RF CMOS: Integrated on a Chip FE ANALOG Modules: ANALOG
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Semiconductor Sector Report
SEMICONDUCTOR SECTOR REPORT SAVVIAN, LLC 150 CALIFORNIA STREET, SAN FRANCISCO, CA 94111 | www.savvian.com | 415.318.3600 MARKET HIGHLIGHTS Inside this issue MARKETMARKET HIGHLIGHTSHIGHLIGHTS STMicroelectronics (NYSE:STM, Paris: STM.PA, Milan:STM.MI), Intel (NASDAQ:INTC) and Francisco Partners entered into a definitive agreement to create a new independent semiconductor company from the key assets of businesses which Market Highlights last year generated approximately $3.6Bn in combined annual revenue. The new company’s strategic focus will be on Summary Performance supplying flash memory solutions for a variety of consumer and industrial devices. Two Global Positioning Systems (GPS) related private companies were acquired, confirming the emerging significance of Observations GPS-related technology in the semiconductor industry. In early June, Broadcom (NASDAQ: BRCM) signed a definitive Trading Data agreement to acquire Global Locate, Inc for $226MM. In late June, GPS chipmaker SiRF Technology Holdings Inc. (NASDAQ: SIRF) announced the purchase of Centrality Communications for $283MM. Transaction Activity Early in the quarter, Linear Technology announced a $3Bn Accelerated Stock Repurchase in combination with $1.7Bn in Savvian Update privately placed convertible senior notes. This financing was noticed and emulated by numerous other large capitalization companies who are seeking to optimize their capital structures in light of increased shareholder pressure and private equity interest. Applied Materials (NASDAQ:AMAT) acquired HCT Shaping Systems, a Swiss solar company, for CHF 583MM ($475MM) in cash, extending the company’s reach in the solar industry. The acquisition advances AMAT’s strategy leveraging its semiconductor process capability into complementary adjacent markets. Zarlink (NYSE / TSX: ZL) signed a definitive agreement to acquire privately held Legerity Holdings for $135MM in cash. -
Advanced Packaging Solutions
Advanced Packaging Solutions Highlights Providing silicon-scaling • Advanced packaging capabilities in solutions for tomorrow’s applications 2.5D, 3D, WLP and Silicon Photonics GLOBALFOUNDRIES post-fab services provide complementary and extended • Power, performance, cost and solutions with complete supply chain management including bump, probe, form-factor optimized solutions packaging and final test. The flexible supply chain model is tailored to your • Industry leader in smart interposers needs with services ranging from bump and probe only to a more comprehen- sive spectrum of services including package design, assembly and test. • In-house bump and wafer probe capabilities In addition to in-house bump and probe capabilities, we provide packaging • Advanced memory integration services in collaboration with a network of established OSAT partners, includ- with stacked memories ing 2D packages as well as 2.5D and 3D advanced package technologies. Test development and capabilities include RF, analog, embedded memory, • Ownership and process maturity for HVM and mmWave applications, with wide array of tester platforms for wafer sort operations. • Advanced silicon node CPI and qualification Packaging Requirements • RF system-in-package and Package types are selected based on performance requirements and optimized mmWave packaging capability for market segments including IoT, RF, Automotive, Mobile, High-end • Partnerships and strong relationships Computing, Networking and Storage. with leading-edge OSATs • Flexible supply chain and Mobile IoT RF Automotive Computing Networking Storage collaborative business models QFN FBGA WLCSP FOWLP SiP fcCSP FCBGA 2.5D 3D Si-PH Advanced Packaging Solutions Packaging Technologies TSV Si Interposer Availability GF Si nodes are qualified in a wide range of package Full Reticle 26x33mm2 technologies including 2D wirebond designs, flip Stitched Interposer >1300 mm2 chip, WLCSP and FOWLP configurations, as well 10:1 Aspect Ratio TSV 10um Dia./ 100um Depth as 2.5D, 3D and Si-Photonics. -
TOWER SEMICONDUCTOR LTD. (Translation of Registrant's Name Into English)
