Henkel Solutions Medical Electronics 2 | Medical Electronics

Overview Accurate diagnostics, improved alternative treatments and patient monitoring are all critical needs of the medical electronics industry. But, none of this is possible without the high-reliability medical devices used to facilitate these objectives. Henkel’s advanced semiconductor packaging and assembly materials are delivering the solutions needed to address the demanding requirements of next- generation medical electronics.

There’s no doubt that improving access to patients’ data has enabled medical professionals to provide personalized care and has expanded early intervention programs for the treatment of chronic conditions. Technologies such as implantable medical devices and patient monitoring sensors that make this type of patient care possible now require a form factor that is only achieved through advanced electronic devices, materials and assembly methods. Henkel’s technical expertise, low-risk partnership proposition, innovation philosophy, world-class global support infrastructure and history as a leading formulator of market-leading materials ensure that we will enable the future advancement of the medical electronics industry. Medical Electronics | 3 4 | Medical Electronics

Index

Medical

Inks & Coatings Adhesives COB Encapsulants PCB Protection Solder Materials Underfills

Silver/ Electrically Non- Low Electrically Non- Glob Tops Conformal Liquid Silver Water-Based Conductive Conductive Dam Fill Pressure Pastes Wires Capillary Flow Edgebond Conductive Inks Conductive General Coatings Fluxes Chloride Pastes Pastes Molding

LOCTITE LOCTITE Silver/ LOCTITE LOCTITE LOCTITE LOCTITE LOCTITE Pb-Free Pb-Free Pb-Free LOCTITE LOCTITE MACROMELT SnPb Halogen- Water Non- PTC Carbon Silver EDAG 6037SS EDAG 452SS Carbon Silver Silver ABLESTIK ABLESTIK ECCOBOND ECCOBOND ECCOBOND Halide- Halogen- Water No-Clean Reworkable ECCOBOND 5293 MM 6208 No-Clean Free Wash Reworkable E&C E&C Chloride 84-1LMISR4 84-3 FP 4451TD FP 4450HF EO 1060 Free Free Wash 3128

LOCTITE LOCTITE LOCTITE LOCTITE LOCTITE LOCTITE LOCTITE LOCTITE LOCTITE LOCTITE LOCTITE LOCTITE LOCTITE LOCTITE LOCTITE LOCTITE LOCTITE LOCTITE LOCITE LOCTITE LOCTITE LOCTITE LOCTIITE MACROMELT ECI 8001 EDAG 109 ECI 1001 EDAG 6038SS EDAG PD 038 EDAG ECI 1005 EDAG ABLESTIK ABLESTIK ECCOBOND ECCOBOND MULTICORE MULTICORE MULTICORE MULTICORE MULTICORE MULTICORE MULTICORE ECCOBOND ECCOBOND ECCOBOND 5296 Q 5353 E&C E&C E&C E&C E&C 112 E&C E&C PE 428 E&C CA 3556HF 2025D FP 4651 EO 1072 LF 318 HF 212 WS 300 MP 218 MF 388 C 400 HYDRO X E 1216M UF 3810 3707

LOCTITE LOCTITE LOCTITE LOCTITE LOCTITE LOCTITE LOCTITE LOCTITE LOCTITE LOCTITE LOCTITE EDAG EDAG EDAG 7019 EDAG PF 021 ABLESTIK ECCOBOND ECCOBOND STYCAST MULTICORE MULTICORE ECCOBOND C 932-51 479SS E&C E&C CE 3103WLV FP 4802 FP 4460 PC 18M HF 250DP MFR 301 FP 4531 E&C E&C

LOCTITE LOCTITE LOCTITE LOCTITE EDAG LOCTITE LOCTITE EDAG EDAG EDAG PE 007 PF 455B STYCAST ECCOBOND C 932-74 725A E&C E&C UV 7993 XE 1218 E&C E&C

LOCTITE EDAG PF 407C E&C

LOCTITE EDAG SS 24600 E&C Medical Electronics | 5

Electronics

Inks & Coatings Adhesives COB Encapsulants PCB Protection Solder Materials Underfills

