Memory Devices
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Chapter 3 Semiconductor Memories
Chapter 3 Semiconductor Memories Jin-Fu Li Department of Electrical Engineering National Central University Jungli, Taiwan Outline Introduction Random Access Memories Content Addressable Memories Read Only Memories Flash Memories Advanced Reliable Systems (ARES) Lab. Jin-Fu Li, EE, NCU 2 Overview of Memory Types Semiconductor Memories Read/Write Memory or Random Access Memory (RAM) Read Only Memory (ROM) Random Access Non-Random Access Memory (RAM) Memory (RAM) •Mask (Fuse) ROM •Programmable ROM (PROM) •Erasable PROM (EPROM) •Static RAM (SRAM) •FIFO/LIFO •Electrically EPROM (EEPROM) •Dynamic RAM (DRAM) •Shift Register •Flash Memory •Register File •Content Addressable •Ferroelectric RAM (FRAM) Memory (CAM) •Magnetic RAM (MRAM) Advanced Reliable Systems (ARES) Lab. Jin-Fu Li, EE, NCU 3 Memory Elements – Memory Architecture Memory elements may be divided into the following categories Random access memory Serial access memory Content addressable memory Memory architecture 2m+k bits row decoder row decoder 2n-k words row decoder row decoder column decoder k column mux, n-bit address sense amp, 2m-bit data I/Os write buffers Advanced Reliable Systems (ARES) Lab. Jin-Fu Li, EE, NCU 4 1-D Memory Architecture S0 S0 Word0 Word0 S1 S1 Word1 Word1 S2 S2 Word2 Word2 A0 S3 S3 A1 Decoder Ak-1 Sn-2 Storage Sn-2 Wordn-2 element Wordn-2 Sn-1 Sn-1 Wordn-1 Wordn-1 m-bit m-bit Input/Output Input/Output n select signals are reduced n select signals: S0-Sn-1 to k address signals: A0-Ak-1 Advanced Reliable Systems (ARES) Lab. Jin-Fu Li, EE, NCU 5 Memory Architecture S0 Word0 Wordi-1 S1 A0 A1 Ak-1 Row Decoder Sn-1 Wordni-1 A 0 Column Decoder Aj-1 Sense Amplifier Read/Write Circuit m-bit Input/Output Advanced Reliable Systems (ARES) Lab. -
Memory & Devices
Memory & Devices Memory • Random Access Memory (vs. Serial Access Memory) • Different flavors at different levels – Physical Makeup (CMOS, DRAM) – Low Level Architectures (FPM,EDO,BEDO,SDRAM, DDR) • Cache uses SRAM: Static Random Access Memory – No refresh (6 transistors/bit vs. 1 transistor • Main Memory is DRAM: Dynamic Random Access Memory – Dynamic since needs to be refreshed periodically (1% time) – Addresses divided into 2 halves (Memory as a 2D matrix): • RAS or Row Access Strobe • CAS or Column Access Strobe Random-Access Memory (RAM) Key features – RAM is packaged as a chip. – Basic storage unit is a cell (one bit per cell). – Multiple RAM chips form a memory. Static RAM (SRAM) – Each cell stores bit with a six-transistor circuit. – Retains value indefinitely, as long as it is kept powered. – Relatively insensitive to disturbances such as electrical noise. – Faster and more expensive than DRAM. Dynamic RAM (DRAM) – Each cell stores bit with a capacitor and transistor. – Value must be refreshed every 10-100 ms. – Sensitive to disturbances. – Slower and cheaper than SRAM. Semiconductor Memory Types Static RAM • Bits stored in transistor “latches” à no capacitors! – no charge leak, no refresh needed • Pro: no refresh circuits, faster • Con: more complex construction, larger per bit more expensive transistors “switch” faster than capacitors charge ! • Cache Static RAM Structure 1 “NOT ” 1 0 six transistors per bit 1 0 (“flip flop”) 0 1 0/1 = example 0 Static RAM Operation • Transistor arrangement (flip flop) has 2 stable logic states • Write 1. signal bit line: High à 1 Low à 0 2. address line active à “switch” flip flop to stable state matching bit line • Read no need 1. -
Hard Disk Drives
