computing Design Resource Guide www.embedded-computing.com VITA: VME, VPX, VXS, PMC/XMC, FMC, chassis, backplanes COTS Collection |
Innovative Integration "8BSE"WFOVFt4JNJ7BMMFZ $" www.innovative-dsp.com
VPX-COMEX The VPX-COMEX is a 3U OpenVPX system controller CPU card that integrates an Intel CPU COM Express CPU module with SRIO switch, system timing and triggering features, and a Spartan-6 FPGA core. The VPX-COMEX supports VPX systems with up to 4 other PCIe/SRIO cards and timing/triggering support for embedded communications instrumentation, and data acquisition applications. FEATURES i COM Express Type 6 CPU module Embedded Computing Design Resource Guide – Intel i7 @ 2.53 GHz/i5 @ 2.4 GHz The CPU core is a COM Express module, a PICMG industry standard, – Up 8 GB 1066 MHz DDR3 ECC memory that is an Intel Architecture i7 or i5 CPU with QM57 chipset. The i PCI Express Root supports x4/x4/x1/x1 endpoints COM Express module runs Windows, Linux, or VxWorks, providing i GbE, USB 2.0, 3x SATA300, DisplayPort a familiar and easy-to-use software environment that is abundant i Integrated 1.8 in SATA SSD up to 256 GB i Serial RapidIO Data Plane Switch in tools and applications, resulting in dramatically lower time-to- – 8x SRIO Gen2 (5 Gbps) ports to VPX market than other CPU architectures. – Front panel QSFP x4 optical link i Precision timing/triggering support – PLL with 125 KHz to 1 GHz tuning range with -110 dB phase noise @ 10 kHz The VPX-COMEX supports 4 expansion cards using PCI Express – 10 MHz, 0.28 PPM clock reference and SRIO. The PCI Express root complex has x4, x4, x1 and x1 Gen1 – Reference input support for GPS integration – Synchronized triggering outputs endpoint support, provided by the chipset. The SRIO data plane i Xilinx Spartan-6 LX45T to LX120T FPGA core complements the PCIe connectivity with a central switch providing i < 50 W typical; conduction or forced-air cooling 8 SRIO Gen2 links (5 Gbps each). i Operating Environment: 0˚C to 60˚C, 0 to 100% RH, 30g shock, 0.04 g2/Hz random vibe
For more information, contact: [email protected] www.embedded-computing.com/p52900
VITA: VME, VPX, VXS, PMC/XMC, FMC, chassis, backplanes
Innovative Integration "8BSE"WFOVFt4JNJ7BMMFZ $" www.innovative-dsp.com
VPX6-COP The VPX6-COP is a fl exible FPGA coprocessor card that integrates a Virtex-6 FPGA computing core with an industry-standard FMC I/O module on a 3U OpenVPX card.
The FPGA computing core features the Xilinx Virtex-6 FPGA family, in densities up to LX550 and SX475. The SX475 provides over 2000 DSP MAC elements operating at up to 500 MHz. The FPGA core has two FEATURES 9 MB QDRII+ SRAM banks, two 256 MB LPDDR2 DRAM banks, and i 3U OpenVPX FPGA coprocessor card a 128 MB DDR3 bank. Each memory is directly connected to the i FMC I/O site (VITA 57) with 8x 5 Gbps MGT lanes, 80 LVDS pairs FPGA and is fully independent. (LA, HA, HB full support) i 2 banks of 256 MB DRAM (512 MB total) i 2 banks of 9 MB QDRII+ SRAM (18 MB total) For system communications, the VPX6-COP has a PCI Express and i 128 MB DDR3 DRAM two SRIO/Aurora interfaces. The PCIe port is a x8, Gen2 interface i VPXI system-timing features supporting global and local timing and capable of up to 2 GB/s sustained operation with 4 GB/s burst rate. triggering features Two additional x4 system ports support either SRIO, Aurora or i Gen2 x8 PCI Express providing 4 GB/s burst and 2 GB/s sustained transfer rates custom protocols. i Two Serial RapidIO or Aurora ports supporting x4 Gen2 (2 GB/s) i < 15 W typical excluding FMC i Ruggedization levels up to L4 forced air or conduction cooling i 40 g shock, 9 g sine vibration 0.1 g2/Hz random vibe
For more information, contact: [email protected] www.embedded-computing.com/p52896 www.embedded-computing.com Embedded Computing Design Resource Guide August 2011 | 93 VITA: VME, VPX, VXS, PMC/XMC, FMC, chassis, backplanes
Innovative Integration "8BSE"WFOVFt4JNJ7BMMFZ $" www.innovative-dsp.com
VPXI-ePC The VPXI-ePC is a 3U VPX embedded computer system that provides a performance architecture for instrumentation, signal processing and embedded computing applications. Four expansion slots, plus an IO/HDD drive are in a compact half rack, 4U enclosure. The VPX-COMEX CPU combines an Intel Architecture COM Express CPU module with timing and communications features. Real-time, | COTS Collection data-intensive operation is built on multiple, high performance data planes employing both centralized and mesh topologies inter- connections between the cards.
