Intel® Omni-Path Software — Release Notes for V10.8.0.2
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Allgemeines Abkürzungsverzeichnis
Allgemeines Abkürzungsverzeichnis L. -
Dell EMC Poweredge T340 Technical Guide
Dell EMC PowerEdge T340 Technical Guide Regulatory Model: E60S Regulatory Type: E60S001 Dec. 2020 Rev. A07 Notes, cautions, and warnings NOTE: A NOTE indicates important information that helps you make better use of your product. CAUTION: A CAUTION indicates either potential damage to hardware or loss of data and tells you how to avoid the problem. WARNING: A WARNING indicates a potential for property damage, personal injury, or death. © 2018 - 2020 Dell Inc. or its subsidiaries. All rights reserved. Dell, EMC, and other trademarks are trademarks of Dell Inc. or its subsidiaries. Other trademarks may be trademarks of their respective owners. 1 Product Overview Topics: • Introduction • New technologies Introduction The Dell EMC PowerEdge T340 is the reliable, easy to manage, and scalable 1-socket tower server for growing businesses and remote offices/ branch offices. New technologies The PowerEdge T340 equipped with Intel® Xeon® E-2100 and E-2200 product family processors support to help run applications faster and support for full-feature remote management (iDRAC9). The T340 is versatile enough to address many customer segments and workloads. Target workloads include ● Small and medium businesses and organizations: Collaboration/sharing productivity applications, databases, web serving, backup/recovery, and mail and messaging. ● ROBO: Applications and workloads specific to the particular industry, e.g. Retail, Healthcare, Finance, Education, etc. The following table shows the list of new technologies offered by the PowerEdge T340: New Technologies Detailed Descriptions Intel® C246 series chipset Please refer to the chipset section for details. Intel® Xeon® processor E- 2100 and E-2200 Product The Intel® processor that works with Intel® C246 series Family chipset. -
Intel® Omni-Path Architecture (Intel® OPA) for Machine Learning
Big Data ® The Intel Omni-Path Architecture (OPA) for Machine Learning Big Data Sponsored by Intel Srini Chari, Ph.D., MBA and M. R. Pamidi Ph.D. December 2017 mailto:[email protected] Executive Summary Machine Learning (ML), a major component of Artificial Intelligence (AI), is rapidly evolving and significantly improving growth, profits and operational efficiencies in virtually every industry. This is being driven – in large part – by continuing improvements in High Performance Computing (HPC) systems and related innovations in software and algorithms to harness these HPC systems. However, there are several barriers to implement Machine Learning (particularly Deep Learning – DL, a subset of ML) at scale: • It is hard for HPC systems to perform and scale to handle the massive growth of the volume, velocity and variety of data that must be processed. • Implementing DL requires deploying several technologies: applications, frameworks, libraries, development tools and reliable HPC processors, fabrics and storage. This is www.cabotpartners.com hard, laborious and very time-consuming. • Training followed by Inference are two separate ML steps. Training traditionally took days/weeks, whereas Inference was near real-time. Increasingly, to make more accurate inferences, faster re-Training on new data is required. So, Training must now be done in a few hours. This requires novel parallel computing methods and large-scale high- performance systems/fabrics. To help clients overcome these barriers and unleash AI/ML innovation, Intel provides a comprehensive ML solution stack with multiple technology options. Intel’s pioneering research in parallel ML algorithms and the Intel® Omni-Path Architecture (OPA) fabric minimize communications overhead and improve ML computational efficiency at scale. -
3. System Management Bus
Input/Output Systems and Peripheral Devices 1 3. SYSTEM MANAGEMENT BUS This laboratory work presents the System Management Bus (SMBus). After an over- view of SMBus, bit and data transfers are described, the bus arbitration procedure is present- ed, the differences between SMBus and the I2C bus are highlighted, and several command protocols are detailed. Next, the Intel SMBus controller is presented, including its registers and commands, as well as its use with I2C devices. The applications aim to detect the devices connected to the computer’s SMBus, read the contents of SPD memories present in the sys- tem, and decode the contents of these memories. 