A Review of Current Methods in Microfluidic Device Fabrication And
Total Page:16
File Type:pdf, Size:1020Kb
Load more
Recommended publications
-
MEMS Technology for Physiologically Integrated Devices
A BioMEMS Review: MEMS Technology for Physiologically Integrated Devices AMY C. RICHARDS GRAYSON, REBECCA S. SHAWGO, AUDREY M. JOHNSON, NOLAN T. FLYNN, YAWEN LI, MICHAEL J. CIMA, AND ROBERT LANGER Invited Paper MEMS devices are manufactured using similar microfabrica- I. INTRODUCTION tion techniques as those used to create integrated circuits. They often, however, have moving components that allow physical Microelectromechanical systems (MEMS) devices are or analytical functions to be performed by the device. Although manufactured using similar microfabrication techniques as MEMS can be aseptically fabricated and hermetically sealed, those used to create integrated circuits. They often have biocompatibility of the component materials is a key issue for moving components that allow a physical or analytical MEMS used in vivo. Interest in MEMS for biological applications function to be performed by the device in addition to (BioMEMS) is growing rapidly, with opportunities in areas such as biosensors, pacemakers, immunoisolation capsules, and drug their electrical functions. Microfabrication of silicon-based delivery. The key to many of these applications lies in the lever- structures is usually achieved by repeating sequences of aging of features unique to MEMS (for example, analyte sensitivity, photolithography, etching, and deposition steps in order to electrical responsiveness, temporal control, and feature sizes produce the desired configuration of features, such as traces similar to cells and organelles) for maximum impact. In this paper, (thin metal wires), vias (interlayer connections), reservoirs, we focus on how the biological integration of MEMS and other valves, or membranes, in a layer-by-layer fashion. The implantable devices can be improved through the application of microfabrication technology and concepts. -
Design of a Microelectronic Manufacturing Laboratory
2006-1635: DESIGN OF A MICROELECTRONIC MANUFACTURING LABORATORY Stilson Applin, Montana State University Todd Kaiser, Montana State University Page 11.407.1 Page © American Society for Engineering Education, 2006 Design of a Microelectronic Manufacturing Laboratory Abstract The design of an undergraduate microelectronic manufacturing laboratory for teaching will be described in the following paper. This laboratory emphasizes learning the processes of semiconductor manufacturing and clean room protocol. The laboratory is housed in a 500 square foot, class 10,000 facility. In the laboratory the students, with a junior standing and a science based background, will use a pre-made six mask set to create P and N type transistors as well as inverters and diodes. The students will be conducting oxidization, RCA clean, photolithography, etching, diffusion, metallization and other processes. A brief description of these processes and the methods used to teach them will also be described. In addition to these processes students will also learn about clean room protocol, chemical safety, and testing devices. All of these skills will be marketable to future employers and graduate schools. These same skills and processes will be covered in a seminar course for educators, with the main purpose of inspiring the high school teachers to teach about semiconductor manufacturing. The cost effective design is what makes the laboratory unique. The expenditure control is important due to the size of the Electrical Engineering department. The department has only 250 undergraduates and 40 graduate students, thus internal funding is difficult to obtain. A user fee paid by the students will cover the funding. This fee will be small and manageable for any college student. -
Nanoimprint Lithography: Methods and Material Requirements**
