Pc104online.Com

For Single Prin Only For Single Prin Only www.smallformfactors.com www.pc104online.com

Volume 12 • Number 3

COLUMNS FEATURES 8 PC/104 Embedded Consortium SPECIAL: Low-power portable devices Embedded community rallies at pc104.org By Dr. Paul Haris 16 It doesn’t look anything like the picture By Don Dingee 10 Small Form Factor SIG Low power is the new black 18 Small, efficient COMs remedy mobile medical By Colin McCracken electronics demands 12 Focus on Form Factors: Qseven By Christine Van De Graaf, Kontron America Low-power module standard poised to open new markets By Christian Eder HARDWARE: PC/104: New frontiers 14 European Technology 26 PC/104-Plus: The brains behind the DARwIn humanoid robot Maneuvering in outer space and underwater By Karl Muecke and Dennis Hong, PhD, Virginia Tech RoMeLa By Hermann Strass 46 Editor’s Insight 32 An inside look at PCI/104-Express Everything’s coming up ‘small form factors’ By Jim Blazer, RTD Embedded Technologies By Chris A. Ciufo

DEPARTMENTS ForEVENTS Single Prin Only 38-40 Editor’s Choice Products Intel Developer Forum By Don Dingee August 19-21 • San Francisco, CA www.intel.com/idf 42-45 New Products By Robin DiPerna

E-LETTER E-CASTS Summer: www.smallformfactors.com/eletter Techcast: Trends in Small Form Factor Computing  UMPCs get a direct connection to users’ primary PCs By Alex Chow, PLX Technology Archived at www.opensystems-publishing.com/ecast  Portable fuel cell powers PC/104 platforms By Amar Ganwani and Ted Prescop, UltraCell

On the cover: Advances in processing technology like the new Intel Atom chip are achieving fast performance while conserving power, a major perk when it comes to designing mobile devices. Special Atom coverage WEB RESOURCES starts on page 16. Subscribe to the magazine or E-letter at: www.opensystems-publishing.com/subscriptions Industry news: Read: www.smallformfactors.com/news Published by: OpenSystems Publishing™ Submit: www.opensystems-publishing.com/news/submit

© 2008 OpenSystems Publishing © 2008 PC/104 and Small Form Factors Submit new products at: All registered brands and trademarks in PC/104 and Small Form Factors are property of their respective owners. www.opensystems-publishing.com/np

4 / Summer 2008 PC/104 and Small Form Factors For Single Prin Only OpenSystems Publishing Advertising/Business Office Regional Sales Managers 30233 Jefferson Avenue Ernest Godsey St. Clair Shores, MI 48082 Central and Mountain States n Tel: 586-415-6500 Fax: 586-415-4882 [email protected] A n Op e n S y s t e m s Pu b l i c a t i o n Vice President Marketing & Sales Barbara Quinlan Patrick Hopper Midwest/Southwest Military & Aerospace Group [email protected] [email protected] Business Manager Denis Seger n DSP-FPGA.com Resource Guide Karen Layman Southern California n DSP-FPGA.com [email protected] n DSP-FPGA.com E-letter n Sales Group Sydele Starr Military Embedded Systems Northern California n Military Embedded Systems E-letter Dennis Doyle [email protected] n PC/104 and Small Form Factors Senior Account Manager n PC/104 and Small Form Factors E-letter Ron Taylor [email protected] n East Coast/Mid Atlantic PC/104 and Small Form Factors Resource Guide Tom Varcie [email protected] n VME and Critical Systems Senior Account Manager n VME and Critical Systems E-letter [email protected] International Sales Group Editorial Director Chris Ciufo Doug Cordier [email protected] Account Manager Dan Aronovic Contributing Editor Don Dingee [email protected] Account Manager – Israel [email protected] [email protected] Andrea Stabile Senior Associate Editor Jennifer Hesse Advertising/Marketing Coordinator Sam Fan [email protected] [email protected] Account Manager – Asia Senior Editor (columns) Terri Thorson [email protected] Christine Long [email protected] E-marketing Manager Associate Editor Sharon Schnakenburg [email protected] Assistant Editor Robin DiPerna European Representative Hermann Strass Reprints and PDFs [email protected] Nan Lamade: 800-259-0470 • [email protected] Senior Web Developer Konrad Witte Web Content Specialist Matt Avella Creative Director Steph Sweet ADVERTISER INFORMATION Art Director David Diomede Graphic Coordinator Sandy Dionisio Page Advertiser/Ad Title Circulation/Office Manager Phyllis Thompson [email protected] 19 ACCES I/O Products, Inc. – Boldly go

33 Advantech Corporation – Ready-to-go solutions nSy OpenSystemsi h ng™ Publishing 39 Aprotek, Inc. – PC/104 modems For Editorial/ProductionSingle office: Prin Only 2 Diamond Systems Corporation – 4 things you’ll love 16872 E. Ave. of the Fountains, Ste 203, Fountain Hills, AZ 85268 31 DIGITAL-LOGIC AG – In-vehicle PCs Tel: 480-967-5581 n Fax: 480-837-6466 15 Excalibur Systems, Inc. – Ready for the unexpected Website: www.opensystems-publishing.com 3 Intel – Rethink cool Publishers John Black, Michael Hopper, Wayne Kristoff Vice President Editorial Rosemary Kristoff 9 Jacyl Technology Inc. – XG-5000K 41 LiPPERT Automationstechnik GmbH – Resilient and powerful Communications Group 35 Logic Supply – Compact, fanless, solid Editorial Director Joe Pavlat 5 Micro/sys, Inc. – Dreaming of embedded super powers? Assistant Managing Editor Anne Fisher 27 MPL AG – The smallest embedded CPU board Senior Editor (columns) Terri Thorson 7 PQI Corporation – The flash storage leader Technology Editor Curt Schwaderer European Representative Hermann Strass 40 Radicom Research, Inc. – PC/104 modem Senior Designer Joann Toth 37 Remote 2008 Conference and Expo – Remote 2008 Conference and Expo 24,25 RTD Embedded Technologies, Inc. – HighRel PC/104 ISA & PCI Embedded and Test & Analysis Group 47 RTD Embedded Technologies, Inc. – AMD Geode LX Editorial Director Jerry Gipper 39 SCIDYNE – PC/104 peripherals Editorial Director Don Dingee 28 Sensoray Co., Inc. – 4 channels of uncompressed video Senior Associate Editor Jennifer Hesse 13 Servo Halbeck GmbH – POSYS motion controllers Special Projects Editor Bob Stasonis European Representative Hermann Strass 45 Technologic Systems – TS-7800 17 Toronto MicroElectronics, Inc. – Peripherals ISSN Print 1096-9764, ISSN Online 1550-0373 Publication Agreement Number: 40048627 22 Toronto MicroElectronics, Inc. – PC/104-P3 Canada return address: WDS, Station A, PO Box 54, Windsor, ON N9A 615 34 Toronto MicroElectronics, Inc. – DVR301 PC/104 and Small Form Factors is published five times a year by OpenSystems 21 Tri-M Systems Inc. – Intel Pentium M 745 Publishing LLC, 30233 Jefferson Ave., St. Clair Shores, MI 48082. Subscriptions are 23 Tri-M Systems Inc. – PC/104 FlexTainer free upon request to persons interested in PC/104 and other small form factor single board computer technology. For others inside the US and Canada, subscriptions are 29 VersaLogic Corp. – Sometimes you have to outrun $35/year. For 1st class delivery outside the US and Canada, subscriptions are 11 WDL Systems – The power inside tomorrow’s technology $50/year (advance payment in US funds required). 48 WinSystems, Inc. – EPIC solutions POSTMASTER: Send address changes to PC104 and Small Form Factors 16872 E. Ave. of the Fountains, Ste 203, Fountain Hills, AZ 85268

6 / Summer 2008 PC/104 and Small Form Factors For Single Prin Only Embedded community rallies at pc104.org

Today’s world is plagued by the compulsion to obtain short-term savings Already hundreds of product listings have been upload- at the expense of long-term value. This often leads to solutions that look ed to the new website spanning more than 55 main and good at face value, but when you get down to the details, problems arise. subcategories: This usually occurs only after the project is well under way and sunk costs are high. Processors  CPU or SBC, DSP, coprocessors So what are OEMs to do? Today’s technologies are often complex and Data acquisition sometimes fleeting. To minimize risk, it is critical that project designers  Analog I/O, digital I/O start with specifications that have undergone rigorous development and debate. Industrial I/O  Load cell, motor controller, synchro, resolver, LVDT encoder, optocoupled I/O This is where the PC/104 Embedded Consortium shines and why its PC/104, PC/104-Plus, PCI-104, EPIC, and EBX specifications have been Bus interfaces so successful in withstanding the test of time. And with the newly pub-  Avionics bus interfaces lished PCI/104-Express – which has as its backbone the PCI Express bus Human interfaces and spans over the 104, EPIC, and EBX form factors – current and future  Display interfaces, frame grabbers, video designers can continue to leverage the vast PC industry technology base. processors, MPEG, touch interfaces, keypad and keyboard interfaces, sound and speech As with the Consortium’s other specifications, PCI/ 04-Express allows Communications OEMs to standardize around one architecture that has all the necessary  Modem or fax, network interfaces, serial I/O, interchangeable components for both simple and complex systems now For SingleUSB, FireWire, cellular phone, GPS Prin Only and in the future. Mass storage PCI/104-Express was the result of 22 of the 68 (and growing) Consortium  Floppy and hard disk, PCMCIA, solid-state disk members coming together in the Technical Committee to create a solu- Power tion for stackable PCI Express that not only addresses what is happening  Power supply, uninterruptible power supply in the industry today but also what could happen tomorrow. This group consists of individuals and companies with inside knowledge of chip ven- Enclosures  Commercial, rugged, industrial dor roadmaps, along with expertise in manufacturing techniques, board layouts, and signal integrity and vast knowledge of embedded trends. Software (Editor’s note: See page 32 for an article on PCI/104-Express penned by  Operating system and BIOS, drivers, software one of these insiders.) development tools Connectors But having technology is not enough. Designers must be able to easily  Bus connectors, I/O connectors find products and information about the technology. With that goal in mind, the Consortium completely restructured its website to give mem- ICs and devices bers, designers, and OEMs access to a wealth of information. The end  Processors, chipsets, disk storage result went live April 15 and has received rave reviews thus far. Hardware and miscellaneous  Prototyping modules and development The new website is a portal to the expansive, unified PC/104 community. stations, bus adapter boards and cables, other This website provides users with official up-to-date specifications and form factors with PC/104 interfaces opportunities to develop first-order solutions to their requirements. All levels of the embedded community can now benefit from this easy-to- And more are being added all the time. use resource. Members can directly update product offering information. Need I say more? Component manufacturers can list products that target the PC/104 industry. Board-level manufacturers can obtain information on current PC/104 Embedded Consortium specifications and see which components are being targeted for the long 415-674-4504 term. OEMs can find products and manufacturers based on the PC/104, [email protected] EBX, and EPIC architectures. It’s a one-stop resource for the embedded www.pc104.org market at all levels.

