Ultrascale Architecture PCB Design User Guide (UG583)
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Facebook Server Intel Motherboard V3.0
Facebook Server Intel Motherboard v3.0 Author: Jia Ning, Engineer, Facebook Contents Contents .......................................................................................................................................... 2 1 Scope ......................................................................................................................................... 5 2 Overview ................................................................................................................................... 5 2.1 License ............................................................................................................................. 5 3 Efficient Performance Motherboard v3 Features ..................................................................... 6 3.1 Block Diagram .................................................................................................................. 6 3.2 Placement and Form Factor ............................................................................................ 6 3.3 CPU and Memory ............................................................................................................. 7 3.4 Platform Controller Hub .................................................................................................. 8 3.5 Printed Circuit Board Stackup (PCB) ................................................................................ 8 4 Basic Input Output System (BIOS) ........................................................................................... 10 -
FLEX 10K Embedded Programmable Logic Family Data Sheet
FLEX 10K ® Embedded Programmable Logic Family October 1998, ver. 3.13 Data Sheet Features... ■ The industryÕs first embedded programmable logic device (PLD) family, providing system integration in a single device Ð Embedded array for implementing megafunctions, such as efficient memory and specialized logic functions Ð Logic array for general logic functions ■ High density Ð 10,000 to 250,000 typical gates (see Tables 1 and 2) Ð Up to 40,960 RAM bits; 2,048 bits per embedded array block (EAB), all of which can be used without reducing logic capacity ■ System-level features Ð MultiVoltª I/O interface support Ð 5.0-V tolerant input pins in FLEX¨ 10KA devices Ð Low power consumption (typical specification less than 0.5 mA in standby mode for most devices) Ð FLEX 10K and FLEX 10KA devices support peripheral component interconnect Special Interest GroupÕs (PCI-SIG) PCI Local Bus Specification, Revision 2.1 Ð FLEX 10KA devices include pull-up clamping diode, selectable on a pin-by-pin basis for 3.3-V PCI compliance Ð Select FLEX 10KA devices support 5.0-V PCI buses with eight or fewer loads Ð Built-in JTAG boundary-scan test (BST) circuitry compliant with IEEE Std. 1149.1-1990, available without consuming any device logic Table 1. FLEX 10K Device Features Feature EPF10K10 EPF10K20 EPF10K30 EPF10K40 EPF10K50 EPF10K10A EPF10K30A EPF10K50V Typical gates (logic and RAM), 10,000 20,000 30,000 40,000 50,000 Note (1) Usable gates 7,000 to 15,000 to 22,000 to 29,000 to 36,000 to 31,000 63,000 69,000 93,000 116,000 Logic elements (LEs) 576 1,152 1,728 2,304 2,880 Logic array blocks (LABs) 72 144 216 288 360 Embedded array blocks (EABs) 366810 Total RAM bits 6,144 12,288 12,288 16,384 20,480 Maximum user I/O pins 134 189 246 189 310 Altera Corporation 1 A-DS-F10K-03.13 FLEX 10K Embedded Programmable Logic Family Data Sheet Table 2. -
Parasitic Component Analysis and Acoustic Noise Evaluation in Voltage Regulator Modules (Vrms)
Parasitic Component Analysis and Acoustic noise evaluation in Voltage Regulator Modules (VRMs) A THESIS SUBMITTED TO THE FACULTY OF UNIVERSITY OF MINNESOTA BY PRANIT JANNAWAR IN PARTIAL FULFILLMENT OF THE REQUIREMENTS FOR THE DEGREE OF MASTER OF SCIENCE Ned Mohan, Adviser June, 2015 © Pranit Jannawar 2015 Acknowledgements I would like to thank my adviser Prof. Ned Mohan for his support and advice. I appreciate his patience in guiding me throughout the period. I have learnt what kind of effort is put into the research and what kind of attitude is required to address a technical issue. I would like to mention the efforts of my fellow mates in the lab who helped me obtaining components and hardware in timely manner. Finally, I express my gratitude to my parents for their emotional support and encouragement. i Abstract Stable and regulated supply voltage has been an important topic of discussion in a consumer electronic products. Every chip and device requires specified voltages with small margins. Voltage regulated modulators (VRMs) have always been proven to provide a solution to this problem. Building a power stage using point of load method helps overcome variability issue in the signal but introduces a converter with lot of supporting components. Multiple combination of capacitors and resistors of different material composition are required to obtain an optimal design for the product. PCB parasitic comes into play and due to high current slew rate physical stress builds up in the caps which tend to come out in form of acoustic noise. This thesis deals with such issues which can improve the product quality but keeping the cost low by utilizing and analyzing components the proper way. -