REVIEW DOI: 10.1002/adma.200600882 Nanoimprint Lithography: Methods and Material Requirements** By L. Jay Guo* Nanoimprint lithography (NIL) is a nonconventional lithographic technique for high-throughput patterning of polymer nanostructures at great precision and at low costs. Unlike traditional lithographic ap- proaches, which achieve pattern definition through the use of photons or electrons to modify the chemical and physical properties of the resist, NIL relies on direct mechanical deformation of the resist material and can therefore achieve resolutions beyond the limitations set by light diffraction or beam scattering that are encountered in conventional techniques. This Review covers the basic principles of nanoimprinting, with an emphasis on the requirements on materi- als for the imprinting mold, surface properties, and resist materials for successful and reliable nanostructure replication. 1. Introduction proaches towards nanostructure fabrication have been exploited in the past 15 years, without resorting to expensive The ability to fabricate structures from the micro- to the tools such as those used in deep-UV projection lithography nanoscale with high precision in a wide variety of materials is and electron-beam lithography. These techniques include [1] of crucial importance to the advancement of micro- and nano- microcontact printing (or soft lithography), nanoimprint [2] technology and the nanosciences. The semiconductor industry lithography (NIL), scanning-probe-based techniques (e.g., [3] has been pushing high-precision nanoscale lithography to atomic force microscope lithography), and dip-pen lithogra- [4] manufacture ever-smaller transistors and higher-density inte- phy. A good overview of several of these techniques was [5] grated circuits (ICs). Critical issues, such as resolution, relia- presented in a recent paper. -
Advanced Solar Technology Sample
ADVANCED SOLAR TECHNOLOGY SAMPLE TECHNOLOGY ACQUISITION REPORT CONTENTS Technology 1: Microsystems Enabled Photovoltaics (MEPV) - Photovoltaic solar concentrator ............... 4 Technology 2: Method and apparatus for integrating an infrared (ir) photovoltaic cell on a thin film photovoltaic cell ............................................................................................................................................ 7 Technology 3: Photovoltaic cells with quantum dots with built-in-charge and methods of making same 10 Technology 4: Super-transparent electodes for photovoltaic applications ................................................. 13 Technology 5: Optical concentrator and associated photovoltaic devices ................................................. 15 Technology 6: Hybrid photovoltaic devices and applications thereof ........................................................ 18 Technology 7: Methods of manufacturing photovoltaic electrodes ............................................................ 20 Technology 8: Thin film photovoltaic cell structure, nanoantenna, and method for manufacturing ......... 23 Technology 9: Apparatuses, systems and methods for cleaning photovoltaic devices .............................. 26 Technology 10: Photovoltaic structures having a light scattering Interface layer and methods of making the same ....................................................................................................................................................... 28 Technology 11: Rapid thermal -
Electron Beam Lithography for Nanofabrication
Departament de Física, Facultat de Ciències Universitat Autònoma de Barcelona January 2008 ElectronElectron beambeam lithographylithography forfor NanofabricationNanofabrication PhD Thesis by Gemma Rius Suñé Directed by Francesc Pérez-Murano and Joan Bausells Institut de Microelectrònica de Barcelona -------------------------------------------- The cover image corresponds to a PMMA residual found after the stripping of the resist layer. Even though it seems a new planet, it is 1µm in diameter. -------------------------------------------- This memory reflects part of the work performed at the Nanofabrication Laboratory of the IMB–CNM during the past 5 years, based on Electron Beam Lithography (EBL). Nanofabrication is a very active area of research, as can be noticed from the number of publications that appear continuously and from the number of running R&D projects. Most of the work is realized in the framework of three European research projects. Novopoly project deals with the development of new polymer materials for applications in micro and nano systems. The development of a new EBL resist is framed in this project. Within NaPa, Emerging Nanopatterning methods, the development of NEMS fabrication with EBL is used to realise discrete nanomechanical devices. They are used to characterize the performance of resonating nanostructures and signal enhancement is achieved by their integration in CMOS circuits. The aim of Charpan is the development of a new patterning tool based on several charged particle species. The incidence of charged particle beams on devices is studied to evaluate potential effects induced during fabrication. Carbon nanotube (CNT) based devices contribute to some tasks of national projects Crenatun and Sensonat. In particular, the technology for fabrication of high performance CNT field-effect transistors and their preparation for sensing applications is established. -