8 / Summer 2008 PC/104 and Small Form Factors For Single Prin Only Low power is the new black

More than just a common positioning space, not even including the thermal solu- Low Pin Count (LPC) bus, I2C/SMBus, phrase, “low power” appears to be the tions, with power consumption starting at and Serial Peripheral Interface (SPI). This major thrust of silicon vendors in 2008 20 W and rising sharply. breadth of functionality allows simple, judging by the recent Embedded Systems low-cost I/O cards to be developed for Conference and Embedded World shows. The integrated I/O of the appealing two- virtually any low-power application. Also, New processors and chipsets are sud- chip solutions (CPU + single-chip chip- a working group is now under way for the denly aligned with system requirements set) does not map well to existing form Qseven COM form factor, and additional for performance and power across many factors and buses, so it’s no wonder that reviewers are encouraged to join SFF-SIG applications. All that’s missing is a new new SBC and Computer-On-Module to help complete the specification in a generation of suitable board- and system- (COM) form factors are arriving at a fast timely fashion. (Editor’s note: Qseven is level specifications to facilitate the explo- rate of several per month. Whether design- featured in this issue’s Focus on Form sive growth of eco-friendly, off-the-shelf ing a new application or simply trying to Factors column on page 12.) building blocks. minimize system redesign due to end-of life notices, these low-power processor Some might argue that competing ide- Board vendors are rushing to take advan- solutions are the best news since the ologies about how to bring PCI Express tage of the brand new two-chip x86 pro- 486 derivatives and Systems-on-Chip off a board in a small, embeddable for- cessor solutions with an unprecedented (SoCs) hit the market 10 years ago. mat signify that the “bus wars” are back. combination of Gigahertz performance We don’t see it that way. The low-power and sub 10 W power consumption. Appli- end of the market needs broad platforms cation requirements in the low-power SFF-SIG is taking and choices for OEMs to achieve its out- sector are so diverse that the debut of standing growth potential. One thing is multiple form factors and expansion For a broad platform- Singlefor certain: Reducing board sizes without Prin Only interfaces is inevitable, giving the appear- addressing thermal solutions, enclosures, ance of fragmentation. Even before the based approach to cabling, RAM, and solid-state storage is low-power two-chip solutions, this “Wild inadequate. West” frontier was saddled with at least ensure that two-chip 50 form factors, mostly single-vendor Equipped with component, board, and proprietary in nature. system integration expertise, SFF-SIG’s processor technology 15 members representing Asia, Europe, SFF-SIG is pioneering deeply into this and North America are working to define lawless territory where conventional ap- is easy to implement and promote specifications in the low- proaches to specifications development are power space. Some new specifications not rapid enough to keep pace. SFF-SIG in many of the popular will appear to overlap and compete, as isn’t working on graphics-intensive appli- the group’s philosophy is to let the market cations like digital signage, gaming, SBC, COM, and decide what should prevail and what can imaging, or similar products – other form coexist. We welcome your perspectives factors are well established, CPU cards stackable formats.” and contributions as well. Check in with don’t need to be particularly small, and us regularly here and online at our website heat removal of 30-60 W tends to be the to keep up with the latest developments. limiting factor. SFF-SIG is taking a broad platform-based approach to ensure that two-chip proces- Small Form Factor SIG Instead, SFF-SIG is working on specifi- sor technology is easy to implement in 408-480-7900 cations to simplify product development many of the popular SBC, COM, and [email protected] and production beginning with low-power stackable formats. For example, there are www.sff-sig.org x86 architecture processors. Leading already two form factors – Pico-ITX and processor and chipset manufacturers Express104 – that use the SUMIT bus have achieved breakthrough two-chip interface SFF-SIG announced in April. solutions up to 1.6 GHz and 10 W total using tiny Ball Grid Array (BGA) pack- SUMIT features a mix of high-speed sig- ages. This comes at a time when three-chip nals such as PCI Express and USB 2.0 and solutions occupy twice as much board low-speed easy connectivity buses like

10 / Summer 2008 PC/104 and Small Form Factors For Single Prin Only 70

Primary target applications: Mobile and ultra- 64 mobile embedded computing applications Sponsors: congatec AG and SECO, with support from Heat transmission zone 5 recently announced participating members Hectronic, MSC Vertriebs GmbH, IEI Technology, and Portwell Specification release:June 2008 Specification information:Download specification for free at www.qseven-standard.org Dimensions: 70 mm x 70 mm 70 54 Mounting: 64 9 • Computer-On-Module (COM); requires carrier board • All data and power signals available at Mobile PCI Express Module (MXM)-type edge connector Power input: • +5 VDC • Optional +5 VDC standby for power management 5 1 features Features: 54.53 7.58 • 4x PCI Express x1 lanes

• 2x SATA 62.11 3 95 • 8x USB 2.0 • 2x ExpressCard • 1x SDIO Low-power module standard poised to • I2C bus Foropen new marketsSingle Prin Only • HD audio By Christian Eder, congatec AG • 1x Gigabit Ethernet The latest processor products from chipset manufacturers, such as Intel’s Atom • 2x 24-bit LVDS (with VESA DisplayID Z5xx series CPUs, show a strong trend toward low power consumption figures flat-panel detection) at high-performance computing levels. Existing Computer-On-Module (COM) • SDVO standards like COM Express or ETX were defined four to eight years ago without consideration of this low-power trend. Where COM Express defines • DisplayPort a maximum power consumption of 188 W, the Qseven specifications describe • HDMI a 14 W maximum. • Fan control Qseven cuts all legacy interfaces and focuses purely on a feature set that will • Battery management be available for several years, calling for only differential serial interfaces with • Software API for embedded features high bandwidth and good EMC behavior. Cooling concepts and features such as an I2C bus, watchdog timer, user storage area, flat-panel interface, and temperature control are present in the clearly defined Qseven specification.

“We see Qseven as a great initiative to approach new applications in fanless, mobile, and battery-powered systems, which current solutions do not support very well,” says Wolfgang Eisenbarth, director of marketing at MSC. “This will open new markets with a strong industry commitment from the Qseven community.”

“The Qseven platform will allow embedded designers to take advantage of the benefits of new UMPC platforms such as Intel’s Atom processor,” says Hectronic sales and marketing manager Patrik Björklund. “We see this new module standard as a perfect fit for applications where very small form factors, competitive cost, x86 performance, and ultra-low power consumption are important requirements.”

Standard applications will include automation/DIN rail, automotive, and other ultra-mobile embedded computing systems.

12 / Summer 2008 PC/104 and Small Form Factors For Single Prin Only

Maneuvering in outer space and underwater

Motion on Mars Computing Design). EPOS controller Maxon Motor, Switzerland, has deliv- SBCs control chain drive motors, robot ered motors to nearly every space vehicle arms, turrets, and other moving elements in that has moved around on Mars and the real time. The Telerob is radio-controlled moon. These motors are extremely small, from a safe distance. lightweight, and power efficient because of their patented design, which is created Maxon has partnered with NASA since through a patented production process. the first Mars landing in 1997. The Maxon’s micromotors use an ironless Mars Pathfinder was fitted with 11 small rotor with rhombic winding. Located on Maxon motors. Spirit and Opportunity, space vehicles’ wheels and other mechan- NASA’s twin rovers that landed on Mars ical parts, these motors do nothing unless in January 2004, each have 39 Maxon told to move in a coordinated manner. Figure 1 motors. Maxon also supports Phoenix, the most recent Mars project that success- The world’s leading high-precision drive speed, and position control at installation fully landed on the Red Planet on May 25. systems supplier introduced the second time. The con roller also has gateways to The probe Phoenix Lander (Figure 3, generation of motor management and USB and RS 232. Control cycle times courtesy of Corby Waste, Jet Propulsion position control at the Hannover Industrial are not a problem even for very small and Laboratory) will search for visible water Fair earlier this April. The company makes highly dynamic motors. and dig for traces of water with a robot motors from 1 W (0.25" diameter) to about For Singleshovel. A more than 2 meter long robot Prin Only 5 kW. Maxon’s EPOS controller family is EPOS-controlled motors power the arm will penetrate the thin layer of dust optimized for smaller motors up to 700 W, Telerob vehicle (Figure 2), a remote- and rubble to lay bare the Martian ice-rich which covers most applications. controlled robot from Telerob, Germany, soil. The researchers at the University of that searches for explosives in buses, Neuchatel, Switzerland, will use a special Small and mechanically robust, the DSP- aircraft, or railway cars (see the Embed- microscope to analyze the soil samples supported EPOS2 controller (Figure 1) ded Technology in Europe column in and assess if primitive life forms can be can be installed near the drive or motor the November 2007 issue of Embedded found beneath Mars’ surface. in decentralized applications. A typical EPOS is 105 mm x 83 mm x 24 mm (4" x 3.5" x 1"). Communication with up to 127 nodes or axes can be achieved via the CAN fieldbus, which is efficient in real time and often used under different names (J1939, NMEA 2000, ISO 11783, 11898, and 11992, Smart Distributed System, and DeviceNet) in many passenger cars, trucks, and farm tractors worldwide.

The EPOS controller is an SBC with local I/O (analog and digital) using a 32-bit DSP to process complex mathematical algorithms in real time. I/O ports are available potential-separated (optocoupled) for electrical isolation and protection against electromagnetic interference. In Interpo- lated Position Mode, EPOS2 can move synchronously and control coordinated multi-axis movements. The Regulated Tuning function helps optimize current, Figure 2

14 / Summer 2008 PC/104 and Small Form Factors To compete in SAUC-E, AUVs (mini submarines) must operate autonomously without any control or communication to or from the outside world. Batteries must last for an extended period of time, and processors must handle complex algorithms and three video streams in real time, thus presenting heat dissipation difficulties. Pressure sensors and compass and inertial navigation systems control the underwater course.

Teams that participate in this four-day event gain real-life engineering experience as they design and build vehicles capable of completing a series of underwater tasks without any human intervention. Points are awarded based on the final run, technical documenta- tion, presentations, and innovation. The 2008 competition will be held this July in Brest, France, along the Atlantic Coast.

For more information, contact Hermann at [email protected].

Figure 3

Mini submarine contest The Student Autonomous Underwater Challenge – Europe (SAUC-E) is a competition in which students from across Europe design and build Autonomous Underwater Vehicles (AUVs) to attempt navigation through an underwater assault course. The course varies from year to year but typically consists of gates, drop targets, surface zones, and many other obstacles. The competition aims to advance AUV technology and provides students the opportunity to gain industrial links.

A student-led team from the University of Southampton, United Kingdom, tri- umphed at last year’s SAUC-E, winning both the overall competition and receiv- ing an award for Innovation in Autonomy Two U.K. government organizations – For Single Prin Only the Defence Science Technology Lab- oratory and the Research Acquisition Organisation – hosted and sponsored the competition, respectively. Commercial sponsors included QinetiQ, Kontron Europe, and other companies.

