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The 3rd Generation ® Core™ Processor: A must have for all high-performance embedded computing appliances

If it’s embedded, it ’s Kontron. Whitepaper

The 3rd Generation Intel® Core™ Processor: A must have for all high-performance embedded computing appliances

Intel® 3-D processor technology brings a new dimension of processing to the embedded computing space and comes with a great deal of improvements. What are the most important benefi ts for embedded appliances and how can engineers deploy them most effi ciently?

Abstract With their increased performance levels, lowered TDP, improved high-end embedded graphics performance, optimized security, and broad scalability, the 3rd generation Intel® Core™ processors provide an attractive solution for a broad array of high performance embedded applications in target markets such as medical, communications, industrial automation, infotainment and military. This whitepaper gives engineers a closer look into the architectural improvements of the new 3rd generation Intel® Core™ processors and delivers the answers as to how they can integrate these most effi ciently into their appliances.

CONTENTS

Overview...... 3 Improved architecture: a tick-plus ...... 3 Enhanced performance...... 4 Turbo Boost 2.01 ...... 4 Extended AVX and SEE instructions ...... 5 Improved interface performance ...... 5 Additional power savings ...... 5 Enhanced media and graphics ...... 6 Secure manageability ...... 7 The new benchmark comes in different fl avours ...... 7 COM Express® basic Computer-on-Module ...... 8 Flex-ATX and Mini-ITX embedded motherboards ...... 8 AdvancedMC™ ...... 8 3U and 6U CompactPCI® blades ...... 9 3U VPX CPU boards ...... 9 Custom designs and application-ready platforms ...... 9

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Overview dimensions. But as gate lengths approach sub-32nm dimensions, scaling becomes more challenging to overcome High-performance embedded computing applications, the fundamental physical limitations imposed by traditional such as image processing in automation and medical materials. As the size decreases, planar applications, embedded cloud computing and digital transistors increasingly suffer from the undesirable off-state signal processing in communications, as well as signals leakage current, which increases the idle power required intelligence in military and aerospace platforms, all by the device [1]. To solve this issue and keep the pace share a common demand in terms of highest possible of technology advancement, yet another innovation was signal processing performance, throughput and graphics needed to fuel Moore’s Law for the years to come. processing. At the same time, this demand is frequently coupled with strict requirements in regards of power In 2012 Intel® has accomplished this with another radical effi ciency to deliver a level of performance per watt change in its transistor design. For the fi rst time in history, that fi ts the needs of space-, weight- and power- silicon transistors entered the third dimension. With the 3rd constrained (SWaP) applications that characterize many generation Intel® Core™ processors, Intel® is introducing embedded deployments. With the development of a new the tri-gate transistor, in which the transistor channel is 22-nanometer (nm) 3-D tri-gate transistor technology, raised into the 3rd dimension. Adding a third dimension to Intel® introduced several architectural improvements that transistors allows Intel® to increase transistor density to lay the groundwork to continuously fulfi l these tough 1.4 billion transistors on a die size of 160mm² and insert demands for the next years to come. more capabilities into every square millimetre of these new processors [2]. The current fl ow is now controlled on The 3rd generation Intel® Core™ processors, which are the three sides of the channel (top, left and right) rather than fi rst processors to leverage this new technology, provide just from the top, as in conventional, planar transistors. up to 20% enhanced computing power and up to 40% The net result is much better control of the transistor, a increased performance per watt compared to designs based maximization of current fl ow for when high performance is on the 2nd generation Intel® Core™ processors. Embedded required and minimization when it is off to reduce leakage computing platforms that implement the new processors [3]. enable OEMs to build applications with increased processing density and I/O bandwidth within tight thermal envelopes. This also meets and exceeds the requirement for improved size, weight and power of embedded designs and enables designers to utilize the power of the latest quad-core Intel® processors for the fi rst time on small form factors such as COM Express®, AdvancedMC™ and 3U VPX.

