2011 Annual Report on Form 10-K
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Reviving the Development of Openchrome
Reviving the Development of OpenChrome Kevin Brace OpenChrome Project Maintainer / Developer XDC2017 September 21st, 2017 Outline ● About Me ● My Personal Story Behind OpenChrome ● Background on VIA Chrome Hardware ● The History of OpenChrome Project ● Past Releases ● Observations about Standby Resume ● Developmental Philosophy ● Developmental Challenges ● Strategies for Further Development ● Future Plans 09/21/2017 XDC2017 2 About Me ● EE (Electrical Engineering) background (B.S.E.E.) who specialized in digital design / computer architecture in college (pretty much the only undergraduate student “still” doing this stuff where I attended college) ● Graduated recently ● First time conference presenter ● Very experienced with Xilinx FPGA (Spartan-II through 7 Series FPGA) ● Fluent in Verilog / VHDL design and verification ● Interest / design experience with external communication interfaces (PCI / PCIe) and external memory interfaces (SDRAM / DDR3 SDRAM) ● Developed a simple DMA engine for PCI I/F validation w/Windows WDM (Windows Driver Model) kernel device driver ● Almost all the knowledge I have is self taught (university engineering classes were not very useful) 09/21/2017 XDC2017 3 Motivations Behind My Work ● General difficulty in obtaining meaningful employment in the digital hardware design field (too many students in the field, difficulty obtaining internship, etc.) ● Collects and repairs abandoned computer hardware (It’s like rescuing puppies!) ● Owns 100+ desktop computers and 20+ laptop computers (mostly abandoned old stuff I -
AMD's Llano Fusion
AMD’S “LLANO” FUSION APU Denis Foley, Maurice Steinman, Alex Branover, Greg Smaus, Antonio Asaro, Swamy Punyamurtula, Ljubisa Bajic Hot Chips 23, 19th August 2011 TODAY’S TOPICS . APU Architecture and floorplan . CPU Core Features . Graphics Features . Unified Video decoder Features . Display and I/O Capabilities . Power Gating . Turbo Core . Performance 2 | LLANO HOT CHIPS | August 19th, 2011 ARCHITECTURE AND FLOORPLAN A-SERIES ARCHITECTURE • Up to 4 Stars-32nm x86 Cores • 1MB L2 cache/core • Integrated Northbridge • 2 Chan of DDR3-1866 memory • 24 Lanes of PCIe® Gen2 • x4 UMI (Unified Media Interface) • x4 GPP (General Purpose Ports) • x16 Graphics expansion or display • 2 x4 Lanes dedicated display • 2 Head Display Controller • UVD (Unified Video Decoder) • 400 AMD Radeon™ Compute Units • GMC (Graphics Memory Controller) • FCL (Fusion Control Link) • RMB (AMD Radeon™ Memory Bus) • 227mm2, 32nm SOI • 1.45BN transistors 4 | LLANO HOT CHIPS | August 19th, 2011 INTERNAL BUS . Fusion Control Link (FCL) – 128b (each direction) path for IO access to memory – Variable clock based on throughput (LCLK) – GPU access to coherent memory space – CPU access to dedicated GPU framebuffer . AMD Radeon™ Memory Bus (RMB) – 256b (each direction) for each channel for GMC access to memory – Runs on Northbridge clock (NCLK) – Provides full bandwidth path for Graphics access to system memory – DRAM friendly stream of reads and write – Bypasses coherency mechanism 5 | LLANO HOT CHIPS | August 19th, 2011 Dual-channel DDR3 Unified Video DDR3 UVD Decoder NB CPU CPU Graphics SIMD Integrated Integrated GPU, Display Northbridge Array Controller I/O Controllers L2 Display L2 I/OMultimedia Controllers L2 PCI Express I/O - 24 lanes, optional 1 MB L2 cache L2 I/O per core digital display interfaces CPU CPU Digital display interfaces 4 Stars-32nm PCIe CPU cores PPL Display PCIe PCIe Display 6 | LLANO HOT CHIPS | August 19th, 2011 CPU, GPU, UVD AND IO FEATURES STARS-32nm CPU CORE FEATURES . -