The victorious Southampton team used three watertight USB cameras, which deliver better accuracy than echolocation or other search systems, and the dual-core 986LCD-M/M-ITX, a 17 cm x 17 cm (approximately 7" x 7") Mini-ITX board from Kontron. Figure 4 shows a view inside the team’s AUV, courtesy of the University of Southampton.

Figure 4

PC/104 and Small Form Factors Summer 2008 / 15 SPECIAL Low-power portable devices

It doesn’t look anything like the picture

By Don Dingee

For Single Prin Only

ntel launched the Atom processor as others remarked, asserting that it would Conference Silicon Valley; even more will a headliner at Intel Developer Forum take years to crack into that market, if it is be ready by the next stop later this year in IShanghai this April, including a brand even possible. Speculation that Intel was Boston. They also launched an initiative spanking new branding campaign that in after Apple’s future iPhone business was for automotive infotainment at Telematics and of itself is significant – after all, it’s rampant. (Those odds got a lot slimmer Detroit this May. not every day that Intel launches a major with Apple’s recent purchase of P.A. Semi processor brand. and the ARM intellectual capital). Intel made sure that Atom processors would be available with the extended The Intel brass has been discussing names Hello? Over here ... it’s the embedded seven-year life cycle from the first day like Menlow, Silverthorne, and Poulsbo community. We build lots of things that of introduction, supporting two specific for quite some time. With the announce- could use a low-power Intel Architecture Stock Keeping Units (SKUs) for embed- ment of the Atom brand for those proj- processor like Atom. We’ll have some- ded designs. And the company is starting ects, Intel officials went on stage and thing to say before this is over. to support distributors – as I’m writing discussed their vision for Mobile Internet this, Avnet’s site says they have Z510s at Devices (MIDs). Some folks at Intel absolutely understand $23 and Z530s at $80.50 with “call for the embedded play. They’ve developed a lead time”; Arrow’s site lists both SKUs And the trade press largely panned them. whole ecosystem of embedded vendors, with a “call for quote.” who in turn have built a wide range of MIDs are “dreams,” one journalist com- small form factor boards, many of which (I’ve read the reports about the expected mented. That’s a space owned by ARM, were showcased at the Embedded Systems short supply of Atom processors in Q3. It’s

16 / Summer 2008 PC/104 and Small Form Factors a short-term mix issue, if anything. Atom is fabbed on the same 45 nm process used for Penryn platforms, which helps with capacity and yield issues. And two more 45 nm fabs are coming online soon.)

That said, why isn’t the embedded play for Atom processors making headlines?

This reminds me of the scene in Iron Man where Tony Stark, tasked by his captors to build a Jericho missile, instead builds the prototype armor. During construction, the captors peek in via a surveillance camera, and after studying the work in prog- ress and comparing it to a Jericho missile photo, one finally says, “It doesn’t look anything like the picture.”

So, the brass said “MID,” and that’s what the media expected to see. But visualizing the exact outcome for Atom processors (or any architecture, for that matter) in the embedded space is difficult. There will be many relatively low-volume uses and probably not a single high-profile, huge volume platform. And there will be a lot of creative applications.

It’s hard to say where Atoms will show up, but the answer is likely everywhere. Maybe inside a credit card swipe termi- nal. Or in a new hydrogen automotive fuel dispenser. Or an office photocopier Or a car dashboard. Or in portable medi- For Single Prin Only cal gear.

Most folks won’t even know there’s an Atom inside their device. They’ll know they get good performance, good battery life, good connectivity – whatever their measure of “good” is – and they won’t need to know much else.

The current Menlow platform based on the Silverthorne processor might not make the most headlines. Perhaps the next-generation platform, Moorestown, with lower standby power and support for both video encoding and decoding, will get more ink.

I don’t expect that Atom processors will suddenly dethrone ARM and other well- established embedded processor architectures. I also am not holding my breath on the MID vision. It may take years to develop, if at all.

But I do believe the Atom launch is significant for the embedded space – and so do a lot of the folks I talk to.

Yeah. It can fly. ➤

PC/104 and Small Form Factors Summer 2008 / 17 SPECIAL Low-power portable devices

While mobile medical devices are shrinking in size, the need to improve diagnostic capabilities is increasing the demand for performance. Small form factor specifications are rising to the challenge, as evidenced by the evolution of Computer-On-Module (COM) systems. Christine outlines a design approach that uses COM Small, efficient COMs remedy mobile modules to help cut time to market. medical electronics demands edical OEMs face many challenges throughout product life By Christine Van De Graaf Mcycles as they strive to meet performance and reliability requirements, pass certifications tests, and keep up with future needs. With processors evolving continually and new high-speed serial differential interfaces emerging in the market, embedded developers are now confronted with the problem of implementing these new capabilities while maintaining focus on their core busi- nesses. Engineering a new SBC for each generation of processors and implement- For Singleing faster buses are both expensive and Prin Only time-consuming propositions.

Embedded computing options include off-the-shelf motherboards, long-life industrial motherboards, and high-volume, application-specific custom boards. The COM approach offers some distinct advantages, such as high levels of processing performance and I/O bandwidth in a compact form factor. More significantly, COM modules can help medical systems designers achieve faster time to market, reduced development cost, minimized design risk, simplified future upgrade paths, scalability, and greater application longevity – all leading to the potential for increased market share.

Design challenges for medical electronic equipment The majority of medical electronic equipment on the market today is designed to enhance patient care while lowering health-care costs. In medical imaging applications, such as X-ray, ultrasound, and MRI devices, the more images that doctors can see when examining a patient, the better equipped they are to properly diagnose and treat that patient.

18 / Summer 2008 PC/104 and Small Form Factors “The COM approach can help medical The need for extremely high-resolution development time needed to modify exist- images that can be manipulated in real ing designs and expand product portfolios. equipment manufacturers time has driven medical equipment devel- This holds true particularly for embed- opers to require better graphics, faster ded products that require longevity (5- to meet new requirements processing, and enhanced communica- 10-year life cycles) as well as up-to-date by reducing the costs tions capabilities. In emergency medical processing performance and I/O capabili- and rescue services where every second ties. A big, bulky piece of equipment that and development time counts, getting the right information at the takes a long time to develop, such as a full right time is vital, so real-time data con- custom motherboard and enclosure, is not needed to modify existing versions are essential. In many embedded a viable option. Engineering, debugging, medical applications such as point-of-care and supporting a new SBC for each gen- designs and expand terminals, size also matters. eration of processors and faster buses can product portfolios.” be extremely costly and time-consuming. As the medical industry advances, the In fact, a full custom design can average requirements will likely change repeat- edly. However, these applications must be updated without having to start completely from scratch, so scalability and upgradeability must be built in.

Beyond performance and scalability needs, equipment designed for medical use must meet extended longevity requirements, with some applications expected to last as long as 10-15 years. As in all embedded applications, time to market is also a concern; thus, reducing implementation time plus the time allotted for FDA and other regulatory testing and approv- als is also key a factor for consideration. Additionally, because budgets for these products are not unlimited, costs must be For Single Prin Only optimized whenever possible.

COMs shorten design time and improve scalability Many of today’s most demanding embedded application segments benefit from high levels of processing performance and I/O bandwidth in extremely compact form factors. The COM approach puts an entire computer host on a small form factor module that can be mounted on carrier boards containing application-specific I/O and power circuitry.

All generic PC functions, such as graphics, Ethernet, sound, integrated development environment, floppy disk drive, keyboard/ mouse, parallel, serial, USB ports, and PCI and ISA system buses are added via an off-the-shelf module. A custom- designed carrier board can then be added to address specific functionality. The carrier boards provide all the interface connectors to attach the system to peripherals such as hard disks, displays, and so on.

The COM approach can help medical equipment manufacturers meet new requirements by reducing the costs and

PC/104 and Small Form Factors Summer 2008 / 19 SPECIAL Low-power portable devices

as long as 24 weeks to complete. Figure 1 The system was also fanless to increase EN 60601-1 Parts 1, 2, and 4 tests. It is provides a comparison between full and reliability and lessen noise. estimated that using the ETX module cut semicustom design timelines. the cost of retesting by 40 percent. This modular approach enabled the rela- The following example of a clinical work- tively small design team consisting of one Evolving standards station illustrates the time-to-market and electrical engineer, one systems engineer, Medical electronic equipment follows scalability benefits derived from using and one mechanical engineer to finish the a path of continuous improvement not a COM implementation focused on the concept design and prototyping within unlike that of consumer electronics, with application-specific core. Typically, a 12 weeks, a significant improvement over increasing emphasis on size reduction and clinical workstation comprises an IP65- the typical 6-9 month schedule. Com- mobility. Driven by extended battery life resistant 19" panel PC with a pen and pleting new computing product designs requirements and users’ need to quickly touch interface for data entry and control in this context traditionally calls for two find out the status of their health, key in patient-monitoring or ICU stations. additional hardware engineers and one design considerations focus on low power firmware programmer, which would have consumption, high efficiency, and high An ETX module was chosen for this appli- more than doubled the development time. precision for fast response time. cation because of its ability to deliver the computer engine while the baseboard After undergoing four performance up- The PICMG-defined COM Express stan- hosted power conditioning, battery backup grades, this particular workstation has dard is evolving to address this trend. (uninterruptible power supply function), not required a single modification to the Initially, COM Express was designed to and media storage. This design provided baseboard. Instead of redesigning the accommodate the next generations of the flexibility to use a flash drive or hard entire motherboard, designers simply had PCI Express (5 GHz) and Serial ATA disk. An RFID reader, touch controller, to install the new ETX module to prepare (300 Mbps) interfaces, effectively dou- PCI expansion card socket, and ETX mod- the workstation for the approval process. bling existing data rates to 160 Gbps and ule pin connectors were designed to the This approach turned a multi-engineer 1.2 GBps. baseboard. In this case, the workstation project that would have taken several had a special feature – interconnects that months to complete into a single-engineer, Kontron’s ETXexpress family was created allowed the system to communicate with one-week project. I/O interfaces were not to integrate high-speed COMs with the a range of patient-monitoring systems. touched, thus reducing the risk of failing PCI Express bus and PCI Express chipsets. For Single Prin Only Full Custom Design = 24 Weeks

Design Touch-Up, Build Build Revised Units, Schematics Placement & Routing Prototypes Te st & Validation Te st & Release

6 weeks 6 weeks 2 weeks 6 weeks 4 weeks

Embedded Module Semicustom Design = 12 Weeks

Placement Build Schematics & Routing Prototypes Te st & Release

3 weeks 3 weeks 2 weeks 4 weeks

Figure 1

20 / Summer 2008 PC/104 and Small Form Factors In 2006, a compact footprint (95 mm x and rural medical facilities. Medical 95 mm) version of COM Express mod- equipment manufacturers are now pio- ules – the microETXexpress family – was neering the concept of “take-everywhere” developed. Recently, the nanoETXexpress diagnostic tools that enable medical family of COM Express compatible practitioners to make faster and more modules debuted with a footprint merely accurate clinical decisions at the point of 39 percent of the original COM Express care. Pocket ultrasound systems and other standard form factor module, as shown in ultra-portable point-of-care units demand Figure 2. low power and high performance in a very small form factor. Table 1 provides a comparison of these related COM Express modules. All three Until recently, the convenience of por- COMs share the same baseboard interface tability required manufacturers to sac- connector design and pinout and have rifice image quality, limiting the scope overlapping mechanical assemblies. Stan- and accuracy of medical diagnoses made dardized height and heat spreaders further with portable ultrasound equipment. In facilitate interchangeability among mod- addition, few options among standards- ules from different manufacturers. based embedded computing platforms adequately met the requirements for this Looking ahead: field. Platforms were not small enough, Ultra-small and ultra-portable lacked the right mix of integrated Ultrasound exams are increasingly being features, and/or did not provide a seamless conducted in nontraditional environments, migration for next-generation product such as doctors’ offices, ambulatory units, revisions.