Additional improvements, such as extended Intel® Advanced Vector Extensions (AVX) and SSE instructions as well as the support for OpenCL 1.1 provide developers Copyright: Intel® effi cient tools to reduce the development effort and Image 1: 3-D Tri-Gate transistors form conducting channels time-to-market for parallel computing applications. on three sides of a vertical fi n structure to maximize current Further advancements, such as the integrated Intel® HD fl ow on the one hand and reduce leakage current at the other Graphics 4000, that now features 30% more execution hand. Moreover, Tri-Gate transistors can have multiple of units than the previous generation and natively supports these vertical fi ns connected together to increase total drive three independent digital display interfaces, enables strength for higher performance [4]. sophisticated graphics intensive applications such as infotainment and digital signage with an immersive user experience. All of these architectural improvements are But the change in transistor design is not the only worth taking a closer look into the enhancements and architectural improvement in the 3rd generation over the how OEMs in the different verticals can unleash the full 2nd generation Intel® Core™ processors. Together with the potential of this new processor architecture by leveraging 3-D tri-gate transistor technology Intel® also introduced standardized and proven platforms to minimize design and a new graphics architecture which offers up to twice risks and speed up time-to-market. the HD media and 3-D graphics performance compared to its predecessor. Further new features are support for low-power DDR3L memory, dynamic overclocking control of both the compute and graphics cores, power-management Improved architecture: a tick-plus improvements and security enhancements to guard against escalation of privilege attacks. With the introduction of the 32 nm process in 2009, Intel® maintained its historical doubling of chip functionality This signifi cant redesign is quite unusual in Intel's "tick- every two years by continually reducing transistor tock" chip-release cadence, in which a tick stands for a

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process shrink and a tock stands for a new architecture. Transistor Changing the chips’ architecture while at the same time Gate Delay shrinking the size of the underlying transistors is an (normalized) acceleration of Intel’s “tick-tock” model. This is why Intel® refers to the 3rd generation Intel® Core™ processor as "a 2.0 tick-plus" – a scaled-down version of the 2nd generation 1.8 Intel® Core™ processors, but with its own architectural improvements [2]. 1.4 37% Faster 32 nm Planar 1.2

Enhanced performance 1.0 18% Due to these improvements and as already mentioned in 22 nm 0.8 Trigate Faster the overview chapter, the 3rd generation Intel® Core™ processors now offer up to 20% enhanced computing power 0.6 Operating and up to 40% increased performance per watt compared Voltage to designs based on the 2nd Generation Intel® Core™ 0.5 0.6 0.7 0.8 0.9 1.0 1.1 (V) processors. But this is not all: This increase in power effi ciency now also allows applications with tight thermal Image 2: 22 nm 3-D Tri-Gate transistors provide improved envelopes to take advantage of the parallel performance performance at high voltage and an unprecedented of up to four CPU cores and eight threads. This not only performance gain at low voltage [4] enables highly effi cient small form factor applications, such as extremely compact unmanned aerial vehicles (UAVs), but, due to the high level of integration, also allows Turbo Boost 2.01 consolidating multiple computing systems onto one single platform [5]. This results in reduced hardware costs, as one As for applications that are particularly power-hungry, the multicore system is less expensive than several single core new processors also provide the enhanced Intel® Turbo systems. The decreased system count also results in higher Boost 2.0 technology that has been introduced with the MTBF values of the consolidated installation and helps to 2nd generation Intel® Core™ processors. Turbo Boost mode save valuable space for SWaP optimized high-performance increases the clock speeds of both the processor cores embedded computing applications. However, it’s important and the graphics unit independently. This automatically to be aware that standard boards for the consumer market shifts processor cores and processor graphics resources to are not designed to meet high MTBF requirements. Modules, accelerate performance, tailoring a workload to give users boards and systems that are intended to meet a high MTBF an immediate performance boost for their applications should be selected from embedded computer vendors such whenever needed. Depending on the load, the actual speed as Kontron. And together with its hypervisor implementation can be increased by up to 40%. Because the new turbo requirement, a consolidated heterogeneous system also boost technology can overclock not only single, but also requires software support that ideally derived from a single all cores, both older single-thread applications and modern source in order to accelerate time-to-market and reduce the multi-thread applications benefi t from the computing integration effort for customers. turbo. Furthermore, the Power Manager now has the option of overclocking a core which was switched off for a given time for approximately 10 to 20 seconds immediately after waking up. Right after the core wakes up, the maximum application performance is available to reactivate inactive Copyright: Intel®

Image 3: With Intel’s Turbo Boost 2.0 Technology cores can be run faster than the indicated speeds under certain circumstances. For example, when running a single threaded application, the CPU can boost the speed of a single core for that task. [9]

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processes at high speed as needed. Thus, the thermal budget latest high-end graphics cards but also to connect with 10 is more effi ciently used. Moreover, Intel Turbo Boost 2.01 Gbit/s and 40 Gbit/s Ethernet chips in telecommunications can now also increase processor performance beyond the as well as high-speed solid-state drives of which any specifi ed electrical TDP for a short time, without crossing application can benefi t through faster response times when the thermal limit. For this, Intel utilizes the lag which the accessing the hard drive. Additionally high bandwidth cooling solution needs to heat up to the maximal specifi ed VPX and MicroTCA applications with PCIe based intra case temperature, maximizing the usability of turbo boost. communication via the backplane benefi t from the doubled transfer rates, enabling high bandwidth on the data plane.