Xeon™ Processor Voltage Regulator Down (VRD) Design Guidelines
® Dual Intel® Xeon Processor Voltage Regulator Down (VRD) Design Guidelines July 2003 Order Number 298644-003 Dual Intel® Xeon Processor Voltage Regulator Down (VRD) Guidelines THIS DOCUMENT AND RELATED MATERIALS AND INFORMATION ARE PROVIDED "AS IS" WITH NO WARRANTIES, EXPRESS OR IMPLIED, INCLUDING BUT NOT LIMITED TO ANY IMPLIED WARRANTY OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, NON- INFRINGEMENT OF INTELLECTUAL PROPERTY RIGHTS, OR ANY WARRANTY OTHERWISE ARISING OUT OF ANY PROPOSAL, SPECIFICATION, OR SAMPLE. INTEL ASSUMES NO RESPONSIBILITY FOR ANY ERRORS CONTAINED IN THIS DOCUMENT AND HAS NO LIABILITIES OR OBLIGATIONS FOR ANY DAMAGES ARISING FROM OR IN CONNECTION WITH THE USE OF THIS DOCUMENT. Intel products are not intended for use in medical, life saving, life sustaining, critical control or safety systems, or in nuclear facility applications. Intel Corporation may have patents or pending patent applications, trademarks, copyrights, or other intellectual property rights that relate to the presented subject matter. The furnishing of documents and other materials and information does not provide any license, express or implied, by estoppel or otherwise, to any such patents, trademarks, copyrights, or other intellectual property rights. Intel may make changes to specifications and product descriptions at any time, without notice. Designers must not rely on the absence or characteristics of any features or instructions marked reserved or undefined. Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them. This document contains information on products in the design phase of development. Do not finalize a design with this information. Revised information will be published when the product is available. -
Analysis of Low Voltage Regulator Efficiency Based
ANALYSIS OF LOW VOLTAGE REGULATOR EFFICIENCY BASED ON FERRITE INDUCTOR by MRIDULA KOTHAKONDA A THESIS Submitted in partial fulfillment of the requirements for the degree of Master of Science in the Department of Electrical and Computer Engineering in the Graduate School of The University of Alabama TUSCALOOSA, ALABAMA 2010 Copyright Mridula Kothakonda 2010 ALL RIGHTS RESERVED ABSTRACT Low voltage regulator based on ferrite inductor, using single- and two-phase topologies, were designed and simulated in MATLAB. Simulated values of output voltage and current were used to evaluate the buck converter (i.e., low voltage regulator) for power efficiency and percentage ripple reduction at frequencies between 1 and 10 MHz with variable loads from 0.024 to 4 Ω. The parameters, such as inductance of 20 nH, quality factor of 15 of fabricated ferrite inductor and DC resistance (DCR) of 8.3 mΩ, were used for efficiency analysis of the converter. High current around 40 A was achieved by the converter at low load values. Low output voltage in the range of 0.8-1.2 V was achieved. The simulated results for the single- and two- phase converter were compared for maximum efficiency and lowest ripple in output voltage and current. The maximum efficiency of 97 % with load of 0.33 Ω and the lowest ripple current of about 2.3 mA were estimated for the two-phase converter at 10 MHz. In summary, the two- phase converter showed higher efficiency and lower ripple voltage and current than those of the single-phase converter. In addition, the efficiency of single- and two-phase converters based on ferrite inductor was compared to single- and two-phase converters based on air-core inductor. -
Pentium® II Xeon™ Processor Power Distribution Guidelines
E AP-828 APPLICATION NOTE Pentium® II Xeon™ Processor Power Distribution Guidelines June 1998 Order Number: 243772-001 5/28/98 3:57 PM 24377201.DOC INTEL CONFIDENTIAL (until publication date) Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel's Terms and Conditions of Sale for such products, Intel assumes no liability whatsoever, and Intel disclaims any express or implied warranty, relating to sale and/or use of Intel products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright or other intellectual property right. Intel products are not intended for use in medical, life saving, or life sustaining applications. Intel may make changes to specifications and product descriptions at any time, without notice. Designers must not rely on the absence or characteristics of any features or instructions marked "reserved" or "undefined." Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them. The Pentium® II Xeon™ processor may contain design defects or errors known as errata which may cause the product to deviate from published specifications. Current characterized errata are available on request. Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order. Copies of documents which have an ordering number and are referenced in this document, or other Intel literature, may be obtained by calling 1-800-548-4725 or by visiting Intel’s website at http://www.intel.com Copyright © Intel Corporation 1998. -