3.1. Overview of SMBus System Management Bus (SMBus) is a simple serial bus with only two signal lines. This bus can be used for communication between various system devices and between these devices and the rest of a system. The operating principles of SMBus are similar to those of the I2C bus. There are, however, several differences between the two buses, differences which will be presented later. SMBus represents a control bus for system management and power management op- erations. A system may use the SMBus to transfer messages to and from various devices in- stead of using individual control lines, which allows to reduce pin count and interconnection wires. A device may use the SMBus to provide manufacturer information, provide the device model number, report different types of errors, accept control parameters, and return the de- vice status. SMBus was initially proposed by Intel as a link between an intelligent battery, a charger for the battery and a microcontroller that communicates with the rest of the system. -
Intel Server Board SE7320EP2 and SE7525RP2
Intel® Server Board SE7320EP2 and SE7525RP2 Tested Hardware and Operating System List Revision 1.0 June, 2005 Enterprise Platforms and Services Marketing Revision History IntelP®P Server Board SE7320EP2 and SE7525RP2 Revision History Revision Date Number Modifications June 2005 1.0 First Release ii Revision 1.0 IntelP®P Server Board SE7320EP2 and SE7525RP2 Disclaimers Disclaimers THE INFORMATION IN THIS DOCUMENT IS PROVIDED "AS IS" WITH NO WARRANTIES WHATSOEVER, INCLUDING ANY WARRANTY OF MERCHANTABILITY, FITNESS FOR ANY PARTICULAR PURPOSE, OR ANY WARRANTY OTHERWISE ARISING OUT OF ANY PROPOSAL, SPECIFICATION, OR SAMPLE. Information in this document is provided in connection with Intel® products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel's Terms and Conditions of Sale for such products, Intel assumes no liability whatsoever, and Intel disclaims any express or implied warranty, relating to sale and/or use of Intel products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright or other intellectual property right. Intel products are not intended for use in medical, life saving, or life sustaining applications. Intel retains the right to make changes to its test specifications at any time, without notice. The hardware vendor remains solely responsible for the design, sale and functionality of its product, including any liability arising from product infringement or product warranty. Copyright © Intel Corporation 2005. All rights reserved. Intel, the Intel logo, and EtherExpress are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the United States and other countries. -
EPC612D8A-TB EPC612D8A EPC612D8 User Manual
EPC612D8A-TB EPC612D8A EPC612D8 User Manual Version 1.1 Published August 2016 Copyright©2016 ASRock Rack INC. All rights reserved. Version 1.1 Published October 2016 Copyright©2016 ASRock Rack Inc. All rights reserved. Copyright Notice: No part of this documentation may be reproduced, transcribed, transmitted, or translated in any language, in any form or by any means, except duplication of documentation by the purchaser for backup purpose, without written consent of ASRock Rack Inc. Products and corporate names appearing in this documentation may or may not be registered trademarks or copyrights of their respective companies, and are used only for identification or explanation and to the owners’ benefit, without intent to infringe. Disclaimer: Specifications and information contained in this documentation are furnished for informational use only and subject to change without notice, and should not be constructed as a commitment by ASRock Rack. ASRock Rack assumes no responsibility for any errors or omissions that may appear in this documentation. With respect to the contents of this documentation, ASRock Rack does not provide warranty of any kind, either expressed or implied, including but not limited to the implied warranties or conditions of merchantability or fitness for a particular purpose. In no event shall ASRock Rack, its directors, officers, employees, or agents be liable for any indirect, special, incidental, or consequential damages (including damages for loss of profits, loss of business, loss of data, interruption of business and the like), even if ASRock Rack has been advised of the possibility of such damages arising from any defect or error in the documentation or product. -
Intel® Omni-Path Fabric Software in Red Hat* Enterprise Linux* 8.1 Release Notes
