NDA Data Center Group (DCG) Platform Roadmap Data Center Group Marketing (DCGM)
WW32 2010
Intel Confidential—NDA Platform Roadmap 11 Legal Information • All products, computer systems, dates, and figures specified are preliminary based on current expectations, and are subject to change without notice. This document contains information on products in the design phase of development. • Results have been estimated based on internal Intel analysis and are provided for informational purposes only. Any difference in system hardware or software design or configuration may affect actual performance. • Intel processor numbers are not a measure of performance. Processor numbers differentiate features within each processor family, not across different processor families. Click here for details • Hyper-Threading Technology requires a computer system with a processor supporting HT Technology and an HT Technology-enabled chipset, BIOS and operating system. Performance will vary depending on the specific hardware and software you use. For more information including details on which processors support HT Technology, see here • Intel® Turbo Boost Technology requires a PC with a processor with Intel Turbo Boost Technology capability. Intel Turbo Boost Technology performance varies depending on hardware, software and overall system configuration. Check with your PC manufacturer on whether your system delivers Intel Turbo Boost Technology. For more information, see http://www.intel.com/technology/turboboost. • No computer system can provide absolute security under all conditions. Intel® Trusted Execution Technology (Intel® TXT) requires a computer system with Intel® Virtualization Technology, an Intel TXT-enabled processor, chipset, BIOS, Authenticated Code Modules and an Intel TXT-compatible measured launched environment (MLE). The MLE could consist of a virtual machine monitor, an OS or an application. In addition, Intel TXT requires the system to contain a TPM v1.2, as defined by the Trusted Computing Group and specific software for some uses. For more information, see here • The original equipment manufacturer must provide TPM functionality, which requires a TPM-supported BIOS. TPM functionality must be initialized and may not be available in all countries. • Intel, Intel Xeon, Intel Core micro-architecture, and the Intel logo are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the United States and other countries.
2 Intel Confidential—NDA Platform Roadmap, All dates and plans are subject to change without notice. WW32 Changes: Data Center Group (DCG) Mission Critical (MC) • No Changes
Expandable (EX) • No Changes
Efficient Performance (EP) • No Changes
Entry (EN) & Workstation (WS) • Updated Sandy Bridge –Skt H2 detail – Updated WS platform 1S & Sku details – Updated 1S EN platform and SKU details – Updated Low Power & Ultra-Dense Processor SKU Detail – Updated Intel® Xeon® E3-1200 product family Reference Table – Updated Chipset Reference table – SKU waterfall in 1S WS (W3565, W3550 SKUs)
General Updates • PDN/EOL/PSN slide –updated • Sales Guidance slides –updated • SSD slides –updated • New Server Numbering System enacted – Reintroduction of decoder slides – product line and numbering – No renumbering of older products – SNB Skt H2 first product with new numbering
3 Intel Confidential—NDA Platform Roadmap, All dates and plans are subject to change without notice. New slide Product Line Descriptions, Today & 2011 Today 2011
Intel® Itanium® processor Intel® Itanium® processor 9000 sequence platforms 9000 sequence platforms
Intel® Xeon® processor Intel® Xeon® processor 7000 sequence platforms E7 platforms
Intel® Xeon® processor Intel® Xeon® processor 5000 sequence platforms E5 platforms
Intel® Xeon® processor Intel® Xeon® processor 3000 sequence platforms E3 platforms
44 Intel Confidential—NDA Platform Roadmap, All dates and plans are subject to change without notice. New slide Introducing New DCG Processor Numbering
Brand Prod Line Version (E3, E5, E7) Prod Family (v2, v3, v4, etc) Intel® Xeon® processor E# – # # # # v#
Wayness, maximum number of CPUs in a node (1, 2, 4, 8) Socket/segment designation (2, 4, 6, 8) ‘Low Power’ SKUs (after 4 digit numeric set): Designator Actual Socket Alpha Description 8 LS (Westmere EX) Processor SKU Suffix (i.e. 10, 20, 30, etc…) 6 R (Sandy Bridge) L Low Power 4 B2 (Sandy Bridge) 2 H2 (Sandy Bridge)
2011 Example above (socket changes over time, designator does not)
5 Intel Confidential—NDA Platform Roadmap, All dates and plans are subject to change without notice. New slide Introducing New DCG Chipset Numbering
Intel® C 6 0 0 Chipset Typical Usages Intentionally differentiated from SKU Collective group reference processor numbering; chipsets used across processor product lines Generation (within segment) • Intel® CXXX series chipset
PCH segment Specific SKU • Intel® CXXX chipset
Sandy Bridge Ivy Bridge Future
Data Center C600 C610 PCH (Patsburg) (Future)
Desktop- Derived C200 C210 C220 PCH (Cougar Point) (Panther Point) (Future)
Note: Ancillary chipset components (i.e. memory buffer) to be ‘C100’.
