Composable Building Blocks to Open up Processor Design
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Efficient Checker Processor Design
Efficient Checker Processor Design Saugata Chatterjee, Chris Weaver, and Todd Austin Electrical Engineering and Computer Science Department University of Michigan {saugatac,chriswea,austin}@eecs.umich.edu Abstract system works to increase test space coverage by proving a design is correct, either through model equivalence or assertion. The approach is significantly more efficient The design and implementation of a modern micro- than simulation-based testing as a single proof can ver- processor creates many reliability challenges. Design- ify correctness over large portions of a design’s state ers must verify the correctness of large complex systems space. However, complex modern pipelines with impre- and construct implementations that work reliably in var- cise state management, out-of-order execution, and ied (and occasionally adverse) operating conditions. In aggressive speculation are too stateful or incomprehen- our previous work, we proposed a solution to these sible to permit complete formal verification. problems by adding a simple, easily verifiable checker To further complicate verification, new reliability processor at pipeline retirement. Performance analyses challenges are materializing in deep submicron fabrica- of our initial design were promising, overall slowdowns tion technologies (i.e. process technologies with mini- due to checker processor hazards were less than 3%. mum feature sizes below 0.25um). Finer feature sizes However, slowdowns for some outlier programs were are generally characterized by increased complexity, larger. more exposure to noise-related faults, and interference In this paper, we examine closely the operation of the from single event radiation (SER). It appears the current checker processor. We identify the specific reasons why advances in verification (e.g., formal verification, the initial design works well for some programs, but model-based test generation) are not keeping pace with slows others. -
Three-Dimensional Integrated Circuit Design: EDA, Design And
Integrated Circuits and Systems Series Editor Anantha Chandrakasan, Massachusetts Institute of Technology Cambridge, Massachusetts For other titles published in this series, go to http://www.springer.com/series/7236 Yuan Xie · Jason Cong · Sachin Sapatnekar Editors Three-Dimensional Integrated Circuit Design EDA, Design and Microarchitectures 123 Editors Yuan Xie Jason Cong Department of Computer Science and Department of Computer Science Engineering University of California, Los Angeles Pennsylvania State University [email protected] [email protected] Sachin Sapatnekar Department of Electrical and Computer Engineering University of Minnesota [email protected] ISBN 978-1-4419-0783-7 e-ISBN 978-1-4419-0784-4 DOI 10.1007/978-1-4419-0784-4 Springer New York Dordrecht Heidelberg London Library of Congress Control Number: 2009939282 © Springer Science+Business Media, LLC 2010 All rights reserved. This work may not be translated or copied in whole or in part without the written permission of the publisher (Springer Science+Business Media, LLC, 233 Spring Street, New York, NY 10013, USA), except for brief excerpts in connection with reviews or scholarly analysis. Use in connection with any form of information storage and retrieval, electronic adaptation, computer software, or by similar or dissimilar methodology now known or hereafter developed is forbidden. The use in this publication of trade names, trademarks, service marks, and similar terms, even if they are not identified as such, is not to be taken as an expression of opinion as to whether or not they are subject to proprietary rights. Printed on acid-free paper Springer is part of Springer Science+Business Media (www.springer.com) Foreword We live in a time of great change. -
Performance and Energy Efficient Network-On-Chip Architectures
