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DCG) Platform Roadmap Data Center Group Marketing (DCGM NDA Data Center Group (DCG) Platform Roadmap Data Center Group Marketing (DCGM) WW32 2010 Intel Confidential—NDA Platform Roadmap 11 Legal Information • All products, computer systems, dates, and figures specified are preliminary based on current expectations, and are subject to change without notice. This document contains information on products in the design phase of development. • Results have been estimated based on internal Intel analysis and are provided for informational purposes only. Any difference in system hardware or software design or configuration may affect actual performance. • Intel processor numbers are not a measure of performance. Processor numbers differentiate features within each processor family, not across different processor families. Click here for details • Hyper-Threading Technology requires a computer system with a processor supporting HT Technology and an HT Technology-enabled chipset, BIOS and operating system. Performance will vary depending on the specific hardware and software you use. For more information including details on which processors support HT Technology, see here • Intel® Turbo Boost Technology requires a PC with a processor with Intel Turbo Boost Technology capability. Intel Turbo Boost Technology performance varies depending on hardware, software and overall system configuration. Check with your PC manufacturer on whether your system delivers Intel Turbo Boost Technology. For more information, see http://www.intel.com/technology/turboboost. • No computer system can provide absolute security under all conditions. Intel® Trusted Execution Technology (Intel® TXT) requires a computer system with Intel® Virtualization Technology, an Intel TXT-enabled processor, chipset, BIOS, Authenticated Code Modules and an Intel TXT-compatible measured launched environment (MLE). The MLE could consist of a virtual machine monitor, an OS or an application. In addition, Intel TXT requires the system to contain a TPM v1.2, as defined by the Trusted Computing Group and specific software for some uses. For more information, see here • The original equipment manufacturer must provide TPM functionality, which requires a TPM-supported BIOS. TPM functionality must be initialized and may not be available in all countries. • Intel, Intel Xeon, Intel Core micro-architecture, and the Intel logo are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the United States and other countries. 2 Intel Confidential—NDA Platform Roadmap, All dates and plans are subject to change without notice. WW32 Changes: Data Center Group (DCG) Mission Critical (MC) • No Changes Expandable (EX) • No Changes Efficient Performance (EP) • No Changes Entry (EN) & Workstation (WS) • Updated Sandy Bridge –Skt H2 detail – Updated WS platform 1S & Sku details – Updated 1S EN platform and SKU details – Updated Low Power & Ultra-Dense Processor SKU Detail – Updated Intel® Xeon® E3-1200 product family Reference Table – Updated Chipset Reference table – SKU waterfall in 1S WS (W3565, W3550 SKUs) General Updates • PDN/EOL/PSN slide –updated • Sales Guidance slides –updated • SSD slides –updated • New Server Numbering System enacted – Reintroduction of decoder slides – product line and numbering – No renumbering of older products – SNB Skt H2 first product with new numbering 3 Intel Confidential—NDA Platform Roadmap, All dates and plans are subject to change without notice. New slide Product Line Descriptions, Today & 2011 Today 2011 Intel® Itanium® processor Intel® Itanium® processor 9000 sequence platforms 9000 sequence platforms Intel® Xeon® processor Intel® Xeon® processor 7000 sequence platforms E7 platforms Intel® Xeon® processor Intel® Xeon® processor 5000 sequence platforms E5 platforms Intel® Xeon® processor Intel® Xeon® processor 3000 sequence platforms E3 platforms 44 Intel Confidential—NDA Platform Roadmap, All dates and plans are subject to change without notice. New slide Introducing New DCG Processor Numbering Brand Prod Line Version (E3, E5, E7) Prod Family (v2, v3, v4, etc) Intel® Xeon® processor E# – # # # # v# Wayness, maximum number of CPUs in a node (1, 2, 4, 8) Socket/segment designation (2, 4, 6, 8) ‘Low Power’ SKUs (after 4 digit numeric set): Designator Actual Socket Alpha Description 8 LS (Westmere EX) Processor SKU Suffix (i.e. 10, 20, 30, etc…) 6 R (Sandy Bridge) L Low Power 4 B2 (Sandy Bridge) 2 H2 (Sandy Bridge) 2011 Example above (socket changes over time, designator does not) 5 Intel Confidential—NDA Platform Roadmap, All dates and plans are subject to change without notice. New slide Introducing New DCG Chipset Numbering Intel® C 6 0 0 Chipset Typical Usages Intentionally differentiated from SKU Collective group reference processor numbering; chipsets used across processor product lines Generation (within segment) • Intel® CXXX series chipset PCH segment Specific SKU • Intel® CXXX chipset Sandy Bridge Ivy Bridge Future Data Center C600 C610 PCH (Patsburg) (Future) Desktop- Derived C200 C210 C220 PCH (Cougar Point) (Panther Point) (Future) Note: Ancillary chipset components (i.e. memory buffer) to be ‘C100’. 