Silver/ Electrically Non- Low Electrically Non- Glob Tops Conformal Liquid Silver Water-Based Conductive Conductive Dam Fill Pressure Pastes Wires Capillary Flow Edgebond Conductive Inks Conductive General Coatings Fluxes Chloride Pastes Pastes Molding

LOCTITE LOCTITE Silver/ LOCTITE LOCTITE LOCTITE LOCTITE LOCTITE Pb-Free Pb-Free Pb-Free LOCTITE LOCTITE MACROMELT SnPb Halogen- Water Non- PTC Carbon Silver EDAG 6037SS EDAG 452SS Carbon Silver Silver ABLESTIK ABLESTIK ECCOBOND ECCOBOND ECCOBOND Halide- Halogen- Water No-Clean Reworkable ECCOBOND 5293 MM 6208 No-Clean Free Wash Reworkable E&C E&C Chloride 84-1LMISR4 84-3 FP 4451TD FP 4450HF EO 1060 Free Free Wash 3128

LOCTITE LOCTITE LOCTITE LOCTITE LOCTITE LOCTITE LOCTITE LOCTITE LOCTITE LOCTITE LOCTITE LOCTITE LOCTITE LOCTITE LOCTITE LOCTITE LOCTITE LOCTITE LOCITE LOCTITE LOCTITE LOCTITE LOCTIITE MACROMELT ECI 8001 EDAG 109 ECI 1001 EDAG 6038SS EDAG PD 038 EDAG ECI 1005 EDAG ABLESTIK ABLESTIK ECCOBOND ECCOBOND MULTICORE MULTICORE MULTICORE MULTICORE MULTICORE MULTICORE MULTICORE ECCOBOND ECCOBOND ECCOBOND 5296 Q 5353 E&C E&C E&C E&C E&C 112 E&C E&C PE 428 E&C CA 3556HF 2025D FP 4651 EO 1072 LF 318 HF 212 WS 300 MP 218 MF 388 C 400 HYDRO X E 1216M UF 3810 3707

LOCTITE LOCTITE LOCTITE LOCTITE LOCTITE LOCTITE LOCTITE LOCTITE LOCTITE LOCTITE LOCTITE EDAG EDAG EDAG 7019 EDAG PF 021 ABLESTIK ECCOBOND ECCOBOND STYCAST MULTICORE MULTICORE ECCOBOND C 932-51 479SS E&C E&C CE 3103WLV FP 4802 FP 4460 PC 18M HF 250DP MFR 301 FP 4531 E&C E&C

LOCTITE LOCTITE LOCTITE LOCTITE EDAG LOCTITE LOCTITE EDAG EDAG EDAG PE 007 PF 455B STYCAST ECCOBOND C 932-74 725A E&C E&C UV 7993 XE 1218 E&C E&C

LOCTITE EDAG PF 407C E&C

LOCTITE EDAG SS 24600 E&C 6 | Medical Electronics

Inks & Coatings

ELECTRICALLY CONDUCTIVE-PTC INKS

SHEET RESISTANCE - PRODUCT DESCRIPTION APPLICATION CURE SCHEDULE OHM/SQUARE/25μ

Positive Temperature Coefficient (PTC), screen printable ink designed LOCTITE for applications where self-regulating ECI 8001 heaters are required. Formulated to Self-regulating heating elements. 10 min. @ 120°C 1,700 E&C rapidly heat to a specific threshold temperature and then maintain constant temperature for the device.

ELECTRICALLY CONDUCTIVE-CARBON INKS

SHEET RESISTANCE - PRODUCT DESCRIPTION APPLICATION CURE SCHEDULE OHM/SQUARE/25μ

LOCTITE Carbon ink for flexographic/rotogravure EDAG 109 printing on plastic film (PET, PVC) and Bio and medical sensors. 1 min. @ 120°C <30 E&C paper substrates. LOCTITE EDAG C 932-51 Rotary screened and blendable ink. Printed heaters. 4 min. @ 120°C 10,000-15,000 E&C LOCTITE EDAG C 932-74 Rotary screened and blendable ink. Printed heaters. 4 min. @ 120°C <50 E&C LOCTITE Membrane touch switches and Screen printable carbon ink for plastic EDAG PF 407C keyboards. Bio and medical 15 min. @ 120°C <15 film and paper substrates. E&C sensors. LOCTITE Dispersion of finely divided graphite in a EDAG SS 24600 thermoplastic resin that rapidly air dries Bio and medical sensors. Air dries in approx. 10 min. <40 E&C to form a flexible conductive coating.