VPXI integrates timing features into the VPX architecture providing synchronized high performance clock and trigger features to each FEATURES slot. Peripheral slots receive a dedicated clock and trigger input, as i VPX for Instrumentation well as several shared coordination signals. These signals are used – 3U OpenVPX embedded computer system – Integrated timing and triggering by VPX-COP, X6 and X3 I/O card families and support simultaneous – Advanced multiple plane connectivity and coordinated sampling. An optional high-precision GPS can be – Rugged with wide-temperature options used with the VPX-COMEX as a timing reference. i Embedded PC – Runs Windows, Linux or VxWorks The backbone of the system in the VPXI-ePC comprises the PCIe and – COM Express module with Intel i5/i7 CPU with up to 8 GB memory SRIO planes in the VPXI system. Each plane can sustain data rates – Gb Ethernet, 4x USB, DisplayPort video over 500 MB/s concurrently on PCIe and SRIO planes. The SRIO data – 256 GB SSD + up to 3 removable drives plane also has a x4 optical link on the front panel supporting 12 Gbps i Half (1/2) rack, 4U system connection. – Six slots total: CPU slot + 4 OpenVPX Peripheral Slots + Storage/ – I/O Slot The VPXI may host one VPX-COMEX CPU card to create a Windows/ – Compatible with many OpenVPX cards Linux/VxWorks-compatible PC. The VPXI-ePC can run the same – Up to 3 HDD/SSD storage slots – Supports Innovative X3/X5/X6 and VPX-COP applications as a desktop system. Performance OSs such as Linux Xenomai and VxWorks are available for real-time applications. i Integrated timing and triggering features – Synchronized, multi-card sampling – Internal or external clock/references
Embedded Computing Design Resource Guide – Generate low phase noise sample clocks from 0.125 to 1 GHz – 10 MHz, 0.5 PPM stable clock reference – Optional GPS-disciplined reference
i Advanced architecture supports multiple data planes – PCI Express and SRIO planes – Mesh interconnects all I/O cards – Front panel x4 optical link for SRIO
i Rear Terminal Modules for I/O and CPU slots – Forced air cooling with upper and lower fans – Integrated 500 W power supply – Expands to additional VPXI chassis using cable PCI Express – option
APPLICATIONS i Remote, Autonomous I/O i Mobile Instrumentation i Distributed Data Acquisition i Signal Processing Clusters
For more information, contact: [email protected] www.embedded-computing.com/p52899
94 | August 2011 Embedded Computing Design Resource Guide www.embedded-computing.com VITA: VME, VPX, VXS, PMC/XMC, FMC, chassis, backplanes COTS Collection | Kontron 4UPXF%SJWFt1PXBZ $" www.kontron.com
Kontron 3U VPX SBC VX3035 Integrating the Intel® Core™ i7-2655LE processor, Intel® HD graphics and features such as Intel® Turbo Boost technology and Intel® Advanced Vector Extensions (Intel® AVX), the Kontron VX3035 defi nes a new performance class for SWaP (size, weight and power) optimized VPX applications.
The Kontron VX3035 supports VXFabric™, allowing data fl ow Embedded Computing Design Resource Guide applications using IP Sockets to enjoy high-bandwidth interboard communication at PCIe DMA hardware speed. The Kontron VX3035 FEATURES is available standard air-cooled, rugged air-cooled or rugged i Intel® Core™ i7-2655LE conduction-cooled for extreme environmental conditions. i Up to 8 GB dual-channel 1333 SDRAM with ECC i Support for Windows Embedded Standard 7, Linux and VxWorks i Support of Kontron VXFabric™ i Standard air-, rugged air- or rugged conduction-cooled versions i Available also as turnkey evaluation/development platforms
For more information, contact: [email protected] www.embedded-computing.com/p53034
VITA: VME, VPX, VXS, PMC/XMC, FMC, chassis, backplanes Kontron 4UPXF%SJWFt1PXBZ $" www.kontron.com
Kontron 6U VME SBC VM6050 The Kontron VM6050 with the Intel® Core™ i7 processor brings increased performance and reduced development time to new and existing VME system designs.
