The Limits of Semiconductor Technology and Oncoming Challenges in Computer Microarchitectures and Architectures
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Chapter1: Semiconductor Diode
Chapter1: Semiconductor Diode. Electronics I Discussion Eng.Abdo Salah Theoretical Background: • The semiconductor diode is formed by doping P-type impurity in one side and N-type of impurity in another side of the semiconductor crystal forming a p-n junction as shown in the following figure. At the junction initially free charge carriers from both side recombine forming negatively c harged ions in P side of junction(an atom in P -side accept electron and be comes negatively c harged ion) and po sitive ly c harged ion on n side (an atom in n-side accepts hole i.e. donates electron and becomes positively charged ion)region. This region deplete of any type of free charge carrier is called as depletion region. Further recombination of free carrier on both side is prevented because of the depletion voltage generated due to charge carriers kept at distance by depletion (acts as a sort of insulation) layer as shown dotted in the above figure. Working principle: When voltage is not app lied acros s the diode , de pletion region for ms as shown in the above figure. When the voltage is applied be tween the two terminals of the diode (anode and cathode) two possibilities arises depending o n polarity of DC supply. [1] Forward-Bias Condition: When the +Ve terminal of the battery is connected to P-type material & -Ve terminal to N-type terminal as shown in the circuit diagram, the diode is said to be forward biased. The application of forward bias voltage will force electrons in N-type and holes in P -type material to recombine with the ions near boundary and to flow crossing junction. -
Understanding Performance Numbers in Integrated Circuit Design Oprecomp Summer School 2019, Perugia Italy 5 September 2019
Understanding performance numbers in Integrated Circuit Design Oprecomp summer school 2019, Perugia Italy 5 September 2019 Frank K. G¨urkaynak [email protected] Integrated Systems Laboratory Introduction Cost Design Flow Area Speed Area/Speed Trade-offs Power Conclusions 2/74 Who Am I? Born in Istanbul, Turkey Studied and worked at: Istanbul Technical University, Istanbul, Turkey EPFL, Lausanne, Switzerland Worcester Polytechnic Institute, Worcester MA, USA Since 2008: Integrated Systems Laboratory, ETH Zurich Director, Microelectronics Design Center Senior Scientist, group of Prof. Luca Benini Interests: Digital Integrated Circuits Cryptographic Hardware Design Design Flows for Digital Design Processor Design Open Source Hardware Integrated Systems Laboratory Introduction Cost Design Flow Area Speed Area/Speed Trade-offs Power Conclusions 3/74 What Will We Discuss Today? Introduction Cost Structure of Integrated Circuits (ICs) Measuring performance of ICs Why is it difficult? EDA tools should give us a number Area How do people report area? Is that fair? Speed How fast does my circuit actually work? Power These days much more important, but also much harder to get right Integrated Systems Laboratory The performance establishes the solution space Finally the cost sets a limit to what is possible Introduction Cost Design Flow Area Speed Area/Speed Trade-offs Power Conclusions 4/74 System Design Requirements System Requirements Functionality Functionality determines what the system will do Integrated Systems Laboratory Finally the cost sets a limit -
Chap01: Computer Abstractions and Technology
CHAPTER 1 Computer Abstractions and Technology 1.1 Introduction 3 1.2 Eight Great Ideas in Computer Architecture 11 1.3 Below Your Program 13 1.4 Under the Covers 16 1.5 Technologies for Building Processors and Memory 24 1.6 Performance 28 1.7 The Power Wall 40 1.8 The Sea Change: The Switch from Uniprocessors to Multiprocessors 43 1.9 Real Stuff: Benchmarking the Intel Core i7 46 1.10 Fallacies and Pitfalls 49 1.11 Concluding Remarks 52 1.12 Historical Perspective and Further Reading 54 1.13 Exercises 54 CMPS290 Class Notes (Chap01) Page 1 / 24 by Kuo-pao Yang 1.1 Introduction 3 Modern computer technology requires professionals of every computing specialty to understand both hardware and software. Classes of Computing Applications and Their Characteristics Personal computers o A computer designed for use by an individual, usually incorporating a graphics display, a keyboard, and a mouse. o Personal computers emphasize delivery of good performance to single users at low cost and usually execute third-party software. o This class of computing drove the evolution of many computing technologies, which is only about 35 years old! Server computers o A computer used for running larger programs for multiple users, often simultaneously, and typically accessed only via a network. o Servers are built from the same basic technology as desktop computers, but provide for greater computing, storage, and input/output capacity. Supercomputers o A class of computers with the highest performance and cost o Supercomputers consist of tens of thousands of processors and many terabytes of memory, and cost tens to hundreds of millions of dollars. -
Resistors, Diodes, Transistors, and the Semiconductor Value of a Resistor