FORM 6-K SECURITIES AND EXCHANGE COMMISSION Washington, D.C. 20549 For the month January 2021 No. 1 TOWER SEMICONDUCTOR LTD. (Translation of registrant's name into English) Ramat Gavriel Industrial Park P.O. Box 619, Migdal Haemek, Israel 2310502 (Address of principal executive offices) Indicate by check mark whether the registrant files or will file annual reports under cover Form 20-F or Form 40-F. Form 20-F ☒ Form 40-F ☐ Indicate by check mark whether the registrant by furnishing the information contained in this Form is also thereby furnishing the information to the Commission pursuant to Rule 12g3-2(b) under the Securities Exchange Act of 1934. Yes ☐ No ☒ On January 5, 2021, the Registrant Announce Program Creating an Integrated-Laser-on-Silicon Photonics Foundry Process SIGNATURES Pursuant to the requirements of the Securities Exchange Act of 1934, the registrant has duly caused this report to be signed on its behalf by the undersigned, thereunto duly authorized. TOWER SEMICONDUCTOR LTD. Date: January 5, 2021 By: /s/ Nati Somekh Name: Nati Somekh Title: Corporate Secretary NEWS ANNOUNCEMENT FOR IMMEDIATE RELEASE Tower Semiconductor Announces Program Creating an Integrated-Laser-on-Silicon Photonics Foundry Process Advanced process to be developed with partial funding from the DARPA LUMOS program addressing high-speed communications MIGDAL HAEMEK, Israel, January 05, 2021 – Tower Semiconductor (NASDAQ/TASE: TSEM), the leader in high-value analog semiconductor foundry solutions, today announced that it is participating in the LUMOS program, with partial support from DARPA, to create a semiconductor foundry integrated-laser-on-silicon photonics process. This process will combine high performance III-V laser diodes with Tower’s PH18 production silicon photonics platform. -
TOWER SEMICONDUCTOR LTD. (Translation of Registrant's Name Into English)
FORM 6-K SECURITIES AND EXCHANGE COMMISSION Washington, D.C. 20549 For the month May 2018 No. 3 TOWER SEMICONDUCTOR LTD. (Translation of registrant's name into English) Ramat Gavriel Industrial Park P.O. Box 619, Migdal Haemek, Israel 2310502 (Address of principal executive offices) Indicate by check mark whether the registrant files or will file annual reports under cover Form 20-F or Form 40-F. Form 20-F ☒ Form 40-F ☐ Indicate by check mark whether the registrant by furnishing the information contained in this Form is also thereby furnishing the information to the Commission pursuant to Rule 12g3-2(b) under the Securities Exchange Act of 1934. Yes ☐ No ☒ On May 9, 2018, the Registrant and Newsight Imaging Announce Advanced CMOS Image Sensor Chips for LiDAR used in ADAS and Autonomous Vehicles SIGNATURES Pursuant to the requirements of the Securities Exchange Act of 1934, the registrant has duly caused this report to be signed on its behalf by the undersigned, thereunto duly authorized. TOWER SEMICONDUCTOR LTD. Date: May 9, 2018 By: /s/ Nati Somekh Name: Nati Somekh Title: Corporate Secretary NEWS ANNOUNCEMENT FOR IMMEDIATE RELEASE TowerJazz and Newsight Imaging Announce Advanced CMOS Image Sensor Chips for LiDAR used in ADAS and Autonomous Vehicles Customized for high volume markets of automotive visual safety solutions as well as drones and autonomous home appliance robots MIGDAL HAEMEK and NESS ZIONA, Israel, May 9, 2018 – TowerJazz, the global specialty foundry leader, and Newsight Imaging, today announced production of Newsight’s advanced CMOS image sensor (CIS) chips and camera modules, customized for very high volume LiDAR and machine vision markets, combining sensors, digital algorithms and pixel array on the same chip. -
Spring 2017 Industry Study Industry Report Electronics
Spring 2017 Industry Study Industry Report Electronics The Dwight D. Eisenhower School for National Security and Resource Strategy National Defense University Fort McNair, Washington, DC 20319-5062 i ELECTRONICS 2017 ABSTRACT: While currently assessed as mature and healthy, the global semiconductor industry is facing a strategic inflection point. This inflection will shape a future for the industry that is significantly different than the past. Although outlook for that future remains favorable, numerous challenges place that future at risk. Challenges found in Chinese competition, skilled workforce shortages, commercial semiconductor market shifts, unique DoD electronics needs, and ongoing requirements