ELECTRICALLY CONDUCTIVE-SILVER INKS

SHEET RESISTANCE - PRODUCT DESCRIPTION APPLICATION CURE SCHEDULE OHM/SQUARE/25μ

Screen printable, conductive ink LOCTITE designed for membrane-touch switch PTF circuits, membrane touch 10 min. @ 120°C minimum, ECI 1001 and other flex circuit applications. Offers <0.030 switches and flexible circuits. in convection oven E&C excellent balance of flexibility, hardness and adhesion. LOCTITE Conductive traces in membrane- EDAG 479SS Screen printable silver ink for PET film. touch switches and other flexible 15 min. @ 95°C <0.020 E&C circuitry. Medical Electronics | 7

ELECTRICALLY CONDUCTIVE-SILVER INKS

SHEET RESISTANCE - PRODUCT DESCRIPTION APPLICATION CURE SCHEDULE OHM/SQUARE/25μ

LOCTITE Silver conductive polymer thick film ink Conductive traces in membrane EDAG 725A is designed for use in the production of touch switches and other flexible 15 min. @ 120°C <0.015 E&C low voltage circuitry on polyester film. circuitry.

SILVER/SILVER CHLORIDE

SHEET RESISTANCE - PRODUCT DESCRIPTION APPLICATION CURE SCHEDULE OHM/SQUARE/25μ

LOCTITE Dry 30 min. @ 80°C Conductive screen printable ink. Designed for use as an Bio and medical EDAG 6037SS or 15 min. @ 95°C <0.12 electrode material in medical bio-sensing devices. sensors. E&C or 15 min. @ 120°C LOCTITE Dry 30 min. @ 80°C Conductive screen printable ink. Designed for use as an Bio and medical EDAG 6038SS or 15 min. @ 95°C ≤0.04 electrode material in medical bio-sensing devices. sensors. E&C or 15 min. @ 120°C Screen printable, silver-filled polymer thick film that also LOCTITE contains silver chloride. It is based on a thermoplastic Bio and medical 5 min. flash, EDAG 7019 resin and has been formulated to provide excellent <0.05 sensors. 30 min. bake @ 71°C E&C adhesion to the wide variety of substrates used in the manufacture of electrically conductive medical devices. LOCTITE Silver/silver chloride ink for flexographic/rotogravure Bio and medical EDAG PE 007 2 min. @ 110°C <0.100 printing on plastic film. sensors. E&C

NON-CONDUCTIVE

SHEET RESISTANCE - PRODUCT DESCRIPTION APPLICATION CURE SCHEDULE OHM/SQUARE/25μ

LOCTITE Screen printable, UV curable dielectric Tail coating membrane touch EDAG 452SS ink for plastic film and paper substrates. switches and PC desktop/ UV @ 0.5 joule/cm² <2 x 109 E&C Excellent flexibility. notebook keyboards. Dot spacer for touch screens LOCTITE Screen printable, UV curable dielectric and computer/palm-top panels. EDAG PD 038 ink for ITO treated PET film and copper- 0.5 joule/cm2 >2×109 Spacer for copper-etched E&C etched circuitry. circuitry. LOCTITE Encapsulating polymer designed to EDAG PF 021 secure low profile surface mount devices Surface mount devices. 0.4 to 1.0 joule/cm² >1 E&C to rigid or flexible substrates. LOCTITE Screen printable, UV curable dielectric Crossover dielectric in membrane EDAG PF 455B ink for plastic film. Excellent humidity touch switches and PC desktop/ UV @ 0.5 joule/cm² <2 x 109 E&C resistance. notebook keyboards. 8 | Medical Electronics

Inks & Coatings

WATER-BASED-CARBON INKS

SHEET RESISTANCE - PRODUCT DESCRIPTION APPLICATION CURE SCHEDULE OHM/SQUARE/25μ

Air-drying graphite coating of unusually LOCTITE high conductivity. It provides excellent EMI shielding, protective coating EDAG Air dry 25 min. <50 static bleed properties and acts as a on metals and plastics. 112 E&C protective energy absorbing layer.

