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Congatec Product Guide
Product Guide 2020 NXP based Modules congatec A story of courage and passion. Pursuing this dream calls for a lot of courage and absolute conviction. It’s a dream that inspires us, drives us anew every day. It’s a dream that requires passionate supporters to push it forward. People who help others progress and improve themselves in the process. People who inspire and are inspired. This is the story of congatec. The story of people who carry this spirit within them. People who put their all into developing new ideas – while remaining flexible and creative. Who respond quickly and solve problems. Who are always learning and want to explore the unknown. Who always beat a new path, whenever possible. Who stand out – when it’s good to be an individual. And who do it all for the customer and their needs. Embedded in your success. Pure-Play Roadmap Solid World’s largest vendor focused on Most complete roadmap Stable finance. COMs, SBCs and customized of COM products. Strong growth, no debt and designs only. solid profit. Design-In Innovative Logistics Proven superior design-in support. Close partnerships to Intel, AMD Logistics and stability of supply. Review of customers designs for and NXP. Strategy for long lead time compliance, thermal and Active player in standardization components. Flexibility through mechanical design to reduce risk committees SGET and PICMG. last time buy process. Proven and shorten design cycles. quality for more than 13 years. Technology Leader congatec has been driving industry standards since 2005 SMARC 2.0 Module Configurable Battery Thin 2.5” SBC 3.5” SBC BIOS Manager Mini-ITX Pico-ITX Type 2 Heat Pipe Type 6 First Type 10 Type 7 Acquisiton Module Cooling Module Module Module Real-Time Systems Founder Founding Design Guide Founding customizing IoT COM HPC Member Member Services Gateway Chairman 2005 2006 2007 2008 2009 2010 2011 2012 2013 2014 2015 2016 2017 2018 2019 2020 Technology Partnerships Executive Member Founding Member Board Member Associate member Specification editor Rev. -
Qseven MSC Q7-MB-RP3
Qseven MSC Q7-MB-RP3 Description Qseven™ 2.0 Evaluation Board The MSC Q7-MB-RP3 is the third generation reference platform provided to test and qualify Qseven™ Rev. 2.0 modules for compatibility with the SGET specification. The board is shipped with a complete set of design files. An extensive design guide for the Qseven™ module technology is also provided to allow the motherboard designer to easily implement a custom version of a Qseven™ carrier. The Qseven™ Rev. 2.0 reference platform MSC Q7-MB-RP3 offers a large variety of interfaces commonly used in industrial applications such as Gigabit LAN, USB 3.0/2.0, RS232 and CAN as well as HDMI, DP and LVDS 435 x 170 for display attachment. In addition PCI Express is supported with one x16 and three PCIe x1 slots. This platform for N.A. rapid prototyping helps to assess the fitness of a specific CPU Technology. It is a key instrument to shorten design N.A.N.A. cycles and to improve time to market of new Qseven™ based systems. Highlights . One PCI Express™ x16 slot and 3 x1 slots . Two graphic card slots for HDMI / DP / eDP / LVDS . Mini PCI Express™ & mSATA slot . SD Card socket and SIM Card slot . Two SATA onboard connectors . Winbond W83627DHG Super I/O . EXAR X28V384 Super I/O . 7x COM, HW monitor . CAN Transceiver . HD audio codec . USB 3.0, 4x USB 2.0 Host and USB 2.0 Client interfaces avnet.com/embedded Qseven Technical Data - MSC Q7-MB-RP3 Formfactor Wide-ATX Storage Interfaces 2x SATA USB USB 3.0, 4x USB 2.0 Host, USB 2.0 Client Serial Interfaces 2x COM from Winbond Super I/O 4x COM from EXAR Super I/O 1x COM from Qseven module Bus Interfaces PCI express x16, 3x PCIe x1 Display Interfaces HDMI, DP, eDP, LVDS on add-on cards Network Interface GbE Audio Interface HD Audio on 6 connectors + S/PDIF Power Requirement 12V on standard connectors Certificates UL avnet.com/embedded Qseven Order Reference - MSC Q7-MB-RP3 Order Description Reference Cat Number 1135005 The MSC Q7-MB-RP3 is a reference platform designed for evaluation and MSC Q7-MB-RP3 PV test of Qseven Rev. -
SFF.2009.RG.Pdf