Amd Filed: February 24, 2009 (Period: December 27, 2008)
FORM 10-K ADVANCED MICRO DEVICES INC - amd Filed: February 24, 2009 (period: December 27, 2008) Annual report which provides a comprehensive overview of the company for the past year Table of Contents 10-K - FORM 10-K PART I ITEM 1. 1 PART I ITEM 1. BUSINESS ITEM 1A. RISK FACTORS ITEM 1B. UNRESOLVED STAFF COMMENTS ITEM 2. PROPERTIES ITEM 3. LEGAL PROCEEDINGS ITEM 4. SUBMISSION OF MATTERS TO A VOTE OF SECURITY HOLDERS PART II ITEM 5. MARKET FOR REGISTRANT S COMMON EQUITY, RELATED STOCKHOLDER MATTERS AND ISSUER PURCHASES OF EQUITY SECURITIES ITEM 6. SELECTED FINANCIAL DATA ITEM 7. MANAGEMENT S DISCUSSION AND ANALYSIS OF FINANCIAL CONDITION AND RESULTS OF OPERATIONS ITEM 7A. QUANTITATIVE AND QUALITATIVE DISCLOSURE ABOUT MARKET RISK ITEM 8. FINANCIAL STATEMENTS AND SUPPLEMENTARY DATA ITEM 9. CHANGES IN AND DISAGREEMENTS WITH ACCOUNTANTS ON ACCOUNTING AND FINANCIAL DISCLOSURE ITEM 9A. CONTROLS AND PROCEDURES ITEM 9B. OTHER INFORMATION PART III ITEM 10. DIRECTORS, EXECUTIVE OFFICERS AND CORPORATE GOVERNANCE ITEM 11. EXECUTIVE COMPENSATION ITEM 12. SECURITY OWNERSHIP OF CERTAIN BENEFICIAL OWNERS AND MANAGEMENT AND RELATED STOCKHOLDER MATTERS ITEM 13. CERTAIN RELATIONSHIPS AND RELATED TRANSACTIONS AND DIRECTOR INDEPENDENCE ITEM 14. PRINCIPAL ACCOUNTANT FEES AND SERVICES PART IV ITEM 15. EXHIBITS, FINANCIAL STATEMENT SCHEDULES SIGNATURES EX-10.5(A) (OUTSIDE DIRECTOR EQUITY COMPENSATION POLICY) EX-10.19 (SEPARATION AGREEMENT AND GENERAL RELEASE) EX-21 (LIST OF AMD SUBSIDIARIES) EX-23.A (CONSENT OF ERNST YOUNG LLP - ADVANCED MICRO DEVICES) EX-23.B -
AMD Accelerated Parallel Processing Opencl Programming Guide
AMD Accelerated Parallel Processing OpenCL Programming Guide November 2013 rev2.7 © 2013 Advanced Micro Devices, Inc. All rights reserved. AMD, the AMD Arrow logo, AMD Accelerated Parallel Processing, the AMD Accelerated Parallel Processing logo, ATI, the ATI logo, Radeon, FireStream, FirePro, Catalyst, and combinations thereof are trade- marks of Advanced Micro Devices, Inc. Microsoft, Visual Studio, Windows, and Windows Vista are registered trademarks of Microsoft Corporation in the U.S. and/or other jurisdic- tions. Other names are for informational purposes only and may be trademarks of their respective owners. OpenCL and the OpenCL logo are trademarks of Apple Inc. used by permission by Khronos. The contents of this document are provided in connection with Advanced Micro Devices, Inc. (“AMD”) products. AMD makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. The information contained herein may be of a preliminary or advance nature and is subject to change without notice. No license, whether express, implied, arising by estoppel or other- wise, to any intellectual property rights is granted by this publication. Except as set forth in AMD’s Standard Terms and Conditions of Sale, AMD assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right. AMD’s products are not designed, intended, authorized or warranted for use as compo- nents in systems intended for surgical implant into the body, or in other applications intended to support or sustain life, or in any other application in which the failure of AMD’s product could create a situation where personal injury, death, or severe property or envi- ronmental damage may occur. -
Advanced Packaging Solutions
