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Dual 2-Input Positive-NOR Gate, SN74LVC2G02 Datasheet

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Dual 2-Input Positive-NOR Gate, SN74LVC2G02 Datasheet Product Order Technical Tools & Support & Folder Now Documents Software Community SN74LVC2G02 SCES194N –APRIL 1999–REVISED MAY 2019 SN74LVC2G02 Dual 2-Input Positive-NOR Gate 1 Features 3 Description This dual 2-input positive-NOR gate is designed for 1• Available in the Texas Instruments NanoFree™ package 1.65-V to 5.5-V VCC operation. • Supports 5-V VCC operation The SN74LVC2G02 device performs the Boolean • Inputs accept voltages to 5.5 V function Y = A + B or Y = A × B in positive logic. • Max tpd of 4.9 ns at 3.3 V NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die • Low power consumption, 10-μA Max I CC as the package. • ±24-mA Output drive at 3.3 V This device is fully specified for partial-power-down • Typical VOLP (output ground bounce) applications using Ioff. The Ioff circuitry disables the <0.8 V at VCC = 3.3 V, TA = 25°C outputs, preventing damaging current backflow • Typical VOHV (output VOH undershoot) through the device when it is powered down. >2 V at VCC = 3.3 V, TA = 25°C Device Information(1) • Ioff supports partial-power-down mode operation • Latch-up performance exceeds 100 mA er JESD PART NUMBER PACKAGE BODY SIZE (NOM) 78, class II SN74LVC2G02DCT SSOP (8) 2.95 mm × 2.8 mm • ESD protection exceeds JESD 22 SN74LVC2G02DCU VSSOP (8) 2.3 mm × 2.0 mm – 2000-V Human-body model (A114-A) SN74LVC2G02YZP DSBGA (8) 1.91 mm × 0.91 mm – 1000-V Charged-device model (C101) (1) For all available packages, see the orderable addendum at the end of the data sheet. 2 Applications Simplified Schematic • AV receiver 1 1A 7 • Audio dock: portable 2 1Y • Blu-ray player and home theater 1B • Embedded PC 5 2A 3 • MP3 Player/recorder (portable audio) 6 2Y 2B • Personal digital assistant (PDA) • Power: Telecom/server AC/DC supply: single controller: analog and digital • Solid state drive (SSD): client and enterprise • TV: LCD/digital and high-definition (HDTV) • Tablet: enterprise • Video analytics: server • Wireless headset, keyboard, and mouse 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA. SN74LVC2G02 SCES194N –APRIL 1999–REVISED MAY 2019 www.ti.com Table of Contents 1 Features .................................................................. 1 8.1 Overview ................................................................... 9 2 Applications ........................................................... 1 8.2 Functional Block Diagram ......................................... 9 3 Description ............................................................. 1 8.3 Feature Description................................................... 9 4 Revision History..................................................... 2 8.4 Device Functional Modes.......................................... 9 5 Pin Configuration and Functions ......................... 3 9 Application and Implementation ........................ 10 9.1 Application Information............................................ 10 6 Specifications......................................................... 4 9.2 Typical Application ................................................. 10 6.1 Absolute Maximum Ratings ..................................... 4 6.2 ESD Ratings ............................................................ 4 10 Power Supply Recommendations ..................... 11 6.3 Recommended Operating Conditions ...................... 5 11 Layout................................................................... 11 6.4 Thermal Information ................................................. 5 11.1 Layout Guidelines ................................................. 11 6.5 Electrical Characteristics .......................................... 6 11.2 Layout Example .................................................... 11 6.6 Switching Characteristics ......................................... 6 12 Device and Documentation Support ................. 12 6.7 Switching Characteristics ......................................... 6 12.1 Community Resources.......................................... 12 6.8 Operating Characteristics.......................................... 6 12.2 Trademarks ........................................................... 12 6.9 Typical Characteristics.............................................. 7 12.3 Electrostatic Discharge Caution............................ 12 7 Parameter Measurement Information .................. 