6 Intel Confidential—NDA Platform Roadmap, All dates and plans are subject to change without notice. New product Line description Product Line Descriptions
Intel® Itanium® processor 9000 series platforms Architected for mission critical UNIX and mainframe-class reliability & scalability. Targeted at large-scale databases, data warehouses, ERP, business intelligence, and data analytics. Delivers uncompromising scalable performance for today ’s most demanding workloads and world-class reliability for uninterrupted real-time business processing and decision support
Intel® Xeon® processor 7000 series platforms Scalable (up to 256-way), reliable, powerful 64-bit multi-core servers offering industry-leading performance, expanded memory & I/O capacity, and advanced reliability ideal for the most demanding enterprise and mission critical workloads, large scale virtualization and large-node HPC applications.
Intel® Xeon® processor E5 platforms Versatile (up to 2-way) servers that support up to six-core processors for all your infrastructure, high-density , workstation and HPC applications with features that enable optimal performance and power efficiency for the data center.
Intel® Xeon® processor 3000 series platforms » Intel® Xeon® processor E3 platforms Economical (1-way) dependable general purpose 64-bit servers well-suited for small businesses and education
7 Intel Confidential—NDA Platform Roadmap, All dates and plans are subject to change without notice. WW32 Workstation (WS) Platform Roadmap New 1S EN Numbering
Q3’10 Q4’10 Q1’11 Q2'11 Q3’11
Tylersburg-WS Platform Intel® Xeon® processor 5600 series (Westmere-EP) Intel® Xeon® processor 5500 series (Nehalem-EP)
Intel® 5520 chipset (dual configuration)
Technologies Workstation Xeon® processor 5500* & 5600 series features plus up to 50% more cores and cache support for low voltage Two Socket DDR3 1333/1066/800 memory, Advanced Encryption Standard new instructions and Intel ® Trusted Execution Technology Tylersburg-WS Platform Intel® Xeon® processor 3600 series (Westmere-EP) Intel® Xeon® processor 3500 series (Nehalem-EP) Intel® X58 chipset Technologies 32nm Process Technology, Up to 6-Cores / 12 Threads
Foxhollow -WS Platform Bromolow Platform
Intel® Xeon® processor 3400 series Intel® Xeon® processor E3-1200 product family (Lynnfield) (Sandy Bridge)
32nm Clarkdale processors Intel® C206 Chipset Technologies: Quad-Core / Dual Core, DDR3 3 ® Technologies 1333/1066/800 memory, Intel Turbo Boost Quad-Core / Dual Core, DDR3 1333/1066 memory, Intel® AMT, Intel® ® Technology, Intel® VT, Intel Hyper-Threading Turbo Boost Technology, Intel® VT, Intel® Hyper-Threading Technology, Workstation Technology, ECC Memory Support, Lead and ECC Memory Support, Lead and halogen free platform kit 2 One Socket halogen free platform kit2, Intel ® AMT6.0
*note: 1.35V DIMM, Intel ® TXT and AES-NI only supported on Intel® Xeon® processor 5600 series
1. Lead Free/Halogen free refers to Intel ® Xeon® 5400/5200 processor series. 2. Lead and Halogen free kit includes Intel® Xeon® family CPU, Intel® Chipsets, and Intel® LAN components. Note:45nm product is manufactured on a Lead Free process. Lead-free per EU RoHS directive July, 2006. Some E.U. RoHS exemptions may apply to other components used in the product package.