Only Print Single Only Print Single www.smallformfactors.com www.pc104online.com Volume 13 • Number 1 COLUMNS FEATURES 8 PC/104 Consortium THE BIG YET SMALL PICTURE: Embedded marketplace embraces PCI/104-Express By Dr. Paul Haris Small, smaller, smallest 12 The wireless toolbox 9 Small Form Factor SIG By John Schwartz, Digi International Separating interconnects from form factors By Paul Rosenfeld 15 Focus on Form Factors: Pico-ITXe 10 Euro Small Tech By Bob Burckle, WinSystems Compact board powers personal weather station By Hermann Strass TECH SMALL TALK: Insights from the experts 74 Editor’s Insight 16 COMIT hits the embedded computing world Rugged SFFs nail system designs By Bob Burckle, WinSystems By Chris A. Ciufo Only IT’S A SMALL (FORM FACTOR) WORLD: Unique applications DEPARTMENTS 19 PC/104 powers nanosatellite for space situational 24 Editor’s Choice Products awareness By Kristin Allen, Kristin Allen Marketing & Design By Don Dingee Print 22 Prototyping SoCs with customized PCI Express WEB RESOURCES development boards By Stephane Hauradou, PLDA Subscribe to the magazine or E-letter Live industry news • Submit new products RESOURCE GUIDE: http://submit.opensystemsmedia.com White papers: 27 2009 PC/104 and Small Form Factors Resource Guide Read: http://whitepapers.opensystemsmedia.com Submit: http://submit.opensystemsmedia.comSingle Communications and networking ...........27 Complete systems .....................29 ON THE COVER: In a progression from small to smallest, the ADLINK Technology Industrial automation ...................30 MilSystem 800, WinSystems Pico-I/O with VIA Pico-ITXe, and Digi XBee radio module show the latest trends in small form factor Interfaces ..........................32 systems and boards. -
Focus on Your Core Competency the COM Express Standard
Computer-On-Modules Focus on your Core Competency The COM Express Standard – A Computer-On-Module (COM) provides a convenient solution for Adaptable to Your Specific Needs OEMs that need computing functionality but are not interested in COM Express was developed and is maintained by PICMG investing the time and resources into designing a single board (PCI Industrial Computer Manufacturers Group). COM computer. There are several COM standards, one of the more Express was released in the summer of 2005 and is the popular being COM Express (also referred to as COM.0). COM most widely used COM standard. The standard defines the Express modules contain the CPU, memory, common peripherals physical size, interconnect, and thermal interface for a COM. (USB, SATA) and an I/O interface (PCI and PCI Express). OEMs that The original COM Express specification was written to use COM Express modules design a carrier board that contains any support peripherals that were available at the time of release required I/O interfaces not found on the COM Express module as – including USB 2.0, SATA, PATA, Ethernet, VGA, LVDS, well as connectors for external I/O. A COM based solution allows SDVO, PCI, and PCI Express Gen 1. Several pinout types an OEM to focus on their core competency and not the design and were defined by PICMG with each one having a specific maintenance of a single board computer. combination of peripherals, expansion interfaces and connector layout. The most widely used COM Express A COM Express based solution with a custom carrier board offers module is a type 2, followed by type 1. -
User Manual - S.USV Solutions Compatible with Raspberry Pi, up Board and Tinker Board Revision 2.2 | Date 07.06.2018
User Manual - S.USV solutions Compatible with Raspberry Pi, UP Board and Tinker Board Revision 2.2 | Date 07.06.2018 User Manual - S.USV solutions / Revision 2.0 Table of Contents 1 Functions .............................................................................................................................................. 3 2 Technical Specification ........................................................................................................................ 4 2.1 Overview ....................................................................................................................................... 5 2.2 Performance .................................................................................................................................. 