Intel® Omni-Path Fabric Software in Red Hat* Enterprise Linux* 8.1 Release Notes Rev. 3.0 April 2020 Doc. No.: K65222, Rev.: 3.0 You may not use or facilitate the use of this document in connection with any infringement or other legal analysis concerning Intel products described herein. You agree to grant Intel a non-exclusive, royalty-free license to any patent claim thereafter drafted which includes subject matter disclosed herein. No license (express or implied, by estoppel or otherwise) to any intellectual property rights is granted by this document. All product plans and roadmaps are subject to change without notice. The products described may contain design defects or errors known as errata which may cause the product to deviate from published specifications. Current characterized errata are available on request. Intel technologies may require enabled hardware, software or service activation. No product or component can be absolutely secure. Your costs and results may vary. Intel, the Intel logo, and other Intel marks are trademarks of Intel Corporation or its subsidiaries. Other names and brands may be claimed as the property of others. Copyright © 2019–2020, Intel Corporation. All rights reserved. Intel® Omni-Path Fabric Software in Red Hat* Enterprise Linux* 8.1 Release Notes April 2020 2 Doc. No.: K65222, Rev.: 3.0 Contents—Intel® Omni-Path Fabric Contents 1.0 Overview of the Release............................................................................................... 5 1.1 Audience.............................................................................................................. -
Pro Processor Workstation Performance Brief
Pentium Pro Processor Workstation Performance Brief June 1997 Order Number: 242999-003 Pentium® Pro Processor Workstation Performance Brief Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel's Terms and Conditions of Sale for such products, Intel assumes no liability whatsoever, and Intel disclaims any express or implied warranty, relating to sale and/or use of Intel products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright or other intellectual property right. Intel products are not intended for use in medical, life saving, or life sustaining applications. Intel may make changes to specifications and product descriptions at any time, without notice. Designers must not rely on the absence or characteristics of any features or instructions marked "reserved" or "undefined." Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them. The Pentium® Pro processor may contain design defects or errors known as errata which may cause the product to deviate from published specifications. Current characterized errata are available on request. Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order. Copies of documents which have an ordering number and are referenced in this document, or other Intel literature, may be obtained from: Intel Corporation P.O. Box 7641 Mt. Prospect IL 60056-7641 or call 1-800-879-4683 or visit Intel’s website at http:\\www.intel.com Copyright © Intel Corporation 1996, 1997. -
SBIR Program Document
Topic Index and Description A20-101 Continuous Flow Recrystallization of Energetic Nitramines A20-102 Deep Neural Network Learning Based Tools for Embedded Systems Under Side Channel Attacks A20-103 Beyond Li-Ion Batteries in Electric Vehicles (EV) A20-104 Wireless Power transfer A20-105 Direct Wall Shear Stress Measurement for Rotor Blades A20-106 Electronically-Tunable, Low Loss Microwave Thin-film Ferroelectric Phase-Shifter A20-107 Automated Imagery Annotation and Segmentation for Military Tactical Objects A20-108 Multi-Solution Precision Location Determination System to be Operational in a Global Positioning System (GPS) Denied Environment for Static, Dynamic and Autonomous Systems under Test A20-109 Environmentally Adaptive Free-Space Optical Communication A20-110 Localized High Bandwidth Wireless Secure Mesh Network A20-111 Non-Destructive Evaluation of Bonded Interface of Cold Spray Additive Repair A20-112 Compact, High Performance Engines for Air Launched Effects UAS A20-113 Optical Based Health Usage and Monitoring System (HUMS) A20-114 3-D Microfabrication for In-Plane Optical MEMS Inertial Sensors A20-115 Using Artificial Intelligence to Optimize Missile Sustainment Trade-offs A20-116 Distributed Beamforming for Non-Developmental Waveforms A20-117 Lens Antennas for Resilient Satellite Communications (SATCOM) on Ground Tactical Vehicles A20-118 Novel, Low SWaP-C Unattended Ground Sensors for Relevant SA in A2AD Environments A20-119 Efficient Near Field Charge Transfer Mediated Infrared Detectors A20-120 Very Small Pixel Uncooled -
Dell EMC Poweredge C4140 Technical Guide