37 Hard Disk Drives The last chapter introduced the general concept of an I/O device and showed you how the OS might interact with such a beast. In this chapter, we dive into more detail about one device in particular: the hard disk drive. These drives have been the main form of persistent data storage in computer systems for decades and much of the development of file sys- tem technology (coming soon) is predicated on their behavior. Thus, it is worth understanding the details of a disk’s operation before building the file system software that manages it. Many of these details are avail- able in excellent papers by Ruemmler and Wilkes [RW92] and Anderson, Dykes, and Riedel [ADR03]. CRUX: HOW TO STORE AND ACCESS DATA ON DISK How do modern hard-disk drives store data? What is the interface? How is the data actually laid out and accessed? How does disk schedul- ing improve performance? 37.1 The Interface Let’s start by understanding the interface to a modern disk drive. The basic interface for all modern drives is straightforward. The drive consists of a large number of sectors (512-byte blocks), each of which can be read or written. The sectors are numbered from 0 to n − 1 on a disk with n sectors. Thus, we can view the disk as an array of sectors; 0 to n − 1 is thus the address space of the drive. Multi-sector operations are possible; indeed, many file systems will read or write 4KB at a time (or more). However, when updating the disk, the only guarantee drive manufacturers make is that a single 512-byte write is atomic (i.e., it will either complete in its entirety or it won’t com- plete at all); thus, if an untimely power loss occurs, only a portion of a larger write may complete (sometimes called a torn write). -
Error Detection and Correction Methods for Memories Used in System-On-Chip Designs
International Journal of Engineering and Advanced Technology (IJEAT) ISSN: 2249 – 8958, Volume-8, Issue-2S2, January 2019 Error Detection and Correction Methods for Memories used in System-on-Chip Designs Gunduru Swathi Lakshmi, Neelima K, C. Subhas ABSTRACT— Memory is the basic necessity in any SoC Static Random Access Memory (SRAM): It design. Memories are classified into single port memory and consists of a latch or flipflop to store each bit of multiport memory. Multiport memory has ability to source more memory and it does not required any refresh efficient execution of operation and high speed performance operation. SRAM is mostly used in cache memory when compared to single port. Testing of semiconductor memories is increasing because of high density of current in the and in hand-held devices. It has advantages like chips. Due to increase in embedded on chip memory and memory high speed and low power consumption. It has density, the number of faults grow exponentially. Error detection drawback like complex structure and expensive. works on concept of redundancy where extra bits are added for So, it is not used for high capacity applications. original data to detect the error bits. Error correction is done in Read Only Memory (ROM): It is a non-volatile memory. two forms: one is receiver itself corrects the data and other is It can only access data but cannot modify data. It is of low receiver sends the error bits to sender through feedback. Error detection and correction can be done in two ways. One is Single cost. Some applications of ROM are scanners, ID cards, Fax bit and other is multiple bit. -
DDR and DDR2 SDRAM Controller Compiler User Guide
DDR and DDR2 SDRAM Controller Compiler User Guide 101 Innovation Drive Software Version: 9.0 San Jose, CA 95134 Document Date: March 2009 www.altera.com Copyright © 2009 Altera Corporation. All rights reserved. Altera, The Programmable Solutions Company, the stylized Altera logo, specific device designations, and all other words and logos that are identified as trademarks and/or service marks are, unless noted otherwise, the trademarks and service marks of Altera Corporation in the U.S. and other countries. All other product or service names are the property of their respective holders. Altera products are protected under numerous U.S. and foreign patents and pending ap- plications, maskwork rights, and copyrights. Altera warrants performance of its semiconductor products to current specifications in accordance with Altera's standard warranty, but reserves the right to make changes to any products and services at any time without notice. Altera assumes no responsibility or liability arising out of the application or use of any information, product, or service described herein except as expressly agreed to in writing by Altera Corporation. Altera customers are advised to obtain the latest version of device specifications before relying on any published information and before placing orders for products or services. UG-DDRSDRAM-10.0 Contents Chapter 1. About This Compiler Release Information . 