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Electronics and Electrical Engineering Laboratory THE ELECTRONICS AND ELECTRICAL ENGINEERING LABORATORY One of NIST’s seven Measurement and Standards Laborato- ries, EEEL conducts research, provides measurement services, and helps set standards in support of: the fundamental electronic technologies of semiconductors, magnetics, and superconduc- tors; information and communications technologies, such as fiber optics, photonics, microwaves, electronic displays, and electronics manufacturing supply chain collaboration; forensics and security measurement instrumentation; fundamental and practical physical standards and measurement services for electrical quantities; maintaining the quality and integrity of electrical power systems; and the development of nanoscale and microelectromechanical devices. EEEL provides support to law enforcement, corrections, and criminal justice agencies, including homeland security. EEEL consists of four programmatic divisions and two matrix- managed offices: Semiconductor Electronics Division Optoelectronics Division Quantum Electrical Metrology Division Electromagnetics Division Office of Microelectronics Programs Office of Law Enforcement Standards This document describes the technical programs of the Office of Microelectronics Programs. Similar documents describing the other Divisions and Offices are available. Contact NIST/ EEEL, 100 Bureau Drive, MS 8100, Gaithersburg, MD 20899- 8100, Telephone: (301) 975-2220, On the Web: www.eeel.nist.gov Cover caption: From top picture, left to right #1 and #2; bottom left to right #3 and #4; and center is #5 #1 – Deep Ultraviolet Twyman Green Interferometer #2 – Dr. Curt Richter testing molecular electronics structures #3 – Microcalorimeter high resolution energy dispersive X-ray spectrometer mounted on analytical scanning electron microscope #4 – Patterned silicon wafer #5 – Small angle X-ray scattering diffraction pattern from silicon nano-scale test structure. ELECTRONICS AND ELECTRICAL ENGINEERING LABORATORY OFFICE OF MICROELECTRONICS PROGRAMS PROGRAMS, ACTIVITIES, AND ACCOMPLISHMENTS NISTIR 7171 January 2005 U.S. DEPARTMENT OF COMMERCE Donald L. Evans, Secretary Technology Administration Phillip J. Bond, Under Secretary of Commerce for Technology National Institute of Standards and Technology Hratch G. Semerjian, Acting Director DISCLAIMER Disclaimer: Certain commercial equipment and/or software are identified in this report to adequately describe the experimental procedure. Such identification does not imply recom- mendation or endorsement by the National Institute of Standards and Technology, nor does it imply that the equipment and/or software identified is necessarily the best available for the purpose. References: References made to the International Technology Roadmap for Semicon- ductors (ITRS) apply to the most recent edition, dated 2003: Semiconductor Industry Association. The International Technology Roadmap for Semicon- ductors, 2003 edition. International SEMATECH: Austin, TX, 2003. This document is available on-line at URL: http://public.itrs.net or in printed copy by contact- ing International SEMATECH, 2706 Montopolis Drive, Austin, TX 78741, ITRS department 860-008, phone: (512) 356-3500. The reader will notice that there are acronyms and abbreviations throughout this document that are not spelled out due to space limitations. We have listed the acronyms and abbrevia- tions in an appendix at the end of this document. CONTENTS Welcome and Introduction .................................................................................................... v Office of Microelectronics Programs Organization ............................................................ vii Lithography Metrology Program .................................................................................... 1 Metrology Supporting Deep Ultraviolet Lithography ............................................................ 3 Metrology Supporting Extreme Ultraviolet Lithography ....................................................... 9 Polymer Photoresist Fundamentals for Next-Generation Lithography ............................... 15 Critical Dimension and Overlay Metrology Program ................................................ 21 Wafer-Level and Mask Critical Dimension Metrology ....................................................... 22 Scanning Electron-Based Dimensional Metrology ....................................................... 23 Scanning Probe Microscope-Based Dimensional Metrology ....................................... 27 Small Angle X-Ray-Based Dimensional Metrology ..................................................... 31 Electrical-Based Dimensional Metrology and Single Crystal Critical Dimension Artifact Development ................................................................................. 35 Optical-Based Photomask Dimensional Metrology ...................................................... 41 Model-Based Linewidth Metrology .............................................................................. 45 Atom-Based Dimensional Metrology ........................................................................... 49 Wafer-Level and Overlay Metrology ................................................................................. 53 Front-End Processing Metrology Program ................................................................. 57 Wafer and Chuck Flatness Metrology ................................................................................ 59 Modeling, Measurements, and Standards for Wafer Surface Inspection ........................... 63 Front-End Materials Characterization ................................................................................. 69 Chemical Metrology of Materials and Particle Contamination ........................................... 83 Interconnect and Packaging Metrology Program ...................................................... 89 Atomic Layer Deposition – Process, Models, and Metrology ............................................ 91 Superconformal Deposition Copper and Advanced Interconnect Materials....................... 95 Porous Thin-Film Metrology for Low-κ Dielectric ............................................................. 99 Interconnect Materials and Reliability Metrology ............................................................. 103 Wire Bonding to Copper/Low-κ Semiconductor Devices .................................................111 Solders and Solderability Measurements for Microelectronics ......................................... 113 Thermal Measurements and Packaging Reliability ........................................................... 117 Dielectric Metrology Supporting Integrated Passive Device Technology ........................ 123 Process Metrology Program........................................................................................ 127 Gas Property Data and Flow Standards for Improved Gas Delivery Systems ................ 129 Low Concentration of Humidity Standards ...................................................................... 133 Temperature Measurements and Standards for Rapid Thermal Processing .................... 139 Plasma Process Metrology ............................................................................................... 143 Office of Microelectronics Programs iii Analysis Tools and Techniques Program ................................................................... 149 Thin-Film X-Ray Metrology for Microelectronics ............................................................ 151 Electron Microscope Tomography of Electronic Materials .............................................. 155 High Resolution Microcalorimeter X-Ray Spectrometer for Chemical Analysis ............. 157 Device Design and Characterization Program .......................................................... 163 Device Characterization and Reliability ............................................................................ 165 Advanced Measurements Nanofabrication Facility Support ............................................ 171 System Design and Test Metrology Program ........................................................... 173 Metrology for System-on-a-Chip ...................................................................................... 175 At-Speed Test of Digital Integrated Circuits .................................................................... 179 Non-Linear Device Characterization ................................................................................ 183 Jitter and Propagation Delay Measurements .................................................................... 187 Manufacturing Support Program ................................................................................. 189 Time Synchronization and Time Stamping Needs for Data Collection in Semiconductor Manufacturing ...................................................................................... 191 Engineering Chain Management in the Semiconductor Industry ...................................... 193 NIST/SEMATECH e-Handbook of Statistical Methods .................................................. 195 Invited Talks .................................................................................................................. 197 Abbreviations and Acronyms ....................................................................................... 198 Technical Contacts ........................................................................................................ 202 iv Electronics and Electrical Engineering
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