for rapid innovation threaten the stability of the market, the U.S. competitive advantage, and U.S. economic and national security. Future success in the industry hinges upon policies which address these challenges and enable U.S. companies to embrace future opportunities. LTC Khalid Alothman, Saudi Arabian Army CDR Terri L. Gabriel, U.S. Navy LTC Kevin F. Hanrahan, U.S. Army COL Jeffrey Howell, U.S. Army Mr. Benjamin Lam, U.S. Dept. of State Mr. Steven Mapes, Office of the Secretary of Defense Lt Col Adrian Meyer, Air National Guard COL Michael Samson, Philippine Army Col James E. Smith, U.S. Air Force Mr. Keith Smithson, Dept. of Energy COL William Smoot, U.S. Army Mr. Sim Walker, Dept. of the Army Lt Col Aaron Weiner, U.S. Air Force Ms. Denise L. Williams, Office of the Secretary of Defense Dr. Stephen Basile, Faculty Mr. Michael Dixon, Department of State, Faculty Col Thomas A. Santoro, Jr., U.S. Air Force, Faculty ii Industry Study Outreach and Field Studies On Campus Presenters BAE Systems, Inc., Arlington, VA Bureau of East Asian and Pacific Affairs, U.S. -
Heading Towards Big Data Building a Better Data Warehouse for More Data, More Speed, and More Users
Heading Towards Big Data Building A Better Data Warehouse For More Data, More Speed, And More Users Raymond Gardiner Goss [email protected] Kousikan Veeramuthu [email protected] Manufacturing Technology GLOBALFOUNDRIES Malta, NY, USA Abstract—As a new company, GLOBALFOUNDRIES is determine the caller’s income level and specify to which agent aggressively agile and looking at ways to not just mimic existing to route the call or the switch would timeout. When switches semiconductor manufacturing data management but to leverage were overwhelmed with data, they would drop packets and new technologies and advances in data management without algorithms had to infer states based on most probable current sacrificing performance or scalability. Being a global technology state. Other industries, such as social media, are challenged company that relies on the understanding of data, it is important to centralize the visibility and control of this information, bringing more by unstructured data and need tools to help turn text it to the engineers and customers as they need it. messages and photos into useful information for search engines and marketing purposes. The challenge in the semiconductor Currently, the factories are employing the best practices and world is with the size of the data. Speed becomes a secondary data architectures combined with business intelligence analysis problem because so many sources are needed to be joined and reporting tools. However, the expected growth in data over together in a timely manner. Large recipes, complex output the next several years and the need to deliver more complex data integration for analysis will easily stress the traditional tools from the test floor combined now with more Interface-A trace beyond the limits of the traditional data infrastructure. -
Boa Motion to Dismiss
Case 21-10036-CSS Doc 211-4 Filed 02/15/21 Page 425 of 891 Disposition of the Stapled Securities Gain on sale of Stapled Securities by a Non-U.S. Stapled Securityholder will not be subject to U.S. federal income taxation unless (i) the Non-U.S. Stapled Securityholder’s investment in the Stapled Securities is effectively connected with its conduct of a trade or business in the United States (and, if provided by an applicable income tax treaty, is attributable to a permanent establishment or fixed base the Non-U.S. Stapled Securityholder maintains in the United States) and a properly completed Form W-8ECI has not been provided, (ii) the Non-U.S. Stapled Securityholder is present in the United State for 183 days or more in the taxable year of the sale and other specified conditions are met, or (iii) the Non-U.S. Stapled Securityholder is subject to U.S. federal income tax pursuant to the provisions of the U.S. tax law applicable to U.S. expatriates. If gain on the sale of Stapled Securities would be subject to U.S. federal income taxation, the Stapled Securityholder would generally recognise any gain or loss equal to the difference between the amount realised and the Stapled Securityholder’s adjusted basis in its Stapled Securities that are sold or exchanged. This gain or loss would be capital gain or loss, and would be long-term capital gain or loss if the Stapled Securityholder’s holding period in its Stapled Securities exceeds one year. In addition, a corporate Non-U.S. -