WATER-BASED-SILVER INKS

SHEET RESISTANCE - PRODUCT DESCRIPTION APPLICATION CURE SCHEDULE OHM/SQUARE/25μ

Designed to dry rapidly to form a LOCTITE flexible, conductive coating. It is suitable RFID antenna, electronic circuitry ECI 1005 1 min. @ 70°C <0.050 for applications using high speed and bio and medical sensors. E&C flexographic printing techniques.

WATER-BASED-SILVER/SILVER CHLORIDE INKS

SHEET RESISTANCE - PRODUCT DESCRIPTION APPLICATION CURE SCHEDULE OHM/SQUARE/25μ

Designed for printing on flexible LOCTITE substrates. Suitable for applications Body contact pads, medical EDAG PE 428 15 min. @ 95°C 0.0175 using flexographic or rotogravure sensors. E&C printing techniques. Medical Electronics | 9

Adhesives

ELECTRICALLY CONDUCTIVE PASTES

VOLUME PRODUCT DESCRIPTION CURE TYPE SHELF LIFE CURE SCHEDULES RESISTIVITY

Conductive adhesive for semi-conductor LOCTITE packaging applications. Ideal for small ABLESTIK Heat 12 months @ -40°C 60 min. @ 175°C 0.0002 components or high speed dispense 84-1LMISR4 manufacturing. One-component, highly flexible, LOCTITE conductive adhesive for applications ABLESTIK Heat 5 months @ -40°C 120 sec. @ 110°C 0.0025 with large CTE mismatches between CA 3556HF substrates. Snap cure capability. Electrically conductive adhesive with LOCTITE superior contact resistance stability. 10 min. @ 120°C or ABLESTIK Pb-free alternative to solder attachment Heat 12 months @ -40°C 0.0008 3 min. @ 150°C CE 3103WLV materials. Low viscosity for fine line dispensing.

NON-ELECTRICALLY CONDUCTIVE PASTES

VOLUME PRODUCT DESCRIPTION CURE TYPE SHELF LIFE CURE SCHEDULES RESISTIVITY

Electrically insulative, one-component LOCTITE solvent-free product for die attach ABLESTIK Heat 12 months @ -40°C 1 hr. @ 150°C 3.5 x 1013 applications. Ideal for either auto 84-3 dispense or screen printing. LOCTITE A hybrid chemistry die attach adhesive 30 min. ramp to 175ºC; ABLESTIK designed for PBGA, FlexBGA and for Heat 12 months @ -40°C 1.2 x 1013 hold 15 min. @ 175ºC 2025D stacking BGA packages. 10 | Medical Electronics

COB-Encapsulants

DAM

VISCOSITY PRODUCT DESCRIPTION RECOMMENDED CURE Tg °C cPs

LOCTITE Industry standard material for dam 30 min. @ 125°C or ECCOBOND applications in BGA's. Low ionics. Ideal for tall 300,000 150 90 min. @ 165°C FP 4451TD and narrow dam dimensions.

FILL

VISCOSITY PRODUCT DESCRIPTION RECOMMENDED CURE Tg °C cPs

LOCTITE High flow, industry standard fill material. Also 30 min. @ 125°C or ECCOBOND for use in cavity down BGA applications. Good 32,000 160 90 min. @ 165°C FP 4450HF for use in fine wire and low alpha applications. LOCTITE Epoxy encapsulant features very low thermal 1 hr. @ 125°C + ECCOBOND expansion while retaining syringe dispense 130,000 150 90 min. @ 165°C FP 4651 capabilities. LOCTITE High purity, liquid encapsulant for use in 1 hr. @ 120°C + ECCOBOND 80,000 50 applications using lead-free solder. 120 min. @ 165°C FP 4802

