PART I: People & Strategy
Total Page:16
File Type:pdf, Size:1020Kb
Load more
Recommended publications
-
Fenwick Employment Brief
Fenwick Employment Brief December 10, 2008 Victor Schachter Editor 650.335.7905 Mary Wang Contributor 650.335.7154 planning a workforce reduction: a brief checklist In current economic times, more and more companies are turning to “reductions in force” or “RIFs.” While RIFs can provide both short and long-term economic benefits, they are also among the most difficult events an attorney or human resources professional must oversee because of the emotional and economic impact they will have on employees, the myriad of complex laws that must be observed, and the enormous amount of work that is usually required in a very short amount of time. Thoughtful and careful planning is important not only to ensure compliance with legal requirements, but also help to minimize the adverse effects of a workforce reduction, further reducing the risk of lawsuits. The following checklist provides some practical guidance to assist employers in implementing a reduction in force and to minimize legal risks. This checklist does not address all the possible issues arising from a RIF and we encourage you to consult with counsel as part of your planning and implementation of a RIF. planning and construction of a layoff n Identify triggering events for layoff n Identify possible layoff alternatives (e.g., pay cuts, schedule reductions, temporary shutdowns and vacation/PTO drawdown, reduction of contractor headcount) n Identify affected sites and estimate number of affected employees for WARN and other analyses n Establish the RIF management team: Identify the individuals -
Advanced Packaging Solutions
Advanced Packaging Solutions Highlights Providing silicon-scaling • Advanced packaging capabilities in solutions for tomorrow’s applications 2.5D, 3D, WLP and Silicon Photonics GLOBALFOUNDRIES post-fab services provide complementary and extended • Power, performance, cost and solutions with complete supply chain management including bump, probe, form-factor optimized solutions packaging and final test. The flexible supply chain model is tailored to your • Industry leader in smart interposers needs with services ranging from bump and probe only to a more comprehen- sive spectrum of services including package design, assembly and test. • In-house bump and wafer probe capabilities In addition to in-house bump and probe capabilities, we provide packaging • Advanced memory integration services in collaboration with a network of established OSAT partners, includ- with stacked memories ing 2D packages as well as 2.5D and 3D advanced package technologies. Test development and capabilities include RF, analog, embedded memory, • Ownership and process maturity for HVM and mmWave applications, with wide array of tester platforms for wafer sort operations. • Advanced silicon node CPI and qualification Packaging Requirements • RF system-in-package and Package types are selected based on performance requirements and optimized mmWave packaging capability for market segments including IoT, RF, Automotive, Mobile, High-end • Partnerships and strong relationships Computing, Networking and Storage. with leading-edge OSATs • Flexible supply chain and Mobile IoT RF Automotive Computing Networking Storage collaborative business models QFN FBGA WLCSP FOWLP SiP fcCSP FCBGA 2.5D 3D Si-PH Advanced Packaging Solutions Packaging Technologies TSV Si Interposer Availability GF Si nodes are qualified in a wide range of package Full Reticle 26x33mm2 technologies including 2D wirebond designs, flip Stitched Interposer >1300 mm2 chip, WLCSP and FOWLP configurations, as well 10:1 Aspect Ratio TSV 10um Dia./ 100um Depth as 2.5D, 3D and Si-Photonics. -
Think Journey Business and AI Campus
Think Journey Business and AI Campus March 19–March 22 Mandalay Bay Convention Center Las Vegas Think is the flagship IBM® conference built to help enhance or jumpstart your journey to AI and the cloud. Forty-thousand of the world’s most inspiring innovators, leaders and thinkers will be in attendance; gathering to learn how AI can solve business challenges, and to discuss the current state of the art and the future possibilities of AI. Think is IBM’s only conference in 2018, and it will be your last chance until Think 2019 to learn how to make the most of AI for your business. 1 Table of Contents Top seven things to know about AI, Watson™ and Think 2018 03 Access to Watson expertise and leadership 03 Think week at-a-glance 04 Watson clients and partners 04 Entertainment at Think 04 Watson Primer 05 Watson at Work Activations 06 Future of the Call Center in Augmented Reality 07 With Watson Studio 08 The eight sessions everyone should attend 09 Watson tech talks for beginners to experts 11 Client sessions not to be missed 13 Think Campus Map 20 Watson Campus Map 20 IBM Events mobile app 21 Transportation 21 Think Journey | Business and AI Campus 2 Top seven things to know about AI, Watson and Think 2018 1. Be the first to hear about the newest Watson AI products and solutions to be unveiled at Think 2. Attend one of 50+ client-led sessions to learn about projects with Watson 3. Develop or evolve your AI strategy and business case in hands-on sessions with IBM AI experts 4. -
Spring 2017 Industry Study Industry Report Electronics