With 100% I/O compatibility with the Kontron VM6250, its PowerPC sibling, both featuring a VITA 57 FMC interface, the Kontron VM6050 is the ideal bridge between all existing VME designs and modern CPU and I/O performance and price, regardless of the software legacy. It combines extremely high x86 computing and graphics performance with fl exible and modular expansion possibilities in FEATURES ® ™ four different ruggedization levels. i 6U VME high-performance Intel Core i7 processor i Outstanding performance in VME format with SSE 4.2 CPU instruction set With Kontron’s long-term supply program with availability of 10 years or more, OEMs can further optimize the life cycle and total cost of i Exceptional I/O versatility ownership (TCO) for applications. i Commercial and rugged versions i Extended life cycle with adapted long-term support program
For more information, contact: [email protected] www.embedded-computing.com/p53036 www.embedded-computing.com Embedded Computing Design Resource Guide August 2011 | 95 VITA: VME, VPX, VXS, PMC/XMC, FMC, chassis, backplanes Kontron 4UPXF%SJWFt1PXBZ $" www.kontron.com
Kontron 3U VPX PCI Express and Ethernet hybrid switch VX3905 The Kontron 3U VPX PCI Express and Ethernet hybrid switch VX3905 is the ideal partner for the centralized backplane to effi ciently handle high bandwidth. It provides up to 24 ports with 32-lane PCI Express Gen 1/Gen 2 switching and additional 9-port Gigabit Ethernet switching capabilities for the control plane. With such a feature set in a single 3U VPX slot, very effi cient and compact computer | COTS Collection architectures can be designed to satisfy the most stringent SWaP-C requirements in high-performance embedded computing.
The Kontron VX3905 is available in an air-cooled version for ambient FEATURES temperatures from 0° to +55°C and in a rugged conduction-cooled i Compliant with OpenVPX VITA 65 profi le SLT3-SWH-6F6U-14.4.1 version for the extended temperature range from -40° to + 85°C. i Up to 24 ports/32 lanes PCIe switch i 9-port Gigabit Ethernet switch i Air-cooled and conduction-cooled builds
For more information, contact: [email protected] www.embedded-computing.com/p53033
VITA: VME, VPX, VXS, PMC/XMC, FMC, chassis, backplanes Mercury Computer Systems, Inc. 3JWFSOFDL3PBEt$IFMNTGPSE ." www.mc.com
Echotek Series SCFE-V6-OVPX The Echotek® Series SCFE-V6-OVPX Virtex-6 FPGA Processing Embedded Computing Design Resource Guide Engine from Mercury Computer Systems provides high-performance processing for applications requiring extreme FPGA processing power, such as EW, ELINT, SIGINT, RADAR, Commercial Wireless, and Deep Packet Inspection. Utilizing top-end FPGAs available from market leader Xilinx®, the SCFE-V6-OVPX solves the toughest signal processing problems in a cost-effective form factor. VITA 57 FPGA Mezzanine Card (FMC) mezzanine sites and OpenVPX Rear Transition FEATURES Modules (RTMs) provide diverse sensor and I/O entry points, both i Next-generation architecture for high-end defense and analog and digital. When incorporated with the Mercury Ensemble™ commercial applications such as SIGINT, EW, Communications, RADAR, Commercial Wireless, and Deep Packet Inspection multi-computing OpenVPX modules, the SCFE-V6-OVPX represents i Ultimate processing power with three Xilinx® Virtex™-6 LX240Ts or an essential building block in powerful heterogeneous subsystems SX315Ts that can be tailored to specifi c applications and platforms. i VITA 57 FMC sites for fl exible I/O enhancements, including Echotek® Series multi-channel digitizer FMCs i High-speed OpenVPX interface fully compatible with Ensemble OpenVPX modules i EchoCore™ IP Advantage i Flexible control-plane processor i Flexible I/O with FMC sites
For more information, contact: [email protected] www.embedded-computing.com/p52893