Linköping Studies in Science and Technology Dissertation No. 1130 Performance and Energy Efficient Network-on-Chip Architectures Sriram R. Vangal Electronic Devices Department of Electrical Engineering Linköping University, SE-581 83 Linköping, Sweden Linköping 2007 ISBN 978-91-85895-91-5 ISSN 0345-7524 ii Performance and Energy Efficient Network-on-Chip Architectures Sriram R. Vangal ISBN 978-91-85895-91-5 Copyright Sriram. R. Vangal, 2007 Linköping Studies in Science and Technology Dissertation No. 1130 ISSN 0345-7524 Electronic Devices Department of Electrical Engineering Linköping University, SE-581 83 Linköping, Sweden Linköping 2007 Author email: [email protected] Cover Image A chip microphotograph of the industry’s first programmable 80-tile teraFLOPS processor, which is implemented in a 65-nm eight-metal CMOS technology. Printed by LiU-Tryck, Linköping University Linköping, Sweden, 2007 Abstract The scaling of MOS transistors into the nanometer regime opens the possibility for creating large Network-on-Chip (NoC) architectures containing hundreds of integrated processing elements with on-chip communication. NoC architectures, with structured on-chip networks are emerging as a scalable and modular solution to global communications within large systems-on-chip. NoCs mitigate the emerging wire-delay problem and addresses the need for substantial interconnect bandwidth by replacing today’s shared buses with packet-switched router networks. With on-chip communication consuming a significant portion of the chip power and area budgets, there is a compelling need for compact, low power routers. While applications dictate the choice of the compute core, the advent of multimedia applications, such as three-dimensional (3D) graphics and signal processing, places stronger demands for self-contained, low-latency floating-point processors with increased throughput. -
Computer Architecture: Dataflow (Part I)
Computer Architecture: Dataflow (Part I) Prof. Onur Mutlu Carnegie Mellon University A Note on This Lecture n These slides are from 18-742 Fall 2012, Parallel Computer Architecture, Lecture 22: Dataflow I n Video: n http://www.youtube.com/watch? v=D2uue7izU2c&list=PL5PHm2jkkXmh4cDkC3s1VBB7- njlgiG5d&index=19 2 Some Required Dataflow Readings n Dataflow at the ISA level q Dennis and Misunas, “A Preliminary Architecture for a Basic Data Flow Processor,” ISCA 1974. q Arvind and Nikhil, “Executing a Program on the MIT Tagged- Token Dataflow Architecture,” IEEE TC 1990. n Restricted Dataflow q Patt et al., “HPS, a new microarchitecture: rationale and introduction,” MICRO 1985. q Patt et al., “Critical issues regarding HPS, a high performance microarchitecture,” MICRO 1985. 3 Other Related Recommended Readings n Dataflow n Gurd et al., “The Manchester prototype dataflow computer,” CACM 1985. n Lee and Hurson, “Dataflow Architectures and Multithreading,” IEEE Computer 1994. n Restricted Dataflow q Sankaralingam et al., “Exploiting ILP, TLP and DLP with the Polymorphous TRIPS Architecture,” ISCA 2003. q Burger et al., “Scaling to the End of Silicon with EDGE Architectures,” IEEE Computer 2004. 4 Today n Start Dataflow 5 Data Flow Readings: Data Flow (I) n Dennis and Misunas, “A Preliminary Architecture for a Basic Data Flow Processor,” ISCA 1974. n Treleaven et al., “Data-Driven and Demand-Driven Computer Architecture,” ACM Computing Surveys 1982. n Veen, “Dataflow Machine Architecture,” ACM Computing Surveys 1986. n Gurd et al., “The Manchester prototype dataflow computer,” CACM 1985. n Arvind and Nikhil, “Executing a Program on the MIT Tagged-Token Dataflow Architecture,” IEEE TC 1990. -
Understanding Performance Numbers in Integrated Circuit Design Oprecomp Summer School 2019, Perugia Italy 5 September 2019
Understanding performance numbers in Integrated Circuit Design Oprecomp summer school 2019, Perugia Italy 5 September 2019 Frank K. G¨urkaynak [email protected] Integrated Systems Laboratory Introduction Cost Design Flow Area Speed Area/Speed Trade-offs Power Conclusions 2/74 Who Am I? Born in Istanbul, Turkey Studied and worked at: Istanbul Technical University, Istanbul, Turkey EPFL, Lausanne, Switzerland Worcester Polytechnic Institute, Worcester MA, USA Since 2008: Integrated Systems Laboratory, ETH Zurich Director, Microelectronics Design Center Senior Scientist, group of Prof. Luca Benini Interests: Digital Integrated Circuits Cryptographic Hardware Design Design Flows for Digital Design Processor Design Open Source Hardware Integrated Systems Laboratory Introduction Cost Design Flow Area Speed Area/Speed Trade-offs Power Conclusions 3/74 What Will We Discuss