High-Throughput Plasmonic Nanolithography
UC Berkeley UC Berkeley Electronic Theses and Dissertations Title High-Throughput Plasmonic Nanolithography Permalink https://escholarship.org/uc/item/93c7w34j Author Pan, Liang Publication Date 2010 Peer reviewed|Thesis/dissertation eScholarship.org Powered by the California Digital Library University of California High-Throughput Plasmonic Nanolithography by Liang Pan A dissertation submitted in partial satisfaction of the requirements for the degree of Doctor of Philosophy in Engineering-Mechanical Engineering in the Graduate Division of the University of California, Berkeley Committee in charge: Professor David B. Bogy, Co-Chair Professor Xiang Zhang, Co-Chair Professor Roberto Horowitz Professor Ming Wu Fall 2010 High-Throughput Plasmonic Nanolithography ©2010 by Liang Pan Abstract High-Throughput Plasmonic Nanolithography by Liang Pan Doctor of Philosophy in Engineering-Mechanical Engineering University of California, Berkeley Professor David B. Bogy, Co-Chair Professor Xiang Zhang, Co-Chair The conventional projection-type photolithography approach to nanoscale manufacturing is facing possibly insurmountable challenges, especially to invent novel technical solutions that remain economical for the next generation of semi-conductor integrated circuits. Although extreme ultra violet (EUV) lithography with the next generation photo-masks and 193-nm immersion lithography with double patterning are expected to deliver 22 nm and smaller nodes, it still cannot effectively address the reliability and cost issues required for mass production. Maskless nanolithography is a potentially agile and cost effective approach, but most of the current solutions have throughputs that are too low for manufacturing purposes. This dissertation reports a new low-cost high-throughput approach to maskless nanolithography that uses an array of plasmonic lenses (PL) that "fly" above the rotating surface to be patterned, concentrating short wavelength surface plasmons into sub-100 nm spots. -
Microfabrication and Microfluidics for 3D Brain-On-Chip
Microfabrication and microfluidics for 3D brain-on-chip Bart Schurink Microfabrication and microfluidics for 3D brain-on-chip Bart Schurink i Members of the committee: Chairman Prof. dr. ir. J.M.W. Hilgenkamp (voorzitter) Universiteit Twente Promotor Prof. dr. J.G.E. Gardeniers Universiteit Twente Co-promotor/supervisor Dr. R. Luttge Universiteit Eindhoven Members Prof. dr. J.C.T. Eijkel University of Twente Prof. dr. H.B.J. Karperien University of Twente Prof. dr. A.S. Holmes Imperial College London Prof. dr. ir. J.M.J. den Toonder Technical University of Eindhoven Prof. dr. ir. R. Dekker Delft University of Technology The work in this thesis was carried out in the Mesoscale Chemical Systems group and MESA+ Institute for Nanotechnology, University of Twente. It is part of the MESOTAS project financially supported by ERC, Starting Grant no. 280281 Title: Microfabrication and microfluidics for 3D brain-on-chip Author: Bart Schurink ISBN: 978-90-365-4142-8 DOI: 10.3990/1.9789036541428 Publisher: Gildeprint, Enschede, The Netherlands Copyright © 2016 by Bart Schurink, Enschede, The Netherlands. No part of the this book may be copied, photocopied, reproduced, translated or reduced to any electronic medium or machine-readable form, in whole or in part, without specific permission of the author. ii Microfabrication and microfluidics for 3D brain-on-chip PROEFSCHRIFT ter verkrijging van de graad van doctor aan de Universiteit Twente, op gezag van de rector magnificus, Prof. dr. H. Brinksma, volgens besluit van het College voor Promoties in het openbaar te verdedigen op donderdag 23 juni 2016 door Bart Schurink Geboren op 6 november 1982 te Oldenzaal, Nederland iii Dit proefschrift is goedgekeurd door de promotor: Prof. -
A Technology Overview and Applications of Bio-MEMS
