Intel® Omni-Path Architecture (Intel® OPA) for Machine Learning
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Mac Labs. More Creativity
Mac labs. More creativity. More engagement. More learning. Every Mac comes ready for 21st-century learning. Mac OS X Server creates the ultimate lab environment. Creativity and innovation are critical skills in the modern Mac OS X Server includes simplified tools for creating wikis and workplace, which makes them critical skills to teach today’s blogs, so students and staff can set up and manage them with students. Apple offers comprehensive lab solutions for your little or no help from IT. The Spotlight Server feature makes it school or university that will creatively engage students and easy for students collaborating on projects to find and view motivate them to take an interest in their own learning. The content stored anywhere on the network. Of course, access iLife ’09 suite of applications comes standard on every Mac, controls are built in, so they only get the search results they’re so students can immediately begin creating podcasts, editing authorised to see. Mac OS X Server also allows for real-time videos, composing music, producing photo essays and more. streaming of audio and video content, which lets everyone get right to work instead of waiting for downloads – saving major Mac or PC? Have both. storage across your network. Now one lab really can solve all your computing needs. Every Mac is powered by an Intel processor and features Launch careers from your Mac lab. Mac OS X – the world’s most advanced operating system. As an Apple Authorised Training Centre for Education, your Mac OS X comes with an amazing dual-boot feature called school can build a bridge between students and real-world Boot Camp that lets students run Windows XP or Vista natively careers. -
Integrated Step-Down Converter with SVID Interface for Intel® CPU
Product Order Technical Tools & Support & Folder Now Documents Software Community TPS53820 SLUSE33 –FEBRUARY 2020 Integrated Step-Down Converter with SVID Interface for Intel® CPU Power Supply 1 Features 3 Description The TPS53820 device is D-CAP+ mode integrated 1• Single chip to support Intel VR13.HC SVID POL applications step-down converter for low current SVID rails of Intel CPU power supply. It provides up to two outputs to • Two outputs to support VCCANA (5.5 A) and power the low current SVID rails such as VCCANA P1V8 (4 A) (5.5 A) and P1V8 (4 A). The device employs D-CAP+ • D-CAP+™ Control for Fast Transient Response mode control to provide fast load transient • Wide Input Voltage (4.5 V to 15 V) performance. Internal compensation allows ease of use and reduces external components. • Differential Remote Sense • Programmable Internal Loop Compensation The device also provides telemetry, including input voltage, output voltage, output current and • Per-Phase Cycle-by-Cycle Current Limit temperature reporting. Over voltage, over current and • Programmable Frequency from 800 kHz to 2 MHz over temperature protections are provided as well. 2 • I C System Interface for Telemetry of Voltage, The TPS53820 device is packaged in a thermally Current, Output Power, Temperature, and Fault enhanced 35-pin QFN and operates between –40°C Conditions and 125°C. • Over-Current, Over-Voltage, Over-Temperature (1) protections Table 1. Device Information • Low Quiescent Current PART NUMBER PACKAGE BODY SIZE (NOM) • 5 mm × 5 mm, 35-Pin QFN, PowerPAD Package TPS53820 RWZ (35) 5 mm × 5 mm (1) For all available packages, see the orderable addendum at 2 Applications the end of the data sheet. -
Introduction to Intel® FPGA IP Cores
Introduction to Intel® FPGA IP Cores Updated for Intel® Quartus® Prime Design Suite: 20.3 Subscribe UG-01056 | 2020.11.09 Send Feedback Latest document on the web: PDF | HTML Contents Contents 1. Introduction to Intel® FPGA IP Cores..............................................................................3 1.1. IP Catalog and Parameter Editor.............................................................................. 4 1.1.1. The Parameter Editor................................................................................. 5 1.2. Installing and Licensing Intel FPGA IP Cores.............................................................. 5 1.2.1. Intel FPGA IP Evaluation Mode.....................................................................6 1.2.2. Checking the IP License Status.................................................................... 8 1.2.3. Intel FPGA IP Versioning............................................................................. 9 1.2.4. Adding IP to IP Catalog...............................................................................9 1.3. Best Practices for Intel FPGA IP..............................................................................10 1.4. IP General Settings.............................................................................................. 11 1.5. Generating IP Cores (Intel Quartus Prime Pro Edition)...............................................12 1.5.1. IP Core Generation Output (Intel Quartus Prime Pro Edition)..........................13 1.5.2. Scripting IP Core Generation.................................................................... -