Dell EMC PowerEdge C4140 Technical Guide Regulatory Model: E53S Series Regulatory Type: E53S001 Notes, cautions, and warnings NOTE: A NOTE indicates important information that helps you make better use of your product. CAUTION: A CAUTION indicates either potential damage to hardware or loss of data and tells you how to avoid the problem. WARNING: A WARNING indicates a potential for property damage, personal injury, or death. © 2017 - 2019 Dell Inc. or its subsidiaries. All rights reserved. Dell, EMC, and other trademarks are trademarks of Dell Inc. or its subsidiaries. Other trademarks may be trademarks of their respective owners. 2019 - 09 Rev. A00 Contents 1 System overview ......................................................................................................................... 5 Introduction............................................................................................................................................................................ 5 New technologies.................................................................................................................................................................. 5 2 System features...........................................................................................................................7 Specifications......................................................................................................................................................................... 7 Product comparison............................................................................................................................................................. -
Intel® Omni-Path Architecture Overview-Partner.Sales.Training
Intel® Omni-Path Architecture: Overview August 2017 Legal Notices and Disclaimers INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. EXCEPT AS PROVIDED IN INTEL’S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY RELATING TO SALE AND/OR USE OF INTEL PRODUCTS, INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT, OR OTHER INTELLECTUAL PROPERTY RIGHT. Intel products are not intended for use in medical, life-saving, life- sustaining, critical control or safety systems, or in nuclear facility applications. Intel products may contain design defects or errors known as errata which may cause the product to deviate from published specifications. Current characterized errata are available on request. Intel may make changes to dates, specifications, product descriptions, and plans referenced in this document at any time, without notice. This document may contain information on products in the design phase of development. The information herein is subject to change without notice. Do not finalize a design with this information. Designers must not rely on the absence or characteristics of any features or instructions marked "reserved" or "undefined." Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them. Intel Corporation or its subsidiaries in the United States and other countries may have patents or pending patent applications, trademarks, copyrights, or other intellectual property rights that relate to the presented subject matter. The furnishing of documents and other materials and information does not provide any license, express or implied, by estoppel or otherwise, to any such patents, trademarks, copyrights, or other intellectual property rights. -
System Management Bus (Smbus) Specification Version 2.0
System Management Bus (SMBus) Specification Version 2.0 System Management Bus (SMBus) Specification Version 2.0 August 3, 2000 SBS Implementers Forum Copyright 1994, 1995, 1998, 2000 Duracell, Inc., Energizer Power Systems, Inc., Fujitsu, Ltd., Intel Corporation, Linear Technology Inc., Maxim Integrated Products, Mitsubishi Electric Semiconductor Company, PowerSmart, Inc., Toshiba Battery Co. Ltd., Unitrode Corporation, USAR Systems, Inc. All rights reserved. SBS Implementers Forum 1 System Management Bus (SMBus) Specification Version 2.0 THIS SPECIFICATION IS PROVIDED “AS IS” WITH NO WARRANTIES WHATSOEVER, WHETHER EXPRESS, IMPLIED OR STATUTORY, INCLUDING BUT NOT LIMITED TO ANY WARRANTY OF MERCHANTABILITY, NONINFRINGEMENT OR FITNESS FOR ANY PARTICULAR PURPOSE, OR ANY WARRANTY OTHERWISE ARISING OUT OF ANY PROPOSAL, SPECIFICATION OR SAMPLE. IN NO EVENT WILL ANY SPECIFICATION CO-OWNER BE LIABLE TO ANY OTHER PARTY FOR ANY LOSS OF PROFITS, LOSS OF USE, INCIDENTAL, CONSEQUENTIAL, INDIRECT OR SPECIAL DAMAGES ARISING OUT OF THIS SPECIFICATION, WHETHER OR NOT SUCH PARTY HAD ADVANCE NOTICE OF THE POSSIBILITY OF SUCH DAMAGES. FURTHER, NO WARRANTY OR REPRESENTATION IS MADE OR IMPLIED RELATIVE TO FREEDOM FROM INFRINGEMENT OF ANY THIRD PARTY PATENTS WHEN PRACTICING THE SPECIFICATION. * Other product and corporate names may be trademarks of other companies and are used only for explanation and to the owner’s benefit, without intent to infringe. Revision No. Date Notes 1.0 2/15/95 General Release 1.1 12/11/98 Version 1.1 Release 2.0 8/3/00 Version 2.0 Release Questions and comments regarding this For additional information on Smart specification may be forwarded to: Battery System Specifications, visit the [email protected] SBS Implementer’s Forum (SBS-IF) at: www.sbs-forum.org SBS Implementers Forum 2 System Management Bus (SMBus) Specification Version 2.0 Table of Contents 1.