Alphabetical Listing by Company Name
FOREIGN COMPANIES REGISTERED AND REPORTING WITH THE U.S. SECURITIES AND EXCHANGE COMMISSION December 31, 2015 Alphabetical Listing by Company Name COMPANY COUNTRY MARKET 21 Vianet Group Inc. Cayman Islands Global Market 37 Capital Inc. Canada OTC 500.com Ltd. Cayman Islands NYSE 51Job, Inc. Cayman Islands Global Market 58.com Inc. Cayman Islands NYSE ABB Ltd. Switzerland NYSE Abbey National Treasury Services plc United Kingdom NYSE - Debt Abengoa S.A. Spain Global Market Abengoa Yield Ltd. United Kingdom Global Market Acasti Pharma Inc. Canada Capital Market Acorn International, Inc. Cayman Islands NYSE Actions Semiconductor Co. Ltd. Cayman Islands Global Market Adaptimmune Ltd. United Kingdom Global Market Adecoagro S.A. Luxembourg NYSE Adira Energy Ltd. Canada OTC Advanced Accelerator Applications SA France Global Market Advanced Semiconductor Engineering, Inc. Taiwan NYSE Advantage Oil & Gas Ltd. Canada NYSE Advantest Corp. Japan NYSE Aegean Marine Petroleum Network Inc. Marshall Islands NYSE AEGON N.V. Netherlands NYSE AerCap Holdings N.V. Netherlands NYSE Aeterna Zentaris Inc. Canada Capital Market Affimed N.V. Netherlands Global Market Agave Silver Corp. Canada OTC Agnico Eagle Mines Ltd. Canada NYSE Agria Corp. Cayman Islands NYSE Agrium Inc. Canada NYSE AirMedia Group Inc. Cayman Islands Global Market Aixtron SE Germany Global Market Alamos Gold Inc. Canada NYSE Alcatel-Lucent France NYSE Alcobra Ltd. Israel Global Market Alexandra Capital Corp. Canada OTC Alexco Resource Corp. Canada NYSE MKT Algae Dynamics Corp. Canada OTC Algonquin Power & Utilities Corp. Canada OTC Alianza Minerals Ltd. Canada OTC Alibaba Group Holding Ltd. Cayman Islands NYSE Allot Communications Ltd. Israel Global Market Almaden Minerals Ltd. -
Advanced Micro Devices (AMD)
Strategic Report for Advanced Micro Devices, Inc. Tad Stebbins Andrew Dialynas Rosalie Simkins April 14, 2010 Advanced Micro Devices, Inc. Table of Contents Executive Summary ............................................................................................ 3 Company Overview .............................................................................................4 Company History..................................................................................................4 Business Model..................................................................................................... 7 Market Overview and Trends ...............................................................................8 Competitive Analysis ........................................................................................ 10 Internal Rivalry................................................................................................... 10 Barriers to Entry and Exit .................................................................................. 13 Supplier Power.................................................................................................... 14 Buyer Power........................................................................................................ 15 Substitutes and Complements............................................................................ 16 Financial Analysis ............................................................................................. 18 Overview ............................................................................................................ -
Fidelity® Nasdaq Composite Index® Fund