8 Intel Confidential—NDA Platform Roadmap, All dates and plans are subject to change without notice. New SKU Numbers WW32 1S Workstation Processor Roadmap W3565 SKU Waterfall W3550 SKU waterfall
Q3’10 Q4’10 Q1’11 Q2'11 Q3’11 EXTREME W3680 W3680 W3690 W3690 W3690 W3565 W3670 W3670 W3670 W3670
ADVANCED W3550 W3550 W3565 W3565 W3565 X3480 X3480 X3480 E3-1280 X3480 E3-1280 X3480 E3-1280
STANDARD3 W3530 W3530 W3550 W3550 W3550 X3460 X3470 E3-1275 E3-1275 E3-1275 32nm Clarkdale processors – See Client Desktop Roadmap (Clarkdale) for SKU lineup STANDARD2 X3450 X3450 E3-1245 E3-1245 E3-1245 X3440 X3440 E3-1235 E3-1235 E3-1235 32nm Clarkdale processors – See Client Desktop Roadmap (Clarkdale) for SKU lineup STANDARD1 X3430 X3430 E3-1225 E3-1225 E3-1225
32nm Clarkdale processors – See Desktop Roadmap for SKU lineup
Intel® Xeon® 3500 Intel® Xeon® 3400 SNB SKT-H2 series (NHM-WS) series (Lynnfield)
NOTE: Intel processor numbers are not a measure of performance. Processor numbers differentiate features within each processor family, not across different processor families. See WWw.intel.com/products/processor_number for details.
9 Intel Confidential—NDA Platform Roadmap, All dates and plans are subject to change without notice. New 1S EN Numbering WW32 Entry Server (EN) Platform Roadmap
Q3’10 Q4’10 Q1’11 Q2'11 Q3’11 Tylersburg-EN Platform
Intel® Xeon® processor 5500* & 5600 series (Westmere-EP) Intel® 5500 chipset
Technologies: Six-Core / Quad Core Up to 12MB of cache DDR3 1333/1066/800 memory (1.5 and 1.35V *) Intel ® Turbo Boost Technology Entry Intel ® VT-x, -d, & -c Two Socket Intel ® QuickPath Interconnect (QPI) Intel ® Hyper-Threading Technology Intel ® TXT*, Advanced Encryption Standard New Instructions *
Foxhollow Platform Bromolow Platform
Intel® Xeon® processor 3400 series Intel® Xeon® processor E3-1200 product family (Lynnfield) (Sandy Bridge) Intel® Xeon® L3406 processor (Clarkdale) Intel® C206 Chipset 32nm Clarkdale processors Technologies Intel® 3400/3420 chipset (Ibex Peak) Quad-Core / Dual Core, DDR3 1333/1066 memory
Entry Technologies: Quad-Core / Dual Core, DDR3 Intel® AMT, Intel® Turbo Boost Technology, Intel ® VT, Intel® One Socket 1333/1066/8003 memory, Intel® Turbo Boost Hyper-Threading Technology, ECC Memory Support, Lead and Technology, Intel® VT, Intel® Hyper-Threading halogen free platform kit 2 Technology, ECC Memory Support, Lead and halogen free platform kit2
*note: 1.35V DIMM, Intel ® TXT and AES-NI only supported on Intel® Xeon® processor 5600 series
1. Lead Free/Halogen free refers to Intel ® Xeon® processor series where indicated Halogen free kit includes Intel® Xeon® family CPU, Intel® Chipsets, and Intel® LAN components. System Board may not be compliant. Lead free kit 2. Includes Intel® Xeon® family CPU, Intel® Chipsets, and Intel® LAN components. System Board may or may not be compliant • Note:45nm product is manufactured on a Lead Free process. Lead-free per EU RoHS directive July, 2006. Some E.U. RoHS exemptions may apply to other components used in the product package. 3. 1066 RDIMMs running at 800. No support for native 800 MT/s UDIMMs and RDIMMs 10 Intel Confidential—NDA Platform Roadmap, All dates and plans are subject to change without notice. New Product Line Introduction New Sku Detail WW32 Intel® Xeon® Processor 3000 Series and E3-1200 Product Family