Advanced Packaging Solutions Highlights Providing silicon-scaling • Advanced packaging capabilities in solutions for tomorrow’s applications 2.5D, 3D, WLP and Silicon Photonics GLOBALFOUNDRIES post-fab services provide complementary and extended • Power, performance, cost and solutions with complete supply chain management including bump, probe, form-factor optimized solutions packaging and final test. The flexible supply chain model is tailored to your • Industry leader in smart interposers needs with services ranging from bump and probe only to a more comprehen- sive spectrum of services including package design, assembly and test. • In-house bump and wafer probe capabilities In addition to in-house bump and probe capabilities, we provide packaging • Advanced memory integration services in collaboration with a network of established OSAT partners, includ- with stacked memories ing 2D packages as well as 2.5D and 3D advanced package technologies. Test development and capabilities include RF, analog, embedded memory, • Ownership and process maturity for HVM and mmWave applications, with wide array of tester platforms for wafer sort operations. • Advanced silicon node CPI and qualification Packaging Requirements • RF system-in-package and Package types are selected based on performance requirements and optimized mmWave packaging capability for market segments including IoT, RF, Automotive, Mobile, High-end • Partnerships and strong relationships Computing, Networking and Storage. with leading-edge OSATs • Flexible supply chain and Mobile IoT RF Automotive Computing Networking Storage collaborative business models QFN FBGA WLCSP FOWLP SiP fcCSP FCBGA 2.5D 3D Si-PH Advanced Packaging Solutions Packaging Technologies TSV Si Interposer Availability GF Si nodes are qualified in a wide range of package Full Reticle 26x33mm2 technologies including 2D wirebond designs, flip Stitched Interposer >1300 mm2 chip, WLCSP and FOWLP configurations, as well 10:1 Aspect Ratio TSV 10um Dia./ 100um Depth as 2.5D, 3D and Si-Photonics. -
Passmark Intel Vs AMD CPU Benchmarks - High End
PassMark Intel vs AMD CPU Benchmarks - High End http://www.cpubenchmark.net/high_end_cpus.html Shopping cart | Search Home Software Hardware Benchmarks Services Store Support Forums About Us Home » CPU Benchmarks » High End CPU's CPU Benchmarks Video Card Benchmarks Hard Drive Benchmarks RAM PC Systems Android iOS / iPhone CPU Benchmarks Over 600,000 CPUs Benchmarked High End CPU's - Intel vs AMD How does your CPU compare? This chart comparing high end CPU's is made using thousands of PerformanceTest benchmark Add your CPU to our benchmark results and is updated daily. These are the high end AMD and Intel CPUs are typically those chart with PerformanceTest V8 found in newer computers. The chart below compares the performance of Intel Xeon CPUs, Intel Core i7 CPUs, AMD Phenom II CPUs and AMD Opterons with multiple cores. Intel processors vs ---- Select A Page ---- AMD chips - find out which CPU's performance is best for your new gaming rig or server! CPU Mark | Price Performance (Click to select desired chart) PassMark - CPU Mark High End CPUs - Updated 26th of August 2013 Price (USD) Intel Xeon E5-2687W @ 3.10GHz 14,564 $1,929.99 Intel Xeon E5-2690 @ 2.90GHz 14,511 $1,920.99 Intel Xeon E5-2680 @ 2.70GHz 13,949 $1,725.99 Intel Xeon E5-2689 @ 2.60GHz 13,444 NA Intel Xeon E5-2670 @ 2.60GHz 13,312 $1,509.00 Intel Core i7-3970X @ 3.50GHz 12,873 $1,006.99 Intel Core i7-3960X @ 3.30GHz 12,749 $965.99 Intel Xeon E5-1660 @ 3.30GHz 12,457 $1,086.99 Intel Xeon E5-2665 @ 2.40GHz 12,453 $1,499.99 Intel Core i7-3930K @ 3.20GHz 12,086 $567.27 Intel Xeon -
