Initial Experience with 3D Xpoint Main Memory
Total Page:16
File Type:pdf, Size:1020Kb
Load more
Recommended publications
-
Intel® Omni-Path Architecture (Intel® OPA) for Machine Learning
Big Data ® The Intel Omni-Path Architecture (OPA) for Machine Learning Big Data Sponsored by Intel Srini Chari, Ph.D., MBA and M. R. Pamidi Ph.D. December 2017 mailto:[email protected] Executive Summary Machine Learning (ML), a major component of Artificial Intelligence (AI), is rapidly evolving and significantly improving growth, profits and operational efficiencies in virtually every industry. This is being driven – in large part – by continuing improvements in High Performance Computing (HPC) systems and related innovations in software and algorithms to harness these HPC systems. However, there are several barriers to implement Machine Learning (particularly Deep Learning – DL, a subset of ML) at scale: • It is hard for HPC systems to perform and scale to handle the massive growth of the volume, velocity and variety of data that must be processed. • Implementing DL requires deploying several technologies: applications, frameworks, libraries, development tools and reliable HPC processors, fabrics and storage. This is www.cabotpartners.com hard, laborious and very time-consuming. • Training followed by Inference are two separate ML steps. Training traditionally took days/weeks, whereas Inference was near real-time. Increasingly, to make more accurate inferences, faster re-Training on new data is required. So, Training must now be done in a few hours. This requires novel parallel computing methods and large-scale high- performance systems/fabrics. To help clients overcome these barriers and unleash AI/ML innovation, Intel provides a comprehensive ML solution stack with multiple technology options. Intel’s pioneering research in parallel ML algorithms and the Intel® Omni-Path Architecture (OPA) fabric minimize communications overhead and improve ML computational efficiency at scale. -
Intel Server Board SE7320EP2 and SE7525RP2
Intel® Server Board SE7320EP2 and SE7525RP2 Tested Hardware and Operating System List Revision 1.0 June, 2005 Enterprise Platforms and Services Marketing Revision History IntelP®P Server Board SE7320EP2 and SE7525RP2 Revision History Revision Date Number Modifications June 2005 1.0 First Release ii Revision 1.0 IntelP®P Server Board SE7320EP2 and SE7525RP2 Disclaimers Disclaimers THE INFORMATION IN THIS DOCUMENT IS PROVIDED "AS IS" WITH NO WARRANTIES WHATSOEVER, INCLUDING ANY WARRANTY OF MERCHANTABILITY, FITNESS FOR ANY PARTICULAR PURPOSE, OR ANY WARRANTY OTHERWISE ARISING OUT OF ANY PROPOSAL, SPECIFICATION, OR SAMPLE. Information in this document is provided in connection with Intel® products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel's Terms and Conditions of Sale for such products, Intel assumes no liability whatsoever, and Intel disclaims any express or implied warranty, relating to sale and/or use of Intel products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright or other intellectual property right. Intel products are not intended for use in medical, life saving, or life sustaining applications. Intel retains the right to make changes to its test specifications at any time, without notice. The hardware vendor remains solely responsible for the design, sale and functionality of its product, including any liability arising from product infringement or product warranty. Copyright © Intel Corporation 2005. All rights reserved. Intel, the Intel logo, and EtherExpress are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the United States and other countries. -
Intel® Omni-Path Fabric Software in Red Hat* Enterprise Linux* 8.1 Release Notes
Intel® Omni-Path Fabric Software in Red Hat* Enterprise Linux* 8.1 Release Notes Rev. 3.0 April 2020 Doc. No.: K65222, Rev.: 3.0 You may not use or facilitate the use of this document in connection with any infringement or other legal analysis concerning Intel products described herein. You agree to grant Intel a non-exclusive, royalty-free license to any patent claim thereafter drafted which includes subject matter disclosed herein. No license (express or implied, by estoppel or otherwise) to any intellectual property rights is granted by this document. All product plans and roadmaps are subject to change without notice. The products described may contain design defects or errors known as errata which may cause the product to deviate from published specifications. Current characterized errata are available on request. Intel technologies may require enabled hardware, software or service activation. No product or component can be absolutely secure. Your costs and results may vary. Intel, the Intel logo, and other Intel marks are trademarks of Intel Corporation or its subsidiaries. Other names and brands may be claimed as the property of others. Copyright © 2019–2020, Intel Corporation. All rights reserved. Intel® Omni-Path Fabric Software in Red Hat* Enterprise Linux* 8.1 Release Notes April 2020 2 Doc. No.: K65222, Rev.: 3.0 Contents—Intel® Omni-Path Fabric Contents 1.0 Overview of the Release............................................................................................... 5 1.1 Audience.............................................................................................................. -