6 Intel Confidential—NDA Platform Roadmap, All dates and plans are subject to change without notice. New product Line description Product Line Descriptions Intel® Itanium® processor 9000 series platforms Architected for mission critical UNIX and mainframe-class reliability & scalability. Targeted at large-scale databases, data warehouses, ERP, business intelligence, and data analytics. Delivers uncompromising scalable performance for today ’s most demanding workloads and world-class reliability for uninterrupted real-time business processing and decision support Intel® Xeon® processor 7000 series platforms Scalable (up to 256-way), reliable, powerful 64-bit multi-core servers offering industry-leading performance, expanded memory & I/O capacity, and advanced reliability ideal for the most demanding enterprise and mission critical workloads, large scale virtualization and large-node HPC applications. Intel® Xeon® processor E5 platforms Versatile (up to 2-way) servers that support up to six-core processors for all your infrastructure, high-density , workstation and HPC applications with features that enable optimal performance and power efficiency for the data center. Intel® Xeon® processor 3000 series platforms » Intel® Xeon® processor E3 platforms Economical (1-way) dependable general purpose 64-bit servers well-suited for small businesses and education 7 Intel Confidential—NDA Platform Roadmap, All dates and plans are subject to change without notice. WW32 Workstation (WS) Platform Roadmap New 1S EN Numbering Q3’10 Q4’10 Q1’11 Q2'11 Q3’11 Tylersburg-WS Platform Intel® Xeon® processor 5600 series (Westmere-EP) Intel® Xeon® processor 5500 series (Nehalem-EP) Intel® 5520 chipset (dual configuration) Technologies Workstation Xeon® processor 5500* & 5600 series features plus up to 50% more cores and cache support for low voltage Two Socket DDR3 1333/1066/800 memory, Advanced Encryption Standard new instructions and Intel ® Trusted Execution Technology Tylersburg-WS Platform Intel® Xeon® processor 3600 series (Westmere-EP) Intel® Xeon® processor 3500 series (Nehalem-EP) Intel® X58 chipset Technologies 32nm Process Technology, Up to 6-Cores / 12 Threads Foxhollow -WS Platform Bromolow Platform Intel® Xeon® processor 3400 series Intel® Xeon® processor E3-1200 product family (Lynnfield) (Sandy Bridge) 32nm Clarkdale processors Intel® C206 Chipset Technologies: Quad-Core / Dual Core, DDR3 3 ® Technologies 1333/1066/800 memory, Intel Turbo Boost Quad-Core / Dual Core, DDR3 1333/1066 memory, Intel® AMT, Intel® ® Technology, Intel® VT, Intel Hyper-Threading Turbo Boost Technology, Intel® VT, Intel® Hyper-Threading Technology, Workstation Technology, ECC Memory Support, Lead and ECC Memory Support, Lead and halogen free platform kit 2 One Socket halogen free platform kit2, Intel ® AMT6.0 *note: 1.35V DIMM, Intel ® TXT and AES-NI only supported on Intel® Xeon® processor 5600 series 1. Lead Free/Halogen free refers to Intel ® Xeon® 5400/5200 processor series. 2. Lead and Halogen free kit includes Intel® Xeon® family CPU, Intel® Chipsets, and Intel® LAN components. Note:45nm product is manufactured on a Lead Free process. Lead-free per EU RoHS directive July, 2006. Some E.U. RoHS exemptions may apply to other components used in the product package. 8 Intel Confidential—NDA Platform Roadmap, All dates and plans are subject to change without notice. New SKU Numbers WW32 1S Workstation Processor Roadmap W3565 SKU Waterfall W3550 SKU waterfall Q3’10 Q4’10 Q1’11 Q2'11 Q3’11 EXTREME W3680 W3680 W3690 W3690 W3690 W3565 W3670 W3670 W3670 W3670 ADVANCED W3550 W3550 W3565 W3565 W3565 X3480 X3480 X3480 E3-1280 X3480 E3-1280 X3480 E3-1280 STANDARD3 W3530 W3530 W3550 W3550 W3550 X3460 X3470 E3-1275 E3-1275 E3-1275 32nm Clarkdale processors – See Client Desktop Roadmap (Clarkdale) for SKU lineup STANDARD2 X3450 X3450 E3-1245 E3-1245 E3-1245 X3440 X3440 E3-1235 E3-1235 E3-1235 32nm Clarkdale processors – See Client Desktop Roadmap (Clarkdale) for SKU lineup STANDARD1 X3430 X3430 E3-1225 E3-1225 E3-1225 32nm Clarkdale processors – See Desktop Roadmap for SKU lineup Intel® Xeon® 3500 Intel® Xeon® 3400 SNB SKT-H2 series (NHM-WS) series (Lynnfield) NOTE: Intel processor numbers are not a measure of performance. Processor numbers differentiate features within each processor family, not across different processor families. See WWw.intel.com/products/processor_number for details. 9 Intel Confidential—NDA Platform
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