AMD Codexl 1.7 GA Release Notes
AMD CodeXL 1.7 GA Release Notes Thank you for using CodeXL. We appreciate any feedback you have! Please use the CodeXL Forum to provide your feedback. You can also check out the Getting Started guide on the CodeXL Web Page and the latest CodeXL blog at AMD Developer Central - Blogs This version contains: For 64-bit Windows platforms o CodeXL Standalone application o CodeXL Microsoft® Visual Studio® 2010 extension o CodeXL Microsoft® Visual Studio® 2012 extension o CodeXL Microsoft® Visual Studio® 2013 extension o CodeXL Remote Agent For 64-bit Linux platforms o CodeXL Standalone application o CodeXL Remote Agent Note about installing CodeAnalyst after installing CodeXL for Windows AMD CodeAnalyst has reached End-of-Life status and has been replaced by AMD CodeXL. CodeXL installer will refuse to install on a Windows station where AMD CodeAnalyst is already installed. Nevertheless, if you would like to install CodeAnalyst, do not install it on a Windows station already installed with CodeXL. Uninstall CodeXL first, and then install CodeAnalyst. System Requirements CodeXL contains a host of development features with varying system requirements: GPU Profiling and OpenCL Kernel Debugging o An AMD GPU (Radeon HD 5000 series or newer, desktop or mobile version) or APU is required. o The AMD Catalyst Driver must be installed, release 13.11 or later. Catalyst 14.12 (driver 14.501) is the recommended version. See "Getting the latest Catalyst release" section below. For GPU API-Level Debugging, a working OpenCL/OpenGL configuration is required (AMD or other). CPU Profiling o Time-Based Profiling can be performed on any x86 or AMD64 (x86-64) CPU/APU. -
Opengl ES, XNA, Directx for WP8) Plan
Mobilne akceleratory grafiki Kamil Trzciński, 2013 O mnie Kamil Trzciński http://ayufan.eu / [email protected] ● Od 14 lat zajmuję się programowaniem (C/C++, Java, C#, Python, PHP, itd.) ● Od 10 lat zajmuję się programowaniem grafiki (OpenGL, DirectX 9/10/11, Ray-Tracing) ● Od 6 lat zajmuję się branżą mobilną (SymbianOS, Android, iOS) ● Od 2 lat zajmuję się mobilną grafiką (OpenGL ES, XNA, DirectX for WP8) Plan ● Bardzo krótko o historii ● Mobilne układy graficzne ● API ● Programowalne jednostki cieniowania ● Optymalizacja ● Silniki graficzne oraz silniki gier Wstęp Grafika komputerowa to dziedzina informatyki zajmująca się wykorzystaniem technik komputerowych do celów wizualizacji artystycznej oraz wizualizacji rzeczywistości. Bardzo często grafika komputerowa jest kojarzona z urządzeniem wspomagającym jej generowanie - kartą graficzną, odpowiedzialna za renderowanie grafiki oraz jej konwersję na sygnał zrozumiały dla wyświetlacza 1. Historia Historia Historia kart graficznych sięga wczesnych lat 80-tych ubiegłego wieku. Pierwsze karty graficzne potrafiły jedynie wyświetlać znaki alfabetu łacińskiego ze zdefiniowanego w pamięci generatora znaków, tzw. trybu tekstowego. W późniejszym okresie pojawiły się układy, wykonujące tzw. operacje BitBLT, pozwalające na nałożenie na siebie 2 różnych bitmap w postaci rastrowej. Historia Historia #2 ● Wraz z nadejściem systemu operacyjnego Microsoft Windows 3.0 wzrosło zapotrzebowanie na przetwarzanie grafiki rastrowej dużej rozdzielczości. ● Powstaje interfejs GDI odpowiedzialny za programowanie operacji związanych z grafiką. ● Krótko po tym powstały pierwsze akceleratory 2D wyprodukowane przez firmę S3. Wydarzenie to zapoczątkowało erę graficznych akceleratorów grafiki. Historia #3 ● 1996 – wprowadzenie chipsetu Voodoo Graphics przez firmę 3dfx, dodatkowej karty rozszerzeń pełniącej funkcję akceleratora grafiki 3D. ● Powstają biblioteki umożliwiające tworzenie trójwymiarowych wizualizacji: Direct3D oraz OpenGL. Historia #3 Historia #4 ● 1999/2000 – DirectX 7.0 dodaje obsługę: T&L (ang. -