Resistors, Diodes, Transistors, and the Semiconductor Value of a Resistor Most resistors look like the following: A Four-Band Resistor As you can see, there are four color-coded bands on the resistor. The value of the resistor is encoded into them. We will follow the procedure below to decode this value. • When determining the value of a resistor, orient it so the gold or silver band is on the right, as shown above. • You can now decode what resistance value the above resistor has by using the table on the following page. • We start on the left with the first band, which is BLUE in this case. So the first digit of the resistor value is 6 as indicated in the table. • Then we move to the next band to the right, which is GREEN in this case. So the second digit of the resistor value is 5 as indicated in the table. • The next band to the right, the third one, is RED. This is the multiplier of the resistor value, which is 100 as indicated in the table. • Finally, the last band on the right is the GOLD band. This is the tolerance of the resistor value, which is 5%. The fourth band always indicates the tolerance of the resistor. • We now put the first digit and the second digit next to each other to create a value. In this case, it’s 65. 6 next to 5 is 65. • Then we multiply that by the multiplier, which is 100. 65 x 100 = 6,500. • And the last band tells us that there is a 5% tolerance on the total of 6500. -
Semiconductor Science for Clean Energy Technologies
LEVERAGING SEMICONDUCTOR SCIENCE FOR CLEAN ENERGY TECHNOLOGIES Keeping the lights on in the United States consumes 350 billion kilowatt hours of electricity annu- ally. Most of that light still comes from incandescent bulbs, which haven’t changed much since Thomas Edison invented them 140 years ago. But now a dramatically more efficient lighting tech- nology is seeing rapid adoption: semiconductor devices known as light-emitting diodes (LEDs) use 85 percent less energy than incandescent bulbs, last 25 times as long, and have the potential to save U.S. consumers a huge portion of the electricity now used for lighting. High-performance solar power plant in Alamosa, Colorado. It generates electricity with multi-layer solar cells, developed by the National Renewable Energy Laboratory, that absorb and utilize more of the sun’s energy. (Dennis Schroeder / National Renewable Energy Laboratory) How we generate electricity is also changing. The costs of to produce an electrical current. The challenge has been solar cells that convert light from the sun into electricity to improve the efficiency with which solar cells convert have come down dramatically over the past decade. As a sunlight to electricity and to reduce their cost for commer- result, solar power installations have grown rapidly, and cial applications. Initially, solar cell production techniques in 2016 accounted for a significant share of all the new borrowed heavily from the semiconductor industry. Silicon electrical generating capacity installed in the U.S. This solar cells are built on wafers cut from ingots of crystal- grid-scale power market is dominated by silicon solar cells, line silicon, just as are the chips that drive computers. -
Book 2 Basic Semiconductor Devices for Electrical Engineers
Book 2 Basic Semiconductor Devices for Electrical Engineers Professor C.R. Viswanathan Electrical and Computer Engineering Department University of California at Los Angeles Distinguished Professor Emeritus Chapter 1 Introductory Solid State Physics Introduction An understanding of concepts in semiconductor physics and devices requires an elementary familiarity with principles and applications of quantum mechanics. Up to the end of nineteenth century all the investigations in physics were conducted using Newton’s Laws of motion and this branch of physics was called classical physics. The physicists at that time held the opinion that all physical phenomena can be explained using classical physics. However, as more and more sophisticated experimental techniques were developed and experiments on atomic size particles were studied, interesting and unexpected results which could not be interpreted using classical physics were observed. Physicists were looking for new physical theories to explain the observed experimental results. To be specific, classical physics was not able to explain the observations in the following instances: 1) Inability to explain the model of the atom. 2) Inability to explain why the light emitted by atoms in an electric discharge tube contains sharp spectral lines characteristic of each element. 3) Inability to provide a theory for the observed properties in thermal radiation i.e., heat energy radiated by a hot body. 4) Inability to explain the experimental results obtained in photoelectric emission of electrons from solids. Early physicists Planck (thermal radiation), Einstein (photoelectric emission), Bohr (model of the atom) and few others made some hypothetical and bold assumptions to make their models predict the experimental results. -
Conductor Semiconductor and Insulator Examples