6 2.3 Lighting Indicators ......................................................................................................................... 6 3 Installation Guide................................................................................................................................. 7 3.1 Hardware ...................................................................................................................................... 7 3.1.1 Commissioning S.USV ............................................................................................................ 7 3.1.2 Connecting the battery .......................................................................................................... 8 3.1.3 Connecting the external power supply ................................................................................. -
Mini ATR, 3-Slot Openvpx™ Platform RUGGED, SMALL FORM FACTOR
DATA SHEET Mini ATR, 3-Slot OpenVPX™ Platform RUGGED, SMALL FORM FACTOR DESCRIPTION The modular design of this Mini ATR platform allows for various con- figurations. The chassis can easily be scaled up or down while using the same side walls. DC and AC power variations as well as custom front I/O configurations are available. Elma also offers a wide selec- tion of backplanes in various architectures and has different milled card cage sizes off-the-shelf. Functional Features Benefits ■■ Small form factor mini ATR-style chassis, natural convection- The all-aluminum Mini ATR incorporates military-grade cooled is low weight, ideal for weight critical applications components like MIL-DTL-38999L connector, on/off and reset switches, LEDs, breakers, etc. EMC shielding is compliant to (SWaP) MIL-STD-461E. Depending on specific applications, commercial, ■■ 3-slot backplane, 1in pitch to meet VITA 65 (OpenVPX) Back- industrial, or military-grade power supplies are available. The plane Profile BKP3-CEN03-15.2.9-n accepts 3U OpenVPX Mini ATR can also be configured with solid-state storage and boards on a 1in pitch, according to VITA 48.2 (REDI) and 250 W AC plug-in power supply module. VITA 65 (OpenVPX) ■■ Other backplanes can be accommodated: 3U CPCI, custom ■■ Two sizes available; other sizes custom: ■■ 1)133mm H x 175mm W x 311mm D (5.24in H x 6.89in W x 12.24in D) ■■ 2) 133mm H x 175mm W x 235mm D (5.24in H x 6.89in W x 9.25in D) ■■ Advanced airflow design distributes air across external fins in sidewalls ■■ Optional plug-in power supply provides up to 350 W VDC; AC versions also available ■■ Option to accommodate 2.5in storage with drive tray ■■ Custom I/O options including MIL-STD wiring and connectors OPTIONAL COMPUTING PRODUCTS ›■ 3U and 6U VPX compliant single board computers. -
A Highly Modular Router Microarchitecture for Networks-On-Chip
A Highly Modular Router Microarchitecture for Networks-on-Chip Item Type text; Electronic Dissertation Authors Wu, Wo-Tak Publisher The University of Arizona. Rights Copyright © is held by the author. Digital access to this material is made possible by the University Libraries, University of Arizona. Further transmission, reproduction, presentation (such as public display or performance) of protected items is prohibited except with permission of the author. Download date 01/10/2021 08:12:16 Link to Item http://hdl.handle.net/10150/631277 A HIGHLY MODULAR ROUTER MICROARCHITECTURE FOR NETWORKS-ON-CHIP by Wo-Tak Wu Copyright c Wo-Tak Wu 2019 A Dissertation Submitted to the Faculty of the DEPARTMENT OF ELECTRICAL AND COMPUTER ENGINEERING In Partial Fulfillment of the Requirements For the Degree of DOCTOR OF PHILOSOPHY In the Graduate College THE UNIVERSITY OF ARIZONA 2019 THE UNIVERSITY OF ARIZONA GRADUATE COLLEGE As members of the Dissertation Committee, we certify that we have read the dissertation prepared by Wo-Tak Wu, titled A HIGHLY MODULAR ROUTER MICROARCHITECTURE FOR NETWORKS-ON-CHIP and recommend that it be accepted as fulfilling the dissertation requirement for the Degree of Doctor of Philosophy. Dr. Linda Powers --~-__:::::____ ---?---- _________ Date: August 7, 2018 Dr. Roman Lysecky Final approval and acceptance of this dissertation is contingent upon the candidate's submission of the final copies of the dissertation to the Graduate College. I hereby certify that I have read this dissertation prepared under my direction and recommend that it be accepted as fulfilling the dissertation requirement. _____(/2 __·...... ~"--------\;-~=--------- · __ Date: August 7, 2018 Dissertation Director: Dr. -