Spring 2017 Industry Study Industry Report Electronics The Dwight D. Eisenhower School for National Security and Resource Strategy National Defense University Fort McNair, Washington, DC 20319-5062 i ELECTRONICS 2017 ABSTRACT: While currently assessed as mature and healthy, the global semiconductor industry is facing a strategic inflection point. This inflection will shape a future for the industry that is significantly different than the past. Although outlook for that future remains favorable, numerous challenges place that future at risk. Challenges found in Chinese competition, skilled workforce shortages, commercial semiconductor market shifts, unique DoD electronics needs, and ongoing requirements for rapid innovation threaten the stability of the market, the U.S. competitive advantage, and U.S. economic and national security. Future success in the industry hinges upon policies which address these challenges and enable U.S. companies to embrace future opportunities. LTC Khalid Alothman, Saudi Arabian Army CDR Terri L. Gabriel, U.S. Navy LTC Kevin F. Hanrahan, U.S. Army COL Jeffrey Howell, U.S. Army Mr. Benjamin Lam, U.S. Dept. of State Mr. Steven Mapes, Office of the Secretary of Defense Lt Col Adrian Meyer, Air National Guard COL Michael Samson, Philippine Army Col James E. Smith, U.S. Air Force Mr. Keith Smithson, Dept. of Energy COL William Smoot, U.S. Army Mr. Sim Walker, Dept. of the Army Lt Col Aaron Weiner, U.S. Air Force Ms. Denise L. Williams, Office of the Secretary of Defense Dr. Stephen Basile, Faculty Mr. Michael Dixon, Department of State, Faculty Col Thomas A. Santoro, Jr., U.S. Air Force, Faculty ii Industry Study Outreach and Field Studies On Campus Presenters BAE Systems, Inc., Arlington, VA Bureau of East Asian and Pacific Affairs, U.S. -
Heading Towards Big Data Building a Better Data Warehouse for More Data, More Speed, and More Users
Heading Towards Big Data Building A Better Data Warehouse For More Data, More Speed, And More Users Raymond Gardiner Goss [email protected] Kousikan Veeramuthu [email protected] Manufacturing Technology GLOBALFOUNDRIES Malta, NY, USA Abstract—As a new company, GLOBALFOUNDRIES is determine the caller’s income level and specify to which agent aggressively agile and looking at ways to not just mimic existing to route the call or the switch would timeout. When switches semiconductor manufacturing data management but to leverage were overwhelmed with data, they would drop packets and new technologies and advances in data management without algorithms had to infer states based on most probable current sacrificing performance or scalability. Being a global technology state. Other industries, such as social media, are challenged company that relies on the understanding of data, it is important to centralize the visibility and control of this information, bringing more by unstructured data and need tools to help turn text it to the engineers and customers as they need it. messages and photos into useful information for search engines and marketing purposes. The challenge in the semiconductor Currently, the factories are employing the best practices and world is with the size of the data. Speed becomes a secondary data architectures combined with business intelligence analysis problem because so many sources are needed to be joined and reporting tools. However, the expected growth in data over together in a timely manner. Large recipes, complex output the next several years and the need to deliver more complex data integration for analysis will easily stress the traditional tools from the test floor combined now with more Interface-A trace beyond the limits of the traditional data infrastructure. -
Boa Motion to Dismiss
Case 21-10036-CSS Doc 211-4 Filed 02/15/21 Page 425 of 891 Disposition of the Stapled Securities Gain on sale of Stapled Securities by a Non-U.S. Stapled Securityholder will not be subject to U.S. federal income taxation unless (i) the Non-U.S. Stapled Securityholder’s investment in the Stapled Securities is effectively connected with its conduct of a trade or business in the United States (and, if provided by an applicable income tax treaty, is attributable to a permanent establishment or fixed base the Non-U.S. Stapled Securityholder maintains in the United States) and a properly completed Form W-8ECI has not been provided, (ii) the Non-U.S. Stapled Securityholder is present in the United State for 183 days or more in the taxable year of the sale and other specified conditions are met, or (iii) the Non-U.S. Stapled Securityholder is subject to U.S. federal income tax pursuant to the provisions of the U.S. tax law applicable to U.S. expatriates. If gain on the sale of Stapled Securities would be subject to U.S. federal income taxation, the Stapled Securityholder would generally recognise any gain or loss equal to the difference between the amount realised and the Stapled Securityholder’s adjusted basis in its Stapled Securities that are sold or exchanged. This gain or loss would be capital gain or loss, and would be long-term capital gain or loss if the Stapled Securityholder’s holding period in its Stapled Securities exceeds one year. In addition, a corporate Non-U.S. -
Building the Cognitive Enterprise: Nine Action Areas Deep Dive