Furthermore, the accompanying Intel® 7-Series chipsets Extended AVX and SEE instructions now also directly integrate support for four high-speed USB 3.0 interfaces without the need for additional controller Expanding on the implementation of the double-width chips as it was the case for the 2nd Generation Intel® Advanced Vector Extensions that were introduced with the Core™ processors. This allows for fast fi le transfers and 2nd Generation Intel® Core™ processors, the 3rd Generation device synchronisation and enables the connection of the Intel® Core™ processors bring two new Float16 format most modern peripheral components such as full HD video conversion instructions (VCVTPH2PS and VCVTPS2PH) which cameras or fast external storage media which facilitates, support the conversion between the 16-bit (compressed) for example, to build small machine vision systems with fl oating point memory format and the 32-bit single commercially available standard components. precision formats (either 256-bit AVX or 128-bit SSE), allowing for a higher dynamic range in the same memory Embedded computing vendors will rapidly implement footprint [6]. The new AVX and SSE instruction sets these new features on their latest embedded computing accelerate fl oating-point intensive applications in high- boards and systems. Kontron, for example, offers performance embedded computing as well as the digital appropriate hardware platforms at the board or system processing of images, videos and audio data in industrial level and optionally includes fully tested, application-ready automation, medical and military applications. hypervisor and OS implementations to consolidate hardware requirements from two systems for the embedded real-time High-performance embedded applications also benefi t application and GUI into only one heterogeneous system. from the processor’s support for OpenCL 1.1. OpenCL Providing customers with application-ready, pre-integrated, provides software developers with a uniform programming real-time capable virtualization platforms including environment to write effi cient, portable code for high- operating systems and license management from a single performance computing servers, reducing the development source accelerates the time-to-market and reduces the effort and time-to-market for data-parallel applications on integration task for customers. multi-core architectures. These new features make embedded platforms equipped with the 3rd generation of Intel® Core™ processors an ideal solution for applications in which a huge amount of data has to be processed in a limited Additional power savings thermal envelope. The main application areas to benefi t from innovations, such as AVX and improved graphics In addition to the performance gains the 3rd Generation performance, are situational awareness and applications Intel® Core™ processors also bring a couple of power- such as radar, sonar, image processing, video surveillance saving enhancements. These include support for low-voltage with recognition and computer-aided diagnostics (CAD). DDR3 (DDR3L), options for lower system agent1 operating voltages in ultra-low-power parts, and DDR3 power gating. The latter enables parts of the memory interface to be disabled when in deep C-states. All 3rd generation Intel® Improved interface performance Core™ processors furthermore feature Power Aware Interrupt Routing (PAIR) to improve Intel's core sleeping technology Owing to the support for faster interfaces, further by making the CPU aware of which of its cores are asleep performance improvements have been achieved. The memory and which are awake. It can then send interrupt requests controller now supports 1600 MHz to connect to DDR3-1600 from peripherals or a software application to cores that are memory which meets the high speed system requirements, up and running, rather than waking a core that has been for example, of telecommunication applications. The same powered down to handle the interrupt. is true for the processors 16 PCIe 3.0 lanes. PCIe 3.0 is the next evolution of the general-purpose PCI Express The system agent was introduced with the 2nd Generation I/O standard providing a transfer rate of up to 8GT/s processor and refers to the display output, (GigaTransfers/second). Thus, the interconnect performance memory controller, DMI and PCI Express interfaces of the bandwidth is doubled over PCIe 2.0, while preserving processor. The System Agent operates on a separate voltage compatibility with software and mechanical interfaces. This plane than the rest of the chip. additional bandwidth will not only be gratefully utilized by