FLEX 10K Embedded Programmable Logic Device Family Data Sheet
Includes FLEX 10KA FLEX 10K ® Embedded Programmable Logic Device Family January 2003, ver. 4.2 Data Sheet Features... ■ The industry’s first embedded programmable logic device (PLD) family, providing System-on-a-Programmable-Chip (SOPC) integration – Embedded array for implementing megafunctions, such as efficient memory and specialized logic functions – Logic array for general logic functions ■ High density – 10,000 to 250,000 typical gates (see Tables 1 and 2) – Up to 40,960 RAM bits; 2,048 bits per embedded array block (EAB), all of which can be used without reducing logic capacity ■ System-level features – MultiVoltTM I/O interface support – 5.0-V tolerant input pins in FLEX® 10KA devices – Low power consumption (typical specification less than 0.5 mA in standby mode for most devices) – FLEX 10K and FLEX 10KA devices support peripheral component interconnect Special Interest Group (PCI SIG) PCI Local Bus Specification, Revision 2.2 – FLEX 10KA devices include pull-up clamping diode, selectable on a pin-by-pin basis for 3.3-V PCI compliance – Select FLEX 10KA devices support 5.0-V PCI buses with eight or fewer loads – Built-in Joint Test Action Group (JTAG) boundary-scan test (BST) circuitry compliant with IEEE Std. 1149.1-1990, available without consuming any device logic Table 1. FLEX 10K Device Features Feature EPF10K10 EPF10K20 EPF10K30 EPF10K40 EPF10K50 EPF10K10A EPF10K30A EPF10K50V Typical gates (logic and RAM) (1) 10,000 20,000 30,000 40,000 50,000 Maximum system gates 31,000 63,000 69,000 93,000 116,000 Logic elements (LEs) 576 1,152 1,728 2,304 2,880 Logic array blocks (LABs) 72 144 216 288 360 Embedded array blocks (EABs) 3 6 6 8 10 Total RAM bits 6,144 12,288 12,288 16,384 20,480 Maximum user I/O pins 150 189 246 189 310 Altera Corporation 1 DS-F10K-4.2 FLEX 10K Embedded Programmable Logic Device Family Data Sheet Table 2. -
Voltage Regulator Module (VRM) and Enterprise Voltage Regulator-Down (EVRD) 10.2
Voltage Regulator Module (VRM) and Enterprise Voltage Regulator-Down (EVRD) 10.2 Design Guidelines March 2005 Document Number: 306760-001 INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL'S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. Intel products are not intended for use in medical, life saving, or life sustaining applications. Intel may make changes to specifications and product descriptions at any time, without notice. Designers must not rely on the absence or characteristics of any features or instructions marked “reserved” or “undefined.” Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them. Intel® Xeon™ processor and 64-bit Intel® Xeon™ processor MP may contain design defects or errors known as errata that may cause the product to deviate from published specifications. Current characterized errata are available on request. Intel, Intel Xeon, Pentium and the Intel logo are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the United States and other countries. ∆ Intel processor numbers are not a measure of performance. Processor numbers differentiate features within each processor family, not across different processor families. -
Voltage Regulator Module (VRM) and Enterprise Voltage Regulator-Down (EVRD) 11.1
Voltage Regulator Module (VRM) and Enterprise Voltage Regulator-Down (EVRD) 11.1 Design Guidelines September 2009 Reference Number: 321736 Revision: 002 Notice: This document contains information on products in the design phase of development. The information here is subject to change without notice. Do not finalize a design with this information. INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL'S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. Intel products are not intended for use in medical, life saving, or life sustaining applications. Intel may make changes to specifications and product descriptions at any time, without notice. Designers must not rely on the absence or characteristics of any features or instructions marked “reserved” or “undefined.” Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them. The Intel Xeon Processor 5500 Series, processors in the Intel Xeon 5500 Platform platforms may contain design defects or errors known as errata, which may cause the product to deviate from published specifications. Current characterized errata are available upon request. No computer system can provide absolute security under all conditions. Intel® Trusted Execution Technology (Intel® TXT) requires a computer system with Intel® Virtualization Technology, an Intel TXT-enabled processor, chipset, BIOS, Authenticated Code Modules and an Intel TXT-compatible measured launched environment (MLE). -