96 | August 2011 Embedded Computing Design Resource Guide www.embedded-computing.com VITA: VME, VPX, VXS, PMC/XMC, FMC, chassis, backplanes COTS Collection | Mercury Computer Systems, Inc. 3JWFSOFDL3PBEt$IFMNTGPSE ." www.mc.com
Ensemble GSC6200 The Ensemble™ 6000 series 6U OpenVPX™ GSC6200 GPU Processing Module from Mercury Computer Systems, Inc. harnesses the tre- mendous compute power of graphics processing units (GPUs) for rugged, high-performance, embedded signal and image processing in a broad range of defense and commercial applications, including radar signal processing, electro-optical and infrared image processing, electronic warfare and other applications requiring Embedded Computing Design Resource Guide intense computational capabilities on large streams of data. Apply FEATURES GPUs to accelerate compute-intensive applications including i Dual MXM sites support 1 NVIDIA GeForce GTX 460M Fermi Fast Fourier Transforms (FFTs), Constant False Alarm Rate (CFAR), Architecture GPU, each with two single-link DVI interfaces and QR Decomposition (QRD) Synthetic Aperture Radar (SAR). i 48-lane, 12-port PCI Express Gen2 switch to backplane The GSC6200 uses 2 NVIDIA GPUs based on their latest genera- i Software-controlled management features tion Fermi architecture, which provides signifi cant enhancements i CUDA software environment for NVIDIA-based GPUs over the previous generation GPUs, including a larger number i Supports up to 2 high-end NVIDIA® compute nodes per 6U slot of parallel processing cores, larger memory capacity and higher i MXM form factor preserves rapid technical insertion of latest GPU memory bandwidth using GDDR5. architectures i Advanced power management capabilities i Conduction-cooled and air-cooled versions
For more information, contact: [email protected] www.embedded-computing.com/p52886
VITA: VME, VPX, VXS, PMC/XMC, FMC, chassis, backplanes Mercury Computer Systems, Inc. 3JWFSOFDL3PBEt$IFMNTGPSE ." www.mc.com
Ensemble HCD3210 The Ensemble™ 3000 Series HCD3210 3U OpenVPX™ Processing Module from Mercury Computer Systems is a single-slot solution for data acquisition and processing. By combining the performance logic of a highly capable Xilinx® Virtex™-6 FPGA with the real-time processing power of a Freescale™ MPC8640D dual-core processor, the HCD3210 supports multi-stage processing for many applications. The module’s XMC mezzanine site delivers I/O to these powerful processing elements, supporting high-performance processing for FEATURES size, weight, and power (SWaP)-constrained platforms. The multi- i General-purpose processing via dual-core MPC8640D processor plane OpenVPX architecture allows users to scale, knitting together running at 1.06 GHz, supported 1 GB of DDR2 SDRAM multiple HCD3210s into a powerful subsystem. i Xilinx® Virtex™-6 FPGA supported by two 9 MB banks of QDRII SRAM and 128 MB of DDR3-900M SDRAM i High-bandwidth communications, including native support for RapidIO and PCI Express® (PCIe) i XMC site supported by PCI Express (PCIe) per VITA 42.3 i IPMI controller for system management functions i MultiCore Plus® software environment with MC SAL
For more information, contact: [email protected] www.embedded-computing.com/p52884 www.embedded-computing.com Embedded Computing Design Resource Guide August 2011 | 97 VITA: VME, VPX, VXS, PMC/XMC, FMC, chassis, backplanes Mercury Computer Systems, Inc. 3JWFSOFDL3PBEt$IFMNTGPSE ." www.mc.com
Ensemble IOM-200 XMC The IOM-200 I/O Mezzanine XMC Module and IOR-280 RTM from Mercury Computer Systems provide the industry’s leading 10Gbps Ethernet I/O density. When two IOM-200s are confi gured with the IOR-280 Rear Transition Module (RTM), up to eight channels of 10Gbps Ethernet can be supported per 6U OpenVPX slot.
