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Dual-Core Intel® Xeon® Processor LV and ULV: Datasheet

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Dual-Core Intel® Xeon® Processor LV and ULV: Datasheet Dual-Core Intel® Xeon® Processor LV and ULV Datasheet November 2006 311391-003US INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL'S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. Intel may make changes to specifications and product descriptions at any time, without notice. Intel products are not intended for use in medical, life saving, life sustaining, critical control or safety systems, or in nuclear facility applications. Intel may make changes to specifications and product descriptions at any time, without notice. Designers must not rely on the absence or characteristics of any features or instructions marked “reserved” or “undefined.” Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them. The Dual-Core Intel® Xeon® Processor LV and Dual-Core Intel® Xeon® Processor ULV may contain design defects or errors known as errata which may cause the product to deviate from published specifications. Current characterized errata are available on request. Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order. Copies of documents which have an ordering number and are referenced in this document, or other Intel literature may be obtained by calling 1-800-548-4725 or by visiting Intel's website at http://www.intel.com. AnyPoint, AppChoice, BoardWatch, BunnyPeople, CablePort, Celeron, Chips, CT Media, Dialogic, DM3, EtherExpress, ETOX, FlashFile, i386, i486, i960, iCOMP, InstantIP, Intel, Intel Centrino, Intel logo, Intel386, Intel486, Intel740, IntelDX2, IntelDX4, IntelSX2, Intel Create & Share, Intel GigaBlade, Intel InBusiness, Intel Inside, Intel Inside logo, Intel NetBurst, Intel NetMerge, Intel NetStructure, Intel Play, Intel Play logo, Intel SingleDriver, Intel SpeedStep, Intel StrataFlash, Intel TeamStation, Intel Xeon, Intel XScale, IPLink, Itanium, MCS, MMX, MMX logo, Optimizer logo, OverDrive, Paragon, PC Dads, PC Parents, PDCharm, Pentium, Pentium II Xeon, Pentium III Xeon, Performance at Your Command, RemoteExpress, SmartDie, Solutions960, Sound Mark, StorageExpress, The Computer Inside., The Journey Inside, TokenExpress, VoiceBrick, VTune, and Xircom are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the United States and other countries. *Other names and brands may be claimed as the property of others. Copyright © 2006, Intel Corporation. All rights reserved. Dual-Core Intel® Xeon® Processor LV and ULV September 2006 2 Contents—Dual-Core Intel® Xeon® Processor LV and ULV Contents 1.0 Introduction ..............................................................................................................6 1.1 Terminology .......................................................................................................7 1.2 References .........................................................................................................8 2.0 Low Power Features ..................................................................................................9 2.1 Clock Control and Low Power States ......................................................................9 2.1.1 Core Low Power States ........................................................................... 10 2.1.2 Package Low Power States ...................................................................... 11 2.2 Enhanced Intel SpeedStep® Technology .............................................................. 12 2.3 Extended Halt State (C1E).................................................................................. 13 3.0 Electrical Specifications........................................................................................... 14 3.1 Front Side Bus and GTLREF ................................................................................ 14 3.2 Power and Ground Pins ...................................................................................... 14 3.3 Decoupling Guidelines........................................................................................ 14 3.3.1 VCC Decoupling...................................................................................... 14 3.3.2 FSB AGTL+ Decoupling ........................................................................... 15 3.3.3 FSB Clock (BCLK[1:0]) and Processor Clocking........................................... 15 3.3.4 Mixed Frequency in Dual Processor Systems .............................................. 15 3.3.5 Mixed Steppings in Dual Processor Systems ............................................... 15 3.4 Voltage Identification and Power Sequencing ........................................................ 15 3.5 Catastrophic Thermal Protection .......................................................................... 18 3.6 Signal Terminations and Unused Pins ................................................................... 18 3.7 FSB Frequency Select Signals (BSEL[2:0])............................................................ 18 3.8 FSB Signal Groups............................................................................................. 18 3.9 CMOS Signals ................................................................................................... 19 3.10 Test Access Port (TAP) Connection....................................................................... 20 3.11 Maximum Ratings.............................................................................................. 20 3.12 Processor DC Specifications ................................................................................ 21 4.0 Package Mechanical Specifications and Pin Information .......................................... 27 4.1 Package Mechanical Specifications ....................................................................... 27 4.1.1 Package Mechanical Drawings .................................................................. 27 4.1.2 Processor Component Keep-Out Zones ...................................................... 30 4.1.3 Package Loading Specifications ................................................................ 30 4.1.4 Processor Mass Specifications .................................................................. 30 4.2 Processor Pin-Out and Pin List............................................................................. 30 4.2.1 Alphabetical Signals Reference ................................................................. 32 5.0 Thermal Specifications and Design Considerations .................................................. 63 5.1 Thermal Specifications ....................................................................................... 64 5.1.1 Thermal Diode ....................................................................................... 64 5.1.2 Thermal Diode Offset .............................................................................. 67 5.1.3 Intel® Thermal Monitor ........................................................................... 67 5.1.4 Digital Thermal Sensor (DTS)................................................................... 69 5.1.5 Out of Specification Detection .................................................................. 69 5.1.6 PROCHOT# Signal Pin ............................................................................. 70 5.1.7 FORCEPR# Signal Pin.............................................................................. 70 5.1.8 THERMTRIP# Signal Pin .......................................................................... 70 6.0 Debug Tools Specifications ...................................................................................... 71 6.1 Logic Analyzer Interface (LAI)............................................................................. 71 6.1.1 Mechanical Considerations ....................................................................... 71 6.1.2 Electrical Considerations.......................................................................... 71 September 2006 Dual-Core Intel® Xeon® Processor LV and ULV 3 Dual-Core Intel® Xeon® Processor LV and ULV—Contents Figures 1 Package-Level Low Power States ................................................................................. 9 2 Core Low Power States..............................................................................................10 3 Processor Active VCC and ICC Load Line .....................................................................24 4 Micro-FCPGA Package Top and Bottom Views ...............................................................27 5 Micro-FCPGA Processor Package Drawing (Sheet 1).......................................................28 6 Micro-FCPGA Processor Package Drawing (Sheet 2).......................................................29 7 The Coordinates of the Processor Pins as Viewed From the Top of the Package .................31 Tables 1 Terminology ............................................................................................................. 7 2 References
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