DM3730, DM3725 Digital Media Processors Datasheet (Rev. D)
DM3730, DM3725 www.ti.com SPRS685D–AUGUST 2010–REVISED JULY 2011 DM3730, DM3725 Digital Media Processors Check for Samples: DM3730, DM3725 1 DM3730, DM3725 Digital Media Processors 1.1 Features 123456 • DM3730/25 Digital Media Processors: • Load-Store Architecture With – Compatible with OMAP™ 3 Architecture Non-Aligned Support – ARM® Microprocessor (MPU) Subsystem • 64 32-Bit General-Purpose Registers • Up to 1-GHz ARM® Cortex™-A8 Core • Instruction Packing Reduces Code Size Also supports 300, 600, and 800-MHz • All Instructions Conditional operation • Additional C64x+TM Enhancements • NEON™ SIMD Coprocessor – Protected Mode Operation – High Performance Image, Video, Audio – Expectations Support for Error (IVA2.2TM) Accelerator Subsystem Detection and Program Redirection • Up to 800-MHz TMS320C64x+TM DSP Core – Hardware Support for Modulo Loop Also supports 260, 520, and 660-MHz Operation operation – C64x+TM L1/L2 Memory Architecture • Enhanced Direct Memory Access (EDMA) • 32K-Byte L1P Program RAM/Cache Controller (128 Independent Channels) (Direct Mapped) • Video Hardware Accelerators • 80K-Byte L1D Data RAM/Cache (2-Way – POWERVR SGX™ Graphics Accelerator Set- Associative) (DM3730 only) • 64K-Byte L2 Unified Mapped RAM/Cache • Tile Based Architecture Delivering up to (4- Way Set-Associative) 20 MPoly/sec • 32K-Byte L2 Shared SRAM and 16K-Byte • Universal Scalable Shader Engine: L2 ROM Multi-threaded Engine Incorporating Pixel – C64x+TM Instruction Set Features and Vertex Shader Functionality • Byte-Addressable (8-/16-/32-/64-Bit Data) -
COM Express® Basic, Compact, Mini • Qseven® • SMARC™
• • • • Computer Highlights Product ETX® SMARC™ Qseven COM Express® - ® Qseven® on (70 x 70 mm) - Module Basic SMARC™ (84 x 55 mm) , Compact COM Express® mini (84 x 55 mm) , Mini your specialist for embedded solutions COM Express® Compact (95 x 95 mm) 13.10.2017 COM Express® Basic (125 x 95 mm) Embedded Boards Industrial Mainboards Embedded Systems Accessories & IoT 2,5“ Pico-ITX™ Mini-ITX™ Embedded Box PCs Gateways 3,5“ Single Board Computer Micro-ATX Embedded Panel PCs Switches PC/104 Flex-ATX Embedded Server Router Slot SBC ATX Embedded Desktop PCs Memory, CPUs Computer-on-Module Digital Signage Player Cables Industrial Monitors Power Supplies Available Features & Options: Designed for Industrial Applications Long-term Availability Extended Temperature -40°C…+85°C Custom Design Design-in Support Fixed Bill of Material Kits (Board with OS, Display & Cables) EOL / PCN Handling your specialist for embedded solutions Systems - Custom - Standard Kit Solutions - Embedded Board - Operating System - Accessories e.g. Cable/Memory Distribution - Embedded Boards - Displays - Power Supplies your specialist for embedded solutions COM Express® Basic Type 6 & Type 7 COM Express® Basic (125 x 95 mm) your specialist for embedded solutions COM Express® Basic (95 x 125 mm) Intel® Core™ i CPU (Kaby Lake & Skylake) Product SOM-5898 COMe-bKL6 ET970 SOM-5897 COMe-bSL6 Vendor ADVANTECH Kontron iBASE ADVANTECH Kontron Type / Pin-out Type 6 R2.1 Type 6 Type 6 Type 6 Type 6 Intel® Xeon®, Core® i, Intel® Core® i, Xeon, Intel® Core™ i , Xeon (7th Intel® Core™ -
Highrel PC/104 ISA, PCI & Pcie Modules and Systems
Copyright © 2010 RTD Embedded Technologies, Inc. All rights reserved. All trademarks or registered trademarks are the property of their respective companies. RTD Embedded Technologies, Inc. Catch the Express! Left: a stellar PCI/104-Express IDAN® including dual, hot-swappable SATA drawers, a 1.86 GHz Intel® Core™ 2 Duo cpuModule™ and Controller with video ports, serial ports, gigabit Ethernet, Advanced Analog & Digital I/O ports, and an 88W high-efficiency power supply. Below: a sample of RTD’s Express offering. RTD is proud to lead the industry in PCI/104-Express selection and development. PCI/104-Express PCIe/104 with Dual Ethernet Intel® Core™ 2 Duo cpuModule™ Intel® Core™ 2 Duo cpuModule™ High-Speed Digital I/O Isolated Digital I/O 88W Power Supply SATA Drive Carrier Dual-Slot Mini PCIe 5-Port Ethernet Switch Dual Gigabit Ethernet PCI Express to PCI Bridge rights reserved. All Inc. Inc. the property of their respective companies. the property of their respective are Technologies, Embedded RTD The Leading Source for Express. 