| COTS Collection The IOM-200 module includes a high-performance Altera Stratix IV GX fi eld programmable gate array (FPGA) all in a single-wide XMC form factor. FEATURES i Up to eight 10GbE channels per 6U OpenVPX slot i Rear Transition Module available supports two IOM-200 XMCs i Includes high-performance user programmable FPGA i Mercury-provided Intel-based drivers supported under Linux industry-leading Quad 10Gbps Ethernet I/O density i Leverages open standards to ensure interoperability
For more information, contact: [email protected] www.embedded-computing.com/p52885
VITA: VME, VPX, VXS, PMC/XMC, FMC, chassis, backplanes Mercury Computer Systems, Inc. 3JWFSOFDL3PBEt$IFMNTGPSE ." www.mc.com
Ensemble LDS6521 The Ensemble™ 6000 Series OpenVPX Intel® Core i7 Quad-Core Next Embedded Computing Design Resource Guide Generation LDS6521 Module combines a powerful Sandy Bridge mobile-class quad-core Intel® 2nd Generation Core i7 processor, a high-performance FPGA for both fabric bridging and user- application functions, and high-bandwidth on-board and off-board communication fabrics in a single 6U OpenVPX slot. FEATURES The LDS6521 low-density server provides a next-generation archi- i One 10/100/1000BASE-T GbE connection: front panel on air-cooled, tecture that balances the disruptive computational capabilities of backplane on conduction-cooled the Intel 2nd Generation Core i7 processor with key high-bandwidth i One additional 10/100/1000BASE-T GbE connection to the I/O interfaces, providing a powerful and scalable computing archi- backplane tecture that is well aligned with high-end radar, electronic warfare, i Two 1000BASE-BX SERDES Ethernet connections to the backplane and image processing applications. i One front panel USB 2.0 interface on air-cooled i Two backplane USB 2.0 interfaces on both air-cooled and conduction-cooled i One front-panel eSATA interface provided on air-cooled i Two SATA interfaces to the backplane i Eight GPIO lines
For more information, contact: [email protected] www.embedded-computing.com/p52892
98 | August 2011 Embedded Computing Design Resource Guide www.embedded-computing.com VITA: VME, VPX, VXS, PMC/XMC, FMC, chassis, backplanes COTS Collection | Schroff $PNNFSDF%SJWFt8BSXJDL 3* 5FM t'BY t5PMMGSFF www.schroff.co.uk
Your complete solution for VITA applications Pentair Technical Products with its brand Schroff is a producer and supplier of mechanical components, power supplies, backplanes, and accessories up to complete system solutions.
Their decades of experience and leading-edge technology enable them to offer precisely what will help take you a step further. They supply a broad range of VITA products such as VME, VME64x, VXS Embedded Computing Design Resource Guide and VPX for all ruggedization levels, starting with 19" racks up to modular rugged enhanced Titan VPX systems. Thanks to our modular rugged platform concept, Schroff delivers COTS (commercial-off- the-shelf) benefi ts and can be easily adapted to meet your individual requirements. Their products guarantee success through their high level of technical dependability and extended performance.
From a modular toolbox, their subracks are available in three levels of ruggedization. All of them withstand extremes of shock and vibration. Readily available product platforms are confi gurable to fulfi l your individual needs and are the base for your custom system solution. From standard industrial to robust transportation FEATURES for light military use and rugged-level products (1g up to 25g), they i Subracks and systems for all kinds of ruggedization levels have the right solution. i COTS as well as individual solutions i Test platform with card cage for forced-air and conduction-cooled Due to a fl exible test platform for boards and rugged 19" system cards applications, evaluations can already be arranged at the laboratory i Modular approach for conduction-cooled chassis stage. In the process, cards are accessible from all sides, and card i Individual VPX clamshell design cages for forced-air and conduction-cooled cards are available. i Backplanes with data transfer rates up to 10 Gb/s per port Even modular power solutions can be tested.
A modular shock- and vibration-resistant chassis – Titan – is designed in accordance with the VITA 48.2 mechanical specifi ca- tion for microcomputers using REDI conduction cooling applied to VITA 46. This enables a variety of open-standard bus architectures that Schroff already provides, including VPX, VME, CompactPCI and VME64 extensions that conform to the IEEE standard for mechanical core specifi cations for conduction-cooled Euroboards.
Our brand Birtcher delivers a 3 U 1"-pitch VPX clamshell with primary-side cooling and connector protection conforming to VITA 48.2 REDI (also available with secondary-side cooling).
To complete this portfolio Schroff offers a VPX backplane family with data transfer rates up to 10 Gb/s in single-star and full-mesh topologies. They have the in-house capability to provide each back- plane with a conformal coating to MIL-STD-810E, DIN 50155 and UL94V-0 specifi cations.