Q3’10 Q4’10 Q1’11 Q2'11 Q3’11
X3480 X3480 E3-1280 E3-1280 E3-1280
X3460 X3470 E3-1270 E3-1270 E3-1270
X3450 X3450 E3-1240 E3-1240 E3-1240
X3440 X3440 E3-1230 E3-1230 E3-1230
X3430 X3430 E3-1220 E3-1220 E3-1220
Intel® Xeon® processor 3400 Sandy Bridge series (Lynnfield) (Skt – H2) processors
11 Intel Confidential—NDA Platform Roadmap, All dates and plans are subject to change without notice. New Sku Detail New Product Line Introduction WW32 Low Power & Ultra Dense Server Processor Roadmap
Q3’10 Q4’10 Q1’11 Q2'11 Q3’11
9310 9310 9310 9310 9310
Intel® Itanium® 9000 series
L7555 L7555 L7555 L7555 L7555
L7545 L7545 L7545 L7545 L7545 Intel® Xeon® 7000 platform
L5640 L5640 L5640 L5640 L5640 L5630 L5630 L5630 L5630 L5630
Intel® Xeon® 5000 L5609 L5609 L5609 L5609 L5609 Platform
L3426 L3426 E3-1260L E3-1260L E3-1260L
Intel® Xeon® 3000 Platform & Intel® Xeon® L3406 L3406 E3-1220L E3-1220L E3-1220L Processor E3 Platform
Intel® Itanium® processor Intel® Xeon® processor Intel® Xeon® processor 5600 Intel® Xeon® processor Intel® Xeon® processor E3- 9300 series (Tukwila-MC) 7500 series (NHM-EX) series (Westmere-EP) 3400 series (Clarkdale) 1200 product family (SNB H2)
12 Intel Confidential—NDA Platform Roadmap, All dates and plans are subject to change without notice. Updated Server Processor Transition Guidance
RTR Ready to Receive = PDN Product Discontinuance Notice = EOL End of Lifecycle = - - PSN Product Support Change Notice = -
INTEL CONFIDENTIAL
Intel® the Intel logo Pentium® Itanium® Intel® Xeon™ Celeron® Intel® Centrino™ Intel® Core™ Duo and Intel® Core™ Solo are trademarks or registered trademarks of the , , , , , , , , Intel Corporation or its subsidiaries in the US and other countries
All dates & volumes specified are targets based on current expectations, provided for planning purposes only, and are subject to change without prior notice Availability in different channels may vary 13 . . WW32 Server Processor Guidance: MC & EX Updated
Mission Critical (MC) Sales Out Guidance
•Tukwila continues to ramp through horizon
Expandable (EX) Sales Out Guidance
• Expect cross over between Nehalem EX and Dunnington to occur in Q3’10 • NHM EX continues to ramp through horizon
14 Intel Confidential—NDA Platform Roadmap, All dates and plans are subject to change without notice. WW32 Server Processor Guidance: EP & EN Updated
Xeon® 2S Efficient Performance (EP) & Entry Segment (EN) Sales Out Guidance •Westmere volume shipments continue to ramp through horizon •2011 reflects introduction of Westmere to Basic segment
Xeon® 1S Entry (EN) Sales Out Guidance •Lynnfield continues to ramp across the horizon •Sandy Bridge introduction being shown in 1H’11
15 Intel Confidential—NDA Platform Roadmap, All dates and plans are subject to change without notice. Updated Non-Volatile Memory & Solid-State Drive Roadmap for Server
Q4’10 Q1 ’11 Q2Q2 ’’0911 Q3 ’11 Q3 ’10/Now Q1 ’09 Q2 ’09 Q2Q3 ’’0909 Q4’09 X25-E (2.5” SATA SSD) Lyndonville
400GB400GB 200GB200GB
64GB64GB 100GB100GB
32GB32GB Intel® High Performance X25-M (2.5” SATA SSD) Postville Refresh SATA SSD 600GB