GLOB TOPS: GENERAL

PRODUCT DESCRIPTION POT LIFE @ 25°C CURE SCHEDULE Tg °C

LOCTITE High glob formulation with low CTE and ECCOBOND low ionic content. Ideal for more harsh 25 days 4 - 6 hrs. @ 125°C 125 EO 1062 environment applications. LOCTITE One-component, high performance epoxy ECCOBOND encapsulant with high Tg and low extractable 30 days 5 min. @ 140°C 135 EO 1072 ionics. Short cure cycle. LOCTITE High purity, low stress glob top semiconductor ECCOBOND encapsulant with excellent moisture resistance 2 days 3 hrs. @ 150°C 171 FP 4460 and working life. Medical Electronics | 11

PCB Protection

CONFORMAL COATINGS

VISCOSITY PRODUCT DESCRIPTION RESIN TYPE CURE SCHEDULE cPs

20 sec. @ 70 mW/cm2 + LOCTITE Repairable, solvent-free, medium viscosity, UV/moisture cure Silicone 600 72 hrs. @ 5293 silicone suited to brush, dip and selective coating. One-Component room temperature LOCTITE Heat cure silicone can be applied with brush, dip, or spray. Silicone 200 Heat 7 min. @ 125°C 5296 High reliability for automotive. Clear. One-Component LOCTITE Flexible solvent-based, one-component urethane coating. Urethane STYCAST 350 2 hrs. @ 60°C Provides good thermal shock resistance. MIL-I-46058C. One-Component PC 18M Solvent-free , 100% solids, one-component, dual UV cure LOCTITE and secondary moisture cure conformal coating providing Urethane Acrylate 5 sec. UV + 4 days @ STYCAST 120 excellent protection against moisture and other harsh One-Component room temperature UV 7993 environments.

LOW PRESSURE MOLDING VISCOSITY @ OPERATING SOFETENING CTE ABOVE TG SHORE A ELONGATION AT PRODUCT DESCRIPTION 210°C MPA.S Tg °C TEMP, °C POINT, °C (PPM/°C) HARDNESS BREAK, % cP Moldable polyamide with excellent adhesion to tough substrates. Great flexibility offers MACROMELT incredible strain relief on -40 to 130 3,200 150 to 160 -37 193 79 570 MM 6208 cables and wires. Ideal for encapsulation of heat producing components in appliance and consumer electronics. UL RTI 95°C. Hot melt adhesive for general assembly appications in cable MACROMELT industry, especially for -20 to 120 10,500 151 to 161 -20 N/A 90 Approx. 400 Q 5353 bonding and coating polypropylene and other polyolefins. 12 | Medical Electronics

Solder Materials

PASTES-Pb-FREE HALIDE-FREE METAL PARTICLE SIZE IPC TACK IPC/J-STD-004B PRODUCT DESCRIPTION ALLOY LOADING APPLICATION DISTRIBUTION (g/MM2) CLASSIFICATION (% WEIGHT) A halide-free, no-clean, Pb-free solder paste that has excellent humidity resistance and a broad process window for both reflow and printing. Offers high LOCTITE 90iSC (Hi-Rel)* tack to resist component movement AGS (type 3) 1.8 Printing MULTICORE 96SC (SAC387) 88.5 ROL0 during high-speed placement, long printer DAP (type 4) 2.3 25-150mms-1 LF318 97SC (SAC305) abandon times and excellent solderability over a wide range of reflow profiles in air and N2 reflow ovens and across a wide range of surface finishes.

