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Introduction to

Junwei Su Mechanical Engineering University of Massachusetts Lowell [email protected] Outline

• Introduction • • SfSoft Lihithograp hy • Nanoimprint (NIL) • NIL System Overview • Conclusion Nanolithography

Nanolithography is the branch of concerned with the stdtudy and applica tion of ffbiabrica ting nanometer‐scale structures, meaning patterns with at least one lateral dimension between the size of an individual atom and approximately 100 nm. Introduction

• Why we need micro/nano pattern? MEMS (Micro electronic mechanical system)

A MEMS device optical switch ratcheted microgear [Sandia National Laboratories] (Sandia) (Sandia) Top‐down Versus Bottom‐up Top Down Process Bottom Up Process

Start with bulk Start with bulk wafer Apply layer of Alteeaeaor area of w aeafer where structure is to be created by adding or seed Expose wafer with crystals or other UV through techniques. mask and etch Grow or assemble wafer the structure on the area determined by Etched wafer with the seed crystals or desired pattern polymer. (self assembly)

Similar results can be obtained through bottom-up and top-down processes Photolithography https://www.youtube.com/watch?v=1bxf9QRVesQ

EUV lithography

• Extreme lithography (also known as EUV or EUVL) is a next‐ generation lithography using an EUV , currently expected to be 13.5 nm. Photolithography Limits

• It requir es eepesxpensive instr um en ts adand facilit ies with high capital investment • Pattern resolution is limited by optical • The methods is not suitable for patterning all types of , and only photosensitive resist materials can be directly patterned. • The technique requires harsh processing conditions. (Lim ite d applica tion for sensitive materials such as biological samples with living cell)

• Introduction

George Whitesides DttDepartment of Chem is try and Chem ica l Bio logy, Harvard University • PDMS Soft Lithography

There are 3 basic steps in Soft Lithography: • Step # 1: –Master fabrication (usually Si wafer with SU‐8 pattern) & silanize • Step # 2: – Create PDMS micromold from the master • Step # 3: use the PDMS micromold in a number of ways … –Microfluidic Device Fabrication – (μCP) – Microtransfer Molding (μTM) – Micromolding in Capillaries (MIMIC) – Replica Molding ()(REM) –Sub‐micron Soft Lithography –Etc.

Soft Lithography Soft Lithography Application (Superhdhydrop hbhobic Surf)face) Soft Lithography Application (Superhdhydrop hbhobic Surf)face) Soft Lithography Application (Carbon based MEMS‐Bio Sensor)

Bare Micro Carbon Pillars Pt NPs decorated Micro Carbon Pillars Soft Lithography Application (b(Carbon bbdased MEMS‐Bio Sensor) (NIL) • Introduction

Steph en Y. Chou the head of the NanoStructure Laboratory Princeton University

• Hard mold (“mask”) with surface relief pattern used to emboss resist • Heat and pressure are typically used during imprinting • The mold is removed after imprint • Resist residldual layer (dry ) etchdhed to leave bhbehin d fllfully patterned resist

S. Chou et al., “Nanoimprint Lithography,” J. Vac. Sci. Technol. B, 14 (6), 1996 Nanoimprint Lithography (NIL) NIL category

Thermal Imprint Thermal + UV Imprint UV Imprint UV Imprint

(PMMA) (SU‐8) (PU) (()PU)

Resist Polymer Available in Umass Lowell

• PMMA: Tg=100C, Low etch selectivity over SiO2 • SU‐8 • PU (Polyurethane) How Much Initial Material (Resist) is Needed?

Flow in a channel

d

p l Molding pressure for filling a channels

Resist Issues

• Proper glass transitional temperature • Minimal shrinkage • Mechilhanical strength • Mold fill • Viscosity If glass transitional temperature is too low, what will happen? Issues with Imprinting Micro & Nano Features Issues with Imprinting Micro & Nano Features

NIL System Overview

NIL System Overview Nanonex 2600 Nanonex 2600 software Nanonex 2600

Conclusion There are major differences between soft‐litho & nanoimprint‐litho & photolithography: ¾ Soft template vs. hard template ¾ The resist used ¾ Resolution and application

Umass Lowell offer: ¾Soft‐litho ¾Photolithography ¾Nanoimprint‐litho: Thermal & UV