4010, 237 8514, 226 80486, 280 82786, 227, 280 a AA. See Anti-Aliasing (AA) Abacus, 16 Accelerated Graphics Port (AGP), 219 Acce
Index 4010, 237 AIB. See Add-in board (AIB) 8514, 226 Air traffic control system, 303 80486, 280 Akeley, Kurt, 242 82786, 227, 280 Akkadian, 16 Algebra, 26 Alias Research, 169 Alienware, 186 A Alioscopy, 389 AA. See Anti-aliasing (AA) All-In-One computer, 352 Abacus, 16 All-points addressable (APA), 221 Accelerated Graphics Port (AGP), 219 Alpha channel, 328 AccelGraphics, 166, 273 Alpha Processor, 164 Accel-KKR, 170 ALT-256, 223 ACM. See Association for Computing Altair 680b, 181 Machinery (ACM) Alto, 158 Acorn, 156 AMD, 232, 257, 277, 410, 411 ACRTC. See Advanced CRT Controller AMD 2901 bit-slice, 318 (ACRTC) American national Standards Institute (ANSI), ACS, 158 239 Action Graphics, 164, 273 Anaglyph, 376 Acumos, 253 Anaglyph glasses, 385 A.D., 15 Analog computer, 140 Adage, 315 Anamorphic distortion, 377 Adage AGT-30, 317 Anatomic and Symbolic Mapper Engine Adams Associates, 102 (ASME), 110 Adams, Charles W., 81, 148 Anderson, Bob, 321 Add-in board (AIB), 217, 363 AN/FSQ-7, 302 Additive color, 328 Anisotropic filtering (AF), 65 Adobe, 280 ANSI. See American national Standards Adobe RGB, 328 Institute (ANSI) Advanced CRT Controller (ACRTC), 226 Anti-aliasing (AA), 63 Advanced Remote Display Station (ARDS), ANTIC graphics co-processor, 279 322 Antikythera device, 127 Advanced Visual Systems (AVS), 164 APA. See All-points addressable (APA) AED 512, 333 Apalatequi, 42 AF. See Anisotropic filtering (AF) Aperture grille, 326 AGP. See Accelerated Graphics Port (AGP) API. See Application program interface Ahiska, Yavuz, 260 standard (API) AI. -
RADEON 7000 MAC EDITION User's Guide
RADEON™ 7000 MAC® EDITION User’s Guide P/N: 137-40298-20 Copyright © 2002, ATI Technologies Inc. All rights reserved. ATI and all ATI product and product feature names are trademarks and/or registered trademarks of ATI Technologies Inc. All other company and/or product names are trademarks and/or registered trademarks of their respective owners. Features, performance and specifications are subject to change without notice. Product may not be exactly as shown in the diagrams. Reproduction of this manual, or parts thereof, in any form, without the express written permission of ATI Technologies Inc. is strictly prohibited. Disclaimer While every precaution has been taken in the preparation of this document, ATI Technologies Inc. assumes no liability with respect to the operation or use of ATI hardware, software or other products and documentation described herein, for any act or omission of ATI concerning such products or this documentation, for any interruption of service, loss or interruption of business, loss of anticipatory profits, or for punitive, incidental or consequential damages in connection with the furnishing, performance, or use of the ATI hardware, software, or other products and documentation provided herein. ATI Technologies Inc. reserves the right to make changes without further notice to a product or system described herein to improve reliability, function or design. With respect to ATI products which this document relates, ATI disclaims all express or implied warranties regarding such products, including but not limited to, the implied warranties of merchantability, fitness for a particular purpose, and non-infringement. Page ii 1 Introduction The RADEON 7000 MAC EDITION represents the next generation in 3D and video acceleration for your Power Macintosh computer. -