PASTES-Pb-FREE HALOGEN FREE METAL PARTICLE SIZE JIS TACK IPC/J-STD-004B PRODUCT DESCRIPTION ALLOY LOADING APPLICATION DISTRIBUTION (gF) CLASSIFICATION (% WEIGHT)

Halogen-free, no-clean, low voiding Pb- free solder paste. Excellent wetting to a LOCTITE broad range of metallization. Wide process 90iSC (Hi-Rel)* AGS (type 3) Printing MULTICORE 88.5 62 ROL0 window for printing amd minimal slump 97SC (SAC305) DAP (type 4) 40 -120mms-1 HF 212 with abandon time of 1 hour. Optimize for long soak reflow. Halogen-free, no-clean, Pb-free solder LOCTITE paste shows excellent humidity resistance 90iSC (Hi-Rel)* AGS (type 3) Printing MULTICORE and solderability when reflowed in both air 96SC(SAC387) 88.5 DAP (type 4) 16 ROL0 50 -140mms-1 HF 250DP and nitrogen across a wide range of surface 97SC (SAC305) DAP+ (type 4.5) finishes including OSP copper.

PASTES-Pb-FREE WATER WASH

% METAL IPC TACK IPC/J-STD-004B PRODUCT DESCRIPTION ALLOY APPLICATION LOADING (g/MM2) CLASSIFICATION

Flux system specially formulated for lead-free alloys. High performance, water LOCTITE washable solder paste. Residues are easily 96SC (SAC387) Printing MULTICORE 87 0.8 ORH1 removed with DI water, without the need 97SC (SAC305) 25-100mms-1 WS 300 for a saponifier. Good open time with excellent print definition and soldering.

* High reliability. Medical Electronics | 13

PASTES-Sn-Pb NO CLEAN

% METAL IPC TACK IPC/J-STD-004B PRODUCT DESCRIPTION ALLOY APPLICATION LOADING (g/MM2) CLASSIFICATION

High activity, soft residue, colorless, halide- free, no-clean solder paste that displays LOCTITE outstanding resistance to high temperature Sn62/Sn63/63S4 Printing MULTICORE 89.5 1.6 ROL0 and humidity environments. Suitable for a (anti-tombstoning) 25-150mms-1 MP 218 large range of assembly processes, including rheo pump, proflow, large high-den.

LIQUID FLUXES-NO-CLEAN

SOLIDS ACID VALUE IPC/J-STD-004B PRODUCT DESCRIPTION APPLICATION CONTENT (%) (MG KOH/G) CLASSIFICATION

LOCTITE Sustained activity in high preheats for dual wave and lead-free MULTICORE processes. High PTH fill, low residues. High reliability. Solvent- 3.5 20 Spray ROL0 MF 388 based flux may be thinned with IPA. Higher solids, halide-free flux for better wetting on reduced LOCTITE solderability surfaces and to minimize bridging on complex MULTICORE 6.0 40 Spray/Foam ROM0 geometries. Fully lead-free and dual wave compatible. Solvent- MFR 301 based flux may be thinned with IPA.

WIRES-HALOGEN-FREE

ALLOY ALLOY IPC/J-STD-004B PRODUCT DESCRIPTION (SnPb) (Pb-FREE) CLASSIFICATION

LOCTITE Sn60 96SC (SAC387) Halide-free, no-clean, clear residue, cored solder wire with MULTICORE Sn62 97SC (SAC305) ROL0 increased flux content for improved wetting. C 400 Sn63 99C (SnCu)

WIRES-WATER WASH

ALLOY ALLOY IPC/J-STD-004B PRODUCT DESCRIPTION (SnPb) (Pb-FREE) CLASSIFICATION

LOCTITE Sn60 96SC (SAC387) High activity, water washable-flux cored solder wire with MULTICORE Sn62 97SC (SAC305) ORH1 excellent wetting on difficult substrates. HYDRO X Sn63 99C (SnCu) 14 | Medical Electronics

Underfills

CAPILLARY FLOW-NON-WORKABLE

PRODUCT DESCRIPTION VISCOSITY cPs POT LIFE @25°C RECOMMENDED CURE

LOCTITE Filler filled non-reworkable, high reliability with 10 mm filler ECCOBOND 3,252 4 days @ 25 ºC 3.5 min. @ 150ºC size. E 1216M LOCTITE A snap curable lower CTE Uunderfill for flip chip for rigid ECCOBOND 10,000 24 hr. @ 25 ºC 7 min. @ 160ºC laminate and ceramic. FP 4531 LOCTITE Reworkable, snap cure, void free, fast flowing underfill, ECCOBOND which also provides excellent adhesion and reliability 1,100 10 days 10 min. @ 110°C XE 1218 benefits.