1–1 Device Family Support . 1–1 Features . 1–2 General Description . 1–2 Performance and Resource Utilization . 1–4 Installation and Licensing . 1–5 OpenCore Plus Evaluation . 1–6 Chapter 2. Getting Started Design Flow . 2–1 SOPC Builder Design Flow . 2–1 DDR & DDR2 SDRAM Controller Walkthrough . -
AXP Internal 2-Apr-20 1
2-Apr-20 AXP Internal 1 2-Apr-20 AXP Internal 2 2-Apr-20 AXP Internal 3 2-Apr-20 AXP Internal 4 2-Apr-20 AXP Internal 5 2-Apr-20 AXP Internal 6 Class 6 Subject: Computer Science Title of the Book: IT Planet Petabyte Chapter 2: Computer Memory GENERAL INSTRUCTIONS: • Exercises to be written in the book. • Assignment questions to be done in ruled sheets. • You Tube link is for the explanation of Primary and Secondary Memory. YouTube Link: ➢ https://youtu.be/aOgvgHiazQA INTRODUCTION: ➢ Computer can store a large amount of data safely in their memory for future use. ➢ A computer’s memory is measured either in Bits or Bytes. ➢ The memory of a computer is divided into two categories: Primary Memory, Secondary Memory. ➢ There are two types of Primary Memory: ROM and RAM. ➢ Cache Memory is used to store program and instructions that are frequently used. EXPLANATION: Computer Memory: Memory plays a very important role in a computer. It is the basic unit where data and instructions are stored temporarily. Memory usually consists of one or more chips on the mother board, or you can say it consists of electronic components that store instructions waiting to be executed by the processor, data needed by those instructions, and the results of processing the data. Memory Units: Computer memory is measured in bits and bytes. A bit is the smallest unit of information that a computer can process and store. A group of 4 bits is known as nibble, and a group of 8 bits is called byte. -
Low Voltage, One-Time Programmable, Read-Only Memory
Features • Fast read access time – 90ns • Dual voltage range operation – Low voltage power supply range, 3.0V to 3.6V, or – Standard power supply range, 5V 10% • Compatible with JEDEC standard Atmel® AT27C512R • Low-power CMOS operation – 20µA max standby (less than 1µA, typical) for VCC = 3.6V – 29mW max active at 5MHz for VCC = 3.6V 512K (64K x 8) • JEDEC standard package – 32-lead PLCC Low Voltage, • High-reliability CMOS technology One-time – 2,000V ESD protection Programmable, – 200mA latchup immunity • Rapid programming algorithm – 100µs/byte (typical) Read-only Memory • CMOS- and TTL-compatible inputs and outputs – JEDEC standard for LVTTL • Integrated product identification code Atmel AT27LV512A • Industrial temperature range • Green (Pb/halide-free) packaging option 1. Description The Atmel AT27LV512A is a high-performance, low-power, low-voltage, 524,288-bit, one- time programmable, read-only memory (OTP EPROM) organized as 64K by 8 bits. It requires only one supply in the range of 3.0 to 3.6V in normal read mode operation, making it ideal for fast, portable systems using battery power. The Atmel innovative design techniques provide fast speeds that rival 5V parts, while keep- ing the low power consumption of a 3.3V supply. At VCC = 3.0V, any byte can be accessed in less than 90ns. With a typical power dissipation of only 18mW at 5MHz and VCC = 3.3V, the AT27LV512A consumes less than one-fifth the power of a standard, 5V EPROM. Standby mode supply current is typically less than 1µA at 3.3V. The AT27LV512A is available in industry-standard, JEDEC-approved, one-time programmable (OTP) PLCC package. -
Nasdeluxe Z-Series