300GB
160GB160GB 160GB
80GB80GB 80GB
® Intel Turbo X25-V (2.5” SATA SSD ) Memory 40GB40GB 40GB
50nm SLC 34nm MLC 25nm Enterprise MLC 25nm MLC 16 Intel Confidential -- NDA Platform Roadmap, All dates and plans are subject to change without notice Solid State Drive Technologies : Server Updated Value Proposition for current SSDs Key Message Supporting Details
– Sustained Read/Write: up to 250/170 MB/s Intel® High- Intel’s highest performing SATA – 35 k IOPs (4Kb Read); Performance Solid-State Drive 3.3 k IOPs (4Kb Write) Solid State – Active (typ) / Idle Drive � Game Changing Performance � Enterprise Class Reliability 2400mW / 60mW X25-E – 2 million hour MTBF Extreme – Read Latency 75 microseconds
Do more and wait less with Intel’s 2 Intel® High- – Sustained Read/Write: 250/100 MB/s Mainstream SATA Solid-State Drive 1* Performance – 35 k IOPs (4KB Read); 300 IOPs (4 Kb Write) Solid State � Increased client system – Active (typ)/Idle 3.0W/0.06W13 Drive performance – 1.2 million hour MTBF X25-M � Faster boot time – Read Latency 65 microseconds1 � Lower power – Write Latency 85 microseconds1 Mainstream
Intel® High- Intel’s smaller capacity with – Sustained Read/Write: 170/35 MB/s Performance optimized high performance 34nm – Up to 25 k IOPs (4KB Read) Solid State SATA Solid-State Drive Up to 2.5 k IOPs1* (4KB Write) Drive � Competitive Performance VS Hard – Power: Active(typ) /Idle(typ) Drive 150mW /75mW X25-V � Lower TCO – 1.2 million hour MTBF Value � Boot Drive replacement – Read/Write Latency: 65/110 microseconds All products, dates, and programs are based on current expectations and subject to change without notice . 1 : Specifications based on Postville 34nm Product Line • : Measurement performed on 100% span 2 : Specifications based on 34nm X25-M 160GB SSD 3 : Specification based on simulated enterprise workload running 6KB sequential arites with a write queue depth of 1 Intel Confidential -- NDA Platform Roadmap, All dates and plans are subject to change without notice ReferenceReference TablesTables
Intel Confidential—NDA Platform Roadmap 18 Deleted SNB line WW32 Intel® Xeon® Processor 3400 Series Reference Table
Intel Capabilities1 Package Intel® Technology Turbo Clock Speed/ Boost Processor Processor Processor TDP Cores / Memory Speed Technolog VT & Lead Halogen Brand Name Generation Process Number GHz/(Watt) Cache Threads (DDR3 only) y DBS TXT FlexMigration Free Free 3.06 1333/ X3480 8MB 4/8 (95W) 1066/800 √ √ √ √ √ √ 2.93 1333/1066/ X3470 8MB 4/8 (95W) 800 √ √ √ √ √ √ 2.80 1333/1066/ X3460 8MB 4/8 (95W) 800 √ √ √ √ √ √ 2.66 1333/1066/ Intel® Lynnfield 45 nm X3450 8MB 4/8 √ √ √ √ √ √ Xeon® (95W) 800 Processor 2.53 1333/1066/ X3440 8MB 4/8 (95W) 800 √ √ √ √ √ √ 2.40 1333/1066/ X3430 8MB 4/4 (95W) 800 √ √ √ √ √ √ 1.86 1333/1066/ L3426 8MB 4/8 (45W) 800 √ √ √ √ √ √ 2.26 Clarkdale 32 nm L3406 4MB 2/4 1066 (30W) √ √ √ √ √ √