Pro Processor Workstation Performance Brief
Pentium Pro Processor Workstation Performance Brief June 1997 Order Number: 242999-003 Pentium® Pro Processor Workstation Performance Brief Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel's Terms and Conditions of Sale for such products, Intel assumes no liability whatsoever, and Intel disclaims any express or implied warranty, relating to sale and/or use of Intel products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright or other intellectual property right. Intel products are not intended for use in medical, life saving, or life sustaining applications. Intel may make changes to specifications and product descriptions at any time, without notice. Designers must not rely on the absence or characteristics of any features or instructions marked "reserved" or "undefined." Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them. The Pentium® Pro processor may contain design defects or errors known as errata which may cause the product to deviate from published specifications. Current characterized errata are available on request. Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order. Copies of documents which have an ordering number and are referenced in this document, or other Intel literature, may be obtained from: Intel Corporation P.O. Box 7641 Mt. Prospect IL 60056-7641 or call 1-800-879-4683 or visit Intel’s website at http:\\www.intel.com Copyright © Intel Corporation 1996, 1997. -
Intel® Omni-Path Architecture Overview-Partner.Sales.Training
Intel® Omni-Path Architecture: Overview August 2017 Legal Notices and Disclaimers INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. EXCEPT AS PROVIDED IN INTEL’S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY RELATING TO SALE AND/OR USE OF INTEL PRODUCTS, INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT, OR OTHER INTELLECTUAL PROPERTY RIGHT. Intel products are not intended for use in medical, life-saving, life- sustaining, critical control or safety systems, or in nuclear facility applications. Intel products may contain design defects or errors known as errata which may cause the product to deviate from published specifications. Current characterized errata are available on request. Intel may make changes to dates, specifications, product descriptions, and plans referenced in this document at any time, without notice. This document may contain information on products in the design phase of development. The information herein is subject to change without notice. Do not finalize a design with this information. Designers must not rely on the absence or characteristics of any features or instructions marked "reserved" or "undefined." Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them. Intel Corporation or its subsidiaries in the United States and other countries may have patents or pending patent applications, trademarks, copyrights, or other intellectual property rights that relate to the presented subject matter. The furnishing of documents and other materials and information does not provide any license, express or implied, by estoppel or otherwise, to any such patents, trademarks, copyrights, or other intellectual property rights. -
Analyzing the Performance of Intel Optane DC Persistent Memory in Storage Over App Direct Mode
Front cover Analyzing the Performance of Intel Optane DC Persistent Memory in Storage over App Direct Mode Introduces DCPMM Storage over Evaluates workload latency and App Direct Mode bandwidth performance Establishes performance Illustrates scaling performance for expectations for DCPMM DCPMM populations capacities Travis Liao Tristian "Truth" Brown Jamie Chou Abstract Intel Optane DC Persistent Memory is the latest memory technology for Lenovo® ThinkSystem™ servers. This technology deviates from contemporary flash storage offerings and utilizes the ground-breaking 3D XPoint non-volatile memory technology to deliver a new level of versatile performance in a compact memory module form factor. As server storage technology continues to advance from devices behind RAID controllers to offerings closer to the processor, it is important to understand the technological differences and suitable use cases. This paper provides a look into the performance of Intel Optane DC Persistent Memory Modules configured in Storage over App Direct Mode operation. At Lenovo Press, we bring together experts to produce technical publications around topics of importance to you, providing information and best practices for using Lenovo products and solutions to solve IT challenges. See a list of our most recent publications at the Lenovo Press web site: http://lenovopress.com Do you have the latest version? We update our papers from time to time, so check whether you have the latest version of this document by clicking the Check for Updates button on the front page of the PDF. Pressing this button will take you to a web page that will tell you if you are reading the latest version of the document and give you a link to the latest if needed. -
Intel® Omni-Path Software — Release Notes for V10.9.2