NASdeluxe Z-Series Benefit from scalable ZFS data storage By partnering with Starline and with Starline Computer’s NASdeluxe Open-E, you receive highly efficient Z-series and Open-E JovianDSS. This and reliable storage solutions that software-defined storage solution is offer: Enhanced Storage Performance well-suited for a wide range of applica- tions. It caters perfectly to the needs • Great adaptability Tiered RAM and SSD cache of enterprises that are looking to de- • Tiered and all-flash storage Data integrity check ploy a flexible storage configuration systems which can be expanded to a high avail- Data compression and in-line • High IOPS through RAM and SSD ability cluster. Starline and Open-E can data deduplication caching look back on a strategic partnership of Thin provisioning and unlimited • Superb expandability with more than 10 years. As the first part- number of snapshots and clones ner with a Gold partnership level, Star- Starline’s high-density JBODs – line has always been working hand in without downtime Simplified management hand with Open-E to develop and de- Flexible scalability liver innovative data storage solutions. Starline’s NASdeluxe Z-Series offers In fact, Starline supports worldwide not only great features, but also great Hardware independence enterprises in managing and pro- flexibility – thanks to its modular archi- tecting their storage, with over 2,800 tecture. Open-E installations to date. www.starline.de Z-Series But even with a standard configuration with nearline HDDs IOPS and SSDs for caching, you will be able to achieve high IOPS 250 000 at a reasonable cost. -
Use External Storage Devices Like Pen Drives, Cds, and Dvds
External Intel® Learn Easy Steps Activity Card Storage Devices Using external storage devices like Pen Drives, CDs, and DVDs loading Videos Since the advent of computers, there has been a need to transfer data between devices and/or store them permanently. You may want to look at a file that you have created or an image that you have taken today one year later. For this it has to be stored somewhere securely. Similarly, you may want to give a document you have created or a digital picture you have taken to someone you know. There are many ways of doing this – online and offline. While online data transfer or storage requires the use of Internet, offline storage can be managed with minimum resources. The only requirement in this case would be a storage device. Earlier data storage devices used to mainly be Floppy drives which had a small storage space. However, with the development of computer technology, we today have pen drives, CD/DVD devices and other removable media to store and transfer data. With these, you store/save/copy files and folders containing data, pictures, videos, audio, etc. from your computer and even transfer them to another computer. They are called secondary storage devices. To access the data stored in these devices, you have to attach them to a computer and access the stored data. Some of the examples of external storage devices are- Pen drives, CDs, and DVDs. Introduction to Pen Drive/CD/DVD A pen drive is a small self-powered drive that connects to a computer directly through a USB port. -
Nanotechnology Trends in Nonvolatile Memory Devices
IBM Research Nanotechnology Trends in Nonvolatile Memory Devices Gian-Luca Bona [email protected] IBM Research, Almaden Research Center © 2008 IBM Corporation IBM Research The Elusive Universal Memory © 2008 IBM Corporation IBM Research Incumbent Semiconductor Memories SRAM Cost NOR FLASH DRAM NAND FLASH Attributes for universal memories: –Highest performance –Lowest active and standby power –Unlimited Read/Write endurance –Non-Volatility –Compatible to existing technologies –Continuously scalable –Lowest cost per bit Performance © 2008 IBM Corporation IBM Research Incumbent Semiconductor Memories SRAM Cost NOR FLASH DRAM NAND FLASH m+1 SLm SLm-1 WLn-1 WLn WLn+1 A new class of universal storage device : – a fast solid-state, nonvolatile RAM – enables compact, robust storage systems with solid state reliability and significantly improved cost- performance Performance © 2008 IBM Corporation IBM Research Non-volatile, universal semiconductor memory SL m+1 SL m SL m-1 WL n-1 WL n WL n+1 Everyone is looking for a dense (cheap) crosspoint memory. It is relatively easy to identify materials that show bistable hysteretic behavior (easily distinguishable, stable on/off states). IBM © 2006 IBM Corporation IBM Research The Memory Landscape © 2008 IBM Corporation IBM Research IBM Research Histogram of Memory Papers Papers presented at Symposium on VLSI Technology and IEDM; Ref.: G. Burr et al., IBM Journal of R&D, Vol.52, No.4/5, July 2008 © 2008 IBM Corporation IBM Research IBM Research Emerging Memory Technologies Memory technology remains an -