For Single Prin Only

Figure 2

COM Express module Footprint Basic form factor (ETXexpress) 125 mm x 95 mm (4.9" x 3.7") Extended form factor 155 mm x 110 mm (6.1" x 4.3") microETXexpress 95 mm x 95 mm (3.7" x 3.7") nanoETXexpress 55 mm x 84 mm (2.2" x 3.3") Table 1

PC/104 and Small Form Factors Summer 2008 / 21 For Single Prin Only SPECIAL

Credit card-sized COM with Intel Atom inside

The Kontron nanoETXexpress-SP offers processor performance from 1.1 GHz to 1.6 GHz, a highly integrated chipset, up to 533 MHz front side bus, and up to 1 GB DDR2 RAM on a credit card-sized footprint of 55 mm x 84 mm. An integrated graphics processor handles accelerated MPEG2 decoding and produces extremely clear images for applications that require extra graphics performance. Dual-channel 18/24-bit LVDS provides enhanced resolution.

To meet current and future interface requirements, nanoETXexpress-SP supports one Gigabit Ethernet interface, a PCI Express x1 lane, and two Serial ATA (SATA) II ports. The two SATA interfaces are designed in accordance with the PICMG COM.0 specification to ensure that the COM connectors remain COM Express compatible. The module follows the PICMG COM Express standard and is 100 percent compatible with the COM.0 Type 1 connector with respect to pin-out definition and the physical connector positioning.

However, advances in processing tech- coat – that wirelessly transmits images nology have dramatically improved the Forto a standard PC for remote diagnosis.Single Prin Only amount of performance that can be An EMT could use this new device at squeezed into a small form factor. For the scene of an emergency, allowing the instance, the new Intel Atom processor attending doctor to start the diagnosis Z5xx series was specifically developed and treatment process before the patient to address very compact, performance- arrives at the ER. This application would hungry, thermally constrained embedded provide a quick and convenient way to applications. deliver care, with the ultimate goal of saving lives. ➤ The new 45 nm Intel Atom processor architecture achieves fast performance Christine Van (with clock speeds between 1.1 GHz De Graaf is the and 1.6 GHz) in a sub 5 W thermal product marketing power envelope. Power optimization on manager for Kontron the front side bus (up to 533 MHz) pro- America’s Embedded vides fast data transfer. To address the Modules Division need for a standardized, ultra-portable located in Northern embedded computing platform, Kontron California’s has introduced the nanoETXexpress-SP Silicon Valley. Christine has more than based on the Intel Atom processor seven years of experience working in (see sidebar). the embedded computing technology industry and holds an MBA in Marketing With these new technologies, applications Management from California State that previously faced barriers because University, East Bay, Hayward, of size, performance issues, or power California. consumption limitations can now be developed using a standard COM. One Kontron America possible future implementation is a mini 858-677-0877 ultrasound machine – as simple as a [email protected] “brick” that fits into the pocket of a lab www.kontron.com

PC/104 and Small Form Factors Summer 2008 / 23 For Single Prin Only For Single Prin Only HARDWARE PC/104: New frontiers

PC/104-Plus: The brains behind the DARwIn humanoid robot For Single Prin Only

By Karl Muecke and Dennis Hong, PhD

Powered by a PC/104-Plus board and National Instruments’ LabVIEW, Virginia Tech’s DARwIn is making huge strides in robotics – literally, with a bipedal soccer-playing machine. Karl and Dennis explore the dynamics of bipedal motion and describe the electromechanical platform used to control these robots’ movements.

he Dynamic Anthropomorphic Robot The 600 mm tall, 4 kg robot (the latest Static versus dynamic gaits with Intelligence (DARwIn) series version of DARwIn) has 21 degrees of With a few exceptions, such as Honda Tis a family of humanoid robots freedom with each joint actuated by a ASIMO, Sony QRIO, and KAIST HUBO, capable of bipedal walking and perform- coreless DC motor via distributed con- most legged robots today walk using what ing human-like motions. Developed at trol with controllable compliance. Using is called the static stability criterion. The the Robotics & Mechanisms Laboratory a computer vision system on the head, static stability criterion is an approach to (RoMeLa) at Virginia Tech, DARwIn is Inertial Measurement Unit (IMU) in the prevent the robot from falling down by a research platform for studying robot torso, and multiple force sensors on the keeping its center of mass over the sup- locomotion that served as the base plat- foot, DARwIn can implement human- port polygon by adjusting the position of form for Virginia Tech’s first entry to the like gaits while navigating obstacles and its links and pose of its body very slowly humanoid division of RoboCup 2007, an will eventually be able to traverse uneven to minimize dynamic effects[2]. Thus, at international autonomous robot soccer terrain while implementing complex any given instant in the walk, the robot competition[1]. behaviors such as playing soccer. could “pause” and not fall over.

26 / Summer 2008 PC/104 and Small Form Factors Static stability walking is generally energy at a single point, making it equivalent to a inefficient because the robot must con- ball and socket joint (Figure 1). Not only stantly adjust its pose in such a way as to does this make the kinematic configuration keep its center of mass over its support closer to a human’s, but it also simplifies polygon, which generally requires large the mathematics involved in controlling torques at the joint actuators, similar to a and creating the robot’s motion. human standing still with one foot off the ground and the knee of the other leg bent. DARwIn has 21 degrees of freedom (6 in each leg, 4 in each arm, 1 in the waist), Humans naturally walk dynamically with 4 force sensors on each foot, a 3-axis rate their center of mass almost always out- gyro, a 3-axis accelerometer, and space to side the support polygon. Thus, human house a computer and batteries for pow- walking can be considered as a cycle of ering the Robotis’ Dynamixel DX-117 continuously falling and catching the motors, Flexiforce sensors, and comput- fall: an exchange of potential energy and ing equipment. The motors operate on kinetic energy of the system, like the a serial RS-485 network, allowing the Figure 1 motion of a pendulum. We fall forward and catch ourselves with our swinging foot while continuing to walk forward. This falling motion allows our center of mass to continually move forward, not expending energy to stop the momentum. The lowered potential energy from this forward motion is then increased again by the lifting motion of the supporting leg.

Dynamic stability is commonly measured using the Zero Moment Point (ZMP), which is defined as “the point where the influence of all forces acting on the mechanism can be replaced by one single force” without a moment term[3]. If this point remains in the support polygon then the robot can apply some force or For Single Prin Only torque to the ground, which in turn means the robot can have some control over its motion (the system). Once the ZMP moves to the edge of the foot, the robot is unstable and cannot recover without extending the support polygon (planting another foot or arm).

Kinematically correct Parameterized gaits can be optimized using the ZMP as a stability criterion. Stable hyperbolic gaits can be generated by solving the ZMP equation for a path of the center of mass. Additionally, the ZMP can be measured directly or estimated during walking to give the robot feedback to correct and control walking. DARwIn is developed and being used for research on such dynamic gaits and control strategies for stability[2,4].

DARwIn’s primary joints are kinematically equivalent to human joints. Humans have ball and socket joints at the shoul- ders and hips, allowing three axes of rotation about a single point. Though DARwIn does not have a ball and socket joint, it achieves the same kinematics with three motors’ axes of rotation intersecting

PC/104 and Small Form Factors Summer 2008 / 27 HARDWARE PC/104: New frontiers

motors to be daisy-chained together. Each which drops from 16.4 V to 14.8 V during motor has its own built-in potentiometer runtime. In addition to providing power to and position feedback controller, creating DARwIn’s main systems, the power distributed control. electronics allow for an external power connection and a seamless switch between DARwIn II kicks power sources. Additionally, this circuit In addition to the mechanical design im- prevents reverse polarity, overvoltage, provements over DARwIn I, DARwIn II overcurrent, and undervoltage conditions has added intelligence that allows it to from damaging the computing, sensing, perform higher-level tasks, like playing and actuation components. Figure 2 soccer autonomously. DARwIn II’s electronics provide power management, a DARwIn’s computing architecture is set The cameras are attached to a pan and computing architecture, and a sensing up to use a centralized control scheme, tilt unit, which allows the robot to look scheme to gather information on salient which is run on an Arbor Em104P-i7013 at its surroundings. Two lithium polymer environmental features. PC/104-Plus computer (Figure 2) with a batteries in the feet allow the robot to be 1.4 GHz Pentium M processor, 1 GB of powered autonomously. Two 8.2 V (nominal) lithium polymer RAM, CompactFlash drive for storage, batteries power DARwIn. The batteries IEEE 1394 card, serial communication, Software for reactive-based are usually attached to the lower body USB, Ethernet, and IEEE 802.11 for control (legs or feet) to keep the robot’s center of wireless communication. For higher-level behaviors such as playing gravity below its waist. These batteries autonomous soccer, DARwIn uses a reac- provide 2.1 Ah, which gives DARwIn a DARwIn also has two IEEE 1394 tive behavior-based control architecture little more than 15 minutes of runtime. (FireWire) cameras and a 6-axis rate gyro/ programmed using LabVIEW Real-Time. The power circuit provides 3.3 V, 5 V, and accelerometer (IMU) for vision and local- Reactive-based control has the advantage 12 V for the various digital electronics ization. The cameras capture 15 frames of being simple and robust. Figure 3 shows within DARwIn. However, the joint per second (fps) at 640 x 480 resolution the flow diagram of the entire control algo- actuators are run directly off battery power, and 30 fps at 320 x 240 resolution RGB. rithm used for RoboCup 2007. The sensor

For Single Prin Only

28 / Summer 2008 PC/104 and Small Form Factors data is processed to meaningful informa- Sensors tion, which gives the robot ball position, goal position, opponent positions, and orientation. The behavior modules use this information to dictate their respective Perception actions. The motion control module uses orientation information to correct and stabilize the bipedal walking gait.

Each behavior module’s result is sent to Command/Behavior the integrator, which decides the most appropriate behavior to implement in a given situation. For example, three behaviors may be “kick the ball,” “reposi- Integrator Motion Motion tion,” and “avoid obstacles.” If there are generator control no obstacles (or opponent robots) nearby, the integrator will more likely choose to reposition the robot for a better kick. Team Probed Web host However, if an opponent is nearby, the message data integrator will “skip” repositioning and move straight to kicking the ball.

