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Intel® Omni-Path Architecture Overview-Partner.Sales.Training Intel® Omni-Path Architecture: Overview August 2017 Legal Notices and Disclaimers INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. EXCEPT AS PROVIDED IN INTEL’S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY RELATING TO SALE AND/OR USE OF INTEL PRODUCTS, INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT, OR OTHER INTELLECTUAL PROPERTY RIGHT. Intel products are not intended for use in medical, life-saving, life- sustaining, critical control or safety systems, or in nuclear facility applications. Intel products may contain design defects or errors known as errata which may cause the product to deviate from published specifications. Current characterized errata are available on request. Intel may make changes to dates, specifications, product descriptions, and plans referenced in this document at any time, without notice. This document may contain information on products in the design phase of development. The information herein is subject to change without notice. Do not finalize a design with this information. Designers must not rely on the absence or characteristics of any features or instructions marked "reserved" or "undefined." Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them. Intel Corporation or its subsidiaries in the United States and other countries may have patents or pending patent applications, trademarks, copyrights, or other intellectual property rights that relate to the presented subject matter. The furnishing of documents and other materials and information does not provide any license, express or implied, by estoppel or otherwise, to any such patents, trademarks, copyrights, or other intellectual property rights. Wireless connectivity and some features may require you to purchase additional software, services or external hardware. Performance tests and ratings are measured using specific computer systems and/or components and reflect the approximate performance of Intel products as measured by those tests. Any difference in system hardware or software design or configuration may affect actual performance. Buyers should consult other sources of information to evaluate the performance of systems or components they are considering purchasing. For more information on performance tests and on the performance of Intel products, visit Intel Performance Benchmark Limitations Intel, the Intel logo are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the United States and other countries. Other names and brands may be claimed as the property of others. Copyright © 2017 Intel Corporation. All rights reserved. Intel® Omni-Path 2 Architecture Legal Disclaimer & Optimization Notice INFORMATION IN THIS DOCUMENT IS PROVIDED “AS IS”. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. INTEL ASSUMES NO LIABILITY WHATSOEVER AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO THIS INFORMATION INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. Software and workloads used in performance tests may have been optimized for performance only on Intel microprocessors. Performance tests, such as SYSmark and MobileMark, are measured using specific computer systems, components, software, operations and functions. Any change to any of those factors may cause the results to vary. You should consult other information and performance tests to assist you in fully evaluating your contemplated purchases, including the performance of that product when combined with other products. Copyright© 2017, Intel Corporation. All rights reserved. Intel, the Intel logo, Atom, Xeon, Xeon Phi, Core, VTune, and Cilk are trademarks of Intel Corporation in the U.S. and other countries. Optimization Notice Intel’s compilers may or may not optimize to the same degree for non-Intel microprocessors for optimizations that are not unique to Intel microprocessors. These optimizations include SSE2, SSE3, and SSSE3 instruction sets and other optimizations. Intel does not guarantee the availability, functionality, or effectiveness of any optimization on microprocessors not manufactured by Intel. Microprocessor-dependent optimizations in this product are intended for use with Intel microprocessors. Certain optimizations not specific to Intel microarchitecture are reserved for Intel microprocessors. Please refer to the applicable product User and Reference Guides for more information regarding the specific instruction sets covered by this notice. Notice revision #20110804 Intel® Omni-Path 3 Architecture Intel® Omni-Path Architecture (OPA) Training Agenda • Intel® OPA overview • Omni-Path performance and innovations • Sales enablement tools • Online configurator tools • Where to go for assistance Intel® Omni-Path 4 Architecture What is Intel® Omni-Path Architecture? Evolutionary Approach, Revolutionary Features, End-to-End Solution Building on the industry’s best technologies .Highly leverage existing Aries and Intel® True Scale fabric as well as OpenFabric Alliance host stack .Significant additions of Intel intellectual property .Excellent performance at an even better price/performance .Adds innovative new features and capabilities to improve performance, reliability, and QoS Robust product offerings and ecosystem .End-to-end Intel product line .>100 OEM designs1 .Strong ecosystem with 80+ Fabric Builders members 1 Source: Intel internal information. Design win count based on OEM and HPC storage vendors who are planning to offer either Intel-branded or custom switch products, along with the total number of OEM platforms that are currently planned to support custom and/or standard Intel® OPA adapters. Design win count as of November 1, 2015 and subject to change without notice based on vendor product plans. *Other names and brands may be claimed as property of others. Intel® Omni-Path 5 Architecture Intel® Omni-Path Architecture Evolutionary Approach, Revolutionary Features, End-to-End Solution HFI Adapters Edge Switches Director Switches Silicon Software Cables Single port 1U Form Factor QSFP-based OEM custom designs Open Source Third Party Vendors x8 and x16 24 and 48 port 192 and 768 port HFI and Switch ASICs Host Software and Passive Copper Fabric Manager Active Optical x16 Adapter (100 Gb/s) HFI silicon 768-port Up to 2 ports Director Switch (50 GB/s 48-port (20U chassis) total b/w) x8 Adapter Edge Switch (58 Gb/s) Switch silicon up to 48 ports 24-port “-F” 192-port (1200 GB/s Edge Switch Processor Director Switch total b/w w/integrated (7U chassis) HFI 1 Source: Intel internal information. Design win count based on OEM and HPC storage vendors who are planning to offer either Intel-branded or custom switch products, along with the total number of OEM platforms that are currently planned to support custom and/or standard Intel® OPA adapters. Design win count as of November 1, 2015 and subject to change without notice based on vendor product plans. *Other names and brands may be claimed as property of others. Intel® Omni-Path 6 Architecture Why OPA has been winning in HPC 2 HPC Performance – Major Buying Criteria . In most cases, Intel OPA has equal to or better HPC performance (latency, bandwidth, and applications) Price / Performance – Next Evaluation/Buying Point 1 . Leadership price/performance at any scale – from entry to large supercomputers . Build a better cluster – more FLOPS and storage OPA Features – Key Differentiators . Builds on key technologies from QLogic and Cray needed to support ever-increasing HPC cluster sizes & workloads . Features: CPU/Fabric Integration, HPC Optimization and Enhanced Fabric Functionality 1 Configuration assumes a 750-node cluster, and number of switch chips required is based on a full bisectional bandwidth (FBB) Fat-Tree configuration. Intel® OPA uses one fully-populated 768-port director switch, and Mellanox EDR solution uses a combination of 648-port director switches and 36-port edge switches. Mellanox component pricing from www.kernelsoftware.com, with prices as of April 4, 2017. Compute node pricing based on Dell PowerEdge R730 server from www.dell.com, with prices as of April 4, 2017. Intel® OPA pricing based on pricing from www.kernelsoftware.com as of April 4, 2017 * Other names and brands may be claimed as property of others. 2 See Performance backup slide for configuration information, Intel® Omni-Path 7 Architecture June 2017 Top500 Analysis Intel® OPA 22% more total entries Intel® OPA 30% more top 100 than EDR IB* 14 entries than EDR IB* 13 12 10 10 8 6 31 Intel® OPA 6 4 4 3 EDR IB* 38 2 1 0 0 0 Top 10 Top 15 Top 50 Top 100 Intel® OPA EDR IB* Intel® OPA 7.6% higher average Share of 100Gb Flops – 67.1PF efficiency at scale than EDR IB* OPA vs 38.7PF EDR 1 81.9% 0.8 74.3% 0.6 38.7 EDR IB* 0.4 67.1 Efficiency 0.2 Intel® OPA (Rmax/Rpeak) 0 Average efficiency on Intel® Xeon® processors www.top500.org June 2017 list *Other names and brands may be claimed as the property of others. Intel® Omni-Path 8 Architecture Intel® OPA’s Impact across Many Segments Supercomputers 100’s of Accounts Deployed Artificial HPC Cloud Intelligence Traditional HPC LRZ Enterprise R&D Intel® Omni-Path
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