For more information, contact: [email protected] www.embedded-computing.com/p45797 www.embedded-computing.com Embedded Computing Design Resource Guide August 2011 | 99 VITA: VME, VPX, VXS, PMC/XMC, FMC, chassis, backplanes Vector Electronics & Technology, Inc. 7BOPXFO4USFFUt/PSUI)PMMZXPPE $" www.vectorelect.com
VME/VME64x Backplanes and Series 2270 ’Slimline‘ Chassis
VME/VME64x Backplanes Per ANSI/VITA 1.1-1997 Vector VME64x 6U monolithic backplanes are a ’true‘ 6U foot- print, fully RoHS-compliant and available for immediate shipment from our factory. | COTS Collection Vector VME64x monolithic backplanes for 6U cards are available in 2, 3, 4, 5, 7, 8, 10, 12 and 21-slot confi gurations. ’True‘ 6U (10.317" H) for easy replacement or addition to any 6U rack system.
Custom backplane design services available; please contact [email protected].
Series 2270 ’Slimline‘ Chassis for VME or cPCI Series 2270 can be confi gured with full 6Ux80mm rear transition slots, and single plug-in, hot-swappable or cost-saving embedded ATX power options are available. We can customize any Vector chassis; please contact us at [email protected].
Go to www.vectorelect.com to order our new 2011 Catalog. FEATURES i VME/VME64x Backplanes tGreater than 64MHz high-speed design t10-layer FR-4 construction, UL94V-0 and RoHS-compliant tSignal line shielded, controlled impedance tOR-logic electronic daisy-chaining (EBG) with onboard t termination tSMT capacitors, resistors, etc. replace through-hole for increased reliability tScrew-terminal power connections Embedded Computing Design Resource Guide
i Series 2270 ’Slimline‘ Chassis t1U to 5U, 2 to 10 slots, space-saving 19" rackmount tPush-pull fans for maximum airfl ow tDual-redundant, hot-swap power supply option
For more information, contact: [email protected] www.embedded-computing.com/p18881 | www.embedded-computing.com/p21566
100 | August 2011 Embedded Computing Design Resource Guide www.embedded-computing.com VITA: VME, VPX, VXS, PMC/XMC, FMC, chassis, backplanes COTS Collection | Mercury Computer Systems, Inc. 3JWFSOFDL3PBEt$IFMNTGPSE ." www.mc.com
Ensemble SFM3010 The Ensemble™ 3000 Series SFM3010 3U OpenVPX™ Switch Fabric Module from Mercury Computer Systems combines Serial RapidIO® data-plane switching with a managed Gigabit Ethernet control-plane switch for maximum scalability. The SFM3010 also implements the OpenVPX Chassis Manager function for mission-critical system management. With the module’s XMC mezzanine site, users can stream I/O directly onto the data plane, delivering data to any Embedded Computing Design Resource Guide processing element in the system without signifi cant overhead. By combining these functions on a single 3U OpenVPX module, FEATURES the SFM3010 expands subsystem capabilities for size, weight, and i Control-plane communications supported by a Broadcom Gigabit power (SWaP)-constrained environments. Ethernet switch with integrated MIPS processor core i Data-plane communications supported by a Tundra Serial RapidIO switch with six 4x links to the backplane and two 4x links to the J15 XMC connector i XMC site supported by Serial RapidIO per VITA 42.2 i IPMI controller for system management functions i Air-cooled and conduction-cooled models available
For more information, contact: [email protected] www.embedded-computing.com/p52883
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Expert panels and technical sessions on: `iʵÕ>ÌÞÊUÊ "£Çn ÊUÊ "Óx{ÊUÊ/ÀÕÃÌi`Ê«>ÌvÀÊÃÌÀ>Ìi}ià Presented by: Klocwork, Esterel Technologies, Presagis, TTTech, Wind River, DDC-I -i«ÌiLiÀÊÓÓ`]Ê£ÓÊÊ{«Ê /
ecast.opensystemsmedia.com www.embedded-computing.com Embedded Computing Design Resource Guide August 2011 | 101 -community Beat Keeping the embedded conversation going
By Jennifer Hesse www.embedded-computing.com
BLOGS | MARKET STATS | SURVEYS | VIDEOS | SOCIAL NETWORKING
Tablet silicon sales expected Demo: 40 Gbps multiplexed transponder on to soar high-density FPGA Move over, smartphones. Tablets and Learn how to build a e-readers are gaining traction in the ▲ 40 Gbps Optical Transport consumer electronic devices footrace, as Network (OTN) mapper on a In-Stat is projecting that silicon content for 40 nm Altera Stratix IV GX FPGA to help tablets will shoot to nearly $14 billion by meet strict cost and power requirements 2015. With devices like the iPad enjoying in telecom applications. wide adoption on a global scale, silicon See more videos at our LTE-Advanced TechChannel: providers will face increasing pressure, so http://tech.opensystemsmedia.com/lte-advanced. much so that in 2015, tablet and e-reader silicon will account for almost 85 percent of all silicon content dominating the portable entertainment device category, according to In-Stat. The firm’s research indicates that tablet shipments will exceed Virtualization TechChannel 110 million units by 2013, while e-reader Join the “core”-us. There is something to unit shipments will reach 40 million units be said for the Harmony of using just one OS to by 2015. span all of a multicore processor’s cores. As a new white paper from MontaVista explains, the result can be to sidestep the complexity of multiple runtimes while achieving a highly configurable, scalable, and virtualized Linux environment. Read more at http://opsy.st/iNnqpV. See more ideas at our Virtualization TechChannel: http://tech.opensystemsmedia.com/virtualization.