Intel® Omni-Path Software Release Notes for V10.9.2 Rev. 1.0 March 2019 Doc. No.: K54191, Rev.: 1.0 You may not use or facilitate the use of this document in connection with any infringement or other legal analysis concerning Intel products described herein. You agree to grant Intel a non-exclusive, royalty-free license to any patent claim thereafter drafted which includes subject matter disclosed herein. No license (express or implied, by estoppel or otherwise) to any intellectual property rights is granted by this document. All information provided here is subject to change without notice. Contact your Intel representative to obtain the latest Intel product specifications and roadmaps. The products described may contain design defects or errors known as errata which may cause the product to deviate from published specifications. Current characterized errata are available on request. Intel technologies’ features and benefits depend on system configuration and may require enabled hardware, software or service activation. Performance varies depending on system configuration. No computer system can be absolutely secure. Check with your system manufacturer or retailer or learn more at intel.com. Intel, the Intel logo, Intel Xeon Phi, and Xeon are trademarks of Intel Corporation in the U.S. and/or other countries. *Other names and brands may be claimed as the property of others. Copyright © 2019, Intel Corporation. All rights reserved. Intel® Omni-Path Software Release Notes for V10.9.2 March 2019 2 Doc. No.: K54191, Rev.: 1.0 Contents—Intel® Omni-Path Fabric Contents 1.0 Overview of the Release............................................................................................... 5 1.1 Audience.............................................................................................................. -
Intel® Omni-Path Software — Release Notes for V10.8.0.2
Intel® Omni-Path Software Release Notes for V10.8.0.2 Rev. 1.0 January 2019 Doc. No.: K48500, Rev.: 1.0 You may not use or facilitate the use of this document in connection with any infringement or other legal analysis concerning Intel products described herein. You agree to grant Intel a non-exclusive, royalty-free license to any patent claim thereafter drafted which includes subject matter disclosed herein. No license (express or implied, by estoppel or otherwise) to any intellectual property rights is granted by this document. All information provided here is subject to change without notice. Contact your Intel representative to obtain the latest Intel product specifications and roadmaps. The products described may contain design defects or errors known as errata which may cause the product to deviate from published specifications. Current characterized errata are available on request. Intel technologies’ features and benefits depend on system configuration and may require enabled hardware, software or service activation. Performance varies depending on system configuration. No computer system can be absolutely secure. Check with your system manufacturer or retailer or learn more at intel.com. Intel, the Intel logo, Intel Xeon Phi, and Xeon are trademarks of Intel Corporation in the U.S. and/or other countries. *Other names and brands may be claimed as the property of others. Copyright © 2019, Intel Corporation. All rights reserved. Intel® Omni-Path Software Release Notes for V10.8.0.2 January 2019 2 Doc. No.: K48500, Rev.: 1.0 Contents—Intel® Omni-Path Fabric Contents 1.0 Overview of the Release............................................................................................... 5 1.1 Important Information........................................................................................... -
After the 3D Xpoint Take-Off, Emerging NVM Keeps Growing1
Press Release February 26, 2020 LYON, France After the 3D XPoint take-off, emerging NVM keeps growing1 OUTLINES: PCM2-based persistent memory hit the market in 2019. And embedded STT-MRAM3 has finally moved into mass production. The overall emerging NVM4 market is poised to reach over US$6 billion in 2025. The embedded business will account for 1/3 of it. Foundries and IDMs5 are accelerating the adoption of embedded emerging NVMs at advanced technology nodes. Rise of in-memory computing is triggering new players’ dynamics. “The stand-alone emerging NVM market will grow to over US$4 billion in 2025”, explains Simone Bertolazzi, PhD. Technology & Market Analyst at Yole Développement (Yole). “It will be driven by two key segments: low-latency storage (enterprise and client drives) and persistent memory (NVDIMMs).” 1 Extracted from Emerging Non-Volatile Memory, Yole Développement, 2020 2 PCM: Phase-Change Memory 3 STT- MRAM : Spin-Transfer Torque Magnetoresistive RAM 4 NVM: Non-Volatile Memory 5 IDM : Integrated Design Manufacturer Press Release The embedded emerging NVM entered the takeoff phase. The embedded market segment is showing a 118% CAGR6 between 2019 and 2025, reaching more than US$2 billion by 2025. In this dynamic context, the market research and strategy consulting company Yole, releases its annual memory report, Emerging Non-Volatile Memory. The 2020 edition presents an overview of the semiconductor memory market with stand-alone7 and embedded memories8. Yole’s memory team proposes today a deep understanding of emerging NVM applications with related market drivers, challenges, technology roadmap, players, and main trends. This report also offers detailed 2019-2025 market forecasts. -
Transforming Business with Data