Introducing the New 11Th Gen Intel® Core™ Desktop Processors
Product Brief 11th Gen Intel® Core™ Desktop Processors Introducing the New 11th Gen Intel® Core™ Desktop Processors The 11th Gen Intel® Core™ desktop processor family puts you in control of your compute experience. It features an innovative new architecture for reimag- ined performance, immersive display and graphics for incredible visuals, and a range of options and technologies for enhanced tuning. When these advances come together, you have everything you need for fast-paced professional work, elite gaming, inspired creativity, and extreme tuning. The 11th Gen Intel® Core™ desktop processor family gives you the power to perform, compete, excel, and power your greatest contributions. Product Brief 11th Gen Intel® Core™ Desktop Processors PERFORMANCE Reimagined Performance 11th Gen Intel® Core™ desktop processors are intelligently engineered to push the boundaries of performance. The new processor core architecture transforms hardware and software efficiency and takes advantage of Intel® Deep Learning Boost to accelerate AI performance. Key platform improvements include memory support up to DDR4-3200, up to 20 CPU PCIe 4.0 lanes,1 integrated USB 3.2 Gen 2x2 (20G), and Intel® Optane™ memory H20 with SSD support.2 Together, these technologies bring the power and the intelligence you need to supercharge productivity, stay in the creative flow, and game at the highest level. Product Brief 11th Gen Intel® Core™ Desktop Processors Experience rich, stunning, seamless visuals with the high-performance graphics on 11th Gen Intel® Core™ desktop -
Intel Server Board SE7320EP2 and SE7525RP2
Intel® Server Board SE7320EP2 and SE7525RP2 Tested Hardware and Operating System List Revision 1.0 June, 2005 Enterprise Platforms and Services Marketing Revision History IntelP®P Server Board SE7320EP2 and SE7525RP2 Revision History Revision Date Number Modifications June 2005 1.0 First Release ii Revision 1.0 IntelP®P Server Board SE7320EP2 and SE7525RP2 Disclaimers Disclaimers THE INFORMATION IN THIS DOCUMENT IS PROVIDED "AS IS" WITH NO WARRANTIES WHATSOEVER, INCLUDING ANY WARRANTY OF MERCHANTABILITY, FITNESS FOR ANY PARTICULAR PURPOSE, OR ANY WARRANTY OTHERWISE ARISING OUT OF ANY PROPOSAL, SPECIFICATION, OR SAMPLE. Information in this document is provided in connection with Intel® products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel's Terms and Conditions of Sale for such products, Intel assumes no liability whatsoever, and Intel disclaims any express or implied warranty, relating to sale and/or use of Intel products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright or other intellectual property right. Intel products are not intended for use in medical, life saving, or life sustaining applications. Intel retains the right to make changes to its test specifications at any time, without notice. The hardware vendor remains solely responsible for the design, sale and functionality of its product, including any liability arising from product infringement or product warranty. Copyright © Intel Corporation 2005. All rights reserved. Intel, the Intel logo, and EtherExpress are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the United States and other countries. -
Intel® Arria® 10 Device Overview
Intel® Arria® 10 Device Overview Subscribe A10-OVERVIEW | 2020.10.20 Send Feedback Latest document on the web: PDF | HTML Contents Contents Intel® Arria® 10 Device Overview....................................................................................... 3 Key Advantages of Intel Arria 10 Devices........................................................................ 4 Summary of Intel Arria 10 Features................................................................................4 Intel Arria 10 Device Variants and Packages.....................................................................7 Intel Arria 10 GX.................................................................................................7 Intel Arria 10 GT............................................................................................... 11 Intel Arria 10 SX............................................................................................... 14 I/O Vertical Migration for Intel Arria 10 Devices.............................................................. 17 Adaptive Logic Module................................................................................................ 17 Variable-Precision DSP Block........................................................................................18 Embedded Memory Blocks........................................................................................... 20 Types of Embedded Memory............................................................................... 21 Embedded Memory Capacity in -
Intel® Omni-Path Fabric Software in Red Hat* Enterprise Linux* 8.1 Release Notes