Once the integrator decides what the robot should do, the result is sent to the motion Operational generator as a team message for other Control Unit teammates to read in order to coordinate (OCU) team play. The motion generator creates the necessary motion for the motion control based on the integrator’s result. Figure 3

For Single Prin Only

PC/104 and Small Form Factors Summer 2008 / 29 HARDWARE PC/104: New frontiers

Next up: DARwIn III model allows for planning, which reac- in a delayed fashion on a nondetermin- DARwIn III looks to further improve tive behavior does not, and leads to more istic, polling architecture bus. Using the the successful designs of the previous efficient behaviors. team’s own joint actuators can subvert versions. Because the robot needs finer many of these problems and allow a control of its walking gaits and increased To meet the modeling demand, the deterministic bus such as EtherCAT to be processing power for a robust vision PC/104-Plus board will be upgraded to implemented. Without such a bus, large system, an ARM9 microcontroller will a Core 2 Duo-based board running at latencies and indeterminism will make be introduced in DARwIn III’s design to approximately 2 GHz, allowing RoMeLa it very difficult to implement active real- handle all aspects of gait generation, leav- team members to finish developing their time controllers. ➤ ing the PC/104-Plus computer to run the vision – behavior and walking gate algo- behavior and vision routines. rithms on a computing platform running Karl Muecke is a LabVIEW Real-Time. PhD candidate at Virginia Tech in “To meet the Going farther with FPGAs Blacksburg, Virginia, The final implementation of DARwIn’s and the lead engineer electronics package calls for a large on the DARwIn modeling demand, reduction in weight, power consumption, project. and size while increasing performance. Several improvements are planned. Dennis Hong is the PC/104-Plus board Assistant Professor First, the PC/104-Plus Core 2 Duo will be of Mechanical will be upgraded to a replaced by the old PC/104-Plus 1.4 GHz Engineering and Pentium M to save battery power To director of RoMeLa boost performance, a new set of FPGAs at Virginia Tech. Core 2 Duo-based will be added for each system, such as He holds a PhD and behavior and vision This will allow mul- MS from Purdue board running at tiple systems, such as walking, vision, University and a BS from the University and behaviors o be more complex and of Wisconsin-Madison. run simultaneously on their own proces- approximately 2 GHz, sors without impinging on each other’s Virginia Tech RoMeLa operation. More importantly, DARwIn’s 540-231-7195 allowing RoMeLa team Forreaction time to an ever-changing Single envi- [email protected] Prin Only ronment will decrease as a result of the [email protected] www.me.vt.edu/romela/ members to finish parallel architecture.

In addition, the specific I/O required by References: each system will be on the FPGAs, elimi- developing their vision ...” [1] Hong, D. W., “Biologically Inspired nating the need to add I/O boards present Locomotion Strategies: Novel Ground in DARwIn III’s larger computing pack- Mobile Robots at RoMeLa,” The 3rd age. The walking algorithms running on a International Conference on Ubiquitous Gait commands to the microcontroller will microcontroller could then be instantiated Robots and Ambient Intelligence tell the robot to move in a specific way on an FPGA and control custom joint actu- (URAI 2006), Seoul, S. Korea, October 15-17, 2006. (direction, speed, gait type, pose, and so ators instead of the Robotis Dynamixel on). The PC/104-Plus board and the micromotors. Alternate joint actuators will be [2] J. Kim, “On the Stable Dynamic Walking of Biped Humanoid Robots,” controller communicate with one another used because the controller within the Korea Advanced Institute of Science over an RS-232 network, with the micromotors is Robotis’ intellectual property, and Technology, Daejeon, South Korea, controller communicating over an RS-485 and the ability to design the motors’ con- 2006. network with the Robotis Dynamixel troller is becoming a necessity. [3] Vukobratovic, Miomir, “Zero-moment motors. Point – Thirty Five Years of its Life,” Finally, all systems will be connected to Int. Journal of Humanoid Robotics, Vol. 1, No. 1, 2004. DARwIn III also will use a world model deterministic buses so the delay caused by to dictate its behavior. A world model is information transfer is known. The current [4] Q. Huang, K. Yokoi, S. Kajita, et al, “Planning Walking Patterns for a Biped a completely known virtual model of the setup in DARwIn III does not use feed- Robot,” IEEE Transactions on Robotics environment with the states of the model back from the Dynamixel motors because and Automation, Vol. 17, No. 3, updated from sensor inputs. A world the proprietary code shares information June 2001, pp. 280-289. It shoots, it scores Check out a DARwIn robot in action at: www.me.vt.edu/Robocup/Site/Media.html

30 / Summer 2008 PC/104 and Small Form Factors For Single Prin Only HARDWARE PC/104: New frontiers

An inside look at PCI/104-Express

By Jim Blazer

The PC/104 Embedded Consortium recently announced its latest specification, PCI/104-Express. In this expanded view, which amounts to a primer on the specification, one of the creators explains the thinking behind it and illustrates some of the finer details, such as stacking and PCI Express (PCIe) routing.

he PCI/104-Express specification For Singleit is point-to-point, PCI Express can trans- Prin Only establishes a standard method for mit and receive data simultaneously from using the high-speed PCI Express any or all devices. T PCI Connector bus in embedded applications. It was developed by the PC/104 Embedded Understanding lanes and links: Consortium and adopted by member x1, x4, x8, and x16 vote this March. The PC/104 Embedded A PCI Express lane is a transmit dif- Consortium chose PCI Express because ferential pair and a receive differential of its desktop/laptop PC market adoption, PCI/104-Express pair connection between two devices. A performance, scalability, and growing sil- PCI Express link is one or more lanes icon availability worldwide. It provides a and a clock differential pair. Therefore, a new high-performance physical interface x1 (read as “by 1”) link has one transmit/ while retaining software compatibility Stackable PCIe Connector receive lane and one clock differential with existing PCI infrastructure. pair. Likewise, a x4 link has four transmit/ receive lanes and one clock differential Incorporating the PCI Express bus within Figure 1 pair. This continues logically for x8 and the industry-proven PC/104 architecture provides embedded applications many advantages, including fast data transfer, 33 MHz synchronous parallel bus. low cost because of PC/104’s unique self- The new connectors in desktop stacking bus, high reliability because of PCs are PCI Express. PC/104’s inherent ruggedness, and long- term sustainability. Figure 1 shows the PCI Express is similar to PCI from layout, and Figure 2 shows a board using the software view but much differ- PCI/104-Express. ent in hardware. It is a point-to-point, high-speed, differential serial bus com- PCI and PCI Express posed of lanes and links. PCI Express The PCI bus has been the standard bus uses a packet-based model similar to in desktop PCs for nearly 20 years. In Ethernet, but Gen 1 PCI Express runs at PC/104-Plus and PCI-104, it is a 32-bit, 2.5 Gbps per lane per direction. Because Figure 2

32 / Summer 2008 PC/104 and Small Form Factors x16 links, each having 8 or 16 transmit/ Technology Bandwidth (MBps) Bandwidth relative to 32-bit, 33 MHz PCI receive lanes and one clock differential 32-bit, 33 MHz PCI-104 132 1 pair. Table 1 shows the bandwidth for various link configurations. PCIe x1 link 500 3.8 PCIe x4 link 2,000 15 Implementing PCI Express PCI/104-Express add-in cards are identi- PCIe x8 link 4,000 30 fied by link size. The specification sup- PCIe x16 link 8,000 61 ports four x1 links and one x16 link. Users PCI/104-Express 10,000 76 can place any four x1 cards on the CPU in Four x1 and one x16 links any order and all of them will work. Each uses its own PCI Express link. Table 1

Several choices exist if PCI cards are switch on the x16 link can replace all four the x16 link on the bus, and/or create a available to use in the system. One option x1 links, break the x16 into two x4 or PCI-104 PCI bus. The switch can do any is to stack CPU, PCI/104-Express, and two x8, use x16 onboard and replace of these things individually or all of them. then PCI cards being careful not to exceed the PCI specification limits. Users also can stack the PCI and PCI Express card on opposite sides of the CPU; for example, they can stack PCI Express cards below the CPU and PCI cards above the CPU. Additionally, if a x1 link card uses a PCI Express switch, which is similar in concept to an Ethernet switch, it can replace the link on the bus and share the bandwidth with another x1 card. This capability means that the number of add- in cards will not be the limiting factor for PCI/104-Express systems.

Taking advantage of the x16 link The x16 link has options that depend on the CPU and chipset. Users can employ the For Single Prin Only x16 link as a x16 PCI Express. The most popular use for a x16 link is in graphics cards, but watch for 10 GbE, high-end DSP, frame grabber, and FPGA cards. Xilinx supports a x1 PCI Express core in the Spartan III FPGA and has a x8 hardware PCI Express endpoint in the Virtex-5 FPGA. Altera offers x1, x4, and x8 MegaCores for the Stratix and Arria FPGAs. Several other FPGA vendors and IP vendors offer PCI Express cores, which are probably just the tip of the iceberg.

The PCI/104-Express specification also supports two x4 or x8 links with automatic link shifting on the x16 part of the connector. These add-in cards are identi- fied as x4, x8, or x16 and do not affect the four x1 links. Also, chipsets allow the x16 link to be used for other functions such as Serial Digital Video Output (SDVO), which is automatically selected by the CPU and add-in card. Support for these functions is optional, so consult the CPU manual for more information.

PCI Express switches allow vendors to create bridge cards that provide additional uses for the x16 link. A PCI Express

PC/104 and Small Form Factors Summer 2008 / 33 HARDWARE

Granted, they all share the bandwidth of the x16 link. However, vendors can have four x1s and two x4s and still use a x4 on the board without losing any bandwidth.

Pseudo-multitasking with the x16 link For an example of the x16 link’s power and flexibility, consider a simple board that uses a three-port, 48-lane switch with an onboard DSP that requires a x16 link. The board replaces the x16 link on the bus.

In a stack-down configuration, the x16 link comes in the top connector and sends all 16 lanes to one of the switch’s ports. The switch’s second port sends 16 lanes to the onboard x16 link DSP. Lastly, the third port sends 16 lanes to the bottom connector replacing the x16 link (see Figure 3).

Top PCIe Connecto r

x16 Link

Port 1

Port2 x16 Link Switch DSP For Single Prin Only Port 3

x16 Link

Bottom PCIe Connec tor Figure 3 If the system is configured with a CPU and three of the DSP boards depicted in Figure 3 – called DSP 1, DSP 2, and DSP 3 – the boards will be able to perform the following transactions, each assuming nothing else is happening on the x16 link:

 CPU can talk to DSP 1 at 10,000 MBps  CPU can talk to DSP 2 at 10,000 MBps  CPU can talk to DSP 3 at 10,000 MBps  CPU can talk to any of the DSPs at 5,000 MBps at the same time it talks to any other DSP at 5,000 MBps  CPU can talk to all three DSPs at the same time at 2,500 MBps each and still have 2,500 MBps for additional x16 cards  CPU can talk to DSP 1 at 10,000 MBps while DSP 2 talks to DSP 3 at 10,000 MBps

34 / Summer 2008 PC/104 and Small Form Factors This example makes it appear as though sends them to a device at the fastest rate the same time? Imagine a host that uses the CPU is performing more than one the device can handle. These packets can a x16 link. Devices #1 and #2 are x1 link transaction at a time when in reality it vary in size but are typically no more than devices, devices #3 and #4 are x4 link is not. Express switches operate like 512 bytes. devices, and device #5 is a x8 link de- Ethernet switches. A host sends packets vice. The drawing in Figure 4 shows the of data to the switch at the fastest rate pos- So, how does a PCI Express switch let timing required for this “simultaneous” sible. The switch buffers the packets and a CPU talk to five devices seemingly at operation.