CAPILLARY FLOW-REWORKABLE

PRODUCT DESCRIPTION VISCOSITY cP POT LIFE @25°C RECOMMENDED CURE

LOCTITE ECCOBOND Reworkable, epoxy underfill for CSP and BGA applications. 394 3 days ≤8 min. @ 130°C UF 3810*

EDGEBOND

CURE VISCOSITY PRODUCT DESCRIPTION CURE TYPE COLOR POT LIFE SHELF LIFE SCHEDULES cPs

LOCTITE 14 days 20 min. @ 80° ECCOBOND Drive IC Chip reinforcement after drop test. Heat Cure Black 15,000 @ room 1 year @ -40°C 60 min. @ 60° 3128 temperature LOCTITE UV curable edgebond designed for bonding < 7 days Opaque >30 sec. @ 100 m/ ECCOBOND various types of electronic components on UV Cure 9,595 @ room N/A White Wcm2 3707** a PCB. temperature

* High Tg. ** UV cure. Medical Electronics | 15

Across The Board

CSP Underfills Encapsulants (Cornerbond) (Dam & Fill)

Non-Conductive Electrically Pastes Conductive Pastes Gasketing Potting Conformal Compounds Coatings

Low Pressure Molding

Printed Sealants Inks Surface Mount Adhesives Thermal Management Materials

Solder Materials Assembly Film Adhesives AMERICAS ASIA-PACIFIC MALAYSIA Henkel (Malaysia) Sdn Bhd HEADQUARTERS: CHINA Lot 973, Jalan Kampung Baru Hicom UNITED STATES No. 332 Meigui South Road Persiaran Tengku Ampuan, Lion Industrial Henkel Electronic Materials LLC WaiGaoQiao Free Trade Zone Park 14000 Jamboree Road Shanghai 200131, P.R. China Section 26, 40400 Shah Alam Irvine, CA 92606 Tel: +86.21.3898.4800 Selangor Darul Ehsan USA Fax: +86.21.5048.4169 Tel: +603-51926200 Tel: +1.714.368.8000 Fax: +603-51926211 Tel: +1.800.562.8483 Henkel Huawei Electronics CO. LTD Customer Support: +1.888.943.6535 Songtiao Industrial Park Lianyungang TAIWAN Fax: +1.714.368.2265 Jiangsu Province 222006 China Henkel Taiwan Ltd Tel: +86.518.8515.5336 Room A4, 19F-1, No.6, Sihwei 3rd Rd, Henkel Electronic Materials LLC Fax: +86.518.8515.3801 Lingya Dist., Kaohsiung, Taiwan 20021 Susana Road Tel: 886-7-335-7970 Rancho Dominguez, CA 90221 JAPAN Fax: 886-7-335-1057 USA Henkel Japan Ltd. Tel: +1.310.764.4600 27-7, Shin Isogo-cho EUROPE Fax: +1.310.605.2274 Isogo-ku Yokohama, 235-0017 Japan BELGIUM BRAZIL Tel: +81.45.758.1800 Henkel Electronic Materials (Belgium) N.V. Henkel Brazil Nijverheidsstraat 7 B-2260 Westerlo Av. Prof. Vernon Krieble, 91 KOREA Tel: +32.1457.5611 06690-250 Itapevi, Henkel Technologies (Korea) Ltd. Fax: +32.1458.5530 Sao Paulo, Brazil 6th Floor Tel: +55.11.3205.7000 Dae Ryung Techno Town II 569-21 Gasan-dong, Geumcheon-gu, Seoul 153-771 Across the Board, Korea Around the Globe. Tel: +82.2.6675.8000 www.henkel.com/electronics

Except as otherwise noted, all marks are trademarks and/or registered trademarks of Henkel and/or its affiliates in the U.S. and elsewhere. © Henkel Corporation, 2013. All rights reserved. 9786/LT-5892 (1/13)