WHITE PAPER Transforming Business with Data Enterprise infrastructure is pushing the boundaries of data in scope, size, and speed. The right infrastructure tools can help you make better business decisions by getting more value from data. Writing about the data explosion is the IT equivalent of “it was a dark and stormy night.” At this point, it’s an old narrative that misstates the challenge and actually understates the problem. Yes, there’s more data, but there are also more types of data, which further complicates how to store, activate, and monetize this modern-day resource that promises to transform companies and industries. Advanced analytics capabilities, like artificial intelligence (AI) and machine learning, make the machine-generated unstructured and semi-structured data coming from the Internet of Things (IoT) accessible and, thus, valuable. But many companies are still not realizing the full potential of even their conventional, structured data. Less than half of companies’ structured data is being actively used by decision-makers, and less than one percent of companies’ unstructured data is being analyzed or used at all.1 This data needs to be activated through better storage technologies so that companies can realize the full value of their data. One way in which Intel helps activate data is by innovatively disrupting data centers’ data tiers. Traditionally, IT organizations have faced a stark tradeoff with their storage: faster storage was much more expensive than slower storage. It only made economic sense to place the most-important, most-accessed data in fast storage. But if storage can be made faster—particularly less expensive storage— without a proportionate rise in price, more data can be analyzed and acted upon. -
Arxiv:1908.03583V1 [Cs.DC] 9 Aug 2019 1 Introduction
An Empirical Guide to the Behavior and Use of Scalable Persistent Memory Jian Yang Juno Kim Morteza Hoseinzadeh Joseph Izraelevitz Steven Swanson* Nonvolatile Systems Laboratory Computer Science & Engineering University of California, San Diego August 13, 2019 Abstract After nearly a decade of anticipation, scalable nonvolatile memory DIMMs are finally commercially available with the release of Intel’s 3D XPoint DIMM. This new nonvolatile DIMM supports byte-granularity accesses with access times on the order of DRAM, while also providing data storage that survives power outages. Researchers have not idly waited for real nonvolatile DIMMs (NVDIMMs) to arrive. Over the past decade, they have written a slew of papers proposing new programming models, file systems, libraries, and applications built to exploit the performance and flexibility that NVDIMMs promised to deliver. Those papers drew conclusions and made design decisions without detailed knowledge of how real NVDIMMs would behave or how industry would integrate them into computer architectures. Now that 3D XPoint NVDIMMs are actually here, we can provide detailed performance numbers, concrete guidance for programmers on these systems, reevaluate prior art for performance, and reoptimize persistent memory software for the real 3D XPoint DIMM. In this paper, we explore the performance properties and characteristics of Intel’s new 3D XPoint DIMM at the micro and macro level. First, we investigate the basic characteristics of the device, taking special note of the particular ways in which its performance is peculiar relative to traditional DRAM or other past methods used to emulate NVM. From these observations, we recommend a set of best practices to maximize the performance of the device. -
Intel® Optane™ DC Persistent Memory – Telecom Use Case Workloads
Application note Intel Corporation Intel® Optane™ DC Persistent Memory – Telecom Use Case Workloads Author 1 Introduction David Kennedy This document provides an overview of Intel® Optane™ DC persistent memory for 2nd generation Intel® Xeon® Scalable processors (formerly Cascade Lake). The document contains a description of the technology and discusses some use cases for telecom environments. The requirement for large memory footprints for artificial intelligence and media/streaming servers, as well as low latency access to large subscriber databases and routing tables in telecom networks provides a challenge for customers in deploying manageable nodes in the network. Often, instances of these databases are stored across multiple nodes, which increases the total cost of ownership and manageability costs. Also, due to the different latency requirements, there are often multiple copies of database instances across the network, plus data duplication for redundancy. Intel Optane DC persistent memory is highly beneficial for applications that require high capacity, low latency, and resiliency, which are applicable across a number of telecom specific use cases, including: • In-memory databases • Analytics • Virtualization • HPC clusters Intel Optane DC persistent memory provides the opportunity to: • Consolidate databases into smaller, easier to manage instances. • Position large datasets, such as network telemetry, right next to the CPU, directly in-memory, for faster big data analytics for network automation. • Enable a whole new class of shared, distributed data layer to enable cloud native infrastructure with ultra low latency, similar to DRAM, but without the cost of DRAM. • Cache rapidly emerging live linear video content or highest performance video-on- demand in a CDN with capacity-like storage, but performance-like memory, at a lower cost.