NOTES ON FIGURE 4  Each time slot – T0, T1, …, Tn – is the time required to send one packet on a x16 link.  The numbers inside the waveforms represent the destination device for the packet, and the letters identify different packets headed to the same device. For example, <1a> on the host is the same data packet as <1a> going to device #1. The host transfer takes less time because it is a x16 link. The device is a x1 link, so the transfer takes 16 times longer.  A packet cannot be sent out of the switch before it is received.  Packets <1b>, <3b>, and <4b> show that when a device is busy, the switch has to buffer the packet until the device is free. T0 T1 T2 T3 T4 T5 T6 T7 T8 T9 T10 T11 T12 T13 T14 T15 T16 T17 T18 x16 Packets In From Host 1a 2a 3a 4a 5a 3b 4b 5b 1b 5c x1 Packets Out Device #1 1a 1b x1 Packets Out Device #2 2a x4 Packets Out Device #3 3a 3b x4 Packets Out Device #4 4a 4b x8 Packets Out Device #5 5a 5b 5c Figure 4

For Single Prin Only

PC/104 and Small Form Factors Summer 2008 / 35 HARDWARE PC/104: New frontiers

Using PCI/104-Express Mechanics of stacking PCI Memory Chipset Processor Chip PCI/104-Express is designed to simplify PCI/104-Express CPU Module system configuration. For example, if a

PCI designer uses a typical 3.6" x 3.8" (92 mm PCIe 0.600 inches x 96 mm) 104 form factor CPU, the CPU (15.24 mm) is placed on top of the stack, as shown PCIe Device in Figure 5. PCI/104-Express add-in PCI/104-Express Peripheral Module boards are then stacked below the CPU. PCI Because all add-in boards are universal PCIe 0.600 inches cards and employ automatic lane shifting, (15.24 mm) the designer never has to set switches or PCIe Device jumpers. PCI/104-Express Peripheral Module

PCI PCIe 0.600 inches (15.24 mm) “PCI/104-Express PCI Device PCI-104 Peripheral Module

PCI is designed to simplify 0.600 inches (15.24 mm) system configuration … PCI Device PCI-104 Peripheral Module

Because all add-in PCI boards are universal Figure 5

cards and employ PCIe Device PCIe/104 Peripheral Module automatic lane shifting, PCIe 0.600 inches For Single(15.24 mm) Prin Only the designer never PCIe Device PCIe/104 Peripheral Module

PCIe 0.600 inches has to set switches (15.24 mm) PCIe Device or jumpers.” PCIe/104 Peripheral Module PCIe 0.600 inches PCI (15.24 mm) PCI Device If a designer chooses one of the PC/104 PCI/104-Express Peripheral Module

Embedded Consortium’s larger form PCI PCIe 0.600 inches factors such as EPIC or EBX or uses a (15.24 mm) PCI/104-Express module as a macro- Memory Chipset Processor component on a baseboard, the CPU Larger Form Factor PCI/104-Express CPU Module is typically placed on the bottom of the PCI PCIe stack, and add-in cards are stacked on top, as shown in Figure 6. The exact same cards used in the stack-down configura- Figure 6 tion can be used without any changes in this configuration as well because PCI/104-Express features a universal For more information on the add-in card design that automatically detects if it is installed above or below the PCI/104-Express specification, check out the CPU and selects the correct PCI Express link. Because of the frequencies involved PC/104 Embedded Consortium website at: with PCI Express, it is not recommended to stack modules both above and below www.pc104.org/pci104_Express_specs.php the CPU at the same time.

36 / Summer 2008 PC/104 and Small Form Factors Form factors Jim Blazer is the embedded PC designs. He currently The PC/104 Embedded Consortium main- vice chairman serves as chairman of the PC/104 tains specifications for three form factors. and Chief Tech- Embedded Consortium’s Technical The original 104 form factor is the readily nical Officer of Committee. Jim has a BSEE from recognized 3.6" x 3.8" (92 mm x 96 mm) RTD Embedded Penn State University. board. EPIC provides a midsized board at Technologies, Inc., 4.5" x 6.5" (115 mm x 165 mm). EBX is in State College, RTD Embedded Technologies 814-234-8087 the largest at 5.8" x 8" (146 mm x 203 mm). Pennsylvania, [email protected] PCI/104-Express is defined on all three form where he is responsible for managing www.rtd.com factors, as shown in Figure 7. ➤ intelligent data acquisition system and

EBX Express Form Factor

EPIC Express Form Factor

104 Form Factor PCI Connector

PCI Connector PCI Connector PCI/104-Express

PCI/104-Express PCI/104-Express Stackable PCIe Connector

Stackable PCIe Connector Stackable PCIe Connector

Figure 7

For Single Prin Only

PC/104 and Small Form Factors Summer 2008 / 37 p

c s

/ r

1 o 0 t 4 c a a f nd m ¸ sm l for al EDITOR’S CHOICE PRODUCT

A different take Denser, faster ASIC verification on XMCs I’m always on the lookout for systems that have undergone

a significant reduction in size. Those who used an ASIC Folks usually think of verification system in the last couple of decades know that XMCs as expansion modules the boxes were huge – we’re talking washing machine- for VME or CompactPCI boards, but sized huge. there’s nothing stopping more creative uses. And that’s exactly what the SBC-ComEx illustrates in its small form factor PC design with GiDEL has shrunk that huge box into something more two XMC sites for configurable expansion. toaster-sized in the PROC_SoC, powered by Altera Stratix III L340 FPGAs. The system holds SBC-ComEx runs either Windows or Linux on a COM Express three small form factor boards, x86 CPU module, with its suite of I/O. The XMC sites support each capable of 6M gates, for PCI Express as the connection for additional high-speed I/O. The a total capacity of 18M gates entire unit comes in a 250 mm x 170 mm footprint and operates running at 300 MHz system clock on either AC or 12 VDC input. speed. A larger version with 10 Innovative Integration boards handles up to 60M gates. www.innovative-dsp.com GiDEL RSC# 36881 www.gidel.com RSC# 37073 Green watch: Smarter wateringFor Single Prin Only I’ve seen several programmable sprinkler control systems, Better runtime tracing, more but this one has a couple of interesting ideas, including an 802.15.4 wireless connection from a PC to the controller and the complete support ability to download an online weather forecast to help project Code Red’s Eclipse-based C development tools now offer water needs – less on cool or rainy days, more on hot days. more advanced runtime tracing using serial wire-viewing The Cyber-Rain XCI system presents an easy-to-use PC interface capability in the Luminary Micro Stellaris microcontroller to set zones, keep track of water usage, and produce reports on family, a nonstopping technology that gathers information water savings, which the company claims can be 30-70 percent. nonintrusively as the target code executes. Modes such as “fertilizing” also can help manage a temporary Red Suite 1.5 adds support for project wizards, USB increase in water supply for a short period, then return to normal. registers, and DMA controllers in the Stellaris family, giving Cyber-Rain better views into microcontroller and peripheral activities www.cyber-rain.com as well as enabling faster code writing and debugging. RSC# 37072 The tool includes a FreeRTOS.org project wizard, which the company claims can generate a project skeleton in just four mouse clicks. Code Red Technologies Ltd. www.code-red-tech.com RSC# 37074 code_red™

38 / Summer 2008 PC/104 and Small Form Factors GPUs get GRIP on images Tiny 16-bit ADC for portable sensors GRIP in this case Linear Technology’s latest 16-bit delta-sigma ADC family means General- features a pair of converters with a 0.5 microamp shutdown purpose Rugged current in a tiny 3 mm x 2 mm, 8-pin package. The LTC2451 2 Image Processing, the has an I C interface and measures voltages from 0 to Vcc, basis for a new line while the LTC2452 has an SPI interface and measures of platforms launched a differential input up to ±Vcc. recently by Vision4ce. These units support up to 60 conversions per second but Combining an Intel can be throttled back to save power at lower sample rates – Core 2 Duo processor typically 40 microwatt at one sample per second. with a suite of GPUs Linear Technology in a rugged package, these units can process images in harsh www.linear.com environments. RSC# 37075 Besides the GRIP-Alpha rugged platform pictured here, larger versions are available with increasing numbers of GPUs. This Alpha unit includes 1 GPU, 4 GB of memory, two GbE ports, four USB ports, one PCI Express slot, and room for an SSD or SATA drive. Vision4ce www.vision4ce.com RSC# 36410

For Single Prin Only

PC/104 and Small Form Factors Summer 2008 / 39 LabVIEW ARMs up If you caught the DARwIn article on page 26, you noticed that the research team is making one Six inches, seven pounds, 100 GFLOPs improvement by adding Sounds like a birth an ARM microcontroller to announcement … and it is, in the robot platform. National Instruments recently announced a sense. Mercury Computer the LabVIEW Embedded Module for ARM microcontrollers. Systems has taken a leap in Targets include ARM 7, ARM 9, and Cortex-M3 reducing system size with the microcontroller families. new PowerBlock 50, packing Drivers are available for peripherals, along with a desktop 100 GFLOPs into a tiny, rugged, simulator and links into NI Multisim. In addition to a project liquid-cooled package. We saw wizard for fast configuration, the module includes an interrupt a preview at the recent VITA MediaFest, and we’re pretty sure the manager that sets up LabVIEW code to run when a specific package is rugged enough to stand on without collapsing. hardware interrupt occurs. With a Linux board support package development environment National Instruments and desktop-ready heat-rejection unit, developers can get started www.ni.com right away. Mercury expects to customize the payload and cooling RSC# 33913 to specific program requirements for volume shipments. Mercury Computer Systems Editor’s Ch ce P od cts are drawn from OSP’s product database and press releases. Vendors may www.mc.com add their new products to our website at www.opensystems-publishing.com/np and submit press releases at www.opensystems-publishing.com/news/submit. OSP reserves the right to publish products RSC# 36933 based on editors’ discretion alone, and does not guarantee publication of any product entries.