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Furthermore, some Ultra-Low Voltage (ULV) and Extreme Enhanced media and graphics Edition (EE) SKUs of the 3rd generation Intel® Core™ processors also ship with a confi gurable TDP. This new Besides these architectural enhancements, the 3rd feature allows the processor to dynamically scale across generation Intel® Core™ processors also deliver a three TDPs: nominal, a lower confi gurable TDP (cTDP down) signifi cantly improved integrated graphics unit. The new and an upper confi gurable TDP (cTDP up). For example, Intel® HD Graphics 4000 delivers up to two times higher the nominal 17W TDP of the Intel® Core™ i7-3517UE 3-D graphics performance compared to the previous- processor is fl anked by a low-power 14W cTDP down state, generation processor [2], bringing richer details at higher and a 25W cTDP up state. This enables mobile application resolutions to graphics intensive embedded applications scenarios, where the same system can run at a much such as digital signage, infotainment, medical imaging or higher frequency when docked (25W) and can behave like video surveillance. And the built-in visual features such as an ultraportable when running on battery (14W). In other the Intel® Quick Sync Video 2.0 and Intel® Clear Video HD scenarios, for instance in mobile applications with changing Technology enable an improved user experience across a environmental conditions, such as military or industrial wide range of intelligent system designs. vehicles, an embedded system will be able to switch up to the higher TDP under optimal cooling conditions and, if Furthermore the Intel® HD Graphics 4000 now provides environmental temperatures are critical, lower the TDP to up to 16 execution units (instead of 6 or 12 with the 2nd keep the system cool. Generation Intel® Core™ processors) with DirectX 11 and OpenGL 3.1 (Shader Model 5) support. They are therefore also suitable for general purpose computations via OpenCL 1.1 and DirectCompute 11.0 which are backed by an increased local shared memory, enabling a more effi cient Higher Performance exchange of data between the execution units.

TDP Up With its support of now three independent displays, the 3rd generation Intel® Core™ processor graphics also enables multi-screen applications without the need for an additional NominalNominal dedicated graphics controller thus saving costs and valuable space for space constraint SFF applications. TDP DownDown Application areas for installations with three independent displays can be found in many different vertical markets Smaller Form Factors such as gaming, kiosk/POS, infotainment and digital signage or patient monitoring to name just a few. One can imagine that an outdoor digital signage system requires a different system design and hardware integration compared Image 4: The confi gurable TDP of the ULV and EE editions of to an aseptic patient monitoring system for deployment in the 3rd generation Intel® Core™ processors allows multiple operating theatres or intensive care. Consequently OEMs in TDP levels within the same part [6]. these different markets are searching for strong hardware

Architecture and 3-D feature comparison of the 3rd and the 2nd generation Intel® Core™ processor graphics.

Features Intel® HD Graphics Intel® HD Graphics 2500/4000 2000/3000

Architecture Unifi ed Shader Architecture Yes Yes Improvements Execution Units (EUs) 6/16 EUs 6/12 EUs Dedicated Math box Yes Yes Media processing Yes Yes Targeted OS Optimizations Windows 7/Windows 8 Windows 7/Vista/XP Independent Displays 3 2 3-D Performance Core Frequency Up to 1350 MHz Up to 1350 MHz DircetX Support DX11 DX10.1 Open GL Support Open GL 3.1 Open GL 3.0 Shader Model Support SM 5.0 SM 4.1 Dynamic Frequency Scaling Yes (mobile and DT) Yes (mobile and DT) Maximum Resolution 2560 x 1600 2560 x 1600 HDMI (V.1.4 with 3-D Support) Yes Yes