Solving High-Speed Memory Interface Challenges with Low-Cost Fpgas
SOLVING HIGH-SPEED MEMORY INTERFACE CHALLENGES WITH LOW-COST FPGAS A Lattice Semiconductor White Paper May 2005 Lattice Semiconductor 5555 Northeast Moore Ct. Hillsboro, Oregon 97124 USA Telephone: (503) 268-8000 www.latticesemi.com Introduction Memory devices are ubiquitous in today’s communications systems. As system bandwidths continue to increase into the multi-gigabit range, memory technologies have been optimized for higher density and performance. In turn, memory interfaces for these new technologies pose stiff challenges for designers. Traditionally, memory controllers were embedded in processors or as ASIC macrocells in SoCs. With shorter time-to-market requirements, designers are turning to programmable logic devices such as FPGAs to manage memory interfaces. Until recently, only a few FPGAs supported the building blocks to interface reliably to high-speed, next generation devices, and typically these FPGAs were high-end, expensive devices. However, a new generation of low-cost FPGAs has emerged, providing the building blocks, high-speed FPGA fabric, clock management resources and the I/O structures needed to implement next generation DDR2, QDR2 and RLDRAM memory controllers. Memory Applications Memory devices are an integral part of a variety of systems. However, different applications have different memory requirements. For networking infrastructure applications, the memory devices required are typically high-density, high-performance, high-bandwidth memory devices with a high degree of reliability. In wireless applications, low-power memory is important, especially for handset and mobile devices, while high-performance is important for base-station applications. Broadband access applications typically require memory devices in which there is a fine balance between cost and performance. -
Semiconductor Memories
Semiconductor Memories Prof. MacDonald Types of Memories! l" Volatile Memories –" require power supply to retain information –" dynamic memories l" use charge to store information and require refreshing –" static memories l" use feedback (latch) to store information – no refresh required l" Non-Volatile Memories –" ROM (Mask) –" EEPROM –" FLASH – NAND or NOR –" MRAM Memory Hierarchy! 100pS RF 100’s of bytes L1 1nS SRAM 10’s of Kbytes 10nS L2 100’s of Kbytes SRAM L3 100’s of 100nS DRAM Mbytes 1us Disks / Flash Gbytes Memory Hierarchy! l" Large memories are slow l" Fast memories are small l" Memory hierarchy gives us illusion of large memory space with speed of small memory. –" temporal locality –" spatial locality Register Files ! l" Fastest and most robust memory array l" Largest bit cell size l" Basically an array of large latches l" No sense amps – bits provide full rail data out l" Often multi-ported (i.e. 8 read ports, 2 write ports) l" Often used with ALUs in the CPU as source/destination l" Typically less than 10,000 bits –" 32 32-bit fixed point registers –" 32 60-bit floating point registers SRAM! l" Same process as logic so often combined on one die l" Smaller bit cell than register file – more dense but slower l" Uses sense amp to detect small bit cell output l" Fastest for reads and writes after register file l" Large per bit area costs –" six transistors (single port), eight transistors (dual port) l" L1 and L2 Cache on CPU is always SRAM l" On-chip Buffers – (Ethernet buffer, LCD buffer) l" Typical sizes 16k by 32 Static Memory