Today? Introduction Cost Structure of Integrated Circuits (ICs) Measuring performance of ICs Why is it difficult? EDA tools should give us a number Area How do people report area? Is that fair? Speed How fast does my circuit actually work? Power These days much more important, but also much harder to get right Integrated Systems Laboratory The performance establishes the solution space Finally the cost sets a limit to what is possible Introduction Cost Design Flow Area Speed Area/Speed Trade-offs Power Conclusions 4/74 System Design Requirements System Requirements Functionality Functionality determines what the system will do Integrated Systems Laboratory Finally the cost sets a limit -
CSE 141L: Design Your Own Processor What You'll
CSE 141L: Design your own processor What you’ll do: - learn Xilinx toolflow - learn Verilog language - propose new ISA - implement it - optimize it (for FPGA) - compete with other teams Grading 15% lab participation – webboard 85% various parts of the labs CSE 141L: Design your own processor Teams - two people - pick someone with similar goals - you keep them to the end of the class - more on the class website: http://www.cse.ucsd.edu/classes/sp08/cse141L/ Course Staff: 141L Instructor: Michael Taylor Email: [email protected] Office Hours: EBU 3b 4110 Tuesday 11:30-12:20 TA: Saturnino Email: [email protected] ebu 3b b260 Lab Hours: TBA (141 TA: Kwangyoon) Æ occasional cameos in 141L http://www-cse.ucsd.edu/classes/sp08/cse141L/ Class Introductions Stand up & tell us: -Name - How long until graduation - What you want to do when you “hit the big time” - What kind of thing you find intellectually interesting What is an FPGA? Next time: (Tuesday) Start working on Xilinx assignment (due next Tuesday) - should be posted Sat will give a tutorial on Verilog today Check the website regularly for updates: http://www.cse.ucsd.edu/classes/sp08/cse141L/ CSE 141: 0 Computer Architecture Professor: Michael Taylor UCSD Department of Computer Science & Engineering RF http://www.cse.ucsd.edu/classes/sp08/cse141/ Computer Architecture from 10,000 feet foo(int x) Class of { .. } application Physics Computer Architecture from 10,000 feet foo(int x) Class of { .. } application An impossibly large gap! In the olden days: “In 1942, just after the United States entered World War II, hundreds of women were employed around the country as Physics computers...” (source: IEEE) The Great Battles in Computer Architecture Are About How to Refine the Abstraction Layers foo(int x) { . -
Configurable Fine-Grain Protection for Multicore Processor Virtualization 1
Configurable Fine-Grain Protection for Multicore Processor Virtualization David Wentzlaff1, Christopher J. Jackson2, Patrick Griffin3, and Anant Agarwal2 [email protected], [email protected], griffi[email protected], [email protected] 1Princeton University 2Tilera Corp. 3Google Inc. Abstract TLB Access DMA Engine “User” Network I/O Network 2 2 2 2 1 3 1 3 1 3 1 3 Multicore architectures, with their abundant on-chip re- 0 0 0 0 sources, are effectively collections of systems-on-a-chip. The protection system for these architectures must support Key: 0 – User Code, 1 – OS, 2 – Hypervisor, 3 – Hypervisor Debugger multiple concurrently executing operating systems (OSes) Figure 1. With CFP, system software can dy• with different needs, and manage and protect the hard- namically set the privilege level needed to ac• ware’s novel communication mechanisms and hardware cess each fine•grain processor resource. features. Traditional protection systems are insufficient; they protect supervisor from user code, but typically do not protect one system from another, and only support fixed as- ticore systems, a protection system must both temporally signment of resources to protection levels. In this paper, protect and spatially isolate access to resources. Spatial iso- we propose an alternative to traditional protection systems lation is the need to isolate different system software stacks which we call configurable fine-grain protection (CFP). concurrently executing on spatially disparate cores in a mul- CFP enables the dynamic assignment of in-core resources ticore system. Spatial isolation is especially important now to protection levels. We investigate how CFP enables differ- that multicore systems have directly accessible networks ent system software stacks to utilize the same configurable connecting cores to other cores and cores to I/O devices. -