Intel® Omni-Path Fabric Software in Red Hat* Enterprise Linux* 8.1 Release Notes Rev. 3.0 April 2020 Doc. No.: K65222, Rev.: 3.0 You may not use or facilitate the use of this document in connection with any infringement or other legal analysis concerning Intel products described herein. You agree to grant Intel a non-exclusive, royalty-free license to any patent claim thereafter drafted which includes subject matter disclosed herein. No license (express or implied, by estoppel or otherwise) to any intellectual property rights is granted by this document. All product plans and roadmaps are subject to change without notice. The products described may contain design defects or errors known as errata which may cause the product to deviate from published specifications. Current characterized errata are available on request. Intel technologies may require enabled hardware, software or service activation. No product or component can be absolutely secure. Your costs and results may vary. Intel, the Intel logo, and other Intel marks are trademarks of Intel Corporation or its subsidiaries. Other names and brands may be claimed as the property of others. Copyright © 2019–2020, Intel Corporation. All rights reserved. Intel® Omni-Path Fabric Software in Red Hat* Enterprise Linux* 8.1 Release Notes April 2020 2 Doc. No.: K65222, Rev.: 3.0 Contents—Intel® Omni-Path Fabric Contents 1.0 Overview of the Release............................................................................................... 5 1.1 Audience.............................................................................................................. -
Pro Processor Workstation Performance Brief
Pentium Pro Processor Workstation Performance Brief June 1997 Order Number: 242999-003 Pentium® Pro Processor Workstation Performance Brief Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel's Terms and Conditions of Sale for such products, Intel assumes no liability whatsoever, and Intel disclaims any express or implied warranty, relating to sale and/or use of Intel products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright or other intellectual property right. Intel products are not intended for use in medical, life saving, or life sustaining applications. Intel may make changes to specifications and product descriptions at any time, without notice. Designers must not rely on the absence or characteristics of any features or instructions marked "reserved" or "undefined." Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them. The Pentium® Pro processor may contain design defects or errors known as errata which may cause the product to deviate from published specifications. Current characterized errata are available on request. Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order. Copies of documents which have an ordering number and are referenced in this document, or other Intel literature, may be obtained from: Intel Corporation P.O. Box 7641 Mt. Prospect IL 60056-7641 or call 1-800-879-4683 or visit Intel’s website at http:\\www.intel.com Copyright © Intel Corporation 1996, 1997. -
Intel® Omni-Path Architecture Overview-Partner.Sales.Training
Intel® Omni-Path Architecture: Overview August 2017 Legal Notices and Disclaimers INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. EXCEPT AS PROVIDED IN INTEL’S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY RELATING TO SALE AND/OR USE OF INTEL PRODUCTS, INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT, OR OTHER INTELLECTUAL PROPERTY RIGHT. Intel products are not intended for use in medical, life-saving, life- sustaining, critical control or safety systems, or in nuclear facility applications. Intel products may contain design defects or errors known as errata which may cause the product to deviate from published specifications. Current characterized errata are available on request. Intel may make changes to dates, specifications, product descriptions, and plans referenced in this document at any time, without notice. This document may contain information on products in the design phase of development. The information herein is subject to change without notice. Do not finalize a design with this information. Designers must not rely on the absence or characteristics of any features or instructions marked "reserved" or "undefined." Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them. Intel Corporation or its subsidiaries in the United States and other countries may have patents or pending patent applications, trademarks, copyrights, or other intellectual property rights that relate to the presented subject matter. The furnishing of documents and other materials and information does not provide any license, express or implied, by estoppel or otherwise, to any such patents, trademarks, copyrights, or other intellectual property rights. -
4-Phase, 140-A Reference Design for Intel® Stratix® 10 GX Fpgas Using