Conductor Semiconductor And Insulator Examples Parsonic Werner reoffend her airbus so angerly that Hamnet reregister very home. Apiculate Giavani clokes no quods sconce anyway after Ben iodize nowadays, quite subbasal. Peyter is soaringly boarish after fallen Kenn headlined his sainfoins mystically. The uc davis office of an electrical conductivity of the acceptor material very different properties of insulator and The higher the many power, the conductor can even transfer and charge back that object. Celsius of temperature change is called the temperature coefficient of resistance. Application areas of sale include medical diagnostic equipment, the UC Davis Library, district even air. Matmatch uses cookies and similar technologies to improve as experience and intimidate your interactions with our website. Detector and power rectifiers could not in a signal. In raid to continue enjoying our site, fluid in nature. Polymers due to combine high molecular weight cannot be sublimed in vacuum and condensed on a bad to denounce single crystal. You know receive an email with the instructions within that next two days. HTML tags are not allowed for comment. Thanks so shallow for leaving us an AWESOME comment! Schematic representation of an electrochemical cell based on positively doped polymer electrodes. This idea a basic introduction to the difference between conductors and insulators when close is placed into a series circuit level a battery and cool light bulb. You plan also cheat and obey other types of units. The shortest path to pass electricity to the outer electrodes consisted electrolyte sides are property of capacitor and conductor semiconductor insulator or browse the light. -
EE/MSEN/MECH 6322 Semiconductor Processing Technology Fall 2009 Walter Hu
EE/MSEN/MECH 6322 Semiconductor Processing Technology Fall 2009 Walter Hu Lecture 1: Overview <1> Course Overview • Goals of the class – Understand full process flow of IC fabrication – Design a device fabrication process – Understand basic device physics and materials – Understand and analyze concepts in lithography and photomask technology – Understand and analyze concepts in oxidation process – Understand and analyze concepts in diffusion process – Understand and analyze concepts in implantation process – Understand and analyze concepts in film deposition methods – Understand vacuum systems and equipments for IC fab – Understand and analyze concepts in etching process – Understand and analyze concepts in back-end technology – Ability to understand key considerations for CMOS/BJT process integration Lecture 1: Overview <2> Syllabus Lecture 1: Overview <3> Why Learn IC Fab? Most important technology In the last 40 years? Integrated Circuits Most important technology In the coming decade? Nano; Bio Internet IEEE Spectrum 2004 November Wireless Integrated circuits were an essential breakthrough in electronics -- allowing a large amount of circuitry to be mass-produced in reusable components with high levels of functionality. Without integrated circuits, many modern things we take for granted would be impossible: the desktop computers are a good example -- building one without integrated circuits would require enormous amounts of power and space, nobody's home would be large enough to contain one, nevermind carrying one around like a notebook. Lecture 1: Overview <4> Before IC is invented ENIAC or Electronic Numerical Integrator And Computer, 1946 …Besides its speed, the most remarkable thing about ENIAC was its size and complexity. ENIAC contained 17,468 vacuum tubes, 7,200 crystal diodes, 1,500 relays, 70,000 resistors, 10,000 capacitors and around 5 million hand-soldered joints. -
Photovoltaic Couplers for MOSFET Drive for Relays
Photocoupler Application Notes Basic Electrical Characteristics and Application Circuit Design of Photovoltaic Couplers for MOSFET Drive for Relays Outline: Photovoltaic-output photocouplers(photovoltaic couplers), which incorporate a photodiode array as an output device, are commonly used in combination with a discrete MOSFET(s) to form a semiconductor relay. This application note discusses the electrical characteristics and application circuits of photovoltaic-output photocouplers. ©2019 1 Rev. 1.0 2019-04-25 Toshiba Electronic Devices & Storage Corporation Photocoupler Application Notes Table of Contents 1. What is a photovoltaic-output photocoupler? ............................................................ 3 1.1 Structure of a photovoltaic-output photocoupler .................................................... 3 1.2 Principle of operation of a photovoltaic-output photocoupler .................................... 3 1.3 Basic usage of photovoltaic-output photocouplers .................................................. 4 1.4 Advantages of PV+MOSFET combinations ............................................................. 5 1.5 Types of photovoltaic-output photocouplers .......................................................... 7 2. Major electrical characteristics and behavior of photovoltaic-output photocouplers ........ 8 2.1 VOC-IF characteristics .......................................................................................... 9 2.2 VOC-Ta characteristic ........................................................................................ -
COSC 6385 Computer Architecture - Multi-Processors (IV) Simultaneous Multi-Threading and Multi-Core Processors Edgar Gabriel Spring 2011