1 The memory disambiguation portion of the hardware not included in the Lynnfield processors Note: Intel processor numbers are not a measure of performance. Processor numbers differentiate features within each processor family, not across different processor families. Over time processor numbers will increment based on changes in clock speed, cache, FSB, or other features, and increments are not intended to represent proportional or quantitative increases in any particular feature. Current roadmap processor number progression is not necessarily representative of future roadmaps. See WWw.intel.com/products/processor_number for details. 19 Intel Confidential—NDA Platform Roadmap, All dates and plans are subject to change without notice. New SNB Detail WW32 Intel® Xeon® Processor E3-1200 Product Family Reference Table
Package Intel Capabilities1 Package Intel Capabilities Technology Clock Intel® Processor Processor Processor Speed/ TDP Cores / Int. Gfx Memory Speed Turbo Boost VT & Lead Halogen Brand Name Gen Process Number GHz/(Watt) Cache Threads Engine (DDR3 only) Technology DBS TXT FlexMigration Free Free 3.10 E3-1220 8MB 4/4 0 1333/1066/800 (80W) √ √ √ √ √ √ 2.20 E3-1220L 3MB 2/4 0 1333/1066/800 (20W) √ √ √ √ √ √ 3.10 E3-1225 6MB 4/4 2 1333/1066/800 (95W) √ √ √ √ √ √ 3.20 E3-1230 8MB 4/8 0 1333/1066/800 (80W) √ √ √ √ √ √ 3.20 E3-1235 8MB 4/8 2 1333/1066/800 (95W) √ √ √ √ √ √ Intel® Xeon® Sandy 3.30 32nm E3-1240 8MB 4/8 0 1333/1066/800 Processor Bridge (80W) √ √ √ √ √ √ 3.30 E3-1245 8MB 4/8 2 1333/1066/800 (95W) √ √ √ √ √ √ 2.40 E3-1260L 8MB 4/8 1 1333/1066/800 (45W) √ √ √ √ √ √ 3.40 E3-1270 8MB 4/8 0 1333/1066/800 (80W) √ √ √ √ √ √ 3.40 E3-1275 8MB 4/8 2 1333/1066/800 (95W) √ √ √ √ √ √ 3.50 E3-1280 8MB 4/8 0 1333/1066/800 (95W) √ √ √ √ √ √
20 Intel Confidential—NDA Platform Roadmap, All dates and plans are subject to change without notice. WW32 Enterprise Platform/Chipset Feature Set Reference Removed SNB Line Table (3 of 4)
Max QPI Memory I/O Processor Speed Chipset # mP’s Bus Generation (GT/ Speed # Max ECC/ 64/32b 64b sec) (MHz) Type DIMM Capacity Density Parity PCI PCI-X PCI-E Storage Graphics Intel Technologies
Intel® Rapid Recovery Technology 2 ch-DDR3 Intel® Active Management Intel® Xeon® 3400 1Gb 1 – x16 1 N/A 800/ 2 UDIMM 4 UDIMM √ √ √ SATA 1 – x16 Technology 3450 Series 2Gb 2– x4 1066/1333 Intel® Quiet System Technology Braidwood
Intel® Rapid Recovery 2 ch-DDR3 Intel® Xeon® 3400 3 RDIMM 6 RDIMM 1Gb 2 - x8 Technology 1 N/A 800/1066/ √ √ √ SATA 3420 Series 2 UDIMM 4 UDIMM 2Gb 2 –x4 Intel® Virtualization 1333 Technology
2 ch-DDR3 2 - x8 Intel® Xeon® 3400 3 RDIMM 6 RDIMM 1Gb Intel® Virtualization 1 N/A 800/1066/ √ √ √ 1 - x4 SATA 3400 Series 2 UDIMM 4 UDIMM 2Gb Technology 1333 2 – x1
Xeon® 3300 1333 2 ch-DDR2 Intel® 64 Intel® Xeon® 3200 1Gb 1 1066 800/ 4 8 √ √ √ 2 - x8 SATA Intel® Virtualization 3210 Xeon® 3100 2Gb 800 667/533 Technology Xeon® 3000
Xeon® 3300 1333 2 ch-DDR2 Intel® 64 Intel® Xeon® 3200 1Gb 1 1066 800/ 4 8 √ √ √ 1 - x8 SATA Intel® Virtualization 3200 Xeon® 3100 2Gb 800 667/533 Technology Xeon® 3000
Xeon® 3200 1066 Intel® 64 Intel® 2 ch-DDR2 1Gb Xeon® 3000 1 800 4 8 √ √ √ 2 - x8 SATA Intel® Virtualization 3010 667/533 2Gb Pentium® D 533 Technology
Xeon® 3200 1066 Intel® 64 Intel® 2 ch-DDR2 1Gb Xeon® 3000 1 800 4 8 √ √ √ 1 - x8 SATA Intel® Virtualization 3000 667/533 2Gb Pentium® D 533 Technology
21 Intel Confidential—NDA Platform Roadmap, All dates and plans are subject to change without notice.