INSTITUTE OF SMART STRUCTURES AND SYSTEMS (ISSS) JOURNAL OF ISSS J. ISSS Vol. 3 No. 2, pp. 39-59, Sept. 2014. REVIEW ARTICLE A Technology Overview and Applications of Bio-MEMS Nidhi Maheshwari+, Gaurav Chatterjee+, V. Ramgopal Rao. Department of Electrical Engineering, Indian Institute of Technology Bombay, Mumbai, India-400076. Corresponding Author: [email protected] + Both the authors have contributed equally. Keywords: Abstract Bio-MEMS, immobilization, Miniaturization of conventional technologies has long cantilever, micro-fabrication, been understood to have many benefits, like: lower cost of biosensor. production, lower form factor leading to portable applications, and lower power consumption. Micro/Nano fabrication has seen tremendous research and commercial activity in the past few decades buoyed by the silicon revolution. As an offset of the same fabrication platform, the Micro-electro-mechanical- systems (MEMS) technology was conceived to fabricate complex mechanical structures on a micro level. MEMS technology has generated considerable research interest recently, and has even led to some commercially successful applications. Almost every smart phone is now equipped with a MEMS accelerometer-gyroscope system. MEMS technology is now being used for realizing devices having biomedical applications. Such devices can be placed under a subset of MEMS called the Bio-MEMS (Biological MEMS). In this paper, a brief introduction to the Bio-MEMS technology and the current state of art applications is discussed. 1. Introduction Generally, the Bio-MEMS can be defined as any The interdisciplinary nature of the Bio-MEMS research is system or device, which is fabricated using the highlighted in Figure 2. This highlights the overlapping of micro-nano fabrication technology, and used many different scientific disciplines, and the need for a healthy for biomedical applications such as diagnostics, collaborative effort. -
Design and Simulation of an RF-MEMS Switch and Analysis of Its
Advances in Science, Technology and Engineering Systems Journal Vol. 3, No. 1, 76-81 (2018) ASTESJ www.astesj.com ISSN: 2415-6698 Special issue on Advancement in Engineering Technology Design and Simulation of an RF-MEMS Switch and analysis of its Electromagnetic aspect in realtion to stress Amna Riaz*,1, Muhammad Umair Javed Ilam Sindhu2, Tahir Zaidi3 1University of Azad Jammu and Kashmir, Department of Electrical Engineering, Muzaffarabad, 13100, Pakistan 2Memorial University of Newfoundland, Department of Electrical and Computer Engineering, A1B 3X5, Canada 3National University of Science and Technology, Department of Electrical Engineering Department, EME College, 13100, Pakistan A R T I C L E I N F O A B S T R A C T Article history: Microelectromechanical Systems (MEMS) are devices made up of several electrical and Received: 31 May, 2017 mechanical components. They consist of mechanical functions (sensing, thermal, inertial) Accepted: 05 September, 2017 and electrical functions (switching, decision making) on a single chip made by Online: 30 January, 2018 microfabrication methods. These chips exhibit combined properties of the two functions. The size of system has characteristic dimensions less than 1mm but more than 1μm. The Keywords : configuration of these components determine the final deliverables of the switch. MEMS RF-MEMS can be designed to meet user requirements on any level from microbiological application Residual Stresses such as biomedical transducers or tissue engineering, to mechanical systems such as Coplanar waveguide microfluidic diagnoses or chemical fuel cells. The low cost, small mass and minimal power Skin depth consumption of the MEMS makes it possible to readily integrate to any kind of system in Return loss any environment. -
Microfabrication of Plastic-PDMS Microfluidic Devices Using Polyimide Release Layer and Selective Adhesive Bonding
BNL-114324-2017-JA Microfabrication of Plastic-PDMS Microfluidic Devices Using Polyimide Release Layer and Selective Adhesive Bonding S. Wang, M. Lu Submitted to the Journal of Micromechanics and Microengineering March 2017 Center for Functional Nanomaterials Brookhaven National Laboratory U.S. Department of Energy USDOE Office of Science (SC), Basic Energy Sciences (SC-22) Notice: This manuscript has been authored by employees of Brookhaven Science Associates, LLC under Contract No. DE- SC0012704 with the U.S. Department of Energy. The publisher by accepting the manuscript for publication acknowledges that the United States Government retains a non-exclusive, paid-up, irrevocable, world-wide license to publish or reproduce the published form of this manuscript, or allow others to do so, for United States Government purposes. DISCLAIMER This report was prepared as an account of work sponsored by an agency of the United States Government. Neither