AT9900063 Active metal brazing of different metals to aluminium nitride ceramics
B. Loeser and D. Brunner
ANCeram GmbH & Co.KG, Bindlach, Germany
During recent years aluminium nitride ceramics for substrates, coolers and components have found more applications in micro- and power electronics. Aluminium nitride ceramic with high thermal conductivity, small CTE and good thermal shock resistance is used in aeronautical equipment as well as in drive systems of undergrounds and high speed trains. Different metals and alloys can be bonded to A1N by the so-called "AMB-process". The bonding mechanism is based on the use of so-called active metals like Ti, Zr, Hf. Copper conductor lines can be brazed onto AlN-jubstrates and components, resistor sheets can be applied on ceramic water coolers and a couple of other metals and alloys like Tantalium, Titanium, KOVAR and steel can be attached to AIN-ceramics by active brazing. Processing, analytical aspects and some special applications will be discussed.
167 Active Metal Braang of Different Metals to AIN Vienna, 06/05/97
Historical Background of the AMB-Process Active Metal Brazing of
Aluminium Nitride Different Metals
Active Metal Brazing of AIN to Aluminium Nitride Ceramics
Analytical Aspects
Special Applications
Summary
Dr. D. Brunner, B. Lflser, ANCeram GmbH & Co. KG, Bindlach, Germany
Aluminium Nitride Ceramics GmbH & Co KG, Esbachgraben 21, Bindlach, Germany Active Metal Brazing of Different Metals to AIN Vienna. 06/05/97
Historical Background
W.D. Kingery and M. llumenik, 1954 : Surface tension and wettability of metal-ceramic systems
Y. Naidich, 1981 : Wetting induced by Titanium
Historical Background of the AMB-Process Joints of Silicon Nitride and Carbide with Metals by Active Brazing ( 1982 ); Degussa, llanau Aluminium Nitride Joints of AIN with Kovar® by Active Brazing ( 1984 ); lleraeus, llanau Active Metal Brazing of AIN Joints of AIN with Copper by Active Brazing ( 1984 ); Toshiba Analytical Aspects
II. Krappitz, H. Thiemann, W. Weise, 1989 : Reactive brazed Ceraniic-Metal-Joints for Special Applications Automotive Applications
Joining AIN with Tantalum and Titanium ( 1993 ); Summary ANCeram
Aluminium Nitride Ceramics GmbH & Co. KG, Esbachgraben 21, Bindlach, Germany Thermal conductivity of conventional ceramic substrate materials
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materials
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170 Active Metal Brazing of Diffefent Metals to AIN Vienna. 06/05/97
thermal coefficient of expansion [ppm/K]
CJ * <|» » :* y ZT \v IBT^\ \ \ \ \ \ \ ff i •3o Iffl £ fl \i . 2. c fjf ¥IBll\ ^ \ \ \ V\ V\ V. V\ \\ • Historical Background of the AMB-Process g lHk\ \ \ \ \ \ s "o 1/ \ ^pl^\\ \ \ \ \A \ ° " 1/ 1 • Aluminium Nitride S D -r^ SStailllllllllllV ' \\\ \ \ \ \ x o W k \ \ a "O K 1 \\ \\ ?Si. 3S i^s^LiiiiM \V v\ \ \ \ \ * "• | 1 ) 2. O Active Metal Brazing of AIN 8 If i » ^E^^^^^^B \\ V\ I Si = "2. uI o 3o Analytical Aspects 1-« HHJVSB^LIV \\U tn ~ 1 2 o ^^^•^•IV \\V\ o \ 3 Special Applications Hi ^ Tr"™"PHH™ \\\ii » z ATI ^ • Summary Bater i 1 •' O o SL Aluminium Nitride Ceramics GmbH & Co. KG, Esbachgraben 21, Bindlach, Germany 4. Mikroclinrnkterisiennifj Rcaktionen: 4Ti + 3A1N - 3TiN + TiAl3 Ag-Cu-Eutektikum bei 780°C p •—- -4 /! o • • Kupfer 1 / .4 , 3* // . / / -* ^ / // y -s- / • /' / Rcaktionszonen: Ti-criche Schicht (ct. l-2fim) / V / • ' Eutektische L^otschicfct (ca. 20ptn) • \ \ Schliflbild: Elementverteilung \ \ t a as -• j j -s — -~ Active Metal Brizing of Different Metals to A1N Vienna. 06/05/97 Historical Background of the AMB-Process Aluminium Nitride Active Metal Brazing of AIN Analytical Aspects Special Applications Summary o > Aluminium Nitride Ceramics GmbH & Co. KG, Esbachgraben 21, Bindlach, Germany o 3 A1N Soldering Metal Alloy Junction OFHC-Cu Alloy junction Alumina 174 Active Metal Brazing of Difl'erenl Metals to AlN Vienna. 06/05/97 Historical Background of the AMB-Process Aluminium Nitride Active Metal Brazing of AlN Analytical Aspects *-"' Special Applications • Summary Aluminium Nitride Ceramics GmbH & Co. KG, Rsbachgraben 21, Bindlach, Germany Active Brazing Process \cii\e Bra/ing Process AIN Substrate ] L Copper Foil AIN Subsiraic ( tipper ( 'oil Rinsing Punching I | Screen Printing of Metal Paste Cleaning fs|iiS3|3^ infli ?*iliinll5*?^?tli?^ H^II I^JI f n ^ ^"Hn iH= Adjusting of Copper Foils in Solder Fixture U Reactive Brazing plIlJiii KCSISI Screen Printing of Etch Resist i nmnnnnn Baking il Etching nnn FT .V'^;'^ ••'• •••i"-l F"ilii>l Resist Stripping 07 07 9S DOWF07 DOT 07 07 9S AIN/AMB Fa.ANCeram Gefugeausbildung Kante 5 Faust Kante 6 111"! Department Fraunhoftr MECHANICAL RELIABILITY tnstitut AND MICRO MATERIALS Zuvariflssigkeit und Head: Prof. Dr. Bemd Michel Mkrointegration Aluminium Nitride Substrates for Power Electronics Active Brazed Copper (ABC) Substrates developed by ANCeram R.Hahll, ANCERAM2DOC. 21.ll.1996. HahitTUB. Tel. 030 314 72833. Fax. 030 314 72 835 177 b 11 IS StadtSparkasse Bayreuth % ••"• ",TT^"T"rT¥ti ill", i]Tri,*," 178 Water-cooled inverter tor underground trains, equipped with ANCeram modules Active Metal Brazing of Different Metals to AIN Vienna. 06/05/97 Summary AIN is wettable to different alloys activated by Ti, Zr, Hf, Ni, and Cr AIN is attachable to KOVAR, Titanium, Tantalum, stainless Steel and Copper AIN-Metal-Joints show high peel strength and sufficient thermal and electrical behavior AIN active brazed with Copper may become an alternative to the DCB-Process on Alumina for high power application Aluminium Nitride Ceramics GmbH & Co. KG. Esbachgraben 21. Bindlach. Germany 180