Motherboard Gigabyte Ga-A75n-Usb3
Socket AM3+ - AMD 990FX - GA-990FXA-UD5 (rev. 1.x) Socket AM3+ Pagina 1/3 GA- Model 990FXA- Motherboard UD5 PCB 1.x Since L2 L3Core System vendor CPU Model Frequency Process Stepping Wattage BIOS Name Cache Cache Bus(MT/s) Version AMD FX-8150 3600MHz 1MBx8 8MB Bulldozer 32nm B2 125W 5200 F5 AMD FX-8120 3100MHz 1MBx8 8MB Bulldozer 32nm B2 125W 5200 F5 AMD FX-8120 3100MHz 1MBx8 8MB Bulldozer 32nm B2 95W 5200 F5 AMD FX-8100 2800MHz 1MBx8 8MB Bulldozer 32nm B2 95W 5200 F5 AMD FX-6100 3300MHz 1MBx6 8MB Bulldozer 32nm B2 95W 5200 F5 AMD FX-4100 3600MHz 1MBx4 8MB Bulldozer 32nm B2 95W 5200 F5 Socket AM3 GA- Model 990FXA- Motherboard UD5 PCB 1.x Since L2 L3Core System vendor CPU Model Frequency Process Stepping Wattage BIOS Name Cache Cache Bus(MT/s) Version AMD Phenom II X6 1100T 3300MHz 512KBx6 6MB Thuban 45nm E0 125W 4000 F2 AMD Phenom II X6 1090T 3200MHz 512KBx6 6MB Thuban 45nm E0 125W 4000 F2 AMD Phenom II X6 1075T 3000MHz 512KBx6 6MB Thuban 45nm E0 125W 4000 F2 AMD Phenom II X6 1065T 2900MHz 512KBx6 6MB Thuban 45nm E0 95W 4000 F2 AMD Phenom II X6 1055T 2800MHz 512KBx6 6MB Thuban 45nm E0 125W 4000 F2 AMD Phenom II X6 1055T 2800MHz 512KBx6 6MB Thuban 45nm E0 95W 4000 F2 AMD Phenom II X6 1045T 2700MHz 512KBx6 6MB Thuban 45nm E0 95W 4000 F2 AMD Phenom II X6 1035T 2600MHz 512KBx6 6MB Thuban 45nm E0 95W 4000 F2 AMD Phenom II X4 980 3700MHz 512KBx4 6MB Deneb 45nm C3 125W 4000 F6 AMD Phenom II X4 975 3600MHz 512KBx4 6MB Deneb 45nm C3 125W 4000 F2 AMD Phenom II X4 970 3500MHz 512KBx4 6MB Deneb 45nm C3 125W 4000 F2 AMD Phenom II X4 965 3400MHz 512KBx4 -
MSI Afterburner V4.6.4
MSI Afterburner v4.6.4 MSI Afterburner is ultimate graphics card utility, co-developed by MSI and RivaTuner teams. Please visit https://msi.com/page/afterburner to get more information about the product and download new versions SYSTEM REQUIREMENTS: ...................................................................................................................................... 3 FEATURES: ............................................................................................................................................................. 3 KNOWN LIMITATIONS:........................................................................................................................................... 4 REVISION HISTORY: ................................................................................................................................................ 5 VERSION 4.6.4 .............................................................................................................................................................. 5 VERSION 4.6.3 (PUBLISHED ON 03.03.2021) .................................................................................................................... 5 VERSION 4.6.2 (PUBLISHED ON 29.10.2019) .................................................................................................................... 6 VERSION 4.6.1 (PUBLISHED ON 21.04.2019) .................................................................................................................... 7 VERSION 4.6.0 (PUBLISHED ON