GROUP: IEEE Smart Grid DISCUSSION: Time drift changes to the power grid In making the grid “smart,” why degrade its utility as an accurate time reference? Letting the time drift to see what is affected creates safety issues and significantly increases costs, as devices that are programmed to distribute loads by time of day might start or end too soon or too late. And who’ll get stuck with the bill for visits to field devices to reset the clocks? Check out other Embedded Computing connections: www.linkedin.com/groups?gid=1802681.
Roving Reporter blog: Getting started with digital signage, Part 2 By Warren Webb As consumers spend more time in automobiles, trucks, buses, and trains, they are demanding the same real-time multimedia functionality from the onboard electronics as they get with their smartphones, home entertainment systems, and Internet-based computers. For example, with an advanced In-Vehicle Infotainment (IVI) system, a driver can engage in a hands-free telephone conversation or check on traffic congestion while a passenger simultaneously watches a movie or plays a video game. IVI digital signage systems powered by Intel Atom E6xx processors improve graphics performance and provide touch screen display monitors that show easy-to-decipher video- or graphics-based images with a minimum of textual information. Read more at http://bit.ly/p5akml.
102 | August 2011 Embedded Computing Design Resource Guide www.embedded-computing.com Learn today. Design tomorrow.
BOSTON
September 26-29, 2011 Attend the Industry’s Leading Embedded Systems Event.
ESC Boston brings together the largest community of Designers, Architects, Technologists, Business Leaders and Suppliers on the East Coast–all in one place.
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Applications Tools and Best Practices t).*BOE.VMUJNFEJB t%FCVHHJOHBOE0QUJNJ[JOH t4ZTUFNT"SDIJUFDUVSF t%FTJHOBOE5FTU t3FMJBCJMJUZ 4FDVSJUZ BOE1FSGPSNBODF t1SPDFTTBOE.BOBHFNFOU t3FNPUF.POJUPSJOHBOE8JSFMFTT/FUXPSLJOH Topics in Embedded-System Design Embedded Software t"SDIJUFDUVSF%FTJHO t-JOVY"OESPJE0QFO4PVSDF t%41 $PNNVOJDBUJPO BOE$POUSPM%FTJHO t1SPHSBNNJOHGPS4UPSBHF *0 BOE/FUXPSLJOH t)8BOE1MBUGPSN%FTJHO t1SPHSBNNJOH-BOHVBHFTBOE5FDIOJRVFT t2VBMJUZ%FTJHOBOE*OUFMMFDUVBM1SPQFSUZ t3504BOE3FBM5JNF4PGUXBSF t4PGUXBSF1SPDFTTFTBOE5PPMT Hardware for Embedded Systems t$IBMMFOHFTBOE4PMVUJPOTJO&NCFEEFE%FTJHOT Register today & get 10% OFF any package! t$POOFDUJWJUZBOE4FDVSJUZ t1SPHSBNNBCMF-PHJDBOE.FNPSZ Enter promo code: AD1 t-PX1PXFS%FTJHOBOE.JDSPDPOUSPMMFST esc.eetimes.com/boston
Four Events. One Unique Experience. This year, ESC Boston is part of DesignDays 2011: a distinctive electronics industry event comprised of 4 design conferences—ESC Boston, DesignCon East, DesignMED and Designing with LEDs. Attend all 4 conferences with the All Access Pass!