Research Insights Building the Cognitive Enterprise: Nine Action Areas Deep Dive This Deep Dive document is the in- depth version. For an abridged version, please read, “Building the Cognitive Enterprise: Nine Action Areas, Core Concepts.” Building the Cognitive Enterprise | 1 Mark Foster Senior Vice President IBM Services and Global Business Services Introduction A new era of business reinvention is dawning. Organizations are facing an unprecedented convergence of technological, social, and regulatory forces. As artificial intelligence, blockchain, automation, Internet of Things, 5G, and edge computing become pervasive, their combined impact will reshape standard business architectures. The “outside-in” digital transformation of the past decade is giving way to the “inside-out” potential of data exploited with these exponential technologies. We call this next-generation business model the Cognitive Enterprise™. 2 | Building the Cognitive Enterprise Table of contents Executive summary 3 Introduction to the Cognitive Enterprise 4 Chapter 1 Market-making Business Platforms 11 – Double down on “Big Bets” 15 – Create a new business blueprint 19 – Orchestrate compelling change 22 – Action guide 25 Chapter 2 Intelligent Workflows 26 – Embed exponential technologies 31 – Drive value from data 37 – Deploy through hybrid multicloud 39 – Action guide 42 Chapter 3 Enterprise Experience and Humanity 43 – Elevate human-technology partnerships 47 – Cultivate smart leadership, skills, and culture 51 – Perform with purposeful agility 55 – Action guide 58 Chapter 4 New way of building: Garage 59 Conclusion A new way to grow, a new way to compete 64 Related IBM Institute for Business Value studies 65 Notes and sources 66 Executive summary | 3 Executive summary The impact of the convergence of multiple exponential ever-clearer strategic bets that they are placing. -
Changeman ZMF Administrator's Guide
ChangeManZMF Administrator’s Guide © Copyright 2001-2019 Micro Focus or one of its affiliates. The only warranties for products and services of Micro Focus and its affiliates and licensors (“Micro Focus”) are set forth in the express warranty statements accompanying such products and services. Nothing herein should be construed as constituting an additional warranty. Micro Focus shall not be liable for technical or editorial errors or omissions contained herein. The information contained herein is subject to change without notice. Contains Confidential Information. Except as specifically indicated otherwise, a valid license is required for possession, use or copying. Consistent with FAR 12.211 and 12.212, Commercial Computer Software, Computer Software Documentation, and Technical Data for Commercial Items are licensed to the U.S. Government under vendor's standard commercial license. Product version: 8.2 Patch 2 Publication date: September 2019 Table of Contents Welcome to ChangeMan® ZMF. 9 Guide to ChangeMan ZMF Documentation. 9 ChangeMan ZMF Documentation Suite . 9 Using the Manuals . 11 Searching the ChangeMan ZMF Documentation Suite. 11 Using the ISPF Interface . 13 Description of the ISPF Interface. 13 Using Online Help . 13 Typographical Conventions . 14 Notes . 14 Chapter 1 Introduction . 15 Global Administrator . 16 Application Administrator . 16 Security Administrator . 16 ChangeMan ZMF Monitor . 17 General Administrator . 17 Chapter 2 What is ChangeMan ZMF? . 19 Change Package . 20 Impact Analysis . 20 Checkout . 20 Staging. 21 Audit . 21 Recompile and Relink . 22 Freeze . 22 Promotion . 23 Approval . 23 Production Installation . 23 Baseline Libraries and Delta Decks. 24 Backout Management Facilities . 24 Emergency Changes. 24 ChangeMan ZMF Life Cycle . 24 Chapter 3 Pre-Implementation Decisions . -
RF CMOS: Integrated on a Chip FE ANALOG Modules: ANALOG
TowerJazz (TSEM) Investor and Analyst Day November 16, 2016 | New York Safe Harbor This presentation contains forward-looking statements within the meaning of the “safe harbor” provisions of the Private Securities Litigation Reform Act of 1995. These statements are based on management’s current expectations and beliefs and are subject to a number of risks, uncertainties and assumptions that could cause actual results to differ materially from those described in the forward-looking statements. All statements other than statements of historical fact are statements that could be deemed forward-looking statements. For example, statements regarding expected (i) customer demand, (ii) utilization and cross utilization of our Fabs, (iii) growth in our end markets, (iv) market and technology trends, and (v) growth in revenues, cash flow, margins and net profits are all forward-looking statements. Actual results may differ materially from those projected or implied by such forward-looking statements due to various risks and uncertainties applicable to TowerJazz’s business as described in the reports filed by Tower Semiconductor Ltd. (“Tower”) with the Securities and Exchange Commission (the “SEC”) and the Israel Securities Authority (“ISA”), including the risks identified under the heading "Risk Factors" in Tower’s most recent filings on Forms 20-F and 6-K. No assurances can be given that any of the events anticipated by the forward-looking statements will transpire or occur, or if any of them do, what impact they will have on the results of operations or financial condition of TowerJazz. TowerJazz is providing this information as of the date of this presentation and expressly disclaims any obligation to update any of the forward-looking statements or other information contained in this document as a result of new information, future events or otherwise. -
