Before the Patent Trial and Appeal Board
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UNITED STATES PATENT AND TRADEMARK OFFICE ___________________________________ BEFORE THE PATENT TRIAL AND APPEAL BOARD ____________________________________ KOA CORPORATION, Petitioner, v. VISHAY DALE ELECTRONICS, LLC, Patent Owner. ____________________________________ Case No. IPR2019-00201 U.S. Patent No. 7,190,252 ___________________________________ PETITIONER KOA’S REPLY TO PATENT OWNER’S RESPONSE By: Scott M. Daniels, Reg. No. 32,562 Cindy H. Chen, Reg. No. 78,206 Attorneys for Petitioner Tel: 703-827-3800 / Fax: 571-395-8753 E-mail: [email protected] / [email protected] TABLE OF CONTENTS I. INTRODUCTION ............................................................................................ 1 II. BOARD’S DEFINITION OF “LEVEL OF ORDINARY SKILL IN THE ART” IS CORRECT ................................................................................ 1 III. PATENT OWNER’S PROPOSED CLAIM CONSTRUCTIONS SHOULD NOT BE ADOPTED ....................................................................... 2 A. “the upwardly presented termination surfaces of the first and second terminations forming a depression in the filler” ........................................... 2 B. “bonding” ...................................................................................................... 4 IV. NAKAMURA DISCLOSES A “DEPRESSION” IN THE FILLER ............... 7 A. Nakamura Discloses “Forming” Uncured Insulation Layer Before Folding Electrodes ........................................................................................ 8 B. Forming the “Laminated Structure” in Nakamura Results in a “Depression” Being Formed in Insulation Layer ......................................... 9 C. Claimed “Depression” Has No Size Limits ................................................ 12 D. Patent Owner’s Product-by-Process Arguments are Unavailing ................ 12 V. NAKAMURA DISCLOSES “BONDING” FILLER TO THE RESISTIVE ELEMENT AND TERMINATION SURFACES ..................... 14 A. Nakamura Discloses that Insulation Layer “Closely Adheres” to the Electrodes and Resistor ......................................................................... 14 B. Nakamura’s Insulation Layer is Applied as Uncured Resin That, When Cured, Bonds to Electrodes and Resistor Section ............................ 17 C. Patent Owner Does Not Dispute the Board’s Obviousness Determination .............................................................................................. 18 VI. NAKAMURA DISCLOSES “FORCING INTO CONTACT” AND “SQUEEZING” THE TERMINATION SURFACES ................................... 20 A. Forming the “Laminated Structure” of Nakamura Involves “Forcing into Contact” and “Squeezing” ................................................................... 20 i B. The ‘252 Patent Does Not Quantify “Forcing” and “Squeezing” .............. 22 VII. CLAIM 2 IS ANTICIPATED BY OR OBVIOUS OVER NAKAMURA .... 23 VIII. NAKAMURA DISCLOSES “PLACING A FILLER…ON THE LOWER SURFACE OF THE RESISTANCE ELEMENT” AND “BENDING THE FIRST AND SECOND TERMINATIONS DOWNWARDLY” (CLAIMS 15 & 19) ........................................................ 24 IX. CONCLUSION ............................................................................................... 25 ii TABLE OF AUTHORITIES Cases Continental Circuits LLC v. Intel Corp. et al., 915 F.3d 788, 129 U.S.P.Q.2d 1385 (Fed. Cir. 2019) ............................................ 3 Daifuku Co., Ltd. v. Murata Machinery, Ltd., IPR2015-00083, Paper 63, Final Written Decision (PTAB, May 3, 2016) ......... 15 In re Heck, 699 F.2d 1331, 216 USPQ 1038 (Fed. Cir. 1983) ................................................ 19 In re Thorpe, 777 F.2d 695, 227 USPQ 964 (Fed. Cir. 1985) .................................................... 13 Merck & Co. v. Biocraft Laboratories, 874 F.2d 804, 10 USPQ2d 1843 (Fed. Cir.), cert. denied, 493 U.S. 975 (1989) .............................................................................................. 19 iii TABLE OF EXHIBITS UPDATED OCTOBER 25, 2019 Exhibit Title New 1001 Declaration of Dr. Michael S. Randall with Curriculum Vitae 1002 U.S. Patent No. 7,190,252 (‘252) 1003 U.S. Patent No. 7,190,252 Patent File History (Excerpts) 1004 Merriam-Webster’s Collegiate Dictionary, 11th Ed. (2003) (Excerpts) 1005 U.S. Patent No. 5,604,477 (Rainer) 1006 Published Japanese Patent Application JP 2004-128000 to Nakamura (Certified English Translation) 1007 Published Japanese Patent Application JP 2004-128000 to Nakamura 1008 Mechanical Behavior of Laminated Steel Composites,” Lesuer, et al. International Materials Reviews, Vol. 41, No. 5, pp. 169- 197 (January 1996) 1009 “The Importance of Interlayers in Diffusion Welding – A Review,” by Akca and Gursel, Periodicals