Processor Architecture Design Using 3D Integration Technology
Processor Architecture Design Using 3D Integration Technology Yuan Xie Pennsylvania State University Computer Science and Engineering Department University Park, PA, 16802, USA [email protected] Abstract (4)Smaller form factor, which results in higher pack- ing density and smaller footprint due to the addition of The emerging three-dimensional (3D) chip architec- a third dimension to the conventional two dimensional tures, with their intrinsic capability of reducing the wire layout, and potentially results in a lower cost design. length, is one of the promising solutions to mitigate This tutorial paper first presents the background on the interconnect problem in modern microprocessor de- 3D integration technology, and then reviews various ap- signs. 3D memory stacking also enables much higher proaches to design future 3D microprocessors, which memory bandwidth for future chip-multiprocessor de- leverage the benefits of fast latency, higher bandwidth, sign, mitigating the “memory wall” problem. In addi- and heterogeneous integration capability that are offered tion, heterogenous integration enabled by 3D technol- by 3D technology. The challenges for future 3D archi- ogy can also result in innovation designs for future mi- tecture design are also discussed in the last section. croprocessors. This paper serves as a survey of various approaches to design future 3D microprocessors, lever- 2. 3D Integration Technology aging the benefits of fast latency, higher bandwidth, and The 3D integration technologies [25,26] can be clas- heterogeneous integration capability that are offered by sified into one of the two following categories. (1) 3D technology. 1 Monolithic approach. This approach involves sequen- tial device process. The frontend processing (to build the 1. -
Processor Design:System-On-Chip Computing For
Processor Design Processor Design System-on-Chip Computing for ASICs and FPGAs Edited by Jari Nurmi Tampere University of Technology Finland A C.I.P. Catalogue record for this book is available from the Library of Congress. ISBN 978-1-4020-5529-4 (HB) ISBN 978-1-4020-5530-0 (e-book) Published by Springer, P.O. Box 17, 3300 AA Dordrecht, The Netherlands. www.springer.com Printed on acid-free paper All Rights Reserved © 2007 Springer No part of this work may be reproduced, stored in a retrieval system, or transmitted in any form or by any means, electronic, mechanical, photocopying, microfilming, recording or otherwise, without written permission from the Publisher, with the exception of any material supplied specifically for the purpose of being entered and executed on a computer system, for exclusive use by the purchaser of the work. To Pirjo, Lauri, Eero, and Santeri Preface When I started my computing career by programming a PDP-11 computer as a freshman in the university in early 1980s, I could not have dreamed that one day I’d be able to design a processor. At that time, the freshmen were only allowed to use PDP. Next year I was given the permission to use the famous brand-new VAX-780 computer. Also, my new roommate at the dorm had got one of the first personal computers, a Commodore-64 which we started to explore together. Again, I could not have imagined that hundreds of times the processing power will be available in an everyday embedded device just a quarter of century later. -
Design Software & Development Kit Selector Guide
® Design Software & Development Kit Selector Guide April 2004 Table of Contents Quartus II Design Software Leadership ................................ page 2 Selecting a Design Software Product ................................... page 5 System Design Technology Recommended System Configurations ................................. page 8 Altera’s Quartus II software is the industry’s only design Altera Programming Hardware........................................... page 8 environment that supports Intellectual Property (IP)-based Altera Development Kits................................................... page 10 system design—including complete and automated system definition and implementation—without requiring lower- Third-Party Solutions........................................................ page 10 level hardware description language (HDL) or schematics. This capability enables designers to turn their concepts into working systems in minutes. The Quartus II system design tools include: Quartus II Design Software SOPC Builder: A system development tool that automates Leadership adding, parameterizing, and linking IP cores—including Altera’s Quartus® II software leads the embedded processors, co-processors, peripherals, memories, industry as the most comprehensive and user-defined logic—without requiring lower-level HDL environment available for FPGA, CPLD, or schematics. (See Figure 1.) and structured ASIC designs, delivering DSP Builder: Shortens digital signal processing (DSP) design unmatched performance, efficiency, and ease-of-use. -
Physical Design of a 3D-Stacked Heterogeneous Multi-Core Processor
Physical Design of a 3D-Stacked Heterogeneous Multi-Core Processor Randy Widialaksono, Rangeen Basu Roy Chowdhury, Zhenqian Zhang, Joshua Schabel, Steve Lipa, Eric Rotenberg, W. Rhett Davis, Paul Franzon Department of Electrical and Computer Engineering North Carolina State University, Raleigh, NC, USA frhwidial, rbasuro, zzhang18, jcledfo3, slipa, ericro, wdavis, [email protected] Abstract—With the end of Dennard scaling, three dimensional TSV (I/O pads) stacking has emerged as a promising integration technique to Bulk improve microprocessor performance. In this paper we present Active First metal layer a 3D-SIC physical design methodology for a multi-core processor using commercial off-the-shelf tools. We explain the various Metal High-performance core flows involved and present the lessons learned during the design Last metal layer process. The logic dies were fabricated with GlobalFoundries Face-to-face micro-bumps 130 nm process and were stacked using the Ziptronix face-to- Metal Low-power core face (F2F) bonding technology. We also present a comparative analysis which highlights the benefits of 3D integration. Results indicate an order of magnitude decrease in wirelengths for critical Active inter-core components in the 3D implementation compared to 2D Bulk implementations. I. INTRODUCTION Fig. 1. Cross-section of the face-to-face bonded 3D-IC stack. As performance benefits from technology scaling slows The primary advantage of 3D-stacking comes from reduced down, computer architects are looking at various architectural wirelengths leading to an improvement in routability and signal techniques to maintain the trend of performance improvement, delays. On the other hand, going 3D also increases design while meeting the power budget. -
Modern Processor Design: Fundamentals of Superscalar
Fundamentals of Superscalar Processors John Paul Shen Intel Corporation Mikko H. Lipasti University of Wisconsin WAVELAND PRESS, INC. Long Grove, Illinois To Our parents: Paul and Sue Shen Tarja and Simo Lipasti Our spouses: Amy C. Shen Erica Ann Lipasti Our children: Priscilla S. Shen, Rachael S. Shen, and Valentia C. Shen Emma Kristiina Lipasti and Elias Joel Lipasti For information about this book, contact: Waveland Press, Inc. 4180 IL Route 83, Suite 101 Long Grove, IL 60047-9580 (847) 634-0081 info @ waveland.com www.waveland.com Copyright © 2005 by John Paul Shen and Mikko H. Lipasti 2013 reissued by Waveland Press, Inc. 10-digit ISBN 1-4786-0783-1 13-digit ISBN 978-1-4786-0783-0 All rights reserved. No part of this book may be reproduced, stored in a retrieval system, or transmitted in any form or by any means without permission in writing from the publisher. Printed in the United States of America 7 6 5 4 3 2 1 Table of Contents PrefaceAbout the Authors x ix 1 Processor Design 1 1.1 The Evolution of Microprocessors 2 1.21.2.1 Instruction Digital Set Systems Processor Design Design 44 1.2.2 Architecture,Realization Implementation, and 5 1.2.3 Instruction Set Architecture 6 1.2.4 Dynamic-Static Interface 8 1.3 Principles of Processor Performance 10 1.3.1 Processor Performance Equation 10 1.3.2 Processor Performance Optimizations 11 1.3.3 Performance Evaluation Method 13 1.4 Instruction-Level Parallel Processing 16 1.4.1 From Scalar to Superscalar 16 1.4.2 Limits of Instruction-Level Parallelism 24 1.51.4.3 Machines Summary for Instruction-Level