For SingleEcast Prin Only Embedded Computing Knowledge Webcasts

presented by OpenSystems Publishing

Coming in June Rough, REDI, and now FPGAs Sponsors: Mercury Computer Systems, Tundra Semiconductor, and Curtiss-Wright Controls Embedded Computing Moderator: Chris Ciufo

OpenSystems Publishing™

40 / Summer 2008 PC/104 and Small Form Factors For Single Prin Only Industrial automation: Sensors Six-channel 24/16-bit precision temperature measurement single-width IP module, with For more information OSRAM Opto Semiconductors fixed and optional programmable current Enter the product’s RSC No. at www.OSRAM-os.com source • Eight 16-bit A/D channels • Input www.smallformfactors.com/rsc SFH7740 and SFH7741 RSC No. 36502 voltage up to ±20 V • Each analog input is programmable separately ±10 V, ±5 V, 0-5 V, Industrial automation: Sensors...... 42 and 0-10 V • Programmable gain from 1 to 128 Mezzanines: IndustryPack...... 42 • IndustryPack module, 8/32 MHz Mezzanines: PMC...... 42 Mezzanines: XMC/PMC...... 42 Mezzanines: PMC Networking: CAN...... 42 4DSP Networking: Industrial computer...... 43 www.4dsp.com AD484 RSC No. 36144 Networking: Power over Ethernet...... 43 Processor boards/SBCs: COM Express . . . . 43 Processor boards/SBCs: ECX...... 43 Processor boards/SBCs: PC/104 ...... 44 Proximity sensor SFH7740 with optical touch switch measures 3.7 mm x 3.7 mm x 1.0 mm Processor boards/SBCs: PC/104-Plus. . . . . 44 and reacts to distances between 0.5 mm Processor boards/SBCs: StackableUSB . . . .44 and 4.0 mm • Compact dimensions allow it Ruggedized/Mil-spec: LCD monitor...... 44 to be unobtrusively integrated into unusual Ruggedized/Mil-spec: Solid-state drive . . . . 45 designs such as extremely low-profile devices • Depending on if the slider is closed Test and analysis: Boundary scan...... 45 or open, SFH7740 switches display lighting Test and analysis: Evaluation board...... 45 Quad 14-bit, 125 MSps A/D digitizer PMC off or on • Provides an alternative to Hall Test and analysis: Synchro converter module. . 45 sensors because it is insensitive to electro- (V rtex-4 FX and SX/LX) with optical trans- magnetic interference and does not produce ceivers (optional: Serial FPDP) • Four 14-bit, For125 MSps A/D channels • Custom Singleexternal Prin Only any electromagnetic interference • Proximity Networking: CAN sensor SFH7741 reacts at a typical working clock and trigger inputs • Dual Virtex-4 FX Dynamic Engineering distance of 20 mm and is suitable for a wide and LX/SX FPGA architecture • QDR2 SRAM range of applications • In hands-free mode and DDR2 SDRAM • PCI-X 64-bit 133/66 MHz www.dyneng.com with the phone away from the user’s ear, IP-CAN RSC No. 36785 backlighting can be switched on and volume Mezzanines: XMC/PMC adjusted accordingly • Helps save energy in AdvancedIO Systems digital cameras, switching off display light- www.advancedio.com ing whenever users hold the camera up to V1021 RSC No. 36417 their eyes and use the viewfinder instead of the screen • The two SMT sensors draw a current of 50 microamperes (approximately) • With integrated ambient light suppression, the sensors operate reliably in all lighting conditions IndustryPack Control Area Network (CAN) provides dual connections with direct or ISO options • Add CAN to VME, PCI, CompactPCI, Mezzanines: IndustryPack or PC/104-Plus hardware • Windows driver Alphi Technology Corporation available • Dual channels: Have redundancy www.alphitech.com built in, snoop or connect to more than one IP-THERMISTOR RSC No. 36416 bus, or simulate more than one instrument • Direct or isolated connections • -ISO model An intelligent VITA 42.3 XMC/PMC module suited for systems with voltage isolation that provides 10 GbE connectivity for demand- requirements • Programmable terminations: ing real-time applications • Enables use of Bus node must be terminated based on the 10 GbE as the high-performance fabric • network topology • Terminations are select- Xilinx Virtex-II Pro FPGA • Standard 10 GbE able in software to optimize performance SFP+ optical interface • PCI Express x4 and and reduce stocking requirements • Driver PCI-X 133 MHz interfaces • udpXG protocol support: Plug-and-play support is provided offload or streamXG direct data streaming with options to operate in Pelican or stan- (optional) dard mode • Reference application software

42 / Summer 2008 PC/104 and Small Form Factors is provided with the driver • Small package More formally known as IEEE 802.3af inter- with an extended feature set that offers with several system options for use in any nationally, PoE specifies a supply of 48 VDC PCI bus, PCI Express-based GbE LAN, and format system • IP carriers available for at up to 15.4 W per port • With the combined PCI Express-based SATA CompactPCI, PCI, VME, PCI-104, PC/104-Plus, capabilities of an unmanaged Ethernet and more switch and PoE power injector, the EKI-2525P RadiSys has four PoE ports capable of supplying up www.radisys.com Procelerant CE945GM2A RSC No. 36025 Networking: Industrial computer to 15.4 W each • Each port automatically detects when PoE-compliant devices are Korenix Technology attached before supplying power, allowing www.korenix.com the use of traditional (non-PoE) Ethernet JetBox 9300 RSC No. 36403 devices if needed • Compact, thin DIN-rail mount chassis suitable for applications where panel space is limited • Ruggedized for demanding industrial applications, with dual 12-48 VDC power inputs, 4,000 VDC Ethernet ESD protection, and power line surge (EFT) protection of 3,000 VDC • Features an operating temperature range of -10 °C to +60 °C to ensure system uptime • CUL (UL/CSA), CE, FCC, and RoHS/WEEE certified • Each Ethernet port is equipped with front- Replaces older ETX technology at a com- facing LED indicators that provide link, trans- parable price point, enabling high-speed mission speed, activity, and PoE output status serial interface options such as PCI Express, to aid in diagnosing issues with cables and SATA, and GbE • Based on the value-priced attached devices • Auto-MDI/MDI-X elimi- Intel Celeron M processor 440 • Higher pro- nates the need to use crossover cables for cessor performance at a value entry point Three-in-one industrial networking computer interswitch connections • Autonegotiation using the COM Express modular form factor • Consolidates industrial computer, router, provides optimum link configurations and • Can be combined with a RadiSys designed and managed switch to make networking compatibility with legacy devices low-profile active heat sink with an embed- simple • RISC, 64 MB SDRAM • Linux, VCOM, ded fan, allowing the module to be used in 1U platforms • Module and heat sink combi- Modbus gateway • Four COM, two USB, four Processor boards/SBCs: nation enables rapid design-in by eliminat- DI/DO, SD card • Router (five Ethernet ports) COM Express • Free combination between WAN and LAN • ing the need to create a heat sink that can ADLINK Technology, Inc. IP routed, static routing, NAT, firewall, DMZ • effectively cool a 1U system Managed switch • SNMP v1/v2c/v3 • Quality www adlinktech.com of Service, VLAN (802.1Q, port-based) Express-MLC RSC No. 36492 Processor boards/SBCs: ECX For SingleAmerican Portwell Technology Prin Only Networking: Power over Ethernet www.portwell.com Advantech eAutomation Group PEB-2736 RSC No. 36455 www.eAutomationPro.com EKI-2525P RSC No. 36397

Member of ADLINK’s Computer-On-Module (COM) Express family • 95 mm x 95 mm • COM Express Type 2 compatible design based on the Intel Atom processor Z500 3.5" Intel ECX form factor embedded board with series with the new Intel System Controller Intel Atom 45 nm ultra-low-power small form Hub US15W • Highly integrated off-the-shelf factor processor and chipset (TDP < 5 W) • building block based on the PCI Express One 200-pin SODIMM supports DDR2 SDRAM bus architecture • Plugs into custom-made, up to 1 GB • One Type II CompactFlash and application-specific carrier boards • Allows one IDE connector • Dual independent dis- for innovative designs that meet mobile and play: SDVO and 24-bit LVDS • SDVO connec- light computing needs, including: portable tor support VGA/DVI/LVDS daughtercard and mobile equipment for the automotive and • Multistream audio and CH5.1 supported Industrial 5-port Power over Ethernet (PoE) test and measurement industries, visual com- Trusted Platform Module and USB-Disk switch • Combines a compact and rugged munication in the medical field such as home Module can be added onboard • Designed 5-port unmanaged Ethernet switch with PoE care and video conferencing, entry-level for very low power consumption at less than technology to connect and power Ethernet public gaming devices, and public points of 10 W at full load • Supports dual display by devices over a single cable • PoE transmits communication • Basic version supports two LVDS and SDVO connector • Modular SDVO power plus data to remote Ethernet devices PCI Express x1, LVDS, SDVO, 8x USB 2.0, and SDIO board architecture can be custom- over standard twisted-pair Cat5e cables • SDIO, audio, and LPC bus • Also available ized easily