Of Engineering and Natural Sciences, Vol. 3, No. 2, (2015) 1010 Certificate of Translation for Published Japanese Patent Application JP 2004-128000 to Nakamura 1011 U.S. Patent 7,541,264 (Gardner et al.) X 1012 U.S. Patent 6,144,547 (Retseptor) X 1013 CN 102753636 A (including translation) X 1014 U.S. Patent 8,647,964 (Harkness) X 1015 Technical Data Sheet for DOWSIL™ Q1-4010 Conformal X Coating (2017, The Dow Chemical Company) 1016 Declaration of Fumika Ogawa in Support of Petitioner KOA’s X Reply to Patent Owner’s Response 1017 High Temperature Adhesives for Structural Applications: A X Review, U.S. Dept. of Commerce, National Technical Information Service (originally presented as an Institution of Production Engineers/The Design Council seminar on “Industrial Applications of Adhesives,” Nov. 10, 1952) 1018 Chambers Dictionary of Science and Technology, Chambers X Harrap Publishers Ltd, 1999 (Excerpt) 1019 TR-150-25 High Temperature Polyimide Resin, PTM&W X Industries, Inc. iv Exhibit Title New 1020 Report on Carcinogens, Fourteenth Edition, 4,4’‑Oxydianiline X CAS No. 101-80-4, National Toxicology Program, Department of Health and Human Services 1021 U.S. Patent No. 5,846,355 (Spencer et al.) X 1022 U.S. Patent No. 5,519,172 (Spencer et al.) X 1023 WO 96/08828 A1 (Spencer et al.) X 1024 U.S. Patent No. 8,647,964 (Harkness) X 1025 EP 0 730 017 A2 (Hutter et al.) X 1026 U.S. Patent Pub. No. 2004/0156177 (Higashitani) X 1027 U.S. Patent No. 6,558,783 (Kato et al.) X 1028 U.S. Patent No. 6,528,860 (Okamoto et al.) X 1029 DuPont™ GreenTape™ low temperature co-fired ceramic X system, E.I. du Pont de Nemours and Company, K-23365, Nov. 2009 1030 VELCRO® brand Adhesives; Pressure Sensitive, Fire X Retardant, Solvent and Heat Activated, Velcro Companies/FASTENation 1031 Dictionary of Materials and Testing, Society of Automotive X Engineers, Inc., 2nd Edition, 2000 (Excerpt) 1032 U.S. Patent No. 4,451,869 (Sakabe et al.) X 1033 U.S. Patent No. 4,558,021 (Hata et al.) X 1034 U.S. Patent No. 5,014,158 (Nishimura et al.) X 1035 U.S. Patent No. 4,290,041 (Utsumi et al.) X 1036 U.S. Patent No. 6,717,506 (Ishii) X 1037 U.S. Patent No. 6,694,613 (Nakamura et al.) X 1038 U.S. Patent No. 6,736,179 (Ito et al.) X 1039 U.S. Patent No. 7,063,768 (Tsujimoto et al.) X 1040 U.S. Patent No. 7,479,313 (Chang et al.) X 1041 Clad Materials, Engineered Materials Solutions, Wickeder X Group 1042 The Synonym Finder, Grand Central Publishing, a division of X First Hachette Book Group Edition, Rodale Press (1978) and Hachette Book Group (1986) (Excerpt) 1043 Merriam-Webster’s Collegiate Dictionary, 11th Ed. (2003) X (Additional Excerpts) v Exhibit Title New 1044 Second Declaration of Dr. Michael S. Randall in support of X Petitioner KOA’s Reply to Patent Owner’s Response 1045 Third Declaration of Dr. Michael S. Randall in support of X Petitioner KOA’s Opposition to Patent Owner’s Motion To Amend Claims 1046 Telephonic Deposition of David W. Hughes, Ph.D., Sept. 27, X 2019 1047 Mitchaku Definition, Sanseido Web Dictionary X 1048 Pitari Definition, Weblio X 1049 Kuttsuku Definition, Weblio X 1050 Ministry of Education Science and Culture, Japan, Japanese X Scientific Terms: Chemistry 169 (Revised and Enlarged Edition, 1986) 1051 Keisuke Fujioka, Engineering Terms 50000, English-Japanese X Japanese-English 1018 (1997) 1052 Kinzoku Zairyō Gijyutsu Kenkyūjo, Zukai Kinzoku Zairyō X Gijyutsu Yōgo Jiten 442 (2d ed. 2000) 1053 Akira Kinbara, Science and Technology of Thin Film Adhesion, X 63(12) J. Surf. Finish Soc. Jpn., 710-7 (2012) 1054 Eiji Iwamura, “Improvement of Adhesion Strength in Thin X Films.” 58(5) J. Surf. Finish Soc. Jpn., 260 (2017) 1055 Kobelco Research Institute, “Evaluation of Adhesion Strength X of Thin-films,” Koberunikusu, 13 Oct. 2004 1056 JP 4623921 B2 X 1057 U.S. Patent 7,238,296 X 1058 Hasami-komu Definition, Weblio X 1059 Kaizai-suru Translation, Sanseido Web Dictionary X 1060 Henkei Definition, Sanseido Web Dictionary X 1061 Konpakuto-na Definition, Sanseido Web Dictionary X vi I. INTRODUCTION Claims 1-21 of U.S. Patent No. 7,190,252 (“‘252 patent”) are unpatentable over JP2004-128000 to Nakamura. In its Response (Paper 16), Patent Owner advances constructions for “forming a depression” and “bonding” limitations (claims 1 and 14) that contradict those terms’ common and ordinary meanings. Whereas Petitioner’s translation of the Nakamura reference is based on the full context of Nakamura’s disclosure, Patent Owner’s translation cherry-picks definitions that favor its position, and deletes the key words from Nakamura’s disclosure that contradict Patent Owner’s narrative. The correctly translated Nakamura reference, as understood by a person of ordinary skill in the art (POSITA), discloses and teaches all the claimed features of the ‘252 patent, including “depression” formed