Quarterly Holdings Report for Fidelity® Nasdaq Composite Index® Fund February 28, 2021 EIF-QTLY-0421 1.814098.116 Schedule of Investments February 28, 2021 (Unaudited) Showing Percentage of Net Assets Common Stocks – 99.7% Shares Value COMMUNICATION SERVICES – 16.7% Diversified Telecommunication Services – 0.2% Alaska Communication Systems Group, Inc. 34,501 $ 112,818 Anterix, Inc. (a) 7,844 331,252 ATN International, Inc. 7,220 351,470 Bandwidth, Inc. (a) (b) 12,082 1,913,306 Cogent Communications Group, Inc. (b) 25,499 1,526,115 Consolidated Communications Holdings, Inc. (a) 21,768 114,500 Iridium Communications, Inc. (a) 77,117 2,954,352 Liberty Global PLC: Class A (a) 112,326 2,766,028 Class B (a) 327 7,521 Class C (a) 204,417 4,967,333 Liberty Latin America Ltd.: Class A (a) 17,405 190,933 Class C (a) 105,781 1,159,360 ORBCOMM, Inc. (a) 54,925 419,078 Radius Global Infrastructure, Inc. (a) (b) 37,222 460,808 Sify Technologies Ltd. sponsored ADR (a) (b) 7,275 22,916 Vonage Holdings Corp. (a) 142,421 1,882,806 19,180,596 Entertainment – 2.5% Activision Blizzard, Inc. 429,734 41,086,868 Bilibili, Inc. ADR (a) (b) 99,200 12,496,224 Blue Hat Interactive Entertainment Technology (a) (b) 13,117 16,659 Chicken Soup For The Soul Entertainment, Inc. (a) 2,009 51,370 Cinedigm Corp. (a) 73,305 102,627 CuriosityStream, Inc. Class A (a) 24,573 426,833 DouYu International Holdings Ltd. ADR (a) 82,330 1,180,612 Electronic Arts, Inc. -
TOWER SEMICONDUCTOR LTD. (Translation of Registrant's Name Into English)
FORM 6-K SECURITIES AND EXCHANGE COMMISSION Washington, D.C. 20549 For the month February 2020 No. 2 TOWER SEMICONDUCTOR LTD. (Translation of registrant's name into English) Ramat Gavriel Industrial Park P.O. Box 619, Migdal Haemek, Israel 2310502 (Address of principal executive offices) Indicate by check mark whether the registrant files or will file annual reports under cover Form 20-F or Form 40-F. Form 20-F ☒ Form 40-F ☐ Indicate by check mark whether the registrant by furnishing the information contained in this Form is also thereby furnishing the information to the Commission pursuant to Rule 12g3-2(b) under the Securities Exchange Act of 1934. Yes ☐ No ☒ On February 27, 2020, the Registrant Announced a New Brand Identity SIGNATURES Pursuant to the requirements of the Securities Exchange Act of 1934, the registrant has duly caused this report to be signed on its behalf by the undersigned, thereunto duly authorized. TOWER SEMICONDUCTOR LTD. Date: Feb. 27, 2020 By: /s/ Nati Somekh Name: Nati Somekh Title: Corporate Secretary NEWS ANNOUNCEMENT FOR IMMEDIATE RELEASE TowerJazz Announces New Brand Identity New brand reflects Company's global presence and strength, highlighting its focus to provide the highest value analog semiconductor solutions, further solidifying its position as a market leader MIGDAL HAEMEK, Israel – February 27, 2020 – TowerJazz, the global specialty foundry leader, (NASDAQ/TASE: TSEM), today announced the launch of a new brand identity to reflect Company's global presence and strength, and highlight its focus to provide the highest value analog semiconductor solutions. The new brand identity will be launched on March 1st, 2020 and will include updates to Company’s brand name, vision, mission, values, logo, tagline, website and graphic design approach. -
14Nm Finfet Technology
14LPP 14nm FinFET Technology Highlights Enabling Connected Intelligence • 14nm FinFET technology GLOBALFOUNDRIES 14LPP 14nm FinFET process technology platform is + Manufactured in state-of-the-art ideal for high-performance, power-efficient SoCs in demanding, high-volume facilities in Saratoga County, New York applications. + Volume production in Computing, 3D FinFET transistor technology provides best-in-class performance and Networking, Mobile and Server power with significant cost advantages from 14nm area scaling. 14LPP applications technology can provide up to 55% higher device performance and 60% • Ideal for high-performance, lower total power compared to 28nm technologies. power-efficient SoC applications + Cloud / Data Center servers Lg Gate length shrink enables + CPU and GPU performance scaling + High-end mobile processors + Automotive ADAS FET is turned on its edge + Wired and wireless networking + IoT edge computing • Lower supply voltage • Comprehensive design ecosystem • Reduced off-state leakage + Full foundation and complex • Faster switching speed IP libraries – high drive current + PDK and reference flows supported by major EDA and IP partners + Robust DFM solutions Target Applications and Solutions • Complete services and Mobile Apps Processor High Performance Compute & Networking supply chain support 60% power reduction 60% power reduction 2x # cores + Regularly scheduled MPWs 80% higher performance, >2.2GHz >3GHz maximum performance + Advanced packaging and test solutions, including 2.5/3D products 45% area reduction