2010 Design, Engineering, Manufacturing & Tech Support Copyright © Copyright All trademarks or registered trademarks All trademarks or registered www.rtd.com AS9100 and ISO 9001 Certified [email protected] www.smallformfactors.com www.pc104online.com Volume 14 • Number 5 COLUMNS FEATURES 6 Small Form Factor SIG Enabling SFF systems: More than just CPUs 10 THE BIG YET SMALL PICTURE By Paul Rosenfeld Mission interoperable Achieving compatibility by 7 PC/104 Consortium Promotions and spec revisions on tap for standardizing -
M-501 Datasheet.Pdf
Linux-ready Arm9 System on Module M-501 Features • ATMEL 180MHz AT91RM9200 CPU w/ MMU • Linux kernel 2.6.14 with file system • 64MB SDRAM and 16MB NOR Flash • 1 x 10/100Mbps Ethernet • 2 x USB 2.0 hosts supporting full speed of 12Mbps • 1 x SD (secure digital) interface • 4 x 921.6Kbps UARTs w/ hardware flow control • External bus (A0~A7, D0~D7, RD, WR), with 4 x chip select • Ultra-low power consumption, less than 2.5 Watts • GNU C / C++ toolchain is included H/W Specifications CPU / Memory GPIO (General-purpose I/Os) • CPU: ATMEL 180MHz AT91RM9200 w/ MMU • 32 x GPIOs can be programmed as digital input or output • Memory: 64MB SDRAM, 16MB NOR Flash • Supports interrupt function when GPIOs are set as digital input Network Interface • Signal Level: CMOS / 3.3V compatible • Type: 1 x 10/100Mbps Ethernet Pre-defined Pins • PHY: DAVICOM DM9161 • Reset Button (CN2, pin#35), input • Protection: 1.5KV magnetic isolation • Buzzer (CN2, pin#37), output UART Interface • 2-pin DIP SW (CN2, pin#12, #13), input • Port 0: TXD0, RXD0, RTS0, CTS0, GND • System ready LED (CN2, pin#38), output • Port 1: TXD1, RXD1, RTS1, CTS1, DCD1, DTR1, DSR1, GND • LAN activity LED (CN3, pin#11), output • Port 2: TXD2, RXD2, RTS2, CTS2, GND Undefined Digital I/O Pins (Reserved) • Port 3: TXD3, RXD3, RTS3, CTS3, GND • CN1: pin#23, #24, #25, #26 • Signal Level: CMOS / 3.3V compatible • CN3: pin#23, #24 Common UART Parameters Debug Ports • Baud Rate: Up to 921.6Kbps • Console Port: Tx / Rx serial console (share RTS2, CTS2) • Parity: None, Even, Odd, Mark, Space • Data Bits: -
Embedded Multi-Core Processing for Networking
12 Embedded Multi-Core Processing for Networking Theofanis Orphanoudakis University of Peloponnese Tripoli, Greece [email protected] Stylianos Perissakis Intracom Telecom Athens, Greece [email protected] CONTENTS 12.1 Introduction ............................ 400 12.2 Overview of Proposed NPU Architectures ............ 403 12.2.1 Multi-Core Embedded Systems for Multi-Service Broadband Access and Multimedia Home Networks . 403 12.2.2 SoC Integration of Network Components and Examples of Commercial Access NPUs .............. 405 12.2.3 NPU Architectures for Core Network Nodes and High-Speed Networking and Switching ......... 407 12.3 Programmable Packet Processing Engines ............ 412 12.3.1 Parallelism ........................ 413 12.3.2 Multi-Threading Support ................ 418 12.3.3 Specialized Instruction Set Architectures ....... 421 12.4 Address Lookup and Packet Classification Engines ....... 422 12.4.1 Classification Techniques ................ 424 12.4.1.1 Trie-based Algorithms ............ 425 12.4.1.2 Hierarchical Intelligent Cuttings (HiCuts) . 425 12.4.2 Case Studies ....................... 426 12.5 Packet Buffering and Queue Management Engines ....... 431 399 400 Multi-Core Embedded Systems 12.5.1 Performance Issues ................... 433 12.5.1.1 External DRAMMemory Bottlenecks ... 433 12.5.1.2 Evaluation of Queue Management Functions: INTEL IXP1200 Case ................. 434 12.5.2 Design of Specialized Core for Implementation of Queue Management in Hardware ................ 435 12.5.2.1 Optimization Techniques .......... 439 12.5.2.2 Performance Evaluation of Hardware Queue Management Engine ............. 440 12.6 Scheduling Engines ......................... 442 12.6.1 Data Structures in Scheduling Architectures ..... 443 12.6.2 Task Scheduling ..................... 444 12.6.2.1 Load Balancing ................ 445 12.6.3 Traffic Scheduling ...................