8 12.4 Glossary ................................................................ 12 8 Detailed Description .............................................. 9 13 Mechanical, Packaging, and Orderable Information ........................................................... 12 4 Revision History NOTE: Page numbers for previous revisions may differ from page numbers in the current version. Changes from Revision M (November 2013) to Revision N Page • Updated document to new TI data sheet format. ................................................................................................................... 1 • Added Device Information table. ........................................................................................................................................... 1 • Added TJ(Max) spec to Abs Max Ratings table...................................................................................................................... 4 • Moved Tstg spec to Abs Max Ratings table. ........................................................................................................................... 4 Changes from Revision L (April 1999) to Revision M Page • Removed Ordering Information table. .................................................................................................................................... 1 • Updated operating temperature range. .................................................................................................................................. 5 2 Submit Documentation Feedback Copyright © 1999–2019, Texas Instruments Incorporated Product Folder Links: SN74LVC2G02 SN74LVC2G02 www.ti.com SCES194N –APRIL 1999–REVISED MAY 2019 5 Pin Configuration and Functions DCT Package 8-Pin SSOP DCU Package Top View 8-Pin VSSOP Top View YZP Package 8-Pin DSBGA Bottom View Pin Functions PIN I/O DESCRIPTION NAME NO. 1A 1 Input Channel 1 input A 1B 2 Input Channel 1 input B 2Y 3 Output Channel 2 output Y 1 1A 7 GND 4 – Ground 2 1Y 1B 2A 5 Input Channel 2 input A 2B 6 Input Channel 2 input B 5 2A 3 1Y 7 Output Channel 1 output Y 6 2Y 2B VCC 8 – Positive supply Logic Diagram (Positive Logic) Copyright © 1999–2019, Texas Instruments Incorporated Submit Documentation Feedback 3 Product Folder Links: SN74LVC2G02 SN74LVC2G02 SCES194N –APRIL 1999–REVISED MAY 2019 www.ti.com 6 Specifications 6.1 Absolute Maximum Ratings(1) over operating free-air temperature range (unless otherwise noted) MIN MAX UNIT VCC Supply voltage range –0.5 6.5 V (2) VI Input voltage range –0.5 6.5 V (2) VO Voltage range applied to any output in the high-impedance or power-off state –0.5 6.5 V (2)(3) VO Voltage range applied to any output in the high or low state –0.5 VCC + 0.5 V IIK Input clamp current VI < 0 –50 mA IOK Output clamp current VO < 0 –50 mA IO Continuous output current ±50 mA Continuous current through VCC or GND ±100 mA TJ Junction temperature 150 °C Tstg Storage temperature –65 150 °C (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) The input negative-voltage and output voltage ratings may be exceeded if the input and output clamp-current ratings are observed. (3) The value of VCC is provided in the Recommended Operating Conditions table. 6.2 ESD Ratings VALUE UNIT Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2500 V(ESD) Electrostatic discharge Charged-device model (CDM), per JEDEC specification JESD22- V ±1500 C101(2) (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 4 Submit Documentation Feedback Copyright © 1999–2019, Texas Instruments Incorporated Product Folder Links: SN74LVC2G02 SN74LVC2G02 www.ti.com SCES194N –APRIL 1999–REVISED MAY 2019 6.3 Recommended Operating Conditions(1) MIN MAX UNIT Operating 1.65 5.5 VCC Supply voltage V Data retention only 1.5 VCC = 1.65 V to 1.95 V 0.65 × VCC VCC = 2.3 V to 2.7 V 1.7 VIH High-level input voltage V VCC = 3 V to 3.6 V 2 VCC = 4.5 V to 5.5 V 0.7 × VCC VCC = 1.65 V to 1.95 V 0.35 × VCC VCC = 2.3 V to 2.7 V 0.7 VIL Low-level input voltage V VCC = 3 V to 3.6 V 0.8 VCC = 4.5 V to 5.5 V 0.3 × VCC VI Input voltage 0 5.5 V VO Output voltage 0 VCC V VCC = 1.65 V –4 VCC = 2.3 V –8 IOH High-level output current –16 mA VCC = 3 V –24 VCC = 4.5 V –32 VCC = 1.65 V 4 VCC = 2.3 V 8 IOL Low-level output current 16 mA VCC = 3 V 24 VCC = 4.5 V 32 VCC = 1.8 V ± 0.15 V, 2.5 V ± 0.2 V 20 Δt/Δv Input transition rise or fall rate VCC = 3.3 V ± 0.3 V 10 ns/V VCC = 5 V ± 0.5 V 5 TA Operating free-air temperature –40 125 °C (1) All unused inputs of the device must be held at VCC or GND to ensure proper device
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