the United States Government nor any agency thereof, nor any of their employees, nor any of their contractors, subcontractors, or their employees, makes any warranty, express or implied, or assumes any legal liability or responsibility for the accuracy, completeness, or any third party’s use or the results of such use of any information, apparatus, product, or process disclosed, or represents that its use would not infringe privately owned rights. Reference herein to any specific commercial product, process, or service by trade name, trademark, manufacturer, or otherwise, does not necessarily constitute or imply its endorsement, recommendation, or favoring by the United States Government or any agency thereof or its contractors or subcontractors. The views and opinions of authors expressed herein do not necessarily state or reflect those of the United States Government or any agency thereof. -
And Nanolithography Techniques and Their Applications
Review on Micro- and Nanolithography Techniques and their Applications Alongkorn Pimpin* and Werayut Srituravanich** Department of Mechanical Engineering, Faculty of Engineering, Chulalongkorn University, Pathumwan, Bangkok 10330, Thailand E-mail: [email protected]*, [email protected]** Abstract. This article reviews major micro- and nanolithography techniques and their applications from commercial micro devices to emerging applications in nanoscale science and engineering. Micro- and nanolithography has been the key technology in manufacturing of integrated circuits and microchips in the semiconductor industry. Such a technology is also sparking revolutionizing advancements in nanotechnology. The lithography techniques including photolithography, electron beam lithography, focused ion beam lithography, soft lithography, nanoimprint lithography and scanning probe lithography are discussed. Furthermore, their applications are summarized into four major areas: electronics and microsystems, medical and biotech, optics and photonics, and environment and energy harvesting. Keywords: Nanolithography, photolithography, electron beam lithography, focused ion beam lithography, soft lithography, nanoimprint lithography, scanning probe lithography, dip-pen lithography, microsystems, MEMS, nanoscience, nanotechnology, nano-engineering. ENGINEERING JOURNAL Volume 16 Issue 1 Received 18 August 2011 Accepted 8 November Published 1 January 2012 Online at http://www.engj.org DOI:10.4186/ej.2012.16.1.37 DOI:10.4186/ej.2012.16.1.37 1. Introduction For decades, micro- and nanolithography technology has been contributed to the manufacturing of integrated circuits (ICs) and microchips. This advance in the semiconductor and IC industry has led to a new paradigm of the information revolution via computers and the internet. Micro- and nanolithography is the technology that is used to create patterns with a feature size ranging from a few nanometers up to tens of millimeters. -
Nano-Lithography
15-398 Introduction to Nanotechnology Pushing The Limits of Photolithography • Reduce wavelength (λ) Nanoscale Lithography • Use Reducing Lens • Increase Numerical Aperture (NA) of Lens Seth Copen Goldstein – E.g., Immersion optics [email protected] •Hacks (k1) CMU – PSM, OPC, RET, off-axis illumination • Rayleigh eqn: min-feature-size=k1λ/NA lecture 4 © 2004-5 Seth Copen Goldstein 1 lecture 4 © 2004-5 Seth Copen Goldstein 2 Trends in λ, NA, k1 NA & Immersion ICKnowledge.com • NA = n sinα = d/(2f) – N is index of refraction of medium – α is angle of acceptance •Air, n=1 • Water, n≅1.47 • Result -> improve min linewidth 30%! CUHG, Chap 5. lecture 4 © 2004-5 Seth Copen Goldstein 3 lecture 4 © 2004-5 Seth Copen Goldstein 4 E-Beam? FIB? Example of E-beam patterning • Use high-energy electrons to alter/ablate a resist P = 40 nm P = 45 nm • Issues: – Secondary electrons – Scattering in resist (or off substrate) – Serial process P = 50 nm P = 60 nm – alignment Handbook of Microlithography, Micromachining and lecture 4 © 2004-5 Seth Copen Goldstein Microfabrication, SPIE (1997)5 lectureUofA, 4 Nanolithography © 2004-5 Seth Copen Goldstein 6 Microelectronics isn’t everything Today • Reactive organics • Soft Lithography/Nanoimprint • 3-D structures • Scanning Probe Lithography • Edge Lithography • Top-down fabrication to create nanoscale features using a physical mold or tip for patterning. lecture 4 © 2004-5 Seth Copen Goldstein 7 lecture 4 © 2004-5 Seth Copen Goldstein 8 Soft Litho Basic Example • Replica Molding transfer features from master to