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integration partners with vertical market competence. is made available to programmers through the new RDRAND On the other hand they want to implement hardware instruction. The resultant random number generation platforms from the most stable vendors. Thus they often capability is designed to comply with existing industry buy the integration from an independent system integrator, standards in this regard (ANSI X9.82 and NIST SP 800-90) although the system integrator itself bought the board [8]. Some possible usages of the new RDRAND instruction from different embedded hardware vendors. However, OEMs include cryptographic key generation as used in a variety of are now searching for single sources to improve the entire applications including communication, digital signatures, supply chain and to optimize the effi ciency of new hardware secure storage, and so on. integration. The world leading embedded vendor Kontron has chosen to offer these OEMs not only boards and systems These security features are a great enhancement to but also the complete range of hardware integration services hardware platforms and are a must in a world where ever required for all relevant vertical markets. The company more devices are connected. However, application engineers provides its own strong core competence teams for various require even greater support because many new designs vertical markets such as medical or aerospace and defense have a tendency to remain permanently connected and as well as Kontron certifi ed design partners extending the online, and engineers spend increasingly more time on performance for custom design and integration requirements remote / cloud projects. As an example, Kontron is able to to all specifi c competences required. Thus, OEMs will be able provide these applications with wireless connectivity in all to fi nd all required hardware integration services for their fl avors from a single source in order to accelerate time-to- standard or customized hardware platform form a highly market and reduce the integration task for customers: The stable single source. Intel® ™ processor based Kontron M2M Smart Services Developer Kit for example is 802.11a/b/g/n Wireless Local Area Network (WLAN) and 802.15.4 Wireless Personal Area Network (WPAN) capable facilitating the rapid development Secure manageability of wireless connectivity solutions. 3G Wireless Wide Area Network (WWAN) is either pre-installed or easily enabled by With 3rd generation Intel® Core™ processor based designs, dropping in a pre-certifi ed PCI Express 3G/4G module for developers can furthermore enjoy improved security with further broadband connectivity fl exibility. For immediate new features such as Intel® Secure Key, which helps protect application wireless connectivity, the Kontron M2M Smart data and assets more securely through encryption and Intel® Services Developer Kit generates a compelling out-of-box OS Guard, which helps detect and prevent malware. Intel® experience, which can be used in multiple ways to generate, Secure Key consists of a digital random number generator aggregate and transmit machine-to-machine data to the that creates truly random numbers to strengthen encryption cloud. Eval-platform connection to the third generation of algorithms. Intel® OS Guard or SMEP (Supervisor Mode Intel® Core™ processor based platforms is easily achieved Execution Protection) is a new mechanism that provides an by Ethernet protocol based communication which is additional level of system protection by blocking malicious also a feasible method for hypervisor implementations software attacks from user mode code when the system is in heterogeneous multi-core systems. Alternative running in the highest privilege level [7]. This helps defend implementations are offered upon request. against privilege escalation attacks where a hacker tries to remotely take over another person's system.

Intel® Secure Key and Intel® OS Guard join existing The new benchmark comes in platform security features such as Intel® Identity Protection different fl avours Technology (Intel® IPT) and Intel® Anti-Theft technology (Intel® AT) to help make these platforms some of the most secure in the industry. When paired with the Intel® Series Owing to its highly attractive feature set, the 3rd 7 Chipset, new designs with Intel® IPT can make a portion generation Intel® Core™ processors are the ideal candidates of the screen unreadable to spyware with the “protected to build new sophisticated embedded applications. But transaction display” feature, helping prevent a hacker from at the same time such a leap in innovation puts a lot of obtaining login credentials that could lead to identity pressure to the OEMs to keep pace with the implementation theft [2]. Continued support for Intel® vPro™ and Intel® of this new processor technology. For example, OpenCL AMT 8.0 technology enables secure data exchange among programming is quite new in the embedded segments and increasingly connected devices across various industries and multi-processing and virtualization too needed time before allows for problems to be diagnosed, managed, and repaired they were incorporated into larger series production for remotely, which can make many onsite service visits projects. Everything requires a certain amount of time. unnecessary [5]. And the more complex things get, the more challenging each further innovation becomes in terms of development. The new processor generation furthermore introduces a Every innovation means time has to be invested, learning software visible random number generation mechanism processes carried out and costs have to be considered. supported by a high quality entropy source. This capability These all have to be kept under control or to a minimum

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so that investment costs for new embedded computing Flex-ATX and Mini-ITX embedded platforms are kept as low as possible while keeping them motherboards competitive. To ensure that customers can keep up pace with new innovations as simply, quickly and as cost- effi ciently as possible, embedded hardware manufacturers like Kontron work with a dual strategy: fi rstly, in regards to standardization and, secondly, by offering value-added services for implementing new processor technology. The aim being to ensure that customers have little to no worries about implementing the latest processors.