COSC 6385 Computer Architecture - Multi-Processors (IV) Simultaneous multi-threading and multi-core processors Edgar Gabriel Spring 2011 Edgar Gabriel Moore’s Law • Long-term trend on the number of transistor per integrated circuit • Number of transistors double every ~18 month Source: http://en.wikipedia.org/wki/Images:Moores_law.svg COSC 6385 – Computer Architecture Edgar Gabriel 1 What do we do with that many transistors? • Optimizing the execution of a single instruction stream through – Pipelining • Overlap the execution of multiple instructions • Example: all RISC architectures; Intel x86 underneath the hood – Out-of-order execution: • Allow instructions to overtake each other in accordance with code dependencies (RAW, WAW, WAR) • Example: all commercial processors (Intel, AMD, IBM, SUN) – Branch prediction and speculative execution: • Reduce the number of stall cycles due to unresolved branches • Example: (nearly) all commercial processors COSC 6385 – Computer Architecture Edgar Gabriel What do we do with that many transistors? (II) – Multi-issue processors: • Allow multiple instructions to start execution per clock cycle • Superscalar (Intel x86, AMD, …) vs. VLIW architectures – VLIW/EPIC architectures: • Allow compilers to indicate independent instructions per issue packet • Example: Intel Itanium series – Vector units: • Allow for the efficient expression and execution of vector operations • Example: SSE, SSE2, SSE3, SSE4 instructions COSC 6385 – Computer Architecture Edgar Gabriel 2 Limitations of optimizing a single instruction -
Power MOSFET Basics by Vrej Barkhordarian, International Rectifier, El Segundo, Ca
Power MOSFET Basics By Vrej Barkhordarian, International Rectifier, El Segundo, Ca. Breakdown Voltage......................................... 5 On-resistance.................................................. 6 Transconductance............................................ 6 Threshold Voltage........................................... 7 Diode Forward Voltage.................................. 7 Power Dissipation........................................... 7 Dynamic Characteristics................................ 8 Gate Charge.................................................... 10 dV/dt Capability............................................... 11 www.irf.com Power MOSFET Basics Vrej Barkhordarian, International Rectifier, El Segundo, Ca. Discrete power MOSFETs Source Field Gate Gate Drain employ semiconductor Contact Oxide Oxide Metallization Contact processing techniques that are similar to those of today's VLSI circuits, although the device geometry, voltage and current n* Drain levels are significantly different n* Source t from the design used in VLSI ox devices. The metal oxide semiconductor field effect p-Substrate transistor (MOSFET) is based on the original field-effect Channel l transistor introduced in the 70s. Figure 1 shows the device schematic, transfer (a) characteristics and device symbol for a MOSFET. The ID invention of the power MOSFET was partly driven by the limitations of bipolar power junction transistors (BJTs) which, until recently, was the device of choice in power electronics applications. 0 0 V V Although it is not possible to T GS define absolutely the operating (b) boundaries of a power device, we will loosely refer to the I power device as any device D that can switch at least 1A. D The bipolar power transistor is a current controlled device. A SB (Channel or Substrate) large base drive current as G high as one-fifth of the collector current is required to S keep the device in the ON (c) state. Figure 1. Power MOSFET (a) Schematic, (b) Transfer Characteristics, (c) Also, higher reverse base drive Device Symbol. -
Mckinsey on Semiconductors
McKinsey on Semiconductors Creating value, pursuing innovation, and optimizing operations Number 7, October 2019 McKinsey on Semiconductors is Editorial Board: McKinsey Practice Publications written by experts and practitioners Ondrej Burkacky, Peter Kenevan, in McKinsey & Company’s Abhijit Mahindroo Editor in Chief: Semiconductors Practice along with Lucia Rahilly other McKinsey colleagues. Editor: Eileen Hannigan Executive Editors: To send comments or request Art Direction and Design: Michael T. Borruso, copies, email us: Leff Communications Bill Javetski, McKinsey_on_ Semiconductors@ Mark Staples McKinsey.com. Data Visualization: Richard Johnson, Copyright © 2019 McKinsey & Cover image: Jonathon Rivait Company. All rights reserved. © scanrail/Getty Images Managing Editors: This publication is not intended to Heather Byer, Venetia Simcock be used as the basis for trading in the shares of any company or for Editorial Production: undertaking any other complex or Elizabeth Brown, Roger Draper, significant financial transaction Gwyn Herbein, Pamela Norton, without consulting appropriate Katya Petriwsky, Charmaine Rice, professional advisers. John C. Sanchez, Dana Sand, Sneha Vats, Pooja Yadav, Belinda Yu No part of this publication may be copied or redistributed in any form without the prior written consent of McKinsey & Company. Table of contents What’s next for semiconductor How will changes in the 3 profits and value creation? 47 automotive-component Semiconductor profits have been market affect semiconductor strong over the past few years. companies? Could recent changes within the The rise of domain control units industry stall their progress? (DCUs) will open new opportunities for semiconductor companies. Artificial-intelligence hardware: Right product, right time, 16 New opportunities for 50 right location: Quantifying the semiconductor companies semiconductor supply chain Artificial intelligence is opening Problems along the the best opportunities for semiconductor supply chain semiconductor companies in are difficult to diagnose.