TI Designs: PMP20176 Four-Phase, 140-A Reference Design for Intel® Stratix® 10 GX FPGAs Using TPS53647 Description Features This reference design focuses on providing a compact, • All Ceramic Output Capacitors high-performance, multiphase solution suitable for • D-CAP+™ Modulator for Superior Current-Sharing powering Intel®Stratix® 10 GX FPGAs with a specific Capabilities and Transient Response focus on the 1SG280-1IV variant. Integrated PMBus™ • Peak Efficiency of 91.5% at 400 kHz, VIN = 12 V, allows for easy output voltage setting and telemetry of V = 0.9 V, I = 60 A key design parameters. The design enables OUT OUT programming, configuration, smart VID adjustment, • Excellent Thermal Performance Under No Airflow and control of the power supply, while providing Conditions monitoring of input and output voltage, current, power, • Overvoltage, Overcurrent, and Overtemperature and temperature. TI's Fusion Digital Power™ Designer Protection is used for programming, monitoring, validation, and • PMBus Compatibility for Output Voltage Setting characterization of the FPGA power design. and Telemetry for VIN, VOUT, IOUT, and Temperature • PMBus and Pinstrapping Programming Options Resources Applications PMP20176 Design Folder • FPGA Core Rail Power TPS53647 Product Folder CSD95472Q5MC Product Folder • Ethernet Switches Fusion Digital Power • Firewalls and Routers Product Folder Designer • Telecom and Base Band Units • Test and Measurement ASK Our E2E Experts CSD95472Q5MC Smart Power Stage CSD95472Q5MC Smart Power Stage TPS53647 ® Four-Phase Stratix 10 GX Controller Core Rail CSD95472Q5MC Smart Power Stage Onboard Load Generator CSD95472Q5MC Smart Power Intel® Load Stage Slammers Copyright © 2017, Texas Instruments Incorporated An IMPORTANT NOTICE at the end of this TI reference design addresses authorized use, intellectual property matters and other important disclaimers and information. -
Performance Analysis of Intel Gen9.5 Integrated GPU Architecture
Performance Analysis of Intel Gen9.5 Integrated GPU Architecture Helder Francisco Pereira Duarte Thesis to obtain the Master of Science Degree in Electrical and Computer Engineering Supervisor(s): Doctor Aleksandar Ilic Examination Committee Chairperson: Doctor António Manuel Raminhos Cordeiro Grilo Supervisor: Doctor Aleksandar Ilic Member of the Committee: Doctor Ricardo Jorge Fernandes Chaves June 2018 Declaration I declare that this document is an original work of my own authorship and that it fulfills all the require- ments of the Code of Conduct and Good Practices of the Universidade de Lisboa. Acknowledgments I would like to thank my family and friends, whose support was paramount to the completion of this thesis, and to INESC-ID Lisboa, for providing the facilities in which this thesis was developed. In particular I would like to thank Diogo Marques for his tips that helped drive my research forward and, of course, to Prof. Aleksander for his incredible patience in dealing with me. i ii Resumo Recentemente os CPUs vemˆ equipados com placas graficas´ integradas. Este acoplamento tem o potencial de oferecer ganhos de desempenho consideraveis´ caso as ditas GPUs sejam usadas como aceleradores. No entanto, placas graficas´ integradas temˆ dificuldade em atingir os n´ıveis de desem- penho que placas discretas proporcionam devido ao menor numero´ de nucleos.´ Contudo, a sua prox- imidade com o CPU significa uma partilha de dados com menos sobrecargas associadas. Ademais, as vantagens de partilhar a hierarquia de memoria´ com o processador e o consumo de energia mais baixo que as placas discretas a` custa de desempenho permite atingir n´ıveis de eficienciaˆ energetica´ mais elevados. -
WIND RIVER INTELLIGENT DEVICE PLATFORM XT the Foundation for Building Devices That Connect to the Internet of Things
WIND RIVER INTELLIGENT DEVICE PLATFORM XT The Foundation for Building Devices That Connect to the Internet of Things The opportunities presented by the burgeoning Internet of Things (IoT) may be new, but Wind River® has been providing the intelligence that powers interconnected, automated systems for decades. Wind River Intelligent Device Platform XT is a scalable, sustainable, and secure development environment that simplifies the development, integration, and deployment of IoT gateways. It is based on Wind River industry-leading operating systems, which are standards-compliant and fully tested, as well as Wind River development tools. The platform provides device security, smart connectivity, rich network options, and device management; and it includes ready-to-use components built exclusively for developing IoT gateway applications. Intelligent Device Platform XT provides outstanding software and expertise to fuel the rapid innovation and deployment of safe, secure, and reliable intel- ligent devices through more efficient development cycles, standards-based data connec- tions, and intuitive management tools. CONNECTIVITY TOOLS ZigBee Bluetooth WWAN VPN MQTT Cloud Connector Wi MANAGEMENT nd River Integrated Development Environment T Secure Updates OMA DM, TR-069 Device Authentication Web Interface Application Signing API OpenJDK Lua VM SQLite OSGi To SECURITY ol TCG Standards Role Based Access Control Integrity Monitoring Signed Software ool s WIND RIVER OPERATING ENVIRONMENTS Trusted Secure Boot Wind River Intelligent Device Operating Platform Feature Environment Base Figure 1: Wind River Intelligent Device Platform architecture Product Note INNOVATORS START HERE. WIND RIVER INTELLIGENT DEVICE PLATFORM XT INTEL, MCAFEE, AND WIND RIVER, BETTER TOGETHER Intelligent Device Platform XT is part of Intel® Gateway Solutions for Internet of Things (IoT), a family of platforms that enables companies to seamlessly interconnect indus- trial devices and other systems into a system of systems.