Kontron has fulfi lled the fi rst part of this strategy by Kontron KTQ77/Flex implementing the new processor generation on a broad array of suitable standard form factors with even more boards and systems to follow soon:

COM Express® basic Computer-on-Modules Kontron KTQM77/mITX

Built on the 3rd generation Intel® Core™ processors, the Kontron Flex-ATX and Mini-ITX embedded motherboards KTQ77/Flex and KTQM77/mITX are Kontron’s highest performing ATX-compliant embedded designs with up to 40% increased performance per watt. With their extensive range of interfaces combined with the latest serial I/O performance including PCIe 3.0 and, USB 3.0, the Kontron Kontron COMe-biP# embedded motherboards simplify the design-in process because they include all required standard interfaces for a broad range of computing-intensive and graphics-intensive applications, such as image processing in industrial automation, medical and military applications as well as digital signage, infotainment and gaming applications. Even multi-screen applications with simultaneous presentation on three independent displays are enabled with Kontron’s latest embedded motherboards, without additional components. Based on the 3rd generation Intel® Core™ processors, the new Kontron COM Express® basic Computer-on-Modules COMe-biP# are now the most powerful COM Express® modules available. Without exceeding the thermal boundaries of AdvancedMC™ comparable forerunners, they offer an unprecedented level of graphics and processing performance, the support of three independent displays, USB 3.0 and fast PCI-Express Gen 3.0. This makes the new Computer-on-Module an ideal fi t for feature-rich, graphics-oriented applications such as digital signage servers running several displays, gaming systems and high-performance medical appliances. Design engineers of high-end embedded computer systems who Kontron AM4022 have to effi ciently balance out performance, watts and costs, benefi t from Kontron’s highly scalable range of 3rd generation modules which is available in COM Express® pin- out type 6 as well as pin-out type 2. Equipped with the quad-core 3rd generation Intel® Core™ i7-3612UE processor and Intel® Hyper-Threading technology, the new Kontron AM4022 can produce an amazing amount of computing power, with up to 4 x 2.1 GHz of quad-core performance to run parallel, multi-

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threaded applications on MicroTCA™ and AdvancedTCA® 3U VPX CPU boards integrated platforms. The Kontron AdvancedMC™ processor module AM4022 incorporates the high-performance Intel® Core™ i7 processor with an integrated memory controller for up to 8 GB of soldered DDR3-1600 ECC memory, PCI Express Gen3 I/O and Intel® HD 4000 graphics. Using the Kontron AM4022, customers can take advantage of the reduced component count and streamlined data paths between the CPU, PCH and peripherals in a powerful, space-saving and cost-effective design. Thus, Kontron’s latest AMC is ideal for Kontron VX3044 MicroTCA™ platforms in telecommunications applications such as IPTV, media servers and media gateways, conference systems, and TETRA switches, as well as applications in medical, automation and security. The new Kontron VX3042 and VX3044 are 3U VPX SBCs with native support for 10 Gigabit Ethernet and PCI Express 3.0. Based on the Intel® Core™ i7-3517UE dual-core processor, the Kontron VX3042 with a confi gurable TDP and a XMC slot, represents the most versatile solution ideal for console and 3U and 6U CompactPCI® blades rugged servers. Top of the scale, the Kontron VX3044 with the quad-core Intel® Core™ i7-3612QE processor is tailored for high performance embedded computing applications. This broad offering enables OEMs to pinpoint the ideal performance level right off the shelf and thus minimize design efforts and total cost of ownership for military, aerospace and transportation systems. With the new Kontron VX3042 and VX3044 system developers can develop extremely compact and light applications with high parallel computing power, such as video and image processing, radar, sonar or signal processing in software-defi ned wireless equipment. The new VPX boards support established APIs such as OpenCL as well as VXFabric, which simplifi es and Kontron CP6004-SA Kontron CP3003 speeds up application development.

Custom designs and application- Based on the dual-core and quad-core 3rd generation Intel® ready platforms Core™ processor technology and designed to bring leading- edge performance, low power consumption and low heat dissipation to a broad range of applications, the Kontron As a second part of Kontron’s strategy to reduce design CompactPCI® processor boards CP3003 (3U) and CP6004- efforts Kontron offers extensive custom design services and SA (6U) ideally fi t the demands of, military, aerospace, migration support that includes validation and verifi cation. transportation, medical, communications and industrial The demand for such services is high: In a recent survey of systems. For maximum application fl exibility the Kontron communications engineers, VDC Research determined, that CompactPCI® processor boards come with an extensive particularly hardware integration (48%), custom design and range of interfaces with SATA 6Gb/s and USB3.0 support, manufacturing (45%) and technical support (37%) are the three independent graphics outputs as well as up to 5x most requested services that application developers would Gigabit Ethernet interfaces connected via PCI Express to like to see fulfi lled by external service providers. Thus, meet the high performance requirements of communications customization of all sorts is of particular importance, both applications. Kontron’s latest CompactCPI® processor boards in regards of hardware and of software. This is because furthermore support up to 16 GB of fast DDR3-1600 memory hardware integration is often also a matter of software. with ECC protection. Take for example the integration of peripheral components. The optimal all-round carefree package therefore is a mix of standards, that reduce costs and a customization service, that takes into account both hardware and software issues adequately.