Investigation of Alternative Power Architectures for CPU Voltage Regulators
Investigation of Alternative Power Architectures for CPU Voltage Regulators Julu Sun Dissertation submitted to the Faculty of the Virginia Polytechnic Institute and State University in partial fulfillment of the requirements for the degree of Doctor of Philosophy in Electrical Engineering Fred C. Lee, Chairman Dusan Boroyevich Ming Xu William T. Baumann Carlos T.A. Suchicital Elaine P. Scott November 22nd, 2008 Blacksburg, Virginia Keywords: two-stage, voltage regulator, high power density, high efficiency Investigation of Alternative Power Architectures for CPU Voltage Regulators Abstract Since future microprocessors will have higher current in accordance with Moore’s law, there are still challenges for voltage regulators (VRs). Firstly, high efficiency is required not only for easy thermal management, but also for saving on electricity costs for data centers, or battery life extension for laptop computers. At the same time, high power density is required due to the increased power of the microprocessors. This is especially true for data centers, since more microprocessors are required within a given space (per rack). High power density is also required for laptop computers to reduce the size and the weight. To improve power density, a high frequency is required to shrink the size of the output inductors and output capacitors of the multi-phase buck VR. It has been demonstrated that the output bulk capacitors can be eliminated by raising the VR control bandwidth to around 350kHz. Assuming the bandwidth is one-third of the switching frequency, a VR should run at 1MHz to ensure a small size. However, the efficiency of a 12V VR is very poor at 1MHz due to high switching losses. -
A+ Computer Maintenance
Multiple Category Scope and Sequence: Scope and Sequence Report For Course Standards and Objectives, Content, Skills, Vocabulary Wednesday, August 20, 2014, 12:35PM Course Standards and Unit Content Skills Vocabulary Objectives District U1: UT: CTE: Information Technology, UT: . Basic components and . Identify the component 1. Documentation Advanced Professionalism Grades 9-12, Computer Maintenance & functions of a computer of a basic computer 2. RAM A+ (Computer and Computer Repair (A+) . The art of elicitation . Effectively interface 3. OS Standard 2 with a customer to 4. Server Maintenance) Basics (Week 1, . Importance of respect and Students will demonstrate integrity when dealing with address their concerns 5. Memory Stick (11.9920) 1 Week) Troubleshooting, Repair and customers with their computer 6. My Documents (District) Maintenance Skills. Troubleshooting . Summarize the 7. Peripheral methodology troubleshooting 8. Plug and Play 2014-2015 9. Port (input/output) Objective 1 . Legacy vs Modern Ports process Collaboration . 10. Printer Given a scenario, explain the 11. Software troubleshooting theory. 12. Tablet PC a. Identify the problem - 13. Toner Question the user and identify 14. Toner Cartridge user changes to computer and 15. USB perform backups before 16. Mouse making changes 17. User Account b. Establish a theory of 18. WAV probable cause (question the 19. Anti-aliasing obvious) 20. Anti-static c. Test the theory to determine 21. Anti-Static Mat cause - Once theory is 22. Antistatic Bag confirmed determine next 23. Wrist Strap steps to resolve problem, If 24. Daily Backup theory is not confirmed re- 25. DHCP establish new theory or 26. DOS escalate 27. Laser Printer d. -
Power Systems
Power Systems Voltage regulators for the 8231-E2B, 8231-E1C, 8231-E1D, 8231-E2C, 8231-E2D, or 8268-E1D Power Systems Voltage regulators for the 8231-E2B, 8231-E1C, 8231-E1D, 8231-E2C, 8231-E2D, or 8268-E1D Note Before using this information and the product it supports, read the information in “Safety notices” on page v, “Notices” on page 65, the IBM Systems Safety Notices manual, G229-9054, and the IBM Environmental Notices and User Guide, Z125–5823. This edition applies to IBM Power Systems servers that contain the POWER7 processor and to all associated models. © Copyright IBM Corporation 2010, 2013. US Government Users Restricted Rights – Use, duplication or disclosure restricted by GSA ADP Schedule Contract with IBM Corp. Contents Safety notices .................................v Voltage regulator modules for the 8231-E2B, 8231-E1C, 8231-E1D, 8231-E2C, 8231-E2D, or 8268-E1D ..................................1 Installing the 8231-E2B, 8231-E1C, 8231-E1D, 8231-E2C, 8231-E2D, or 8268-E1D voltage regulator module ....2 Removing the 8231-E2B, 8231-E1C, 8231-E1D, 8231-E2C, 8231-E2D, or 8268-E1D voltage regulator module ....5 Replacing the 8231-E2B, 8231-E1C, 8231-E1D, 8231-E2C, 8231-E2D, or 8268-E1D voltage regulator module ....7 Common procedures for installable features .........................8 Before you begin .................................8 Identifying a part ................................11 Control panel LEDs...............................11 Identifying a failing part in an AIX system or logical partition ................13