Preliminary Injunctions in Non-Compete Cases
G THE B IN EN V C R H E S A N 8 8 D 8 B 1 AR SINCE WWW. NYLJ.COM ©2009 INCISIVE MEDIA US PROPERTIES, LLC VOLUME 242—NO. 65 THURSDAY, OCTOBER 1, 2009 SOUTHERN DISTRICT CIVIL PRACTICE ROUNDUP Expert Analysis Preliminary Injunctions In Non-Compete Cases or employees who possess confiden- The Second Circuit has not yet sought to tial business information, the threat re-tool the longstanding standard operative of a preliminary injunction can make in this circuit for entry of a preliminary Fchanging jobs a highrisk proposition. injunction,7 and we do not read Winter as To prevent, or at least forestall, the loss of overruling the Second Circuit’s approach. confidential information to the competi- We do note, however, that Winter could be tion, employers occasionally seek prelimi- read to require consideration of the private nary injunctions, regarded as “one of the By ByAnd equities as well as the public interest in most drastic tools in the arsenal of judicial HowardEdward M.B. TheodoreJudith L. A. every case, including where the plaintiff remedies,”1 to enjoin departing employees EpsteinSpiro KeyesMogul has established both irreparable injury from working for competitors. The decision and a likelihood of success on the merits. whether to grant such relief generally turns A party must demonstrate either (1) a likeli- Many cases already consider these factors, on resolution of the tension between pro- hood of success on the merits of its claim or and thus, as a practical matter, Winter is tecting proprietary business information (2) “sufficiently serious” questions making unlikely to result in a significant change in on the one hand, and the strong public the merits “fair ground for litigation” plus Second Circuit law. -
Advanced Micro Devices (AMD)
Strategic Report for Advanced Micro Devices, Inc. Tad Stebbins Andrew Dialynas Rosalie Simkins April 14, 2010 Advanced Micro Devices, Inc. Table of Contents Executive Summary ............................................................................................ 3 Company Overview .............................................................................................4 Company History..................................................................................................4 Business Model..................................................................................................... 7 Market Overview and Trends ...............................................................................8 Competitive Analysis ........................................................................................ 10 Internal Rivalry................................................................................................... 10 Barriers to Entry and Exit .................................................................................. 13 Supplier Power.................................................................................................... 14 Buyer Power........................................................................................................ 15 Substitutes and Complements............................................................................ 16 Financial Analysis ............................................................................................. 18 Overview ............................................................................................................ -
Understanding the Motivations for Business to Create Shared Value 18 Case Studies 3
3 Understanding the Motivations for Business to Create Shared Value 18 Case Studies 3 Understanding the Motivations for Business to Create Shared Value 18 Case Studies Introduction - a Mix of Motivations for All but Organised in the Primary In this section, there are 18 case studies listing companies from Hong Kong and around the world who are embracing business for good. This is a snapshot of different types of activities, not a comprehensive analysis. The write-ups are based on interviews that the Consulting Team conducted mainly in the third and fourth quarter of 2019. Since this study is interested in what motivates businesses to do good, this section has been organised around three broad categories, based on our research and the interviews. The three categories are 1) New business opportunities 2) Leadership and 3) External influence. In reality,there are a variety of drivers that are driving these companies to behave differently, not just one. We have clustered the cases around the primary driver to do good. This categorisation should not be viewed in a strict sense - rather the motivations are interlinked and not mutually exclusive. New Business Opportunities Whilst Transforming Society This section lists companies who are primarily motivated by finding a new business opportunity, at the same time as tackling a societal challenge. 53 Hong Kong Broadband Network Purposeful Profits HKSAR “Under the goal of Making Hong Kong a Better Place to Live, HKBNers share a strong collective alignment of interest, and are extra passionate to deliver products, services and outcomes that are always great for our stakeholders and Hong Kong’s communities.