PC/104 and Small Form Factors Summer 2008 / 43 performance • Fanless operation (no moving Five host ports through the StackableUSB Processor boards/SBCs: PC/104 parts), soldered-on system memory, and ex- connector and two separate client USB ports Sealevel Systems tended temperature operation (-40 °C to +85 °C) • Dual network processing engines drive the www.sealevel.com for military, aerospace, medical, and indus- 10/100BASE-T Ethernet, allowing embedded C4-104.485+I RSC No. 36496 trial applications • Highly integrated AMD system users to offload networking tasks LX 800 processor delivers Celeron 800 MHz- from a server such as Ethernet filtering, equivalent performance while drawing which enables higher throughputs • Con- less than 5 W of power • Standard onboard sumes 385 mA typical in its basic configura- features include 256 MB soldered-on tion • 24 digital I/O lines • Eight readable DIP SDRAM, dual 10/100 Ethernet, four USB 2.0 switches • Eight LEDs for application use • ports, IDE interface, and three COM ports • Four RS-232 serial ports, one RS-485 configu- CompactFlash socket provides reliable, high- rable • 128 MB of SDRAM and 64 MB resident capacity onboard storage • Flexible options flash array • CompactFlash socket supports for keyboard, mouse, external storage, and storage devices and I/O devices such as other devices are provided via USB ports • Wi-Fi cards • Board support packages avail- Includes integrated SVGA and LVDS flat- able for Linux, Windows CE, and VxWorks PC/104 serial I/O adapter with four RS-422/485 panel support with MMX and 3DNow! for ports • 1,500 VDC port-to-port isolation pro- video-intensive applications • PC/104-Plus Ruggedized/Mil-spec: LCD monitor tects against transients and ground loops • interface supports both ISA and PCI add-on Stealth Computer Corporation Each port is software configurable for 4-wire modules • Standard pass-through connec- www.stealthcomputer.com tors allow the board to be used either above RS-422/485 or 2-wire RS-485 • Includes 16954 TuffTouch LCD Monitor RSC No. 35614 UART with 128-byte FIFOs and 9-bit support • or below other PC/104 modules • Can be used Error-free data rates to 921.6 Kbps • Includes as a CPU module for a larger system by plug- an Oxford 16954 UART with 128-byte trans- ging it into a proprietary baseboard that in- mit and receive FIFOs for communication cludes specific user I/O circuitry • Features up to 921.6 Kbps • UART includes support a General Software Embedded BIOS with for 9-bit protocol • Clock prescaler coupled OEM enhancements • Field reprogrammable with a 14.7456 oscillator provide high reso- BIOS supports custom defaults and the addi- lution for achieving all standard and many tion of firmbase securi y applications, remote nonstandard baud rates • Includes Sealevel booting, and o her pre-operating system Systems’ SeaCOM suite of drivers for software functions • Compatible with a variety Windows 98/ME/NT/2000/XP/Vista operating of popular operating systems, including systems • Includes WinSSD, a full-featured Windows CE/XP/XPe, QNX, VxWorks, Linux, diagnostic application providing powerful and other real-time operating systems • Fully testing and troubleshooting capabilities to ForRoHS-compliant • Options include conformalSingle Prin Only assist in application development and test- coating, BIOS customizations, revision locks, ing • Use WinSSD for bit error rate testing, custom labeling, high g shock and vibration throughput monitoring, loopback tests, and treatment, custom testing, and screening transmitting test pattern messages • Also includes drivers, utilities, application notes, Processor boards/SBCs: Industrial-grade, rugged, versatile touch- and technical details to simplify installations StackableUSB screen LCD monitor designed to handle the rigors of industrial and commercial environ- in Linux, QNX, and DOS • Standard operat- Micro/sys, Inc. ing temperature range is 0 °C to +70 °C • ments • 17" steel-enclosed touch-screen www.embeddedsys.com Extended temperature range version offer- LCD • Built to withstand harsh environments ing -40 °C to +85 °C is available • Covered by RCB1626 RSC No. 36863 typically encountered in industrial plant floor a lifetime warranty applications • NEMA 4/IP 66 LCD front panel withstands water, dust, and dirt intrusion • High precision, metal-encapsulated 17" view- Processor boards/SBCs: PC/104-Plus able display is capable of running resolutions VersaLogic up to its native mode of 1280 x 1024 pixels www.versalogic.com with both analog and digital input sources Cougar RSC No. 36489 • Low power consumption • Wide viewing angles • Enhanced image quality with 250 nits of brightness, 8 ms response time, and a contrast ratio of 500:1 • Available with resistive and capacitive touch-screen options • Includes a wide range of versatile mounting options such as wall, benchtop, pendant arm, and ceiling mounts • All Stealth LCD moni- tors are plug-and-play capable, requiring no video drivers or special interface cards • Suitable for applications such as Human- Machine Interface, factory automation, LX 800 PC/104-Plus embedded computer • Incorporates StackableUSB technology in process control, interactive kiosks, or de- Uses an AMD LX 800 processor that provides an ARM processor • Network-ready control- manding applications where vital information low power consumption without sacrificing ler on the 104 form factor • Seven USB ports: must be displayed

44 / Summer 2008 PC/104 and Small Form Factors Ruggedized/Mil-spec: Solid-state drive Trident Space and Defense www.tridentsd.com Trident BGADrive RSC No. 36775

control, four timers, ADC, RTC, DMA, and up to 80 GPIO • Dimensions: 149 mm x 142 mm • Processor: STR912FW42 (966E-S) with (256+32) KB internal flash and 96 KB internal Solid-state drive in a standard BGA form fac- SRAM • Working temperature: -40 °C ~ +85 °C tor that can be reflowed directly onto a PCB • • Power input: +5.0 V/1 A • 10/100M Ethernet Available in standard IDE and SATA interfaces interface (CS8900A) • USB 2.0 interface • BGA form factor: 29 mm x 29 mm • Less than (device) • CAN 2.0 communication interface 7 mm high • Capacities up to 32 GB using SLC with CAN driver chip • LCD interface (16 x 2 NAND flash • Custom sizes and form factors character LCD) • Seven LED indicator lights: available • Highly rugged for extreme envi- one for power, two for indicating network ronmental conditions • Suitable for military communication, others for general usage and industrial embedded systems Test and analysis: Test and analysis: Boundary scan Synchro converter module ASSET InterTech North Atlantic Indu tries www.asset-intertech.com www.naii.com ScanWorks RSC No. 36723 73DS2 RSC No. 36804 For Single Prin Only

CPU emulation test and diagnostic system • Supports Intel’s Atom processor with CPU A 3-channel programmable digital-to- emulation test and diagnostics • Takes con- synchro/resolver converter available on trol of the CPU and then asserts structural a PC/104 card • Three independent, trans- and functional test and diagnostic routines former isolated, programmable synchro/ through the processor to other devices and resolver simulation channels • Each channel other nodes on the circuit board has 16-bit resolution, ±1 arc-minute accuracy, and a short circuit protected output with Test and analysis: 1.2 VA drive capability • Each unit includes Evaluation board eight programmable digital I/O channels, wrap-around self-test, programmable out- GAO Tek Inc. put angle rotation, and an optional program- www.gaotek.com mable excitation reference supply • Provides ARM STDV912F RSC No. 36388 continuous background Built-In-Test on all Part of the STMicroelectronics STR91xF functions and channels, including reference series of ARM-powered microcontrollers, and signal loss detection which combines a 16/32-bit ARM966E-S RISC processor core with up to 96 KB SRAM, 256 KB main flash, and 32 KB second flash For more information • ARM966E-S core can perform single-cycle DSP instructions for speech processing, Enter the product’s RSC No. at audio algorithms, and low-end imaging • www.smallformfactors.com/rsc Equipped with USB, CAN, Ethernet, AC motor Everything’s coming up ‘small form factors’ SFF-SIG: New logo, new start, and a SUMIT to ascend. Meanwhile, the PC/104 Consortium rolls out PCIe, and ESC needs a new name.

Before last month’s Embedded Systems Conference (ESC) even right first and let the SIG’s members propose the definition for the got rolling in San Jose, the SFF-SIG held a private dinner to brief physical card size. Member company VIA Technologies did just the media on what I believe is a new idea that stands a snowball’s that, showing a proof-of-concept Pico-ITX processor board modi- chance at success. In a packed room at the San Jose Marriott, fied with SUMIT-based Pico-I/O add-in cards. (Note: VIA even had international journalists and companies began charting a course Robert Kuo, inventor of the Mini-, Nano-, and Pico-ITX modules for the creation of several new Small Form Factors (SFFs) while present at this kickoff. That says they’re serious about this, folks.) capitalizing on the trends of Size, Weight, and Power (SWaP), PCI Express (PCIe), low cost, and processor independence. Later that evening, various SFF-SIG member companies and (presumably) a few “lurkers” milled about after the crème brûlée The SFF-SIG was an idea I personally championed behind the had congealed. European companies congatec AG and SECO – scenes and in print. With more than 80 SFFs in the market, it’s founders of the Qseven SFF consortium – announced that MSC high time to rein it all in and foster the type of “co-opetition” Vertriebs GmbH and Hectronic of Sweden will support the (cooperation/competition) that births open standards and creates Qseven platform I a so noticed some ex-Kontron people in atten- sustainable markets with multiple vendors. PC/104 is one such dance. The on-the-record attendees or supporters include VIA, successful SFF, and at ESC the PC/104 Embedded Consortium Ampro Computers, congatec, General Standards Corporation, also announced its own new flavor, called PCI/104-Express. Octagon Systems, American Portwell Technology, Samtec, SiliconSystems, Tri-M Systems, VersaLogic, and WinSystems. I described the SFF-SIG’s mission in the PC/104 and Small Form Factors 2008 Resource Guide (www.smallformfac ors.com/ Not to be outdone, the next day the PC/104 Consortium unveiled departments/insight/2008/03/01/a_new_sig_in_town/). Now the two years’ worth of work and a few lost member companies. Their group has taken the wraps off its SUMIT interface. Based on briefing made it crystal clear that the PC/104 ecosystem intends a low-bux Samtec connector set that theyFor say sells for a mere to stay weddedSingle to the successful ISA/PCI legacy desktop world. Prin Only $16 in quantity 1, the Stackable Unified Module Interconnect Several audience members provided impromptu assertion testi- Technology (SUMIT) is intended to decouple the board size and monials to this fact: I’d just witnessed the genesis of the market interconnect from the processor bus du jour. Moreover, the size split between the visions of the PC/104 Consortium and the and interconnect are designed to balance the best of legacy inter- SFF-SIG. Ironically, many companies belong to both camps, lead- faces and current- and future-generation connectivity options. And ing to possible future multiple personalities not seen since Sybil. because PC/104 has enjoyed such a long run of success partially PCI/104-Express also uses a Samtec connector, but this one has a because of a well-managed life cycle (read: anti-obsolescence), better eye diagram and can support faster and wider signals. SUMIT is building “long term” in at the start. In other SFF news, congatec’s Qseven and XTX form factors Here are the technical whizzies: SUMIT includes two PCIe x1 and might soon become SFF-SIG standards, LiPPERT Embedded one PCIe x4 lanes. On an SFF, the routing (and cost!) required Computers announced CoreExpress, which is arguably the to accommodate anything fatter than x4 approaches diminishing smallest Intel-based SFF SBC on the market, and XtremeData returns. There are three USB 2.0 ports, an LPC “bus” to bridge back showcased the XD2000 Altera Stratix II-based FPGA coprocessor to legacy modules (such as PC/104 running ISA), SPI, MicroWire, SFF compatible with AMD’s and Intel’s coprocessor initiatives. SMBus, and I2C. These pins and traces can be configured to sup- Also at ESC, the general manager of ADLINK briefed me on port an Express card, the add-in I/O choice of today’s high-volume the company’s post-acquisition plans for PC/104 inventor Ampro laptops and notebook computers. SUMIT’s Samtec Q2 52-pin con- (hint: U.S. manufacturing and design, leading to military sales), nector has a relatively clean eye diagram for 5 GHz signals with and EMAC beefed up its almost Gumstix-sized SODIMM SoM boards stacked three high and is supposedly rugged enough to deal SFF modules with a ColdFire MCF5282 32-bit CPU. with standoffs. At these speeds, even PCIe 2.0 and USB 3.0 are doable. Samtec claims insertion cycles of 1,000 times, well beyond ESC showcased so many SFFs that it should be renamed SFF ESC. what any board stack would ever see in the real world. Really. Embedded hardware seems to only come in SFF sizes, and we are ramping up our coverage of SFF trends in this very The SFF-SIG also announced its Express104 standard, which is magazine1. Stay tuned. PC/104-like at 90 mm x 96 mm, with 14 square inches (8,600 square mm) per side. Clearly, the SFF-SIG wanted to get the basics Chris A. Ciufo, [email protected]

1 Two other SFFs recently appeared in an unlikely place: under the umbrella of VITA, owner of the sacred VME flame. VITA 57 pertains to a smaller-than-PMC FPGA mezzanine card designed to make FPGA I/O swaps easier than a full basecard re-layout. As well, the new VITA 59 Rugged System-On-Module is COM-sized but includes a full billet alloy frame for extremely rugged shock and vibration, plus it offers nifty conduction cooling for up to about 40 W over a wide temperature range.

46 / Summer 2008 PC/104 and Small Form Factors For Single Prin Only