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Also the importance of synchronized development of the References right hardware, including system integration, is growing and the integration speed can be pushed so far that customers can even introduce their systems parallel to [1] Multiple Gate Field-Effect Transistors for Future the launch of the processors. As, however, OEM customers' CMOS Technologies application development can often not keep up with this http://www.tr.ietejournals.org/article.asp?issn=0256- speed, complementary software services are a further lever 4602;year=2010;volume=27;issue=6;spage=446;epage=454;a which can be used to help application developers upgrade ulast=Subramanian or migrate to new platforms. This sometimes even entails, for example, standard tasks such as the design of a web- [2] 3rd Generation Intel® Core™ Processors Bring based GUI so that alongside the hardware-related software Exciting New Experiences and Fun to the PC development even actual software services can be carried http://newsroom.intel.com/community/intel_newsroom/ out, letting developers fully concentrate on their core blog/2012/04/23/3rd-generation-intel-core-processors- competence. bring-exciting-new-experiences-and-fun-to-the-pc?cid=rss- 258152-c1-274615 One main pre-requisites which Kontron had to put into place is the formation of a powerful software team, that [3] The Intel® Revolutionary 22nm Transistor Technology can deal with the software aspects of the corresponding Backgrounder implementations– parallel to the development of the http://www.intel.com/content/www/us/en/silicon- different hardware platforms and systems. Software teams innovations/standards-revolutionary-22nm-transistor- working together in a global software design center are technology-backgrounder.html a great advantage so that re-usability can really be put to practice, which in the end leads to more development [4] The Intel® Revolutionary 22 nm Transistor effi ciency. The more the software can be re-used, the faster Technology and more cost-effi cient customer-specifi c implementation http://download.intel.com/newsroom/kits/22nm/pdfs/ solutions can be provided. 22nm-Details_Presentation.pdf

If a hardware offering is connected with such a broad [5] The Next Generation of Intelligent Innovations service portfolio, customers receive a truly application-ready https://www-ssl.intel.com/content/www/us/en/processors/ platform – regardless of whether it is a standard, a semi- core/intelligent-systems-core-processors.html custom or full custom module, motherboard, IPC or system design from a hardware point of view. Application-ready [6] Technology Insight: Intel® Next Generation platforms include all the required hardware components Microarchitecture Codename Ivy Bridge along with the hardware-optimized software implementation http://www.intel.com/idf/library/pdf/sf_2011/SF11_ for the respective target application and are ready for use SPCS005_101F.pdf with the customer’s application software. Upon request, they can be certifi ed for the intended target market. So [7] Intel® 64 and IA-32 Architectures Developer's OEMs only have to integrate the application-ready platform Manual: Vol. 3A into their application. That shortens time-to-market, lowers http://www.intel.com/Assets/PDF/manual/253668.pdf the total cost of ownership and is the foundation for high quality. [8] Mobile 3rd Generation Intel® Core™ Processor Family Datasheet – Volume 1 of 2 If one adds the aspects of supply chain and project http://www.intel.com/content/dam/www/public/us/en/ managements and the Extended Lifecycle Management, documents/datasheets/3rd-gen-core-family-mobile-vol-1- customers can get a real full service package which allows datasheet.pdf them to completely concentrate on their application development. Partnership in developing is a major issue [9] Image source: which accelerates development synchronization and can http://getsmart.intel.com/uk/technology/single-view/ gain customers an increasing competitive advantage, as article/turbo-boost-even-more-effective-with-version-20/ not only in the high-end area but also in the SFF segment, time-to-market is one of the most important variables in achieving signifi cant market shares.

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About Kontron

Kontron is a global leader in embedded computing technology. With more than 40% of its employees in Research and Development, Kontron creates many of the standards that drive the world’s embedded computing platforms. Kontron’s product longevity, local engineering and support, and value-added services, helps create a sustainable and viable embedded solution for OEMs and system integrators. Kontron works closely with its customers on their embedded application-ready platforms and custom solutions, enabling them to focus on their core competencies. The result is an accelerated time-to-market, reduced total-cost-of-ownership and an improved overall application with leading-edge, highly-reliable embedded technology.

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